Superconducting magnet device and magnetic resonance imaging device

Abstract

Embodiments disclosed in the specification and drawings relate to a superconducting magnet device and a magnetic resonance imaging device. One of the issues to be solved by the embodiment is to efficiently cool a plurality of structures to be cooled while reducing the amount of refrigerant. A superconducting magnet device according to an embodiment includes a superconducting coil, a structure, a refrigerant tank, a heat exchanger, a refrigerator, a solid heat conductor, and a vacuum container. The superconducting coil is composed of a superconducting wire forming a magnetic field. The structure is composed of a superconductor and is electrically connected to the superconducting coil. The refrigerant tank stores a refrigerant. The heat exchanger is exposed to the inside of the refrigerant tank. And the refrigerating machine is used for cooling the refrigerant. The solid heat conductor connects the refrigerant tank with the superconducting coil and the structure directly or indirectly in a heat-conducting manner. The superconducting coil or the structure is configured using at least two structures having different operating temperatures or superconducting characteristics as superconductors.

Description

[0001] Reference to related applications This application enjoys the benefit of priority to Japanese Patent Application No. 2024-194321, filed on November 6, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The embodiments disclosed in this specification and accompanying drawings relate to superconducting magnet devices and magnetic resonance imaging (MRI) devices. Background Technology

[0003] Previously, magnetic resonance imaging (MRI) devices were known to have superconducting magnets that act as static magnetic field magnets that generate a static magnetic field in the imaging space where the subject is placed.

[0004] Generally, the superconducting magnet device in an MRI machine includes a cooling container filled with a refrigerant such as liquid helium, a refrigerator that cools the refrigerant in the cooling container, and a superconducting coil immersed in the refrigerant in the cooling container. Here, the superconducting coil is made of superconducting wire and generates a magnetic field by passing an electric current through it in a state where it has been cooled by the refrigerant and is in a superconducting state.

[0005] In recent years, such superconducting magnet devices have been required to efficiently cool multiple structures of the object being cooled while reducing the amount of refrigerant. Summary of the Invention

[0006] One of the problems to be solved by the embodiments disclosed in this specification and accompanying drawings is to efficiently cool multiple structures of the object being cooled while reducing the amount of refrigerant. However, the problems to be solved by the embodiments disclosed in this specification and accompanying drawings are not limited to the above-mentioned problems. Problems corresponding to the effects of the various structures shown in the embodiments described below can also be identified as other problems.

[0007] The superconducting magnet device of this embodiment includes a superconducting coil, a structure, a refrigerant tank, a heat exchanger, a refrigerator, a solid heat conductor, and a vacuum container. The superconducting coil is constructed of superconducting wire that generates a magnetic field. The structure is constructed of a superconductor and is electrically connected to the superconducting coil. The refrigerant tank stores refrigerant. The heat exchanger is exposed to the interior of the refrigerant tank. The refrigerator cools the refrigerant. The solid heat conductor connects the refrigerant tank, the superconducting coil, and the structure directly or indirectly in a thermally conductive manner. The vacuum container encloses the superconducting coil, the structure, the refrigerant tank, the heat exchanger, the refrigerator, and the solid heat conductor. The superconducting coil or the structure is constructed using at least two structures with different superconducting operating temperatures or superconducting properties.

[0008] Effect The superconducting magnet device and magnetic resonance imaging device according to the embodiments can efficiently cool multiple structures of the object being cooled while reducing the amount of refrigerant. Attached Figure Description

[0009] Figure 1 This is a diagram illustrating an example of the configuration of the MRI device according to the first embodiment.

[0010] Figure 2 This is a diagram illustrating an example of a superconducting magnet device according to a comparative example of the first embodiment.

[0011] Figure 3 This is a diagram illustrating an example of the superconducting magnet device according to the first embodiment.

[0012] Figure 4 This is a diagram showing a modified example of the superconducting magnet device according to the first embodiment.

[0013] Figure 5 This is a diagram illustrating an example of the superconducting magnet device according to the second embodiment.

[0014] Figure 6 This is a diagram illustrating an example of the superconducting magnet device according to the third embodiment.

[0015] Figure 7 This is a diagram illustrating an example of the superconducting magnet device according to the fourth embodiment.

[0016] Figure 8 This is a diagram illustrating an example of the superconducting magnet device according to the fifth embodiment.

[0017] Figure 9 This is a diagram illustrating an example of the superconducting magnet device according to the sixth embodiment.

[0018] Figure 10This is a diagram showing an example of the superconducting magnet device according to the seventh embodiment.

[0019] Figure 11 This is a diagram showing an example of the superconducting magnet device according to the eighth embodiment. Detailed Implementation

[0020] Hereinafter, embodiments of the superconducting magnet device and MRI device of this application will be described in detail with reference to the accompanying drawings.

[0021] (First Implementation) Figure 1 This is a diagram illustrating an example of the configuration of the MRI device according to the first embodiment.

[0022] For example, such as Figure 1 As shown, the MRI device 100 includes a static magnetic field magnet 1, a tilted magnetic field coil 2, a tilted magnetic field power supply 3, a whole-body high-frequency (Radio Frequency: RF) coil 4, a local RF coil 5, a transmitting circuit 6, a receiving circuit 7, an RF shield 8, a scanning gantry 9, an examination table 10, an input interface 11, a display 12, a storage circuit 13, and processing circuits 14 to 17.

[0023] The static magnetic field magnet 1 generates a static magnetic field in the imaging space where the subject S is disposed. Specifically, the static magnetic field magnet 1 is formed as a hollow, generally cylindrical shape (including an elliptical shape of the cross section orthogonal to the central axis), and generates a static magnetic field in the imaging space formed on its inner periphery.

[0024] The tilted magnetic field coil 2 is disposed inside the static magnetic field magnet 1, generating a tilted magnetic field in the imaging space where the subject S is disposed. Specifically, the tilted magnetic field coil 2 is formed as a hollow, generally cylindrical shape (the shape of the cross section orthogonal to the central axis is elliptical), and has an X coil, a Y coil, and a Z coil corresponding to the mutually orthogonal X-axis, Y-axis, and Z-axis, respectively. Based on the current supplied from the tilted magnetic field power supply 3, the X coil, Y coil, and Z coil generate a tilted magnetic field in the imaging space that varies linearly along each axis. Here, the Z-axis is set along the magnetic flux of the static magnetic field generated by the static magnetic field magnet 1. In addition, the X-axis is set along the horizontal direction orthogonal to the Z-axis, and the Y-axis is set along the vertical direction orthogonal to the Z-axis. Here, the X-axis, Y-axis, and Z-axis constitute the inherent device coordinate system of the MRI apparatus 100.

[0025] The tilting magnetic field power supply 3 generates a tilting magnetic field in the imaging space by supplying current to the tilting magnetic field coil 2. Specifically, the tilting magnetic field power supply 3 generates tilting magnetic fields in the imaging space by individually supplying current to the X, Y, and Z coils of the tilting magnetic field coil 2, thereby generating tilting magnetic fields that vary linearly along mutually orthogonal readout, phase encoding, and slice directions, respectively. Here, the axes along the readout direction, the phase encoding direction, and the slice direction constitute a logical coordinate system for defining the slice area or volume area that is the object of imaging.

[0026] Tilted magnetic fields along the readout direction, phase encoding direction, and slice direction are superimposed on the static magnetic field generated by the static magnetic field magnet 1, thereby imparting spatial position information to the nuclear magnetic resonance (NMR) signal generated from the subject S. Specifically, the tilted magnetic field along the readout direction imparts positional information to the NMR signal by causing frequency changes in the NMR signal based on its position. Similarly, the tilted magnetic field along the phase encoding direction imparts positional information to the NMR signal by causing phase changes in the NMR signal based on its position. Furthermore, in the case of capturing two-dimensional MR images (slice images), the tilted magnetic field along the slice direction determines the position, thickness, and number of slices by causing frequency changes in the NMR signal based on its position. Finally, in the case of capturing three-dimensional MR images (volume images), the tilted magnetic field along the slice direction imparts positional information to the NMR signal by causing phase changes in the NMR signal based on its position.

[0027] A whole-body RF coil 4 is disposed on the inner periphery of the tilted magnetic field coil 2. It applies an RF pulse (excitation pulse, etc.) to a subject S disposed in the imaging space and receives the NMR signal (echo signal, etc.) generated from the subject S due to the influence of the RF pulse. Specifically, the whole-body RF coil 4 is formed as a hollow, generally cylindrical shape (including an elliptical shape with a cross-section orthogonal to the central axis). It applies an RF pulse to the subject S disposed in the imaging space located on its inner periphery based on the RF pulse signal supplied from the transmitting circuit 6. Furthermore, the whole-body RF coil 4 receives the NMR signal generated from the subject S due to the influence of the RF pulse and outputs the received NMR signal to the receiving circuit 7. For example, the whole-body RF coil 4 is a birdcage-type coil or a TEM (Transverse Electromagnetic) coil.

[0028] A local RF coil 5 is positioned near the subject S during imaging to receive NMR signals generated from the subject S. Specifically, the local RF coil 5 is prepared for each part of the subject S and is positioned near the area being imaged during imaging of the subject S. It receives NMR signals generated from the subject S due to the influence of RF pulses applied by the whole-body RF coil 4 and outputs the received NMR signals to the receiving circuit 7. For example, the local RF coil 5 is a surface coil, or a phased array coil composed of multiple surface coils combined as coil elements. Furthermore, the local RF coil 5 may also have the function of transmitting RF pulses to the subject.

[0029] The transmitting circuit 6 outputs an RF pulse signal corresponding to the inherent resonant frequency (Larmor frequency) of the atomic nucleus of the object placed in a static magnetic field to the whole-body RF coil 4 or the local RF coil 5. Specifically, the transmitting circuit 6 includes a pulse generator, an RF generator, a modulator, and an amplifier. The pulse generator generates the waveform of the RF pulse signal. The RF generator produces an RF signal at the resonant frequency. The modulator modulates the amplitude of the RF signal generated by the RF generator with the waveform generated by the pulse generator, thereby generating an RF pulse signal. The amplifier amplifies the RF pulse signal generated by the modulator and outputs it to the whole-body RF coil 4 or the local RF coil 5.

[0030] The receiving circuit 7 generates NMR data based on the NMR signal output from the whole-body RF coil 4 or the local RF coil 5, and outputs the generated NMR data to the processing circuit 15. Specifically, the receiving circuit 7 includes a selector, a preamplifier, a phase detector, and an A / D (Analog / Digital) converter. The selector selectively inputs the NMR signal output from the whole-body RF coil 4 or the local RF coil 5. The preamplifier amplifies the NMR signal output from the selector. The phase detector detects the phase of the NMR signal output from the preamplifier. The A / D converter generates NMR data by converting the analog signal output from the phase detector into a digital signal, and outputs the generated NMR data to the processing circuit 15. Furthermore, the processes described here as being performed by the receiving circuit 7 do not necessarily require all processing to be performed by the receiving circuit 7; some processing may be performed by the whole-body RF coil 4 or the local RF coil 5 (e.g., processing performed by the A / D converter, etc.).

[0031] An RF shield 8 is disposed between the tilted magnetic field coil 2 and the whole-body RF coil 4 to shield the tilted magnetic field coil 2 from the RF pulses generated by the whole-body RF coil 4. Specifically, the RF shield 8 is formed as a hollow, generally cylindrical shape (including an elliptical shape of the cross section orthogonal to the central axis of the cylinder), and is disposed in the space on the inner periphery of the tilted magnetic field coil 2 in such a way as to cover the outer peripheral surface of the whole-body RF coil 4.

[0032] The scanning gantry 9 has a hollow cavity 9a that is generally cylindrical (including an elliptical cross-section orthogonal to the central axis), housing a static magnetic field magnet 1, a tilted magnetic field coil 2, a whole-body RF coil 4, and an RF shield 8. Specifically, the scanning gantry 9 houses the whole-body RF coil 4 on the outer periphery of the cavity 9a, the RF shield 8 on the outer periphery of the whole-body RF coil 4, the tilted magnetic field coil 2 on the outer periphery of the RF shield 8, and the static magnetic field magnet 1 on the outer periphery of the tilted magnetic field coil 2. Here, the space within the cavity 9a of the scanning gantry 9 is the imaging space for arranging the subject S during imaging.

[0033] The examination table 10 has a top plate 10a for placing the subject S. When imaging the subject S, the top plate 10a on which the subject S is placed is moved into the imaging space. For example, the examination table 10 is arranged such that the length direction of the top plate 10a is parallel to the central axis of the static magnetic field magnet 1.

[0034] Input interface 11 receives various instructions and information input operations from the operator. Specifically, input interface 11 is connected to processing circuit 17, converting the input operations received from the operator into electrical signals and outputting them to processing circuit 17. For example, input interface 11 may be implemented using a trackball, switch button, mouse, keyboard, touchpad for input operations via touch operation surface, touchscreen integrating display screen and touchpad, contactless input circuit using optical sensor, and voice input circuit. Furthermore, in this specification, input interface 11 is not limited to having physical operating devices such as a mouse and keyboard. For example, an electrical signal processing circuit that receives electrical signals corresponding to input operations from external input devices separate from the device and outputs such electrical signals to control circuit is also included in input interface 11.

[0035] The display 12 displays various information. Specifically, the display 12 is connected to the processing circuit 17, and converts the data of various information sent from the processing circuit 17 into electrical signals for display and outputs them. For example, the display 12 can be implemented as a liquid crystal monitor, a CRT (Cathode Ray Tube) monitor, a touch panel, etc.

[0036] Storage circuit 13 stores various types of data. Specifically, storage circuit 13 is connected to processing circuits 14-17 and stores various types of data input and output by each processing circuit. For example, storage circuit 13 is implemented using semiconductor memory elements such as RAM (Random Access Memory) and flash memory, hard disk, or optical disk.

[0037] The processing circuit 14 has an examination bed control function 14a. The examination bed control function 14a controls the operation of the examination bed 10 by outputting control electrical signals to the examination bed 10. For example, the examination bed control function 14a receives instructions from the operator via the input interface 11 to move the top plate 10a in the length direction, the up and down direction, or the left and right direction, and actuates the moving mechanism of the top plate 10a of the examination bed 10 to move the top plate 10a according to the received instructions.

[0038] The processing circuit 15 has a collection function 15a. The collection function 15a collects NMR data from the subject S by executing various pulse sequences. Specifically, the collection function 15a executes various pulse sequences by driving the tilted magnetic field power supply 3, the transmitting circuit 6, and the receiving circuit 7 according to the sequence execution data output from the processing circuit 17. Here, the sequence execution data is data representing the pulse sequence, specifying the timing and intensity of the current supplied by the tilted magnetic field power supply 3 to the tilted magnetic field coil 2, the timing and intensity of the RF pulse signal supplied by the transmitting circuit 6 to the whole-body RF coil 4, and the timing of the NMR signal sampling by the receiving circuit 7. Furthermore, the collection function 15a receives the NMR data output from the receiving circuit 7 as a result of executing the pulse sequence and stores it in the storage circuit 13. At this time, the NMR data stored in the storage circuit 13 is given position information along the readout direction, phase encoding direction and slice direction by the aforementioned tilting magnetic fields, and is thus stored as k-space data representing two-dimensional or three-dimensional k-space.

[0039] The processing circuit 16 has a generation function 16a. The generation function 16a generates an MR image based on the NMR data collected by the collection function 15a of the processing circuit 15. Specifically, under the control of the processing circuit 17, the generation function 16a reads the NMR data collected by the collection function 15a of the processing circuit 15 from the storage circuit 13, and performs reconstruction processing such as Fourier transform on the read NMR data, thereby generating a two-dimensional or three-dimensional MR image. Furthermore, the generation function 16a causes the storage circuit 13 to store the generated MR image.

[0040] The processing circuit 17 has a camera control function 17a. The camera control function 17a controls the MRI apparatus 100 as a whole by controlling the various components of the MRI apparatus 100. Specifically, the camera control function 17a displays a GUI (Graphical User Interface) on the display 12 for receiving various instructions and information input from the operator, and controls the various components of the MRI apparatus 100 based on the input received via the input interface 11. For example, the camera control function 17a receives input from the operator regarding imaging conditions and sets a pulse sequence for collecting NMR data from the subject S based on the input imaging conditions. Furthermore, the camera control function 17a generates sequence execution data representing the set pulse sequence and outputs it to the processing circuit 15, thereby causing the collection function 15a of the processing circuit 15 to execute various pulse sequences. Additionally, for example, the camera control function 17a controls the generation function 16a of the processing circuit 16, thereby reconstructing an MR image based on the k-space data collected by the processing circuit 15. Additionally, for example, the camera control function 17a reads the MR image stored in the storage circuit 13 according to a request from the operator, and displays the read MR image on the display 12.

[0041] Here, the aforementioned processing circuits 14 to 17 are implemented, for example, by a processor. In this case, the processing functions of each processing circuit are stored in the storage circuit 13, for example, in the form of a program executable by a computer. Furthermore, each processing circuit implements the processing function corresponding to its respective program by reading it from the storage circuit 13 and executing it. In other words, each processing circuit, when its program has been read, has... Figure 1 The processing functions shown.

[0042] Furthermore, while processing circuits 14 to 17 are each implemented by a single processor, the implementation is not limited to this. For example, each processing circuit may be configured by combining multiple independent processors, with each processor executing a program to implement its respective processing function. Additionally, the processing functions of each processing circuit may be appropriately distributed or integrated into one or more processing circuits. Furthermore, in the above description, a single storage circuit 13 stores the program corresponding to each processing function, but the implementation is not limited to this. For example, it may be configured such that multiple storage circuits are distributed among each processing circuit, with each processing circuit reading the corresponding program from a separate storage circuit.

[0043] The above describes a configuration example of the MRI apparatus 100 according to this embodiment. In this configuration, the MRI apparatus 100 of this embodiment includes a superconducting magnet device as a static magnetic field magnet 1 that generates a static magnetic field in the imaging space where the subject S is disposed.

[0044] Figure 2 This is a diagram illustrating an example of a superconducting magnet device according to a comparative example of the first embodiment.

[0045] For example, such as Figure 2 As shown, a typical MRI device's superconducting magnet assembly includes a cooling container filled with a refrigerant such as liquid helium, a refrigerator that cools the refrigerant within the cooling container, and a superconducting coil immersed in the refrigerant within the cooling container. Here, the superconducting coil is made of superconducting wire and generates a magnetic field by passing an electric current through it while it is in a superconducting state due to cooling by the refrigerant.

[0046] In recent years, such superconducting magnet devices have been required to efficiently cool multiple structures of the object being cooled while reducing the amount of refrigerant.

[0047] Therefore, in the MRI apparatus 100 of this embodiment, the superconducting magnet device provided as a static magnetic field magnet 1 is configured to efficiently cool multiple structures of the object to be cooled while reducing the amount of refrigerant. Hereinafter, the superconducting magnet device provided as a static magnetic field magnet 1 in the MRI apparatus 100 of this embodiment will be described in detail.

[0048] Figure 3 This is a diagram showing an example of the superconducting magnet device 200 according to the first embodiment.

[0049] For example, such as Figure 3As shown, the superconducting magnet device 200 of this embodiment includes a superconducting coil 201, structures 202 and 203, a refrigerant tank 204, a heat exchanger 205, a refrigerator 206, a radiation shield 207, a thermal anchor 208, a precooling pipe 209, a refrigerant tank 210, piping 211, solid heat conductors 212-215, a heat capacity retainer 216, a vacuum container 217, and a cover 218.

[0050] The superconducting coil 201 is made of superconducting wire that generates a magnetic field. Specifically, the superconducting coil 201 is made of wire made of low-temperature superconductor (LTS) material.

[0051] Structures 202 and 203 are both made of superconductors and are electrically connected to the superconducting coil 201. For example, structure 202 is a persistent current switch (PCS). A PCS is a switch that is made by non-inductively winding superconducting wire and can cut off the circuit of the superconducting coil when it switches to a normal conducting state. Alternatively, structure 203 is, for example, superconducting solder. Superconducting solder is solder used to bond superconducting wires and becomes superconducting when cooled.

[0052] Here, the superconducting coil 201, structure 202, and structure 203 each have different operating temperatures or superconducting characteristics. The operating temperature is a temperature lower than the critical temperature, set to allow operation in a superconducting state. Furthermore, the superconducting characteristics are the critical temperature (Tc), critical magnetic field (Bc), or critical current (Ic). The critical temperature (Tc) is the temperature at which the superconducting state transitions to a normal conducting state; the critical magnetic field (Bc) is the magnetic field at which the superconducting state transitions to a normal conducting state; and the critical current (Ic) is the current at which the superconducting state transitions to a normal conducting state.

[0053] Furthermore, the superconducting coil 201, structure 202, and structure 203 are respectively constructed using low-temperature superconductor (LTS) materials, high-temperature superconductor (HTS) materials, protective materials, base materials, and substrates, which have different thermal conductivity or specific heat characteristics. LTS materials are, for example, metals such as NbTi and Nb3Sn. HTS materials are, for example, metals such as REBCO, MgB2, and Bi. The protective materials, base materials, and substrates are, for example, metals such as Cu, CuNi, Al, and Ag.

[0054] In addition, in this embodiment, among the superconducting coil 201, structure 202 and structure 203, the heat capacity of structure 202 is less than that of superconducting coil 201, and the heat capacity of structure 203 is less than that of structure 202.

[0055] Refrigerant tank 204 stores refrigerants such as liquid helium.

[0056] The heat exchanger 205 is exposed to the interior of the refrigerant tank 204, allowing the vaporized refrigerant to be reliquefied and returned to the refrigerant tank 204.

[0057] The refrigeration unit 206 cools the refrigerant in the refrigerant tank 204. Specifically, the refrigeration unit 206 has a high-temperature end 206a with a first temperature (e.g., 50K) and a low-temperature end 206b with a second temperature (e.g., 4K) lower than the first temperature. The refrigerant in the refrigerant tank 204 is cooled to the second temperature at the low-temperature end 206b.

[0058] A radiation shield 207 is disposed between the vacuum container 217 and the multiple structures containing the object to be cooled within the vacuum container 217, reducing heat intrusion into each structure. Specifically, the radiation shield 207 is made of metals such as aluminum and copper, and is thermally connected to the high-temperature end 206a of the refrigerator 206 to maintain a first temperature, thereby reducing heat intrusion from the vacuum container 217 at atmospheric temperature into each structure. Furthermore, in Figure 3 Only a portion of the radiation shield 207 is shown in the image.

[0059] The thermal anchor 208 reduces the entry of heat through the precooling pipe 209 by connecting the radiation shield 207 to the precooling pipe 209 in a thermally conductive manner.

[0060] The precooling tube 209 is configured to contact the outer periphery of the superconducting coil 201 in a thermally conductive manner, and precools the superconducting coil 201 by circulating cooling gas through an inlet and an outlet exposed to the outside of the vacuum container 217. Specifically, the precooling tube 209 is made of a metal with low thermal conductivity (e.g., phosphorus deoxidized copper) from the inlet and outlet to the point where it connects to the heat anchor 208, and of a metal with high thermal conductivity from the point where it connects to the heat anchor 208 to the point where it contacts the outer periphery of the superconducting coil 201, as well as the outer periphery of the superconducting coil 201.

[0061] The refrigerant tank 210 stores the refrigerant supplied from the refrigerant tank 204, and seals the structure 202 in a state of being immersed in the refrigerant to cool the structure 202 to a second temperature.

[0062] Pipe 211 is installed between refrigerant tank 204 and refrigerant tank 210 to deliver refrigerant from refrigerant tank 204 to structure 202 inside refrigerant tank 210.

[0063] Here, piping 211 is configured with at least two parameters, including size, thermal conductivity, and heat load, based on the operating temperature or superconducting properties of structure 202.

[0064] Solid heat conductors 212-215 are made of metals with high thermal conductivity (e.g., pure aluminum, copper, etc.) and connect the refrigerant tank 204 and the superconducting coil 201, as well as the refrigerant tank 204 and the structure 203, directly or indirectly in a thermally conductive manner.

[0065] For example, solid heat conductors 212-215 are made of a metal with high thermal conductivity formed in the form of a plate, corner, tape, or sheet, or a metal formed in the form of a cylindrical pipe with its thermal conductivity set according to the structure in contact with it in a thermally conductive manner. Among these, metals formed in the form of a tape are more suitable than other materials in terms of availability and ease of manufacture.

[0066] Specifically, one end of the solid heat conductor 212 is in thermal contact with the refrigerant tank 204, and the other end of the solid heat conductor 212 is in thermal contact with a portion of the outer periphery of the superconducting coil 201. The solid heat conductor 212 cools the superconducting coil 201 to a second temperature by transferring the temperature of the refrigerant in the refrigerant tank 204 to the superconducting coil 201.

[0067] In addition, one end of each of the solid heat conductors 213 and 214 is in thermal contact with the refrigerant tank 204, and the other end of each of the solid heat conductors 213 and 214 is in thermal contact with a portion of the precooling tube 209 from the portion connected to the heat anchor 208 to the portion in contact with the outer periphery of the superconducting coil 201. The solid heat conductors 213 and 214 respectively cool the superconducting coil 201 to a second temperature by transferring the temperature of the refrigerant in the refrigerant tank 204 to the superconducting coil 201 via the precooling tube 209.

[0068] In addition, one end of the solid heat conductor 215 is in thermal contact with a part of the piping 211 in a thermally conductive manner, and the other end of the solid heat conductor 215 is in contact with the structure 203. The solid heat conductor 215 cools the structure 203 to a second temperature by transferring the temperature of the refrigerant in the refrigerant tank 204 to the structure 203 via the piping 211.

[0069] Here, solid heat conductors 212 to 214 are each configured with at least two parameters, namely size, thermal conductivity, and heat load, based on the operating temperature or superconducting characteristics of the superconducting coil 201. Additionally, solid heat conductor 215 is configured with at least two parameters, namely size, thermal conductivity, and heat load, based on the operating temperature or superconducting characteristics of the structure 203.

[0070] The heat capacity retainer 216 is made of a metal (e.g., SUS) with a specified heat capacity and is mounted on the solid heat conductor 212 to retain the heat capacity of the solid heat conductor 212.

[0071] Here, the heat capacity retainer 216 sets at least two parameters of size, thermal conductivity and heat load according to the operating temperature or superconducting properties of the superconducting coil 201 cooled by the solid heat conductor 212.

[0072] Vacuum container 217 encloses the superconducting coil 201, structure 202, structure 203, refrigerant tank 204, heat exchanger 205, radiation shield 207, heat anchor 208, precooling pipe 209, refrigerant tank 210, piping 211, solid heat conductors 212-215, and heat capacity retainer 216.

[0073] The cover 218 is installed on the vacuum container 217 to cover the inlet and outlet of the precooling tube 209, thereby keeping the precooling tube 209 in a vacuum state by making the interior a vacuum state.

[0074] Based on the above structure, compared to immersion-type superconducting magnet devices that immerse the superconducting coil in a refrigerant within a cooling container, the superconducting coil can be cooled using a small refrigerant tank, thus reducing the amount of refrigerant required. Furthermore, by utilizing solid heat conductors and piping to independently cool multiple structures, it is possible to efficiently cool structures with different operating temperatures or superconducting properties.

[0075] Therefore, according to the first embodiment, multiple structures of the object to be cooled can be cooled efficiently while reducing the amount of refrigerant.

[0076] Furthermore, based on the above structure, compared with the immersion type superconducting magnet device, the amount of refrigerant can be reduced, thereby enabling the superconducting magnet device to be lightweight.

[0077] Furthermore, according to the above structure, by installing a heat capacity retainer 216 on the solid heat conductor 212, even if the refrigerator 206 stops due to a power outage, the temperature rise of the solid heat conductor 212 caused by heat entering from the atmosphere through the refrigerator 206 can be delayed. Therefore, for example, even if a quench occurs due to the refrigerator 206 stopping (a phenomenon where a portion of the superconducting coil returns from a superconducting state to a normal conducting state), the temperature rise of the superconducting coil 201 during the period before the refrigerator 206 resumes operation can be suppressed, and the time until the superconducting coil 201 has finished cooling after resumption can be shortened. As a result, for example, an uninterruptible power supply (UPS) is not required to prevent power outages, and the magnetic field can be maintained for a long time.

[0078] In addition, Figure 3 In the example shown, the superconducting magnet device 200 has a precooling tube 209, but the structure of the superconducting magnet device 200 in the first embodiment is not limited to this, and it may not have the precooling tube 209 and the cover 218.

[0079] Figure 4 This is a diagram showing a modified example of the superconducting magnet device 200 according to the first embodiment.

[0080] For example, such as Figure 4 As shown, the superconducting magnet device 200 can also be derived from... Figure 3 The precooling tube 209, cover 218, solid heat conductor 213 and heat anchor 208 are removed from the structure shown.

[0081] In this structure, one end of the solid heat conductor 214 is in thermally conductive contact with the refrigerant tank 204, and the other end of the solid heat conductor 214 is in thermally conductive contact with a portion of the outer periphery of the superconducting coil 201. The solid heat conductor 214 cools the superconducting coil 201 to a second temperature by directly transferring the temperature of the refrigerant in the refrigerant tank 204 to the superconducting coil 201.

[0082] The first embodiment has been described above, but the structure of the superconducting magnet device and MRI device described above can also be implemented by appropriately modifying part of the structure. Therefore, variations of the superconducting magnet device and MRI device of the first embodiment will be described below as other embodiments. Furthermore, in the following embodiments, the description will focus on the differences from the previously described embodiments, and the same reference numerals will be used to label the same components that perform the same function, and detailed descriptions will be omitted.

[0083] (Second Implementation) Figure 5This is a diagram illustrating an example of the superconducting magnet device 300 according to the second embodiment.

[0084] For example, such as Figure 5 As shown, the superconducting magnet device 300 of this embodiment differs from the superconducting magnet device 200 of the first embodiment in that it has a solid heat conductor 301 instead of a refrigerant tank 210 and piping 211.

[0085] Similar to solid heat conductors 212-215, solid heat conductor 301 is made of a metal with high thermal conductivity (e.g., pure aluminum, copper, etc.) and connects the refrigerant tank 204 to the structures 202 and 203 in a thermally conductive manner.

[0086] Specifically, one end of the solid heat conductor 301 is in thermally conductive contact with the refrigerant tank 204, and the other end of the solid heat conductor 301 is in thermally conductive contact with the structure 202 and the structure 203 respectively. The solid heat conductor 301 cools the structure 202 and the structure 203 to a second temperature by transferring the temperature of the refrigerant in the refrigerant tank 204 to the structure 202 and the structure 203.

[0087] Here, the solid heat conductor 301 is configured with at least two parameters, namely size, thermal conductivity and heat load, according to the operating temperature or superconducting properties of the structures 202 and 203, respectively.

[0088] According to the above structure, the same effect as the first embodiment can be obtained, and compared with the first embodiment, the structure 202 can be cooled without using the refrigerant tank 210, thus reducing manufacturing costs.

[0089] (Third implementation method) Figure 6 This is a diagram illustrating an example of the superconducting magnet device 400 according to the third embodiment.

[0090] For example, such as Figure 6 As shown, the superconducting magnet device 400 of this embodiment differs from the superconducting magnet device 200 of the first embodiment in that it also has a superconducting coil 401, a solid heat conductor 402, a connecting part 403, and a connecting part 404.

[0091] The superconducting coil 401 is made of superconducting wire that generates a magnetic field. Specifically, the superconducting coil 401 is made of wire of HTS material. Here, the superconducting coil 401 is electrically connected to structures 202 and 203.

[0092] That is, the superconducting magnet device 400 of this embodiment has a hybrid cooling structure that combines a superconducting coil 201 made of LTS material and a superconducting coil 401 made of HTS material.

[0093] Similar to solid heat conductors 212-215, solid heat conductor 402 is made of a metal with high thermal conductivity (e.g., pure aluminum or copper) and connects the refrigerant tank 204 and the superconducting coil 401 in a thermally conductive manner.

[0094] Specifically, one end of the solid heat conductor 402 is in thermal contact with the refrigerant tank 204, and the other end of the solid heat conductor 402 is in thermal contact with the outer periphery of the superconducting coil 401. The solid heat conductor 402 cools the superconducting coil 401 to a second temperature by transferring the temperature of the refrigerant in the refrigerant tank 204 to the superconducting coil 401.

[0095] Here, the solid heat conductor 402 is configured with at least two parameters, including size, thermal conductivity, and heat load, based on the operating temperature or superconducting characteristics of the superconducting coil 401.

[0096] The connecting portion 403 connects the superconducting coil 401 to the structure 202 in a thermally conductive manner. Additionally, the connecting portion 404 connects the superconducting coil 401 to the structure 203 in a thermally conductive manner. This allows the temperatures of the superconducting coil 201, the structure 202, the structure 203, and the superconducting coil 401 to be uniformly controlled to a second temperature.

[0097] According to the above structure, the same effect as the first embodiment can be obtained, and by cooling the superconducting coil 201 and the superconducting coil 401 separately, each superconducting coil can be cooled efficiently in the hybrid cooling structure.

[0098] (Fourth Implementation) Figure 7 This is a diagram illustrating an example of the superconducting magnet device 500 according to the fourth embodiment.

[0099] For example, such as Figure 7 As shown, the superconducting magnet device 500 of this embodiment differs from the superconducting magnet device 400 of the third embodiment in that it has a piping 501 instead of a solid heat conductor 402.

[0100] Piping 501 is configured to contact the outer periphery of superconducting coil 401 in a thermally conductive manner, thereby cooling superconducting coil 401 to a second temperature by supplying refrigerant from refrigerant tank 204 to refrigerant tank 210.

[0101] Here, piping 501 is configured with at least two parameters, including size, thermal conductivity, and heat load, based on the operating temperature or superconducting characteristics of superconducting coil 401.

[0102] According to the above structure, the same effect as the first embodiment can be obtained, and compared with the superconducting magnet device 400 of the third embodiment, the superconducting coil 401 can be cooled by the piping 501 through which the refrigerant passes, so the superconducting coil 401 can be cooled more efficiently.

[0103] (Fifth implementation method) Figure 8 This is a diagram illustrating an example of the superconducting magnet device 600 according to the fifth embodiment.

[0104] For example, such as Figure 8 As shown, the superconducting magnet device 600 of this embodiment differs from the superconducting magnet device 400 of the third embodiment in that it has a solid heat conductor 601 and a refrigerant tank 602 instead of a solid heat conductor 402, a connecting part 403 and 404.

[0105] Similar to solid heat conductors 212-215, solid heat conductor 601 is made of a metal with high thermal conductivity (e.g., pure aluminum or copper) and connects the high-temperature end 206a of the refrigerator 206 to the superconducting coil 401 in a thermally conductive manner.

[0106] Specifically, one end of the solid heat conductor 601 is in thermally conductive contact with the high-temperature end 206a of the refrigerator 206, and the other end of the solid heat conductor 601 is in thermally conductive contact with the outer periphery of the superconducting coil 401. The solid heat conductor 601 cools the superconducting coil 401 to a first temperature by transferring the temperature of the high-temperature end 206a of the refrigerator 206 to the superconducting coil 401.

[0107] Here, the solid heat conductor 601 is configured with at least two parameters, namely, size, thermal conductivity, and heat load, according to the operating temperature or superconducting characteristics of the superconducting coil 401.

[0108] The refrigerant tank 602 is in thermally conductive contact with the superconducting coil 401, and the superconducting coil 401 is auxiliary cooled by the liquid or gas (gas) refrigerant filled inside.

[0109] According to the above structure, the same effect as the first embodiment can be obtained, and compared with the superconducting magnet device 400 of the third embodiment, the superconducting coil 401 of HTS material is cooled to a first temperature, and the superconducting coil 201 of LTS material is cooled to a second temperature lower than the first temperature, thereby enabling more efficient cooling of each superconducting coil in the hybrid cooling structure.

[0110] (Sixth Implementation Method) Figure 9 This is a diagram showing an example of the superconducting magnet device 700 according to the sixth embodiment.

[0111] For example, such as Figure 9 As shown, the superconducting magnet device 700 of this embodiment differs from the superconducting magnet device 600 of the fifth embodiment in that it has a refrigerant tank 701, a heat exchanger 702, a refrigerator 703 and piping 704 instead of a solid heat conductor 601 and a refrigerant tank 602.

[0112] Refrigerant tank 701 stores refrigerants such as liquid nitrogen and liquid hydrogen.

[0113] The heat exchanger 702 is exposed to the interior of the refrigerant tank 701, allowing the vaporized refrigerant to be reliquefied and returned to the refrigerant tank 701.

[0114] The refrigerator 703 cools the refrigerant in the refrigerant tank 701. Specifically, the refrigerator 703 has a high-temperature end 703a with a first temperature (e.g., 50K), at which the refrigerant in the refrigerant tank 701 is cooled to the first temperature. Furthermore, the refrigerator 703 may also have a low-temperature end with a second temperature (e.g., 4K) lower than the first temperature, similar to the refrigerator 206 described in the above embodiment.

[0115] Piping 704 is configured to contact the outer periphery of superconducting coil 401 in a thermally conductive manner, thereby cooling superconducting coil 401 to a first temperature by circulating refrigerant within refrigerant tank 701.

[0116] Here, the piping 704 is configured with at least two parameters, including size, thermal conductivity, and heat load, based on the operating temperature or superconducting characteristics of the superconducting coil 401.

[0117] That is, the superconducting magnet device 700 of this embodiment includes a plurality of refrigerators that are configured to maintain a superconducting state relative to the heat load generated by the structure of the object being cooled, and a superconducting coil 401 made of wire of HTS material is connected to one of the plurality of refrigerators in a thermally conductive manner.

[0118] According to the above structure, the same effect as the first and fifth embodiments can be obtained, and compared with the superconducting magnet device 400 of the third embodiment, the superconducting coil 401 can be cooled by the piping 704 through which the refrigerant passes, so the superconducting coil 401 can be cooled more efficiently.

[0119] (Seventh Implementation) Figure 10 This is a diagram showing an example of the superconducting magnet device 800 according to the seventh embodiment.

[0120] For example, such as Figure 10As shown, the superconducting magnet device 800 of this embodiment differs from the superconducting magnet device 600 of the fifth embodiment in that it has a refrigerator 801, a refrigerant tank 802 and a heat exchanger 803 instead of a solid heat conductor 601 and a refrigerant tank 602.

[0121] The refrigerator 801 cools the refrigerant in the refrigerant tank 802. Specifically, the refrigerator 801 has a high-temperature end 801a with a first temperature (e.g., 50K), at which the refrigerant in the refrigerant tank 802 is cooled to the first temperature. Furthermore, the refrigerator 801 may also have a low-temperature end with a second temperature (e.g., 4K) lower than the first temperature, similar to the refrigerator 206 described in the above embodiment.

[0122] The refrigerant tank 802 stores refrigerants such as liquid nitrogen and liquid hydrogen cooled by the refrigerator 801, and seals the superconducting coil 401 in a state of being immersed in the refrigerant, thereby cooling the superconducting coil 401 to the first temperature.

[0123] The heat exchanger 803 is exposed to the interior of the refrigerant tank 802, allowing the vaporized refrigerant to be reliquefied and returned to the refrigerant tank 802.

[0124] That is, similar to the sixth embodiment, the superconducting magnet device 800 of this embodiment includes a plurality of refrigerators that are configured to maintain a superconducting state relative to the heat load generated by the structure of the object being cooled, and a superconducting coil 401 made of wire of HTS material is connected to one of the plurality of refrigerators in a thermally conductive manner.

[0125] According to the above structure, the same effect as the first and fifth embodiments can be obtained, and compared with the superconducting magnet device 700 of the sixth embodiment, the superconducting coil 401 can be directly cooled by the refrigerant stored in the refrigerant tank 802, so the superconducting coil 401 can be cooled more efficiently.

[0126] Furthermore, the superconducting magnet devices 300-800 described in the second to seventh embodiments above can also be... Figure 4 Similarly, in the variation of the first embodiment shown, from Figures 5-10 The precooling tube 209, cover 218, solid heat conductor 213 and heat anchor 208 are removed from the structure shown.

[0127] (Eighth Implementation) Figure 11 This is a diagram showing an example of the superconducting magnet device 900 according to the eighth embodiment.

[0128] For example, such as Figure 11As shown, the superconducting magnet device 900 of this embodiment differs from the superconducting magnet device 400 of the third embodiment in that it has a refrigerator 901, a refrigerant tank 902, a heat exchanger 902, a heat exchanger 903 and a solid heat conductor 904 instead of a refrigerant tank 204, a heat exchanger 205, a refrigerator 206, a heat anchor 208, a precooling pipe 209, a refrigerant tank 210, a piping 211, a solid heat conductor 212-215, a heat capacity retaining member 216, a cover 218 and a solid heat conductor 402.

[0129] The refrigeration unit 901 cools the refrigerant in the refrigerant tank 902. Specifically, the refrigeration unit 901 has a high-temperature end 901a with a first temperature (e.g., 50K) and a low-temperature end 901b with a second temperature (e.g., 4K) lower than the first temperature. The refrigerant in the refrigerant tank 902 is cooled to the second temperature at the low-temperature end 901b.

[0130] The refrigerant tank 902 stores refrigerant such as liquid helium cooled by the refrigerator 901, and seals the superconducting coil 201, structure 202 and structure 203 in a state of being immersed in the refrigerant, thereby cooling the superconducting coil 201, structure 202 and structure 203 to a first temperature.

[0131] The heat exchanger 903 is exposed to the interior of the refrigerant tank 902, allowing the vaporized refrigerant to be reliquefied and returned to the refrigerant tank 902.

[0132] The solid heat conductor 904, like the solid heat conductor 402 described in the third embodiment, is made of a metal with high thermal conductivity (e.g., pure aluminum, copper, etc.) and connects the refrigerant tank 902 and the superconducting coil 401 in a thermally conductive manner.

[0133] Specifically, one end of the solid heat conductor 904 is in thermal contact with the refrigerant tank 902, and the other end of the solid heat conductor 904 is in thermal contact with the outer periphery of the superconducting coil 401. The solid heat conductor 904 cools the superconducting coil 401 to a first temperature by transferring the temperature of the refrigerant in the refrigerant tank 902 to the superconducting coil 401.

[0134] Here, the solid heat conductor 904 is configured with at least two parameters, including size, thermal conductivity, and heat load, based on the operating temperature or superconducting characteristics of the superconducting coil 401.

[0135] According to the above structure, the same effect as the first embodiment can be obtained, and compared with the superconducting magnet device 400 of the third embodiment, the superconducting coil 201, structure 202 and structure 203 can be directly cooled by the refrigerant stored in the refrigerant tank 902, so the superconducting coil 201, structure 202 and structure 203 can be cooled more efficiently.

[0136] (Other implementation methods) Furthermore, in the above embodiments, an example of a case in which only the solid heat conductor 212 is equipped with a heat capacity retention member 216 has been described, but the embodiments are not limited to this. For example, all or part of other solid heat conductors may also be equipped with heat capacity retention members in the same way.

[0137] Furthermore, in the above embodiments, the locations and number of the piping supplying refrigerant from the refrigerant tank to the structure being cooled, and the solid heat conductors that directly or indirectly connect the refrigerant tank and the structure being cooled in a thermally conductive manner, are not limited to the structures described in each embodiment, and can be appropriately varied depending on the operating temperature or superconducting characteristics of the structure being cooled. For example, the solid heat conductor may also be in thermally conductive contact with multiple locations of the piping. Additionally, for example, the solid heat conductor may be in thermally conductive contact with multiple locations on the outer periphery of the superconducting coil. Furthermore, for example, the solid heat conductor may be in thermally conductive contact with one or more locations on the side plate or inner periphery of the superconducting coil.

[0138] Alternatively, in the above embodiments, a temperature-adjustable heater may be provided instead of any one of the solid heat conductor, piping, and heat capacity retainer, or based on the solid heat conductor, piping, and heat capacity retainer. In this case, the heater may contact the structure being cooled in a thermally conductive manner, and at least two parameters of size, thermal conductivity, and heat load may be set according to the operating temperature or superconducting properties of the structure being cooled.

[0139] Furthermore, while the above description illustrates an example of a "processor" reading and executing programs corresponding to various processing functions from a storage circuit, the implementation is not limited to this. The term "processor" refers to circuits such as a CPU (Central Processing Unit), GPU (Graphics Processing Unit), Application Specific Integrated Circuit (ASIC), and programmable logic devices (e.g., Simple Programmable Logic Device (SPLD), Complex Programmable Logic Device (CPLD), and Field Programmable Gate Array (FPGA)). In the case where the processor is, for example, a CPU, the processor implements each processing function by reading and executing the program stored in the storage circuit. On the other hand, in the case where the processor is an ASIC, instead of storing the program in the storage circuit, the processing function is directly integrated into the processor's circuitry as logic circuitry. Moreover, the processors in this embodiment are not limited to each processor being a single circuit; multiple independent circuits can be combined to form a single processor to implement its processing functions. Furthermore, it is also possible to... Figure 1 Multiple components are integrated into a single processor to achieve its processing functions.

[0140] Here, the program executed by the processor is provided pre-loaded into ROM (Read Only Memory), storage circuitry, etc. The program can also be provided as a file that can be installed on or executed on computer-readable storage media such as CD (Compact Disk)-ROM, FD (Flexible Disk), CD-R (Recordable), DVD (Digital Versatile Disk). Alternatively, the program can be stored on a computer connected to a network such as the Internet and provided or distributed via download. For example, the program consists of modules containing the aforementioned functional units. As actual hardware, the CPU reads the program from the storage medium such as ROM and executes it, thereby loading each module onto the main storage device and generating the program on the main storage device.

[0141] Furthermore, in the above embodiments, the constituent elements of each device illustrated are functional concepts and do not necessarily need to be physically configured as shown in the illustrations. That is, the specific manner in which the devices are distributed or integrated is not limited to the manner illustrated, and can be configured in any unit, functionally or physically, according to various loads, usage conditions, etc. Moreover, all or any part of the processing functions performed by each device can be implemented by a CPU and the program parsed and executed by the CPU, or as hardware based on wired logic.

[0142] Furthermore, in each of the processes described in the above embodiments, all or part of the processes described as automatically performed processes can also be performed manually, or all or part of the processes described as manually performed processes can also be performed automatically by known methods. In addition, the processing steps, control steps, specific names, and information including various data and parameters shown in the above specification and drawings can be arbitrarily changed, except where specifically stated.

[0143] According to at least one embodiment described above, multiple structures of the object to be cooled can be cooled efficiently while reducing the amount of refrigerant.

[0144] Several embodiments have been described, but these embodiments are provided by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other ways, and various omissions, substitutions, modifications, and combinations of embodiments can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, and are also included in the scope of the invention as described in the claims and its equivalents.

[0145] Regarding the above-described embodiments, as an aspect of the invention and optional features, the following notes are disclosed.

[0146] (Note 1) A superconducting magnet device, comprising: A superconducting coil is made of superconducting wire that generates a magnetic field; A structure made of a superconductor and electrically connected to the superconducting coil; A refrigerant tank that stores refrigerant and seals the structure in a state of being immersed in the refrigerant; A heat exchanger that exposes to the interior of the refrigerant tank; A refrigeration unit that cools the refrigerant; A solid heat conductor that directly or indirectly connects the refrigerant tank to the superconducting coil in a thermally conductive manner; and A vacuum container that encloses the superconducting coil, the structure, the refrigerant tank, the heat exchanger, the refrigerator, and the solid heat conductor; The superconducting coil or the structure is constructed using at least two structures that have different operating temperatures or superconducting properties.

Claims

1. A superconducting magnet device, characterized in that, have: A superconducting coil is made of superconducting wire that generates a magnetic field; A structure made of a superconductor and electrically connected to the superconducting coil; A refrigerant tank, used to store refrigerant; A heat exchanger that exposes to the interior of the refrigerant tank; A refrigeration unit that cools the refrigerant; A solid heat conductor that directly or indirectly connects the refrigerant tank to the superconducting coil and the structure in a thermally conductive manner; and A vacuum container that encloses the superconducting coil, the structure, the refrigerant tank, the heat exchanger, the refrigerator, and the solid heat conductor; The superconducting coil or the structure is constructed using at least two structures that have different operating temperatures or superconducting properties.

2. The superconducting magnet device according to claim 1, characterized in that, The superconducting properties are the critical temperature, critical magnetic field, or critical current.

3. The superconducting magnet device according to claim 1 or 2, characterized in that, The superconducting coil or the structure is constructed using at least two of the following: low-temperature superconducting materials, high-temperature superconducting materials, protective materials, parent materials, and substrates, which have different thermal conductivity or specific heat properties.

4. The superconducting magnet device according to claim 1 or 2, characterized in that, The solid heat conductor is composed of a metal with high thermal conductivity formed in the form of a plate, corner, strip or sheet, or a metal formed in the form of a cylindrical pipe with thermal conductivity set according to the structure in contact with the solid heat conductor in a thermally conductive manner.

5. The superconducting magnet device according to claim 1 or 2, characterized in that, It also has: Piping that supplies the refrigerant from the refrigerant tank to at least one of the structure and the superconducting coil; and A heat capacity retainer is mounted on the solid heat conductor to retain the heat capacity of the solid heat conductor.

6. The superconducting magnet device according to claim 5, characterized in that, At least one of the solid heat conductor, the piping, the heat capacity retainer, and the heater is in thermally conductive contact with at least one part of the superconducting coil and the structure with a small heat capacity. At least two parameters of the size, thermal conductivity, and heat load of the at least one component are set according to the operating temperature or the superconducting properties.

7. The superconducting magnet device according to claim 5, characterized in that, The solid heat conductor is in thermally conductive contact with at least one part of the piping.

8. The superconducting magnet device according to claim 1 or 2, characterized in that, The solid heat conductor is in thermally conductive contact with at least one part of the superconducting coil.

9. The superconducting magnet device according to claim 5, characterized in that, The superconducting coil or the structure comprises high-temperature superconducting materials or low-temperature superconducting materials. The superconducting coil or the structure is connected in a thermally conductive manner to one of the low-temperature end and the high-temperature end of the refrigerator via at least one of the refrigerant tank, the piping, the solid heat conductor and the refrigerant.

10. The superconducting magnet device according to claim 5, characterized in that, The superconducting coil or the structure comprises: a first superconducting coil or a first structure comprising a low-temperature superconducting material; and a second superconducting coil or a second structure comprising a high-temperature superconducting material; The first superconducting coil or the first structure is connected to the low-temperature end of the refrigerator in a thermally conductive manner via at least one of the refrigerant tank, the piping, the solid heat conductor, and the refrigerant. The second superconducting coil or the second structure is connected to the high-temperature end of the refrigerator in a thermally conductive manner via at least one of the refrigerant tank, the piping, the solid heat conductor, and the refrigerant.

11. The superconducting magnet device according to claim 9, characterized in that, The refrigerator includes one or more refrigerators, each configured to maintain a superconducting state relative to the heat load generated by the structure of the object being cooled. The superconducting coil is connected to one of the one or more refrigerators in a thermally conductive manner.

12. A magnetic resonance imaging device, characterized in that, The superconducting magnet device according to claim 1 or 2 is used as a static magnetic field magnet to generate a static magnetic field in the imaging space in which the subject is placed.

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