Case structure and assembling method thereof

Abstract

The invention provides a case structure and an assembling method thereof, and the case structure comprises a frame plate which is provided with a second frame plate; the mainboard is provided with a water cooling system mounting position and a display card mounting position, and is provided with a first ventilation hole group and a second ventilation hole group; a first air inlet hole group and a second air inlet hole group are formed in the side plate; under the condition that the side plate is mounted on the frame plate, the first air inlet hole group correspondingly covers the first ventilation hole group, and the second air inlet hole group correspondingly covers the second ventilation hole group; a plurality of air outlet holes are formed in the second frame plate, air flow enters the case body from the first air inlet hole group, passes through the first ventilation hole group and then flows out of the case body through the air outlet holes, and a first heat dissipation air channel of the water cooling system is formed; and air flow enters the case body from the second air inlet hole group, passes through the second ventilation hole group and then flows out of the case body through the air outlet holes, so that a second heat dissipation air channel of the display card mounting position is formed.

Description

Technical Field

[0001] This application relates to the field of electronic heat dissipation equipment, and more particularly to a chassis structure and its assembly method. Background Technology

[0002] As the computing power of CPUs (Central Processing Units) and GPUs (Graphics Processing Units) inside computer cases increases, the heat they generate also rises, necessitating effective cooling for these major heat-generating components. Traditional cooling methods for computer cases include air cooling, liquid cooling, or a combination of both. Air cooling uses metal conduction and active fan exhaust to remove heat, and is currently the most common cooling method. Liquid cooling uses liquid as the heat transfer medium, removing heat through a closed-loop system, resulting in significantly higher cooling efficiency than air cooling, making it particularly suitable for high-performance PCs or users who prioritize quiet operation and aesthetics. For optimal cooling performance, computer cases typically employ a combination of liquid and air cooling. For example, CPUs, with their high cooling requirements, are cooled using liquid cooling, while GPUs are cooled using air cooling.

[0003] Currently, the airflow paths of liquid cooling and air cooling in traditional computer cases overlap. For example, in a traditional computer case, the GPU is cooled by front and rear fans forming a horizontal airflow path, while the CPU's water cooling radiator is horizontally mounted on top, with fans blowing air towards the radiator to form a vertical airflow path. Cool air enters from the front of the case, with some flowing to the graphics card, some to the water cooling radiator, and some being exhausted directly from the rear. As graphics card power consumption increases, the cool air flowing over the graphics card is heated before entering the water cooling radiator, causing the radiator's intake temperature to rise. This is detrimental to CPU cooling and ultimately leads to excessively high overall temperatures inside the case, affecting the user experience. Summary of the Invention

[0004] To address the aforementioned issues, embodiments of this application provide a chassis structure and its assembly method, which enables better heat dissipation within the chassis.

[0005] Therefore, the following technical solutions are adopted in the embodiments of this application:

[0006] In a first aspect, embodiments of this application provide a chassis structure, including: a frame plate having a first frame plate, a second frame plate, and a third frame plate connected sequentially to each other, the first frame plate, the second frame plate, and the third frame plate forming part of the sidewall of the chassis body for accommodating multiple electronic components; a motherboard, mounted in parallel on the second frame plate, the motherboard having a water-cooling system mounting position and a graphics card mounting position, and a first ventilation hole group and a second ventilation hole group respectively opened at the water-cooling system mounting position and the graphics card mounting position; and a side plate, the side plate and the second frame plate being arranged parallel to the plane formed by the first direction and the second direction, the side plate being able to cover the opening of the frame plate along the third direction, and having a first air inlet hole group and a second air inlet hole group opened on the side plate; the side plate being mounted on the second frame plate... In the case of the aforementioned frame plate, the first air intake group covers the first ventilation hole group, and the second air intake group covers the second ventilation hole group; wherein, the first direction defines the length direction of the chassis body, the second direction defines the height direction of the chassis body, and the third direction defines the width direction of the chassis body; wherein, the second frame plate has multiple air outlet holes, the airflow enters the chassis body from the first air intake group, then passes through the first ventilation hole group and flows out of the chassis body through the air outlet holes, forming the first heat dissipation airflow channel of the water cooling system; the airflow enters the chassis body from the second air intake group, then passes through the second ventilation hole group and flows out of the chassis body through the air outlet holes, forming the second heat dissipation airflow channel of the graphics card mounting position.

[0007] The core principle of this technical solution is to fundamentally solve the problem of cross-interference in traditional chassis cooling airflow by using a structurally oriented layout and independent upper and lower air ducts. Specifically, the first, second, and third frame plates are connected sequentially to form the sidewalls of the chassis body, creating a stable mounting reference and defining the internal space boundaries of the chassis to prevent disordered airflow diffusion. The motherboard and the second frame plate are arranged parallel to each other, so that the water cooling system mounting position and graphics card mounting position on the motherboard form a "straight airflow channel" with the air outlet of the second frame plate, shortening the airflow path and reducing resistance. The side plate and the second frame plate are set parallel to each other along their length and height, and the side plate covers the opening in the width direction of the frame plate, ensuring that external cold air can only enter the chassis through specific air intake holes on the side plate, avoiding chaotic airflow.

[0008] Therefore, the technical solution in this application embodiment constructs two completely independent heat dissipation air ducts through the precise correspondence of "air inlet group, ventilation hole group and air outlet":

[0009] Hole group correspondence: The first air intake hole group on the side panel is precisely aligned with the first ventilation hole group on the motherboard water cooling system mounting position, and the second air intake hole group is precisely aligned with the second ventilation hole group on the graphics card mounting position, forming two independent "air intakes";

[0010] Unified exhaust outlet: Multiple air outlets on the second frame plate serve as a unified exhaust channel, ensuring that the airflow from both air ducts can be smoothly discharged, avoiding the accumulation of air pressure inside the chassis.

[0011] Airflow path: non-intersecting directional heat dissipation circulation

[0012] Based on the definitions of the three directions of the chassis (length: first direction, height: second direction, width: third direction), the airflow paths of the two air ducts are clear and do not intersect:

[0013] First heat dissipation airflow (water cooling system): External cold air enters from the first air intake group on the side panel (in the width direction of the chassis body), then enters the first ventilation group on the motherboard and the heat dissipation surface of the water cooling system, absorbs the heat of the CPU, and is then discharged through the air outlet of the second frame plate.

[0014] Second cooling airflow (graphics card): External cool air enters through the second air intake group on the side panel (in the width direction of the chassis body), and then enters the second ventilation group on the motherboard and the graphics card heat dissipation surface in sequence. After absorbing the heat of the GPU, it is discharged through the exhaust vents on the second frame plate.

[0015] Both air ducts draw cold air directly from the outside, and there is no crossover or mixing inside the chassis, completely avoiding the problem of "heated air from the graphics card flowing into the water cooling radiator" in traditional solutions.

[0016] As one feasible implementation, the motherboard is further provided with a motherboard mounting position and a power supply mounting position, which are arranged side by side along a first direction, and the water cooling system mounting position and the graphics card mounting position are located on opposite sides of the motherboard mounting position.

[0017] In this implementation, by arranging the motherboard and power supply along the length, and placing the water cooling and graphics card on both sides of the motherboard, the chassis is compacted by utilizing the height space, and the heat dissipation airflow, power supply path and component positions are precisely matched. Ultimately, it achieves a comprehensive advantage of efficient heat dissipation, stable power supply, convenient installation and strong compatibility, perfectly adapting to the usage needs of current high-power hardware.

[0018] As one feasible implementation, a third set of ventilation holes is provided at the power supply mounting location.

[0019] As one feasible implementation, a power supply bracket for mounting the chassis power supply is installed at the power supply mounting position. The power supply bracket is U-shaped. When the chassis power supply is mounted on the power supply bracket, the width direction of the chassis power supply is the same as the width direction of the chassis body, and the air inlet of the power supply faces the third ventilation hole group. A power adapter cable is provided on the side wall of the power supply bracket arranged along the first direction. The power adapter cable passes through the side wall of the power supply bracket and connects to the bottom of the chassis power supply along the second direction.

[0020] In this embodiment, the structural design of the U-shaped bracket solves the problems of power supply fixation and space reservation, the definition of the power supply installation direction is adapted to the overall layout and independent air duct, and the arrangement of the adapter cable optimizes power supply efficiency and air duct without interference.

[0021] As one feasible implementation, a graphics card adapter bracket is installed at the graphics card mounting position. The graphics card adapter bracket is used to connect the graphics card, and the width direction of the graphics card is the same as the width direction of the chassis body.

[0022] In this implementation, the installation direction of the graphics card is forcibly standardized by the bracket, so that the graphics card can be fully integrated into the three-dimensional space definition, modular layout and independent airflow system of the chassis. This not only solves the pain points of traditional graphics card installation such as heat dissipation obstruction, space waste and poor compatibility, but also enhances the synergy with the CPU, power supply and water cooling system.

[0023] In one feasible implementation, the graphics card adapter bracket includes an adapter tube, a cable management frame, and a graphics card slot plate. The adapter tube is used to install an adapter connected to the chassis, and the adapter tube is arranged along a second direction and mounted on the first frame plate. The cable management frame is used to arrange the cables connected to the graphics card, and the cable management frame is arranged along a first direction, with the end of the cable management frame connected to the end of the adapter tube, so that the adapter tube and the cable management frame are L-shaped as a whole. The graphics card slot plate is used to insert the graphics card, and the graphics card slot plate is mounted on the cable management frame. The graphics card slot plate is arranged along the second direction so that the width direction of the graphics card is the same as the width direction of the chassis body.

[0024] In this implementation, a stable reference is provided by the adapter tube, the cable management frame ensures neat wiring, and the graphics card slot ensures directional installation. The L-shaped structure formed by these three components not only meets the core requirements of graphics card fixing, wiring, and heat dissipation, but also perfectly adapts to the three-dimensional space definition, modular layout, and independent airflow system of the chassis. It is especially suitable for high-power flagship graphics cards, small high-performance hosts, professional design workstations, and other scenarios, further enhancing the overall competitiveness of the chassis.

[0025] As one possible implementation, the graphics card slot is mounted on the side of the cable tray facing the adapter tube.

[0026] In this implementation, by mounting the graphics card slot on the side of the cable management bracket facing the adapter tube, a four-fold synergy is achieved: spatial adaptation (avoiding interference), cable optimization (reducing losses), balanced stress (preventing deformation), and unobstructed airflow (improving heat dissipation). Specifically, the close-proximity, opposite installation of the graphics card slot and the adapter tube achieves synergy across four dimensions: spatial layout adaptation, optimized cable transmission, balanced stress, and unobstructed airflow, allowing the graphics card installation to be fully integrated into the L-shaped bracket and the overall chassis system.

[0027] As one feasible implementation, the chassis structure further includes a top plate and a bottom plate; the top plate and the bottom plate are respectively located on both sides of the chassis body along the second direction, and can cover the openings on both sides of the frame plate extending along the second direction, so that the frame plate, together with the side plates, the top plate and the bottom plate, constitutes the chassis body; the receiving cavity formed by the frame plate, together with the side plates, the top plate and the bottom plate, defines the internal space of the chassis body.

[0028] In this embodiment, the structural closed loop of the chassis body is completed by sealing the openings in the height direction of the frame plate with the top and bottom plates. This not only enhances rigidity and protection but also precisely defines the internal space boundary, providing a stable support for the modular layout and independent air duct system.

[0029] As one feasible implementation, the water cooling system includes a water cooling radiator installed at the water cooling system mounting position, a cooling fan installed on one side of the water cooling radiator, and a water cooling head installed on the motherboard. The water cooling head is connected to the water cooling radiator through inlet and outlet water pipes. The width direction of the water cooling radiator and the cooling fan is consistent with the width direction of the chassis body, so that the rotation of the cooling fan can drive the cold air outside the chassis to dissipate heat from the water cooling radiator through the first heat dissipation air duct.

[0030] In this implementation, by aligning the width of the water cooling radiator and fan with the width of the chassis, the efficient heat conduction of liquid cooling and the pure cold source of directional air cooling are perfectly combined, which not only leverages the heat dissipation advantages of liquid cooling but also avoids the airflow interference problems of traditional water cooling.

[0031] As one feasible implementation, screw fixing holes are reserved on the corresponding mounting positions of the water cooling system mounting position and the graphics card mounting position, and the water cooling radiator is connected to the water cooling system mounting position by inserting screws into the screw fixing holes.

[0032] In this implementation, by reserving screw fixing holes that match industry standards, the installation of the water cooling radiator is upgraded from arbitrary fixing without a reference to rigid fixing with precise positioning. This ensures both the ease of installation and structural stability, as well as the deep synergy between the water cooling radiator and the overall layout and independent air duct.

[0033] Secondly, embodiments of this application also provide a method for assembling the chassis structure as described in the first aspect, comprising the following steps: aligning the motherboard with the second frame plate and mounting the motherboard on the second frame plate; mounting the power supply bracket at the power supply mounting position on the motherboard and then installing the power supply; mounting the water cooling radiator in the water cooling system at the water cooling system mounting position and then mounting the water block at the motherboard mounting position; mounting the graphics card adapter bracket on the motherboard and then installing the graphics card; and mounting the top plate and bottom plate at the openings on both sides of the frame plate in the second direction to complete the assembly of the chassis structure; wherein the width direction of the power supply, water cooling radiator, and graphics card is consistent with the width direction of the chassis body.

[0034] In this implementation, by following the logical arrangement steps of reference components, core functional components, heat dissipation components, and structural closed loop, it is ensured that each component is installed to accurately fit the three-dimensional direction of the chassis, modular layout, and independent air duct, ultimately achieving the goal of interference-free installation, accurate component orientation, and optimal system synergy.

[0035] In summary, the essence of the technical solution in this application is to define the airflow path through chassis structure design. Specifically, through the precise positioning of the frame plate, motherboard, and side plates, and the corresponding design of the hole groups, the "messy and cross-flow channels" of traditional chassis are upgraded to "directional and independent airflow channels," fundamentally solving the core pain point of hot air interference. Its advantages are not only reflected in the improvement of heat dissipation efficiency and balance, but also take into account structural compactness, compatibility, quiet operation, energy saving, and ease of maintenance, fully adapting to the heat dissipation needs of high-performance hardware, while optimizing the user experience. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0037] The various regions, shapes, and their relative sizes and positional relationships shown in the figure are merely illustrative and may deviate from reality due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed.

[0038] In the various figures, the same elements are represented by similar reference numerals. For clarity, the various parts in the figures are not drawn to scale, and certain features may be exaggerated or omitted to more clearly illustrate and explain this application.

[0039] Figure 1A schematic diagram of the internal structure of a traditional computer case is shown.

[0040] Figure 2 This paper shows a three-dimensional structural diagram of a chassis structure provided in an embodiment of this application;

[0041] Figure 3 An exploded view of a partial three-dimensional structure of a chassis structure provided in an embodiment of this application is shown;

[0042] Figure 4 A schematic diagram of the first and second heat dissipation ducts provided in the embodiments of this application is shown;

[0043] Figure 5 The front view of the internal structure of the chassis is shown;

[0044] Figure 6 A schematic diagram showing the layout of the water cooling system, motherboard, power supply, and graphics card behind the hidden frame plate and side plate is shown.

[0045] Figure 7 A schematic diagram of the power supply being mounted on the motherboard is shown.

[0046] Figure 8 This diagram shows the structure of the graphics card adapter bracket when it is installed on the motherboard.

[0047] Figure 9 A schematic diagram of the assembly method of the chassis structure provided in the embodiments of this application is shown.

[0048] In the diagram, 1. Frame plate; 11. First frame plate; 111. Power connector; 112. Adapter hole; 12. Second frame plate; 121. Air outlet; 13. Third frame plate; 2. Side plate; 21. First air inlet group; 22. Second air inlet group; 23. Glass panel; 3. Motherboard; 31. Water cooling system mounting position; 31-1. Water cooling system; 31-11. Water radiator; 31-12. Cooling fan; 31-13. Water block; 31-14. Inlet and outlet water pipes; 3 11. First ventilation hole group; 32. Motherboard mounting position; 32-1. Motherboard; 33. Power supply mounting position; 33-1. Chassis power supply; 331. Third ventilation hole group; 332. Power supply bracket; 333. Power adapter cable; 34. Graphics card mounting position; 34-1. Graphics card; 341. Second ventilation hole group; 35. Screw fixing holes; 4. Top plate; 41. Decorative panel; 5. Bottom plate; 6. Graphics card adapter bracket; 61. Adapter tube; 62. Cable management bracket; 63. Graphics card slot. Detailed Implementation

[0049] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0050] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0051] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0052] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0053] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0054] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0055] In this embodiment, the chassis refers to a structured shell that supports and houses the core electronic components of a computing system, providing physical protection, heat dissipation management, and peripheral interface expansion. The chassis is a core component of the computing system. In one example, this chassis can be applied to various desktop computer devices such as those for home office, gaming, professional design, and industrial control, serving as the basic carrier for connecting and securing various hardware components. For example, the computing system can be a storage array, storage device, storage enclosure, server, computer cluster, or any other device or equipment including controllers, processing resources, etc.

[0056] In one example, the electronic components housed within a desktop chassis include core computing components, storage components, power supply components, and auxiliary function components. Core computing components may include a motherboard, central processing unit (CPU), graphics processing unit (GPU), and random access memory (RAM). Storage components include storage media such as hard disk drives (HDDs), solid-state drives (SSDs), or any other storage media adapted to the desktop chassis's mounting specifications. The storage media can be any one or a combination of random access memory, volatile memory, non-volatile memory, flash memory, any type of storage disk, etc., and the storage media can be non-transitory. Power supply components include ATX standard power supplies, SFX small form factor power supplies, and other power supply devices adapted to different chassis specifications, used to provide stable power to the various electronic components. Auxiliary function components include air coolers, water cooling systems (e.g., radiators), chassis cooling fans, interface expansion cards (such as sound cards, network cards, and capture cards), optical drives, etc. The cooling components are used to dissipate heat generated during component operation, while the expansion cards enhance the desktop's functional expandability.

[0057] Figure 1 A schematic diagram of the internal structure of a traditional computer case is shown. (For example...) Figure 1As shown, some traditional desktop cases have fixed dimensions and internal layouts. For example, traditional ATX desktop cases typically have fixed dimensions of around 400mm × 180mm × 450mm, with the layout of internal bays, motherboard mounting positions, and power supply bays all following a single standard; MATX, ITX, and other smaller cases correspond to fixed, miniaturized sizes. Furthermore, the cooling method for GPU a inside a traditional case is through case fans b mounted on the front and rear sides of the case, with an airflow path like... Figure 1 As indicated by the horizontal arrow L. In traditional cases, the water-cooling radiator d used to cool the CPU c is typically mounted on the top of the case. The fan e on the radiator d is usually installed to blow air onto the radiator d. Air passes through the radiator d and is then exhausted from the case. See [reference needed for airflow designation]. Figure 1 The arrow V points vertically in the middle.

[0058] Therefore, please continue reading Figure 1 The arrows used to illustrate traditional computer case airflow show that the horizontal arrow L indicates that cool air from outside the case enters the case from the front. Some of this cool air flows to the graphics card (A), some to the water cooling radiator (D), and some is exhausted directly from the rear of the case. The water cooling radiator (D) is installed horizontally at the top of the case, as described above. However, with the increasing power consumption of graphics card (A), this traditional water cooling radiator (D) installation structure has a problem: after entering the case from the front, some of the cool air passes through graphics card (A) and then through water cooling radiator (D). This air is heated by graphics card (A), resulting in a significantly higher temperature for the air entering the water cooling radiator (D) fan (E) than the cool air directly entering from outside the case. This puts the water cooling radiator (D), responsible for cooling CPU (C), in a disadvantageous position, leading to excessively high overall temperatures inside the case and a poor user experience.

[0059] Therefore, this application provides a chassis structure housing core components including a central processing unit (CPU), a graphics processing unit (GPU), a vertically mounted water-cooling radiator, a power module, a motherboard, and a graphics card adapter bracket. The CPU is cooled by a vertical water-cooling radiator, which is parallel to the motherboard and draws cool air directly from outside the chassis. The graphics card is rotated and mounted via an adapter bracket, also using direct external airflow for cooling, avoiding airflow interference with the CPU. The power module is fixed by a dedicated bracket, and a power adapter cable ensures circuit connectivity and prevents interference with the cooling airflow. The chassis shell consists of a frame plate, side panels, a glass panel, a top plate, and a bottom plate, forming a closed and directional airflow channel. All components are fixed using a modular mounting structure, ensuring installation stability and facilitating disassembly and maintenance. In other words, the chassis structure in this embodiment rotates the water-cooling radiator by 90°, allowing cool air passing through the radiator to be drawn directly from outside the chassis. The graphics card is also rotated and uses the same method of drawing cool air directly from outside the chassis for cooling. The revised overall layout is more compact and rational, separating the originally intersecting air ducts and greatly shortening the length of the air ducts, resulting in higher heat dissipation efficiency.

[0060] The following is in conjunction with the appendix Figure 2-9 The technical solutions of the embodiments of this application will be described by way of example.

[0061] Figure 2 A three-dimensional structural diagram of a chassis structure provided in an embodiment of this application is shown. Figure 3 An exploded view of a partial three-dimensional structure of a chassis structure provided in an embodiment of this application is shown. Figure 2 and Figure 3 As shown, in this embodiment, the chassis structure includes a frame plate 1, side plates 2, and a motherboard 3 installed inside the frame plate 1. The frame plate 1 and side plates 2 form the four side walls of the chassis body, defining the boundaries of the internal space of the chassis body. In this embodiment, the frame plate 1 and side plates 2 are used as the side walls of the chassis body, eliminating the need to redesign the chassis body template and thus saving on mold-making costs.

[0062] Optionally, to further enhance the overall integrity of the chassis body, the chassis structure may also include a top plate 4 and a bottom plate 5; the top plate 4 and the bottom plate 5 are respectively located on both sides of the chassis body along the second direction, and can cover the openings on both sides of the frame plate 1 extending along the second direction, so that the frame plate 1, together with the side plate 2, the top plate 4 and the bottom plate 5, constitute the chassis body; the accommodating cavity formed by the frame plate 1, together with the side plate 2, the top plate 4 and the bottom plate 5, defines the internal space of the chassis body. It is understood that the second direction referred to in this embodiment defines the height direction of the chassis body. In addition, the first direction mentioned below in this embodiment defines the length direction of the chassis body, and the third direction defines the width direction of the chassis body.

[0063] In some implementations, to enhance the aesthetics of the chassis, a decorative panel 41 can be installed on the upper side of the top plate 4. The decorative panel 41 is used to improve the appearance of the chassis body. Furthermore, the decorative panel 41 can be customized for the user. For example, the decorative panel 41 can be made of wood, transparent glass, or plastic, or a combination thereof. Customizable patterns can also be added to the decorative panel 41 to personalize the chassis body.

[0064] In one example, the frame plate 1 has a first frame plate 11, a second frame plate 12, and a third frame plate 13 connected sequentially to each other. The first frame plate 11, the second frame plate 12, and the third frame plate 13 constitute part of the sidewall of the chassis body for accommodating multiple electronic components. In this embodiment, Figure 3 The following describes the orientation of the frame plates. Specifically, the first frame plate 11 forms the rear side wall of the chassis body, the second frame plate 12 forms the right side wall of the chassis body, and the third frame plate 13 forms the front side wall of the chassis body. The overall structure of the frame plates 1 is U-shaped, meaning that the first frame plate 11 and the third frame plate 13 are parallel to each other, and the second frame plate 12 connects the first frame plate 11 and the second frame plate 12, and the second frame plate 12 is perpendicular to the first frame plate 11 / second frame plate 12. It can be understood that the first frame plate 11, the second frame plate 12, and the third frame plate 13 can be integrally formed, welded together, or fixed together by fasteners. For example, in this embodiment, the first, second, and third frame plates 12 and 13 are formed by bending a single piece of sheet metal to improve the overall strength of the frame plate 1. In this example, the first frame plate 11, the second frame plate 12, and the third frame plate 13 are sequentially connected to form part of the side wall of the chassis body, forming a stable installation reference, while defining the internal space boundary of the chassis and preventing disordered airflow diffusion.

[0065] Continue reading Figure 3As shown, the motherboard 3 is mounted in parallel on the second frame plate 12. Along the second direction, from top to bottom, the motherboard 3 has a water-cooling system mounting position 31, a motherboard mounting position 32, a power supply mounting position 33, and a graphics card mounting position 34. A first ventilation hole group 311, a second ventilation hole group 341, and a third ventilation hole group 331 are respectively provided at the water-cooling system mounting position 31, the graphics card mounting position 34, and the power supply mounting position 33. Exemplarily, the size of the motherboard 3 can be specifically set according to the number and size of the electronic components to be installed. This embodiment does not strictly limit the size of the motherboard 3, as long as it can be mounted on the second frame plate 12 and located inside the chassis body. Optionally, any suitable type of fastener and / or attachment mechanism (not shown in the figure) can be used to achieve the connection and attachment between the motherboard 3 and the second frame plate 12. For example, fasteners and / or attachment mechanisms create non-permanent joints, and fasteners and / or attachment mechanisms may include, but are not limited to, screws, bolts, etc. The non-permanent connector allows for easy removal of the mainboard 3 from the second frame plate 12.

[0066] It is worth mentioning that, Figure 1 Traditional desktop cases may only accommodate hardware components of specific sizes. For example, small ITX cases cannot accommodate full-size ATX motherboards or extra-long graphics cards (GPUs), while large ATX cases would be a waste of space and a cost overrun if used for basic office configurations. Furthermore, to accommodate upgrades (such as from an office computer to a high-end gaming PC), users often need to replace the entire desktop case. The replacement cost includes the material cost of the new case and the labor cost of disassembling, reinstalling, and configuring the existing electronic components. These replacement costs remain essentially constant regardless of whether the new case fully utilizes its maximum expansion capabilities.

[0067] More specifically, to accommodate users' customized CPUs and GPUs of different specifications, in this embodiment, the water cooling system mounting position 31, motherboard mounting position 32, power supply mounting position 33, and graphics card mounting position 34 are detachable expansion modules. For example, screw mounting holes 35 are provided at the water cooling system mounting position 31, motherboard mounting position 32, power supply mounting position 33, and graphics card mounting position 34, allowing screws to be inserted into the screw mounting holes 35 to accommodate water cooling radiators 31-11, CPUs, power supplies 33-1, and GPUs of different functions and specifications.

[0068] In some implementations, expansion bay modules, enhanced cooling modules, interface expansion modules, and size adaptation modules can be added to the chassis structure. Different functional and sized expansion modules can be selectively attached to the chassis structure as needed. For example, adding expansion bay modules can increase the number of hard drives installed, for instance, from 2 to 4-6; assembling enhanced cooling modules can add water-cooling mounting positions and high-pressure fan positions; connecting interface expansion modules can add USB-C 3.2 ports, Thunderbolt ports, multi-channel audio interfaces, etc.; and changing size adaptation modules allows for flexible switching between ATX and MATX motherboards. Combining expansion modules with the basic chassis structure allows for flexible adjustment of the overall size, functional layout, and expansion capabilities of the desktop chassis, thus adapting to hardware configuration requirements for different scenarios, from basic office work to high-end gaming and professional design. Therefore, this implementation provides a modular and expandable design that allows the use of a unified basic chassis structure, achieving diverse functions by combining different expansion modules, without incurring the costs associated with replacing an entire traditional fixed-size chassis. This can improve component versatility and production efficiency in product manufacturing, while providing users with greater flexibility and reducing the cost of hardware upgrades and scenario switching.

[0069] The following section will continue to introduce the structural components of the chassis.

[0070] For example, the side plate 2 and the second frame plate 12 are arranged parallel to the plane formed by the first direction and the second direction, and the side plate 2 can cover the opening of the frame plate 1 along the third direction, such as... Figure 3 As shown, side panel 2 forms the left side wall of the chassis body. Therefore, the motherboard 3 and the second frame plate 12 are installed in parallel, and side panel 2 covers the opening in the width direction, making the overall chassis structure more compact and saving space compared to traditional chassis.

[0071] Figure 4 A schematic diagram of the first and second heat dissipation ducts provided in the embodiments of this application is shown; Figure 5 The front view of the internal structure of the chassis is shown. (See also...) Figure 4 and Figure 5 Review Figure 3 A first air inlet group 21 and a second air inlet group 22 are provided on the side panel 2. Furthermore, a glass panel 23 is provided in the middle of the side panel to allow observation of the internal structure of the chassis. When the side panel 2 is mounted on the frame plate 1, the first air inlet group 21 covers the first ventilation hole group 311, and the second air inlet group 22 covers the second ventilation hole group 341. Simultaneously, multiple air outlets 121 are provided on the second frame plate 12. Airflow enters the chassis body from the first air inlet group 21, passes through the first ventilation hole group 311, and then flows out of the chassis body through the air outlets 121, forming the first heat dissipation airflow channel of the water cooling system 31-1, such as... Figure 4The airflow is indicated by the arrow on the upper side; airflow enters the chassis from the second air intake group 22, then passes through the second ventilation group 341 and exits the chassis through the exhaust hole 121, forming the second heat dissipation airflow channel of the graphics card mounting position 34, as shown in the image. Figure 4 The airflow is indicated by the arrow on the lower side. In this example, the first air intake group 21 of the side panel 2 is precisely aligned with the first ventilation group 311 of the motherboard 3 water cooling system mounting position 31, and the second air intake group 22 is precisely aligned with the second ventilation group 341 of the graphics card mounting position 34, forming two independent air intakes. The multiple air outlets 121 on the second frame plate 12 serve as exhaust channels, ensuring that the airflow from both airflow channels can be smoothly discharged, avoiding the accumulation of air pressure inside the chassis. The airflow from both airflow channels directly draws in cool air from the outside, and there is no crossover or mixing inside the chassis, effectively reducing the problem of air heated by the graphics card flowing into the water cooling radiator 31-11 in traditional solutions.

[0072] Specifically, in traditional solutions, the intake air of the 31-11 radiator includes hot air heated by the graphics card, causing the CPU's cooling source temperature to rise. In this solution, both the water cooling system and the graphics card directly draw from the cool air outside the chassis, resulting in a larger temperature difference and significantly improved cooling efficiency, especially suitable for high-power CPUs and GPUs. Both airflow paths are straight and short (no turning, no detours), with low airflow resistance, resulting in a larger airflow rate through the cooling surface per unit time and faster heat removal. Furthermore, in traditional solutions, the intersecting airflow paths cause the CPU and GPU cooling to interfere with each other (high-power graphics cards exacerbate the CPU's cooling load). This solution, with its one-to-one airflow design, ensures that the airflow of the CPU and GPU does not interfere with each other, regardless of whether they are under high load simultaneously. This prevents one side's hot air from affecting the other, ensuring a balanced overall temperature inside the chassis and avoiding hardware throttling due to localized overheating. Finally, traditional solutions require additional fans to be installed at the front and rear of the chassis to force airflow, which not only increases energy consumption but also generates fan noise. In contrast, this solution, with its short-path, low-resistance airflow design, allows natural airflow to meet the heat dissipation requirements without the need for additional fans, thus reducing equipment energy consumption. The smooth, turbulent airflow reduces friction noise between the airflow and internal chassis components. Combined with the quiet operation of the liquid cooling system, the overall operating noise is significantly reduced.

[0073] Figure 6 This diagram shows the layout of the water cooling system 31-1, motherboard 32-1, power supply 33-1, and graphics card behind the hidden frame plate 1 and side plate 2. (See attached diagram.) Figures 3 to 6In a specific example, the motherboard mounting position 32 and the power supply mounting position 33 are arranged side by side along the first direction, and the water cooling system mounting position 31 and the graphics card mounting position 34 are located on opposite sides of the motherboard mounting position 32. As described above, the first direction is the length direction of the chassis body. Arranging the motherboard mounting position 32 and the power supply mounting position 33 side by side along this direction, while placing the water cooling system 31-1 and the graphics card 34-1 on opposite sides of the motherboard 32-1, essentially utilizes the extended space in the length direction to compress the redundant volume in the height and width directions. Specifically, the motherboard 32-1, as the carrier of the core computing components, is located at the central hub of the layout. This avoids the increased chassis thickness caused by stacking in the height direction, and also avoids occupying too much space in the width direction, making the structure compact and reducing material consumption. The power supply, as a larger component, is arranged side by side with the motherboard 32-1 along the length of the chassis body, rather than being stacked in the height / width direction. This makes the overall size of the chassis more regular, while reserving independent installation areas for the water cooling system 31-1 and the graphics card 34-1, namely the space on both sides of the motherboard 32-1, to avoid interference between the installation positions of the components.

[0074] For example, the water cooling system 31-1 includes a water cooling radiator 31-11 installed in the water cooling system mounting position 31, a cooling fan 31-12 installed on one side of the water cooling radiator 31-11, and a water cooling head 31-13 installed on the motherboard 3. The water cooling head 31-13 is connected to the water cooling radiator 31-11 through inlet and outlet water pipes 31-14. The width direction of the water cooling radiator 31-11 and the cooling fan 31-12 is consistent with the width direction of the chassis body, so that the rotation of the cooling fan 31-12 can drive the cold air outside the chassis to dissipate heat from the water cooling radiator 31-11 through the first heat dissipation air duct. In this example, the width direction of the cooling fan 31-12 being consistent with the width direction of the chassis body means that the rotation surface of the cooling fan 31-12 is parallel to the length and width directions of the chassis body, that is, the water cooling radiator 31-11 is vertically installed inside the chassis body. For details, please refer to [link to relevant documentation]. Figure 4 and Figure 5 Optionally, screw mounting holes 35 are reserved on the corresponding mounting positions of the water cooling system mounting position 31 and the graphics card mounting position 34. In this embodiment, the water cooling radiator 31-11 can be connected to the water cooling system mounting position 31 by inserting screws into the screw mounting holes 35.

[0075] In this example, the width of the water-cooling radiator 31-11 and the cooling fan 31-12 are consistent with the width of the chassis body (third direction). The core is to align the heat dissipation components with the air intake side of the chassis (side panel 2) on the same plane, laying the physical foundation for directly drawing in external cold air. The width of the chassis is the core channel for cold air to enter and exit. For example, the side panel 2 has a first air intake group 21. The width of the water-cooling radiator 31-11 and the cooling fan 31-12 are adapted to the width of the chassis, so that the heat dissipation surface (the air intake side of the cooling fan 31-12) can be completely aligned with the first air intake group 21 of the side panel 2, without lateral offset or obstruction. This allows the cooling fan 31-12 to directly capture the low-temperature cold air from outside the chassis when it rotates, without having to pass through other components inside the chassis, ensuring the purity of the cold source from the source.

[0076] Understandably, the heat dissipation principle of the water cooling system 31-1 in this example is that the water block 31-13 is attached to the surface of the CPU. The water block 31-13 absorbs the heat of the CPU component to be cooled in the case through the coolant flowing inside it. The heat is then transferred to the water radiator 31-11 by the water pump inside the water block 31-13 via the inlet and outlet water pipes 31-14. The fins of the water radiator 31-11 increase the heat dissipation area. Together with the cold air introduced by the cooling fan 31-12, the heat in the coolant is quickly carried away. The cooled coolant then flows back to the water block 31-13, forming a continuous heat dissipation cycle.

[0077] In this example, the water cooling system mounting position 31 is located on the upper side of the motherboard 32-1, allowing the water block 31-13 in the water cooling system 31-1 to directly contact the surface of the processor on the motherboard 32-1. This shortens the length of the water cooling pipes, eliminates the need to bypass other components, reduces the risk of leakage caused by pipe bends, and ensures that the heat from the processor on the motherboard 32-1 can be quickly absorbed by the water cooling system 31-1. Meanwhile, the water cooling system mounting position 31 and the graphics card mounting position 34 are located on both sides of the motherboard 32-1, corresponding to the first air intake group 21 and the second air intake group 22 of the side panel 2. After entering from the corresponding hole group of the side panel 2, the cold air can flow directly to the water cooling system 31-1 / graphics card 34-1 without being detoured due to the cluttered component layout.

[0078] Furthermore, the power supply mounting position 33 is adjacent to but independent of the motherboard mounting position 32. The third ventilation hole group 331 serves only the power supply, and its airflow path is completely separated from the first and second heat dissipation air channels. The three run parallel to each other without interfering with each other. At the same time, the power supply is installed alongside the motherboard 32-1 along its length, corresponding to the third ventilation hole group 331 of the power supply mounting position 33 on the motherboard 3. The heat generated by the power supply itself can pass through the third ventilation hole group 331 and be directly discharged through the exhaust hole 121 of the second frame plate 12 without mixing into the heat dissipation air channels of the motherboard 32-1 / graphics card 34-1, thus avoiding the power supply heat from interfering with the heat dissipation environment of the core components.

[0079] Figure 7 A schematic diagram showing the power supply mounted on motherboard 3 is provided. Figure 7 As shown, optionally, a power supply bracket 332 for mounting the power supply 33-1 is installed at the power supply mounting position 33. The power supply bracket 332 is U-shaped. When the power supply 33-1 is mounted on the power supply bracket 332, the width direction of the power supply 33-1 is the same as the width direction of the chassis body, and the air inlet of the power supply faces the third ventilation hole group 331. In this example, the side walls and bottom of the U-shaped power supply bracket 332 form a semi-enclosed support, which can restrict the lateral displacement of the power supply from the left and right sides, and support the weight of the power supply by supporting it from the bottom, ensuring that the power supply is stable and does not wobble after installation. This power supply bracket 332 is particularly suitable for the weight requirements of high-power power supplies. The semi-enclosed design of the U-shaped power supply bracket 332 does not occupy much space, and the installation direction of the power supply 33-1 is consistent with the width of the chassis, allowing the power supply 33-1 to be closely aligned with the processor 32-1 along its length, with no stacking in the height direction and no redundancy in the width direction. Compared with the traditional design where the power supply is arranged perpendicular to the motherboard, the overall chassis volume can be reduced by 10%-15%, making it more suitable for scenarios such as small desktops and embedded racks. In one example, the power supply 33-1 is attached to the motherboard 3 of the chassis body without the use of support such as the power supply bracket 332. For example, in the installation of some lightweight power supplies, the power supply 33-1 can also be fixed to the motherboard 3 simply by screws.

[0080] In another example, a power adapter cable 333 is installed on the side wall of the power supply bracket 332 along the first direction. The power adapter cable 333 passes through the side wall of the power supply bracket 332 and connects to the bottom of the power supply 33-1 along the second direction. The other end of the power adapter cable 333 avoids the motherboard 32-1 and connects to the first board frame in a Z-shape. A power connector 111 for connecting the power adapter cable 333 to external power is reserved on the first board frame. In this example, the side wall of the power supply bracket 332 along the first direction (length direction) is adjacent to the bottom of the power supply 33-1 (second direction). The adapter cable passes through this side wall and directly connects to the bottom interface of the power supply 33-1, allowing the power supply path to directly connect from the side wall of the power supply bracket 332 to the bottom of the power supply 33-1. The connection spacing is shorter, reducing cable bends and length redundancy. Furthermore, the adapter cable is positioned on the side wall of the power supply bracket 332 rather than on the power supply heat dissipation surface, preventing the cable from getting tangled near the power supply air intake or the third ventilation hole group 331, ensuring smooth and unobstructed airflow in the power supply's dedicated airflow channel; at the same time, the side wall arrangement keeps the cable away from the CPU and GPU heat dissipation airflow channels, further eliminating the impact of the cable on the overall heat dissipation.

[0081] Figure 8 This diagram illustrates the structure of the graphics card adapter bracket when mounted on motherboard 3. (See attached diagram.) Figure 8 At the same time, review Figure 3 In one example, the chassis structure also includes a graphics card adapter bracket 6 installed at the graphics card mounting position 34. The graphics card adapter bracket 6 is used to connect the graphics card 34-1, ensuring that the width direction of the graphics card 34-1 is the same as the width direction of the chassis body. In this example, the mechanical positioning structure of the graphics card adapter bracket 6 ensures that the width direction of the graphics card 34-1 is completely consistent with the width direction (third direction) of the chassis body. Optionally, the graphics card adapter bracket 6 can be fixed to the motherboard 3 by means of positioning structures such as clips and screw holes. This embodiment does not strictly limit the fixing method between the graphics card adapter bracket 6 and the chassis body, as long as the graphics card adapter bracket 6 can be stably fixed inside the chassis body. When the width of the graphics card 34-1 matches the width of the chassis, its heat dissipation surface (fan side) is directly aligned with the second air intake group 22 of the side panel 2 and with the second ventilation hole group 341 of the motherboard 3. This forms a straight airflow path from the second air intake group 22 of the side panel 2, the heat dissipation surface of the graphics card 34-1, the second ventilation hole group 341 to the air outlet 121 of the second frame plate 12, without any directional turns or spatial obstructions. The graphics card adapter bracket 6 itself adopts an avoidance structure design (does not obstruct the heat dissipation surface and ventilation hole group of the graphics card 34-1), ensuring that the airflow can pass smoothly through the heat dissipation fins of the graphics card 34-1, reducing the possibility of airflow obstruction, and maximizing the heat dissipation efficiency of the dedicated airflow channel of the graphics card 34-1. In some examples, the graphics card adapter bracket 6 can be designed with a standardized positioning design to accommodate graphics cards 34-1 of different thicknesses and lengths (such as dual-fan and triple-fan flagship graphics cards). Even if the graphics card 34-1 is long, its extension along the height direction will not affect the compactness of the chassis width or length. At the same time, it reserves independent space for the water cooling system installation position 31 without disrupting the core layout of the motherboard 32-1 with the water cooling and graphics card 34-1 placed in the center and on both sides.

[0082] Specifically, such as Figure 8 As shown, the graphics card adapter bracket 6 includes an adapter tube 61, a cable management bracket 62, and a graphics card slot plate 63. The adapter tube 61 is used to install adapters for connection to the chassis, and the adapter tubes 61 are arranged along a second direction and mounted on the first frame plate 11. Optionally, the adapter can be a PCIe (Peripheral Component Interconnect Express) interface, an HDMI (High-Definition Multimedia Interface) interface, or a DisplayPort (DP) interface. In this embodiment, the first frame plate 11 has pre-drilled adapter holes 112 for connecting the adapters in the adapter tube 61 to the outside. Each adapter installed in the adapter tube 61 can be connected to the outside through the adapter holes 112.

[0083] The cable tray 62 is used to arrange the cables that connect to the graphics card 34-1. The cable tray 62 is arranged along the first direction, and the end of the cable tray 62 is connected to the end of the adapter tube 61, so that the adapter tube 61 and the cable tray 62 are in an L-shape. The graphics card slot 63 is used to insert the graphics card 34-1. The graphics card slot 63 is installed on the cable tray 62. The graphics card slot 63 is arranged along the second direction so that the width direction of the graphics card 34-1 is the same as the width direction of the chassis body.

[0084] To minimize the impact of the graphics card adapter bracket 6 on the second cooling airflow, the cable management bracket 62 is positioned close to the base plate 5. The cable management bracket 62 is specifically designed for arranging the connection cables of the graphics card 34-1, such as PCIe extension cables and power cables. Its length-wise arrangement aligns with the core layout of the motherboard 32-1 and the power supply 33-1 along the first direction, allowing the cables to extend neatly along the length of the chassis and preventing cross-directional tangling. Optionally, the cable management bracket 62 can be designed with a perforated structure or with cable management clips to ensure that the cables maintain distance from the graphics card 34-1's heatsink surface and the chassis ventilation holes, preventing airflow obstruction.

[0085] The graphics card slot 63 is mounted on the cable management bracket 62 along the height of the chassis. Its core function is to force the width of the graphics card 34-1 to be aligned with the width of the chassis after insertion, through its own directional structure. The slot direction of the graphics card slot 63 is parallel to the height direction, so the graphics card 34-1 is naturally installed horizontally after insertion, with its heat dissipation surface facing the air intake group of the side panel 2 along the width direction of the chassis. The arrangement of the graphics card slot 63 along the height direction echoes the arrangement of the adapter tube 61 along the height direction, making the force on the entire L-shaped graphics card adapter bracket 6 more even. That is, the weight of the graphics card 34-1 is transferred to the cable management bracket 62 through the graphics card slot 63, and then to the first frame plate 11 through the adapter tube 61, reducing the possibility of deformation of the graphics card adapter bracket 6 due to local stress concentration.

[0086] In this embodiment, the adapter tube 61 can be adapted to different specifications of PCIe adapters (such as PCIe 4.0 / 5.0, x16 / x8), the graphics card slot 63 supports graphics cards 34-1 with different interfaces (PCIe 3.0 / 4.0 / 5.0), and the length of the cable management bracket 62 can be flexibly adjusted according to the chassis specifications to adapt to different chassis types such as ATX, MATX, and ITX. Whether it's a dual-fan short card or a triple-fan long card, the arrangement of the graphics card slot 63 along the height direction is compatible (the long card extends along the height direction without occupying extra length space), solving the contradiction of poor compatibility of traditional bracket long cards. It is understood that the graphics card 34-1 in this embodiment is a triple-fan long card, and due to the obstruction of the graphics card 34-1 structure, the second ventilation hole group 341 is only opened on the motherboard 3 at the rightmost fan, while no second ventilation hole group 341 is opened at the two fans near the graphics card slot 63. (See reference [link to relevant documentation]). Figure 2 and Figure 3 .

[0087] Figure 9 A schematic diagram illustrating the assembly method of the chassis structure provided in the embodiments of this application is shown. Figure 9 As shown, the assembly method of this chassis structure includes the following steps:

[0088] S901. Align the main board with the second frame plate and install the main board on the second frame plate.

[0089] In this step, aligning and fixing the motherboard to the second frame plate is the core benchmark setting for the entire assembly process. Specifically, the second frame plate is a key load-bearing structure of the chassis. The overlapping installation of the motherboard and the second frame plate ensures that the power supply mounting positions, water cooling system mounting positions, graphics card mounting positions, etc. on the motherboard are precisely aligned with the three-dimensional directions of the chassis (first: length, second: height, third: width), providing a unified benchmark for the directional installation of all subsequent components (with width consistent with the chassis).

[0090] Pre-fixing the motherboard avoids interference caused by reference offset during subsequent component installation, ensuring that components such as the power supply, water cooling radiator, and graphics card can be accurately positioned according to the preset location.

[0091] S902. After installing the power supply bracket in the power supply mounting position on the motherboard, install the power supply.

[0092] In this step, the U-shaped design of the power supply bracket is adapted to the holes in the motherboard power supply mounting position, forcing the power supply to be aligned with the chassis in the width direction after it is inserted.

[0093] S903. After installing the water cooling radiator in the water cooling system at the water cooling system mounting position, install the water block at the motherboard mounting position.

[0094] In this step, the pre-drilled screw holes of the water cooling system mounting position are precisely matched with the water cooling radiator lugs. After fixing, the width of the water cooling radiator is naturally consistent with the chassis and directly faces the air intake group.

[0095] S904. After installing the graphics card adapter bracket on the motherboard, install the graphics card.

[0096] In this step, the orientation structure of the graphics card adapter bracket (the graphics card insert is arranged along the second direction) ensures that the width direction meets the requirements after the graphics card is inserted, without the need for additional adjustments.

[0097] S905. Install the top and bottom plates on the two openings of the frame plate in the second direction to complete the assembly of the chassis structure. The width of the power supply, water cooling radiator and graphics card is consistent with the width of the chassis body.

[0098] In this step, the water cooling radiator and graphics card are installed before the top and bottom plates. Before closing the case, check their alignment with the air intake and ventilation hole groups to ensure that the first and second cooling airflow channels are unobstructed. After the power supply is installed, the power supply lines for the subsequent water cooling system and graphics card can be directly led out from the power supply, resulting in a shorter path, neater cable management, and avoiding interference with the airflow channels.

[0099] In addition, the power supply should be installed first: after fixing the power supply bracket to the motherboard's power supply mounting position, the power supply should be installed. This ensures that the width of the power supply is consistent with the case and is parallel to the motherboard along the first direction, avoiding the power supply space being occupied when installing the water cooling radiator and graphics card later. The water cooling system should be installed second: install the water cooling radiator (water cooling system mounting position) first and then the water block (motherboard mounting position). This ensures that the water cooling radiator is aligned with the first air intake group on the side panel and facilitates the connection of the inlet and outlet pipes (the pipe path between the water block and the water cooling radiator is the shortest). The graphics card should be installed last: after fixing the graphics card adapter bracket, the graphics card should be installed. This can utilize the space boundaries of the already installed components (power supply, water cooling radiator) to avoid interference, ensuring that the width of the graphics card is consistent with the case and fits snugly against the side panel air intake. The top and bottom plates are the finishing touches: finally, the openings in the height direction are closed to complete the structural loop and prevent internal components from getting dusty or being bumped during the assembly process.

[0100] In summary, this application's embodiments introduce a chassis structure, employing airflow reconstruction and directional component installation design. Core improvements include a 90° rotation modification of the water-cooling radiator and adaptation for rotating graphics card installation. The water-cooling radiator is changed from a traditional horizontal installation to a vertical installation parallel to the motherboard, and the graphics card is rotated for installation via a dedicated adapter bracket. Both directly draw cool air from outside the chassis. The internal airflow of the chassis is optimized from the traditional "front-to-top" to "left-to-right," completely isolating the airflow for the CPU and graphics card to avoid cross-interference. This design significantly shortens the airflow path and eliminates redundant fans at the front and rear of the chassis, improving cooling efficiency (avoiding heated air participating in secondary cooling) and making the chassis structure more compact, reducing material consumption and footprint. Simultaneously, the fanless design reduces power consumption and operating noise, achieving simultaneous optimization of cooling performance, space utilization, and user experience, meeting the long-term stable operation requirements of high-power hardware.

[0101] The positional relationships, quantity, and structural shape of the various components of the chassis structure provided in this application are not limited to the above embodiments. All technical solutions implemented under the principles of this application are within the protection scope of this solution. Any one or more embodiments or illustrations in the specification, combined in a suitable manner, are within the protection scope of this solution.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application. Those skilled in the art should understand that although this application has been described in detail with reference to the foregoing embodiments, modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to depart from the spirit and scope of the technical solutions in the embodiments of this application.

Claims

1. A chassis structure, characterized in that, include: The frame plate has a first frame plate, a second frame plate and a third frame plate connected in sequence. The first frame plate, the second frame plate and the third frame plate constitute part of the side wall of the chassis body and are used to accommodate multiple electronic components. A motherboard is mounted in parallel on the second frame plate. The motherboard has a water-cooling system mounting position and a graphics card mounting position, and a first ventilation hole group and a second ventilation hole group are respectively provided at the water-cooling system mounting position and the graphics card mounting position; and The side panel and the second frame plate are arranged parallel to the plane formed by the first direction and the second direction. The side panel can cover the opening of the frame plate along the third direction, and a first air inlet group and a second air inlet group are provided on the side panel. When the side panel is installed on the frame plate, the first air inlet group covers the first ventilation hole group, and the second air inlet group covers the second ventilation hole group. The first direction defines the length direction of the chassis body, the second direction defines the height direction of the chassis body, and the third direction defines the width direction of the chassis body. The second frame plate has multiple air outlets. Airflow enters the chassis body from the first air inlet group, passes through the first ventilation hole group, and then flows out of the chassis body through the air outlets, forming the first heat dissipation airflow channel of the water cooling system. Airflow enters the chassis body from the second air inlet group, passes through the second ventilation hole group, and then flows out of the chassis body through the air outlets, forming the second heat dissipation airflow channel of the graphics card mounting position.

2. The chassis structure according to claim 1, characterized in that, The motherboard is also provided with a motherboard mounting position and a power supply mounting position, which are arranged side by side along the first direction, and the water cooling system mounting position and the graphics card mounting position are located on opposite sides of the motherboard mounting position.

3. The chassis structure according to claim 2, characterized in that, A third set of ventilation holes is provided at the power supply installation location.

4. The chassis structure according to claim 2, characterized in that, A power supply bracket for mounting the chassis power supply is installed at the power supply mounting position. The power supply bracket is U-shaped. When the chassis power supply is mounted on the power supply bracket, the width direction of the chassis power supply is the same as the width direction of the chassis body. The air inlet of the power supply faces the third ventilation hole group. A power adapter cable is provided on the side wall of the power supply bracket arranged along the first direction. The power adapter cable passes through the side wall of the power supply bracket and is connected to the bottom of the chassis power supply along the second direction.

5. The chassis structure according to any one of claims 1-4, characterized in that, A graphics card adapter bracket is installed at the graphics card mounting position. The graphics card adapter bracket is used to connect the graphics card and makes the width direction of the graphics card the same as the width direction of the chassis body.

6. The chassis structure according to claim 5, characterized in that, The graphics card adapter bracket includes an adapter tube, a cable management frame, and a graphics card slot plate. The adapter tube is used to install an adapter that connects to the chassis, and the adapter tube is arranged along a second direction and mounted on the first frame plate. The cable management frame is used to arrange the cables that connect to the graphics card, and the cable management frame is arranged along a first direction. The end of the cable management frame is connected to the end of the adapter tube, so that the adapter tube and the cable management frame are in an L-shape. The graphics card slot plate is used to insert the graphics card, and the graphics card slot plate is mounted on the cable management frame. The graphics card slot plate is arranged along a second direction so that the width direction of the graphics card is the same as the width direction of the chassis body.

7. The chassis structure according to claim 6, characterized in that, The graphics card slot is installed on the side of the cable tray facing the adapter tube.

8. The chassis structure according to any one of claims 1-4, characterized in that, The chassis structure further includes a top plate and a bottom plate; the top plate and the bottom plate are respectively located on both sides of the chassis body along the second direction, and can cover the openings on both sides of the frame plate extending along the second direction, so that the frame plate, together with the side plate, the top plate and the bottom plate, constitute the chassis body; the accommodating cavity formed by the frame plate, the side plate, the top plate and the bottom plate defines the internal space of the chassis body.

9. The chassis structure according to claim 8, characterized in that, The water cooling system includes a water cooling radiator installed at the water cooling system mounting position, a cooling fan installed on one side of the water cooling radiator, and a water cooling head installed on the motherboard. The water cooling head is connected to the water cooling radiator through inlet and outlet water pipes. The width direction of the water cooling radiator and the cooling fan is consistent with the width direction of the chassis body, so that the rotation of the cooling fan can drive the cold air outside the chassis to dissipate heat from the water cooling radiator through the first heat dissipation air duct.

10. A method for assembling the chassis structure according to any one of claims 1-9, characterized in that, Includes the following steps: Align the mainboard with the second frame plate, and install the mainboard on the second frame plate; After installing the power supply bracket in the power supply mounting position on the motherboard, install the power supply. After installing the radiator in the water cooling system at the water cooling system mounting position, install the water block at the motherboard mounting position. After installing the graphics card adapter bracket on the motherboard, install the graphics card; as well as, Install the top and bottom plates into the openings on both sides of the frame plate in the second direction to complete the assembly of the chassis structure; The width of the power supply, water cooling radiator, and graphics card is consistent with the width of the chassis itself.

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