Packaging structure of differential pressure sensitive element

Abstract

The invention provides a packaging structure of a differential pressure sensitive element. The packaging structure comprises a packaging base, a pressure conduit and a column array structure, the central axes of the column array structure, the first pipeline of the pressure conduit and the differential pressure sensitive element coincide and are parallel to the central axis of the packaging base; the column array structure comprises a plurality of column units surrounding the periphery of the first pipeline; and the differential pressure sensitive element is fixed on the first pipeline opening of the pressure conduit and the second array surface of the column array structure. By arranging the column array structure, including setting the length, position height and form of the column unit, setting the size relationship among the column array structure, the differential pressure sensitive element and the pressure conduit, isolating the stress of a static pressure load on the differential pressure sensitive element, reducing the influence of high static pressure on the differential pressure sensitive element, and inhibiting the static pressure deviation; and the measurement accuracy and repeatability of the differential pressure sensitive element are improved.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor integrated circuit manufacturing technology, and in particular relates to a packaging structure for a differential pressure sensing element. Background Technology

[0002] The encapsulation structure of silicon pressure-sensitive elements is a crucial component of silicon-based pressure sensors, primarily serving to support the sensing element, transmit pressure, and extract electrical signals. Current technologies typically use epoxy resin to directly bond and fix the silicon pressure-sensitive element to the encapsulation structure to fabricate pressure sensors, mainly used in process industries for measuring parameters such as pressure, flow rate, and liquid level. However, the increasing complexity, scale, and automation of industrial processes place higher demands on the accuracy, stability, reliability, and intelligence of pressure sensors.

[0003] Ideally, the output value of a differential pressure sensor should be independent of the static pressure experienced by the sensing element and only related to the input differential pressure value. However, in reality, the output value of the sensing element changes with static pressure. Especially under high static pressure, the sensing element is greatly affected by static pressure, leading to static pressure deviation. Specifically, during manufacturing, the linear calibration process of a differential pressure sensor is usually performed under a static pressure of one atmosphere; however, when actually detecting differential pressure under high static pressure, the sensor experiences high static pressure, causing a certain offset in both its zero-point and full-point outputs. This error between the output value of the differential pressure sensor under high static pressure and the output value during atmospheric calibration is called static pressure deviation, which severely affects the detection accuracy and repeatability of the differential pressure sensor. To achieve accurate measurement of differential pressure signals under high static pressure, a specially designed packaging structure for the sensing element is needed to achieve stress isolation and reduce the impact of high static pressure on differential pressure signal measurement. Therefore, there is an urgent need to invent a packaging structure for a differential pressure sensing element that can effectively suppress static pressure deviation.

[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating the understanding of those skilled in the art. It should not be assumed that the above technical solutions are known to those skilled in the art simply because these solutions have been described in the background section of this application. Summary of the Invention

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a packaging structure for a differential pressure sensing element to solve the problem of static pressure deviation in the prior art.

[0006] To achieve the above objectives, the present invention provides a packaging structure for a differential pressure sensing element, the packaging structure comprising: a packaging base, a pressure conduit, and a column array structure, the packaging structure being used to encapsulate the sensing element;

[0007] Both the pressure conduit and the column array structure are located within the encapsulation base; the pressure conduit includes a first part, the pipe direction of the first part being parallel to the central axis direction of the encapsulation base;

[0008] In addition to the differential pressure sensing element, the sensing elements encapsulated in the packaging structure also include a static pressure sensing element and a temperature sensing element.

[0009] The column array structure includes multiple column units, the central axis of each column unit is parallel to the pipe direction of the first part of the pressure conduit, and the column array structure is distributed around the pipe periphery of the first part of the pressure conduit.

[0010] The encapsulation base has a first end face, a second end face, and a third end face from bottom to top along the central axis. The second end face is the bottom surface of a groove that sinks down from the third end face. The column array structure includes a first array surface and a second array surface perpendicular to the central axis of the encapsulation base. The differential pressure sensing element is fixed to the first part of the pressure conduit and the second array surface of the column array structure.

[0011] Optionally, the encapsulation structure further includes a ceramic gasket, which is fixed around the second end face of the encapsulation base; the ceramic gasket includes a first surface and a second surface that are disposed opposite to each other and perpendicular to the central axis of the encapsulation base, the first surface being in contact with the second end face and the second surface being close to the third end face; the first array surface of the column array structure is close to the first end face, and the second array surface is away from the first end face; the second array surface is higher than or lower than the second end face, or the second array surface is flush with the second end face.

[0012] Optionally, when the first array surface is flush with the second end surface, the length of the column array structure along the central axis of the column unit is greater than or equal to 1 mm.

[0013] Optionally, when the first array surface is lower than the second end surface, the length of the column array structure along the central axis of the column unit is greater than or equal to 2 mm.

[0014] Optionally, some adjacent column units in the column array structure are interconnected to form multiple merged column units, and the column array structure is composed of multiple merged column units and column units; the projected area of ​​each merged column unit on the plane perpendicular to the central axis of the packaging base is greater than the projected area of ​​the column unit before connection on the plane perpendicular to the central axis of the packaging base.

[0015] Optionally, adjacent column units in the column array structure are interconnected to form multiple merged column units, and the column array structure is composed of multiple merged column units; the projected area of ​​each merged column unit on a plane perpendicular to the central axis of the packaging base is greater than the projected area of ​​the column unit before connection on a plane perpendicular to the central axis of the packaging base.

[0016] Optionally, the column units in the column array structure are arranged in a U-shaped array including inner and outer column surfaces. The projection profile of the inner column surface on a plane perpendicular to the central axis of the packaging base is rectangular or circular, and the projection profile of the outer column surface on a plane perpendicular to the central axis of the packaging base is rectangular or circular. The projection profile of the differential pressure sensing element on a plane perpendicular to the central axis of the packaging base is located within the projection profile of the outer column surface on a plane perpendicular to the central axis of the packaging base. The distance between the projection profile of the outer column surface on a plane perpendicular to the central axis of the packaging base and the projection profile of the differential pressure sensing element on a plane perpendicular to the central axis of the packaging base is greater than 0.8 mm.

[0017] Optionally, the column units in the column array structure are arranged in a U-shaped array including an inner column and an outer column. The projection profile of the inner column on a plane perpendicular to the central axis of the packaging base is rectangular or circular, and the projection profile of the outer column on a plane perpendicular to the central axis of the packaging base is rectangular or circular. The projection profile of the first part of the pressure conduit on a plane perpendicular to the central axis of the packaging base is located within the projection profile of the inner column on a plane perpendicular to the central axis of the packaging base, and the projection profile of the first part of the pressure conduit on a plane perpendicular to the central axis of the packaging base does not contact the projection profile of the inner column on a plane perpendicular to the central axis of the packaging base.

[0018] Optionally, the projection of the column unit in the column array structure onto a plane perpendicular to the central axis of the packaging base is circular or rectangular.

[0019] Optionally, the central axes of the column array structure, the first port of the pressure conduit, and the differential pressure sensing element are all coincident, and the differential pressure sensing element has a differential pressure sensing element opening on the surface of the differential pressure sensing element near the first port of the pressure conduit for exposing the sensitive film of the differential pressure sensing element.

[0020] As described above, the packaging structure of the differential pressure sensing element of the present invention has the following beneficial effects:

[0021] This invention isolates the stress caused by static pressure load on the packaging base deformation and transmitted to the differential pressure sensing element by setting a column array structure, thereby reducing the impact of high static pressure on the differential pressure sensing element, suppressing static pressure deviation, and improving the measurement accuracy and repeatability of the differential pressure sensing element.

[0022] This invention reduces static pressure deviation by setting the length and position height of the column unit;

[0023] This invention suppresses static pressure deviation by setting the size relationship between the column array structure, the differential pressure sensing element, and the pressure conduit;

[0024] This invention suppresses static pressure deviation by setting the shape of the column unit;

[0025] This invention integrates a static pressure sensing element and a temperature sensing element to acquire static pressure and temperature values ​​in real time and compensate for differential pressure signals, thereby reducing static pressure deviation and temperature drift and improving the measurement accuracy and repeatability of differential pressure signals. Attached Figure Description

[0026] Figure 1 The diagram shown is a three-dimensional structural schematic of the packaging structure of the differential pressure sensing element in this invention, without the sensing element being packaged.

[0027] Figure 2 The diagram shown is a top view of the packaging structure of the differential pressure sensing element in this invention, without the sensing element being packaged.

[0028] Figure 3 The diagram shown is a side cross-sectional view of the differential pressure sensing element in this invention, showing the unencapsulated sensing element along section line AA'.

[0029] Figure 4 The diagram shown is a three-dimensional structural schematic of the packaging structure of the differential pressure sensing element in this invention.

[0030] Figure 5 The diagram shown is a top view of the packaging structure of the differential pressure sensing element in this invention.

[0031] Figure 6 The diagram shows a side cross-sectional view of the differential pressure sensing element in this invention, along section line BB'.

[0032] Figure 7 This diagram illustrates the pressure distribution principle that causes static pressure deviation due to the difference between ideal calibration and actual use conditions in differential pressure sensors using and not using the packaging structure of this invention.

[0033] Figure 8The diagram shown is a three-dimensional structural schematic of the packaging structure of the differential pressure sensing element in this invention, in which the second array surface is flush with the second end surface.

[0034] Figure 9 The diagram shown is a top view of the packaging structure of the differential pressure sensing element in this invention, in which the second array surface is flush with the second end surface.

[0035] Figure 10 The diagram shown is a side sectional view of the packaging structure of the differential pressure sensing element in this invention, with the second array surface flush with the second end surface along the section line OO'.

[0036] Figure 11 The diagram shown is a three-dimensional view of the packaging structure of the differential pressure sensing element in this invention, in which the second array surface is lower than the second end surface.

[0037] Figure 12 The diagram shown is a top view of the packaging structure of the differential pressure sensing element in this invention, in which the second array surface is lower than the second end surface.

[0038] Figure 13 The diagram shown is a side cross-sectional view of the second array surface below the second end surface along the section line PP', which is an example of the packaging structure of the differential pressure sensing element in this invention.

[0039] Figure 14 The diagram shown is a three-dimensional view of the packaging structure of the differential pressure sensing element in this invention, in which the second array surface is higher than the second end surface.

[0040] Figure 15 The diagram shown is a top view of the packaging structure of the differential pressure sensing element in this invention, in which the second array surface is higher than the second end surface.

[0041] Figure 16 The diagram shown is a side cross-sectional view of the packaging structure of the differential pressure sensing element in this invention, in which the second array surface is higher than the second end surface along the section line QQ'.

[0042] Figure 17 The diagram shows a perspective view of the package structure of the differential pressure sensing element in this invention, with a first load of 30 MPa (left) and a second load of 29.5 MPa (right) applied.

[0043] Figure 18 The diagram shows the stress distribution cloud map on the cross-section of the package structure along the section line CC' when a differential pressure load of 30 to 29.5 MPa is applied in an example of a differential pressure sensitive element in this invention.

[0044] Figure 19The diagram shows the position of the package structure along the section line CC' in the differential pressure sensing element example of this invention.

[0045] Figure 20 The figure shows the stress distribution curves on the depth section AB when a differential pressure load of 30 to 29.5 MPa is applied in an example of the differential pressure sensing element in this invention.

[0046] Figure 21 The figure shows the stress distribution curves on the stress study reference line MN when a differential pressure load of 30 to 29.5 MPa is applied in the differential pressure sensing element example of this invention.

[0047] Figure 22 The table shown is a static pressure deviation data recording table of the differential pressure sensing element in this invention, which includes a column array 1 encapsulation structure.

[0048] Figure 23 The diagram shown is a three-dimensional structural schematic of an example of the packaging structure of the differential pressure sensing element in this invention, without a column array structure.

[0049] Figure 24 The diagram shown is a top view of an example of the packaging structure of the differential pressure sensing element in this invention, without a column array structure.

[0050] Figure 25 The diagram shown is a side cross-sectional view along section line DD' of an example of the packaging structure of the differential pressure sensing element in this invention, without the column array structure.

[0051] Figure 26 The diagram shown is a three-dimensional structural schematic of an example of the packaging structure of the differential pressure sensing element, including the column array 2, in this invention.

[0052] Figure 27 The diagram shown is a top view of an example of the packaged structure of the differential pressure sensing element, including the column array 2, in this invention.

[0053] Figure 28 The diagram shown is a side cross-sectional view along section line EE', illustrating an example of the packaged structure of the differential pressure sensing element, including the column array 2, in this invention.

[0054] Figure 29 The table shown is a static pressure deviation data recording table of the differential pressure sensing element in this invention, which includes a column array 2 encapsulation structure.

[0055] Figure 30 The diagram shown is a three-dimensional structural schematic of an example of the packaging structure of the differential pressure sensing element, including the column array 3, in this invention.

[0056] Figure 31The diagram shown is a top view of an example of the packaged structure of the differential pressure sensing element, including the column array 3, in this invention.

[0057] Figure 32 The diagram shown is a side cross-sectional view along section line FF', illustrating an example of the packaged structure of the differential pressure sensing element, including the column array 3, in this invention.

[0058] Figure 33 The table shown is a static pressure deviation data recording table of the differential pressure sensing element in this invention, which includes a column array 3 encapsulation structure.

[0059] Figure 34 The graph shows the variation curves of the static pressure influence coefficient of column array 1-3 under different column heights in the packaging structure example of the differential pressure sensitive element in this invention.

[0060] Component designation explanation

[0061] 10. Encapsulation base; 11. First end face; 12. Second end face; 13. Third end face; 20. Pressure conduit; 21. First part; 22. Second part; 23. Pipe port; 30. Sensing element; 31. Differential pressure sensing element; 32. Static pressure sensing element; 33. Temperature sensing element; 34. Differential pressure sensing element opening; 40. Column array structure; 41. Column unit; 42. First array surface; 43. Second array surface; 44. Inner column surface; 45. Outer column surface; 46. Merged column unit; 60. Ceramic gasket; 61. First surface; 62. Second surface; 71. First load; 72. Second load; 73. Encapsulation structure profile; 74. Depth cutoff line AB; 75. Stress study reference line MN; 81. Lead hole; 82. Through hole. Detailed Implementation

[0062] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0063] In the detailed description of embodiments of the present invention, for ease of explanation, the schematic diagrams illustrating the device structure may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0064] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the accompanying drawings for devices in use or operation.

[0065] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0066] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0067] It should be noted that the "central axis" and "central axis direction" mentioned in this article assume that the various components of the encapsulation structure are conventional columnar or columnar shapes, and are only used to illustrate the approximate relative relationship of direction and position. The specific position and direction can be adaptively adjusted according to the shape of the component.

[0068] This invention provides a packaging structure for a differential pressure sensing element 31, such as... Figures 1-6 As shown, where Figure 1 This is a perspective view of the packaging structure of the unpackaged sensitive element 30. Figure 2 This is a top view of the package structure of the unpackaged sensitive element 30. Figure 3 This is a side cross-sectional view of the package structure of the unpackaged sensitive element 30. Figure 3 The cross-section is Figure 2 AA' in Figure 4 This is a perspective view of the packaging structure of the sensitive element 30. Figure 5 This is a top view of the package structure of the sensitive element 30. Figure 6 This is a side cross-sectional view of the package structure for the sensitive element 30. Figure 6 The cross-section is Figure 5 The encapsulation structure includes: an encapsulation base 10, a pressure conduit 20, and a column array structure 40, which is used to encapsulate the sensitive element 30.

[0069] The pressure conduit 20, the sensing element 30, and the column array structure 40 are all located within the encapsulation base 10; the pressure conduit 20 includes a first part 21, the pipe direction of the first part 21 being parallel to the central axis direction of the encapsulation base 10;

[0070] In addition to the differential pressure sensing element 31, the sensitive element 30 encapsulated in the packaging structure also includes a static pressure sensing element 32 and a temperature sensing element 33. The static pressure sensing element 32 and the temperature sensing element 33 can compensate for the differential pressure signal based on the real-time acquired static pressure and temperature values, reduce static pressure deviation and temperature drift, and improve the measurement accuracy and repeatability of the differential pressure signal.

[0071] The column array structure 40 includes a plurality of column units 41, the central axis of each column unit 41 being parallel to the pipe direction of the first part 21 of the pressure conduit 20, and the column array structure 40 being distributed around the pipe periphery of the first part 21 of the pressure conduit 20.

[0072] The encapsulation base 10 is provided with a first end face 11, a second end face 12 and a third end face 13 from bottom to top along the central axis direction. The second end face 12 is the bottom surface of the groove that sinks down from the third end face 13. The column array structure 40 includes a first array surface 42 and a second array surface 43 perpendicular to the central axis direction of the encapsulation base 10. The differential pressure sensing element 31 is fixed on the pipe port 23 of the first part 21 of the pressure conduit 20 and the second array surface 43 of the column array structure 40.

[0073] In existing technologies, such as Figure 7 As shown in 7(a)-7(b), the differential pressure sensing element 31 is typically fixed directly to the pipe opening 23 of the first part 21 of the pressure conduit 20, located at the second end face 12. Figure 7 (a) is a schematic diagram of the pressure distribution during calibration of the differential pressure sensing element 31 in the prior art. Figure 7 (b) is a schematic diagram of the pressure distribution during measurement by the differential pressure sensing element 31 in the prior art. However, in actual measurement, the measurement results of the differential pressure sensing element 31 are affected by static pressure. This is because the reference pressure P0 of the differential pressure sensing element 31 during calibration is one standard atmosphere, such as... Figure 7 As shown in (a), ideally, there should be no pressure difference between the external environment of the encapsulation base 10 and the first part 21 of the pressure conduit 20, both being P0; however, as Figure 7As shown in (b), during actual measurement, static pressure P1 is generated inside the pressure conduit 20 after the fluid being measured is introduced, resulting in a pressure difference P1-P0 between the external environment of the encapsulation base 10 and the first part 21 of the pressure conduit 20. Especially under high static pressure, P1 is much greater than the reference pressure P0, causing deformation of the encapsulation base 10. The resulting stress is transmitted to the differential pressure sensing element 31, thus affecting the actual measurement accuracy and repeatability of the differential pressure sensing element 31. To achieve accurate measurement of the differential pressure signal under high static pressure, on the one hand, it is necessary to integrate a static pressure sensing element 32 and a temperature sensing element 33 into the encapsulation structure of the differential pressure sensing element 31. Based on the real-time acquired static pressure and temperature values, the differential pressure signal can be compensated, reducing static pressure deviation and temperature drift, and improving the measurement accuracy and repeatability of the differential pressure signal. More importantly, the encapsulation structure of the differential pressure sensing element 31 needs to be specially designed to achieve stress isolation and reduce the impact of high static pressure on the differential pressure signal measurement.

[0074] like Figure 7 As shown in 7(c)-7(d), Figure 7 (c) is a schematic diagram of the pressure distribution during calibration of the differential pressure sensing element 31 of the present invention. Figure 7 (d) is a schematic diagram of the pressure distribution during measurement by the differential pressure sensing element 31 of the present invention. The present invention sets a column array structure 40 in the first part 21 of the pressure conduit 20 so that most of the static pressure P1 borne by the pressure conduit 20 during actual testing is offset by the static pressure P1+ΔP acting on the column array structure 40. That is, the column unit (except the pipe wall of the first part 21 of the pressure conduit 20) that supports the differential pressure sensing element has no pressure difference and will not generate strain. Only the pipe wall of the first part 21 of the pressure conduit 20 has a pressure difference ΔP and generates strain, which reduces the stress and strain of the support structure under the differential pressure sensing element. Therefore, it effectively isolates the stress transmitted to the differential pressure sensing element 31 by the encapsulation base 10, thereby suppressing the static pressure deviation and greatly reducing the influence of high static pressure on the differential pressure sensing element 31, which is beneficial to improving the measurement accuracy and repeatability of the differential pressure sensing element 31.

[0075] Specifically, the pipe port 23 of the first part 21 of the pressure conduit 20 and the differential pressure sensing element opening 34 of the differential pressure sensing element 31 are sealed to ensure that the pressure of the first part 21 of the pressure conduit 20 can be accurately transmitted to the sensitive membrane of the differential pressure sensing element 31.

[0076] In one embodiment, such as Figures 1-6As shown, the encapsulation structure further includes a ceramic gasket 60, which is fixed around the second end face 12 of the encapsulation base 10. The ceramic gasket 60 includes a first surface 61 and a second surface 62 that are oppositely disposed and perpendicular to the central axis of the encapsulation base. The first surface 61 is in contact with the second end face 12, and the second surface 62 is close to the third end face 13. The first array surface 42 of the column array structure 40 is close to the first end face 11, and the second array surface 43 is away from the first end face 11. The second array surface 43 is higher or lower than the second end face 12, or the second array surface 43 is flush with the second end face 12. Figure 3 and Figure 6 As shown, the second array surface 43 is higher than the second end surface 12, and the first array surface 42 is flush with the second end surface 12; or as... Figures 8-10 As shown, the second array surface 43 is flush with the second end surface 12; or as... Figures 11-13 As shown, the second array surface 43 is lower than the second end surface 12; or as... Figures 14-16 As shown, the second array surface 43 is higher than the second end surface 12, and the first array surface 42 is lower than the second end surface 12.

[0077] By setting the height relationship between the column array structure 40 and the second end face 12, the present invention further improves the isolation effect between the stress caused by the static pressure load transmitted from the bottom of the differential pressure sensing element 31 and the differential pressure sensing element 31, suppresses static pressure deviation, and thus further reduces the influence of high static pressure on the differential pressure sensing element 31, which is beneficial to improving the measurement accuracy and repeatability of the differential pressure sensing element 31.

[0078] Specifically, such as Figures 1-6 As shown, the encapsulation base 10 also serves to conduct pressure and lead out electrical signals through the pin hole 81; when the encapsulation structure also includes a ceramic pad 60, the pin hole 81 of the encapsulation base 10 is connected to the through hole 82 provided at the corresponding position of the pin hole 81 of the ceramic pad 60, so that the lead wire can be put into the pin hole 81 through the through hole 82 of the ceramic pad 60 to lead out the electrical signal.

[0079] In one embodiment, such as Figure 3 and Figure 6 As shown, when the first array surface 42 is flush with the second end surface 12, the length of the column array structure 40 along the central axis of the column unit 41 is greater than or equal to 1 mm.

[0080] By setting the column array structure 40 to be higher than the second end face 12 of the packaging base 10, the present invention further improves the isolation effect between the stress caused by the static pressure load transmitted from the bottom of the differential pressure sensing element 31 and the differential pressure sensing element 31, suppresses static pressure deviation, and thus further reduces the impact of high static pressure on the differential pressure sensing element 31, which is beneficial to improving the measurement accuracy and repeatability of the differential pressure sensing element 31.

[0081] In one embodiment, such as Figures 8-10 As shown, where Figure 8 This is a 3D view of the packaging structure. Figure 9 This is a top view of the encapsulation structure. Figure 10 This is a side sectional view of the package structure. Figure 10 The cross-section is Figure 9 In the case of OO'; when the second array surface 43 is flush with the second end surface 12, the first array surface 42 is lower than the second end surface 12, and the length of the column array structure 40 along the central axis of the column unit 41 is greater than or equal to 2 mm.

[0082] In one embodiment, such as Figures 11-13 As shown, where Figure 11 This is a 3D view of the packaging structure. Figure 12 This is a top view of the encapsulation structure. Figure 13 This is a side sectional view of the package structure. Figure 13 The cross-section is Figure 12 In the PP' of the second array surface 43, when the second array surface 43 is lower than the second end surface 12, the first array surface 42 is lower than the second end surface 12, and the length of the column array structure 40 along the central axis direction of the column unit 41 is greater than or equal to 2 mm.

[0083] In one embodiment, such as Figures 14-16 As shown, where Figure 14 This is a 3D view of the packaging structure. Figure 15 This is a top view of the encapsulation structure. Figure 16 This is a side sectional view of the package structure. Figure 16 The cross-section is Figure 15 When the second array surface 43 is higher than the second end surface 12 and the first array surface 42 is lower than the second end surface 12, the length of the column array structure 40 along the central axis of the column unit 41 is greater than or equal to 2 mm.

[0084] This invention, by setting the first array surface 42 of the column array structure 40 to be lower than the second end surface 12 of the packaging base 10, and the second array surface 43 of the column array structure 40 to be flush with, lower than, and higher than the second end surface 12 of the packaging base 10 respectively, further improves the isolation effect between the stress caused by the static pressure load transmitted from the bottom of the differential pressure sensing element 31 and the differential pressure sensing element 31, suppresses static pressure deviation, and thus further reduces the influence of high static pressure on the differential pressure sensing element 31, which is beneficial to improving the measurement accuracy and repeatability of the differential pressure sensing element 31.

[0085] Specifically, such as Figures 1-10 As shown, the pressure conduit 20 also includes a second part 22, the pipe of the second part 22 is perpendicular to the pipe of the first part 21, the pipes of the first part 21 and the second part 22 are connected, the pipe inlet of the second part 22 is on the side wall of the encapsulation base 10, and the distance to the first part 21 is the shortest, the fluid to be measured enters the first part 21 from the pipe inlet of the second part 22 and then reaches the bottom surface of the differential pressure sensing element 31.

[0086] In one embodiment, such as Figures 4-6 As shown, the differential pressure sensing element 31 has a width of 3.5 mm and a length of 4 mm; the projection of the inner cylindrical surface 44 of the column array structure 40 onto the plane perpendicular to the central axis of the packaging base 10 is a square with a side length a of 2 mm, and the projection of the outer cylindrical surface 45 of the column array structure 40 onto the plane perpendicular to the central axis of the packaging base 10 is a square with a side length b of 4.8 mm; the diameter c of the projection of the column unit 41 in the column array structure 40 onto the plane perpendicular to the central axis of the packaging base 10 is 0.2 mm, and the spacing between the projections of adjacent column units 41 onto the plane perpendicular to the central axis of the packaging base 10 is 0.2 mm; the length h of the column array structure 40 along the central axis of the column unit 41 is 2 mm.

[0087] Specifically, in the encapsulation structure of the above parameter settings, such as Figure 17 The two images show that the non-lined gray solid areas represent the locations where loads are applied, as shown in the figures. Figure 17 As shown in the left figure, a first load 71 of 30 MPa is applied downward to the packaging structure, as follows. Figure 17 As shown in the right-hand figure, a second load 72 of 29.5 MPa is applied to the pressure conduit 20 of the encapsulation structure, forming a load stress of 30–29.5 MPa with an overall differential pressure difference of 500 kPa and a downward pressure direction on the differential pressure sensing element 31; Figure 18 The figure shown is a stress distribution cloud diagram of the differential pressure sensing element 31 on the package structure cross section 73, as follows: Figure 19The diagram shows the position of the package structure cross-section 73 within the package structure. The package structure cross-section 73 is along... Figure 5 A three-dimensional cross-sectional diagram obtained from the CC' section line in the diagram; Figure 18 Line AB in the diagram represents depth section 74. The stress distribution along depth section 74 is as follows: Figure 20 As shown, the stress distribution along the depth section 74 is characterized by low stress in the middle and high stress on both sides, and the stress distribution is linearly related to the depth of the differential pressure sensing element 31. Figure 18 The MN line in the figure is the stress study reference line 75. The stress distribution on the stress study reference line 75 is as follows: Figure 21 The curve peaks along the coordinates of the stress study reference line 75, as shown, are present. Figure 21 The peak value of the curve is taken as the internal stress of the differential pressure sensing membrane of the differential pressure sensing element 31 under the load (30~29.5MPa), and the peak value of the stress distribution curve on the stress study reference line 75 under the load of 0~-0.5MPa is taken as the reference value under no static pressure load.

[0088] Specifically, in the packaging structure with the above parameter settings, the location with the most concentrated stress distribution on the packaging structure section 73 is selected as the depth cut-off line 74; the thickness of the differential pressure sensitive film of the differential pressure sensitive element 31 is 0.02 mm, the junction depth of the varistor strip is generally about 0.004 mm, and the stress distribution in the depth direction of the varistor strip is linear. Therefore, the position of the stress study reference line 75 can be taken as the middle position of the varistor strip, that is, a horizontal line with a depth of 0.002 mm from the upper surface of the differential pressure sensitive film is selected as the stress study reference line 75.

[0089] Specifically, in this paper, the column array structure 40 obtained by not connecting any adjacent column units 41 is column array 1, the column array structure 40 obtained by connecting some adjacent column units 41 to form a merged column unit 46 and including the merged column unit 46 and column unit 41 is column array 2, and the column array structure 40 obtained by connecting all adjacent column units 41 to form a merged column unit 46 and including only the merged column unit 46 is column array 3.

[0090] Specifically, the difference between the internal stress on the differential pressure sensing membrane under various loads (30–29.5 MPa, 25–24.5 MPa, 20–19.5 MPa, 15–14.5 MPa, 10–9.5 MPa, 5–4.5 MPa) and the reference value is used as the static pressure deviation of the differential pressure sensing element 31 caused by different static pressures. The length of the column array structure 40 along the central axis of the column unit 41 and the height relationship between the column array structure 40 and the ceramic gasket 60 are adjusted (i.e., taken as...). Figure 6The column array height h described herein is between -7 and 7 mm, and the values ​​of h are an arithmetic sequence with a tolerance of 0.5 mm, resulting in the following: Figure 22 The table shows the static pressure deviation data recording table for column array 1. Specifically, the absolute value of the column array height in the static pressure deviation data recording table is the length of the column array structure 40 along the central axis of the column unit 41. A positive column array height indicates... Figures 1-6 The first array surface 42 of the pillar array structure 40 shown is flush with the second end surface 12 of the packaging base 10, and the negative value of the pillar array height indicates that... Figures 8-10 The second array surface 43 of the pillar array structure 40 shown is flush with the second end face 12 of the packaging base 10, and the pillar array height is 0, indicating that... Figures 23-25 The encapsulation structure shown does not include the column array structure 40, wherein Figure 23 A perspective view of the packaging structure without the column array structure 40. Figure 24 This is a top view of the packaging structure without the column array structure 40. Figure 25 This is a side cross-sectional view of the packaging structure without the column array structure 40. Figure 25 The cross-section is Figure 24 DD' in the middle.

[0091] Specifically, Figure 22 The slope of the static pressure deviation of the differential pressure sensing element 31 under various loads corresponding to each column array height (h = -7 to 7 mm, where h values ​​are an arithmetic sequence with a tolerance of 0.5 mm) in the central column array 1 can be obtained as the static pressure influence coefficient. The static pressure deviation is the difference between the internal stress of the differential pressure sensing membrane under various loads (30–29.5 MPa, 25–24.5 MPa, 20–19.5 MPa, 15–14.5 MPa, 10–9.5 MPa, 5–4.5 MPa) and the reference value (the peak value of the stress distribution curve on the stress study reference line 75 under a load of 0–-0.5 MPa). The static pressure influence coefficient reflects the change in internal stress of the differential pressure sensing membrane with static pressure load at that column array height. The larger the static pressure influence coefficient, the greater the influence of static pressure on the differential pressure sensing element 31.

[0092] In one embodiment, in the column array 1, the column array structure 40 is composed of a plurality of column units 41, combined with Figure 22 It can be known that:

[0093] 1) such as Figures 1-6 As shown, the first array surface 42 is flush with the second end surface 12 and the second array surface 43 is higher than the second end surface 12 (i.e., Figure 22When all column array heights in the data record table are positive numbers, the length of the column array structure 40 along the central axis of the column unit 41 is set to be greater than or equal to 2 millimeters (i.e., ...). Figure 22 The data record table shows that if the column array height is ≥2 mm, it can achieve a static pressure deviation suppression effect with a static pressure influence coefficient of less than 0.265.

[0094] 2) The first array surface 42 is lower than the second end surface 12 and the second array surface 43 is flush with the second end surface 12 (i.e.) Figure 22 When all column array heights in the data record table are negative, the length of the column array structure 40 along the central axis of the column unit 41 is set to be greater than or equal to 2 mm and less than or equal to 6.5 mm (i.e., ...). Figure 22 The data record table shows that the column array height is -2 to -6.5 mm, which can achieve a static pressure deviation suppression effect with a static pressure influence coefficient of less than 0.265.

[0095] By adjusting the composition and length of the column array structure 40, this invention can further optimize the static pressure deviation suppression effect.

[0096] In one embodiment, such as Figures 26-28 As shown, where Figure 26 This is a perspective view of the packaging structure of the unpackaged sensitive element 30. Figure 27 This is a top view of the package structure of the unpackaged sensitive element 30. Figure 28 This is a side cross-sectional view of the package structure of the unpackaged sensitive element 30. Figure 28 The cross-section is Figure 27 In the column array structure 40, some adjacent column units 41 are interconnected to form multiple merged column units 46. The column array structure 40 is composed of multiple merged column units 46 and column units 41. The projected area of ​​each merged column unit 46 on the plane perpendicular to the central axis of the packaging base 10 is greater than the projected area of ​​the column unit 41 before connection on the plane perpendicular to the central axis of the packaging base 10. The difference between the internal stress of the differential pressure sensitive film under various loads (30-29.5MPa, 25-24.5MPa, 20-19.5MPa, 15-14.5MPa, 10-9.5MPa, 5-4.5MPa) and the reference value is used as the static pressure deviation of the differential pressure sensitive element 31 caused by different static pressures. The length of the column array structure 40 along the central axis of the column unit 41, the height relationship between the column array structure 40 and the second end face 12 of the packaging base 10, and the static pressure deviation of the differential pressure sensitive element 31 caused by different static pressures are adjusted. Figure 22 The corresponding values ​​are the same, resulting in the following: Figure 29 The table showing the static pressure deviation data of column array 2 is shown.

[0097] Specifically, Figure 29 The slope of the static pressure deviation of the differential pressure sensing element 31 under each load corresponding to each column array height (h = -7 to 7 mm, where h values ​​are an arithmetic sequence with a tolerance of 0.5 mm) in the central column array 2 is used as the static pressure influence coefficient. The static pressure deviation is the difference between the internal stress of the differential pressure sensing membrane under each load (30–29.5 MPa, 25–24.5 MPa, 20–19.5 MPa, 15–14.5 MPa, 10–9.5 MPa, 5–4.5 MPa) and the reference value (the peak value of the stress distribution curve on the stress study reference line 75 under a load of 0–-0.5 MPa). The static pressure influence coefficient reflects the change in internal stress of the differential pressure sensing membrane with static pressure load at that column array height. The larger the static pressure influence coefficient, the greater the influence of static pressure on the differential pressure sensing element 31.

[0098] In one embodiment, in the column array 2, the column array structure 40 is jointly composed of multiple merged column units 46 and column units 41, combined with Figure 29 It can be known that:

[0099] 1) such as Figures 26-28 As shown, the first array surface 42 is flush with the second end surface 12 and the second array surface 43 is higher than the second end surface 12 (i.e., Figure 29 When all column array heights in the data record table are positive numbers, the length of the column array structure 40 along the central axis of the column unit 41 is set to be greater than or equal to 1 mm (i.e., ...). Figure 29 The data record table shows that if the column array height is ≥1 mm, it can achieve a static pressure deviation suppression effect with a static pressure influence coefficient of less than 0.305.

[0100] 2) The first array surface 42 is lower than the second end surface 12 and the second array surface 43 is flush with the second end surface 12 (i.e.) Figure 29 When all column array heights in the data record table are negative, the length of the column array structure 40 along the central axis of the column unit 41 is set to be greater than or equal to 2 mm and less than or equal to 6 mm (i.e., ...). Figure 29 The data record table shows that the column array height is -2 to -6 mm, which can achieve a static pressure deviation suppression effect with a static pressure influence coefficient of less than or equal to 0.280.

[0101] By adjusting the composition and length of the column array structure 40, this invention can further optimize the static pressure deviation suppression effect.

[0102] In one embodiment, such as Figures 30-32 As shown, where Figure 30 This is a perspective view of the packaging structure of the unpackaged sensitive element 30. Figure 31 This is a top view of the package structure of the unpackaged sensitive element 30. Figure 32This is a side cross-sectional view of the package structure of the unpackaged sensitive element 30. Figure 32 The cross-section is Figure 31 In the column array structure 40, adjacent column units 41 are interconnected to form multiple merged column units 46. The column array structure 40 is composed of multiple merged column units 46. The projected area of ​​each merged column unit 46 on the plane perpendicular to the central axis of the packaging base 10 is greater than the projected area of ​​the column unit 41 before connection on the plane perpendicular to the central axis of the packaging base 10. The difference between the internal stress of the differential pressure sensitive film under various loads (30-29.5MPa, 25-24.5MPa, 20-19.5MPa, 15-14.5MPa, 10-9.5MPa, 5-4.5MPa) and the reference value is used as the static pressure deviation of the differential pressure sensitive element 31 caused by different static pressures. The length of the column array structure 40 along the central axis of the merged column units 46, the height relationship between the column array structure 40 and the second end face 12 of the packaging base 10, and the static pressure deviation of the differential pressure sensitive element 31 caused by different static pressures are adjusted. Figure 22 The corresponding values ​​are the same, resulting in the following: Figure 33 The table showing the static pressure deviation data of column array 3 is shown.

[0103] Specifically, Figure 33 The slope of the static pressure deviation of the differential pressure sensing element 31 under each load corresponding to each column array height (h = -7 to 7 mm, where h values ​​are an arithmetic sequence with a tolerance of 0.5 mm) is used as the static pressure influence coefficient. The static pressure deviation is the difference between the internal stress on the differential pressure sensing membrane under each load (30–29.5 MPa, 25–24.5 MPa, 20–19.5 MPa, 15–14.5 MPa, 10–9.5 MPa, 5–4.5 MPa) and the reference value (the peak value of the stress distribution curve on the stress study reference line 75 under a load of 0–-0.5 MPa). The static pressure influence coefficient reflects the change in internal stress of the differential pressure sensing membrane with static pressure load at that column array height. The larger the static pressure influence coefficient, the greater the influence of static pressure on the differential pressure sensing element 31.

[0104] In one embodiment, in the column array 3, the column array structure 40 is composed of a plurality of the merged column units 46, combined with Figure 33 It can be known that:

[0105] 1) such as Figures 30-32 As shown, the first array surface 42 is flush with the second end surface 12 and the second array surface 43 is higher than the second end surface 12 (i.e., Figure 33 When all column array heights in the data record table are positive numbers, the length of the column array structure 40 along the central axis of the column unit 41 is set to be greater than or equal to 1 mm (i.e., ...). Figure 33 The data record table shows that the column array height is ≥1 mm, which can achieve a static pressure deviation suppression effect with a static pressure influence coefficient of less than 0.285;

[0106] 2) The first array surface 42 is lower than the second end surface 12 and the second array surface 43 is flush with the second end surface 12 (i.e.) Figure 33 When all column array heights in the data record table are negative, the length of the column array structure 40 along the central axis of the column unit 41 is set to be greater than or equal to 2 mm and less than or equal to 5.5 mm (i.e., ...). Figure 33 The data record table shows that the column array height is -2 to -5.5 mm, which can achieve a static pressure deviation suppression effect with a static pressure influence coefficient of less than 0.276.

[0107] By adjusting the composition and length of the column array structure 40, this invention can further optimize the static pressure deviation suppression effect.

[0108] like Figure 34 The figures show the variation curves of the static pressure influence coefficient for three different column arrays at various column array heights. The curve with squares represents the variation of the static pressure influence coefficient of column array 1 with column array height; the curve with circles represents the variation of the static pressure influence coefficient of column array 2 with column array height; and the curve with triangles represents the variation of the static pressure influence coefficient of column array 3 with column array height. Figure 34 The dashed line in the middle is the baseline where the static pressure influence coefficient is equal to 0.265.

[0109] from Figure 34 As can be seen from the data, in column arrays 1-3, when the column array height is negative, the static pressure influence coefficient first decreases and then increases; when the column array height is 0, the static pressure influence coefficient reaches a maximum value; when the column array height is positive, the static pressure influence coefficient decreases with the increase of height.

[0110] And, from Figure 34As can be seen, generally speaking, the static pressure influence coefficient of the differential pressure sensing element 31 in the packaging structure with column array 2 and column array 3 is greater than that in the packaging structure with column array 1. This indicates that the packaging structure with column array 1 has the best effect in isolating the stress caused by static pressure load, reducing the static pressure error of the differential pressure sensing element 31 to a minimum, and maximizing the measurement accuracy and repeatability. Specifically, within the range of column array height of -2 to -6.5 mm and column array height ≥ 2 mm, the static pressure influence coefficient is less than 0.265, showing a good stress isolation effect. Considering the need to avoid excessive column array height leading to a larger packaging volume in practical use, the column array height is generally taken as -2 to -6.5 mm and 2 to 4 mm, and when the column array height is negative, it is ensured that the first array surface 42 is higher than the upper wall of the second part 22 of the pressure conduit 20.

[0111] When the column array height of column array 2 increases from 0 to 1 mm, the static pressure influence coefficient decreases rapidly. When the column array height is ≥1 mm, the static pressure influence coefficient is less than 0.305. When the column array height of column array 2 increases from 0 to -2 mm, the static pressure influence coefficient also decreases rapidly. When the column array height is in the range of -2 to -6 mm, the static pressure influence coefficient is less than or equal to 0.280. The static pressure influence coefficient less than 0.265 corresponds to column array heights of 4.5 mm, 2 mm, and -4 mm.

[0112] When the column array height of column array 3 changes from 0 to 1 mm, the static pressure influence coefficient decreases rapidly. When the column array height is ≥1 mm, the static pressure influence coefficient is less than 0.285. When the column array height of column array 2 changes from 0 to -2 mm, the static pressure influence coefficient also decreases rapidly. When the column array height is in the range of -2 to -5.5 mm, the static pressure influence coefficient is less than 0.276. The column array heights of column array 3 corresponding to a static pressure influence coefficient of less than 0.265 include 1.5-3 mm and 4-7 mm.

[0113] By comparing the static pressure deviation of column array structures 40 with different distribution patterns, this invention finds that column array 1 has the smallest static pressure deviation. That is, column array structure 40 obtained by not connecting adjacent column units 41 can achieve the optimal effect of suppressing static pressure deviation.

[0114] Specifically, the column array height data of column array 2 and column array 3 mentioned in this article, which correspond to a static pressure influence coefficient of less than 0.265, are only part of the experimental data. The actual static pressure influence coefficients of less than 0.265 also include other column array heights not listed in this article but which can be obtained through experiments, and all of them are within the protection scope of this invention.

[0115] In one embodiment, the column units 41 in the column array structure 40 are arranged in a U-shaped array including an inner column surface 44 and an outer column surface 45. The projection profile of the inner column surface 44 on the plane perpendicular to the central axis of the packaging base 10 is rectangular or circular, and the projection profile of the outer column surface 45 on the plane perpendicular to the central axis of the packaging base 10 is rectangular or circular. The projection profile of the differential pressure sensing element 31 on the plane perpendicular to the central axis of the packaging base 10 is located within the projection profile of the outer column surface 45 on the plane perpendicular to the central axis of the packaging base 10. The distance between the projection profile of the outer column surface 45 on the plane perpendicular to the central axis of the packaging base 10 and the projection profile of the differential pressure sensing element 31 on the plane perpendicular to the central axis of the packaging base 10 is greater than 0.8 mm.

[0116] In one embodiment, such as Figure 2 and Figure 5 As shown, the column units 41 in the column array structure 40 are arranged in a U-shaped array including an inner column surface 44 and an outer column surface 45. The projections of the inner column surface 44 and the outer column surface 45 onto a plane perpendicular to the central axis of the packaging base are both squares. The side length of the projection of the outer column surface 45 onto a plane perpendicular to the central axis of the packaging base is more than 0.8 mm longer than the side length of the projection of the differential pressure sensing element 31 onto a plane perpendicular to the central axis of the packaging base, to ensure that at least one ring of column units 41 is left around the differential pressure sensing element 31 so that the first load 71 can be transmitted into the column array structure 40.

[0117] By setting the relationship between the outer cylindrical surface 45 of the column array structure 40 and the side length of the differential pressure sensing element 31, this invention further enhances the isolation effect between the stress caused by the static pressure load transmitted from the bottom of the differential pressure sensing element 31 and the differential pressure sensing element 31, suppresses static pressure deviation, and thus further reduces the influence of high static pressure on the differential pressure sensing element 31, which is beneficial to improving the measurement accuracy and repeatability of the differential pressure sensing element 31.

[0118] In one embodiment, the column units 41 in the column array structure 40 are arranged in a U-shaped array including an inner column surface 44 and an outer column surface 45. The projection profile of the inner column surface 44 on the plane perpendicular to the central axis of the packaging base 10 is rectangular or circular, and the projection profile of the outer column surface 45 on the plane perpendicular to the central axis of the packaging base 10 is rectangular or circular. The projection profile of the first part 21 of the pressure conduit 20 on the plane perpendicular to the central axis of the packaging base 10 is located within the projection profile of the inner column surface 44 on the plane perpendicular to the central axis of the packaging base 10. The projection profile of the first part 21 of the pressure conduit 20 on the plane perpendicular to the central axis of the packaging base 10 does not contact the projection profile of the inner column surface 44 on the plane perpendicular to the central axis of the packaging base 10.

[0119] In one embodiment, such as Figures 2-3 and Figures 5-6 As shown, the column units 41 in the column array structure 40 are arranged in a U-shaped array including an inner column surface 44 and an outer column surface 45. The projections of the inner column surface 44 and the outer column surface 45 onto a plane perpendicular to the central axis of the packaging base 10 are both squares. The side length of the projection of the inner column surface 44 onto a plane perpendicular to the central axis of the packaging base 10 is greater than the diameter of the projection of the first part 21 of the pressure conduit 20 onto a plane perpendicular to the central axis of the packaging base 10.

[0120] By setting the relationship between the side length of the inner cylindrical surface 44 of the column array structure 40 and the diameter of the pressure conduit 20, this invention further enhances the isolation effect between the stress caused by the static pressure load transmitted from the bottom of the differential pressure sensing element 31 and the differential pressure sensing element 31, suppresses static pressure deviation, and thus further reduces the influence of high static pressure on the differential pressure sensing element 31, which is beneficial to improving the measurement accuracy and repeatability of the differential pressure sensing element 31.

[0121] In one embodiment, the projection of the column unit 41 in the column array structure 40 onto a plane perpendicular to the central axis of the packaging base 10 is a circle or a rectangle.

[0122] Specifically, the projection of the column unit 41 onto a plane perpendicular to the central axis of the packaging base 10 can also be set to any other suitable shape, which can be adjusted according to needs, and all are within the protection scope of the present invention.

[0123] In one embodiment, such as Figure 7As shown in (d), the central axes of the column array structure 40, the first part 21 of the pressure conduit 20, the pipe port 23, and the differential pressure sensing element 31 are all coincident. The differential pressure sensing element 31 has a differential pressure sensing element opening 34 on its surface near the first part 21 of the pressure conduit 20, which is used to expose the sensitive film of the differential pressure sensing element 31.

[0124] By aligning the central axes of the column array structure 40, the differential pressure sensing element 31, and the first part 21 of the pressure conduit 20 (pipe port 23), this invention further enhances the isolation effect between the stress caused by the static pressure load transmitted from the bottom of the differential pressure sensing element 31 and the differential pressure sensing element 31, suppressing static pressure deviation and thus further reducing the impact of high static pressure on the differential pressure sensing element 31. This is beneficial for improving the measurement accuracy and repeatability of the differential pressure sensing element 31.

[0125] In one embodiment, such as Figures 4-5 As shown, the encapsulation structure also encapsulates a static pressure sensing element 32 and a temperature sensing element 33, which are bonded and fixed to the non-pillar array structure area of ​​the second end face 12. Based on the real-time acquired static pressure and temperature values, compensation for the differential pressure signal can be achieved, further reducing static pressure deviation and temperature drift, and improving the measurement accuracy and repeatability of the differential pressure signal.

[0126] In summary, the packaging structure of the differential pressure sensing element of the present invention can isolate the stress of static pressure load on the differential pressure sensing element by setting a column array structure, reduce the influence of high static pressure on the differential pressure sensing element, suppress static pressure deviation, and improve the measurement accuracy and repeatability of the differential pressure sensing element. At the same time, static pressure deviation is reduced by setting the length and position height of the column unit. In addition, the size relationship between the column array structure, the differential pressure sensing element, and the pressure conduit is set to suppress static pressure deviation. Furthermore, the shape of the column unit is set to suppress static pressure deviation. Finally, the integrated packaging of the static pressure sensing element and the temperature sensing element allows for real-time acquisition of static pressure and temperature values ​​and compensation for the differential pressure signal, further reducing static pressure deviation and temperature drift, and improving the measurement accuracy and repeatability of the differential pressure signal.

[0127] Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0128] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A packaging structure for a differential pressure sensing element, characterized in that, The encapsulation structure includes: an encapsulation base, a pressure conduit, and a column array structure, and the encapsulation structure is used to encapsulate a sensitive element; Both the pressure conduit and the column array structure are located within the encapsulation base; the pressure conduit includes a first part, the pipe direction of the first part being parallel to the central axis direction of the encapsulation base; In addition to the differential pressure sensing element, the sensing elements encapsulated in the packaging structure also include a static pressure sensing element and a temperature sensing element. The column array structure includes multiple column units, the central axis of each column unit being parallel to the pipe direction of the first part of the pressure conduit, and the column array structure being distributed around the pipe periphery of the first part of the pressure conduit; the encapsulation base, from bottom to top along the central axis, has a first end face, a second end face, and a third end face, the second end face being the bottom surface of a groove recessed from the third end face; the column array structure includes a first array surface and a second array surface perpendicular to the central axis of the encapsulation base, and the differential pressure sensing element is fixed to the pipe opening of the first part of the pressure conduit and the second array surface of the column array structure.

2. The packaging structure of the differential pressure sensing element according to claim 1, characterized in that, The encapsulation structure further includes a ceramic gasket, which is fixed around the second end face of the encapsulation base. The ceramic gasket includes a first surface and a second surface that are oppositely disposed and perpendicular to the central axis of the encapsulation base. The first surface is in contact with the second end face, and the second surface is close to the third end face. The first array surface of the column array structure is close to the first end face, and the second array surface is away from the first end face. The second array surface is higher or lower than the second end face, or the second array surface is flush with the second end face.

3. The packaging structure of the differential pressure sensing element according to claim 2, characterized in that, When the first array surface is flush with the second end surface, the length of the column array structure along the central axis of the column unit is greater than or equal to 1 mm.

4. The packaging structure of the differential pressure sensing element according to claim 2, characterized in that, When the first array surface is lower than the second end surface, the length of the column array structure along the central axis of the column unit is greater than or equal to 2 mm.

5. The packaging structure of the differential pressure sensing element according to any one of claims 1-4, characterized in that, In the column array structure, some adjacent column units are interconnected to form multiple merged column units. The column array structure is composed of multiple merged column units and column units. The projected area of ​​each merged column unit on the plane perpendicular to the central axis of the packaging base is greater than the projected area of ​​the column unit before connection on the plane perpendicular to the central axis of the packaging base.

6. The packaging structure of the differential pressure sensing element according to any one of claims 1-4, characterized in that, The column array structure consists of multiple merged column units, with adjacent column units interconnected to form multiple merged column units. The projected area of ​​each merged column unit on a plane perpendicular to the central axis of the packaging base is greater than the projected area of ​​the column unit before connection on a plane perpendicular to the central axis of the packaging base.

7. The packaging structure of the differential pressure sensing element according to claim 1, characterized in that, The column array structure is arranged in a U-shaped array including inner and outer columns. The projection profile of the inner column on the plane perpendicular to the central axis of the packaging base is rectangular or circular, and the projection profile of the outer column on the plane perpendicular to the central axis of the packaging base is rectangular or circular. The projection profile of the differential pressure sensing element on the plane perpendicular to the central axis of the packaging base is located within the projection profile of the outer column on the plane perpendicular to the central axis of the packaging base. The distance between the projection profile of the outer column on the plane perpendicular to the central axis of the packaging base and the projection profile of the differential pressure sensing element on the plane perpendicular to the central axis of the packaging base is greater than 0.8 mm.

8. The packaging structure of the differential pressure sensing element according to claim 1, characterized in that, The column units in the column array structure are arranged in a U-shaped array including inner and outer column surfaces. The projection profile of the inner column surface on the plane perpendicular to the central axis of the packaging base is rectangular or circular, and the projection profile of the outer column surface on the plane perpendicular to the central axis of the packaging base is rectangular or circular. The projection profile of the first part of the pressure conduit on the plane perpendicular to the central axis of the packaging base is located within the projection profile of the inner column surface on the plane perpendicular to the central axis of the packaging base. The projection profile of the first part of the pressure conduit on the plane perpendicular to the central axis of the packaging base does not contact the projection profile of the inner column surface on the plane perpendicular to the central axis of the packaging base.

9. The packaging structure of the differential pressure sensing element according to claim 1, characterized in that, The projection of the column unit in the column array structure onto a plane perpendicular to the central axis of the packaging base is a circle or a rectangle.

10. The packaging structure of the differential pressure sensing element according to claim 1, characterized in that, The column array structure, the first port of the pressure conduit, and the central axis of the differential pressure sensing element all coincide. The differential pressure sensing element has a differential pressure sensing element opening on its surface near the first port of the pressure conduit, which exposes the sensitive film of the differential pressure sensing element.

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