Punch forming device for automobile chip heat dissipation plate

Abstract

The invention provides an automobile chip heat dissipation plate punch forming device, and belongs to the technical field of heat dissipation plate forming. Comprising a lower die, a cavity and a cooling cavity are formed in the lower die, an upper die is matched with the cavity, the cooling cavity is arranged below the cavity, and a liquid inlet and a liquid outlet which are communicated with the cooling cavity are formed in the two ends of the lower die; the liquid inlet pipe is connected with the liquid inlet, the liquid outlet pipe is connected with the liquid outlet, the waved plate is arranged in the cooling cavity in the direction of a connecting line between the liquid inlet and the liquid outlet, and the spray head is communicated with the breather pipe and faces the cavity. The cooling assembly directly acts on the lower die, heat accumulation caused by friction and material plastic deformation in the continuous stamping process of the lower die is restrained through a cooling means, thermal deformation of the die is avoided, and therefore the size precision of a die cavity during stamping every time is guaranteed, and it is ensured that the forming precision of a heat dissipation plate meets the requirement.

Description

Technical Field

[0001] This invention relates to the field of heat sink forming, and in particular to a stamping forming apparatus for automotive chip heat sinks. Background Technology

[0002] As the "brain" of core components such as the three-electric system, autonomous driving, and controller of new energy vehicles, automotive chips directly determine the operational stability and service life of automotive electronic systems through their heat dissipation efficiency. As a key heat dissipation carrier for automotive chips, heat sinks must have high flatness, high thermal conductivity, and precise compatibility with the chip packaging structure. By quickly conducting the heat generated by the chip during operation, they can prevent the chip from experiencing performance degradation, failure, or even burnout due to high temperatures. They are one of the core structural components that ensure the long-term reliable operation of automotive electronic devices.

[0003] As new energy vehicles develop towards higher power and higher integration, the power density of automotive chips continues to increase, and the heat generated per unit time increases significantly, placing more stringent requirements on the heat dissipation performance and molding precision of heat sinks.

[0004] Currently, in existing heat sink forming technology, the mold, as the core component of stamping, is prone to thermal deformation during continuous stamping due to material plastic deformation friction and heat accumulation. This leads to problems such as dimensional deviations and poor flatness in the heat sink forming process, affecting the fit between the heat sink and the chip and the heat dissipation efficiency. In addition, impurities such as metal shavings and dust generated during the stamping process are easily left on the mold surface. If they are not cleaned in time, they will cause scratches, dents and other defects on the surface of the subsequently formed heat sink, reducing the product qualification rate. Summary of the Invention

[0005] This invention provides a stamping and forming device for automotive chip heat sinks to solve the technical problem in existing heat sink forming technology where the mold, as the core component of stamping and forming, is prone to thermal deformation due to material plastic deformation friction and heat accumulation during continuous stamping, which in turn causes dimensional deviations, poor flatness, and affects the fit between the heat sink and the chip and the heat dissipation efficiency.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0007] An automotive chip heat sink stamping forming apparatus, comprising:

[0008] A frame assembly, comprising an upper mold and a lower mold, wherein the lower mold has a cavity and a cooling cavity, the upper mold is matched with the cavity, the cooling cavity is located below the cavity, and the lower mold has an inlet and an outlet at both ends communicating with the cooling cavity;

[0009] A cooling assembly, comprising: an inlet pipe, an outlet pipe, and a corrugated plate, wherein the inlet pipe is connected to the inlet port, the outlet pipe is connected to the outlet port, and the corrugated plate is disposed in the cooling chamber along the line connecting the inlet port and the outlet port, and the inlet pipe is used to supply coolant to the cooling chamber;

[0010] A cleaning assembly, comprising an air vent and a nozzle, wherein the nozzle is connected to the air vent and is positioned toward the cavity.

[0011] Optionally, the frame assembly further includes a frame, with guide rails respectively provided on the inner walls of both sides of the frame, and a connector slidably connected between the two guide rails. The drive unit at the top of the frame is connected to the connector and controls the lifting and lowering of the connector. The upper mold is installed at the bottom of the connector.

[0012] Optionally, the inlet pipe is connected to a water storage device through a first connecting pipe, and the outlet pipe is connected to the water storage device through a second connecting pipe. A micro water pump is provided on the first connecting pipe. Several staggered baffles are fixedly installed inside the water storage device along the length of the water storage device to make the water flow in a serpentine manner. Cooling components are provided inside the baffles to cool the coolant.

[0013] Optionally, both ends of the cooling cavity are provided with rectifier plate assemblies, each rectifier plate assembly including two symmetrically arranged rectifier plates with their axes intersecting, and the number of wave plates is multiple, with the multiple wave plates arranged in parallel.

[0014] Optionally, the inlet pipe is provided with a spiral guide groove, and the number of spiral guide grooves is three, and the three spiral guide grooves are evenly arranged around the inner circumference of the inlet pipe.

[0015] Optionally, a fixing member is provided inside the first connecting pipe, one end of a first spring is fixedly installed on the fixing member, and an installation block is fixedly installed on the other end of the first spring. A movable plate is rotatably installed on the installation block, and the movable plate is slidably connected to the inner wall of the spiral guide groove so that the movable plate supports displacement within the liquid inlet pipe.

[0016] Optionally, the bottom end of the first connecting pipe has an opening, and the inner wall of the first connecting pipe has an installation groove. A sealing plate is slidably installed in the installation groove. One end of a second spring is fixedly installed on one end of the sealing plate, and the other end of the second spring is fixedly connected to the inner wall of the installation groove. A stop rod is fixedly installed on the other end of the sealing plate. When the movable plate abuts against the stop rod, it pushes the sealing plate to move and open the opening. The first connecting pipe communicates with the collecting component below through the opening, and the collecting component is installed at the bottom end of the first connecting pipe.

[0017] Optionally, the inner wall of the cooling chamber is provided with a conical groove, the conical groove, the liquid inlet and the liquid inlet pipe are connected, a vertical plate is installed in the cooling chamber, an installation cylinder is installed on the vertical plate, the installation cylinder is arranged perpendicular to the vertical plate, a control rod is slidably installed in the installation cylinder, a memory metal part is connected between the control rod and the inner wall of the installation cylinder, and the movable plate supports extending into the conical groove and abutting against the control rod.

[0018] Optionally, the vent pipe and nozzle are mounted on the lower mold.

[0019] Optionally, a spiral plate is fixedly installed inside the vent pipe.

[0020] The beneficial effects of the above-mentioned technical solution of the present invention are as follows:

[0021] In the above scheme, the cooling component acts directly on the lower mold, and suppresses the heat accumulation caused by friction and plastic deformation of the material during continuous stamping by cooling the lower mold, so as to avoid thermal deformation of the mold, thereby ensuring the dimensional accuracy of the mold cavity during each stamping and ensuring that the forming accuracy of the heat sink meets the requirements.

[0022] The cleaning component is installed on the lower die. It uses the heat transfer from the cooling component to heat the airflow. The heated airflow acts on the upper surface of the lower die, which can effectively remove metal shavings, dust and other impurities remaining after stamping. This prevents impurities from affecting the fit between the die and the workpiece in subsequent stamping processes and reduces defects such as scratches and dents on the workpiece surface. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 This is a side view of the frame of the present invention;

[0025] Figure 3 This is a schematic diagram of the structure of the lower mold of the present invention;

[0026] Figure 4 This is a schematic diagram of the internal structure of the first connecting pipe and the liquid inlet pipe of the present invention;

[0027] Figure 5 This is a schematic diagram of the structure of the liquid inlet pipe and the spiral guide groove of the present invention;

[0028] Figure 6 This is a schematic diagram of the internal structure of the mold of the present invention;

[0029] Figure 7 This is a schematic diagram of the structure of the upright plate, mounting cylinder, and control rod of the present invention;

[0030] Figure 8 This is a schematic diagram of the internal structure of the water storage component of the present invention; Figure 9 This is a cross-sectional view of the lower mold part of the present invention.

[0031] [Figure Labels]

[0032] 10. Frame; 11. Drive unit; 12. Upper mold; 13. Guide rail; 14. Connector; 15. Lower mold;

[0033] 20. Cooling assembly; 21. Cooling chamber; 22. Inlet pipe; 23. Outlet pipe; 24. First connecting pipe; 221. Spiral guide groove; 25. Miniature water pump; 26. Water storage device; 27. Second connecting pipe; 28. Rectifier plate; 29. ​​Corrugated plate; 210. Baffle plate;

[0034] 30. Self-cleaning component; 31. Fixing element; 32. First spring; 33. Mounting block; 34. Movable plate; 35. Collection element; 36. Mounting slot; 37. Sealing plate; 38. Push rod; 39. Second spring;

[0035] 40. Control components; 41. Conical groove; 42. Vertical plate; 43. Mounting cylinder; 44. Control lever; 45. Memory metal component;

[0036] 50. Cleaning components; 51. Vent pipe; 52. Nozzle; 53. Spiral plate. Detailed Implementation

[0037] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. It should also be noted that, to make the embodiments more comprehensive, the following embodiments are the best and preferred embodiments, and those skilled in the art can use other alternative methods to implement some well-known technologies; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit the present invention.

[0038] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.

[0039] Generally, terms can be understood at least partly from their use in context. For example, depending at least partly on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood not necessarily to convey an exclusive set of factors, but rather, alternatively, depending at least partly on the context, to allow for the presence of other factors that are not necessarily explicitly described.

[0040] It is understood that the meanings of “on”, “above”, and “above” in this invention should be interpreted in the broadest manner, such that “on” means not only “directly on” something, but also includes the meaning of being “on” something with an intervening feature or layer, and that “above” or “above” means not only “on” something, but also includes the meaning of being “on” something without an intervening feature or layer.

[0041] Furthermore, spatially related terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for convenience to describe the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. Spatially related terms are intended to cover different orientations in the use or operation of the device other than those depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially related descriptive terms used herein can be interpreted similarly.

[0042] like Figures 1 to 9 As shown, an embodiment of the present invention provides a stamping and forming device for automotive chip heat sinks, including a frame assembly. The frame assembly includes an upper mold 12, a lower mold 15, and a frame 10. Guide rails 13 are respectively provided on the inner walls of both sides of the frame 10. A connecting member 14 is slidably connected between the two guide rails 13. A driving member 11 at the top of the frame 10 is connected to the connecting member 14 and controls the lifting and lowering of the connecting member 14. The upper mold 12 is installed at the bottom of the connecting member 14. This is prior art and will not be described in detail here. The lower mold 15 has a cavity and a cooling cavity 21. The upper mold 12 matches the cavity. The cooling cavity 21 is located below the cavity. The two ends of the lower mold 15 have liquid inlets and outlets communicating with the cooling cavity 21.

[0043] like Figure 3 , Figure 6 and Figure 8As shown, the lower mold 15 is equipped with a cooling assembly, which includes an inlet pipe 22, an outlet pipe 23, and a corrugated plate 29. The inlet pipe 22 is connected to the inlet, and the outlet pipe 23 is connected to the outlet. The corrugated plate 29 is arranged in the cooling chamber 21 along the line connecting the inlet and the outlet. The inlet pipe 22 is used to supply coolant to the cooling chamber 21. The cooling assembly 20 is used to cool the lower mold 15, suppress mold thermal deformation, and ensure stamping accuracy.

[0044] The frame 10 provides a stable installation base for the entire device. A pair of guide rails 13 ensure the lifting and lowering accuracy of the connector 14. The drive component 11 controls the connector 14 to slide up and down along the guide rails 13, thereby driving the upper mold 12 to achieve lifting and lowering action. It cooperates with the lower mold 15 fixed on the frame 10 to complete the closing stamping or separation and reset action, thereby realizing the stamping and forming of the automotive chip heat sink.

[0045] The cooling component 20 acts directly on the lower mold 15, suppressing the heat accumulation caused by friction and material plastic deformation during continuous stamping by cooling the lower mold 15, avoiding thermal deformation of the mold, thereby ensuring the dimensional accuracy of the mold cavity during each stamping and ensuring that the forming accuracy of the heat sink meets the requirements.

[0046] The inlet pipe 22 is connected to the water storage component 26 through the first connecting pipe 24, and the outlet pipe 23 is connected to the water storage component 26 through the second connecting pipe 27. A micro water pump 25 is provided on the first connecting pipe 24. Several staggered baffles 210 are fixedly installed in the water storage component 26 along the length of the water storage component 26 so that the water flows in a serpentine manner from one end to the other in the water storage component 26. Cooling components are provided in the baffles 210 to cool the coolant.

[0047] The inlet pipe 22 and outlet pipe 23 respectively serve as the input and output of cooling water. The micro water pump 25 provides power for the cooling water circulation, driving the cooling water from the water storage component 26 through the first connecting pipe 24 and the inlet pipe 22 into the cooling chamber 21. After absorbing the heat of the mold, the cooling water flows back to the water storage component 26 through the outlet pipe 23 and the second connecting pipe 27, forming a closed-loop circulating cooling system. The baffles 210 staggered inside the water storage component 26 can disrupt the flow trajectory of the returning cooling water, avoid local stagnation of cooling water, and make the returning hot water fully mix with the cold water in the water storage component 26, reducing the temperature of the cooling water output again. At the same time, its internal refrigeration components cool the cooling water, improve the cooling effect, further effectively reduce the mold temperature, suppress thermal deformation, and ensure the stability of stamping accuracy.

[0048] The cooling cavity 21 is provided with rectifier plate groups at both ends. Each rectifier plate group includes two symmetrically arranged rectifier plates 28, and the axes of the two rectifier plates 28 in one rectifier plate group intersect. The included angle between the two rectifier plates 28 faces the center of the cooling cavity 21. There are multiple wave plates 29, which are arranged in parallel.

[0049] The extension direction of the corrugated plate 29 is the same as the length direction of the cooling cavity 21. The rectifier plate 28 can guide and rectify the cooling water entering the cooling cavity 21, preventing the cooling water from forming turbulence or eddies in the cooling cavity 21, so that the cooling water flows evenly in a preset direction, covering the entire area of ​​the cooling cavity 21, and preventing local heat dissipation dead zones. The corrugated plate 29 increases the flow path length and heat exchange area of ​​the cooling water, prolongs the residence time of the cooling water in the cooling cavity 21, and allows the cooling water to exchange heat with the mold more fully. At the same time, the corrugated plate 29 can also enhance the turbulence of the cooling water, further improve the heat exchange efficiency, make the mold temperature distribution more uniform, reduce the mold deformation caused by local temperature differences, and further improve the consistency of the heat sink forming size.

[0050] like Figure 4 , Figure 5 and Figure 7 As shown, a spiral guide groove 221 is provided inside the liquid inlet pipe 22. There are three spiral guide grooves 221, and the three spiral guide grooves 221 are evenly arranged around the inner circumference of the liquid inlet pipe. The extension direction of the spiral guide groove 221 is the same as the extension direction of the liquid inlet pipe 22.

[0051] A self-cleaning component 30 is provided inside the first connecting pipe 24. The self-cleaning component 30 includes a fixing member 31. The fixing member 31 is provided inside the first connecting pipe 24. One end of the first spring 32 is fixedly installed on the fixing member 31. The other end of the first spring 32 is fixedly installed on the mounting block 33. A movable plate 34 is rotatably installed on the mounting block 33. The movable plate 34 is slidably connected to the inner wall of the spiral guide groove 221, so that the movable plate 34 can move and extend out of the liquid inlet pipe 22.

[0052] An opening is provided at the bottom end of the first connecting pipe 24, and an installation groove 36 is provided inside the pipe wall of the first connecting pipe 24. A sealing plate 37 is slidably installed in the installation groove 36. One end of a second spring 39 is fixedly installed on one end of the sealing plate 37, and the other end of the second spring 39 is fixedly connected to the inner wall of the installation groove 36. A stop rod 38 is fixedly installed on the other end of the sealing plate 37. When the movable plate 34 abuts against the stop rod 38, it pushes the sealing plate 37 to move and open the opening. The first connecting pipe 24 communicates with the collecting component 35 below through the opening. The collecting component 35 is installed at the bottom end of the first connecting pipe 24. When the stop rod 38 is not abutting against the movable plate 34, the second spring 39 drives the sealing plate 37 to reset and isolate the collecting component 35 from the interior of the first connecting pipe 24.

[0053] The equidistant spiral guide grooves 221 inside the liquid inlet pipe 22 guide the cooling water to flow along a spiral trajectory when it passes through the liquid inlet pipe 22, so that the cooling water forms a spiral water flow. The spiral water flow not only increases the contact area between the cooling water and the inner wall of the liquid inlet pipe 22, but also enhances the turbulence of the water flow, avoiding the problem of insufficient heat exchange caused by laminar flow of cooling water in the liquid inlet pipe 22. At the same time, after the spiral water flow enters the cooling chamber 21, it can better cooperate with the rectifier plate 28 and the wave plate 29 in the cooling chamber 21 to maintain the uniformity and turbulent state of the water flow in the cooling chamber 21, further improving the cooling efficiency of the entire cooling system, making the mold cool down faster and the temperature more stable.

[0054] The self-cleaning component 30 inside the first connecting pipe 24 is fixedly installed by the fastener 31. The first spring 32 on the fastener 31 provides elastic support for the mounting block 33 and the movable plate 34. When the micro water pump 25 starts and the cooling water flows in the first connecting pipe 24, the water flow impact force pushes the movable plate 34. The first spring 32 stretches, causing the movable plate 34 to rotate around the mounting block 33 and slide along the inner wall of the spiral guide groove 221. When the water flow stops, the first spring 32 resets, driving the mounting block 33 and the movable plate 34 back to the initial position. During the sliding process, the edge of the movable plate 34 can scrape the spiral guide groove 221 and the inner wall of the liquid inlet pipe 22, peeling off the scale, metal particles and other impurities attached to the wall surface, completing one self-cleaning action. The automatic cleaning of the inner wall of the liquid inlet pipe 22 is achieved by using the power of the water flow itself, without the need for manual disassembly and cleaning, reducing equipment downtime maintenance time, avoiding the accumulation of impurities that may cause blockage of the liquid inlet pipe 22 or obstruction of water flow, ensuring the circulation stability of the cooling system, and reducing maintenance costs.

[0055] like Figure 4 As shown, the collector 35 is used to collect impurities scraped off the inner wall of the inlet pipe 22 when the movable plate 34 resets. The collector 35, which is fixedly installed on the first connecting pipe 24, works in conjunction with the self-cleaning component 30. When the first spring 32 drives the movable plate 34 to reset, the impurities scraped off by the movable plate 34 will enter the collector 35 due to gravity. The collector 35 provides a dedicated storage space for impurities, preventing the scraped impurities from re-entering the cooling system circulation, preventing impurities from clogging the cooling chamber 21, the inlet pipe 22, or the outlet pipe 23. At the same time, it facilitates subsequent periodic centralized cleaning of impurities without disassembling the entire cooling system, ensuring a stable cooling water flow rate, maintaining the efficient operation of the cooling system, and further improving the continuous operating time of the equipment.

[0056] The mounting groove 36 inside the first connecting pipe 24 provides sliding mounting space for the sealing plate 37. Under the action of the second spring 39, the sealing plate 37 is normally in a closed state, that is, it closes the opening end of the collector 35, which can prevent impurities in the collector 35 from flowing back to the main channel of the first connecting pipe 24. When the movable plate 34 is reset, the movable plate 34 will contact the abutment 38 on the sealing plate 37 and push the abutment 38, so that the sealing plate 37 overcomes the elastic force of the second spring 39 and slides along the mounting groove 36, opening the collection channel of the collector 35. At this time, the impurities scraped off by the movable plate 34 can enter the collector 35 by gravity, realizing the effective collection and isolation of impurities, avoiding the backflow of impurities and affecting the cooling system. At the same time, no additional power is required to control the movement of the sealing plate 37. The structure is simple and reliable, further improving the practicality and stability of the self-cleaning component.

[0057] like Figures 6 to 7 As shown, a control component 40 is provided inside the cooling chamber 21. The control component 40 includes a conical groove 41. The inner wall of the cooling chamber 21 has a conical groove 41. The conical groove 41, the liquid inlet, and the liquid inlet pipe 22 are connected. A vertical plate 42 is installed inside the cooling chamber 21. An installation cylinder 43 is installed on the vertical plate 42. The installation cylinder 43 is perpendicular to the vertical plate 42. A control rod 44 is slidably installed inside the installation cylinder 43. A memory metal part 45 is connected between the control rod 44 and the inner wall of the installation cylinder 43. A movable plate 34 can extend into the conical groove 41 and abut against the control rod 44.

[0058] The tapered groove 41 has its tapered side facing the inlet pipe 22. Located between two flow plates 28, the control rod 44, in conjunction with the movable plate 34, restricts the cooling water flow. One end of the control rod 44 extends into the tapered groove 41, and the water flow pulls the movable plate 34 into the groove, where it remains in contact with the control rod 44. When the mold temperature rises and the water temperature in the cooling chamber 21 increases, the shape memory metal part 45 contracts, pulling the control rod 44 away from the tapered groove 41, increasing the cross-sectional area of ​​the water flow channel between the movable plate 34 and the tapered groove 41, thereby increasing the cooling water flow and improving heat dissipation efficiency. When the mold temperature decreases and the water temperature in the cooling chamber 21 drops, the shape memory metal part 45 recovers, and the control rod 44 and the movable plate 34 reset under the pulling force of the shape memory metal part 45, reducing the cross-sectional area of ​​the water flow channel, decreasing the cooling water flow, and preventing over-cooling that could lead to condensation on the mold. By utilizing the temperature sensing characteristics of the memory metal part 45, the cooling water flow rate can be adaptively adjusted, enabling the heat dissipation capacity of the cooling system to dynamically match the heat generation of the mold. This ensures that the mold temperature remains stable within a reasonable range, saves energy, and enhances the intelligence and economy of the cooling system.

[0059] like Figure 2 , Figure 3 and Figure 9As shown, a cleaning assembly 50 is provided on the lower mold 15. The cleaning assembly 50 is used to clean the upper surface of the lower mold 15 by heating the airflow. The cleaning assembly 50 includes an air vent 51 and a nozzle 52, which are installed on the lower mold 15. The nozzle 52 is connected to the air vent 51 and faces the cavity. A spiral plate 53 is fixedly installed inside the air vent 51. The cavity is formed on the upper surface of the lower mold 15. The other end of the air vent 51 is connected to an air source.

[0060] The cleaning component 50 uses the heat transfer from the cooling component 20 to heat the airflow. The heated airflow acts on the upper surface of the lower die 15, which can efficiently remove metal shavings, dust and other impurities remaining after stamping. This prevents impurities from affecting the fit between the die and the workpiece in subsequent stamping processes and reduces defects such as scratches and dents on the workpiece surface.

[0061] Cooling component 20 ensures stamping accuracy, while cleaning component 50 maintains mold cleanliness. Together, they improve the forming quality of the heat sink and production continuity, and reduce the defect rate.

[0062] The vent pipe 51 of the cleaning component 50 is used to introduce airflow. The nozzle 52 is fixedly installed on the lower mold 15 and faces the cavity, so that the airflow can accurately act on the mold cavity and surrounding area. During the cooling process of the mold, the cooling component 20 will generate a certain amount of heat transfer. This heat can be transferred to the airflow in the vent pipe 51, causing the airflow to heat up. The heated airflow is sprayed out through the nozzle 52. The heated airflow can prevent condensation on the mold surface due to airflow impact, protect the mold from rust, and at the same time can quickly blow away metal debris, dust and other impurities remaining after stamping. The residual heat of the cooling component 20 is used to heat the airflow to achieve energy recovery and utilization, maintain the cleanliness of the mold cavity, ensure the surface quality of the subsequent stamped workpieces, and avoid damage to the mold caused by condensation, thus extending the service life of the mold.

[0063] The spiral plate 53 fixedly installed inside the vent pipe 51 can guide and turbulent the airflow passing through the vent pipe 51, causing the airflow to flow along a spiral trajectory and form a spiral airflow. The spiral airflow can not only increase the residence time of the airflow in the vent pipe 51, fully absorb the heat transferred by the cooling component 20 and improve the airflow heating effect, but also enhance the impact force and coverage of the airflow when it is ejected, so that the airflow ejected by the nozzle 52 can act more comprehensively and powerfully on the cavity and surrounding area of ​​the lower mold 15, and improve the efficiency of impurity removal.

[0064] The workflow of the technical solution of this invention is as follows:

[0065] After the drive unit 11 is started, it drives the connecting part 14 to move down along the guide rail 13, thereby driving the upper mold 12 and the lower mold 15 to close, and stamping the raw material placed on the cavity of the lower mold 15 to complete the basic structure processing of the heat sink; after the stamping is completed, the drive unit 11 drives the connecting part 14 and the upper mold 12 to move up and reset, waiting for the next stamping.

[0066] During the stamping process, the cooling component 20 starts synchronously, and the micro water pump 25 works, transporting the cooling water in the water storage component 26 to the cooling chamber 21 through the first connecting pipe 24 and the liquid inlet pipe 22. The equidistant spiral guide grooves 221 in the liquid inlet pipe 22 guide the cooling water to form a spiral water flow, enhancing the water flow turbulence. After entering the cooling chamber 21, the cooling water is rectified by the rectifier plate 28 and flows evenly between the corrugated plates 29. The corrugated plates 29 increase the heat exchange area and turbulence intensity, allowing the cooling water to fully absorb the heat from the lower mold 15. After absorbing the heat, the cooling water flows back to the water storage component 26 through the liquid outlet pipe 23 and the second connecting pipe 27. The staggered baffles 210 and the refrigeration components in the water storage component 26 allow the hot water and cold water to mix. The mixture is thoroughly mixed and cooled to achieve closed-loop cooling. Meanwhile, the control component 40 in the cooling chamber 21 responds to water temperature changes in real time: when the mold temperature rises, the water temperature in the cooling chamber 21 rises, the shape memory metal part 45 deforms, the control rod 44 and the movable plate 34 abut in the first position to increase the cross-sectional area of ​​the water flow channel and increase the cooling water flow rate; when the water temperature drops, the shape memory metal part 45 returns to its original shape, the control rod 44 and the movable plate 34 abut in the second position to reduce the cross-sectional area of ​​the water flow channel between the movable plate 34 and the conical groove 41, reduce the flow rate, and achieve adaptive temperature control.

[0067] During the cooling water circulation process, the self-cleaning component 30 works synchronously. The water flow impact force pushes the movable plate 34 to rotate around the mounting block 33 and slide along the inner wall of the spiral guide groove 221. When the water flow impact force weakens, the first spring 32 drives the movable plate 34 to reset, scraping and peeling off impurities from the wall surface. At this time, the movable plate 34 pushes the abutment rod 38, causing the sealing plate 37 to overcome the elastic force of the second spring 39 and open the collection member 35. The scraped impurities enter the collection member 35 with gravity, realizing the collection and isolation of impurities and preventing impurities from clogging the cooling system.

[0068] The heat generated by the cooling component 20 during operation is transferred to the vent pipe 51 of the cleaning component 50. The spiral plate 53 inside the vent pipe 51 guides the airflow to form a spiral shape, prolonging the airflow residence time and fully absorbing heat to raise the temperature. The heated airflow is then sprayed directionally through the nozzle 52 into the cavity and surrounding area of ​​the lower mold 15, blowing away residual metal shavings, dust and other impurities from the stamping process, preventing impurities from affecting subsequent stamping. At the same time, the heated airflow prevents condensation on the mold surface and protects the mold.

[0069] This invention encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this invention. To provide the public with a thorough understanding of this invention, specific details are described in detail in the preferred embodiments, while those skilled in the art will fully understand the invention even without these details. Furthermore, to avoid unnecessary misunderstanding of the essence of this invention, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0070] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A stamping and forming apparatus for automotive chip heat sinks, characterized in that, include: A frame assembly, comprising an upper mold and a lower mold, wherein the lower mold has a cavity and a cooling cavity, the upper mold is matched with the cavity, the cooling cavity is located below the cavity, and the lower mold has an inlet and an outlet at both ends communicating with the cooling cavity; A cooling assembly, comprising: an inlet pipe, an outlet pipe, and a corrugated plate, wherein the inlet pipe is connected to the inlet port, the outlet pipe is connected to the outlet port, and the corrugated plate is disposed in the cooling chamber along the line connecting the inlet port and the outlet port, and the inlet pipe is used to supply coolant to the cooling chamber; A cleaning assembly, comprising an air vent and a nozzle, wherein the nozzle is connected to the air vent and is positioned toward the cavity.

2. The automotive chip heat sink stamping and forming apparatus according to claim 1, characterized in that, The frame assembly also includes a frame, with guide rails on the inner walls of both sides of the frame, and a connector slidably connected between the two guide rails. The drive unit at the top of the frame is connected to the connector and controls the lifting and lowering of the connector. The upper mold is installed at the bottom of the connector.

3. The automotive chip heat sink stamping and forming apparatus according to claim 1, characterized in that, The inlet pipe is connected to a water storage device through a first connecting pipe, and the outlet pipe is connected to the water storage device through a second connecting pipe. A miniature water pump is installed on the first connecting pipe. Several staggered baffles are fixedly installed inside the water storage device along its length to make the water flow in a serpentine manner. Cooling components are installed inside the baffles to cool the coolant.

4. The automotive chip heat sink stamping and forming apparatus according to claim 3, characterized in that, The cooling cavity is provided with rectifier plate assemblies at both ends. Each rectifier plate assembly includes two symmetrically arranged rectifier plates with their axes intersecting. There are multiple wave plates arranged in parallel.

5. The automotive chip heat sink stamping and forming apparatus according to claim 4, characterized in that, The inlet pipe is provided with three spiral guide grooves, which are evenly arranged around the inner circumference of the inlet pipe.

6. The automotive chip heat sink stamping and forming apparatus according to claim 5, characterized in that, The first connecting pipe is provided with a fixing component, and one end of the first spring is fixedly installed on the fixing component. The other end of the first spring is fixedly installed with a mounting block. A movable plate is rotatably installed on the mounting block. The movable plate is slidably connected to the inner wall of the spiral guide groove so that the movable plate supports displacement within the liquid inlet pipe.

7. The automotive chip heat sink stamping and forming apparatus according to claim 6, characterized in that, The first connecting pipe has an opening at its bottom end and an installation groove inside its wall. A sealing plate is slidably installed in the installation groove. One end of a second spring is fixedly installed on one end of the sealing plate, and the other end of the second spring is fixedly connected to the inner wall of the installation groove. A stop rod is fixedly installed on the other end of the sealing plate. When the movable plate abuts against the stop rod, it pushes the sealing plate to move and open the opening. The first connecting pipe communicates with the collecting component below through the opening. The collecting component is installed at the bottom end of the first connecting pipe.

8. The automotive chip heat sink stamping and forming apparatus according to claim 6, characterized in that, The inner wall of the cooling chamber is provided with a conical groove, the conical groove, the liquid inlet and the liquid inlet pipe are connected, a vertical plate is installed in the cooling chamber, and an installation cylinder is installed on the vertical plate. The installation cylinder is set perpendicular to the vertical plate, and a control rod is slidably installed in the installation cylinder. A memory metal part is connected between the control rod and the inner wall of the installation cylinder. The movable plate supports extending into the conical groove and abutting against the control rod.

9. The automotive chip heat sink stamping and forming apparatus according to claim 1, characterized in that, The vent pipe and nozzle are installed on the lower mold.

10. The automotive chip heat sink stamping and forming apparatus according to claim 9, characterized in that, A spiral plate is fixedly installed inside the vent pipe.

Images