Cavity-free sensing packaging structure and manufacturing method thereof

Abstract

The invention discloses a cavity-free sensing packaging structure and a manufacturing method thereof. The cavity-free sensing packaging structure comprises a substrate, a sensing module arranged on the substrate, and a light-proof packaging body formed on the sensing module. The sensing module comprises a sensing chip installed on the substrate, a first transparent bonding layer bonded to the sensing chip, and first glass fixedly bonded to the first transparent bonding layer. The sensing chip is electrically coupled to the substrate, and the first transparent bonding layer covers a sensing area of the sensing chip. The sensing module is embedded in the light-proof packaging body, and at least part of the outer surface of the first glass is exposed out of the light-proof packaging body. Therefore, the sensing chip is adhered to the substrate through the first transparent bonding layer, so that the packaging body can replace an existing shell, the production cost of the cavity-free sensing packaging structure is further reduced, and the overall size is reduced.

Description

Technical Field

[0001] This invention relates to a sensing package structure, and more particularly to a cavity-free sensing package structure and its manufacturing method. Background Technology

[0002] Current optoelectronic packaging structures involve mounting glass within a housing and then encapsulating the optoelectronic components inside the housing. However, current optoelectronic packaging structures require the manufacture of corresponding molds for different housings, and their size is difficult to reduce effectively. Therefore, the inventors believed that these shortcomings could be improved, and through dedicated research and the application of scientific principles, finally proposed an invention with a rational design that effectively overcomes these deficiencies. Summary of the Invention

[0003] The present invention provides a cavity-free sensing packaging structure and its manufacturing method, which can effectively improve the defects that may occur in existing optoelectronic packaging structures.

[0004] This invention discloses a cavity-free sensing package structure, comprising: a substrate having an upper surface and a lower surface located on opposite sides; a sensing module disposed on the substrate and comprising: a sensing chip mounted on the upper surface of the substrate and electrically coupled to the substrate; wherein the top surface of the sensing chip has a sensing area; a first transparent adhesive layer bonded to the top surface of the sensing chip and covering the sensing area; a first glass bonded to the first transparent adhesive layer; wherein the first glass corresponds to a first spectral band; and a light-emitting module disposed on the substrate and spaced apart from the sensing module, the light-emitting module comprising: A light-emitting chip is mounted on the upper surface of a substrate, and a sensing chip is electrically coupled to the substrate; a second transparent adhesive layer is bonded to the light-emitting chip and covers the light-emitting surface of the light-emitting chip; a second glass is bonded to the second transparent adhesive layer, and the outer surface of the second glass is coplanar with the outer surface of the first glass; wherein the second glass corresponds to a second spectral band, which is different from the first spectral band; an opaque package is formed on the upper surface of the substrate, and the sensing module and the light-emitting module are embedded in the opaque package, while at least a portion of the outer surface of the first glass and at least a portion of the outer surface of the second glass are exposed outside the opaque package.

[0005] Optionally, the substrate includes at least one first bonding pad and at least one second bonding pad located on the upper surface, and the sensing chip has at least one first connection pad located on the top surface, while the light-emitting chip has at least one second connection pad adjacent to the light-emitting surface; wherein, the sensing module includes at least one first metal wire connecting at least one first bonding pad and at least one first connection pad, which is at least partially embedded within an opaque package; wherein, the light-emitting module includes at least one second metal wire connecting at least one second bonding pad and at least one second connection pad, which is at least partially embedded within an opaque package.

[0006] Optionally, at least one first metal wire is completely embedded within an opaque package.

[0007] Optionally, the sensing area includes a main segment and two sub-segments extending from the main segment, and at least one first connection pad is located within the area surrounded by the main segment and the two sub-segments; wherein, a projection area formed by the first glass projecting onto the top surface of the sensing chip covers the entire main segment but does not cover the two sub-segments and at least one first connection pad.

[0008] Optionally, the sensing area includes a main segment and two sub-segments extending from the main segment, and at least one first connecting pad is located within the area surrounded by the main segment and the two sub-segments; wherein, the first glass has an inner surface located on the opposite side of the outer surface and a relief groove recessed from the inner surface, and at least one first metal wire is partially located within the relief groove; wherein, a projection area formed by the first glass projecting onto the top surface of the sensing chip covers the entire main segment, the two sub-segments, and at least one first connecting pad.

[0009] Optionally, the outer edge of the first glass is flush with the outer edge of the first transparent adhesive layer, and the outer edge of the second glass is flush with the outer edge of the second transparent adhesive layer.

[0010] Alternatively, no cavities are formed inside the cavity-free sensing package structure.

[0011] This invention also discloses a method for manufacturing a cavity-free sensing package structure, comprising: a die placement step: mounting a sensing chip and a light-emitting chip spaced apart on an upper surface of a substrate; a bonding step: bonding a first glass to the sensing area of ​​the sensing chip with a first transparent adhesive layer and defining them together as a sensing module, bonding a second glass to the light-emitting surface of the light-emitting chip with a second transparent adhesive layer and defining them together as a light-emitting module, and making the outer surface of the second glass coplanar with the outer surface of the first glass; wherein the first glass corresponds to a first spectral band, and the second glass corresponds to a second spectral band, which is different from the first spectral band; and a packaging step: forming an opaque package on the upper surface of the substrate, and embedding the sensing module and the light-emitting module within the opaque package, while at least a portion of the outer surface of the first glass and at least a portion of the outer surface of the second glass are exposed outside the opaque package.

[0012] Optionally, in the bonding step, a first optical adhesive is formed by dispensing glue on the sensing area of ​​the sensing chip and a second optical adhesive is formed by dispensing glue on the light-emitting surface of the light-emitting chip. Then, the first glass is bonded to the first optical adhesive and the second glass is bonded to the second optical adhesive. The first optical adhesive and the second optical adhesive are then cured to form a first transparent adhesive layer and a second transparent adhesive layer, respectively.

[0013] Optionally, the method for manufacturing a cavity-free sensing package structure further includes a pre-step before the bonding step: attaching a first optical adhesive film to a first glass layer, and then cutting the first glass layer and the first optical adhesive film to form a plurality of first glass layers that are separated from each other and a plurality of first transparent adhesive layers that are respectively attached to the plurality of first glass layers; in the bonding step, a first glass layer is bonded to the sensing area of ​​the sensing chip by the first transparent adhesive layer attached thereto.

[0014] Optionally, in the pre-step, a second optical adhesive film is attached to a second glass layer, and then the second glass layer and the second optical adhesive film are cut to form a plurality of second glass layers that are separated from each other and a plurality of second transparent adhesive layers that are respectively attached to the plurality of second glass layers; in the bonding step, a second glass layer is bonded to the light-emitting surface of the light-emitting chip by the second transparent adhesive layer attached thereto.

[0015] This invention also discloses a method for manufacturing a cavity-free sensing package structure, comprising: a modularization step: bonding a first glass to each of a plurality of default sensing regions of a first wafer through a first transparent adhesive layer, and dicing the first wafer to form a plurality of mutually separated sensing chips, each including a default sensing region; wherein each sensing chip and the first transparent adhesive layer disposed thereon, together with the first glass, are defined as a sensing module; a die placement step: mounting the sensing chip of a sensing module and a light-emitting module spaced apart from each other on a top surface of a substrate; wherein the light-emitting module includes a light-emitting chip mounted on the top surface, a second transparent adhesive layer bonded to the light-emitting chip, and a second glass bonded to the second transparent adhesive layer; wherein the first glass corresponds to a first spectral band, and the second glass corresponds to a second spectral band, which is different from the first spectral band; and a packaging step: forming an opaque package on the top surface of the substrate, and embedding the sensing module and the light-emitting module within the opaque package, while at least a portion of the outer surface of the first glass and at least a portion of the outer surface of the second glass are exposed outside the opaque package.

[0016] Optionally, in the modularization step, adhesive is applied to multiple default sensing areas of the first wafer to form multiple first optical adhesives spaced apart from each other, and then multiple first glass pieces are respectively bonded to the multiple first optical adhesives, and then the multiple first optical adhesives are cured to form multiple first transparent adhesive layers.

[0017] Optionally, in the modularization step, a first optical colloid covering multiple default sensing areas is coated and formed on the first wafer, and then multiple first glass pieces are respectively bonded to the first optical colloid with their positions corresponding to the multiple default sensing areas. The portions of the first optical colloid that are not in contact with the multiple first glass pieces are removed, so that the first optical colloid forms multiple first transparent adhesive layers that are separated from each other.

[0018] Optionally, the first optical colloid is a photosensitive colloid.

[0019] This invention discloses a cavity-free sensing package structure, comprising: a substrate having an upper surface and a lower surface located on opposite sides; a sensing module disposed on the substrate and comprising: a sensing chip mounted on the upper surface of the substrate and electrically coupled to the substrate; wherein the top surface of the sensing chip has a sensing area; a first transparent adhesive layer bonded to the top surface of the sensing chip and covering the sensing area; a first glass bonded to the first transparent adhesive layer and corresponding to a first spectral band; and an opaque package formed on the upper surface of the substrate, wherein the sensing module is embedded within the opaque package, and at least a portion of the outer surface of the first glass is exposed outside the opaque package.

[0020] Optionally, the substrate includes at least one first bonding pad located on the upper surface, and the sensing chip has at least one first connecting pad located on the top surface; wherein the sensing module includes at least one first metal wire connecting at least one first bonding pad and at least one first connecting pad, which is at least partially embedded within an opaque package.

[0021] Optionally, at least one first metal wire is completely embedded within an opaque package.

[0022] Optionally, the sensing area includes a main segment and two sub-segments extending from the main segment, and at least one first connection pad is located within the area surrounded by the main segment and the two sub-segments; wherein, a projection area formed by the first glass projecting onto the top surface of the sensing chip covers the entire main segment but does not cover the two sub-segments and at least one first connection pad.

[0023] Optionally, the sensing area includes a main segment and two sub-segments extending from the main segment, and at least one first connecting pad is located within the area surrounded by the main segment and the two sub-segments; wherein, the first glass has an inner surface located on the opposite side of the outer surface and a relief groove recessed from the inner surface, and at least one first metal wire is partially located within the relief groove; wherein, a projection area formed by the first glass projecting onto the top surface of the sensing chip covers the entire main segment, the two sub-segments, and at least one first connecting pad.

[0024] In summary, the cavity-free sensing package structure and its manufacturing method disclosed in the embodiments of the present invention use a first transparent adhesive layer to bond the sensing chip to the substrate (and use a second transparent adhesive layer to bond the light-emitting chip to the substrate), so that the package can be used to effectively replace the existing shell, thereby reducing the production cost of the cavity-free sensing package structure and effectively reducing the overall size.

[0025] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description

[0026] Figure 1 This is a three-dimensional schematic diagram of the cavity-free sensing packaging structure of Embodiment 1 of the present invention.

[0027] Figure 2 for Figure 1 A schematic cross-sectional view along section line II-II.

[0028] Figure 3 for Figure 1 A top-down view.

[0029] Figure 4This is a cross-sectional schematic diagram of another aspect of the cavity-free sensing packaging structure according to Embodiment 1 of the present invention.

[0030] Figure 5 for Figure 4 A top view of a cavity-free sensing package structure.

[0031] Figure 6 This is a cross-sectional schematic diagram of another aspect of the cavity-free sensing packaging structure according to Embodiment 1 of the present invention.

[0032] Figure 7 for Figure 2 A cross-sectional view of a cavity-free sensing package structure without a light-emitting module.

[0033] Figure 8 for Figure 4 A cross-sectional view of a cavity-free sensing package structure without a light-emitting module.

[0034] Figure 9 This is a schematic diagram of the die placement step in the manufacturing method of the cavity-free sensing package structure according to Embodiment 1 of the present invention.

[0035] Figure 10 This is a schematic diagram (I) of the bonding steps in the manufacturing method of the cavity-free sensing package structure according to Embodiment 1 of the present invention.

[0036] Figure 11 This is a schematic diagram (II) of the bonding steps in the manufacturing method of the cavity-free sensing package structure according to Embodiment 1 of the present invention.

[0037] Figure 12 This is a schematic diagram (I) of the pre-processing steps of the manufacturing method of the cavity-free sensing packaging structure of Embodiment 2 of the present invention.

[0038] Figure 13 This is a schematic diagram (II) of the pre-processing steps of the manufacturing method of the cavity-free sensing packaging structure according to Embodiment 2 of the present invention.

[0039] Figure 14 This is a schematic diagram of the bonding steps in the manufacturing method of the cavity-free sensing package structure according to Embodiment 2 of the present invention.

[0040] Figure 15 This is a schematic diagram (I) of the modular steps of the manufacturing method of the cavity-free sensing package structure of Embodiment 3 of the present invention.

[0041] Figure 16 This is a schematic diagram (II) of the modular steps of the manufacturing method of the cavity-free sensing package structure of Embodiment 3 of the present invention.

[0042] Figure 17 This is a schematic diagram of the die placement step in the manufacturing method of the cavity-free sensing package structure according to Embodiment 3 of the present invention.

[0043] Figure 18 This is a schematic diagram (I) of the modular steps of the manufacturing method of the cavity-free sensing package structure of Embodiment 4 of the present invention.

[0044] Figure 19 This is a schematic diagram (II) of the modular steps of the manufacturing method of the cavity-free sensing package structure of Embodiment 4 of the present invention.

[0045] Figure 20 This is a schematic diagram (III) of the modular steps of the manufacturing method of the cavity-free sensing package structure of Embodiment 4 of the present invention. Detailed Implementation

[0046] The following specific embodiments illustrate the implementation of the "cavity-free sensing packaging structure and its manufacturing method" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0047] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or features, these components or features should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one feature from another. Furthermore, the term "or" as used in this document should, as appropriate, include any combination of one or more related listed items.

[0048] [Example 1]

[0049] Please see Figures 1 to 11 As shown, this is an embodiment of the present invention. Figures 1 to 3 As shown, this embodiment discloses a cavity-free sensing package structure 100, which includes a substrate 1, a sensing module 2 mounted on the substrate 1, a light-emitting module 3 mounted on the substrate 1 and adjacent to the sensing module 2, and an opaque package 4 formed on the substrate 1.

[0050] It should be noted that, in this embodiment, the cavity-free sensing package structure 100 is defined as having no cavities. Therefore, any package structure with cavities is different from the cavity-free sensing package structure 100 referred to in this embodiment. The structure of each component of the cavity-free sensing package structure 100 will be described below, followed by an explanation of their connection relationships.

[0051] In this embodiment, the substrate 1 is square or rectangular, but the present invention is not limited thereto. The substrate 1 has an upper plate surface 11 and a lower plate surface 12 located on opposite sides. The substrate 1 has a first die-bonding region 111 and a second die-bonding region 112 that are adjacent to each other and spaced apart on the upper plate surface 11. The substrate 1 also has at least one first bonding pad 113 and at least one second bonding pad 114 located on the upper plate surface 11.

[0052] In this embodiment, at least one first bonding pad 113 is adjacent to the first die-bonding region 111, and at least one second bonding pad 114 is adjacent to the second die-bonding region 112. Optionally, at least one first bonding pad 113 and at least one second bonding pad 114 may be located on two outer sides of the first die-bonding region 111 and the second die-bonding region 112, respectively, away from each other. Furthermore, the number of each of the at least one first bonding pad 113 and at least one second bonding pad 114 can be adjusted and varied according to actual needs, and this invention is not limited thereto.

[0053] In this embodiment, the sensing module 2 includes a sensing chip 21 mounted on the substrate 1, a first transparent adhesive layer 22 bonded to the sensing chip 21, a first glass 23 bonded to the first transparent adhesive layer 22, and at least one first metal line 24 electrically coupling the substrate 1 and the sensing chip 21.

[0054] It should be noted that the sensing chip 21 is mounted on the upper surface 11 of the substrate 1 (e.g., the first die-bonding region 111), and in this embodiment, the sensing chip 21 is electrically coupled to the substrate 1 via at least one first metal line 24, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the sensing chip 21 may be mounted on the substrate 1 using a flip-chip method according to actual needs, so that at least one first metal line 24 may be omitted from the sensing module 2.

[0055] More specifically, the top surface of the sensing chip 21 has a sensing area 211 and at least one first connection pad 212, and the number and position of the at least one first connection pad 212 correspond to at least one first bonding pad 113. In this embodiment, at least one first metal line 24 connects at least one first bonding pad 113 and at least one first connection pad 212, thereby enabling the substrate 1 to be electrically coupled to the sensing chip 21 through at least one first metal line 24. Each of the first metal lines 24 may be in a normal bond or reverse bond configuration depending on design requirements, and this invention is not limited thereto.

[0056] Furthermore, the sensing area 211 includes a main segment 2111 and two sub-segments 2112 extending from the main segment 2111. In this embodiment, the area of ​​the main segment 2111 is approximately 80% to 95% of the area of ​​the sensing area 211, and the two sub-segments 2112 are respectively connected to the two ends of one side of the main segment 2111, while at least one of the first connecting pads 212 is located within the area (e.g., the notch 2113) surrounded by the main segment 2111 and the two sub-segments 2112, but the present invention is not limited thereto.

[0057] The first transparent adhesive layer 22 is bonded to the top surface of the sensing chip 21 and covers the sensing area 211, while the first glass 23 is bonded to the first transparent adhesive layer 22, such that the first transparent adhesive layer 22 is sandwiched (or connected) between the sensing area 211 of the sensing chip 21 and the first glass 23. The outer edge of the first glass 23 may be flush with the outer edge of the first transparent adhesive layer 22, and the first glass 23 is a filter corresponding to a first spectral band. The first spectral band may cover the spectral band that the sensing area 211 can sense, but the invention is not limited thereto. Furthermore, the first glass 23 may be coated glass or uncoated glass (e.g., plain glass) depending on actual needs.

[0058] It should be further noted that the correspondence between the first glass 23 and the sensing area 211 can be adjusted and varied according to actual needs. For example, in other embodiments not shown in this invention, the shape of the first glass 23 (or the first transparent adhesive layer 22) can correspond to (or be equivalent to) the shape of the main segment 2111. Further, the projection area formed by the first glass 23 projecting onto the top surface of the sensing chip 21 covers the entire main segment 2111 but does not cover the two sub-segments 2112 and at least one of the first connecting pads 212. In other words, the first transparent adhesive layer 22 covers or adheres to the entire main segment 2111 but does not cover the two sub-segments 2112.

[0059] Or, such as Figure 4 and Figure 5 As shown, the first glass 23 has an outer surface 231, an inner surface 232 located on the opposite side of the outer surface 231, and a recessed groove 233 from the inner surface 232. At least one portion of the first metal wire 24 is located within the recessed groove 233. Furthermore, the projection area formed by the first glass 23 projecting onto the top surface of the sensing chip 21 covers the entire sensing area 211 (i.e., the main segment 2111 and the two secondary segments 2112) and at least one of the first connecting pads 212. In other words, the first transparent adhesive layer 22 covers or adheres to the entire sensing area 211 (i.e., the main segment 2111 and the two secondary segments 2112).

[0060] It should be further noted that the correspondence between at least one of the first metal lines 24 and the first transparent adhesive layer 22 can be adjusted and varied according to actual needs. For example, such as... Figure 6 As shown, at least one portion of the first metal wire 24 and at least one of the first connecting pads 212 are embedded within the first transparent adhesive layer 22; or, at least one of the first metal wires 24 and at least one of the first connecting pads 212 do not touch the first transparent adhesive layer 22.

[0061] like Figures 1 to 3 As shown, the light-emitting module 3 is adjacent to and spaced from the sensing module 2, and in this embodiment, the light-emitting module 3 includes a light-emitting chip 31 mounted on the substrate 1, a second transparent adhesive layer 32 bonded to the light-emitting chip 31, a second glass 33 bonded to the second transparent adhesive layer 32, and at least one second metal line 34 electrically coupling the substrate 1 and the light-emitting chip 31.

[0062] It should be noted that the light-emitting chip 31 is mounted on the upper surface 11 of the substrate 1 (e.g., the second die-bonding region 112), and in this embodiment, the light-emitting chip 31 is electrically coupled to the substrate 1 via at least one second metal line 34, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the light-emitting chip 31 may be mounted on the substrate 1 using a flip-chip method according to actual needs, so that at least one second metal line 34 may be omitted from the light-emitting module 3.

[0063] More specifically, in this embodiment, the light-emitting chip 31 is described as a light-emitting diode (LED) chip. The light-emitting chip 31 has a light-emitting surface 311 and at least one second connecting pad 312 adjacent to the light-emitting surface 311, and the number and position of the at least one second connecting pad 312 correspond to at least one second bonding pad 114. In this embodiment, at least one second metal line 34 connects at least one second bonding pad 114 and at least one second connecting pad 312, so that the substrate 1 can be electrically coupled to the light-emitting chip 31 through at least one second metal line 34. Each of the second metal lines 34 can be in a normal bond or reverse bond form according to design requirements, and this invention is not limited thereto.

[0064] The second transparent adhesive layer 32 is bonded to the light-emitting chip 31 and covers the light-emitting surface 311 of the light-emitting chip 31. The second glass 33 is bonded to the second transparent adhesive layer 32, such that the second transparent adhesive layer 32 is sandwiched (or connected) between the light-emitting surface 311 of the light-emitting chip 31 and the second glass 33. The outer edge of the second glass 33 may be flush with the outer edge of the second transparent adhesive layer 32, and the outer surface 331 of the second glass 33 may be coplanar with the outer surface 231 of the first glass 23. Furthermore, the second glass 33 is a filter corresponding to a second spectral band, and the second spectral band is different from the first spectral band, but the present invention is not limited thereto. In addition, the second glass 33 may be coated glass or uncoated glass (e.g., plain glass) depending on actual needs.

[0065] It should be further noted that the correspondence between at least one of the second metal lines 34 and the second transparent adhesive layer 32 can be adjusted and varied according to actual needs. For example, such as... Figure 6As shown, at least one portion of the second metal wire 34 and at least one second connecting pad 312 are embedded within the second transparent adhesive layer 32; or, at least one second metal wire 34 and at least one second connecting pad 312 do not touch the second transparent adhesive layer 32.

[0066] The opaque package 4 is formed on the upper surface 11 of the substrate 1, and the sensing module 2 and the light-emitting module 3 are embedded within the opaque package 4, while at least a portion of the outer surface 231 of the first glass 23 and at least a portion of the outer surface 331 of the second glass 33 are exposed outside the opaque package 4. It should be further noted that, as Figure 2 and Figure 6 As shown, at least one of the first metal wires 24 and at least one of the second metal wires 34 can be at least partially embedded in the opaque package 4 or completely embedded in the opaque package 4, depending on actual needs.

[0067] Furthermore, the opaque package 4 is described in this embodiment as a molding compound, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the opaque package 4 may be a liquid compound depending on actual needs; or, the opaque package 4 may include a liquid compound and a molding compound located on the top surface of the liquid compound.

[0068] As described above, in this embodiment, the cavity-free sensing package structure 100 uses the first transparent bonding layer 22 to bond the sensing chip 21 to the substrate 1 and uses the second transparent bonding layer 32 to bond the light-emitting chip 31 to the substrate 1, so that the opaque package 4 can be used to effectively replace the existing shell, thereby reducing the production cost of the cavity-free sensing package structure 100 and effectively reducing the overall size.

[0069] It should be further noted that although the cavity-free sensing package structure 100 in this embodiment is described as including the substrate 1, the sensing module 2, the light-emitting module 3, and the opaque package 4, the present invention is not limited thereto. For example, such as Figure 7 and Figure 8 As shown, the cavity-free sensing package structure 100 may omit the light-emitting module 3 according to actual needs; that is, the cavity-free sensing package structure 100 may include the substrate 1, the sensing module 2, and the opaque package 4.

[0070] This embodiment also discloses a method for manufacturing a cavity-free sensing package structure, which can be used to manufacture the cavity-free sensing package structure 100. Therefore, the component construction in the following steps can be referred to the relevant description of the cavity-free sensing package structure 100, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the cavity-free sensing package structure 100 can also be manufactured by other methods other than those in this embodiment.

[0071] In this embodiment, the manufacturing method of the cavity-free sensing package structure includes (in sequence): a die placement step, a bonding step, and a packaging step. The following will describe the various steps of the manufacturing method of the cavity-free sensing package structure.

[0072] The crystal placement step: as follows Figure 9 As shown, a sensing chip 21 and a light-emitting chip 31 are mounted on an upper surface 11 of a substrate 1, spaced apart from each other. In this embodiment, the sensing chip 21 is connected to the substrate 1 via at least one first metal wire 24, and the light-emitting chip 31 is connected to the substrate 1 via at least one second metal wire 34.

[0073] The bonding steps are as follows: Figure 10 and Figure 11 As shown, a first glass 23 is bonded to the sensing area 211 of the sensing chip 21 with a first transparent adhesive layer 22, and together they are defined as a sensing module 2. A second glass 33 is bonded to the emitting surface 311 of the light-emitting chip 31 with a second transparent adhesive layer 32, and together they are defined as a light-emitting module 3. The outer surface 331 of the second glass 33 is coplanar with the outer surface 231 of the first glass 23. In this embodiment, the first glass 23 corresponds to a first spectral band, while the second glass 33 corresponds to a second spectral band, which is different from the first spectral band.

[0074] Furthermore, in the bonding step of this embodiment, a first optical adhesive 22a (in a semi-cured state) is formed by dispensing adhesive on the sensing area 211 of the sensing chip 21, and a second optical adhesive 32a (in a semi-cured state) is formed by dispensing adhesive on the light-emitting surface 311 of the light-emitting chip 31. Then, the first glass 23 is bonded to the first optical adhesive 22a, and the second glass 33 is bonded to the second optical adhesive 32a. Then, the first optical adhesive 22a and the second optical adhesive 32a are cured to form the first transparent adhesive layer 22 and the second transparent adhesive layer 32, respectively.

[0075] The encapsulation steps are as follows: Figure 2As shown, an opaque package 4 is formed on the upper surface 11 of the substrate 1, and the sensing module 2 and the light-emitting module 3 are embedded in the opaque package 4, while at least a portion of the outer surface 231 of the first glass 23 and at least a portion of the outer surface 331 of the second glass 33 are exposed outside the opaque package 4.

[0076] [Example 2]

[0077] Please see Figures 12 to 14 As shown, this is Embodiment Two of the present invention. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated (e.g., the die placement step and the packaging step). The main differences between this embodiment and Embodiment One described above are as follows:

[0078] In this embodiment, the manufacturing method of the cavity-free sensing package structure further includes a pre-step before the bonding step. Furthermore, the bonding step described in this embodiment differs from that described in Embodiment 2.

[0079] The aforementioned preliminary steps: such as Figure 12 and Figure 13 As shown, a first optical adhesive film 22b (in a solid state) is attached to a first glass layer 23a, and then the first glass layer 23a and the first optical adhesive film 22b are cut to form a plurality of first glass 23s that are separated from each other and a plurality of first transparent adhesive layers 22 that are respectively adhered to the plurality of first glass 23s; furthermore, a second optical adhesive film 32b (in a solid state) is attached to a second glass layer 33a, and then the second glass layer 33a and the second optical adhesive film 32b are cut to form a plurality of second glass 33s that are separated from each other and a plurality of second transparent adhesive layers 32 that are respectively adhered to the plurality of second glass 33s.

[0080] The bonding steps are as follows: Figure 14 As shown, a first glass 23 is bonded to the sensing area 211 of the sensing chip 21 with a first transparent adhesive layer 22 attached thereto, and together they are defined as the sensing module 2. A second glass 33 is bonded to the light-emitting surface 311 of the light-emitting chip 31 with a second transparent adhesive layer 32 attached thereto, and together they are defined as the light-emitting module 3. The outer surface 331 of the second glass 33 is coplanar with the outer surface 231 of the first glass 23.

[0081] [Example 3]

[0082] Please see Figures 15 to 17As shown, this is Embodiment 3 of the present invention. Since this embodiment is similar to Embodiment 1 described above, the similarities between the two embodiments will not be repeated (e.g., the encapsulation steps). The main differences between this embodiment and Embodiment 1 described above are as follows:

[0083] This embodiment discloses a method for manufacturing a cavity-free sensing package structure, which can be used to manufacture the cavity-free sensing package structure described in Embodiment 1. Therefore, the component construction in the following steps can be referred to the relevant description of the cavity-free sensing package structure, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the cavity-free sensing package structure can also be manufactured by other methods besides those in this embodiment.

[0084] In this embodiment, the manufacturing method of the cavity-free sensing package structure includes (in sequence): a modularization step, a die placement step, and a packaging step. The following will describe the various steps of the manufacturing method of the cavity-free sensing package structure.

[0085] The modularization steps are as follows: Figure 15 and Figure 16 As shown, a first glass 23 is bonded to each of a plurality of default sensing regions 211a on a first wafer 21a via a first transparent bonding layer 22. The first wafer 21a is then cut to form a plurality of sensing chips 21 that are separated from each other, each of which includes one default sensing region 211a. Each sensing chip 21, the first transparent bonding layer 22 disposed thereon, and the first glass 23 are collectively defined as a sensing module 2.

[0086] Furthermore, in the modularization step of this embodiment, a plurality of first optical adhesives 22a are formed by dispensing adhesive into a plurality of default sensing regions 211a of the first wafer 21a, which are spaced apart from each other (and in a semi-cured state). Then, a plurality of first glass 23s are respectively bonded to the plurality of first optical adhesives 22a. The plurality of first optical adhesives 22a are then cured to form a plurality of first transparent adhesive layers 22.

[0087] The crystal placement step: as follows Figure 17 As shown, the sensing chip 21 of the sensing module 2 and the light-emitting module 3 are mounted on an upper surface 11 of a substrate 1, spaced apart from each other. The light-emitting module 3 includes a light-emitting chip 31 mounted on the upper surface 11, a second transparent adhesive layer 32 bonded to the light-emitting chip 31, and a second glass 33 bonded to the second transparent adhesive layer 32. Furthermore, the first glass 23 corresponds to a first spectral band, while the second glass 33 corresponds to a second spectral band, which is different from the first spectral band.

[0088] In this embodiment, the sensing chip 21 is connected to the substrate 1 via at least one first metal wire 24, and the light-emitting chip 31 is connected to the substrate 1 via at least one second metal wire 34.

[0089] [Example 4]

[0090] Please see Figures 18 to 20 As shown, this is Embodiment 4 of the present invention. Since this embodiment is similar to Embodiment 3 above, the similarities between the two embodiments will not be repeated (e.g., the die placement step and the packaging step). The main differences between this embodiment and Embodiment 3 above are explained as follows:

[0091] In the modularization step of this embodiment, a first optical colloid 22a (e.g., photosensitive colloid) is coated and formed on the first wafer 21a to cover a plurality of default sensing regions 211a (and is in a semi-cured state). Then, a plurality of first glass 23s are respectively bonded to the first optical colloid 22a and their positions respectively correspond to the plurality of default sensing regions 211a. The portions of the first optical colloid 22a that are not in contact with the plurality of first glass 23 are removed, so that the first optical colloid 22a forms a plurality of first transparent adhesive layers 22 that are separated from each other.

[0092] [Technical Effects of the Embodiments of the Invention]

[0093] In summary, the cavity-free sensing package structure and its manufacturing method disclosed in the embodiments of the present invention use a first transparent adhesive layer to bond the sensing chip to the substrate and a second transparent adhesive layer to bond the light-emitting chip to the substrate, so that the package can be used to effectively replace the existing shell, thereby reducing the production cost of the cavity-free sensing package structure and effectively reducing the overall size.

[0094] The above-disclosed content is only an optional and feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the patent scope of the present invention.

Claims

1. A cavity-free sensing packaging structure, characterized in that, The cavity-free sensing package structure includes: A substrate having an upper plate and a lower plate located on opposite sides; A sensing module, disposed on the substrate and comprising: A sensing chip is mounted on the upper surface of the substrate and is electrically coupled to the substrate; wherein the top surface of the sensing chip has a sensing area. A first transparent adhesive layer is bonded to the top surface of the sensing chip and covers the sensing area; and A first glass is bonded to the first transparent adhesive layer; wherein the first glass corresponds to a first spectral band; A light-emitting module is disposed on the substrate and spaced apart from the sensing module, and the light-emitting module includes: A light-emitting chip is mounted on the upper surface of the substrate, and the sensing chip is electrically coupled to the substrate; A second transparent adhesive layer is bonded to the light-emitting chip and covers the light-emitting surface of the light-emitting chip; and A second glass, bonded to the second transparent adhesive layer, wherein the outer surface of the second glass is coplanar with the outer surface of the first glass; wherein the second glass corresponds to a second spectral band, which is different from the first spectral band; and An opaque package is formed on the upper surface of the substrate, and the sensing module and the light-emitting module are embedded within the opaque package, while at least a portion of the outer surface of the first glass and at least a portion of the outer surface of the second glass are exposed outside the opaque package.

2. The cavity-free sensing packaging structure according to claim 1, characterized in that, The substrate includes at least one first bonding pad and at least one second bonding pad located on the upper surface, and the sensing chip has at least one first connection pad located on the top surface, while the light-emitting chip has at least one second connection pad adjacent to the light-emitting surface; wherein, the sensing module includes at least one first metal wire connecting at least one first bonding pad and at least one first connection pad, which is at least partially embedded within the opaque package; wherein, the light-emitting module includes at least one second metal wire connecting at least one second bonding pad and at least one second connection pad, which is at least partially embedded within the opaque package.

3. The cavity-free sensing packaging structure according to claim 2, characterized in that, At least one of the first metal wires is completely embedded within the opaque package.

4. The cavity-free sensing packaging structure according to claim 3, characterized in that, The sensing area includes a main segment and two sub-segments extending from the main segment. At least one of the first connection pads is located within the area enclosed by the main segment and the two sub-segments; wherein, a projection area formed by the first glass projecting onto the top surface of the sensing chip covers the entire main segment but does not cover the two sub-segments and at least one of the first connection pads.

5. The cavity-free sensing packaging structure according to claim 3, characterized in that, The sensing area includes a main segment and two sub-segments extending from the main segment. At least one of the first connecting pads is located within the area enclosed by the main segment and the two sub-segments; wherein the first glass has an inner surface located on the opposite side of the outer surface and a relief groove recessed from the inner surface, and at least one portion of the first metal wire is located within the relief groove; wherein a projection area formed by the first glass projecting onto the top surface of the sensing chip covers the entire main segment, the two sub-segments, and at least one of the first connecting pads.

6. The cavity-free sensing packaging structure according to claim 1, characterized in that, The outer edge of the first glass is flush with the outer edge of the first transparent adhesive layer, and the outer edge of the second glass is flush with the outer edge of the second transparent adhesive layer.

7. The cavity-free sensing packaging structure according to claim 1, characterized in that, No cavities are formed inside the cavity-free sensing package structure.

8. A method for manufacturing a cavity-free sensing package structure, characterized in that, The method for manufacturing the cavity-free sensing package structure includes: One step of chip placement: A sensing chip and a light-emitting chip are mounted on an upper surface of a substrate with spacing between them; A bonding step: A first glass is bonded to the sensing area of ​​the sensing chip with a first transparent adhesive layer, and the two are collectively defined as a sensing module; a second glass is bonded to the emitting surface of the light-emitting chip with a second transparent adhesive layer, and the two are collectively defined as a light-emitting module, with the outer surface of the second glass coplanar with the outer surface of the first glass; wherein the first glass corresponds to a first spectral band, and the second glass corresponds to a second spectral band, which is different from the first spectral band; and A packaging step: An opaque package is formed on the upper surface of the substrate, and the sensing module and the light-emitting module are embedded in the opaque package, while at least a portion of the outer surface of the first glass and at least a portion of the outer surface of the second glass are exposed outside the opaque package.

9. The method for manufacturing a cavity-free sensing package structure according to claim 8, characterized in that, In the bonding step, a first optical adhesive is formed by dispensing glue on the sensing area of ​​the sensing chip and a second optical adhesive is formed by dispensing glue on the light-emitting surface of the light-emitting chip. Then, the first glass is bonded to the first optical adhesive and the second glass is bonded to the second optical adhesive. The first optical adhesive and the second optical adhesive are then cured to form the first transparent adhesive layer and the second transparent adhesive layer, respectively.

10. The method for manufacturing the cavity-free sensing package structure according to claim 8, characterized in that, The method for manufacturing the cavity-free sensing package structure further includes a pre-step before the bonding step: attaching a first optical adhesive film to a first glass layer, and then cutting the first glass layer and the first optical adhesive film to form a plurality of first glass pieces separated from each other and a plurality of first transparent adhesive layers respectively attached to the plurality of first glass pieces; in the bonding step, one of the first glass pieces is bonded to the sensing area of ​​the sensing chip by the first transparent adhesive layer attached thereto.

11. The method for manufacturing the cavity-free sensing package structure according to claim 10, characterized in that, In the preceding step, a second optical adhesive film is attached to a second glass layer, and then the second glass layer and the second optical adhesive film are cut to form a plurality of second glass pieces that are separated from each other and a plurality of second transparent adhesive layers that are respectively attached to the plurality of second glass pieces; in the bonding step, a second glass piece is bonded to the light-emitting surface of the light-emitting chip by the second transparent adhesive layer attached thereto.

12. A method for manufacturing a cavity-free sensing package structure, characterized in that, The method for manufacturing the cavity-free sensing package structure includes: A modular step: A first glass is bonded to each of the multiple default sensing regions of a first wafer through a first transparent adhesive layer, and the first wafer is cut to form a plurality of sensing chips that are separated from each other, each of which includes a default sensing region; wherein, each of the sensing chips and the first transparent adhesive layer disposed thereon and the first glass are collectively defined as a sensing module. A crystal placement step: A sensing chip of one of the sensing modules and a light-emitting module are mounted spaced apart on an upper surface of a substrate; wherein the light-emitting module includes a light-emitting chip mounted on the upper surface, a second transparent adhesive layer bonded to the light-emitting chip, and a second glass bonded to the second transparent adhesive layer; wherein the first glass corresponds to a first spectral band, and the second glass corresponds to a second spectral band, which is different from the first spectral band; and A packaging step: An opaque package is formed on the upper surface of the substrate, and the sensing module and the light-emitting module are embedded in the opaque package, while at least a portion of the outer surface of the first glass and at least a portion of the outer surface of the second glass are exposed outside the opaque package.

13. The method for manufacturing the cavity-free sensing package structure according to claim 12, characterized in that, In the modularization step, adhesive is applied to a plurality of default sensing regions of the first wafer to form a plurality of first optical adhesives spaced apart from each other. Then, a plurality of first glass plates are respectively bonded to the plurality of first optical adhesives. The plurality of first optical adhesives are then cured to form a plurality of first transparent adhesive layers.

14. The method for manufacturing a cavity-free sensing package structure according to claim 12, characterized in that, In the modularization step, a first optical colloid covering multiple default sensing areas is coated and formed on the first wafer. Then, multiple first glass pieces are respectively bonded to the first optical colloid and their positions correspond to the multiple default sensing areas. The first optical colloid portions that are not in contact with the multiple first glass pieces are removed so that the first optical colloid forms multiple first transparent adhesive layers that are separated from each other.

15. The method for manufacturing a cavity-free sensing package structure according to claim 14, characterized in that, The first optical colloid is a photosensitive colloid.

16. A cavity-free sensing packaging structure, characterized in that, The cavity-free sensing package structure includes: A substrate having an upper plate and a lower plate located on opposite sides; A sensing module, disposed on the substrate and comprising: A sensing chip is mounted on the upper surface of the substrate and is electrically coupled to the substrate; wherein the top surface of the sensing chip has a sensing area. A first transparent adhesive layer is bonded to the top surface of the sensing chip and covers the sensing area; and A first glass, bonded to the first transparent adhesive layer, and the first glass corresponding to a first spectral band; and An opaque package is formed on the upper surface of the substrate, and the sensing module is embedded within the opaque package, while at least a portion of the outer surface of the first glass is exposed outside the opaque package.

17. The cavity-free sensing packaging structure according to claim 16, characterized in that, The substrate includes at least one first bonding pad located on the upper surface, and the sensing chip has at least one first connection pad located on the top surface; wherein the sensing module includes at least one first metal wire connecting at least one first bonding pad and at least one first connection pad, which is at least partially embedded within the opaque package.

18. The cavity-free sensing packaging structure according to claim 17, characterized in that, At least one of the first metal wires is completely embedded within the opaque package.

19. The cavity-free sensing packaging structure according to claim 18, characterized in that, The sensing area includes a main segment and two sub-segments extending from the main segment, and at least one first connection pad is located within the area surrounded by the main segment and the two sub-segments; wherein, a projection area formed by the first glass projecting onto the top surface of the sensing chip covers the entire main segment but does not cover the two sub-segments and at least one first connection pad.

20. The cavity-free sensing packaging structure according to claim 18, characterized in that, The sensing area includes a main segment and two sub-segments extending from the main segment, and at least one first connecting pad is located within the area surrounded by the main segment and the two sub-segments; wherein the first glass has an inner surface located on the opposite side of the outer surface and a relief groove recessed from the inner surface, and at least one portion of the first metal wire is located within the relief groove; wherein a projection area formed by the first glass projecting onto the top surface of the sensing chip covers the entire main segment, the two sub-segments, and at least one first connecting pad.

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