Double-cavity circulating flow guide CPU water-cooling radiator

Abstract

The utility model discloses a double-chamber circulating flow guide CPU water-cooling radiator, which comprises a water-cooling head, a circulating pipeline and a water pump, and is characterized in that a main chamber and an auxiliary chamber which are mutually independent are arranged in the water-cooling head, a cold discharge piece connected with the main chamber and the auxiliary chamber is embedded on the outer side of the water-cooling head, a wavy flow guide plate is arranged in the auxiliary chamber, and the water pump is connected with the main chamber and the auxiliary chamber. The main cavity and the auxiliary cavity are communicated through the flow guide plate to form a circulation path, a heat absorption substrate making contact with a CPU is arranged at the bottom of the main cavity, and the circulation pipeline is communicated with the main cavity, the auxiliary cavity and the water pump to form a double-cavity circulation flow guide structure. Through double-cavity independent flow guide, intelligent flow control, efficient heat exchange structure design and visual monitoring, the heat dissipation efficiency and reliability are remarkably improved, and the heat dissipation requirement of a high-performance CPU is met.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology, specifically a dual-chamber circulating CPU water cooling heat sink. Background Technology

[0002] With the development of integrated circuit technology, CPU power density is constantly increasing, and the high heat generated during high-frequency operation places higher demands on heat dissipation devices. Existing CPU water cooling radiators mostly adopt a single-chamber structure, where the coolant absorbs heat through the water block and then dissipates it directly through a single radiator, which has the following shortcomings:

[0003] The single-chamber flow channel design is simple, but the contact area between the coolant and the heat-absorbing substrate and heat dissipation fins is insufficient, and the flow path is short, resulting in inadequate heat exchange, especially when the CPU is under high load, which can easily lead to a sudden temperature rise. Traditional water cooling systems mostly use water pumps with fixed flow rates or single-channel regulation, which cannot dynamically allocate the coolant flow rate of dual chambers (if any) according to the real-time CPU load, resulting in insufficient heat dissipation under high load or energy waste under low load. Utility Model Content

[0004] In order to overcome the shortcomings of existing technical solutions, this utility model provides a dual-chamber circulating flow CPU water cooling radiator, which can effectively solve the problems mentioned in the background art.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] A dual-chamber circulating CPU water-cooling radiator includes a water block, circulation pipes, and a water pump. The water block has an independent main chamber and a secondary chamber. A radiator connecting the main chamber and the secondary chamber is embedded on the outside of the water block. A corrugated guide plate is provided inside the secondary chamber. The main chamber and the secondary chamber are connected by the guide plate to form a circulation path. A heat-absorbing plate that contacts the CPU is provided at the bottom of the main chamber. The circulation pipes are connected to the main chamber, the secondary chamber, and the water pump, forming a dual-chamber circulating structure.

[0007] The radiator assembly includes a first water-cooled radiator and a second water-cooled radiator. The first water-cooled radiator is connected to the secondary chamber, and the second water-cooled radiator is connected to the main chamber. The first water-cooled radiator and the second water-cooled radiator are connected to each other. Both the first water-cooled radiator and the second water-cooled radiator are provided with heat dissipation fins. The liquid inlet of the first water-cooled radiator is connected to the water outlet of the secondary chamber, and the liquid outlet of the second water-cooled radiator is connected to the water inlet of the main chamber.

[0008] As a further description of the above technical solution, the guide plate is inclinedly disposed between the main chamber and the auxiliary chamber, the angle between the guide plate and the bottom surface of the main chamber is 30°-60°, and the guide plate is provided with a plurality of guide holes for the coolant in the main chamber to enter the auxiliary chamber.

[0009] As a further description of the above technical solution, a first guide block and a second guide block are sequentially arranged inside the main chamber along the coolant flow direction, and the first guide block and the second guide block are arranged alternately to form a tortuous flow channel.

[0010] As a further description of the above technical solution, the circulation pipeline is equipped with an electrically controlled flow control valve and a temperature sensor connected to the water pump. The temperature sensor is respectively installed at the inlet of the main chamber and the outlet of the auxiliary chamber, and the electrically controlled flow control valve is electrically connected to the temperature sensor.

[0011] As a further description of the above technical solution, the electronically controlled flow control valve includes an inlet end, a first outlet end and a second outlet end. The inlet end is connected to a water pump, the first outlet end is connected to the main chamber, and the second outlet end is connected to the auxiliary chamber.

[0012] As a further description of the above technical solution, the water pump has an independent dual-chamber structure, and the water pump includes a first pump body that drives the coolant to flow into the main chamber and a second pump body that drives the coolant to flow into the auxiliary chamber.

[0013] As a further description of the above technical solution, the inner walls of both the main chamber and the secondary chamber are coated with a graphene thermally conductive coating, and the heat-absorbing substrate is a micro-convex mirror-milled copper base.

[0014] As a further description of the above technical solution, the outer side of the water cooling head is also provided with an intelligent digital display screen that displays the CPU temperature, coolant flow rate and water pump speed in real time.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] This utility model discloses a dual-chamber circulating CPU water cooling radiator, which has at least one of the following beneficial effects during use:

[0017] The system employs independent main and auxiliary chambers. The main chamber features a tortuous flow channel to extend the coolant's heat absorption time, while the auxiliary chamber utilizes a corrugated guide plate and dual radiators for stacked heat dissipation, significantly improving heat dissipation efficiency compared to traditional single-chamber structures. An electronically controlled flow control valve, combined with a temperature sensor, distributes flow between the two chambers in real time, enabling rapid heat dissipation under high loads and energy saving under low loads. A graphene thermally conductive coating and a micro-convex mirror copper base reduce thermal resistance, ensuring rapid heat dissipation. Independently driven dual-chamber water pumps prevent flow coupling, guaranteeing circulation stability. An intelligent digital display provides real-time feedback on operating parameters and supports remote setting of alarm thresholds, enhancing user maintenance convenience and system reliability, and meeting the heat dissipation requirements of high-performance CPUs. Attached Figure Description

[0018] Figure 1This is a schematic diagram of the overall structure of a dual-chamber circulating CPU water-cooling radiator according to the present invention;

[0019] Figure 2 This is a side view of a dual-chamber circulating CPU water-cooling heatsink according to the present invention;

[0020] Figure 3 This is a perspective view of the water cooling head structure of a dual-chamber circulating CPU water cooling radiator according to the present invention.

[0021] Numbering on the map:

[0022] 1. Water cooling head; 101. Intelligent digital display screen; 102. Secondary chamber; 103. Main chamber; 104. Heat absorption substrate; 105. First guide block; 106. Second guide block; 107. Guide plate; 2. Circulation pipeline; 201. Water pump; 202. Temperature sensor; 203. Electrically controlled flow control valve; 3. Radiator components; 301. First water radiator; 302. Second water radiator. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] like Figure 1-3 As shown, this utility model provides a dual-chamber circulating CPU water-cooled heatsink, including a water-cooling head 1, a circulation pipe 2, and a water pump 201. The water-cooling head 1 has an independent main chamber 103 and a secondary chamber 102. A radiator 3 connecting the main chamber 103 and the secondary chamber 102 is embedded on the outside of the water-cooling head 1. The secondary chamber 102 has a corrugated guide plate 107 inside. The main chamber 103 and the secondary chamber 102 are connected by the guide plate 107 to form a circulation path. The bottom of the main chamber 103 has a heat-absorbing substrate 104 that contacts the CPU. The circulation pipe 2 connects the main chamber 103, the secondary chamber 102, and the water pump 201 respectively, forming a dual-chamber circulating structure.

[0025] In this embodiment, during use, the heat generated by the CPU is conducted to the main chamber 103 through the heat-absorbing substrate 104. The coolant (such as deionized water) in the main chamber 103 absorbs the heat and its temperature rises. The heated coolant enters the secondary chamber 102 through the guide plate 107. The corrugated guide plate 107 in the secondary chamber 102 guides the coolant to be evenly distributed, and then flows into the radiator components 3 (first water radiator 301 and second water radiator 302).

[0026] The first water-cooled radiator 301 is connected to the secondary chamber 102. The coolant first dissipates heat through the first water-cooled radiator 301, and then flows into the second water-cooled radiator 302 through the internal connecting structure. After further heat dissipation, it returns to the inlet of the main chamber 103 through the outlet of the second water-cooled radiator 302, forming a closed loop of "heat absorption in the main chamber 103 → flow guidance in the secondary chamber 102 → heat dissipation by both radiators → recirculation in the main chamber 103". The water pump 201 provides circulation power for the coolant through the circulation pipe 2, ensuring flow balance between the two chambers.

[0027] The radiator 3 includes a first water-cooled radiator 301 and a second water-cooled radiator 302. The first water-cooled radiator 301 is connected to the secondary chamber 102, and the second water-cooled radiator 302 is connected to the main chamber 103. The first water-cooled radiator 301 and the second water-cooled radiator 302 are connected to each other. Both the first water-cooled radiator 301 and the second water-cooled radiator 302 are provided with heat dissipation fins. The liquid inlet of the first water-cooled radiator 301 is connected to the water outlet of the secondary chamber 102, and the liquid outlet of the second water-cooled radiator 302 is connected to the water inlet of the main chamber 103.

[0028] In this embodiment, the main chamber 103 focuses on direct CPU cooling, while the secondary chamber 102 expands the contact area between the coolant and the radiator through a corrugated guide plate 107, conforming to the principle of "increasing the contact path to improve heat exchange efficiency" in fluid mechanics. The first water-cooled radiator 301 and the second water-cooled radiator 302 are connected in series for heat dissipation, extending the residence time of the coolant in the radiator. Combined with the heat dissipation fins, this increases the heat dissipation area, conforming to the design principle of "increasing the contact area of ​​the heat dissipation medium to accelerate heat dissipation" in heat conduction theory.

[0029] Furthermore, the guide plate 107 is inclinedly disposed between the main chamber 103 and the secondary chamber 102, and the angle between the guide plate 107 and the bottom surface of the main chamber 103 is 30°-60°. The guide plate 107 is provided with a plurality of guide holes for the coolant in the main chamber 103 to enter the secondary chamber 102.

[0030] The guide plate 107 is set at an angle of 30°-60° between the main and auxiliary chambers 102. After the coolant absorbs heat in the main chamber 103, natural convection occurs due to the change in density. At the same time, the angle guides the coolant to flow along the guide plate 107 to the auxiliary chamber 102. The guide holes are evenly distributed on the guide plate 107 to control the flow rate of the coolant and avoid pressure fluctuations caused by sudden changes in flow.

[0031] The 30°-60° range is considered the "high-efficiency angle range for inclined plate guidance" in fluid mechanics. This range avoids insufficient guidance efficiency due to an excessively small angle, while also preventing increased flow resistance caused by an excessively large angle. By designing parameters such as orifice diameter and orifice spacing (e.g., orifice diameter 2-5mm, spacing 5-10mm), uniform distribution of coolant is achieved, reducing the pressure difference between the main and auxiliary chambers 102 and ensuring circulation stability.

[0032] Furthermore, a first guide block 105 and a second guide block 106 are sequentially arranged inside the main chamber 103 along the coolant flow direction. The first guide block 105 and the second guide block 106 are arranged alternately to form a tortuous flow channel. The first guide block 105 and the second guide block 106 are arranged alternately in the main chamber 103 to form a zigzag tortuous flow channel. The coolant flows in from above the heat-absorbing substrate 104 and is forced to flow around the guide blocks, increasing the flow path length by 30%-50% and prolonging the contact time with the heat-absorbing substrate 104, thereby absorbing more CPU heat. The tortuous flow channel is a "turbulence structure" that increases flow resistance. The guide blocks are arranged with equal or variable spacing to avoid flow dead zones.

[0033] Furthermore, the circulation pipeline 2 is equipped with an electrically controlled flow control valve 203 and a temperature sensor 202 connected to the water pump 201. The temperature sensor 202 is respectively located at the inlet of the main chamber 103 and the outlet of the secondary chamber 102. The electrically controlled flow control valve 203 is electrically connected to the temperature sensor 202.

[0034] Temperature sensor 202 collects temperature data in real time from the inlet (low-temperature coolant) of main chamber 103 and the outlet (high-temperature coolant) of auxiliary chamber 102, generating a temperature difference signal (ΔT = outlet temperature of auxiliary chamber 102 - inlet temperature of main chamber 103). A PID control algorithm is used to achieve stepless flow regulation with a response time <100ms and a control accuracy of ±5%.

[0035] Furthermore, the electrically controlled flow control valve 203 includes an inlet end, a first outlet end, and a second outlet end. The inlet end is connected to the water pump 201, the first outlet end is connected to the main chamber 103, and the second outlet end is connected to the auxiliary chamber 102.

[0036] The controller dynamically adjusts the opening of the electronically controlled flow control valve 203 based on the ΔT signal: when the CPU is under high load (ΔT > preset threshold, such as 50℃), the flow rate of the main chamber 103 is increased (the opening of the first outlet is increased) to quickly remove heat; when the CPU is under low load (ΔT < preset threshold, such as 30℃), the flow rate of the secondary chamber 102 is reduced (the opening of the second outlet is reduced) to reduce energy consumption.

[0037] The inlet end is connected to the water pump 201, and the first outlet end and the second outlet end correspond to the main chamber 103 and the auxiliary chamber 102, respectively. The flow rate of each branch is adjusted by rotating the valve core (0°-90°) to avoid the flow coupling problem of traditional two-way valves.

[0038] Furthermore, the water pump 201 has an independent dual-chamber structure. The water pump 201 includes a first pump body that drives the coolant into the main chamber 103 and a second pump body that drives the coolant into the secondary chamber 102. The first and second pump bodies are driven independently, controlling the coolant flow rates in the main chamber 103 and the secondary chamber 102 respectively. This avoids mutual interference of flow rates between the two chambers when driven by a single pump (e.g., increased flow resistance in the main chamber 103 leading to a sudden drop in flow rate in the secondary chamber 102). Through a flow allocation algorithm (e.g., dynamically allocating flow rates according to CPU temperature), an optimal balance between energy consumption and heat dissipation efficiency is achieved.

[0039] Furthermore, the inner walls of both the main chamber 103 and the secondary chamber 102 are coated with a graphene thermally conductive coating, and the heat-absorbing substrate 104 is a micro-convex mirror-milled copper base. The 0.1-0.5mm thick graphene thermally conductive coating uniformly covers the inner walls of the main and secondary chambers 102. Utilizing the ultra-high thermal conductivity of graphene, it accelerates heat exchange between the coolant and the chamber walls, reducing thermal resistance. The micro-convex curved surface with a surface roughness Ra≤0.1μm is machined using a milling process, which improves heat conduction efficiency when in contact with the CPU surface (typically a flat surface).

[0040] Furthermore, the water cooling block 1 is equipped with an intelligent digital display screen 101 on its outer side, which displays the CPU temperature, coolant flow rate, and water pump 201 speed in real time. The display screen receives data from the temperature sensor 202, flow sensor, and water pump 201 speed sensor via Bluetooth / Wi-Fi, and displays the CPU core temperature, coolant flow rate, and water pump 201 speed in real time. Users can set alarm thresholds (e.g., flashing alarm when the temperature > 85℃) through the accompanying software.

[0041] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A dual-chamber circulating CPU water-cooling radiator, comprising a water block, circulating pipes, and a water pump, characterized in that, The water cooling head has an independent main chamber and a secondary chamber. A radiator is embedded on the outside of the water cooling head to connect the main chamber and the secondary chamber. The secondary chamber has a corrugated baffle plate inside. The main chamber and the secondary chamber are connected by the baffle plate to form a circulation path. The bottom of the main chamber has a heat-absorbing substrate that contacts the CPU. The circulation pipes are connected to the main chamber, the secondary chamber and the water pump respectively, forming a dual-chamber circulation guide structure. The radiator assembly includes a first water-cooled radiator and a second water-cooled radiator. The first water-cooled radiator is connected to the secondary chamber, and the second water-cooled radiator is connected to the main chamber. The first water-cooled radiator and the second water-cooled radiator are connected to each other. Both the first water-cooled radiator and the second water-cooled radiator are provided with heat dissipation fins. The liquid inlet of the first water-cooled radiator is connected to the water outlet of the secondary chamber, and the liquid outlet of the second water-cooled radiator is connected to the water inlet of the main chamber.

2. The dual-chamber circulating CPU water-cooling radiator according to claim 1, characterized in that: The guide plate is inclined between the main chamber and the auxiliary chamber, and the angle between the guide plate and the bottom surface of the main chamber is 30°-60°. The guide plate is provided with a number of guide holes to allow the coolant in the main chamber to enter the auxiliary chamber.

3. The dual-chamber circulating CPU water-cooling radiator according to claim 1, characterized in that: The main chamber is provided with a first guide block and a second guide block in sequence along the coolant flow direction. The first guide block and the second guide block are arranged alternately to form a tortuous flow channel.

4. The dual-chamber circulating CPU water-cooling radiator according to claim 1, characterized in that: The circulation pipeline is equipped with an electrically controlled flow control valve and a temperature sensor connected to a water pump. The temperature sensor is respectively installed at the inlet of the main chamber and the outlet of the auxiliary chamber. The electrically controlled flow control valve is electrically connected to the temperature sensor.

5. A dual-chamber circulating CPU water-cooling radiator according to claim 4, characterized in that: The electrically controlled flow control valve includes an inlet end, a first outlet end, and a second outlet end. The inlet end is connected to a water pump, the first outlet end is connected to the main chamber, and the second outlet end is connected to the auxiliary chamber.

6. A dual-chamber circulating CPU water-cooling radiator according to claim 1, characterized in that: The water pump has an independent dual-chamber structure, comprising a first pump body that drives the coolant into the main chamber and a second pump body that drives the coolant into the auxiliary chamber.

7. A dual-chamber circulating CPU water-cooling radiator according to claim 1, characterized in that: The inner walls of both the main chamber and the secondary chamber are coated with a graphene thermally conductive coating, and the heat-absorbing substrate is a micro-convex mirror-milled copper base.

8. A dual-chamber circulating CPU water-cooling radiator according to claim 1, characterized in that: The water cooling head is also equipped with an intelligent digital display screen on the outside that displays the CPU temperature, coolant flow rate and water pump speed in real time.

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