Light source and DMD chip coupling device of automobile pixel headlamp
By employing a microlens array, converging lens, TIR prism, and liquid cooling structure in automotive pixel headlights, combined with the damping effect of a three-dimensional micro-motion platform and heat-conducting seat, the problems of insufficient light coupling accuracy and heat dissipation performance in traditional devices are solved, achieving high-definition light and shadow projection and improved stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN BAIBOHE TECH CO LTD
- Filing Date
- 2026-03-23
- Publication Date
- 2026-05-08
AI Technical Summary
Traditional automotive pixel headlights have shortcomings in light coupling accuracy and heat dissipation performance between the light source and the DMD chip coupling device. This results in blurred light and shadow, poor glare control, low coupling accuracy, and device instability. They are unable to effectively resist vibration and thermal expansion displacement, which affects the lighting effect and driving safety.
The system employs a microlens array, a convex spherical lens, and a converging lens to achieve dual straightening and convergence of light. A reflector and a TIR prism precisely change the direction of light propagation. The three-dimensional micro-motion platform of the DMD chip module performs multi-directional fine-tuning. Combined with the damping effect of the liquid cooling structure and the heat conduction seat, vibration is filtered out. An accelerometer is used to lock the core components in real time to ensure that the light is accurately coupled to the DMD chip.
It significantly improves the coupling accuracy and stability between the light source and the DMD chip, ensuring high-definition light and shadow projection effects, avoiding glare interference, extending the service life of the device, and improving vibration resistance and heat dissipation efficiency.
Smart Images

Figure CN121993752A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of automotive lighting technology, and more specifically, to a coupling device between the light source and DMD chip of an automotive pixel headlight. Background Technology
[0002] In the field of automotive lighting technology, pixel headlights, as a new type of intelligent lighting device, are gradually becoming a core configuration of high-end cars due to their advantages such as high-definition light projection, intelligent dimming, and adaptive road conditions. They can precisely control the illumination range, intensity, and shape of light according to driving scenarios and road conditions, effectively improving nighttime driving safety and avoiding glare interference to oncoming vehicles and pedestrians. The core technology of pixel headlights lies in the precise coupling between the light source and the DMD chip. As the core component for pixelated light control, the DMD chip needs to receive stable, uniform, and precisely positioned light emitted by the light source to achieve high-definition light projection. Therefore, the coupling accuracy and stability between the light source and the DMD chip directly determine the lighting effect and operational reliability of automotive pixel headlights.
[0003] Currently, the coupling devices between the light source and DMD chip in traditional automotive pixel headlights suffer from numerous technical defects in practical applications, severely restricting the performance and widespread application of pixel headlights. Regarding light coupling accuracy, the light source alignment structure of traditional coupling devices is poorly designed. After multiple reflections and refractions, the light propagation path is prone to deviation, and there is a lack of effective error compensation mechanisms. These mechanisms cannot compensate for assembly errors, vibration deviations, and thermal expansion deviations, resulting in the light failing to accurately couple to the effective photosensitive area of the DMD chip. This leads to problems such as blurred light and shadow, and poor glare control, affecting lighting performance and driving safety. Simultaneously, the rigid mounting structure of the light source and DMD chip in traditional devices lacks effective vibration buffering design. High-frequency vibrations during vehicle operation are directly and rigidly transmitted to the light source and DMD chip, causing relative misalignment and further reducing coupling accuracy. Over long-term use, this misalignment gradually accumulates, potentially leading to device failure.
[0004] In terms of heat dissipation performance, the light source (especially LED beads) and DMD chip generate a lot of heat during operation. The heat dissipation structure of traditional coupling devices is simple and often uses a single heat sink, which has low heat dissipation efficiency. Heat is easily accumulated on the surface of core components, causing the component temperature to rise. This not only accelerates component aging and shortens service life, but also causes the light intensity of the light source to decrease and the response speed of the DMD chip to drop, further affecting the light coupling accuracy and the working stability of the device. Summary of the Invention
[0005] 1. Technical problems to be solved To address the problems existing in the prior art, the present invention aims to provide a coupling device between the light source and the DMD chip of an automotive pixel headlight. This device achieves dual straightening and focusing of light through a microlens array, convex spherical lens, and converging lens in the light source module. A reflector and TIR prism precisely change the direction of light propagation. The three-dimensional micro-motion platform of the DMD chip module can be finely adjusted in multiple directions to compensate for assembly, vibration, and thermal expansion offsets. The heat transfer rod of the heat-conducting seat filters vibration through a damping effect, avoiding offset caused by rigid transmission. This ensures that the light is always accurately coupled to the DMD chip, significantly improving coupling accuracy and stability, guaranteeing the high-definition light and shadow projection effect of the automotive pixel headlight, and avoiding glare interference.
[0006] 2. Technical Solution To solve the above problems, the present invention adopts the following technical solution.
[0007] A coupling device for a light source and a DMD chip in an automotive pixel headlight includes a mounting housing. A heat dissipation module is fixedly mounted at the bottom of the mounting housing. Two sets of symmetrically distributed drivers are fixedly mounted at the top of the heat dissipation module. A heat conduction seat is fixedly mounted at the top of each driver. A symmetrically distributed light source module and a DMD chip module are fixedly mounted at the top of each of the two heat conduction seats. Locking modules are fixedly mounted at both the front and rear ends of the mounting housing. An acceleration sensor is fixedly mounted at the top of each locking module.
[0008] As a further improvement of the present invention, the light source module includes a light source mounting base, the upper end of which is provided with an LED mounting groove. Multiple linearly distributed LED beads are fixedly installed in the LED mounting groove. A converging lens is provided above the LED beads, and a reflector is provided on the converging lens. The reflection direction of the reflector is towards the DMD chip module. Light emitted from the LED beads is collimated and converged by the converging lens and then emitted to the reflector. The reflector, which is set at a 45-degree angle, changes the light angle by 90 degrees and reflects it to the DMD chip module.
[0009] As a further improvement of the present invention, a microlens array is fixedly installed on the top of the LED mounting groove. Multiple convex spherical lenses corresponding to LED beads are integrally formed on the microlens array. The convex spherical lenses can converge and straighten the diverging light for the first time, and allow the light to pass through without refraction.
[0010] As a further improvement of the present invention, the DMD chip module includes a DMD mounting base, the upper end of which has a DMD mounting groove. A three-dimensional micro-motion platform is fixedly installed in the DMD mounting groove, and a DMD chip is fixedly installed on the upper end of the three-dimensional micro-motion platform. A TIR prism corresponding to the reflector is provided on the upper end of the DMD chip. The three-dimensional micro-motion platform can be used to make fine adjustments in multiple directions of the DMD chip. The light reflected from the convex spherical lens is deflected into a downward 24-degree angle by total internal reflection after passing through the TIR prism and then shines on the DMD chip.
[0011] As a further improvement of the present invention, the heat dissipation module includes a liquid cooling plate, a heat absorption plate is fixedly installed on the upper end of the liquid cooling plate, and a serpentine liquid cooling pipe is provided in the inner cavity of the liquid cooling plate. The liquid flowing in the serpentine liquid cooling pipe can quickly remove heat, and the heat absorption plate absorbs heat to achieve rapid heat dissipation of the light source module and the DMD chip module.
[0012] As a further improvement of the present invention, the heat-conducting base includes an upper heat-conducting plate, a lower heat-conducting plate, and a plurality of heat transfer rods fixedly installed between the two. The upper heat-conducting plate is fixedly installed on the lower end of the light source mounting base and the DMD mounting base, respectively. The lower heat-conducting plate abuts against the upper surface of the heat-absorbing plate. The upper heat-conducting plate, the heat transfer rods, and the lower heat-conducting plate can not only establish a heat-conducting bridge, but also effectively alleviate the vibration during vehicle operation by utilizing the extensible damping characteristics of the heat transfer rods, thus avoiding the vibration from being directly and rigidly transmitted to the light source module and the DMD chip module, which would cause offset errors.
[0013] As a further improvement of the present invention, the heat transfer rod includes a sleeve fixedly installed on the upper surface of the lower heat-conducting plate, a heat-conducting rod slidably installed inside the sleeve, the heat-conducting rod fixedly installed on the lower surface of the upper heat-conducting plate, a sealing ring fixedly installed at the upper opening of the sleeve, the sleeve being filled with heat-conducting oil, and multiple evenly distributed balance holes being opened on the lower side wall of the sleeve. An elastic bladder connected to the balance holes is fixedly fitted on the lower outer surface of the sleeve. A perforated plate sleeve is fixedly installed inside the sleeve, which can absorb heat and transfer it to the lower heat-conducting plate below through the heat-conducting oil. At the same time, the heat-conducting oil generates a large damping characteristic when passing through the perforated plate, thereby achieving an effective vibration filtering effect and preventing vibration from being directly and rigidly transmitted to the light source module and DMD chip module. After being squeezed, the heat-conducting oil can enter the elastic bladder through the balance holes to cause it to expand and balance the hydraulic pressure.
[0014] As a further improvement of the present invention, the driver includes a shape memory alloy actuating plate. The lower end of the shape memory alloy actuating plate is fixedly mounted on the upper end of the liquid cooling plate by multiple support columns. Multiple evenly distributed ball plungers are fixedly mounted on the upper end of the shape memory alloy actuating plate. Multiple ball grooves matching the ball plungers are opened on the lower surface of the upper heat-conducting plate. Under normal conditions, the driver can achieve a good support effect between the heat dissipation module and the heat-conducting seat. When the light source module and DMD chip module are working at high temperatures, the shape memory characteristics of the shape memory alloy actuating plate are used to generate a controllable downward bending deformation. This causes the ball plungers to pull the upper heat-conducting plate, indirectly forcing a closer contact between the lower heat-conducting plate and the heat-absorbing plate to reduce thermal resistance and achieve better heat dissipation. At the same time, it can, to a certain extent, offset the upward displacement of the light source module and DMD chip module caused by thermal expansion in the vertical direction, ensuring precise alignment between the light source module and the DMD chip module.
[0015] As a further improvement of the present invention, the locking module includes a fixing box with multiple mounting holes. An electromagnet is fixedly installed on the outside of the mounting holes, and a locking pin is slidably installed on the inside of the mounting holes. The light source mounting base and the DMD mounting base are both provided with positioning grooves that match the locking pins. When the vehicle experiences a large impact or vibration, such as when passing over a speed bump, the real-time detection of the acceleration sensor triggers the electromagnet, causing it to generate a repulsive magnetic field, which drives the locking pin to insert into the positioning grooves on the light source mounting base and the DMD mounting base for locking, resisting large displacement impacts to protect the light source module and the DMD chip module.
[0016] As a further improvement of the present invention, the locking pin includes a positioning rod, on which a permanent magnet is fixedly installed. A return spring is fixedly installed between the positioning rod and the electromagnet. By responding to the magnetic field of the electromagnet with the permanent magnet, the spring force of the return spring can be overcome to push the positioning rod into the positioning slot to lock the light source module and the DMD chip module. After the impact ends, the electromagnet removes the magnetic field, and the positioning rod can be actively pulled back to reset under the spring force of the return spring, so that the light source module and the DMD chip module can return to the adaptive state.
[0017] 3. Beneficial Effects Compared with the prior art, the advantages of this invention are: (1) This device achieves dual straightening and convergence of light through the microlens array, convex spherical lens and converging lens of the light source module. The reflector and TIR prism accurately change the direction of light propagation. The three-dimensional micro-motion platform of the DMD chip module can be finely adjusted in multiple directions to compensate for assembly, vibration and thermal expansion offset. The heat transfer rod of the heat conduction seat filters vibration through damping effect to avoid offset caused by rigid transmission, ensuring that the light is always accurately coupled to the DMD chip, greatly improving coupling accuracy and stability, ensuring the high-definition light and shadow projection effect of the car pixel headlight, and avoiding glare interference.
[0018] (2) The heat dissipation module of this device adopts a structure combining liquid cooling and heat absorption plate. The serpentine liquid cooling pipe increases the heat exchange area and realizes rapid heat dissipation. The heat conduction seat builds an efficient heat conduction bridge. The heat transfer oil further improves the heat transfer efficiency. The shape memory alloy actuator of the driver can adaptively adjust the fit between the heat conduction seat and the heat absorption plate according to the temperature, reduce thermal resistance, offset thermal expansion offset, ensure that the core components are always at a suitable working temperature, effectively delay component aging, extend the service life of the device, and improve working stability.
[0019] (3) The acceleration sensor of this device detects vibration signals in real time, triggers the locking module to accurately lock the core components, resists large displacement impacts, and automatically resets after the impact ends, without affecting normal operation. The heat transfer rod and the support column work together to buffer vibration, further improving the vibration resistance performance. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the mounting housing of the present invention; Figure 3 This is a schematic diagram of the disassembled structure of the light source module of the present invention; Figure 4 This is a schematic diagram of the disassembled structure of the DMD chip module of the present invention; Figure 5 This is a schematic diagram showing the heat dissipation module, driver, and heat conduction base of the present invention; Figure 6 This is a schematic diagram of the structure of the driver of the present invention; Figure 7 This is a schematic diagram of the disassembled structure of the heat-conducting base of the present invention; Figure 8 This is a schematic diagram of the disassembled structure of the heat transfer rod of the present invention; Figure 9 This is a schematic diagram of the locking module of the present invention; Figure 10 This is a schematic diagram of the disassembled structure of the locking module of the present invention.
[0021] Explanation of the labels in the diagram: 1. Mounting housing; 2. Light source module; 21. Light source mounting base; 22. LED mounting slot; 23. LED beads; 24. Microlens array; 25. Convex spherical lens; 26. Converging lens; 27. Reflector; 3. DMD chip module; 31. DMD mounting base; 32. DMD mounting slot; 33. Three-dimensional micro-motion platform; 34. DMD chip; 35. TIR prism; 4. Locking module; 41. Fixing box; 42. Electromagnet; 43. Locking pin; 431. Positioning rod; 432. Permanent magnet; 433. Return spring; 5. Accelerometer; 6. Heat dissipation module; 61. Liquid cooling plate; 62. Heat absorption plate; 63. Serpentine liquid cooling pipe; 7. Heat-conducting base; 71. Upper heat-conducting plate; 72. Lower heat-conducting plate; 73. Heat transfer rod; 731. Sleeve; 732. Sealing ring; 733. Heat-conducting rod; 734. Perforated plate; 735. Balance hole; 736. Elastic bladder; 8. Actuator; 81. Shape memory alloy actuating plate; 82. Support column; 83. Ball plunger. Detailed Implementation
[0022] The following describes some embodiments of this application in detail with reference to the accompanying drawings.
[0023] Example 1: Please see Figures 1-8 A device for coupling a light source and a DMD chip in an automotive pixel headlight includes a mounting housing 1. A heat dissipation module 6 is fixedly mounted at the bottom of the mounting housing 1. Two sets of symmetrically distributed drivers 8 are fixedly mounted on the upper end of the heat dissipation module 6. A heat conduction seat 7 is fixedly mounted on the upper end of the driver 8. A light source module 2 and a DMD chip module 3 are respectively fixedly mounted on the upper ends of the two heat conduction seats 7.
[0024] The light source module 2 includes a light source mounting base 21. An LED mounting groove 22 is provided on the upper end of the light source mounting base 21. Multiple linearly distributed LED beads 23 are fixedly installed in the LED mounting groove 22. A converging lens 26 is provided above the LED beads 23. A reflector 27 is provided on the converging lens 26. The reflection direction of the reflector 27 is towards the DMD chip module 3. Light is emitted from the LED beads 23, collimated and converged by the converging lens 26, and then emitted to the reflector 27. The reflector 27, which is set at a 45-degree angle, changes the light by 90 degrees and reflects it to the DMD chip module 3.
[0025] A microlens array 24 is fixedly installed on the top of the LED mounting slot 22. Multiple convex spherical lenses 25 corresponding to the LED beads 23 are integrally formed on the microlens array 24. The convex spherical lenses 25 can converge and straighten the diverging light for the first time, and allow the light to pass through without refraction.
[0026] The light source mounting base 21 is made of a high-temperature resistant and thermally conductive metal material, which can quickly transfer the heat generated by the LED beads 23 to the heat-conducting base 7, while providing a stable mounting carrier for other components of the light source module. The upper end of the light source mounting base 21 is provided with an LED mounting groove 22, which is used to fix the LED beads 23. The groove wall is insulated and heat dissipated to prevent the heat generated by the LED beads 23 from accumulating during operation and to prevent leakage. Multiple linearly distributed LED beads 23 are fixedly installed in the LED mounting groove 22. The LED beads are high-brightness, high-temperature resistant, and long-life automotive-grade LEDs with high luminous efficiency and good light stability. They can emit light that is compatible with the DMD chip coupling and are the core light-emitting element of the device.
[0027] The microlens array 24 is made of high-transmittance optical glass with an anti-reflective surface treatment, which can reduce light reflection loss and improve light utilization. Multiple convex spherical lenses 25 corresponding to LED beads 23 are integrally formed on the microlens array 24. The convex spherical lenses correspond one-to-one with LED beads. The convex spherical lenses can converge the diverging light emitted by LED beads 23, perform the first straightening, and make the light tend to be parallel. At the same time, it can make the light pass through the microlens array without refraction, avoid the propagation path deviation caused by light refraction, and lay the foundation for subsequent light convergence and coupling.
[0028] The converging lens 26 is made of high-transmittance optical glass, possessing excellent light-gathering performance. It is used to further collimate and converge the light after the first alignment by the convex spherical lens 25, forming a beam of light with high parallelism and uniform intensity, reducing light divergence loss and improving light utilization. Above the converging lens 26 is a reflector 27, which uses a high-reflectivity metal-coated optical lens, possessing excellent reflection performance, and can efficiently reflect light to the DMD chip module 3. The reflector 27 is fixed at a 45-degree angle, with its reflection direction facing the DMD chip module 3. After the light is emitted from the LED bead 23, it is first aligned by the convex spherical lens 25 and collimated and converged by the converging lens 26, and finally emitted to the reflector 27. The 45-degree angled reflector 27 changes the light's propagation direction by 90 degrees, accurately reflecting it to the DMD chip module 3, achieving initial coupling and guidance of the light.
[0029] The DMD chip module 3 includes a DMD mounting base 31, with a DMD mounting slot 32 at the upper end of the DMD mounting base 31. A three-dimensional micro-motion platform 33 is fixedly installed in the DMD mounting slot 32, and a DMD chip 34 is fixedly installed on the upper end of the three-dimensional micro-motion platform 33. A TIR prism 35 corresponding to the reflector 27 is provided on the upper end of the DMD chip 34. The three-dimensional micro-motion platform 33 can be used to make fine adjustments in multiple directions of the DMD chip 34. The light reflected from the convex spherical lens 25 passes through the TIR prism 35 and is deflected by total internal reflection to a downward 24-degree angle to illuminate the DMD chip 34.
[0030] The DMD mounting slot 32 is used to fix the three-dimensional micro-motion platform 33. Its slot wall is treated with shock absorption and insulation to prevent vibration and leakage from damaging the DMD chip 34. The three-dimensional micro-motion platform 33 is fixedly installed in the DMD mounting slot 32. The three-dimensional micro-motion platform 33 adopts a high-precision piezoelectric drive structure, which has excellent fine adjustment accuracy and stability. It can make small displacement adjustments in multiple directions such as up and down, left and right, and front and back of the DMD chip 34. It is used to compensate for assembly errors, vibration offsets and thermal expansion offsets between the light source module 2 and the DMD chip module 3, and ensure that the light can be accurately coupled to the DMD chip 34.
[0031] The DMD chip 34 adopts an industrial-grade high-precision DMD chip, which has the characteristics of high resolution and high response speed. It can realize pixel-level control of light and is the core component for realizing high-definition light and shadow projection in automotive pixel headlights. The upper end of the DMD chip 34 is equipped with a TIR prism 35 corresponding to the reflector 27. The TIR prism 35 is made of optical glass with high light transmittance and high refractive index, which has excellent total internal reflection performance. It is used to change the propagation direction of the light reflected by the light source module 2, so that the light accurately illuminates the DMD chip 34. The light reflected from the reflector 27 passes through the TIR prism 35 and is deflected at a downward angle of 24 degrees by total internal reflection, accurately illuminating the effective photosensitive area of the DMD chip 34, realizing precise coupling of light.
[0032] The heat dissipation module 6 includes a liquid cooling plate 61, with a heat absorption plate 62 fixedly installed on the upper end of the liquid cooling plate 61. A serpentine liquid cooling pipe 63 is provided in the inner cavity of the liquid cooling plate 61. The liquid flowing through the serpentine liquid cooling pipe 63 can quickly remove heat, and the heat absorption plate 62 absorbs heat to achieve rapid heat dissipation of the light source module 2 and the DMD chip module 3.
[0033] The liquid cooling plate 61 is made of high-strength aluminum alloy, which has excellent thermal conductivity and structural rigidity. It can stably support components such as the driver 8 and the heat conduction base 7, while also conducting heat quickly. A heat absorption plate 62 is fixedly installed on the upper end of the liquid cooling plate 61. The heat absorption plate is made of copper alloy, which has high thermal conductivity. It can be closely attached to the lower heat conduction plate 72 of the heat conduction base 7 to quickly absorb the heat transferred from the light source module 2 and the DMD chip module 3, thus achieving rapid heat conduction.
[0034] The inner cavity of the liquid cooling plate 61 is equipped with a serpentine liquid cooling pipe 63. The serpentine structure can increase the flow path and heat exchange area of the coolant, thereby improving heat dissipation efficiency. The serpentine liquid cooling pipe is made of corrosion-resistant and high-temperature resistant metal pipe, and long-life coolant adapted to automotive operating conditions flows inside. The coolant circulates through the vehicle's on-board cooling system, which can quickly remove the heat absorbed by the liquid cooling plate 61, thereby achieving rapid heat dissipation of the light source module 2 and the DMD chip module 3. This ensures that both are always within a suitable operating temperature range, guaranteeing the accuracy of light coupling and the service life of the components.
[0035] The heat-conducting base 7 includes an upper heat-conducting plate 71, a lower heat-conducting plate 72, and multiple heat transfer rods 73 fixedly installed between the two. The upper heat-conducting plate 71 is fixedly installed at the lower end of the light source mounting base 21 and the DMD mounting base 31, respectively. The lower heat-conducting plate 72 abuts against the upper surface of the heat-absorbing plate 62. The upper heat-conducting plate 71, the heat transfer rods 73 and the lower heat-conducting plate 72 can not only establish a heat-conducting bridge, but also effectively reduce the vibration during vehicle operation by utilizing the extensible damping characteristics of the heat transfer rods 73, thus avoiding the vibration from being directly and rigidly transmitted to the light source module 2 and the DMD chip module 3, which would cause offset errors.
[0036] The heat transfer rod 73 includes a sleeve 731 fixedly installed on the upper surface of the lower heat-conducting plate 72. A heat-conducting rod 733 is slidably installed inside the sleeve 731. The heat-conducting rod 733 is fixedly installed on the lower surface of the upper heat-conducting plate 71. A sealing ring 732 is fixedly installed at the upper opening of the sleeve 731. The sleeve 731 is filled with heat-conducting oil. Multiple evenly distributed balance holes 735 are opened on the lower side wall of the sleeve 731. An elastic bladder communicating with the balance holes 735 is fixedly fitted on the lower outer surface of the sleeve 731. The sleeve 736 and sleeve 731 are internally fixed with a perforated plate 734. The sleeve 731 can absorb heat and transfer it to the lower heat-conducting plate 72 below through heat-conducting oil. At the same time, the heat-conducting oil will generate a large damping characteristic when passing through the perforated plate 734, thereby achieving an effective vibration filtering effect and preventing vibration from being directly and rigidly transmitted to the light source module 2 and DMD chip module 3. After being squeezed, the heat-conducting oil can enter the elastic bladder 736 through the balance hole 735 to cause it to expand and balance the hydraulic pressure.
[0037] Both the upper heat-conducting plate 71 and the lower heat-conducting plate 72 are made of copper alloy, which has high thermal conductivity. The upper heat-conducting plate 71 is fixedly installed at the lower end of the light source mounting base 21 and the DMD mounting base 31, respectively, and can quickly absorb the heat generated by the light source module 2 and the DMD chip module 3. The lower heat-conducting plate 72 abuts against the upper surface of the heat-absorbing plate 62 and is used to transfer heat to the heat-absorbing plate, and then conduct it out through the heat dissipation module 6.
[0038] The heat transfer rod 73, as the core component for heat conduction and vibration damping, is made of a metal alloy with excellent thermal conductivity. It includes a sleeve 731 fixedly mounted on the upper surface of the lower heat-conducting plate 72, a heat-conducting rod 733 slidably mounted inside the sleeve, a sealing ring 732 fixed at the opening on the upper side of the sleeve, a perforated plate 734 fixed inside the sleeve, a balance hole 735 formed on the lower side wall of the sleeve, and an elastic sleeve 736 fixed to the outer surface of the lower end of the sleeve. The sleeve 731, made of high-strength thermally conductive metal, provides sliding space for the heat-conducting rod 733 and conducts heat. The heat-conducting rod 733, fixedly mounted on the lower surface of the upper heat-conducting plate 71, can slide along the inside of the sleeve 731, enabling rapid heat transfer. The sealing ring 732, made of high-temperature resistant and oil-resistant flexible rubber, seals the opening of the sleeve 731 to prevent leakage of internal heat-conducting oil and also provides some vibration damping.
[0039] The heat transfer oil possesses excellent thermal conductivity and fluidity, further enhancing heat transfer efficiency. The sleeve 731 absorbs heat and transfers it to the lower heat transfer plate 72 via the heat transfer oil. The perforated plate 734 is made of high-strength metal with multiple micro-channels on its surface. When the heat transfer oil passes through the perforated plate 734, it generates significant damping characteristics, thereby achieving effective vibration filtering and preventing vibrations during vehicle operation from being directly and rigidly transmitted to the light source module 2 and DMD chip module 3, preventing them from shifting and ensuring the accuracy of light coupling. The balance hole 735 on the lower side wall of the sleeve 731 connects the inside of the sleeve to the elastic sleeve 736. The elastic sleeve 736 is made of high-temperature resistant, highly elastic flexible rubber. When the heat transfer oil is compressed by vibration or temperature changes, it can enter the elastic sleeve 736 through the balance hole 735, causing the elastic sleeve 736 to expand to balance the hydraulic pressure inside the sleeve 731, preventing the heat transfer oil from leaking due to excessive pressure in the sealing ring 732, and further enhancing the vibration buffering effect.
[0040] The actuator 8 includes a shape memory alloy actuator 81. The lower end of the shape memory alloy actuator 81 is fixedly mounted on the upper end of the liquid cooling plate 61 by multiple support columns 82. Multiple evenly distributed ball plungers 83 are fixedly mounted on the upper end of the shape memory alloy actuator 81. Multiple ball grooves matching the ball plungers 83 are opened on the lower surface of the upper heat conduction plate 71. Under normal conditions, the actuator 8 can achieve a good support effect between the heat dissipation module 6 and the heat conduction seat 7. When the light source module 2 and the DMD chip module 3 are working at high temperatures, the shape memory characteristics of the shape memory alloy actuator 81 are used to perform a controllable downward bending deformation, which in turn pulls the upper heat conduction plate 71 through the ball plungers 83, indirectly forcing a closer contact between the lower heat conduction plate 72 and the heat absorption plate 62 to reduce thermal resistance, thereby achieving a better heat dissipation effect. At the same time, it can, to a certain extent, offset the upward displacement of the light source module 2 and the DMD chip module 3 in the vertical direction caused by thermal expansion, ensuring the precise alignment between the light source module 2 and the DMD chip module 3.
[0041] The shape memory alloy actuator 81 is made of nickel-titanium shape memory alloy, which has excellent shape memory effect and high temperature resistance. It can undergo controllable bending deformation within a specific temperature range, which is suitable for the temperature operating range of automotive headlights. The lower end of the shape memory alloy actuator 81 is fixedly installed on the upper end of the liquid cooling plate 61 by multiple support columns 82. The support columns are made of high-strength metal material, with strong structural rigidity, which can realize the stable fixation of the actuator 8, and at the same time play a certain vibration buffering role.
[0042] Multiple evenly distributed ball plungers 83 are fixedly installed on the upper end of the shape memory alloy actuator plate 81. The ball plungers are made of wear-resistant and corrosion-resistant metal material, and their ball ends can rotate flexibly to reduce friction and wear with the heat conduction seat 7. Multiple ball grooves matching the ball plungers 83 are opened on the lower surface of the upper heat conduction plate 71. The ball plungers can be accurately embedded in the ball grooves to realize the flexible connection between the actuator 8 and the heat conduction seat 7. Under normal conditions, the driver 8 provides good support between the heat dissipation module 6 and the heat-conducting seat 7 through the support column 82 and the ball plunger 83. When the operating temperature of the light source module 2 and the DMD chip module 3 rises, the shape memory alloy actuator 81 triggers its shape memory properties, resulting in a controllable downward bending deformation. This, in turn, pulls the upper heat-conducting plate 71 downward through the ball plunger 83, indirectly forcing a closer contact between the lower heat-conducting plate 72 and the heat-absorbing plate 62, reducing the thermal resistance between them, improving heat transfer efficiency, and achieving better heat dissipation. At the same time, this downward pulling force can, to some extent, offset the upward displacement of the light source module 2 and the DMD chip module 3 in the vertical direction caused by thermal expansion, ensuring the relative position stability between them and ensuring the accuracy of light coupling.
[0043] Example 2: Please see Figures 9-10Based on Embodiment 1, locking modules 4 are fixedly installed at both the front and rear ends of the housing 1. An acceleration sensor 5 is fixedly installed at the upper end of the locking module 4. The locking module 4 includes a fixing box 41 with multiple mounting holes. An electromagnet 42 is fixedly installed on the outside of the mounting holes, and a locking pin 43 is slidably installed on the inside of the mounting holes. The light source mounting base 21 and the DMD mounting base 31 are both provided with positioning grooves that match the locking pin 43. When the vehicle experiences a large impact or vibration, such as when passing over a speed bump, the real-time detection of the acceleration sensor 5 triggers the electromagnet 42 to generate a repulsive magnetic field, driving the locking pin 43 to insert into the positioning grooves on the light source mounting base 21 and the DMD mounting base 31 for locking, resisting large displacement impacts to protect the light source module 2 and the DMD chip module 3.
[0044] The locking pin 43 includes a positioning rod 431. A permanent magnet 432 is fixedly installed on the end of the positioning rod 431 near the electromagnet 42. A return spring 433 is fixedly installed between the positioning rod 431 and the electromagnet 42. Through the magnetic field response of the permanent magnet 432 to the electromagnet 42, the elastic force of the return spring 433 can be overcome to push the positioning rod 431 into the positioning slot to lock the light source module 2 and the DMD chip module 3. After the impact ends, the electromagnet 42 removes the magnetic field, and under the elastic force of the return spring 433, the positioning rod 431 can be actively pulled to reset, so that the light source module 2 and the DMD chip module 3 can return to the adaptive state.
[0045] The fixing box 41 is made of high-strength metal, with a strong structural rigidity that can withstand large impact loads. Multiple mounting holes are provided on the fixing box for mounting the electromagnet 42 and the locking pin 43. The electromagnet 42 is fixedly mounted on the outside of the mounting holes. The electromagnet is made of high-magnetism, high-temperature resistant electromagnetic pure iron, possessing excellent electromagnetic response performance. It can generate a strong magnetic field after being energized, serving as the driving component for the locking pin 43. The locking pin 43 is slidably mounted on the inside of the mounting holes. The locking pin can slide flexibly along the mounting holes and is used to insert into the positioning slots of the light source module 2 and the DMD chip module 3 to achieve the locking function. Positioning slots matching the locking pin 43 are provided on both the light source mounting base 21 and the DMD mounting base 31. The positioning slots and the locking pin are precisely matched to ensure reliable locking.
[0046] The positioning rod 431 of the locking pin 43 is made of high-strength metal, which has excellent impact resistance and can withstand large locking loads. A permanent magnet 432 is fixedly installed on the end of the positioning rod 431 near the electromagnet 42. The permanent magnet is made of high magnetic material and can interact with the magnetic field generated by the electromagnet 42, serving as the power source for the sliding of the locking pin. A return spring 433 is fixedly installed between the positioning rod 431 and the electromagnet 42. The return spring is made of high-strength elastic material and has excellent elastic recovery ability, used for the reset of the locking pin 43. When the vehicle experiences a significant impact or vibration, such as passing over a speed bump or colliding, the acceleration sensor 5 detects the vibration signal in real time, triggering the electromagnet 42 to be energized. This generates a repulsive magnetic field with the opposite polarity to that of the permanent magnet 432. Under the action of the repulsive force, the permanent magnet overcomes the elastic force of the return spring 433 and pushes the positioning rod 431 to slide along the mounting hole and insert into the positioning groove on the light source mounting base 21 and the DMD mounting base 31. This locks the light source module 2 and the DMD chip module 3, resisting large displacement impacts and protecting them from displacement or damage. After the impact ends, the electromagnet 42 removes the magnetic field, the repulsive force disappears, and under the action of the return spring 433, it actively pulls the positioning rod 431 to reset and exit the positioning groove, allowing the light source module 2 and the DMD chip module 3 to return to their adaptive state, ensuring that the light coupling accuracy is not affected.
[0047] Accelerometer 5 is a miniature industrial-grade accelerometer with high sensitivity and high response speed. It can detect vibration and impact signals during vehicle operation in real time and serve as the triggering component for locking module 4. Accelerometer 5 is electrically connected to the main control unit of the device and can transmit the detected vibration signals to the main control unit in real time. The main control unit then determines whether to trigger locking module 4 to ensure the accuracy and timeliness of the locking action and avoid unnecessary locking that could affect the normal operation of the device.
[0048] Working principle: Before operation, complete the assembly and debugging of each component. Fix the heat dissipation module 6 to the bottom of the mounting housing 1, ensuring that the liquid cooling plate 61, heat absorption plate 62 and serpentine liquid cooling pipe 63 are firmly installed and connected to the vehicle's on-board cooling system. Fix the two sets of actuators 8 symmetrically to the upper end of the liquid cooling plate 61 through the support column 82, ensuring that the ball plunger 83 is installed flat and rotates flexibly. Fix the heat conduction seat 7 to the upper end of the actuator 8, so that the ball plunger 83 is accurately embedded in the ball groove on the lower surface of the upper heat conduction plate 71, ensuring that the lower heat conduction plate 72 and the heat absorption plate 62 are tightly fitted. At the same time, check the sliding flexibility and sealing of the heat transfer rod 73 to ensure that there is no leakage of heat transfer oil and that the elastic sleeve 736 is intact.
[0049] The light source mounting base 21 of the light source module 2 is fixedly installed on the upper heat-conducting plate 71 of the left heat-conducting base 7. The LED beads 23, microlens array 24, converging lens 26, and reflector 27 are installed in the corresponding positions of the light source mounting base 21 in sequence, ensuring that the LED beads 23 correspond one-to-one with the convex spherical lens 25. The reflector 27 is fixed at a 45-degree angle with the reflection direction facing the right. The DMD mounting base 31 of the DMD chip module 3 is fixedly installed on the upper heat-conducting plate 71 of the right heat-conducting base 7. The three-dimensional micro-motion platform 33, DMD chip 34, and TIR prism 35 are installed in the DMD mounting slot 32 in sequence, ensuring that the TIR prism 35 corresponds to the reflector 27 and can accurately receive the reflected light. The three-dimensional micro-motion platform 33 is adjusted to compensate for assembly errors and ensure that the effective photosensitive area of the DMD chip 34 is aligned with the light output direction of the TIR prism 35.
[0050] The fixing box 41 of the locking module 4 is fixedly installed at both ends of the mounting housing 1. The electromagnet 42 and the locking pin 43 are installed in the mounting holes of the fixing box 41 in sequence, ensuring that the locking pin 43 slides flexibly, the return spring 433 has good elasticity, and the positioning rod 431 can be accurately aligned with the positioning groove on the light source mounting base 21 and the DMD mounting base 31. The acceleration sensor 5 is fixedly installed on the upper end of the locking module 4, ensuring that the sensor sensitivity is normal and that it can detect vibration signals in real time. The wiring connection of each electrical component is completed, the reliability of the wiring connection is checked, and problems such as leakage and poor contact are avoided.
[0051] When the entire device is connected to the car's 12V DC power supply, the LED beads 23, DMD chip 34, three-dimensional micro-motion platform 33, and acceleration sensor 5 are activated, and the coolant in the serpentine liquid cooling pipe 63 of the heat dissipation module 6 begins to circulate, and the device enters normal working condition.
[0052] The main control unit controls the LED beads 23 to emit light. The divergent light emitted by the LED beads 23 first shines on the convex spherical lens 25 of the microlens array 24. The convex spherical lens 25 straightens the divergent light for the first time, converges the light, and makes the light pass through the microlens array 24 without refraction. The light after the first straightening propagates to the converging lens 26. The converging lens 26 further collimates and converges the light to form a beam with high parallelism and uniform intensity. The beam continues to propagate to the reflector 27 set at a 45-degree angle. The reflector 27 changes the propagation direction of the light by 90 degrees and accurately reflects it onto the TIR prism 35 of the DMD chip module 3, completing the light emission and straightening process.
[0053] The light reflected by the reflector 27 enters the TIR prism 35 and is deflected at a downward angle of 24 degrees by the total internal reflection of the TIR prism 35, accurately illuminating the effective photosensitive area of the DMD chip 34. The main control unit controls the three-dimensional micro-motion platform 33 in real time, and makes minute displacement adjustments in multiple directions (up, down, left, right, front, and back) of the DMD chip 34 according to the internal temperature changes and vibration conditions of the device, to compensate for thermal expansion offset, vibration offset and assembly error, and ensure that the light is always accurately coupled to the DMD chip 34, providing a basis for subsequent pixelation control. After receiving the light, the DMD chip 34 realizes pixelation control of the light under the control of the main control unit, and works with the intelligent control system of automotive headlights to complete functions such as high-definition light and shadow projection and intelligent dimming.
[0054] During operation, the LED beads 23 and DMD chip 34 generate a large amount of heat. The heat is transferred to the upper heat-conducting plate 71 of the heat-conducting base 7 through the light source mounting base 21 and DMD mounting base 31. The upper heat-conducting plate transfers the heat to the lower heat-conducting plate 72 through the heat-conducting rod 733 of the heat transfer rod 73, the sleeve 731 and the internal heat-conducting oil. The lower heat-conducting plate transfers the heat to the heat-absorbing plate 62 of the heat dissipation module 6. The heat-absorbing plate quickly absorbs the heat and transfers it to the liquid cooling plate 61. The coolant circulating in the serpentine liquid cooling pipe 63 inside the liquid cooling plate 61 quickly carries away the heat on the liquid cooling plate and discharges it through the vehicle's on-board cooling system, achieving rapid heat removal.
[0055] When the temperature exceeds the preset threshold, the shape memory alloy actuator 81 of the driver 8 triggers its shape memory properties, undergoing downward bending deformation. This causes the upper heat-conducting plate 71 to move downward through the ball-head plunger 83, forcing the lower heat-conducting plate 72 to fit more tightly with the heat-absorbing plate 62, reducing thermal resistance and improving heat transfer efficiency. At the same time, this downward pulling force counteracts the upward displacement of the light source module 2 and the DMD chip module 3 caused by thermal expansion, ensuring the relative position of the two is stable and ensuring the accuracy of light coupling. When the temperature returns to normal, the shape memory alloy actuator 81 resets, and the driver 8 returns to its normal support state.
[0056] Vibrations generated during vehicle operation are first transmitted to each module through the mounting housing 1, where the engineering plastic material of the housing initially buffers some of the vibrations. The support column 82 of the heat dissipation module 6 further buffers the vibrations, preventing them from being directly transmitted to the heat conduction seat 7. The heat transfer oil inside the heat transfer rod 73 of the heat conduction seat 7 generates a damping effect when passing through the perforated plate 734, filtering out most of the high-frequency vibrations and preventing the vibrations from being rigidly transmitted to the light source module 2 and the DMD chip module 3. At the same time, the elastic sleeve 736 of the heat transfer rod expands and contracts to balance the hydraulic pressure inside the sleeve 731, further enhancing the vibration buffering effect and ensuring that the light source module 2 and the DMD chip module 3 do not shift, thus guaranteeing the accuracy of light coupling.
[0057] Accelerometer 5 detects vibration and impact signals during vehicle operation in real time and transmits the signals to the main control unit in real time. When the vehicle passes over speed bumps or experiences minor collisions, resulting in significant impacts or vibrations, and the vibration intensity exceeds a preset threshold, the main control unit determines that locking protection is required. It controls the electromagnet 42 of the locking module 4 to be energized, generating a repulsive magnetic field with the opposite polarity to that of the permanent magnet 432. Under the action of the repulsive force, the permanent magnet 432 overcomes the elastic force of the return spring 433 and pushes the positioning rod 431 to slide along the mounting hole and insert it into the positioning groove of the light source mounting base 21 and the DMD mounting base 31, locking the light source module 2 and the DMD chip module 3 to resist large displacement impacts and protect them from displacement or damage.
[0058] When the impact ends and the vibration intensity returns to normal, the main control unit controls the electromagnet 42 to be de-energized, and the repulsive magnetic field disappears. Under the elastic force of the reset spring 433, the positioning rod 431 is actively pulled to reset and exit the positioning slot. The locking module 4 is unlocked, and the light source module 2 and the DMD chip module 3 return to the adaptive state. The three-dimensional micro-motion platform 33 is finely adjusted as needed to ensure that the light coupling accuracy is not affected.
[0059] When the car headlights are turned off or the device malfunctions, the main control unit receives the signal and controls the power to cut off all electrical components. The LED bulb 23 stops emitting light, and the DMD chip 34, three-dimensional micro-motion platform 33, electromagnet 42, and acceleration sensor 5 stop working. The coolant in the heat dissipation module 6 continues to circulate for a period of time until the device temperature drops to the normal range and then stops circulating.
[0060] The above description is merely a preferred embodiment of the present invention; however, the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and its improved concepts, should be covered within the scope of protection of the present invention.
Claims
1. A coupling device for a light source and a DMD chip in an automotive pixel headlight, comprising a mounting housing (1), characterized in that: A heat dissipation module (6) is fixedly installed at the bottom of the mounting housing (1). Two sets of symmetrically distributed drivers (8) are fixedly installed at the top of the heat dissipation module (6). A heat conduction seat (7) is fixedly installed at the top of the driver (8). A light source module (2) and a DMD chip module (3) are fixedly installed at the top of the two heat conduction seats (7), respectively. Locking modules (4) are fixedly installed at both the front and rear ends of the mounting housing (1). An acceleration sensor (5) is fixedly installed at the top of the locking module (4).
2. The coupling device between the light source and DMD chip of an automotive pixel headlight according to claim 1, characterized in that: The light source module (2) includes a light source mounting base (21), and an LED mounting groove (22) is provided at the upper end of the light source mounting base (21). Multiple linearly distributed LED beads (23) are fixedly installed in the LED mounting groove (22). A converging lens (26) is provided above the LED beads (23), and a reflector (27) is provided on the converging lens (26). The reflection direction of the reflector (27) is towards the DMD chip module (3).
3. The coupling device between the light source and DMD chip of an automotive pixel headlight according to claim 2, characterized in that: A microlens array (24) is fixedly installed on the top of the LED mounting groove (22), and multiple convex spherical lenses (25) corresponding to the LED beads (23) are integrally formed on the microlens array (24).
4. The coupling device between the light source and DMD chip of an automotive pixel headlight according to claim 3, characterized in that: The DMD chip module (3) includes a DMD mounting base (31), a DMD mounting slot (32) is provided at the upper end of the DMD mounting base (31), a three-dimensional micro-motion platform (33) is fixedly installed in the DMD mounting slot (32), a DMD chip (34) is fixedly installed at the upper end of the three-dimensional micro-motion platform (33), and a TIR prism (35) corresponding to the reflector (27) is provided at the upper end of the DMD chip (34).
5. The coupling device between the light source and DMD chip of an automotive pixel headlight according to claim 4, characterized in that: The heat dissipation module (6) includes a liquid cooling plate (61), a heat absorption plate (62) is fixedly installed on the upper end of the liquid cooling plate (61), and a serpentine liquid cooling pipe (63) is provided in the inner cavity of the liquid cooling plate (61).
6. The coupling device between the light source and DMD chip of an automotive pixel headlight according to claim 5, characterized in that: The heat-conducting base (7) includes an upper heat-conducting plate (71), a lower heat-conducting plate (72), and a plurality of heat transfer rods (73) fixedly installed between the two. The upper heat-conducting plate (71) is fixedly installed at the lower end of the light source mounting base (21) and the DMD mounting base (31), respectively, and the lower heat-conducting plate (72) abuts against the upper surface of the heat-absorbing plate (62).
7. The coupling device between the light source and DMD chip of an automotive pixel headlight according to claim 6, characterized in that: The heat transfer rod (73) includes a sleeve (731) fixedly installed on the upper surface of the lower heat-conducting plate (72). A heat-conducting rod (733) is slidably installed inside the sleeve (731). The heat-conducting rod (733) is fixedly installed on the lower surface of the upper heat-conducting plate (71). A sealing ring (732) is fixedly installed at the upper opening of the sleeve (731). The sleeve (731) is filled with heat-conducting oil. Multiple evenly distributed balance holes (735) are opened on the lower side wall of the sleeve (731). An elastic sleeve (736) communicating with the balance holes (735) is fixedly fitted on the lower outer surface of the sleeve (731). A perforated plate (734) is fixedly installed inside the sleeve (731).
8. The coupling device between the light source and DMD chip of an automotive pixel headlight according to claim 7, characterized in that: The actuator (8) includes a shape memory alloy actuator (81), the lower end of which is fixedly mounted on the upper end of the liquid cooling plate (61) by a plurality of support columns (82), and a plurality of evenly distributed ball plungers (83) are fixedly mounted on the upper end of the shape memory alloy actuator (81). The lower surface of the upper heat-conducting plate (71) is provided with a plurality of ball grooves that match the ball plungers (83).
9. The coupling device between the light source and DMD chip of an automotive pixel headlight according to claim 8, characterized in that: The locking module (4) includes a fixing box (41), which has multiple mounting holes. An electromagnet (42) is fixedly installed on the outside of the mounting holes, and a locking pin (43) is slidably installed on the inside of the mounting holes. The light source mounting base (21) and the DMD mounting base (31) are both provided with positioning grooves that match the locking pin (43).
10. The coupling device between the light source and DMD chip of an automotive pixel headlight according to claim 9, characterized in that: The locking pin (43) includes a positioning rod (431), a permanent magnet (432) is fixedly installed at one end of the positioning rod (431) near the electromagnet (42), and a return spring (433) is fixedly installed between the positioning rod (431) and the electromagnet (42).