Stacked inductor-capacitor integrated packaging module and preparation method thereof
By using a stacked structure and topology conversion layer design, the problem of separate layout of inductors and capacitors is solved, achieving efficient integration of inductors and capacitors and flexible topology switching, which is suitable for power system design in compact spaces such as AI servers.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 联振电子(中山)有限公司
- Filing Date
- 2026-01-27
- Publication Date
- 2026-05-08
AI Technical Summary
In the existing technology, the separate layout of inductors and capacitors results in high space occupancy, high cost, and a fixed and simple topology, making it impossible to flexibly configure LC parallel or LC series resonance.
A stacked structure is adopted, inductor modules, capacitor modules and topology conversion layer are stacked. The electrical topology state switching between inductors and capacitors is realized through the connection components on the topology conversion layer, including an electrical isolation layer and a magnetic shielding layer to avoid magnetic field coupling. The connection method between inductors and capacitors is changed by rotating the topology conversion layer.
It achieves efficient integration of inductors and capacitors, reduces space occupation and production costs, provides dynamic switching between series and parallel connection modes of inductors and capacitors, improves the flexibility of use, and overcomes the fixed drawbacks of traditional LC circuit topologies.
Smart Images
Figure CN122002701A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electronic device technology, and in particular to a stacked inductor-capacitor integrated packaging module and its preparation method. Background Technology
[0002] With the rapid development of artificial intelligence technology, the computing power demand of AI chips is growing exponentially. The corresponding multiphase power supply systems need to simultaneously meet the requirements of high power density, low ripple, fast dynamic response, and compact installation space. In traditional multiphase power supply designs, inductors and output capacitors, as core energy storage components, are typically packaged separately and require independent soldering pads on the PCB board.
[0003] This discrete layout has two major problems: First, it has a high space occupancy rate. Discrete inductors and capacitors require separate installation areas on the PCB board, and a certain distance must be maintained to ensure electrical performance, which makes it difficult to meet the space-constrained design requirements of AI servers. Second, it is difficult to balance cost and performance. In order to reduce parasitic parameters between discrete components, high-precision wiring or additional shielding structures are required, which increases the complexity of PCB design. At the same time, the increase in component procurement and soldering processes also drives up the overall production cost.
[0004] Chinese patent application No. 2022107480324 discloses a layered resonator with alternating and odd-even capacitor and inductor layers. The resonator includes a capacitor, an inductor, a first port, and a second port fabricated on a substrate. The resonator consists of multiple layers of capacitors and inductors stacked in parallel and positioned between the first and second ports. The inductors are located inside the capacitors. Each capacitor layer, located between the top and bottom layers, has a defect structure. Vias of the inductors pass perpendicularly through the defect structure and connect to inductors in adjacent layers. In this invention, the capacitors and inductors occupy only the planar area of a single component, exhibiting high integration, small size, high temperature resistance, and integrated fabrication. It can be applied to the design of passive devices such as filters and couplers with series and parallel capacitor and inductor structures.
[0005] Chinese patent application No. 2018800810965 discloses a three-dimensional inductor-capacitor device and its fabrication method, relating to a device comprising multiple stacked metal layers arranged in a helical shape. The multiple stacked metal layers include: a first metal layer including a first inductor; a second metal layer including multiple first pads and multiple second pads; a third metal layer including multiple third pads and multiple fourth pads; a fourth metal layer including a second inductor; multiple first vias configured to couple the first metal layer to the second metal layer; multiple second vias configured to couple the second metal layer to the third metal layer; multiple third vias configured to couple the third metal layer to the fourth metal layer; and a dielectric layer at least partially surrounding the device. The capacitor is formed by any one of the multiple stacked metal layers separated only by the dielectric layer, and any other one of the multiple stacked metal layers, wherein the capacitor is coupled in parallel with the first inductor and the second inductor.
[0006] In the patent solutions with application numbers 2022107480324 and 201880081095, inductors and capacitors are stacked in different ways. Although this stacking method allows the two components, capacitor and inductor, to occupy only one component size, making the most of three-dimensional space and achieving miniaturization and high integration of the resonator, it inevitably causes the alternating magnetic field generated when the inductor is working to couple to the adjacent capacitor plates, causing problems such as capacitor dielectric polarization disturbance, induced eddy current loss, resonant frequency shift or instability. Moreover, the electrical connection structure of the inductor and capacitor is interlocked and restrictive, making it impossible to reconstruct the connection method. This results in a fixed electrical topology of the stacked inductor and capacitor, which cannot be flexibly configured as LC parallel resonance or LC series resonance as discrete inductor and capacitor.
[0007] In summary, there is an urgent need for a stacked inductor-capacitor integrated packaging module and its fabrication method that can not only achieve integrated packaging of inductors and capacitors, but also avoid the influence of magnetic fields on capacitors, and flexibly change the electrical topology between capacitors and inductors. Summary of the Invention
[0008] In view of the problems of integrated capacitor-inductor coupling and fixed and single topology in existing technologies, a stacked inductor-capacitor integrated packaging module is proposed.
[0009] To solve the above problems, the technical solution of the present invention is as follows: A stacked inductor-capacitor integrated packaging module includes an inductor module, a capacitor module, and a topology transition layer. The inductor module, the topology transition layer, and the capacitor module are stacked and packaged together. The topology transition layer electrically isolates the inductor module and the capacitor module. The topology transition layer is provided with a first topology connection component and a second topology connection component. The first topology connection component or the second topology connection component is used for electrical connection between the inductor module and the capacitor module. When the inductor module and the capacitor module are connected through the first topology connection component, it is a first electrical topology state. When the inductor module and the capacitor module are connected through the second topology connection component, it is a second electrical topology state. The first electrical topology state and the second electrical topology state are switchable.
[0010] As a preferred technical solution, the topology conversion layer includes an electrical isolation layer and a magnetic shielding layer, wherein the magnetic shielding layer is located between the two electrical isolation layers.
[0011] As a preferred technical solution, the inductor module has a square structure, including a first inductor connecting plate and a second inductor connecting plate, with the first inductor connecting plate and the second inductor connecting plate facing each other.
[0012] As a preferred technical solution, the capacitor module is a square structure adapted to the inductor module, including a first capacitor connection plate and a second capacitor connection plate, with the first capacitor connection plate and the second capacitor connection plate facing each other.
[0013] As a preferred technical solution, the ends of the first capacitor connecting plate and the first inductor connecting plate are opposite each other, and the ends of the second capacitor connecting plate and the second inductor connecting plate are opposite each other.
[0014] As a preferred technical solution, the inductor module is encapsulated in a plastic package, and a first track groove is provided at the bottom of the plastic package; the capacitor module is encapsulated in a plastic package, and a second track groove is provided at the top of the plastic package, with the first track groove and the second track groove facing each other.
[0015] As a preferred technical solution, the two ends of the first topology connection component and the second topology connection component protrude and engage with the first track groove and the second track groove.
[0016] In view of the problems of integrated capacitor-inductor coupling and fixed and single topology in existing technologies, a method for fabricating stacked inductor-capacitor integrated packaging modules is proposed.
[0017] To solve the above problems, the technical solution of the present invention is as follows: A method for fabricating a stacked inductor-capacitor integrated package module, the method comprising the following steps: Step S10: encapsulating an inductor module; Step S20: encapsulating a capacitor module; Step S30: stacking the inductor module, a topology transition layer, and a capacitor module, wherein the topology transition layer is located between the inductor module and the capacitor module; wherein the topology transition layer is rotatable relative to the capacitor module and the inductor module.
[0018] As a preferred technical solution, the rotation of the topology conversion layer changes the electrical topology connection state between the inductor module and the capacitor module.
[0019] The beneficial effects of this invention are: The stacked inductor-capacitor integrated packaging module and its fabrication method described in this invention adopt a "stacked" structure, integrating the inductor and output capacitor in the vertical direction. Its total thickness in the vertical direction is only about 80% of the sum of the individual thicknesses of the inductor and capacitor, which can easily adapt to the compact installation space inside AI servers, preserving space utilization efficiency. At the same time, a topology conversion layer is set to realize dynamic switching of the series / parallel connection mode of the inductor and capacitor, significantly reducing production costs and greatly improving the flexibility of use. By using the stacked inductor-capacitor integrated packaging module described in this invention, the drawbacks of the fixed topology of traditional LC circuits are overcome, and the connection method can be flexibly reconfigured at the physical level. It can be applied to the design of reconfigurable RF front-ends, adaptive power management, or intelligent filters.
[0020] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0021] Figure 1 This is a three-dimensional schematic diagram of the stacked inductor-capacitor integrated packaging module described in this invention; Figure 2 This is an exploded view of the stacked inductor-capacitor integrated packaging module described in this invention; Figure 3 This is a schematic diagram of the inductor and capacitor modules inside the plastic package; Figure 4 This is a schematic diagram of the topology conversion layer structure of the stacked inductor-capacitor integrated packaging module described in this invention; Figure 5 This is a cross-sectional schematic diagram of the inductor module, capacitor module, and topology transition layer in the first topological state of the present invention; Figure 6 This is a cross-sectional schematic diagram of the inductor module, capacitor module, and topology transition layer in the second topology state of the present invention; Figure 7This is a schematic diagram of the capacitor encapsulation body of the stacked inductor-capacitor integrated packaging module described in this invention; Figure 8 This is a schematic diagram of the rotation state of the topology transformation layer described in this invention; Figure 9 A simplified schematic diagram of the stacked inductor-capacitor integrated package module with control switch; Figure 10 This is a simplified circuit diagram of the first and second topology states with control switches.
[0022] The reference numerals and components involved in the accompanying drawings are shown below: 1. Inductor module; 2. Capacitor module; 3. Topology conversion layer; 4. Capacitor encapsulation; 5. Inductor encapsulation; 11. First inductor connecting plate; 12. Second inductor connecting plate; 21. First capacitor connecting plate; 22. Second capacitor connecting plate; 31. Electrical isolation layer; 32. Magnetic shielding layer; 33. First topology connection assembly; 34. Second topology connection assembly; 41. Second track slot; 51. First track slot; 111. First inductor switch; 121. Second inductor switch; 211. First capacitor switch; 221. Second capacitor switch. Detailed Implementation
[0023] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0024] Please see the appendix Figure 1 Appendix Figure 2 Appendix Figure 3 , Figure 1 This is a three-dimensional schematic diagram of the stacked inductor-capacitor integrated packaging module described in this invention. Figure 2 This is an exploded view of the stacked inductor-capacitor integrated packaging module described in this invention. Figure 3This is a schematic diagram of an inductor module and a capacitor module within a plastic encapsulation. A stacked inductor-capacitor integrated encapsulation module includes an inductor module 1, a capacitor module 2, and a topology transition layer 3. The inductor module 1 is entirely encapsulated using a high-temperature resistant, highly insulating encapsulating material such as epoxy resin or phenolic resin through a mold injection molding process to form an inductor encapsulation body 5. The inductor encapsulation body 5 can fix the relative position of the inductor module 1 and prevent the intrusion of external impurities. Similarly, the capacitor module 2 is entirely encapsulated using a high-temperature resistant, highly insulating encapsulating material such as epoxy resin or phenolic resin through a mold injection molding process to form a capacitor encapsulation body 4. The capacitor encapsulation body 4 can fix the relative position of the capacitor module 2 and prevent the intrusion of external impurities.
[0025] See appendix again Figure 3 In this embodiment, the inductor module 1 and the inductor encapsulation 5 have a square cross-section. In some embodiments, they can also be circular. The inductor module 1 includes a square spiral coil. A first inductor connecting plate 11 and a second inductor connecting plate 12 are connected to the two ends of the coil, respectively. The first inductor connecting plate 11 and the second inductor connecting plate 12 are located on opposite sides of the square structure. Both ends of the first inductor connecting plate 11 and the second inductor connecting plate 12 are exposed outside the inductor encapsulation 5. That is, there are four contact surfaces on the inductor encapsulation 5 that can be electrically connected.
[0026] Correspondingly, the cross-section of the capacitor module 2 and the capacitor encapsulation body 4 is a square structure that is adapted to the inductor module 1 and the inductor encapsulation body 5 respectively. The capacitor module 2 includes two facing plates, which are isolated from each other to form a capacitor structure. A first capacitor connection plate 21 and a second capacitor connection plate 22 are connected to the two plates respectively. The first capacitor connection plate 21 and the second capacitor connection plate 22 are located on opposite sides, and both ends of the first capacitor connection plate 21 and the second capacitor connection plate 22 are exposed outside the capacitor encapsulation body 4. That is, there are four contact surfaces on the capacitor encapsulation body 4 that can be electrically connected.
[0027] Please see the appendix Figure 4 Appendix Figure 5 , Figure 4 This is a schematic diagram of the topology transition layer structure of the stacked inductor-capacitor integrated packaging module described in this invention. Figure 5This is a cross-sectional schematic diagram of the inductor module, capacitor module, and topology transition layer in the first topology state of the present invention. A topology transition layer 3 is provided between the stacked capacitor module 2 and the inductor module 1. Preferably, the topology transition layer 3 includes an electrical isolation layer 31 and a magnetic shielding layer 32. The magnetic shielding layer 32 can be a permalloy or copper shielding layer, and the electrical isolation layer 31 can be a non-conductive epoxy resin material. The area of the magnetic shielding layer 32 is larger than the area of the electrode plate, used to prevent the alternating magnetic field in the inductor module 1 from coupling to the adjacent electrode plate of the capacitor module 2, thereby avoiding dielectric polarization disturbances and induced eddy currents in the capacitor. To address issues such as power loss, resonant frequency shift, or instability, the magnetic shielding layer 32 is sandwiched between the electrical isolation layers 31 at both ends. The electrical isolation layers 31 isolate the electrical connection between the capacitor module 2 and the inductor module 1. Furthermore, a first topology connection component 33 and a second topology connection component 34 are provided on the topology conversion layer 3. Either the first topology connection component 33 or the second topology connection component 34 is used for the electrical connection between the inductor module 1 and the capacitor module 2. When the inductor module 1 and the capacitor module 2 are connected through the first topology connection component 33, it is in a first electrical topology state. (See appendix for details.) Figure 6 , Figure 6 This is a cross-sectional view of the inductor module, capacitor module, and topology transition layer in the second topology state of the present invention. When the inductor module 1 and the capacitor module 2 are connected through the second topology connection component 34, it is the second electrical topology state. The first electrical topology state and the second electrical topology state are switchable. It should be understood that the switching between the first electrical topology state and the second electrical topology state is a physical switching, that is, by rotating the topology rotation layer relative to the relative position between the inductor module 1 and the capacitor module 2, the connection between the inductor module 1 and the capacitor module 2 is switched from being connected through the first topology connection component 33 to being connected through the second topology connection component 34, and this switching can be repeated. In this embodiment, the first topology connection state is an inductor-capacitor series resonance, and the second topology connection state is an inductor-capacitor parallel resonance.
[0028] To enable flexible switching between the first and second topology connection states, please refer to the appendix again. Figure 2 Appendix Figure 7 , Figure 7This is a schematic diagram of the capacitor encapsulation body of the stacked inductor-capacitor integrated packaging module of the present invention. In this embodiment, preferably, a first track groove 51 is provided at the bottom of the inductor encapsulation body 5, and a second track groove 41 is provided at the upper end of the capacitor encapsulation body 4. The first track groove 51 and the second track groove 41 are corresponding three-quarter annular grooves or circular grooves. One side of each of the first inductor connecting plate 11 and the second inductor connecting plate 12 is exposed in the first track groove 51, and the electrical connection ends of each side of the first capacitor connecting plate 21 and the second capacitor connecting plate 22 are exposed in the second track groove 41. The bottom of the inductor encapsulation body 5 is in contact with an electrical isolation layer 31 of the topology conversion layer 3, and the other end of the electrical isolation layer 31 of the topology conversion layer 3 is in contact with the upper end of the capacitor encapsulation body 4. The first topology connection component 33 is a conductive electrode post passing through the two electrical isolation layers 31. The two ends of the conductive electrode post protrude from the surface of the topology conversion layer 3 and are respectively located in the first track groove 51 and the second track groove 41. Please refer to the attached drawing. Figure 8 , Figure 8 This is a schematic diagram of the rotation state of the topology conversion layer described in this invention. When the topology conversion layer 3 is rotated, the conductive electrode posts move along the first track groove 51 and the second track groove 41. It should be understood that the capacitor encapsulation body 4, the inductor encapsulation body 5 and the corresponding electrical isolation layer 31 can be connected in the vertical direction by a rotational snap-fit method.
[0029] Please see again Figure 4 , Figure 5 , Figure 6 A second topology connection component 34 is provided at a position 90 degrees away from the first topology connection component 33. The second topology connection component 34 consists of two conductive electrode posts that pass through the electrical isolation layer 31. The two ends of the conductive electrode posts also protrude from the surface of the topology conversion layer 3 and are located in the first track groove 51 and the second track groove 41, respectively.
[0030] See appendix again Figure 5 When in the first topology state, i.e., the inductor-capacitor series connection state, the first topology connection component 33 is located between the first inductor connection plate 11 and the first capacitor connection plate 21, and the upper and lower ends of the conductive electrode post of the first topology connection component 33 are electrically connected to the first inductor connection plate 11 and the first capacitor connection plate 21, respectively. The second topology connection component 34 is in an open circuit state with both the inductor module 1 and the capacitor module 2 at adjacent 90-degree positions. At this time, the inductor module 1 and the capacitor module 2 are connected in series through the first topology component, and its input / output electrode in the first topology state is one end of the second inductor connection plate 12 and the second capacitor connection plate 22.
[0031] When the second topology state is required, please refer to the appendix again. Figure 6Simply rotate the topology conversion layer 3 by 90 degrees to replace the first topology connection component 33 with the position of the second topology component. The two conductive electrode posts of the second topology component are respectively located between the first inductor connection plate 11 and the first capacitor connection plate 21, and between the second inductor connection plate 12 and the second capacitor connection plate 22, so that the inductor module 1 and the capacitor module 2 are in parallel. At this time, when the input electrode is one end of the first inductor connection plate 11 or the first capacitor connection plate 21, the output electrode is the second inductor connection plate 12 or the second capacitor connection plate 22. When the input electrode is one end of the second inductor connection plate 12 or the second capacitor connection plate 22, the output electrode is the first inductor connection plate 11 or the first capacitor connection plate 21.
[0032] Please see the appendix Figure 9 Appendix Figure 10 , Figure 9 A simplified schematic diagram of the stacked inductor-capacitor integrated package module with control switch; Figure 10 Here are simplified circuit diagrams for the first and second topology states with control switches. Figure 10 The left side of the circuit diagram represents the first topology state, and the right side represents the second topology state. In some preferred embodiments, to facilitate the application of the stacked inductor-capacitor integrated package module, the electrodes for connecting the first inductor connection plate 11, the second inductor connection plate 12, the first capacitor connection plate 21, and the second capacitor connection plate 22 to the external circuit are arranged on the same end face of the stacked inductor-capacitor integrated package module. For example, wires can be used to lead from each connection plate to the same end face to facilitate the connection between the module and the external circuit. For example, the module can be mounted on the corresponding circuit board through this end face. Preferably, a circuit opening / closing control switch is provided between each connection plate and the external electrical connection point. For distinction, the control switch connected to the first inductor connection plate 11 is named the first inductor switch 111, the control switch connected to the second inductor connection plate 12 is named the second inductor switch 121, the control switch connected to the first capacitor connection plate 21 is named the first capacitor switch 211, and the control switch connected to the second capacitor connection plate 22 is named the second capacitor switch 221. When switching between the first topology state and the second topology state, such as... Figure 10 As shown, the on / off state of each control switch is switched synchronously to realize the switching between the input electrode and the output electrode. It should be understood that the control switch can be a manual control switch, a surface mount micro switch, or an electromagnetic switch, etc.
[0033] In some preferred embodiments, the stacked inductor-capacitor integrated package module is fabricated using the following method: Step S10: Perform plastic encapsulation on inductor module 1; The welded inductor module 1, along with the first inductor connecting plate 11 and the second inductor connecting plate 12, is placed into a dedicated molding die. Molten molding material (such as epoxy resin) is injected, and the die is removed after the material has solidified, forming an inductor molding body 5 that encapsulates the inductor module 1. Preferably, the upper surface of the inductor molding body 5 is polished using precision grinding equipment to fully expose both ends (reserved electrical connection positions) of the first inductor connecting plate 11 and the second inductor connecting plate 12. During the polishing process, the thickness accuracy is strictly controlled to ensure consistent exposure height.
[0034] Step S20: Perform plastic encapsulation on capacitor module 2; The welded capacitor module 2, along with the first capacitor connecting plate 21 and the second capacitor connecting plate 22, is placed into a dedicated encapsulation mold. Molten encapsulation material is then injected, and the mold is removed after the material has solidified, forming a capacitor encapsulation body 4 that encapsulates the capacitor module 2. Preferably, the upper surface of the capacitor encapsulation body 4 is polished using precision grinding equipment to fully expose both ends of the first capacitor connecting plate 21 and the second capacitor connecting plate 22. During the polishing process, the thickness accuracy is strictly controlled to ensure consistent exposure height.
[0035] Step S30: Stack the inductor module 1, the topology conversion layer 3, and the capacitor module 2, wherein the topology conversion layer 3 is located between the inductor module 1 and the capacitor module 2; wherein the topology conversion layer 3 is rotatable relative to the capacitor module 2 and the inductor module 1.
[0036] The topology conversion layer 3 is used to connect the upper and lower inductor module 1 and capacitor module 2. The first topology connection component 33 and the second topology connection component 34 on it are used for electrical connection between the inductor module and the capacitor module 2. The rotation switching of the topology conversion layer 3 is achieved through the first topology connection component 33 or the second topology connection component 34, thereby changing the electrical topology connection state between the inductor module 1 and the capacitor module 2.
[0037] The stacked inductor-capacitor integrated packaging module and its fabrication method described in this invention adopt a "stacked" structure, integrating the inductor and output capacitor in the vertical direction. Its total thickness in the vertical direction is only about 80% of the sum of the individual thicknesses of the inductor and capacitor, which can easily adapt to the compact installation space inside the AI server, preserving space utilization efficiency. At the same time, a topology conversion layer 3 is set to realize the dynamic switching of the series / parallel connection mode of the inductor and capacitor. By using the stacked inductor-capacitor integrated packaging module described in this invention, the drawbacks of the fixed topology of traditional LC circuits are overcome, and the connection method can be flexibly reconfigured at the physical level. It can be applied to the design of reconfigured RF front-end, adaptive power management, or intelligent filters.
[0038] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several improvements and additions without departing from the principle of the present invention, and these improvements and additions should also be considered within the scope of protection of the present invention.
Claims
1. A stacked inductor-capacitor integrated packaging module, comprising an inductor module and a capacitor module, characterized in that, It also includes a topology conversion layer, in which the inductor module, the topology conversion layer, and the capacitor module are stacked and packaged. The topology conversion layer electrically isolates the inductor module and the capacitor module. The topology conversion layer is provided with a first topology connection component and a second topology connection component. The first topology connection component or the second topology connection component is used for electrical connection between the inductor module and the capacitor module. When the inductor module and the capacitor module are connected through the first topology connection component, it is a first electrical topology state. When the inductor module and the capacitor module are connected through the second topology connection component, it is a second electrical topology state. The first electrical topology state and the second electrical topology state can be switched.
2. The stacked inductor-capacitor integrated packaging module according to claim 1, characterized in that, The topology conversion layer includes an electrical isolation layer and a magnetic shielding layer, wherein the magnetic shielding layer is located between the two electrical isolation layers.
3. The stacked inductor-capacitor integrated packaging module according to claim 1, characterized in that, The inductor module has a square structure and includes a first inductor connection plate and a second inductor connection plate, with the first inductor connection plate and the second inductor connection plate facing each other.
4. The stacked inductor-capacitor integrated packaging module according to claim 3, characterized in that, The capacitor module is a square structure adapted to the inductor module, including a first capacitor connection plate and a second capacitor connection plate, with the first capacitor connection plate and the second capacitor connection plate facing each other.
5. The stacked inductor-capacitor integrated packaging module according to claim 4, characterized in that, The ends of the first capacitor connecting plate and the first inductor connecting plate are opposite each other, and the ends of the second capacitor connecting plate and the second inductor connecting plate are opposite each other.
6. The stacked inductor-capacitor integrated packaging module according to claim 1, characterized in that, The inductor module is encapsulated in a plastic package, and a first track groove is provided at the bottom of the plastic package; the capacitor module is encapsulated in a plastic package, and a second track groove is provided at the top of the plastic package, with the first track groove and the second track groove facing each other.
7. The stacked inductor-capacitor integrated packaging module according to claim 6, characterized in that, The first topology connection component and the second topology connection component have their two ends protruding and engaging within the first track groove and the second track groove, respectively.
8. A method for fabricating a stacked inductor-capacitor integrated packaging module, characterized in that, The preparation method is used to prepare the stacked inductor-capacitor integrated packaging module according to any one of claims 1-7; it includes the following steps: Step S10: Moldulate the inductor module; Step S20: Perform plastic encapsulation on the capacitor module; Step S30: Stack the inductor module, the topology conversion layer, and the capacitor module, wherein the topology conversion layer is located between the inductor module and the capacitor module; wherein the topology conversion layer is rotatable relative to the capacitor module and the inductor module.
9. The method for preparing a stacked inductor-capacitor integrated packaging module according to claim 9, characterized in that, The rotation of the topology conversion layer changes the electrical topology connection state between the inductor module and the capacitor module.