Packaging product and detection method thereof

Abstract

The invention provides a packaging product and a detection method thereof. The packaging product comprises a substrate, a component arranged on the substrate, a piezoelectric sensitive film arranged on the surface of the component and a plastic packaging body for packaging the component and the piezoelectric sensitive film. Wherein an antenna assembly is etched on the surface of the piezoelectric sensitive film; the piezoelectric sensitive film is used for generating induction current related to defects of the plastic package body and sending the induction current to an external data processing module through the antenna assembly; and the data processing module is used for determining defect information of the plastic package body according to the induction current and preset parameters. According to the invention, high-precision product online defect detection can be realized under the condition that the product is not damaged.

Description

Technical Field

[0001] This invention relates to the field of electronic product packaging and testing technology, and more specifically, to a packaged product and its testing method. Background Technology

[0002] Currently, in the process of SIP packaging of electronic products, the high-density integration often leads to prominent internal stress problems, especially cracks or delamination defects at the interface of the packaging material. These defects are the core cause of packaging failure, affecting product quality and performance.

[0003] Traditional non-destructive testing (NDT) techniques for addressing the aforementioned defects primarily employ X-ray inspection or ultrasonic testing. X-ray inspection has a low detection rate for micron-sized (<10μm) cracks, less than 40% of the frequency domain signal. Ultrasonic testing is susceptible to interference from the internal metal structure of the package, affecting its accuracy. Furthermore, neither of these techniques can achieve precise defect location, with a positioning error greater than 50μm, and requires destructive cap opening verification. After cap opening, the package scrap rate is 100% of the frequency domain signal, thus failing to meet the high-quality online inspection requirements of mass production. Summary of the Invention

[0004] In view of the above problems, the purpose of this invention is to provide a packaged product and its testing method to solve the problem that existing packaged products require destructive cap opening verification to confirm product defect information, which cannot meet the high-quality online testing requirements of mass production.

[0005] The packaging product provided by this invention includes a substrate, components disposed on the substrate, a piezoelectric sensitive film disposed on the surface of the components, and a molding compound encapsulating the components and the piezoelectric sensitive film; wherein, An antenna assembly is etched onto the surface of the piezoelectric sensitive film; The piezoelectric sensitive film is used to generate an induced current related to the defects of the encapsulation, and transmits it to an external data processing module through the antenna assembly; The data processing module is used to determine the defect information of the encapsulated body based on the induced current and preset parameters.

[0006] In addition, an optional technical solution is to set different identification information for the piezoelectric sensitive film corresponding to different components when at least two components are provided. The data processing module determines the defect information of the encapsulation based on the identification information and the induced current corresponding to the identification information.

[0007] In addition, an optional technical solution is that the defect information includes crack size, stress level, and spatial coordinates.

[0008] Alternatively, the antenna assembly may employ an array of distributed spiral coils, with the center-to-center spacing between adjacent coils ranging from 150 μm to 250 μm.

[0009] Furthermore, an optional technical solution is that the preset parameters are built into the data processing module; and, The data processing module is non-contactly coupled to the antenna assembly via an NFC reader / writer to obtain the induced current.

[0010] On the other hand, the present invention also provides a method for testing packaged products, used for real-time online testing of the aforementioned packaged products, the method comprising: The induced current related to the defects of the packaged product is obtained through a piezoelectric sensitive film and sent to an external data processing module through an antenna assembly; The data processing module determines the defect information of the plastic encapsulation of the packaged product based on the induced current and preset parameters.

[0011] In addition, an optional technical solution is that the data processing module determines the defect information of the molding compound based on the induced current and preset parameters, including: The induced current is optimized, and the optimized signal is Fourier transformed to obtain the frequency domain signal corresponding to the induced current. The frequency domain signal is filtered, and the impedance amplitude and resonant frequency of the processed signal are obtained. The defect information is determined by obtaining the impedance amplitude and the cosine similarity between the resonant frequency and the preset parameters.

[0012] In addition, an optional technical solution is that the data processing module obtains the induced current by non-contact coupling with the antenna assembly via an NFC reader / writer; wherein, after determining the defect information, the method further includes: Based on the coordinate information of the antenna assembly within the plastic package and its mapping relationship with the NFC reader, the defect information is optimized in terms of coordinates.

[0013] In addition, an optional technical solution is to optimize the induced current, including: The induced current is subjected to threshold denoising; and the threshold-denoised signal is truncated in the time domain to remove the transition interference signals at the beginning and end of the signal.

[0014] Alternatively, an optional technical solution is to obtain the induced current through the NFC reader / writer, including: collecting a time-domain current signal within a preset duration at a preset sampling frequency, as the induced current.

[0015] Using the packaging product and its testing method provided by the present invention, real-time online detection of defects in the plastic package can be achieved through the antenna assembly and the piezoelectric sensitive film disposed on the surface of the component. There is no need to perform destructive opening verification of the product. It can be applied to existing packaging processes, reduce mass production application costs, and solve the problem that existing technologies cannot achieve non-destructive, real-time, and high-precision monitoring of internal defects in SIP packages.

[0016] To achieve the foregoing and related objectives, one or more aspects of the invention include the features which will be described in detail below and specifically pointed out in the claims. The following description and accompanying drawings illustrate certain exemplary aspects of the invention. However, these aspects indicate only a few of the various ways in which the principles of the invention can be used. Furthermore, the invention is intended to include all such aspects and their equivalents. Attached Figure Description

[0017] Other objects and results of the invention will become more apparent and readily understood with reference to the following description taken in conjunction with the accompanying drawings and the contents of the claims, and with a more complete understanding of the invention. In the drawings: Figure 1 This is a schematic diagram of the structure of a packaged product according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the detection principle of a packaged product according to an embodiment of the present invention; Figure 3 This is a flowchart of a packaged product testing method according to an embodiment of the present invention.

[0018] Figure reference numerals: 1. Substrate; 2. Pad; 3. Piezoelectric sensitive film; 4. Molded package; 5. Component. Detailed Implementation

[0019] In the following description, numerous specific details are set forth for illustrative purposes and to provide a thorough understanding of one or more embodiments. However, it will be apparent that these embodiments may also be implemented without these specific details. In other instances, well-known structures and devices are shown in block diagram form for ease of description of one or more embodiments.

[0020] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0021] To address the issues of poor defect location accuracy and the need for destructive cap opening for verification in existing non-destructive testing of packaged products, which fails to meet the requirements for real-time online monitoring in mass production, this invention provides a packaged product and its testing method. The packaged product includes a substrate, components mounted on the substrate, a piezoelectric sensitive film mounted on the surface of the components, and a molding compound encapsulating the components and the piezoelectric sensitive film. An antenna assembly is etched onto the surface of the piezoelectric sensitive film. The piezoelectric sensitive film generates an induced current related to defects in the molding compound, which is transmitted to an external data processing module via the antenna assembly. The data processing module then determines the defect information of the molding compound based on the induced current and preset parameters, enabling high-quality real-time online defect monitoring.

[0022] Figure 1 A schematic structure of a packaged product according to an embodiment of the present invention is shown; Figure 2 A schematic diagram illustrating the detection principle of a packaged product according to an embodiment of the present invention is shown.

[0023] Combination Figure 1 and Figure 2As shown in the figure, the packaging product provided by the present invention includes a substrate 1, a plurality of components 5 disposed on the substrate 1 via pads 2, piezoelectric sensitive films 3 disposed on the surface of each component 5, and a molding compound 4 encapsulating all components 5 and piezoelectric sensitive films 3. In order to realize the signal transmission between the piezoelectric sensitive films 3 and the outside world, corresponding antenna components can be etched on the surface of each piezoelectric sensitive film 3. The piezoelectric sensitive films 3 can generate induced current related to the defects of the molding compound 4, and send it to an external data processing module through the antenna components. The data processing module can determine the specific defect information of the molding compound 4 according to the induced current and preset parameters, and realize online non-destructive testing of the product without damaging the product.

[0024] To improve the accuracy of non-destructive testing, when at least two components are present, different identification information can be set for the piezoelectric sensitive membrane 3 corresponding to different components. During application, the data processing module can preliminarily determine the location information of possible defects in the encapsulation 4 based on the identification information and the induced current corresponding to the identification information. The defect information includes at least the presence of cracks, crack size, stress level, and spatial coordinates.

[0025] Specifically, the piezoelectric sensitive film 3 can be deposited on the surface of the component 5 using a deposition process, placing it at the interface between the component 5 and the molding compound 4. The material can be PVDF-TrFE or KNN-based piezoelectric ceramic. The thickness of PVDF-TrFE can be set to 3-8 μm, with a dielectric constant of 10-15 and a piezoelectric coefficient of 12-18 pC / N, suitable for room temperature environments. The thickness of KNN-based piezoelectric ceramic is 5-10 μm, with a dielectric constant of 180-220 and a piezoelectric coefficient of 70-90 pC / N, and it is heat resistant, suitable for high-temperature environments. The specific settings can be flexibly configured according to the application scenario and testing requirements of the product.

[0026] In a specific embodiment of the present invention, in the frequency domain signal, the antenna assembly can be etched on the piezoelectric sensitive film 3, using an array of distributed spiral coils. The center-to-center spacing between adjacent coils ranges from 150μm to 250μm. During application, when cracks or delamination occur inside the packaged product, the piezoelectric sensitive film 3 in the corresponding area will deform due to stress concentration, resulting in a sudden change in dielectric constant and resistivity. For example, for every 10MPa increase in stress, the dielectric constant will decrease by 5%, thereby reducing the capacitance of the spiral coil antenna at the corresponding position by 4.8%. At the same time, the resistivity increases, causing the resistance of the spiral coil to rise, ultimately resulting in a characteristic shift in impedance. Based on this, the signal transmitted by the piezoelectric sensitive film 3 at the corresponding position can be reflected to the outside world through the antenna assembly.

[0027] Specifically, the data processing module can achieve contactless coupling with the antenna assembly via an NFC reader / writer. Preset parameters are built into the data processing module. After obtaining the induced single current, the module can determine relevant defect information by comparing and analyzing it with the preset parameters. The NFC frequency domain signal reader / writer can emit an alternating magnetic field of a certain frequency, which, after coupling to the helical coil antenna, generates a corresponding induced current. The amplitude change of the induced current is linearly related to the impedance change, and this linear relationship can be derived by fitting multiple sets of experimental data.

[0028] Correspondingly, the preset parameters stored in the data processing module can include impedance characteristics for different crack sizes, stress levels, and spatial coordinates. The induced current transmitted through the antenna assembly determines the corresponding impedance characteristics. By comparing these impedance characteristics with those in the preset parameters, defect-related information can be determined.

[0029] In specific applications, such as Figure 2 As shown, the testing system for the above-mentioned packaged products may consist of four parts: a SIP package base layer, a dynamic impedance mapping layer, a signal transmission module, and a data processing module. The structure of the SIP package base layer is as follows: Figure 1 As shown, the dynamic impedance mapping layer includes a piezoelectric sensitive film 3 and a distributed spiral coil antenna disposed on the piezoelectric sensitive film 3. The signal transmission module can be implemented based on the distributed spiral coil antenna and an external NFC reader / writer, and the data processing module can adopt an integrated RISC-V architecture edge AI chip to support various data operations and processing.

[0030] As can be seen, the specific type of encapsulation, the structure of the antenna assembly, the type of components, and the selection of the data processing module can all be set and adjusted according to the testing requirements and scenarios, and are not limited to the specific structures shown in the attached figures.

[0031] Corresponding to the above-mentioned packaged products, the present invention also provides a method for testing packaged products, for real-time online testing of the above-mentioned packaged products.

[0032] Specifically, Figure 3 A schematic flow diagram of a packaged product testing method according to an embodiment of the present invention is shown. Figure 3 As shown, the packaging product testing method of this invention includes: S100: Acquires induced current related to defects in the packaged product through a piezoelectric sensitive film and transmits it to an external data processing module through an antenna assembly; S200: The data processing module determines the defect information of the plastic package of the packaged product based on the induced current and preset parameters.

[0033] Specifically, the packaged product includes a substrate, several components disposed on the substrate, piezoelectric sensitive films disposed on the surfaces of each component, and a plastic encapsulation body that encapsulates all components and piezoelectric sensitive films. In order to enable signal transmission between the piezoelectric sensitive films and the outside world, corresponding antenna components are etched on the surface of each piezoelectric sensitive film. The piezoelectric sensitive films can generate induced currents related to defects in the plastic encapsulation body and send them to an external data processing module through the antenna components. The data processing module then analyzes and processes the data to determine the specific defect information of the plastic encapsulation body.

[0034] The data processing module determines the defect information of the molding compound based on the induced current and preset parameters, and further includes: S210: Optimize the induced current and perform Fourier transform on the optimized signal to obtain the frequency domain signal corresponding to the induced current. In this step, the induced current can be obtained through an NFC reader or writer. For example, the time-domain current signal within a preset duration can be collected according to a preset sampling frequency as the induced current and sent to the data processing module for signal processing.

[0035] In addition, the process of optimizing the induced current may include: thresholding the induced current; and truncating the thresholded signal in the time domain to remove the transitional interference signals at the beginning and end of the signal, obtaining a clean time-domain current signal, and then performing Fourier transform processing on it to obtain the corresponding frequency domain signal.

[0036] S220: Filters the frequency domain signal and obtains the impedance amplitude and resonant frequency of the processed signal.

[0037] S230: Obtain the cosine similarity between the impedance amplitude and resonant frequency and the preset parameters to determine the defect information.

[0038] Among them, the corresponding frequency response characteristics can be determined based on the impedance amplitude and resonant frequency of the frequency domain signal. The database of the data processing module pre-stores frequency response characteristic templates (i.e. preset parameters) containing different crack sizes, spatial coordinates and stress levels. By calculating the cosine similarity between the current frequency response characteristics and the template, the initial defect coordinate information can be determined based on the similarity results.

[0039] Specifically, the data processing module can be contactlessly coupled to the antenna assembly via an NFC reader / writer; after determining the defect information, it also includes: optimizing the coordinates of the defect information based on the coordinates of the antenna assembly within the plastic package and the mapping relationship with the NFC reader.

[0040] As a specific example, the antenna assembly uses an array of distributed spiral coils. Each spiral coil corresponds to a fixed spatial region inside the plastic package, forming a correspondence between the spiral coil and the package space. When a crack or delamination occurs in a certain region inside the plastic package, only the spiral coil in the corresponding region will produce a characteristic impedance change due to the stress deformation of the piezoelectric sensitive film below. The impedance of the spiral coil in the non-defect region remains unchanged at the baseline value. By identifying the spiral coil with abnormal impedance, the spatial range of the defect can be initially located. Then, the precise defect location information can be determined through coordinate optimization. Alternatively, the impedance change can be converted into a defect thermal map to achieve precise location and dynamic monitoring of micron-level defects.

[0041] Since a single antenna can only determine distance and cannot determine two-dimensional or three-dimensional coordinates, this invention sets up multiple spiral coils to form a spatial reference array. The NFC reader outside the packaged product will collect parameters such as signal amplitude, phase, and transmission delay of different spiral coil antennas, try to map the signal characteristics to the spatial position, and then combine various methods such as bilinear interpolation algorithm, least squares method or machine learning fitting to lock the precise position coordinates.

[0042] It should be noted that the descriptions in the above embodiments of the packaging product testing method and the packaging product device embodiments can be referenced and learned from each other, and will not be repeated here.

[0043] As can be seen from the above specific embodiments, the packaged product and its testing method provided by the present invention do not rely on large-scale precision equipment such as frequency domain signal X-rays or ultrasonic waves. Online defect detection can be achieved using only a piezoelectric sensitive film, antenna assembly, and frequency domain signal NFC reader / writer. The equipment investment is lower and the detection accuracy is higher. In addition, there is no need to disassemble the plastic package. After testing, the product can enter the subsequent production or use process normally, avoiding the waste of resources that would otherwise be scrapped after testing. It can be applied to real-time online non-destructive testing scenarios for various types of packaged products.

[0044] As referred above Figures 1 to 3 The packaged product and its testing method according to the present invention are described by way of example. However, those skilled in the art should understand that various modifications can be made to the packaged product and its testing method according to the present invention without departing from the scope of the invention. Therefore, the scope of protection of the present invention should be determined by the contents of the appended claims.

Claims

1. A packaged product, characterized in that, It includes a substrate, components disposed on the substrate, a piezoelectric sensitive film disposed on the surface of the components, and a molding compound encapsulating the components and the piezoelectric sensitive film; wherein, An antenna assembly is etched onto the surface of the piezoelectric sensitive film; The piezoelectric sensitive film is used to generate an induced current related to the defects of the encapsulation, and transmits it to an external data processing module through the antenna assembly; The data processing module is used to determine the defect information of the encapsulated body based on the induced current and preset parameters.

2. The packaged product as described in claim 1, characterized in that, When at least two of the components are provided, different identification information is set for the piezoelectric sensitive films corresponding to different components; The data processing module determines the defect information of the encapsulation based on the identification information and the induced current corresponding to the identification information.

3. The packaged product as described in claim 2, characterized in that, The defect information includes crack size, stress level, and spatial coordinates.

4. The packaged product as described in claim 1, characterized in that, The antenna assembly employs an array of distributed spiral coils, with the center-to-center spacing between adjacent coils ranging from 150μm to 250μm.

5. The packaged product as described in claim 1, characterized in that, The preset parameters are built into the data processing module; and... The data processing module is non-contactly coupled to the antenna assembly via an NFC reader / writer to obtain the induced current.

6. A method for testing packaged products, characterized in that, The method for real-time online testing of the packaged product as described in any one of claims 1 to 5 includes: The induced current related to the defects of the packaged product is obtained through a piezoelectric sensitive film and sent to an external data processing module through an antenna assembly; The data processing module determines the defect information of the plastic encapsulation of the packaged product based on the induced current and preset parameters.

7. The packaging product testing method as described in claim 6, characterized in that, The data processing module determines the defect information of the molding compound based on the induced current and preset parameters, including: The induced current is optimized, and the optimized signal is Fourier transformed to obtain the frequency domain signal corresponding to the induced current. The frequency domain signal is filtered, and the impedance amplitude and resonant frequency of the processed signal are obtained. The defect information is determined by obtaining the impedance amplitude and the cosine similarity between the resonant frequency and the preset parameters.

8. The packaging product testing method as described in claim 7, characterized in that, The data processing module is contactlessly coupled to the antenna assembly via an NFC reader / writer to obtain the induced current; wherein, after determining the defect information, it further includes: Based on the coordinate information of the antenna assembly within the plastic package and its mapping relationship with the NFC reader, the defect information is optimized in terms of coordinates.

9. The packaging product testing method as described in claim 7, characterized in that, Optimizing the induced current includes: The induced current is subjected to threshold denoising; and the threshold-denoised signal is truncated in the time domain to remove the transition interference signals at the beginning and end of the signal.

10. The packaging product testing method as described in claim 8, characterized in that, Obtaining the induced current through the NFC reader includes: The time-domain current signal is collected within a preset time period according to a preset sampling frequency and used as the induced current.

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