Conductive vibrating diaphragm, preparation method thereof and sound production device

Abstract

The invention relates to the technical field of electroacoustics, in particular to a conductive vibrating diaphragm, a preparation method thereof and a sound production device. The conductive vibrating diaphragm comprises a vibrating diaphragm main body part and a conductive part, and the conductive part is at least partially embedded in the vibrating diaphragm main body part or is arranged on the surface of the vibrating diaphragm main body part; wherein the conductive part comprises one or more of a spiral fiber conductive material and a woven mesh fiber conductive material; each of the spiral fiber conductive material and the woven mesh fiber conductive material independently comprises a matrix fiber and a conductive layer coated on the surface of the matrix fiber. The conductive diaphragm provided by the invention can alleviate the problem of insufficient resistance stability in a stretched state, can reduce the surface density of the diaphragm, and prevents the resonant frequency from being affected.

Description

Technical Field

[0001] This application relates to the field of electroacoustic technology, specifically to a conductive diaphragm and its preparation method, and a sound-generating device. Background Technology

[0002] The acoustic performance of sound-producing devices such as loudspeakers and headphones hinges on the optimal balance between the mechanical properties and electrical conductivity of the diaphragm. Currently, conductive diaphragms in sound-producing devices primarily improve conductivity by incorporating nanowires into the conductive components. However, these conductive diaphragms exhibit insufficient resistance stability under tension; furthermore, the introduction of nanowires increases the areal density of the diaphragm, thus affecting its resonant frequency. Summary of the Invention

[0003] Based on this, this application provides a conductive diaphragm, its preparation method, and a sound-generating device. The conductive diaphragm provided by this application can alleviate the problem of insufficient resistance stability under tension and can reduce the areal density of the diaphragm, thus preventing its resonant frequency from being affected.

[0004] A first aspect of this application provides a conductive diaphragm, comprising a diaphragm body portion and a conductive portion, wherein the conductive portion is at least partially embedded in the diaphragm body portion and / or the conductive portion is disposed on the surface of the diaphragm body portion;

[0005] The conductive part includes one or more of helical fiber conductive materials and woven mesh fiber conductive materials;

[0006] The spiral fiber conductive material and the woven mesh fiber conductive material each independently include a matrix fiber and a conductive layer covering the surface of the matrix fiber.

[0007] In some embodiments, the matrix fiber is made of one or more of polyester, polyamide, polyacrylonitrile, and polypropylene, and the conductive layer comprises the following components by mass: 5 to 10 parts of nano-conductive metal, 0.2 to 8 parts of resin, 0 to 2 parts of functional additives, and 0 to 10 parts of conductive polymer.

[0008] In some embodiments, the nanoconductive metal is made of one or more of silver, copper, and aluminum.

[0009] In some embodiments, the resin includes one or more of polyurethane, polyetheretherketone, and thermoplastic polyester elastomer.

[0010] In some embodiments, the functional additives include one or more of dispersants, binders, leveling agents, thickeners, defoamers, preservatives, and pH adjusters.

[0011] In some embodiments, the conductive polymer includes one or more of poly(3,4-ethylenedioxythiophene) and sodium polystyrene sulfonate.

[0012] In some embodiments, the diameter of the matrix fiber is 5 nm to 100 μm.

[0013] In some embodiments, the thickness of the conductive layer is 10 nm to 50 μm.

[0014] In some embodiments, the helical morphology of the helical fiber conductive material includes one or more of the following: cylindrical helix, conical helix, DNA-like double-wound helix, and fractal helix structure.

[0015] In some embodiments, the pitch of the spiral fiber conductive material is 50μm~500μm or 20nm~300nm.

[0016] In some embodiments, the outer diameter of the spiral fiber conductive material is 50μm~500μm or 20nm~300nm.

[0017] In some embodiments, the porosity of the woven mesh fiber conductive material is 20% to 50%.

[0018] In some embodiments, the material of the diaphragm body includes one or more of polyetheretherketone, thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, silicone rubber, ethylene-acrylate rubber, acrylate rubber, and hydrogenated nitrile rubber.

[0019] In some embodiments, when the conductive portion is disposed on the surface of the diaphragm body portion, the conductive portion further includes an elastic polymer;

[0020] In the conductive part, the mass fraction of the elastic polymer is 70% to 80%.

[0021] Optionally, the elastic polymer includes one or more of polyetheretherketone, thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, silicone rubber, ethylene-acrylate rubber, acrylate rubber, and hydrogenated nitrile rubber.

[0022] In some embodiments, a first dielectric layer is further provided between the conductive part and the diaphragm body; optionally, the material of the first dielectric layer includes one or more of polyetheretherketone, thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, silicone rubber, ethylene-acrylate rubber, acrylate rubber and hydrogenated nitrile rubber.

[0023] A second dielectric layer is further provided on the surface of the conductive part away from the diaphragm body; optionally, the material of the second dielectric layer includes one or more of polyetheretherketone, thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, silicone rubber, ethylene-acrylate rubber, acrylate rubber and hydrogenated nitrile rubber.

[0024] A second aspect of this application provides a method for preparing the conductive diaphragm according to any one of the first aspects of this application, comprising the following steps:

[0025] A conductive diaphragm is prepared by integrally molding the material of the conductive part and the material of the diaphragm body; wherein, at least a portion of the conductive part is embedded in the diaphragm body.

[0026] or,

[0027] The material of the conductive part is prepared into a conductive paste; the conductive paste and the diaphragm body are compositely molded to prepare the conductive diaphragm; wherein the conductive part of the conductive diaphragm is disposed on the surface of the diaphragm body.

[0028] The conductive part includes one or more of the spiral fiber conductive material and the braided mesh fiber conductive material; the spiral fiber conductive material and the braided mesh fiber conductive material each independently include a matrix fiber and a conductive layer covering the surface of the matrix fiber.

[0029] In some embodiments, the preparation steps of the spiral fiber conductive material and the woven mesh fiber conductive material include:

[0030] A matrix fiber is provided, and a metal paste is coated on the surface of the matrix fiber. After baking and aging or ultraviolet curing, a conductive layer is formed.

[0031] In some embodiments, the metal paste comprises, by weight, the following components: 5 to 10 parts of nano-conductive metal, 0.2 to 8 parts of resin, 0 to 2 parts of functional additives, 0 to 10 parts of conductive polymer, and 50 to 90 parts of solvent.

[0032] In some embodiments, the coating method includes one or more of spraying and immersion.

[0033] In some embodiments, the preparation steps of the spiral fiber conductive material include: providing a matrix fiber, coating the surface of the matrix fiber with a metal paste, baking and aging or ultraviolet curing to form a conductive layer; and winding the matrix fiber with the conductive layer to prepare the spiral fiber conductive material.

[0034] Alternatively, in some embodiments, the preparation steps of the spiral fiber conductive material include: providing a matrix fiber, winding the matrix fiber to form a spiral matrix fiber; then, coating the surface of the matrix fiber with a metal paste, and performing baking aging or ultraviolet curing to form a conductive layer, thereby preparing the spiral fiber conductive material.

[0035] In some embodiments, the preparation steps of the braided mesh fiber conductive material include: providing a matrix fiber, coating the surface of the matrix fiber with a metal paste, baking and aging or ultraviolet curing to form a conductive layer; and braiding the matrix fiber with the conductive layer to prepare the braided mesh fiber conductive material.

[0036] Alternatively, in some embodiments, the preparation steps of the braided mesh fiber conductive material include: providing a matrix fiber, weaving the matrix fiber into a braided mesh; then, coating the surface of the matrix fiber with a metal paste, and subjecting it to baking aging or ultraviolet curing to form a conductive layer, thereby preparing the braided mesh fiber conductive material.

[0037] A third aspect of this application provides a sound-generating device, the sound-generating device comprising the conductive diaphragm described in any one of the first aspects of this application; or comprising the conductive diaphragm prepared by the preparation method described in any one of the second aspects of this application.

[0038] The conductive diaphragm provided in this application has at least the following advantages:

[0039] The conductive diaphragm provided in this application incorporates helical fiber conductive materials and woven mesh fiber conductive materials, which are composed of lightweight, elastic, and non-conductive matrix fibers and conductive layers. The helical fiber conductive material, through its elastic deformation properties, maintains the continuity of the conductive path during dynamic loads such as diaphragm stretching and compression, preventing the detachment of conductive sites due to deformation. The woven mesh fiber conductive material constructs a stable conductive network through a three-dimensional interwoven structure, utilizing multi-point contact effects to reduce the surface resistance of the conductive diaphragm. Simultaneously, this woven mesh fiber conductive material also possesses good tensile properties, thereby alleviating the problem of insufficient resistance stability of the conductive diaphragm under tension.

[0040] Furthermore, the matrix fibers of the two types of spiral fiber conductive materials and woven mesh fiber conductive materials are lightweight, and their modulus is relatively consistent with that of the diaphragm body. Based on this, the conductive diaphragm is less likely to generate segmented vibration during vibration, thus reducing the degree of interference to the resonant frequency of the conductive diaphragm.

[0041] Therefore, the conductive diaphragm of this application can alleviate the problem of insufficient resistance stability under tension and reduce the areal density of the diaphragm, thus avoiding the influence on its resonant frequency. Attached Figure Description

[0042] Figure 1 This is a real-life photo of a matrix fiber that is a spiral fiber.

[0043] Figure 2 This is a real-life image showing the formation of a conductive layer on a spiral matrix fiber.

[0044] Figure 3 A schematic diagram of a woven mesh fiber conductive material;

[0045] Figure 4 This is a schematic diagram of a conductive diaphragm provided in an example of this application, in which at least a portion of the conductive part is embedded in the diaphragm body.

[0046] Figure 5 This is a schematic diagram of the conductive diaphragm structure provided in an example of this application when the conductive part is provided on the surface of the diaphragm body;

[0047] Figure 6 This is a schematic diagram of the structure of a conductive diaphragm provided in yet another example of this application;

[0048] Figure 7 This is a schematic diagram of a structure in which the conductive part contains a spiral fiber conductive material in one example of this application;

[0049] Figure 8 This is a schematic diagram of the structure of a sound-generating device provided as an example of this application.

[0050] Explanation of reference numerals in the attached figures

[0051] 10. Conductive diaphragm; 100. Diaphragm body; 200. Conductive part; 300. First dielectric layer; 400. Second dielectric layer. Detailed Implementation

[0052] The conductive diaphragm, its fabrication method, and the sound-generating device are further described in detail below with reference to specific embodiments. This application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0053] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0054] When a numerical range is disclosed herein, the range is considered continuous and includes the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Furthermore, when the range refers to integers, it includes every integer between the minimum and maximum values ​​of the range. Additionally, when multiple ranges are provided to describe a feature or characteristic, the ranges may be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges to which they are incorporated.

[0055] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise stated or in case of conflict, the terms or phrases used herein have the following meanings:

[0056] In this application, the terms "multiple", "various", "multiple times", "multi-dimensional", etc., unless otherwise specified, refer to a quantity greater than or equal to 2. For example, "one or more" means one or more or more.

[0057] In this application, percentage content refers to mass percentage for solid-liquid mixtures and solid-phase-solid mixtures, and volume percentage for liquid-phase-liquid mixtures, unless otherwise specified.

[0058] In this application, percentage concentrations, unless otherwise specified, refer to the final concentration. The final concentration refers to the proportion of the added component in the system after the addition of that component.

[0059] Traditional conductive diaphragms primarily improve conductivity by incorporating nanowires into the conductive portion. However, during sound production, the diaphragm undergoes high-frequency reciprocating vibration and tensile deformation. The traditionally added nanowires are prone to detachment at contact points between metal particles and breakage of conductive pathways during stretching, leading to a significant increase in diaphragm resistance and even localized conductive failure. This directly impacts the signal transmission stability of the sound-generating device, resulting in sound distortion and decreased sensitivity. Furthermore, the high density and significant differences in density and modulus between metal materials and the diaphragm's main body material increase the diaphragm's areal density, causing a shift in the diaphragm's resonant frequency and consequently reducing the high-frequency response performance of the sound-generating device.

[0060] Based on this, this application provides a conductive diaphragm that has good resistance stability and good resonant frequency under tension.

[0061] A first aspect of this application provides a conductive diaphragm, including a diaphragm body and a conductive portion, wherein the conductive portion is at least partially embedded in the diaphragm body or disposed on the surface of the diaphragm body.

[0062] The conductive part includes one or more of spiral fiber conductive materials and woven mesh fiber conductive materials;

[0063] Spiral fiber conductive materials and braided mesh fiber conductive materials each independently include a matrix fiber and a conductive layer covering the surface of the matrix fiber.

[0064] The conductive diaphragm provided in this application incorporates helical fiber conductive materials and woven mesh fiber conductive materials, which are composed of lightweight, elastic, and non-conductive matrix fibers and conductive layers. The helical fiber conductive material, through its elastic deformation properties, maintains the continuity of the conductive path during dynamic loads such as diaphragm stretching and compression, preventing the detachment of conductive sites due to deformation. The woven mesh fiber conductive material constructs a stable conductive network through a three-dimensional interwoven structure, reducing the surface resistivity of the conductive diaphragm through multi-point contact effects. Simultaneously, this woven mesh fiber conductive material also possesses good tensile properties, thus alleviating the problem of insufficient resistance stability of the conductive diaphragm under tension. Furthermore, the matrix fibers of both helical and woven mesh fiber conductive materials are lightweight, and their modulus is relatively consistent with that of the diaphragm body. Based on this, the conductive diaphragm is less prone to segmented vibrations during vibration, reducing interference with the diaphragm's resonant frequency. Therefore, the conductive diaphragm of this application can alleviate the problem of insufficient resistance stability under tension and reduce the areal density of the diaphragm, preventing its resonant frequency from being affected.

[0065] In some of these examples, the matrix fiber is made of one or more of polyester, polyamide, polyacrylonitrile, and polypropylene.

[0066] In some examples, the diameter of the matrix fiber is 5 nm to 100 μm. For example, the diameter of the matrix fiber includes, but is not limited to, 5 nm, 10 nm, 50 nm, 100 nm, 500 nm, 1 μm, 10 μm, 20 μm, 40 μm, 60 μm, 80 μm or 100 μm, or any two of the above values ​​as endpoints.

[0067] In this example, the matrix fiber of the helical fiber conductive material is a helical fiber. Here, the wire diameter of the matrix fiber refers to the diameter of a single fiber filament constituting the helical fiber structure. For example, Figure 1 This is a real-life photo of a matrix fiber that is helical.

[0068] In this example, in the braided mesh fiber conductive material, the matrix fiber is a fibrous mesh fiber. Here, the wire diameter of the matrix fiber refers to the diameter of a single fiber filament that constitutes the braided mesh fiber structure.

[0069] In some of these examples, the thickness of the conductive layer is 10 nm to 50 μm.

[0070] Understandably, in this example, a conductive layer can be formed on the surface of the matrix fiber before the helical fiber conductive material is wound. Alternatively, the matrix fiber can be wound into a helical shape first, and then a conductive layer can be formed on the surface of the helical matrix fiber to prepare the helical fiber conductive material; in this example, a real-life image of the helical matrix fiber is shown below. Figure 1 As shown in the image; a real-world photograph of the conductive layer formed on the helical matrix fiber is shown below. Figure 2 As shown. For woven fiber conductive materials, a conductive layer can be formed on the surface of the matrix fibers before weaving to form the woven fiber conductive material. Alternatively, the matrix fibers can be woven into a woven mesh fiber, and then a conductive layer can be formed on the surface of the woven mesh fiber to prepare the woven fiber conductive material.

[0071] The following examples illustrate the fabrication processes of helical fiber conductive materials and braided mesh fiber conductive materials. In some examples, the fabrication steps of helical fiber conductive materials include: providing matrix fibers; coating the surface of the matrix fibers with a metal paste; baking and aging or UV curing to form a conductive layer; and winding the matrix fibers with the conductive layer to prepare the helical fiber conductive material. Alternatively, the fabrication steps of helical fiber conductive materials include: providing matrix fibers; winding the matrix fibers to form a helical matrix fiber; then coating the surface of the matrix fibers with a metal paste; baking and aging or UV curing to form a conductive layer to prepare the helical fiber conductive material. In some examples, the fabrication steps of braided mesh fiber conductive materials include: providing matrix fibers; coating the surface of the matrix fibers with a metal paste; baking and aging or UV curing to form a conductive layer; and braiding the matrix fibers with the conductive layer to prepare the braided mesh fiber conductive material. Alternatively, the preparation steps of the woven mesh fiber conductive material include: providing matrix fibers, weaving the matrix fibers to form a woven mesh matrix fiber; then, coating the surface of the matrix fibers with a metal paste, and subjecting it to baking aging or ultraviolet curing to form a conductive layer, thereby preparing the woven mesh fiber conductive material. Further, the conductive layer includes a conductive metal. For example, the conductive metal includes one or more of silver, copper, and aluminum.

[0072] In some of these examples, the conductive layer comprises, by weight, the following components: 5 to 10 parts of nano-conductive metal, 0.2 to 8 parts of resin, 0 to 2 parts of functional additives, and 0 to 10 parts of conductive polymer.

[0073] In this application, "nanoconductive metal" refers to conductive metal with a particle size in the nanoscale range of 1 nm to 100 nm. In some examples, the nanoconductive metal is made of one or more of silver, copper, and aluminum. Preferably, the nanoconductive metal is made of silver.

[0074] The nano-conductive metal in the conductive layer can construct a continuous conductive path in the conductive layer, thereby improving the resistive stability of the conductive diaphragm under tension. For example, the mass fraction of the nano-conductive metal includes, but is not limited to, 5, 6, 7, 8, 9, or 10 parts, or any two of the above values ​​as endpoints.

[0075] In some examples, the resin includes one or more of polyurethane, polyetheretherketone, and thermoplastic polyester elastomers. Preferably, the resin includes polyurethane. As a conductive layer component, the resin enhances interfacial adhesion to the matrix fibers and is adaptable to dynamic deformation to maintain the integrity of the conductive layer structure. For example, the mass fractions of the resin include, but are not limited to, 3, 4, 5, 6, 7, or 8 parts, or any two of the above values ​​forming a range.

[0076] In some examples, the functional additives include one or more of dispersants, binders, leveling agents, thickeners, defoamers, preservatives, and pH adjusters. The addition of functional additives can optimize the film-forming properties and dispersion stability of the conductive layer, and improve the resistive stability and mechanical durability of the conductive diaphragm under dynamic deformation. For example, the mass fractions of the functional additives include, but are not limited to, 0.1 parts, 0.3 parts, 0.5 parts, 0.8 parts, 1 part, 1.2 parts, 1.5 parts, 1.8 parts, or 2 parts, or any two of the above values ​​as endpoints.

[0077] As examples, dispersants include, but are not limited to, one or more of sodium dodecylbenzenesulfonate, sodium oleate, hexadecyltrimethylammonium chloride, polyethylene glycol fatty acid esters, and polyoxyethylene octylphenyl ether. As examples, binders include, but are not limited to, one or more of hydroxypropyl cellulose, polyvinyl alcohol, sodium carboxymethyl cellulose, and polyvinylpyrrolidone. As examples, leveling agents include, but are not limited to, one or more of polyether-modified polysiloxanes, acrylate copolymers, and polydimethylsiloxane. As examples, thickeners include, but are not limited to, one or more of xanthan gum, guar gum, and fumed silica. As examples, defoamers include, but are not limited to, one or more of polyoxypropylene polyoxyethylene ethers and fatty acid ester defoamers. As examples, preservatives include, but are not limited to, one or more of sodium benzoate, potassium sorbate, and Kathon. As examples, pH adjusters include, but are not limited to, one or more of citric acid, tartaric acid, acetic acid, phosphoric acid, sodium hydroxide, potassium hydroxide, and sodium carbonate.

[0078] In some examples, the conductive polymer includes one or more of poly(3,4-ethylenedioxythiophene) and sodium polystyrene sulfonate. The conductive polymer, when used in combination with nano-conductive metals and resins, can synergistically construct a stable conductive network, achieving a synergistic improvement in the conductivity, flexibility, and durability of the conductive diaphragm. For example, the mass fractions of the conductive polymer include, but are not limited to, 0.1 parts, 0.3 parts, 0.5 parts, 0.8 parts, 1 part, 1.5 parts, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, or 10 parts, or any two of the above values ​​as endpoints.

[0079] As an example, the conductive layer comprises the following components in parts by mass: 5 to 10 parts of nano-conductive metal, 0.2 to 8 parts of resin, 0.5 to 1 part of dispersant, and 0.5 to 1 part of leveling agent.

[0080] In other examples, the conductive layer comprises, by weight parts: 5 to 10 parts of nano-conductive metal, 0.2 to 2 parts of resin, 0.05 to 1 part of conductive polymer, and 0.05 to 1 part of binder. The conductive polymer comprises poly(3,4-ethylenedioxythiophene) and sodium polystyrene sulfonate in a weight ratio of 1:(1.5 to 3.5). The binder comprises hydroxypropyl cellulose.

[0081] In some of these examples, the helical morphology of the helical fiber conductive material includes one or more of the following: cylindrical helix, conical helix, DNA-like double-wound helix, and fractal helix structure.

[0082] In some of these examples, the pitch of the helical fiber conductive material is 50 μm to 500 μm or 20 nm to 300 nm.

[0083] In some of these examples, the outer diameter of the spiral fiber conductive material is 50 μm to 500 μm or 20 nm to 300 nm.

[0084] In some of these examples, the porosity of the woven mesh fiber conductive material is 20% to 50%.

[0085] In some examples, the braiding method of the woven mesh fiber conductive material includes one or more of plain weave, twill weave, and satin weave. For example, a schematic diagram of the structure of the woven mesh fiber conductive material is shown below. Figure 3 As shown. This application finds that, Figure 3 The woven mesh fiber conductive material shown can achieve a parallel effect through multi-point contact, thereby effectively reducing the resistance per unit area. Furthermore, it exhibits good tensile strength in the 45° direction, making it suitable for use with conductive diaphragms.

[0086] In some of these examples, the material of the diaphragm body includes one or more of polyetheretherketone, thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, silicone rubber, ethylene-acrylate rubber, acrylate rubber, and hydrogenated nitrile rubber.

[0087] In some examples, the conductive portion also includes an elastic polymer. The mass fraction of the elastic polymer in the conductive portion is 70% to 80%. Introducing an elastic polymer at a mass fraction of 70% to 80% in the conductive portion can significantly improve the flexibility and dynamic deformation adaptability of the conductive layer, maintain the continuity and resistance stability of the conductive network when the diaphragm is stretched or bent, and simultaneously enhance the interfacial bonding force between the conductive portion and the diaphragm body. For example, the mass fraction of the elastic polymer in the conductive portion includes, but is not limited to, 70%, 75%, or 80%, or any two of the above values ​​as endpoints. It is understood that the conductive portion can be embedded within the diaphragm body portion or disposed on the surface of the diaphragm body portion 100. For example, a schematic diagram of a conductive diaphragm in which at least a portion of the conductive portion is embedded within the diaphragm body portion is shown below. Figure 4 As shown. When the conductive part 200 is provided on the surface of the diaphragm body 100, the structural schematic diagram of the conductive diaphragm 10 is as follows. Figure 5 or Figure 6 As shown.

[0088] Optionally, the elastic polymer includes one or more of polyetheretherketone, thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, silicone rubber, ethylene-acrylate rubber, acrylate rubber, and hydrogenated nitrile rubber.

[0089] like Figure 6 As shown, in some examples, when the conductive part 200 is disposed on the surface of the diaphragm body 100, a first dielectric layer 300 is further disposed between the conductive part 200 and the diaphragm body 100. Optionally, the material of the first dielectric layer 300 includes one or more of polyetheretherketone, thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, silicone rubber, ethylene-acrylate rubber, acrylate rubber, and hydrogenated nitrile rubber.

[0090] like Figure 6 As shown, in some examples, when the conductive portion 200 is disposed on the surface of the diaphragm body portion 100, a second dielectric layer 400 is further disposed on the surface of the conductive portion 200 facing away from the diaphragm body portion 100. Optionally, the material of the second dielectric layer 400 includes one or more of polyetheretherketone, thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, silicone rubber, ethylene-acrylate rubber, acrylate rubber, and hydrogenated nitrile rubber.

[0091] In some examples, the conductive part contains a spiral fiber conductive material, and the structural schematic diagram of the conductive part is shown below. Figure 7 As shown.

[0092] A second aspect of this application provides a method for preparing a conductive diaphragm according to any one of the first aspects of this application, comprising the following steps:

[0093] S10: The conductive diaphragm is prepared by integral molding of the material of the conductive part and the material of the diaphragm body; wherein at least a portion of the conductive part of the conductive diaphragm is embedded in the diaphragm body.

[0094] or,

[0095] P10: Prepare a conductive paste from the material of the conductive part; use the conductive paste and the diaphragm body to form a conductive diaphragm; wherein the conductive part of the conductive diaphragm is located on the surface of the diaphragm body.

[0096] In step S10 or step P10, the conductive part includes one or more of spiral fiber conductive material and woven mesh fiber conductive material; the spiral fiber conductive material and the woven mesh fiber conductive material each independently include a matrix fiber and a conductive layer covering the surface of the matrix fiber.

[0097] Understandably, in step S10, a conductive diaphragm with at least a portion of its conductive parts embedded within the diaphragm body is fabricated using an integral molding process. A schematic diagram of the conductive diaphragm with at least a portion of its conductive parts embedded within the diaphragm body is shown below. Figure 4 As shown.

[0098] As an example, such as Figure 4 The fabrication steps of the conductive diaphragm shown include:

[0099] S100: Prepare an elastomer-based conductive slurry by mixing one or more of spiral fiber conductive materials and woven mesh fiber conductive materials with an elastic polymer. S200: Apply the elastomer-based conductive slurry to a predetermined position on a diaphragm mold, and apply the material of the diaphragm body to a non-predetermined position on the diaphragm mold; after vulcanization, form... Figure 4 The structure shown is a one-piece molded conductive diaphragm.

[0100] Alternatively, S110: The woven mesh fiber conductive material and the diaphragm body 100 are hot-pressed together to form a conductive diaphragm 10.

[0101] Understandably, in steps S100 to S200 and step S110, the mass fraction of the elastic polymer can be determined based on the resistance of the conductive diaphragm. As an example, the mass fraction of the elastic polymer in the conductive part 200 is 70% to 80%.

[0102] Understandably, in step P10, a schematic diagram of the structure of the conductive diaphragm with the conductive part disposed on the surface of the diaphragm body is prepared by composite molding of conductive paste and diaphragm body. Figure 5 or Figure 6 As shown.

[0103] As an example, such as Figure 5 or Figure 6 The fabrication steps of the conductive diaphragm shown include:

[0104] P100: Mix one or more of helical fiber conductive materials and woven mesh fiber conductive materials with an elastic polymer to prepare an elastomer-based conductive paste. P200: Coat the elastomer-based conductive paste onto the surface of the diaphragm body 100, and after curing, prepare a conductive diaphragm 10. In this example, in step P200, the coating method includes one or more of spraying and dispensing.

[0105] Alternatively, P110: Mix one or more of helical fiber conductive materials and woven mesh fiber conductive materials with an elastic polymer to prepare an elastomer-based conductive paste. P210: Prepare a conductive part 200 from the elastomer-based conductive paste, and hot-press the conductive part 200 and the diaphragm body 100 to prepare a conductive diaphragm 10. In step P210, the method of preparing the conductive part 200 from the elastomer-based conductive paste includes, but is not limited to, one or more of spraying, scraping, and casting.

[0106] Understandably, in steps P100 to P210, the mass fraction of the elastic polymer can be determined based on the resistance of the conductive diaphragm. As an example, the mass fraction of the elastic polymer in the conductive part 200 is 70% to 80%.

[0107] The following examples illustrate the preparation steps of spiral fiber conductive materials and braided mesh fiber conductive materials.

[0108] In some of these examples, the preparation steps for helical fiber conductive materials and woven mesh fiber conductive materials include:

[0109] A matrix fiber is provided, and a metal paste is coated onto the surface of the matrix fiber. After baking aging or UV curing, a conductive layer is formed. In some examples, the coating method includes one or more of spraying and dipping.

[0110] In some of these examples, the baking and aging process parameters include: temperature of 80℃~150℃ and time of 10min~180min.

[0111] In some of these examples, the UV curing process parameters include: a wavelength range of 200 nm to 400 nm and an irradiation intensity of 50 mW / cm². 2 ~1000mW / cm 2 The curing time is 3s to 30s.

[0112] In some examples, prior to the step of coating the substrate fiber surface with a metal paste, a step of plasma cleaning the substrate fiber surface is included. For example, the plasma cleaning process parameters include: a power of 100W~500W, a chamber pressure of 1Pa~30Pa, a cleaning gas including one or more of argon and oxygen, a gas flow rate of 10sccm~100sccm, and a cleaning time of 1min~10min.

[0113] Understandably, the above describes the formation methods of the conductive layer. As examples, several preparation methods for helical fiber conductive materials and woven mesh fiber conductive materials are described below.

[0114] As an example, the preparation steps of the helical fiber conductive material include: a100, providing linear matrix fibers; a200, coating the surface of the matrix fibers with a metal paste, and then baking and aging or UV curing to form a conductive layer; a300, winding the matrix fibers with the conductive layer to prepare the helical fiber conductive material.

[0115] As an example, the preparation steps of the helical fiber conductive material include: a110, providing linear matrix fibers; a210, winding the matrix fibers to form helical matrix fibers; a310, coating the surface of the helical matrix fibers with a metal paste, and then baking and aging or UV curing to form a conductive layer, thereby preparing the helical fiber conductive material.

[0116] As an example, the preparation steps of the braided mesh fiber conductive material include: b100, braiding the spiral fiber conductive material in step a300 or a310 to prepare the braided mesh fiber conductive material.

[0117] As an example, the preparation steps of the braided mesh fiber conductive material include: b110, providing linear matrix fibers; b210, coating the surface of the matrix fibers with a metal paste, and then baking and aging or UV curing to form a conductive layer; b220, weaving the matrix fibers with the conductive layer to prepare the braided mesh fiber conductive material.

[0118] As an example, the preparation steps of the braided mesh fiber conductive material include: b120, providing linear matrix fibers; b220, weaving the matrix fibers to form a braided mesh matrix fiber; b230, coating the surface of the braided mesh matrix fiber with a metal paste, and then baking and aging or UV curing to form a conductive layer, thereby preparing the braided mesh fiber conductive material.

[0119] In some of these examples, the metal paste comprises, by weight parts, the following components: 5 to 10 parts of nano-conductive metal, 0.2 to 8 parts of resin, 0 to 2 parts of functional additives, 0 to 10 parts of conductive polymer, and 50 to 90 parts of solvent.

[0120] Understandably, except for the solvent, the components in the metal paste described above are the same as those in the conductive layer of the first aspect of this application, and the other components will not be described in detail here. For example, the solvent includes, but is not limited to, 50 parts, 60 parts, 70 parts, 80 parts or 90 parts, or any two of the above point values ​​as endpoint values ​​within the range.

[0121] As an example, the conductive layer comprises the following components in parts by mass: 5 to 10 parts of nano-conductive metal, 0.2 to 8 parts of resin, 0.5 to 1 part of dispersant, 0.5 to 1 part of leveling agent, and 50 to 90 parts of solvent.

[0122] In other examples, the conductive layer comprises, by weight parts: 5 to 10 parts of nano-conductive metal, 0.2 to 2 parts of resin, 0.05 to 1 part of conductive polymer, 0.05 to 1 part of binder, and 50 to 90 parts of solvent. The conductive polymer comprises poly(3,4-ethylenedioxythiophene) and sodium polystyrene sulfonate in a weight ratio of 1:(1.5 to 3.5). The binder comprises hydroxypropyl cellulose.

[0123] A third aspect of this application provides a sound-generating device, which includes a conductive diaphragm according to any one of the first aspects of this application; or a conductive diaphragm prepared by any one of the preparation methods of the second aspect of this application.

[0124] For example, the sound-generating device includes, but is not limited to, a loudspeaker. Further, a schematic diagram of the structure of a loudspeaker containing the conductive diaphragm structure of this application is shown below. Figure 8 As shown. By Figure 8 It is evident that the spiral fiber conductive material is clearly present in the speaker.

[0125] The following detailed embodiments illustrate this application in more detail. It should also be understood that the following embodiments are for further explanation only and should not be construed as limiting the scope of protection of this application. Any non-essential improvements and adjustments made by those skilled in the art based on the above description of this application fall within the scope of protection of this application. The specific process parameters, etc., in the following embodiments are merely examples within a suitable range; that is, those skilled in the art can make appropriate selections within the range based on the description herein, and are not necessarily limited to the specific values ​​in the embodiments below.

[0126] Preparation Example 1

[0127] Example 1 provides a helical fiber conductive material and its preparation method. The preparation steps of the helical fiber conductive material are as follows:

[0128] (1) Provide linear matrix fibers with a diameter of 5 nm to 100 μm. (2) Wind the matrix fibers to prepare helical matrix fibers. (3) Perform plasma cleaning on the helical matrix fibers. The plasma cleaning process parameters include: power of 100 W to 500 W, chamber pressure of 1 Pa to 30 Pa, cleaning gas of argon, gas flow rate of 10 sccm to 100 sccm, and cleaning time of 1 min to 10 min. (4) Prepare a metal slurry according to the following mass proportions: 8 parts of nano-conductive silver metal, 6 parts of waterborne polyurethane resin, 0.8 parts of dispersant (sodium dodecylbenzene sulfonate), 0.8 parts of leveling agent (polydimethylsiloxane), 5 parts of conductive polymer (composed of poly(3,4-ethylenedioxythiophene) and sodium polystyrene sulfonate in a mass ratio of 1:2), and 79.4 parts of water. (5) The plasma-cleaned helical matrix fibers are immersed in a metal slurry and baked for aging (temperature 80℃~150℃, time 10min~180min) to prepare a helical fiber conductive material. The helical shape of the helical fiber conductive material is a cylindrical helix with a pitch of 50μm~500μm or 20nm~300nm; the outer diameter of the helix is ​​50μm~500μm or 20nm~300nm.

[0129] Preparation Example 2

[0130] Example 2 provides a helical fiber conductive material and its preparation method. The preparation steps of the helical fiber conductive material are as follows:

[0131] (1) Provide linear matrix fibers with a diameter of 5 nm to 100 μm. (2) Perform plasma cleaning on the matrix fibers. The plasma cleaning process parameters include: power of 100 W to 500 W, chamber pressure of 1 Pa to 30 Pa, cleaning gas of argon, gas flow rate of 10 sccm to 100 sccm, and cleaning time of 1 min to 10 min. (3) Prepare the metal slurry according to the following mass proportions: 8 parts of nano-conductive silver metal, 6 parts of waterborne polyurethane resin, 0.8 parts of dispersant (sodium dodecylbenzene sulfonate), 0.8 parts of leveling agent (polydimethylsiloxane), 5 parts of conductive polymer (composed of poly(3,4-ethylenedioxythiophene) and sodium polystyrene sulfonate in a mass ratio of 1:2) and 79.4 parts of water. (4) The plasma-cleaned matrix fibers are immersed in a metal slurry and baked for aging (temperature 80℃~150℃, time 10min~180min) to form a conductive layer, thus preparing an intermediate. (5) The intermediate after the conductive layer is formed is wound to prepare a helical fiber conductive material. The helical shape of the helical fiber conductive material is a cylindrical helix with a pitch of 50μm~500μm or 20nm~300nm; the outer diameter of the helix is ​​50μm~500μm or 20nm~300nm.

[0132] Preparation Example 3

[0133] Example 3 provides a braided mesh fiber conductive material and its preparation method. The preparation steps of the braided mesh fiber conductive material are as follows:

[0134] (1) Provide linear matrix fibers with a diameter of 5 nm to 100 μm. (2) Perform plasma cleaning on the matrix fibers. The plasma cleaning process parameters include: power of 100 W to 500 W, chamber pressure of 1 Pa to 30 Pa, cleaning gas of argon, gas flow rate of 10 sccm to 100 sccm, and cleaning time of 1 min to 10 min. (3) Prepare the metal slurry according to the following mass proportions: 8 parts of nano-conductive silver metal, 6 parts of waterborne polyurethane resin, 0.8 parts of dispersant (sodium dodecylbenzene sulfonate), 0.8 parts of leveling agent (polydimethylsiloxane), 5 parts of conductive polymer (composed of poly(3,4-ethylenedioxythiophene) and sodium polystyrene sulfonate in a mass ratio of 1:2) and 79.4 parts of water. (4) The plasma-cleaned matrix fibers are immersed in a metal slurry and baked for aging (temperature 80℃~150℃, time 10min~180min) to form a conductive layer, thus preparing an intermediate. (5) The intermediate after the conductive layer is formed is woven to prepare a woven mesh fiber conductive material. The porosity of the woven mesh fiber conductive material is 20%~50%.

[0135] Preparation Example 4

[0136] Preparation Example 4 is basically the same as Preparation Example 1, except that Preparation Example 4 does not include step (3). In step (5) of Preparation Example 4, the matrix fiber is directly immersed in the metal slurry.

[0137] Preparation Example 5

[0138] Preparation Example 5 is basically the same as Preparation Example 1, the main difference being that step (4) in Preparation Example 5 is different from that in Preparation Example 1. Step (4) in Preparation Example 5 is as follows:

[0139] The metal slurry was prepared according to the following mass proportions: 8 parts of nano-conductive silver metal, 6 parts of waterborne polyurethane resin, 0.8 parts of dispersant (sodium dodecylbenzenesulfonate), 0.8 parts of leveling agent (polydimethylsiloxane), and 84.4 parts of water.

[0140] Examples 1 to 5

[0141] Examples 1 to 5 provide conductive materials and their preparation methods. Examples 1 to 5 are basically the same, with the main difference being that: Example 1 uses the spiral fiber conductive material from Example 1, Example 2 uses the spiral fiber conductive material from Example 2, Example 3 uses the woven mesh fiber conductive material from Example 3, Example 4 uses the woven mesh fiber conductive material from Example 4, and Example 5 uses the woven mesh fiber conductive material from Example 5.

[0142] The preparation steps of the conductive diaphragms in Examples 1 to 5 are as follows:

[0143] (1) The above-mentioned spiral fiber conductive material or woven mesh fiber conductive material and elastic polymer (silicone rubber) are mixed to prepare an elastomer-based conductive slurry. In the elastic-based conductive slurry, the mass fraction of elastic polymer is 75%.

[0144] (2) Apply the elastomer-based conductive paste to the preset position of the diaphragm mold, and apply the material of the diaphragm body (silicone rubber) to the non-preset position of the diaphragm mold; after vulcanization, form Figure 4 The structure shown is a one-piece molded conductive diaphragm.

[0145] This application reveals that the conductive diaphragms prepared in Examples 1 to 5 significantly reduce resistance under tension compared to conventional techniques using the same amount of linear metal filler. Furthermore, compared to conventional techniques using the same amount of linear metal filler, the conductive parts of these diaphragms have lower mass, resulting in a smaller impact of the conductive diaphragms prepared in Examples 1 to 5 on the resonant frequency. Testing revealed that the resonant frequency shift rate of the conductive diaphragms in Examples 1 to 5 at a 15% stretching rate is only 1.2% to 3.0%, far lower than the 5.5% to 8.8% of conventional solutions.

[0146] Comparing Examples 1 and 4, it was found that plasma treatment of the matrix fiber resulted in a stronger adhesion between the conductive layer and the matrix fiber. In the tensile test, the conductive diaphragm in Example 1 exhibited a lower rate of resistance change and a lower resonant frequency shift.

[0147] Comparing Examples 1 and 5, it was found that the addition of a conductive polymer to the metal slurry resulted in a lower rate of change of resistance and a lower resonant frequency shift in the conductive diaphragm of Example 1 during the tensile test.

[0148] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0149] The embodiments described above are merely illustrative of several implementation methods of this application, intended to facilitate a detailed understanding of the technical solutions of this application, but should not be construed as limiting the scope of protection of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. It should be understood that technical solutions obtained by those skilled in the art based on the technical solutions provided in this application through logical analysis, reasoning, or limited experimentation are all within the scope of protection of the appended claims. Therefore, the scope of protection of this patent application should be determined by the content of the appended claims, and the specification can be used to interpret the content of the claims.

Claims

1. A conductive diaphragm, characterized in that, It includes a diaphragm body and a conductive part, wherein the conductive part is at least partially embedded in the diaphragm body and / or the conductive part is disposed on the surface of the diaphragm body; The conductive part includes one or more of helical fiber conductive materials and woven mesh fiber conductive materials; The spiral fiber conductive material and the woven mesh fiber conductive material each independently include a matrix fiber and a conductive layer covering the surface of the matrix fiber.

2. The conductive diaphragm according to claim 1, characterized in that, The matrix fiber is made of one or more of polyester, polyamide, polyacrylonitrile, and polypropylene. The conductive layer comprises the following components by mass: 5 to 10 parts of nano-conductive metal, 0.2 to 8 parts of resin, 0 to 2 parts of functional additives, and 0 to 10 parts of conductive polymer.

3. The conductive diaphragm according to claim 2, characterized in that, The conductive layer has one or more of the following characteristics: (1) The material of the nano-conductive metal includes one or more of silver, copper and aluminum; (2) The resin includes one or more of polyurethane, polyetheretherketone, and thermoplastic polyester elastomer; (3) The functional additives include one or more of the following: dispersants, binders, leveling agents, thickeners, defoamers, preservatives, and pH adjusters; (4) The conductive polymer includes one or more of poly(3,4-ethylenedioxythiophene) and sodium polystyrene sulfonate.

4. The conductive diaphragm according to any one of claims 1 to 3, characterized in that, The conductive diaphragm has one or more of the following characteristics: (1) The diameter of the matrix fiber is 5 nm to 100 μm; (2) The thickness of the conductive layer is 10 nm to 50 μm; (3) The spiral morphology of the spiral fiber conductive material includes one or more of the following: cylindrical spiral, conical spiral, DNA-like double-wound spiral and fractal spiral structure; (4) The pitch of the spiral fiber conductive material is 50μm~500μm or 20nm~300nm; (5) The outer diameter of the spiral fiber conductive material is 50μm~500μm or 20nm~300nm; (6) The porosity of the woven mesh fiber conductive material is 20%~50%; (7) The material of the diaphragm body includes one or more of polyetheretherketone, thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, silicone rubber, ethylene-acrylate rubber, acrylate rubber and hydrogenated nitrile rubber.

5. The conductive diaphragm according to any one of claims 1 to 3, characterized in that, When the conductive part is disposed on the surface of the diaphragm body, the conductive part further includes an elastic polymer; In the conductive part, the mass fraction of the elastic polymer is 70%~80%; Optionally, the elastic polymer includes one or more of polyetheretherketone, thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, silicone rubber, ethylene-acrylate rubber, acrylate rubber, and hydrogenated nitrile rubber.

6. The conductive diaphragm according to claim 5, characterized in that, A first dielectric layer is further provided between the conductive part and the diaphragm body; optionally, the material of the first dielectric layer includes one or more of polyetheretherketone, thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, silicone rubber, ethylene-acrylate rubber, acrylate rubber, and hydrogenated nitrile rubber; and / or, A second dielectric layer is further provided on the surface of the conductive part away from the diaphragm body; optionally, the material of the second dielectric layer includes one or more of polyetheretherketone, thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, silicone rubber, ethylene-acrylate rubber, acrylate rubber and hydrogenated nitrile rubber.

7. A method for preparing a conductive diaphragm according to any one of claims 1 to 6, characterized in that, Includes the following steps: A conductive diaphragm is prepared by integrally molding the material of the conductive part and the material of the diaphragm body; wherein, at least a portion of the conductive part is embedded in the diaphragm body. or, The material of the conductive part is prepared into a conductive paste; the conductive paste and the diaphragm body are composite molded to prepare the conductive diaphragm; wherein the conductive part of the conductive diaphragm is disposed on the surface of the diaphragm body; The conductive part includes one or more of the spiral fiber conductive material and the braided mesh fiber conductive material; the spiral fiber conductive material and the braided mesh fiber conductive material each independently include a matrix fiber and a conductive layer covering the surface of the matrix fiber.

8. The method for preparing a conductive diaphragm according to claim 7, characterized in that, The preparation steps of the spiral fiber conductive material and the braided mesh fiber conductive material include: A matrix fiber is provided, and a metal paste is coated on the surface of the matrix fiber. After baking and aging or ultraviolet curing, a conductive layer is formed.

9. The method for preparing a conductive diaphragm according to claim 8, characterized in that, The metal paste comprises, by weight parts: 5 to 10 parts of nano-conductive metal, 0.2 to 8 parts of resin, 0 to 2 parts of functional additives, 0 to 10 parts of conductive polymer, and 50 to 90 parts of solvent; and / or, The coating methods include one or more of spraying and immersion.

10. The method for preparing the conductive diaphragm according to claim 8 or 9, characterized in that, The preparation steps of the spiral fiber conductive material include: providing a matrix fiber, coating the surface of the matrix fiber with a metal paste, baking and aging or ultraviolet curing to form a conductive layer; and winding the matrix fiber with the conductive layer to prepare the spiral fiber conductive material. Alternatively, the preparation steps of the spiral fiber conductive material include: providing a matrix fiber, winding the matrix fiber into a spiral shape; then, coating the surface of the matrix fiber with a metal paste, and subjecting it to baking aging or ultraviolet curing to form a conductive layer, thereby preparing the spiral fiber conductive material; and / or, The preparation steps of the braided mesh fiber conductive material include: providing a matrix fiber, coating the surface of the matrix fiber with a metal paste, baking and aging or ultraviolet curing to form a conductive layer; and braiding the matrix fiber with the conductive layer to prepare the braided mesh fiber conductive material. or, The preparation steps of the braided mesh fiber conductive material include: providing a matrix fiber, weaving the matrix fiber into a braided mesh; then, coating the surface of the matrix fiber with a metal paste, and baking and aging or ultraviolet curing to form a conductive layer, thereby preparing the braided mesh fiber conductive material.

11. A sound-generating device, characterized in that, The sound-generating device includes the conductive diaphragm according to any one of claims 1 to 6; or includes the conductive diaphragm prepared by the preparation method according to any one of claims 7 to 10.

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