Bearing device

Abstract

A bearing device comprises a bearing disc, a first lifting part, a second lifting part, a third lifting part, a driving assembly and an edge pressing assembly. The first lifting part, the second lifting part and the third lifting part are arranged in the bearing disc, the edge pressing assembly is arranged on the peripheral side of the bearing disc, and the driving assembly is used for selectively driving the first lifting part, the second lifting part and the third lifting part to ascend and descend relative to the bearing disc so that the bearing device can be switched among different states. By using the second lifting piece and the third lifting piece, front bearing of two different types of tested pieces can be completed based on the same bearing device; the first lifting piece is used for supporting the contactable front face of a tested piece such as a standard wafer, and the edge pressing assembly is used for applying pressing pressure to the tested piece, so that the front face of the tested piece can be prevented from making contact with the bearing disc, and the tested piece is borne and fixed in the back face placing posture; therefore, the bearing device not only has a bearing function of different types of tested pieces, but also has a front-side and back-side bearing function.

Description

Technical Field

[0001] This application relates to the field of semiconductor process equipment technology, and specifically to a carrier device. Background Technology

[0002] In semiconductor manufacturing processes, carrier devices are commonly used to support and fix semiconductor workpieces in order to enable the processing, transportation, and inspection of semiconductor workpieces.

[0003] Taking wafers as an example, different types of wafers (such as normal wafers and frame wafers) are typically mounted and fixed using different carrier devices. Furthermore, as inspection requirements become increasingly stringent, it is necessary to inspect not only the front but also the back of the wafer. Since the front of the wafer has circuit patterns, it cannot directly contact the carrier device. Therefore, in related technologies, different carrier devices are used for front and back inspections of the same type of wafer. Clearly, this increases the configuration cost of the carrier device and reduces production efficiency. Summary of the Invention

[0004] The purpose of this application is to provide a support device that at least partially solves the above-mentioned technical problems.

[0005] To achieve the above objectives, one embodiment provides a carrying device, including a carrying plate, a first lifting member, a second lifting member, a third lifting member, a driving assembly, and a pressing assembly. The first lifting member, the second lifting member, and the third lifting member are respectively disposed in the carrying plate, and the second lifting member is closer to the center of the carrying plate relative to the first lifting member, while the third lifting member is farther away from the center of the carrying plate relative to the first lifting member. The pressing assembly is disposed on the periphery of the carrying plate.

[0006] The supporting device has a first state, a second state, and a third state;

[0007] In the first state, the driving component is used to drive the first lifting member to move up and down relative to the carrier plate, so as to support the accessible front side of the first test piece through the first lifting member, thereby spacing the first test piece from the carrier plate; the pressing component is used to apply pressure to the back side of the first test piece to fix the first test piece on the first lifting member.

[0008] In the second state, the drive component is used to drive the second lifting member to move up and down relative to the carrier plate, so as to support the back of the first test piece through the second lifting member and release the first test piece onto the carrier plate;

[0009] In the third state, the driving component is used to drive the third lifting member to move up and down relative to the carrier plate, so as to support the back of the second test piece through the third lifting member and release the second test piece onto the carrier plate; wherein, the type of the first test piece is different from the type of the second test piece.

[0010] In one embodiment, the drive component includes a plurality of independent drive mechanisms; wherein:

[0011] The plurality of drive mechanisms include a first drive mechanism and a second drive mechanism, wherein the first drive mechanism is configured to drive the first lifting member to move up and down, and the second drive mechanism is configured to selectively drive the second lifting member and the third lifting member to move up and down;

[0012] The drive mechanism may include a first drive mechanism, a third drive mechanism, and a fourth drive mechanism, wherein the first drive mechanism is configured to drive the first lifting member to rise and fall, the third drive mechanism is configured to drive the second lifting member to rise and fall, and the fourth drive mechanism is configured to drive the third lifting member to rise and fall.

[0013] In one embodiment, the first driving mechanism includes a first driving member and a first lifting plate. The first lifting plate is disposed below the support plate, and the first lifting member passes through the support plate and is fixed to the first lifting plate. The first driving member is disposed on the support plate and connected to the first lifting plate, and is used to drive the first lifting plate to move the first lifting member up and down.

[0014] And / or the second driving mechanism includes a second driving member and a second lifting plate. The second lifting member and the third lifting member are respectively capable of lifting and lowering through the support plate. The second lifting plate is disposed below the support plate, and the second lifting plate has a first pushing part corresponding to the position of the second lifting member and a second pushing part corresponding to the position of the third lifting member. The height of the first pushing part is lower than the height of the second pushing part. The second driving member is used to drive the second lifting plate to move the first pushing part and the second pushing part up and down. The first pushing part pushes the second lifting member to rise, and the second pushing part pushes the third lifting member to rise.

[0015] In one embodiment, the number of the first lifting components is set to multiple, the multiple first lifting components are distributed at intervals around the center of the bearing plate, and the multiple first lifting components are all fixed to the first lifting plate.

[0016] In one embodiment, the second driving mechanism further includes a first elastic element and a second elastic element; one end of the first elastic element is connected to the bearing plate and the other end is connected to the second lifting member, for providing an elastic force to cause the second lifting member to descend; one end of the second elastic element is connected to the bearing plate and the other end is connected to the third lifting member, for providing an elastic force to cause the third lifting member to descend.

[0017] In one embodiment, the carrier plate includes an adsorption portion, a transition portion surrounding the adsorption portion, and a carrier portion surrounding the transition portion. The upper surface of the transition portion is flush with the upper surface of the adsorption portion, and the upper surface of the carrier portion is lower than the upper surface of the adsorption portion. The first lifting member is disposed in the transition portion, the second lifting member is disposed in the adsorption portion close to the transition portion, and the third lifting member is disposed in the carrier portion.

[0018] In one embodiment, the support device further has a fourth state; in the fourth state, the third lifting member rises to a position higher than the upper surface of the adsorption part, so as to space the second test piece from the support plate by supporting the front of the second test piece.

[0019] In one embodiment, the portion of the first lifting member that contacts the first test piece is provided with a first anti-slip pad, and the portion of the pressing assembly that contacts the first test piece is provided with a second anti-slip pad.

[0020] In one embodiment, the pressing assembly includes a pressing drive and a pressing block; the pressing drive is disposed on the support plate and connected to the pressing block, and is used to drive the pressing block to move closer to or away from the first test piece when the first lifting member supports the first test piece;

[0021] The pressing block has a pressing part and a limiting part connected to each other, and the second anti-slip pad is disposed on the pressing part; in the first state, the pressing part presses against the back of the first test piece through the second anti-slip pad, and the limiting part is used to limit the first test piece.

[0022] In one embodiment, the carrier device further includes a detection component for detecting the status information of the first test piece on the carrier device in the first state; the detection component includes two detection elements disposed on the carrier plate, each detection element including a signal transmitting part and a signal receiving part arranged opposite to each other; the line connecting the signal transmitting part and the signal receiving part of one detection element intersects with the line connecting the signal transmitting part and the signal receiving part of the other detection element.

[0023] In one embodiment, the accessible front surface of the first test piece is an area extending 2 mm to 5 mm from the edge of the front surface of the first test piece toward the center.

[0024] The carrier device according to the above embodiment includes a carrier plate, a first lifting member, a second lifting member, a third lifting member, a drive assembly, and a pressing assembly. The first, second, and third lifting members are respectively disposed in the carrier plate, the pressing assembly is disposed on the periphery of the carrier plate, and the drive assembly is used to selectively drive the first, second, and third lifting members to move up and down relative to the carrier plate, so that the carrier device can switch between different states. Using the second and third lifting members, the front-side bearing of two different types of test pieces (e.g., standard wafers and frame wafers) can be completed based on the same carrier device. By using the first lifting member to support the accessible front side of the test piece such as the standard wafer, and by applying pressure to the test piece through the pressing assembly, the front side of the test piece can be prevented from contacting the carrier plate, thereby the test piece is carried and fixed in a back-side-placed position. Thus, the carrier device not only has the function of bearing different types of test pieces, but also has the function of bearing both the front and back sides, providing support for the front and back inspection operations of different types of test pieces based on the same testing equipment. Attached Figure Description

[0025] Figure 1 A three-dimensional structural schematic diagram (a) of a support device according to one embodiment.

[0026] Figure 2 This is a three-dimensional structural schematic diagram (II) of a support device according to one embodiment.

[0027] Figure 3 This is a schematic diagram of the planar structure of the carrier device according to one embodiment, omitting the drive component.

[0028] Figure 4 for Figure 3 A schematic diagram of the cross-sectional structure of the supporting device along the AA direction.

[0029] Figure 5 for Figure 4 A magnified schematic diagram of the structure of region A in the middle.

[0030] Figure 6 This is a schematic diagram of the structure of the first lifting member and the first driving mechanism in a carrying device according to one embodiment.

[0031] Figure 7 This is a schematic diagram showing the connection relationship between the first positioning seat and the motion platform in a carrying device according to one embodiment.

[0032] In the picture:

[0033] 10. First lifting component; 11. First anti-slip mat; 20. Second lifting component; 30. Third lifting component; 40. Bearing plate; 41. Adsorption part; 42. Transition part; 43. Bearing part; 50. Edge pressing assembly; 51. Second anti-slip mat; 52. Edge pressing drive component; 53. Pressing block; 531. Pressing part; 532. Limiting part; 60. First driving mechanism; 61. First driving component; 62. First lifting plate; 70. Second driving mechanism; 71. Second driving component; 72. Second lifting plate; 73. First elastic component; 74. Second elastic component; 75. First pushing part; 76. Second pushing part; 81. Signal transmitting part; 82. Signal receiving part; 91. First positioning seat; 92. Second positioning seat; 93. Magnetic suction structure. Detailed Implementation

[0034] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0035] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0036] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0037] The carrier device provided in this application embodiment can be applied in or used in conjunction with testing equipment. By carrying and fixing different types of test pieces (UTPs), it supports the front and back inspection of the UTPs based on the same testing equipment. The different types of UTPs can include a first UTP and a second UTP; for example, the first UTP can be an 8-inch standard wafer, and correspondingly, the second UTP is an 8-inch frame wafer; or, for example, the first UTP can be a 12-inch standard wafer, and correspondingly, the second UTP is a 12-inch frame wafer. Of course, the first and second UTPs can also be other products or workpieces, such as semiconductor workpieces with similar structures or testing methods to standard wafers and frame wafers.

[0038] Please see Figures 1 to 6 The supporting device includes a first lifting component 10, a second lifting component 20, a third lifting component 30, a supporting plate 40, a pressing edge assembly 50, a driving assembly, and other functional components as needed, which are described in detail below.

[0039] Please see Figures 1 to 4 The first lifting member 10, the second lifting member 20, and the third lifting member 30 are respectively arranged in the support plate 40 in a manner that allows them to be raised and lowered relative to the support plate 40. The second lifting member 20 is arranged closer to the center of the support plate 40 relative to the first lifting member 10, and the third lifting member 30 is arranged further away from the center of the support plate 40 relative to the first lifting member 10. The first lifting member 10 is mainly used to receive the first test piece by raising and lowering, and to support the first test piece above the support plate 40, maintaining a distance between the first test piece and the support plate 40. The second lifting member 20 is mainly used to receive the first test piece by raising and lowering, so as to release the first test piece onto the support plate 40. The third lifting member 30 is mainly used to receive the second test piece by raising and lowering, so as to release the second test piece onto the support plate 40.

[0040] For example, please refer to Figure 2 , Figure 3 and Figure 5 The support plate 40 includes a centrally located adsorption section 41, a transition section 42 surrounding the adsorption section 41, and a support section 43 surrounding the transition section 42. A second lifting member 20 is disposed in the adsorption section 41, for example, the second lifting member 20 may be disposed near the edge of the adsorption section 41 close to the transition section 42. A first lifting member 10 is disposed in the transition section 42, and a third lifting member 30 is disposed in the support section 43. The adsorption section 41 may include a porous ceramic part, a microporous ceramic part, a metal groove part, or other forms of adsorption structure, and the adsorption section 41 is connected to an external negative pressure source air path. When the test piece is released onto the support plate 40 by the corresponding lifting member, the test piece can be held in place by adsorbing and fixing it through the adsorption section 41.

[0041] Please see Figures 1 to 4The pressure-edge assembly 50 is disposed on the periphery of the support plate 40 and is mainly used to cooperate with the first lifting member 10 to fix the first test piece onto the first lifting member 10 by applying pressure to it, so as to prevent the first test piece from shifting or falling off due to movement on the first lifting member 10. The drive assembly is configured to selectively drive the first lifting member 10, the second lifting member 20 and the third lifting member 30 to move up and down relative to the support plate 40.

[0042] For example, please refer to Figure 1 and Figure 2 The drive assembly includes a first drive mechanism 60 and a second drive mechanism 70 that are independent of each other; wherein the first drive mechanism 60 is configured to drive the first lifting member 10 to rise and fall, and the second drive mechanism 70 is configured to selectively drive the second lifting member 20 and the third lifting member 30 to rise and fall.

[0043] For example, the drive assembly includes a first drive mechanism 60, a third drive mechanism, and a fourth drive mechanism that are independent of each other. The first drive mechanism 60 is configured to drive the first lifting member 10 to rise and fall, the third drive mechanism is configured to drive the second lifting member 20 to rise and fall, and the third drive mechanism is configured to drive the third lifting member 30 to rise and fall.

[0044] By selectively driving the first lifting component 10, the second lifting component 20, and the third lifting component 30 to move up and down through the drive components, the bearing device can have a variety of different application states to adapt to the type of the test piece and the requirements of front and back inspections, and can flexibly switch between different states.

[0045] For example, multiple different states may include a first state, a second state, and a third state.

[0046] Please combine Figure 2 In the first state, when the external gripping device (e.g., a robotic arm) moves the first test piece above the carrier plate 40 with the front of the first test piece facing down, the driving component (e.g., the first driving mechanism 60) drives the first lifting member 10 to rise to a position higher than the upper surface of the carrier plate 40, so that the first lifting member 10 can receive the first test piece by supporting the accessible front of the first test piece; subsequently, the external gripping device is removed, and the driving component drives the first lifting member 10 to descend to a height higher than the carrier plate 40 and adapted to the pressure edge component 50; finally, the pressure edge component 50 applies pressure to the back of the first test piece, fixing the first test piece to the first lifting member 10, keeping the first test piece at a distance from the carrier plate 40, and ensuring that the front of the first test piece does not contact the carrier plate 40.

[0047] In the first state, since the first test piece is fixed with its back side facing up (i.e., back side bearing), the back side of the first test piece can be inspected by acquiring an image of its back side (commonly known as back inspection).

[0048] The accessible front side of the first device under test (DUT) can be an area extending 2mm to 5mm from the edge of the front side towards the center. Regarding wafers, during wafer fabrication, to ensure the process and yield of the effective chip area, all unavoidable edge process defects and variations are confined to the outermost area of ​​the front side of the wafer; this area is called the die-free region of the wafer. Therefore, the accessible front side of the wafer can be understood as the die-free region. By supporting the die-free region of the wafer (e.g., a standard wafer) with the first lifting member 10, it is ensured that the front side of the wafer (specifically, the area with the processed circuit pattern) will not come into contact with the carrier pad 40 and become contaminated or damaged. Furthermore, since the die-free region accounts for a very small area on the front side of the wafer, applying pressure to the back side corresponding to the die-free region of the wafer through the edge pressing component 50 can firmly fix the wafer on the first lifting member 10, which can both prevent the wafer from shifting relative to the first lifting member 10 and reduce the risk of wafer drop.

[0049] In the second state, when the external gripping device (e.g., a robotic arm) moves the first test piece above the support plate 40 with its back facing down, the drive assembly (e.g., the second drive mechanism 70 or the third drive mechanism) drives the second lifting member 20 to rise to a position higher than the upper surface of the support plate 40, so that the second lifting member 20 supports the back of the first test piece, thereby receiving the first test piece. Subsequently, the external gripping device is removed, and the drive assembly drives the second lifting member 20 to lower the first test piece until it lands on the support plate 40, thereby releasing the first test piece. Finally, the first test piece is fixed on the support plate 40 (e.g., by using the adsorption part 41 to adsorb and fix the back of the first test piece), thereby achieving the support and fixation of the first test piece.

[0050] In the second state, since the first test piece is fixed in a front-facing position (i.e. front-facing load-bearing), the front of the first test piece can be inspected by acquiring a front image of the first test piece (commonly known as front inspection).

[0051] In the third state, when the external gripping device (e.g., a robotic arm) moves the second test piece above the carrier plate 40 with its back facing down, the drive assembly (e.g., the second drive mechanism 70 or the fourth drive mechanism) drives the third lifting member 30 to rise to a position higher than the upper surface of the carrier plate 40, so that the third lifting member 30 supports the back of the second test piece, thereby receiving the second test piece. Subsequently, the external gripping device is removed, and the drive assembly drives the third lifting member 30 to lower the second test piece until it lands on the carrier plate 40, thereby releasing the second test piece. Finally, the second test piece is fixed on the carrier plate 40 (e.g., by using the adsorption part 41 to adsorb and fix the back of the second test piece), thereby achieving the support and fixation of the second test piece.

[0052] In the third state, since the second test piece is fixed with its front facing upwards, a frontal inspection of the second test piece can be performed by acquiring a frontal image of the second test piece.

[0053] It is understandable that when the second test piece is a frame wafer, the back side of the wafer and the back side of the iron ring are respectively bonded and fixed to the front side of the blue film. Therefore, in the third state, the blue film on the back side of the iron ring can be supported by the third lifting member 30 to achieve the overall support and release of the frame wafer; the blue film on the back side of the wafer can be adsorbed by the adsorption part 41 to indirectly and firmly fix the wafer to the carrier plate 40, and finally achieve the front-side support of the frame wafer.

[0054] In summary, by positioning the first lifting member 10, the second lifting member 20, and the third lifting member 30 in different areas of the carrier plate 40, it can be adapted to the shape and size of two different types of workpieces being tested. By selectively driving each lifting member to move up and down relative to the carrier plate 40 to switch the state of the carrier device, the carrier device not only has the function of carrying different types of workpieces being tested, but also has the functions of front and back carrying. This provides support for front and back inspection of different types of workpieces based on the same inspection equipment, which can not only effectively improve equipment utilization and reduce equipment configuration costs, but also help improve inspection efficiency.

[0055] In some embodiments, please refer to Figure 5 The first lifting component 10 is provided with a first anti-slip pad 11 at the part that contacts the first test piece, and the pressing component 50 is provided with a second anti-slip pad 51 at the part that contacts the first test piece; the first anti-slip pad 11 and the second anti-slip pad 51 can be made of materials with a high coefficient of friction, such as rubber.

[0056] The first anti-slip pad 11 can be fixedly installed at the top of the first lifting member 10. When the driving component drives the first lifting member 10 to rise to a position higher than the upper surface of the bearing plate 40, the first anti-slip pad 11 contacts the accessible front side of the first test piece (e.g., the die-free area of ​​a standard wafer). This can prevent the first test piece from shifting relative to the first lifting member 10, so that the first lifting member 10 can drive the first test piece to descend stably and move to a height position adapted to the edge pressing component 50.

[0057] The edge-pressing assembly 50 drives the second anti-slip pad 51 to contact the back of the first test piece, applying pressure to the back of the first test piece. This clamps the edge of the first test piece between the first anti-slip pad 11 and the second anti-slip pad 51, which can both securely fix the first test piece and prevent damage to it.

[0058] For example, please refer to Figure 3 and Figure 5 The edge-pressing assembly 50 includes an edge-pressing drive 52 and a pressing block 53. The body of the edge-pressing drive 52 is fixed on the support plate 40, and the power end of the edge-pressing drive 52 is coupled to the pressing block 53. The pressing block 53 has a pressing part 531 and a limiting part 532 in contact, and a second anti-slip pad 51 is disposed on the pressing part 531. The edge-pressing drive 52 may include a power device such as a rotary cylinder capable of outputting rotational motion. When the first lifting member 10 drives the first test piece to descend and move to a predetermined height position, the edge-pressing drive 52 drives the pressing block 53 to rotate relative to the support plate 40, flipping the pressing part 531 to the back of the first test piece, so that the second anti-slip pad 51 presses against the back of the first test piece, while the limiting part 532 is located on the periphery of the first test piece. In this way, while the edge of the first test piece is firmly clamped by the first anti-slip pad 11 and the second anti-slip pad 51, the limiting part 532 can also be used to limit the first test piece (for example, the limiting part 532 can abut against the outer peripheral surface of the first test piece) to prevent the first test piece from slipping, thereby providing support for subsequent back inspection operations.

[0059] After the back inspection is completed, the pressing drive 52 can drive the pressing block 53 to rotate and reset the second anti-slip pad 51 to release the first test piece; subsequently, the first test piece can be removed from the carrier device by an external gripping device.

[0060] In some embodiments, an anti-slip pad may also be provided on the limiting part 532 to avoid the limiting part 532 making hard contact with the first test piece and damaging the first test piece.

[0061] In other embodiments, the pressing component 50 may also adopt other suitable structures, as long as it can cooperate with the first lifting component 10 to clamp and fix the test piece, which will not be elaborated here.

[0062] In some embodiments, the carrier device further includes a detection component, which is mainly used to detect the state information of the first test piece on the carrier device in a first state. For details, please refer to... Figure 1 The detection assembly includes two detection elements disposed on the carrier plate 40. Each detection element includes a signal transmitting part 81 and a signal receiving part 82 arranged opposite to each other. For example, the signal transmitting part 81 and the signal receiving part 82 can be disposed on the periphery or edge of the carrier plate 40.

[0063] The line connecting the signal transmitter 81 and the signal receiver 82 of one detection element intersects with the line connecting the signal transmitter 81 and the signal receiver 82 of the other detection element; for example, the two lines intersect with the center line of the carrier plate 40. In a specific implementation, the signal transmitter 81 and the signal receiver 82 can be photoelectric sensors or other non-contact sensors.

[0064] Thus, based on the structural arrangement of the detection components on the carrier plate 40, the status information of the first test piece on the carrier device can be detected. The detection system can confirm whether the first test piece is fixed in a preset posture or position by the first lifting component 10 and the pressing component 50, so as to carry out subsequent back inspection operations. During the back inspection process, the detection components monitor the first test piece in real time. The detection system can also determine whether the first test piece has dropped, flipped, or experienced other phenomena that affect the detection results, so as to terminate the back inspection process in a timely manner to ensure the accuracy of the detection results.

[0065] It should be noted that, Figure 1 The dashed line in the diagram represents the connection between the signal transmitter 81 and the signal receiver 82, which are arranged opposite to each other.

[0066] As mentioned above, in some embodiments, please refer to Figure 5 The carrier plate 40 includes an adsorption part 41, a transition part 42 and a carrier part 43; wherein, the upper surface of the transition part 42 may be flush with the upper surface of the adsorption part 41, and the upper surface of the carrier part 43 may be lower than the upper surface of the adsorption part 41.

[0067] When the first test piece is a standard wafer, in the second state, by utilizing the fact that the upper surface of the adsorption part 41 and the upper surface of the transition part 42 are flush, the contact area between the carrier disk 40 and the back of the standard wafer can be effectively increased, ensuring that the adsorption part 41 can stably adsorb and fix the standard wafer.

[0068] When the second test piece is a frame wafer, in the third state, by utilizing the structural feature that the upper surface of the support part 43 is lower than the upper surface of the adsorption part 41, the support part 43 can provide a placement space for the iron ring sheet of the frame wafer, so that the blue film between the wafer and the iron ring sheet is stretched and tightened by the iron ring sheet, thereby ensuring that the adsorption part 41 indirectly and firmly fixes the wafer.

[0069] In a specific implementation, the outer diameter of the transition portion 42 can be set to be larger than the outer diameter of the standard wafer, and the inner diameter of the carrier portion 43 can be set to be smaller than the inner diameter of the frame wafer iron ring, so that the structure and size of the carrier disk 40 are adapted to the standard wafer and the corresponding frame wafer.

[0070] Understandably, in the second and third states, the driving assembly can drive the first lifting member 10 to descend and remain at a position no higher than the upper surface of the adsorption part 41, ensuring that the standard wafer or frame wafer is securely fixed on the carrier disk 40 with its face up. In the first state, the driving assembly can drive the second lifting member 20 and the third lifting member 30 to descend and remain at a position no higher than the first lifting member 20, for example, the second lifting member 20 and the third lifting member 30 can remain at a position no higher than the upper surface of the carrier disk 40; to avoid affecting the first lifting member 10's reception and fixation of the standard wafer.

[0071] In some embodiments, please refer to Figure 2 , Figure 5 and Figure 6 The drive assembly includes a first drive mechanism 60 for driving the first lifting member 10 to move up and down. The first drive mechanism 60 includes a first drive member 61 and a first lifting plate 62. The first lifting plate 62 is positioned below the support plate 40. The first lifting member 10 passes through the support plate 40 (e.g., the transition portion 42) and is fixed to the first lifting plate 62. The first drive member 61 is positioned on the support plate 40 and connected to the first lifting plate 62. By driving the first lifting plate 62 to move up and down relative to the support plate 40 below it via the first drive member 61, the first lifting plate 62 drives the first lifting member 10 to move synchronously. This not only fully utilizes the space below the support plate 40 and enhances the overall compactness of the support device, but also ensures the stability of the lifting movement of the first lifting member 10 based on the rigid connection established between the first lifting member 10, the first lifting plate 62, the first drive member 61, and the support plate 40.

[0072] In specific implementation, the first driving component 61 may include a cylinder assembly. Utilizing the characteristics of cylinders, such as low and controllable starting pressure and small size, the controllability of the lifting of the first lifting component 10 can be effectively improved, enabling the first lifting component 10 to provide stable structural support and fixation for the first tested component. The first driving component 61 may also include an electric cylinder assembly. Utilizing the characteristics of electric cylinders, such as strong controllability of movement speed and acceleration and the ability to stop at any position within its stroke range, effective control of the lifting height and speed of the first lifting component 10 can be achieved.

[0073] In some embodiments, please refer to Figures 1 to 3 as well as Figure 6 The number of first lifting components 10 is set to multiple, such as two, three, four or more. The first lifting component 10 can be a columnar structure that passes through the bearing plate 40. The first lifting plate 62 can be a ring structure that surrounds the center line of the bearing plate 40. Multiple first lifting components 10 are distributed at intervals around the center of the bearing plate 40 and are respectively fixed to the first lifting plate 62.

[0074] On the one hand, the first driving component 61 drives the first lifting plate 62 to rise and fall, which in turn drives multiple first lifting components 10 to rise and fall synchronously. This not only ensures the consistency of the rising and falling movement of multiple first lifting components 10, but also effectively reduces the number of parts in the bearing device, lowers the structural complexity, and reduces the difficulty of controlling the rising and falling of the first lifting components 10. On the other hand, in the first state, the multiple first lifting components 10 stably support the first test piece, so that the first test piece is suspended and fixed above the bearing plate 40 in a parallel manner, which ensures that the first test piece is stably supported and fixed.

[0075] In other embodiments, the multiple first lifting members 10 can also be independently driven to rise and fall by the first driving mechanism 60. For example, the number of first lifting members 10 and the number of first driving mechanisms 60 are both set to multiple, with each of the multiple first driving mechanisms 60 corresponding to one of the multiple first lifting members 10. Thus, through the coordinated operation of the multiple first driving mechanisms 60, the multiple first lifting members 10 can also be driven to rise and fall synchronously, forming load-bearing devices with different structural forms to meet different application requirements.

[0076] In some embodiments, please refer to Figure 1 , Figure 2 and Figure 5The drive assembly includes a second drive mechanism 70 that selectively drives the second lifting member 20 and the third lifting member 30 to move up and down. The second drive mechanism 70 includes a second drive member 71, a second lifting plate 72, a first elastic member 73, and a second elastic member 74. The second lifting member 20 and the third lifting member 30 are respectively disposed through the support plate 40 in a vertically movable manner. One end of the first elastic member 73 is connected to the support plate 40 and the other end is connected to the second lifting member 20. One end of the second elastic member 74 is connected to the support plate 40 and the other end is connected to the third lifting member 30. For example, the first elastic member 73 and the second elastic member 74 may include springs, which are sleeved on the corresponding lifting members and clamped between the support plate 40 and the bottom end of the corresponding lifting member.

[0077] The second lifting plate 72 is positioned below the support plate 40, and a first pushing part 75 is provided on the second lifting member 20, and a second pushing part 76 is provided on the second lifting plate 72 corresponding to the position of the third lifting member 30. The height of the first pushing part 75 is lower than the height of the second pushing part 76. The second driving member 71 can be a cylinder assembly or an electric cylinder assembly, and the power end of the second driving member 71 is coupled to the second lifting plate 72.

[0078] When the second lifting plate 72 is driven by the second driving member 71, causing the first pushing part 75 and the second pushing part 76 to move upward relative to the support plate 40 below it, based on the height relationship between the first pushing part 75 and the second pushing part 76, the second pushing part 76 can first push the third lifting member 30 upward, and then the first pushing part 75 can push the second lifting member 20 upward, so that the second elastic member 74 and the first elastic member 73 are compressed successively and stored elastic potential energy. Thus, in the second state, since the third lifting member 20 is located on the periphery of the first test piece, it will not affect the support and acceptance of the first test piece by the second lifting member 20; in the third state, since the height of the second lifting member 20 is lower than the height of the third lifting member 30, the second lifting member 20 will not affect the support and acceptance of the second lifting member 30 by the second test piece.

[0079] When the second driving member 71 drives the second lifting plate 72 to move downward, the first elastic member 73 and the second elastic member 74 release elastic potential energy. The first elastic member 73 provides an elastic force to cause the second lifting member 20 to descend, and the second elastic member 74 provides an elastic force to cause the third lifting member 30 to descend. Thus, in the second state, with the cooperation of the first elastic member 73 and the second lifting member 20, the first test piece is finally released onto the bearing plate 40. In the third state, with the cooperation of the second elastic member 74 and the third lifting member 30, the second test piece is finally released onto the bearing plate 40.

[0080] On the one hand, the second lifting component 20 and the third lifting component 30 share the same drive mechanism, which can effectively reduce the number of parts in the load-bearing device, make full use of the structural space, and enhance the structural compactness of the load-bearing device. On the other hand, setting the second drive mechanism 70, the second lifting component 20, and the third lifting component 30 as a separate linkage structure helps to reduce the difficulty of disassembling and assembling the load-bearing device.

[0081] In some embodiments, the first elastic element 73 and the second elastic element 74 may be omitted. When the second driving element 71 drives the second lifting plate 72 to move downward, the second lifting element 20 and the third lifting element 30 move downward under their own gravity.

[0082] In some embodiments, please refer to Figures 1 to 3 The number of the second lifting component 20 and the third lifting component 30 can also be set to multiple. For example, multiple second lifting components 20 and multiple third lifting components 30 can be evenly distributed or symmetrically distributed around the center of the bearing plate 40, so that the second lifting component 20 can stably support the first test piece and the third lifting component 30 can stably support the second test piece.

[0083] In some embodiments, based on the independent lifting characteristics of each lifting component or the characteristic that the rising height of the second lifting component 20 is always lower than that of the third lifting component 30, the third lifting component 30 can also be used to support and fix the back of the second test piece. Specifically, the bearing device also has a fourth state. In the fourth state, when the external gripping device moves the second test piece above the bearing plate 40 and makes the front of the second test piece face down, the second driving mechanism 70 or the fourth driving mechanism drives the third lifting component 30 to rise to a position higher than the upper surface of the bearing plate 40 (e.g., the adsorption part 41). This position must ensure that the front of the second test piece does not contact the bearing plate 40; thereby, the third lifting component 30 supports the front of the second test piece, thus separating the second test piece from the bearing plate 40, which allows for back inspection of the second test piece.

[0084] For example, the second test piece is a frame wafer, and the top of the third lifting member 30 can be configured with an adsorption structure, such as an electromagnet structure, a magnet structure, or a vacuum adsorption structure (such as a vacuum chuck). In the fourth state, when the third lifting member 30 rises to a position higher than the upper surface of the adsorption part 41, the third lifting member 30 can support and fix the frame wafer by adsorbing the front side of the iron ring plate of the frame wafer, so that the wafer of the frame wafer is spaced apart from the carrier disk 40. Since the blue film of the frame wafer will be kept taut under the action of the wafer's own weight, the wafer is suspended above the carrier disk 40 in a manner parallel to the carrier disk 40, and the back side of the frame wafer can be inspected at this time.

[0085] In some embodiments, please refer to Figure 7 and combined Figure 1 and Figure 2 The bottom of the support plate 40 (e.g., below the adsorption part 41) is provided with a first positioning 91. The first positioning seat 91 can be detachably connected to the second positioning seat 92 of the motion platform. For example, one of the first positioning seat 91 and the second positioning seat 92 is provided with a groove structure and the other is provided with a protrusion structure. At the same time, the first positioning seat 91 and the second positioning seat 92 are also provided with magnetic suction structures 93 respectively.

[0086] By aligning and inserting the protruding structure into the grooved structure, the carrier device is quickly positioned on the motion platform. The magnetic attraction structure 93 then engages the first positioning seat 91 and the second positioning seat 92, thus fixing the carrier device to the motion platform. In this way, the motion platform can drive the carrier device to rotate and translate the workpiece under test, allowing for adjustments to the test position to meet testing requirements.

[0087] Meanwhile, the specifications and dimensions of the carrier device (e.g., carrier plate 40) can be designed according to the type and size of the first test piece and the corresponding second test piece. For example, the carrier plate 40 can be set to a specification and size compatible with 8-inch standard wafers and 8-inch frame wafers, or it can be set to a specification and size compatible with 12-inch standard wafers and 12-inch frame wafers. By utilizing the detachable connection between the first positioning seat 91 and the second positioning seat 92, different carrier devices can be combined with the motion platform as needed, achieving the effect of multiple different carrier devices sharing the same motion platform. This not only meets the front and back inspection requirements of different types and sizes of test pieces, but also effectively saves the time required for modifying the structural system of the testing equipment, improves testing efficiency, and reduces the application cost of the testing equipment.

[0088] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. A supporting device, characterized in that, The device includes a support plate, a first lifting member, a second lifting member, a third lifting member, a drive assembly, and a pressing assembly. The first lifting member, the second lifting member, and the third lifting member are respectively disposed in the support plate, with the second lifting member being closer to the center of the support plate relative to the first lifting member, and the third lifting member being farther away from the center of the support plate relative to the first lifting member. The pressing assembly is disposed on the periphery of the support plate. The supporting device has a first state, a second state, and a third state; In the first state, the driving component is used to drive the first lifting member to move up and down relative to the carrier plate, so as to support the accessible front side of the first test piece through the first lifting member, thereby spacing the first test piece from the carrier plate; the pressing component is used to apply pressure to the back side of the first test piece to fix the first test piece on the first lifting member. In the second state, the drive component is used to drive the second lifting member to move up and down relative to the carrier plate, so as to support the back of the first test piece through the second lifting member and release the first test piece onto the carrier plate; In the third state, the driving component is used to drive the third lifting member to move up and down relative to the carrier plate, so as to support the back of the second test piece through the third lifting member and release the second test piece onto the carrier plate; wherein, the type of the first test piece is different from the type of the second test piece.

2. The bearing device as described in claim 1, characterized in that, The drive assembly includes multiple independent drive mechanisms; wherein: The plurality of drive mechanisms include a first drive mechanism and a second drive mechanism, wherein the first drive mechanism is configured to drive the first lifting member to move up and down, and the second drive mechanism is configured to selectively drive the second lifting member and the third lifting member to move up and down; The drive mechanism may include a first drive mechanism, a third drive mechanism, and a fourth drive mechanism, wherein the first drive mechanism is configured to drive the first lifting member to rise and fall, the third drive mechanism is configured to drive the second lifting member to rise and fall, and the fourth drive mechanism is configured to drive the third lifting member to rise and fall.

3. The bearing device as described in claim 2, characterized in that, The first driving mechanism includes a first driving member and a first lifting plate. The first lifting plate is disposed below the bearing plate, and the first lifting member passes through the bearing plate and is fixed to the first lifting plate. The first driving component is disposed on the support plate and connected to the first lifting plate, and is used to drive the first lifting plate to move the first lifting component up and down; And / or the second driving mechanism includes a second driving member and a second lifting plate. The second lifting member and the third lifting member are respectively capable of lifting and lowering through the support plate. The second lifting plate is disposed below the support plate, and the second lifting plate has a first pushing part corresponding to the position of the second lifting member and a second pushing part corresponding to the position of the third lifting member. The height of the first pushing part is lower than the height of the second pushing part. The second driving member is used to drive the second lifting plate to move the first pushing part and the second pushing part up and down. The first pushing part pushes the second lifting member to rise, and the second pushing part pushes the third lifting member to rise.

4. The bearing device as described in claim 3, characterized in that, The number of the first lifting components is set to multiple, and the multiple first lifting components are distributed at intervals around the center of the bearing plate, and the multiple first lifting components are all fixed to the first lifting plate.

5. The bearing device as described in claim 3, characterized in that, The second driving mechanism further includes a first elastic element and a second elastic element; one end of the first elastic element is connected to the bearing plate and the other end is connected to the second lifting element, and is used to provide an elastic force to cause the second lifting element to descend; one end of the second elastic element is connected to the bearing plate and the other end is connected to the third lifting element, and is used to provide an elastic force to cause the third lifting element to descend.

6. The bearing device as described in claim 2, characterized in that, The support plate includes an adsorption section, a transition section surrounding the adsorption section, and a support section surrounding the transition section. The upper surface of the transition section is flush with the upper surface of the adsorption section, and the upper surface of the support section is lower than the upper surface of the adsorption section. The first lifting member is disposed in the transition section, the second lifting member is disposed in the adsorption section close to the transition section, and the third lifting member is disposed in the support section.

7. The bearing device as described in claim 6, characterized in that, The support device also has a fourth state; in the fourth state, the third lifting member rises to a position higher than the upper surface of the adsorption part, so as to separate the second test piece from the support plate by supporting the front of the second test piece.

8. The bearing device as described in any one of claims 1 to 7, characterized in that, The first lifting component has a first anti-slip pad at the part that contacts the first test piece, and the pressing edge assembly has a second anti-slip pad at the part that contacts the first test piece.

9. The bearing device as described in claim 8, characterized in that, The edge pressing assembly includes an edge pressing drive and a pressing block; the edge pressing drive is disposed on the support plate and connected to the pressing block, and is used to drive the pressing block to move closer to or away from the first test piece when the first lifting member supports the first test piece; The pressing block has a pressing part and a limiting part connected to each other, and the second anti-slip pad is disposed on the pressing part; in the first state, the pressing part presses against the back of the first test piece through the second anti-slip pad, and the limiting part is used to limit the first test piece.

10. The bearing device as described in claim 8, characterized in that, The carrier device further includes a detection component, which is used to detect the status information of the first test piece on the carrier device in the first state; the detection component includes two detection elements disposed on the carrier plate, each detection element including a signal transmitting part and a signal receiving part arranged opposite to each other; the line connecting the signal transmitting part and the signal receiving part of one detection element intersects with the line connecting the signal transmitting part and the signal receiving part of the other detection element.

11. The bearing device as claimed in claim 1, characterized in that, The accessible front surface of the first test piece is the area extending 2mm to 5mm from the edge of the front surface of the first test piece toward the center.

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