Board-to-board connector with shielding structure

Abstract

The invention discloses a board-to-board connector with a shielding structure. The board-to-board connector with the shielding structure comprises a first circuit board, a first connecting piece, a buffer conductor, a second circuit board, a second connecting piece and a shielding cover, the first connecting piece is arranged on the first circuit board; the buffer conductor is arranged on the first circuit board and surrounds the first connecting piece; the second circuit board is perpendicular to the first circuit board, and one side edge of the second circuit board is provided with a first metal layer; the second connecting piece is arranged on the second circuit board and is in butt joint with the first connecting piece along a butt joint direction; the shielding cover is arranged on the second circuit board and surrounds the second connecting piece; when the second connecting piece is in butt joint with the first connecting piece in the butt joint direction, the side edge of the second circuit board abuts against the buffering electric conductor, so that the first metal layer is electrically connected to the buffering electric conductor, and the shielding cover surrounds the first connecting piece. The first metal layer of the board-to-board connector with the shielding structure provided by the invention can make up the problem that the shielding cover cannot completely shield the connector.

Description

Technical Field

[0001] This invention relates to a board-to-board connector, and more particularly to a board-to-board connector with a shielding structure. Background Technology

[0002] Currently, board-to-board connectors are widely used in next-generation... In 5G product design, RF signals can be transmitted between two PCB boards via a board-to-board connector (or BTB connector).

[0003] RF signals are susceptible to interference from external signals during transmission between BTB connectors. Current technology utilizes shielding frames to cover the BTB connectors to mitigate this interference. However, for certain BTB connectors, such as vertical mating connectors, the shielding frame cannot cover every side. For example, the side of the connector that connects to the circuit board may not be shielded, creating gaps in signal shielding.

[0004] Therefore, how to overcome the above-mentioned defects through structural design improvements has become one of the important issues to be addressed in this field.

[0005] Therefore, there is a need to provide a board-to-board connector with a shielded structure to solve the above problems. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a board-to-board connector with a shielding structure to address the shortcomings of the prior art, thereby solving the technical problem that the existing shielding frame cannot completely cover the connector, resulting in a signal shielding gap.

[0007] To address the aforementioned technical problems, one technical solution adopted by this invention is to provide a board-to-board connector with a shielded structure, comprising a first circuit board, a first connector, a buffer conductor, a second circuit board, a second connector, and a shielding cover. The first connector is disposed on the first circuit board. The buffer conductor is disposed on the first circuit board and surrounds the first connector. The second circuit board is perpendicular to the first circuit board, and one side of the second circuit board has a first metal layer. The second connector is disposed on the second circuit board and abuts against the first connector along a mating direction. The shielding cover is disposed on the second circuit board and surrounds the second connector. When the second connector abuts against the first connector along the mating direction, the side of the second circuit board abuts against the buffer conductor, electrically connecting the first metal layer to the buffer conductor, and the shielding cover surrounds the first connector.

[0008] One of the beneficial effects of this invention is that the board-to-board connector with a shielded structure provided by this invention, through a structural design in which a first metal layer is provided on the side of the second circuit board in conjunction with a shielding cover, allows the first metal layer to be electrically connected to a buffer conductor when the first connector and the second connector are mated, and the shielding cover surrounds the first connector. In this way, the first metal layer can compensate for the problem that the shielding cover cannot completely shield the connector. The first metal layer and the shielding cover can together surround the connector to completely shield against external electromagnetic interference.

[0009] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of a board-to-board connector according to an embodiment of the present invention.

[0011] Figure 2 This is an exploded view of the board-to-board connector according to an embodiment of the present invention.

[0012] Figure 3 This is an exploded view of the first connector and the buffer conductor in an embodiment of the present invention.

[0013] Figure 4 This is a top view of the first connector and the buffer conductor according to an embodiment of the present invention.

[0014] Figure 5 This is a schematic diagram of the second connector and shielding cover according to an embodiment of the present invention.

[0015] Figure 6 This is an exploded view of the second connector and shielding cover according to an embodiment of the present invention.

[0016] Figure 7 This is a top view of the second connector and shielding cover according to an embodiment of the present invention.

[0017] Figure 8 This is a bottom view of the second circuit board according to an embodiment of the present invention.

[0018] Figure 9 This is a side view of the second circuit board according to an embodiment of the present invention.

[0019] Figure 10 for Figure 1 A cross-sectional schematic diagram of section XX.

[0020] Explanation of key component symbols:

[0021] D-board to board connector

[0022] M1 First Board Terminal Connector

[0023] M2 Second Board End Connector

[0024] 1 First Circuit Board

[0025] 11 Metal grounding layer

[0026] 2 First connector

[0027] 3. Buffer conductor

[0028] 3U top surface

[0029] 4 Second Circuit Board

[0030] 41 First Surface

[0031] 42 Second Surface

[0032] 43 First metal layer

[0033] 431 First metal extension

[0034] 432 Second metal extension

[0035] 44 Second metal layer

[0036] 441 end

[0037] 4S side

[0038] 5 Second connector

[0039] 6. Shielding cover

[0040] 60 opening

[0041] 61. Protruding part

[0042] 7 Solder mask layer

[0043] Widths of W1, W2, W3, H1, H2 Detailed Implementation

[0044] The following specific embodiments illustrate the implementation of the "board-to-board connector with shielding structure" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention. In addition, it should be understood that although terms such as "first," "second," and "third" may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. Furthermore, the term "or" used herein may, depending on the actual situation, include any combination of one or more of the associated listed items. Additionally, throughout this invention, "connection" refers to a physical connection between two elements, whether direct or indirect.

[0045] [Example]

[0046] See Figure 1 , Figure 2 as well as Figure 5 As shown, Figure 1 This is a schematic diagram of a board-to-board connector according to an embodiment of the present invention. Figure 2 This is an exploded view of the board-to-board connector according to an embodiment of the present invention. Figure 5 This is a schematic diagram of the second connector and shielding cover according to an embodiment of the present invention. The present invention provides a board-to-board connector D with a shielding structure, which includes a first circuit board 1, a first connector 2, a buffer conductor 3, a second circuit board 4, a second connector 5, and a shielding cover 6.

[0047] See Figure 3 and Figure 4 As shown, Figure 3 This is an exploded view of the first connector and the buffer conductor according to an embodiment of the present invention. Figure 4 This is a top view schematic diagram of the first connector 2 and the buffer conductor 3 according to an embodiment of the present invention. The first connector 2 and the buffer conductor 3 are disposed on a surface of the first circuit board 1. For example, the first connector 2 can be soldered to the first circuit board 1 using surface-mount technology (SMT). The surface of the first circuit board 1 has a metal ground layer 11. Figure 3As shown, the metal grounding layer 11 can be, for example, an annular bare copper region. The metal grounding layer 11 surrounds the first connector 2. The buffer conductor 3 is an annular structure whose shape corresponds to the metal grounding layer 11. For example, the buffer conductor 3 can be formed of a compressible conductive material, such as conductive foam or conductive silicone, and the invention is not limited thereto. The buffer conductor 3 is disposed on the metal grounding layer 11, for example, by being adhered to the metal grounding layer 11 with conductive adhesive or conductive backing adhesive, and thus surrounds the first connector 2.

[0048] It is worth mentioning that a predetermined distance must be maintained between the metal grounding layer 11 and the first connector 2 to ensure signal insulation between the metal grounding layer 11 and the buffer conductor 3 adhered thereto and the first connector 2. Preferably, this predetermined distance is at least greater than 1 mm. Furthermore, the width of the metal grounding layer 11, for example... Figure 4 The width H1 of the transverse portion (parallel to the X-axis direction) or the width H2 of the longitudinal portion (parallel to the Y-axis direction) is at least greater than 1 mm. Preferably, in the embodiment of the present invention, the width H1 is 2.5 mm and the width H2 is 3 mm.

[0049] like Figure 2 and Figure 5 As shown, the second connector 5 and the shield 6 are disposed on the second circuit board 4. For example, the second connector 5 and the shield 6 can be soldered to the second circuit board 4 using surface-mount technology (SMT). The shield 6 surrounds the second connector 5 and has an opening 60. Specifically, the board-to-board connector D of the present invention is a connector assembly composed of a first board-end connector M1 and a second board-end connector M2. The first board-end connector M1 includes a first circuit board 1, a first connector 2, and a buffer conductor 3, and the second board-end connector M2 includes a second circuit board 4, a second connector 5, and a shield 6. For example, the first connector 2 is a female connector and the second connector 5 is a male connector, but the present invention is not limited thereto, and the two can be interchanged.

[0050] like Figure 2 As shown, the second board connector M2 can be aligned along a mating direction ( Figure 2The second circuit board 4 (in the negative Z-axis direction) mates with the first board connector M1. During mating, the second circuit board 4 is perpendicular to the first circuit board 1, and the opening 60 of the shield 6 faces the first connector 2, so that the shield 6 can cover both the first connector 2 and the second connector 5 when the second connector 5 mates with the first connector 2, and further abut against the buffer conductor 3. The shield 6 is a metal frame, and its function is to shield signals from the external environment. Specifically, the shield 6 can be grounded by electrically connecting the metal grounding layer 11 through the buffer conductor 3 to achieve an electrical shielding effect. On the one hand, it prevents the first connector 2 and the second connector 5 from being interfered with by external signals during signal transmission, and on the other hand, it prevents the signals transmitted between the first connector 2 and the second connector 5 from interfering with other surrounding electronic components.

[0051] The second circuit board 4 has a side edge 4S and a first surface 41 and a second surface 42 located on opposite sides. The side edge 4S connects the first surface 41 and the second surface 42. The second circuit board 4 has a first metal layer 43 on its side edge 4S, which is located at the edge of the opening 60. For example, the first metal layer 43 is a bare copper layer. Further, the shielding cover 6 has a protrusion 61, which is disposed at the edge of the opening 60 and folds outward toward the outside of the opening 60. The invention is not limited to the number of protrusions 61. For example, a protrusion 61 may be provided on one side of the opening 60; or, protrusions 61 may be provided on all three sides of the opening 60. In an embodiment of the invention, protrusions 61 are provided on all three sides of the opening 60. From another perspective, the protrusions 61 extend along the periphery of the opening 60 and surround the opening 60.

[0052] like Figure 1 , Figure 2 as well as Figure 5 As shown, when the shielding cover 6 is disposed on the second circuit board 4, the protrusion 61 is flush with the side edge 4S of the second circuit board 4 and flush with the first metal layer 43 (see...). Figure 5 When the second connector 5 mates with the first connector 2, the second circuit board 4, through the portion on its side 4S where the first metal layer 43 is located, abuts against the upper surface 3U of the buffer conductor 3, so that the first metal layer 43 is electrically connected to the buffer conductor 3. The shielding cover 6 surrounds the first connector 2, and the protruding portion 61 of the shielding cover 6 also abuts against the upper surface 3U of the buffer conductor 3, so that the shielding cover 6 is electrically connected to the buffer conductor 3. Additionally, as... Figure 1 As shown, in a preferred embodiment, when the protrusion 61 abuts against the upper surface 3U of the buffer conductor 3, the projected area of ​​the protrusion 61 onto the upper surface 3U does not exceed the upper surface 3U of the buffer conductor 3.

[0053] This invention employs a structural design where a first metal layer 43 is provided on the side of the second circuit board 4, combined with a shielding cover 6. This design allows the first metal layer 43 and the shielding cover 6 to jointly surround the first connector 2 and the second connector 5, and the first metal layer 43 can form a closed loop with the protrusion 61 of the shielding cover 6. Therefore, when the first connector 2 and the second connector 5 are mated, the first metal layer 43 and the shielding cover 6 are electrically connected to the buffer conductor 3 and further grounded through the metal grounding layer 11, achieving an electrical shielding effect. In the prior art, because the connectors (first connector 2 and second connector 5) of the board-end connectors (i.e., the first board-end connector M1 and the second board-end connector M2) are located at the edge of the circuit board, the shielding cover cannot completely surround the connectors, resulting in a signal interference gap in the board-end connectors facing the circuit board. Therefore, the present invention strengthens the electrical shielding effect by providing a first metal layer 43 on the side of the second circuit board 4 in conjunction with a shielding cover 6, so that the first metal layer 43 and the shielding cover 6 can together surround the first connector 2 and the second connector 5, thus solving the problem that signal interference gaps are easily created by using only a shielding cover in the prior art.

[0054] Furthermore, the shielding cover 6 can increase the contact area with the buffer conductor 3 through the design of the protrusion 61. This not only strengthens the structural strength of the shielding cover 6 on the buffer conductor 3, but also further increases the area of ​​electrical contact between the shielding cover 6 and the buffer conductor 3, thereby increasing the electrical shielding effect. In addition, since the buffer conductor 3 is compressible, when the second circuit board 4 moves downward together with the second connector 5 and contacts the first connector 2, the compressibility of the buffer conductor 3 allows it to compress and provide a buffer stroke when the second circuit board 4 abuts against the buffer conductor 3, avoiding direct contact with the first circuit board 1 and interference, which would affect the stability of the second connector 5's connection with the first connector 2.

[0055] See Figures 6 to 8 As shown, Figure 6 This is an exploded view of the second connector and shielding cover according to an embodiment of the present invention. Figure 7 This is a top view of the second connector and shielding cover according to an embodiment of the present invention. Figure 8 This is a bottom view schematic diagram of the second circuit board according to an embodiment of the present invention. In this invention, the width of the first metal layer 43 cannot be too small to avoid insufficient contact area with the buffer conductor 3, resulting in poor shielding effect. Figure 6As shown, preferably, the width W1 of the first metal layer 43 is within ±20% of the width W2 of the protrusion 61, for example, width W1 is 1.6 mm and width W2 is 1.8 mm. This ensures that the width of the contact surfaces between the first metal layer 43, the shielding cover 6, and the buffer conductor 3 is relatively consistent at various locations, preventing weaknesses in the electrical shielding effect, i.e., avoiding areas with weak electrical shielding. Figure 7 and Figure 8 As shown, the first metal layer 43 further includes a first metal extension 431 and a second metal extension 432. The first metal extension 431 extends to a first surface 41 of the second circuit board 4, and the second metal extension 432 extends to a second surface 42 of the second circuit board 4. Preferably, the width of the first metal extension 431 and the width of the second metal extension 432 are each between 0.5 mm and 1 mm.

[0056] See Figure 7 and Figure 9 As shown, Figure 9 This is a side view of a second circuit board according to an embodiment of the present invention. The second circuit board 4 further includes a second metal layer 44, which is disposed on the first surface 41. Figure 7 As shown, the second metal layer 44 is a C-shaped bare copper layer. More specifically, the second metal layer 44 serves as a solder area for the shielding cover 6 to be soldered onto. For example, in an embodiment of the invention, the second metal layer 44 is elongated and surrounds the second connector 5. Furthermore, the second metal layer 44 has two ends 441 (see...) Figure 7 Each end 441 has a solder resist layer 7 between its surface and the surface of the first metal layer 43. More specifically, in a preferred embodiment of the invention, the solder resist layer 7 is located between the surface of each end 441 and the surface of the first metal extension 431 (see...). Figure 9 The solder resist layer 7 is an insulating varnish applied to the surface of the second circuit board 4. Preferably, the width W3 of the solder resist layer 7 is greater than 0.1 mm. The solder resist layer 7 is designed to prevent the solder (not shown) located on the second metal layer 44 from extending to the first metal layer 43, which would cause the second circuit board 4 to be uneven due to interference from the cured solder when it contacts the buffer conductor 3, thus affecting the stability of the second connector 5 in contact with the first connector 2.

[0057] It should be noted that the second metal layer 44 is connected to the first metal layer 43. Figure 7 From this perspective, the second metal layer 44 and the first metal extension 431 are disconnected and do not contact each other. However, due to Figure 9From this perspective, the second metal layer 44 and the first metal extension 431 are actually interconnected to achieve electrical connection. In other words, the shield 6 can be electrically connected to the first metal layer 43 through the second metal layer 44, and both can make electrical contact with the buffer conductor 3.

[0058] See Figure 1 , Figure 5 as well as Figure 10 As shown, Figure 10 for Figure 1 A cross-sectional schematic diagram of section XX. Through the design of electrical connections between the shielding cover 6, the first metal layer 43, and the buffer conductor 3, the shielding cover 6 and its protrusion 61 can form a closed loop with the first metal layer 43 completely surrounding the first connector 2 and the second connector 5 in both the XY and YZ planes (see...). Figure 1 and Figure 10 This achieves a three-dimensional shielding effect that completely shields the first connector 2 and the second connector 5.

[0059] When the second connector 5 mates with the first connector 2, the second circuit board 4 presses down on the buffer conductor 3 via its side 4S. The buffer conductor 3 is deformed by the pressure and extends to both sides of the second circuit board 4 to the first surface 41 and the second surface 42. The portion of the buffer conductor 3 extending to the first surface 41 further contacts and covers the first metal extension 431, and the portion of the buffer conductor 3 extending to the second surface 42 further contacts and covers the second metal extension 432. This invention, through the design of the first metal extension 431 and the second metal extension 432, increases the contact area between the buffer conductor 3 and the first metal layer 43, further enhancing the electrical shielding effect.

[0060] It should be noted that, as Figure 2 and Figure 10 As shown, the second circuit board 4 presses down on the conductive buffer 3 along the Z-axis via side 4S, and the contact surface between the first metal layer 43 and the conductive buffer 3 is a continuous surface without breaks. Therefore, the first metal layer 43 and the shielding cover 6 together surround the first connector 2 and the second connector 5, producing a complete electrical shielding effect without any weaknesses in electrical shielding. Furthermore, the projected area of ​​the first metal layer 43 onto the upper surface 3U of the conductive buffer 3 can be entirely within the range of the upper surface 3U, or it can partially extend beyond the upper surface 3U; this invention is not limited thereto. In other words, the relative position of the first metal layer 43 on the upper surface 3U of the conductive buffer 3 can be adjusted in the Y-axis direction as needed, as long as the contact surface between the first metal layer 43 and the conductive buffer 3 is a continuous surface, the electrical shielding effect required by this invention can be achieved.

[0061] [Beneficial Effects of the Examples]

[0062] In the prior art, since the connectors (first connector 2 and second connector 5) of the board-end connectors (i.e., the first board-end connector M1 and the second board-end connector M2) are all located on the edge of the circuit board, the shielding cover cannot completely surround the connectors, resulting in a signal interference gap in the direction of the board-end connectors facing the circuit board. Therefore, the present invention, through a structural design of providing a first metal layer 43 on the side of the second circuit board 4 in conjunction with the shielding cover 6, ensures that when the first connector 2 and the second connector 5 are mated, the first metal layer 43 is electrically connected to the buffer conductor 3 and grounded through the metal grounding layer 11. In this way, the first metal layer 43 and the shielding cover 6 can jointly surround the first connector 2 and the second connector 5, and achieve the effect of electrical shielding through the metal grounding layer 11, solving the problem that the existing technology, which only uses the shielding cover for shielding, is prone to signal interference gaps.

[0063] Furthermore, the shielding cover 6 can increase the contact area with the buffer conductor 3 through the design of the protrusion 61. This not only strengthens the structural strength of the shielding cover 6 on the buffer conductor 3, but also further increases the area of ​​electrical contact between the shielding cover 6 and the buffer conductor 3, thereby increasing the electrical shielding effect. In addition, since the buffer conductor 3 is compressible, when the second circuit board 4 moves downward together with the second connector 5 and contacts the first connector 2, the compressibility of the buffer conductor 3 allows it to compress and provide a buffer stroke when the second circuit board 4 abuts against the buffer conductor 3, avoiding direct contact with the first circuit board 1 and interference, which would affect the stability of the second connector 5's connection with the first connector 2.

[0064] The above-disclosed content is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the claims of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the scope of the claims of the present invention.

Claims

1. A board-to-board connector with a shielded structure, the board-to-board connector with a shielded structure comprising: First circuit board; A first connector is disposed on the first circuit board; A buffer conductor is disposed on the first circuit board and surrounds the first connector; A second circuit board, which is perpendicular to the first circuit board, has a first metal layer on one side; A second connector, disposed on the second circuit board and mated to the first connector along a mating direction; and A shielding cover is disposed on the second circuit board and surrounds the second connector; When the second connector is mated to the first connector along the mating direction, the side of the second circuit board abuts against the buffer conductor, so that the first metal layer is electrically connected to the buffer conductor, and the shielding cover surrounds the first connector.

2. The board-to-board connector with a shielding structure as described in claim 1, wherein, The shield is electrically connected to the first metal layer, and the shield has an opening.

3. The board-to-board connector with a shielding structure as described in claim 2, wherein, The shield has a protrusion located at the edge of the opening, which is folded outward toward the outside of the opening.

4. The board-to-board connector with a shielding structure as described in claim 3, wherein, The width of the first metal layer is greater than or equal to the width of the protrusion.

5. The board-to-board connector with a shielding structure as described in claim 3, wherein, The protrusion is flush with the side of the second circuit board.

6. The board-to-board connector with a shielding structure as described in claim 3, wherein, The protrusion extends along the periphery of the opening and abuts against an upper surface of the buffer conductor when the shield surrounds the first connector.

7. The board-to-board connector with a shielding structure as described in claim 6, wherein, When the protrusion abuts against the upper surface of the buffer conductor, the projected area of ​​the protrusion onto the upper surface does not exceed the upper surface.

8. The board-to-board connector with a shielding structure as described in claim 1, wherein, The second circuit board has a first surface and a second surface located on opposite sides, the side being connected between the first surface and the second surface, the first metal layer including a first metal extension and a second metal extension, the first metal extension extending to the first surface and the second metal extension extending to the second surface.

9. The board-to-board connector with a shielding structure as described in claim 8, wherein, When the second connector is mated to the first connector along the mating direction, the second circuit board presses down on the buffer conductor through the side, causing the buffer conductor to be deformed by compression and extend to the first surface and the second surface, and further cover the first metal extension and the second metal extension.

10. The board-to-board connector with a shielding structure as described in claim 8, wherein, The width of the first metal extension and the width of the second metal extension are each between 0.5 mm and 1 mm.

11. The board-to-board connector with a shielding structure as described in claim 10, wherein, The second circuit board also includes a second metal layer connected to the first metal layer, and the shield is soldered onto the second metal layer.

12. The board-to-board connector with a shielding structure as described in claim 11, wherein, The second metal layer surrounds the second connector and has two ends, with a solder resist layer between the surface of each end and the surface of the first metal layer.

13. The board-to-board connector with a shielding structure as described in claim 11, wherein, The second metal layer surrounds the second connector and has two ends, with a solder resist layer between the surface of each end and the surface of the first metal extension.

14. The board-to-board connector with a shielding structure as described in claim 13, wherein, The width of the solder resist layer is greater than 0.1 mm.

15. The board-to-board connector with a shielding structure as described in claim 1, wherein, The first circuit board has a metal ground layer on one surface, the metal ground layer surrounds the first connector, and the buffer conductor is disposed on the metal ground layer.

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