Alloy frame resistance load platform and laser processing equipment

Abstract

The application provides an alloy frame resistance loading platform and a laser processing device. The alloy frame resistance loading platform comprises: an insulating base module, comprising a loading platform base and an insulating base plate, wherein the loading platform base is configured to provide basic support, and the insulating base plate is arranged on the loading platform base and is configured to be partially insulated from the alloy frame resistance to avoid circuit short circuit during laser processing; a supporting and adsorbing module, arranged on the loading platform base and penetrating through the insulating base plate, configured to adsorb a frame entity part of the alloy frame resistance and avoid the hollowed-out area of the alloy frame resistance to avoid air leakage; and a positioning module, arranged on the loading platform base, configured to push the alloy frame resistance to a positioning reference position.

Description

Technical Field

[0001] This application relates to the field of laser processing equipment technology, and more specifically, to an alloy frame resistor stage and laser processing equipment. Background Technology

[0002] In the field of laser processing technology, alloy frame resistors, as power resistors with low temperature coefficient, high current carrying capacity, and excellent heat dissipation performance, are widely used in high-end equipment manufacturing fields such as power management, automotive electronics, and industrial control. However, the structural characteristics of alloy frame resistors—overall conductivity, hollow core, suspended resistive body, and soft, easily deformable material—make them prone to short circuits, air leakage during hollow adsorption, deformation during rigid clamping, and unevenness of the resistive body during laser processing clamping. Existing stage devices cannot simultaneously meet the process requirements of full insulation protection, hollow avoidance support, flexible positioning and clamping, and reliable vacuum adsorption, severely restricting the accuracy and product yield of laser processing. Therefore, developing a laser processing stage suitable for alloy frame resistors—with full insulation, hollow adaptation, flexible positioning, and reliable adsorption—has become a key problem urgently needing to be solved in the current laser processing equipment field. Summary of the Invention

[0003] The purpose of this application is to address the technical problems in related technologies by providing an alloy frame resistor stage and laser processing equipment. The specific solution is as follows:

[0004] This application provides an alloy frame resistor stage, comprising: an insulating base module, including a stage base and an insulating substrate, the stage base being configured to provide basic support, and the insulating substrate being disposed on the stage base and configured to insulate the portion in contact with the alloy frame resistor to prevent short circuits during laser processing; a support adsorption module, disposed on the stage base and penetrating the insulating substrate, configured to adsorb the frame body portion of the alloy frame resistor, while avoiding the hollow areas of the alloy frame resistor to prevent air leakage during adsorption; and a positioning module, disposed on the stage base and configured to push the alloy frame resistor to a positioning reference position.

[0005] In some embodiments, the insulating substrate includes: a support bearing surface configured to bear the alloy frame resistor;

[0006] An abutment portion is provided on the supporting bearing surface and configured to avoid the hollow area of ​​the alloy frame resistor, so that the insulating substrate only supports the frame solid part to achieve resistor suspension.

[0007] In some embodiments, the insulating substrate further includes a limiting portion disposed at the edge of the supporting bearing surface, wherein the upper surface of the limiting portion is higher than the plane where the supporting bearing surface is located, and is configured to limit the positioning reference position of the alloy frame resistor.

[0008] In some embodiments, the support adsorption module includes: a suction nozzle, a plurality of suction nozzles penetrating the insulating substrate, and the upper port of the suction nozzle being flush with the top surface of the insulating substrate, configured to fit against the frame body portion of the alloy frame resistor to form a sealed negative pressure adsorption space.

[0009] In some embodiments, the suction nozzle and the avoidance portion are staggered and do not overlap, configured to ensure stable adsorption and prevent air leakage during adsorption.

[0010] In some embodiments, the positioning module includes an active positioning module located on the side of the insulating substrate away from the limiting portion, configured to push the alloy frame resistor along a first direction to move closer to the limiting portion.

[0011] In some embodiments, the positioning module further includes: a driven positioning module, which is a follower guide structure of the active positioning module, configured to push the alloy frame resistor to move along a second direction to approach the limiting portion, wherein the first direction is perpendicular to the second direction; in response to the active positioning module moving toward the first direction, the driven positioning module moves toward the second direction.

[0012] In some embodiments, the active positioning module and the passive positioning module are provided with an insulating buffer layer on the side facing the alloy frame resistor, configured to prevent deformation of the frame resistor and to achieve insulation protection.

[0013] In some embodiments, the alloy frame resistor stage further includes a flexible clamping module, mounted on the stage base and at least partially suspended above the insulating substrate, configured to flexibly clamp the alloy frame resistor.

[0014] This application also provides a laser processing device, including: the alloy frame resistor stage configured to support the alloy frame resistor; and a laser configured to perform laser processing on the alloy frame resistor.

[0015] Compared with related technologies, the above-described solutions of this application have at least the following beneficial effects:

[0016] The insulating substrate in the alloy frame resistor stage provided in this application is made of insulating material, which structurally avoids direct contact between the alloy frame resistor and the metal parts of the device, eliminating the problem of short circuits during laser processing. The support adsorption module penetrates the insulating substrate and acts only on the frame body of the alloy frame resistor, effectively avoiding the hollow area. This solves the three major problems of clamping, adsorption, and insulation caused by the soft material, hollow resistor part, and overall conductive properties of the alloy resistor, achieving accurate positioning and stable vacuum adsorption of the alloy resistor.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. In the drawings:

[0019] Figure 1 This is a schematic diagram of the structure of an alloy frame resistor stage according to an exemplary embodiment.

[0020] Figure 2 This is a schematic diagram of an alloy frame resistor stage equipped with an alloy frame resistor, according to an exemplary embodiment.

[0021] Figure 3 This is a schematic diagram of the structure of an insulating substrate according to an exemplary embodiment.

[0022] Figure 4 This is a schematic diagram illustrating the structure of an active positioning module and a passive positioning module linked together according to an exemplary embodiment.

[0023] Figure 5 This is a partially enlarged view illustrating the linkage of a driven positioning module according to an exemplary embodiment.

[0024] Figure 6 This is a schematic diagram of a flexible clamping module according to an exemplary embodiment.

[0025] Figure label:

[0026] Platform base 100;

[0027] Insulating substrate 200, supporting surface 210, clearance portion 220, through hole 221, limiting portion 230, first limiting portion 231, second limiting portion 232;

[0028] 300mm nozzle;

[0029] Active positioning module 400, first driving component 410, active positioning push plate 420, active pushing surface 421, guide inclined side 422, fixed support 430, first elastic component 440, first guide slide rail 450;

[0030] Driven positioning module 500, driven positioning push plate 510, driven pushing surface 511, bearing 520, second guide slide rail 530, second elastic element 540;

[0031] Flexible clamping module 600, second drive component 610, transmission linkage mechanism 620, fulcrum pin 630, floating pressure head 640;

[0032] Alloy frame resistor 700. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0034] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. “Multiple” generally includes at least two, and other quantifiers are similar.

[0035] It should be understood that although the terms "first," "second," "third," etc., may be used in the embodiments of this application, these descriptions should not be limited to these terms. These terms are only used to distinguish the described objects. For example, "first" may also be referred to as "second," and similarly, "second" may also be referred to as "first," without departing from the scope of the embodiments of this application. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0036] It should be understood that the term "and / or" as used herein is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship. The singular forms "a," "the," and "the" are also intended to include the plural forms unless the context clearly indicates otherwise.

[0037] It is further understood that the terms “center,” “longitudinal,” “lateral,” “front,” “rear,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0038] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0039] Depending on the context, the words “if” or “suppose” as used here can be interpreted as “when” or “in response to determination” or “in response to detection.” Similarly, depending on the context, the phrases “if determination” or “if detection (of the stated condition or event)” can be interpreted as “when determination” or “in response to determination” or “when detection (of the stated condition or event)” or “in response to detection (of the stated condition or event).”

[0040] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or device. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or device that includes said element.

[0041] In related technologies, the structure of alloy frame resistors differs fundamentally from that of traditional ceramic substrate resistors. Alloy frame resistors have a frame structure with completely hollowed-out areas between the resistor bodies, suspending the resistor bodies within the frame. The substrate of alloy frame resistors is a metal alloy, such as manganin, nickel copper, or constantan, which is conductive overall. The material is soft and easily deformable compared to ceramic substrate resistors, exhibiting lower mechanical strength, thinner thickness (typically 0.1mm~0.3mm), and prone to edge warping. These characteristics present numerous technical challenges to the laser processing of alloy frame resistors. Traditional stages are mostly made of metal and are primarily designed for traditional ceramic substrate resistors, failing to fully consider the overall conductivity, hollowed-out structure, and soft, easily deformable nature of alloy frame resistors. Direct contact with the alloy resistor can lead to a short circuit, preventing further processing. The hollowed-out structure around the component causes air leakage at the hollowed-out areas with traditional vacuum adsorption methods, making it impossible to establish an effective negative pressure. The alloy frame is easily deformed under stress; traditional rigid clamping can damage the product and easily cause bending during positioning. Due to the combined characteristics of the hollowed-out structure and the soft material, edge pressing alone cannot guarantee the flatness of the resistor body area.

[0042] To address the aforementioned technical problems, this application provides an alloy frame resistor stage, comprising: an insulating base module, including a stage base and an insulating substrate, wherein the stage base is configured to provide basic support, and the insulating substrate is disposed on the upper surface of the stage base. The insulating substrate is made of insulating material and is configured to prevent short circuits during processing; a support adsorption module, disposed on the stage base and penetrating the insulating substrate, configured to adsorb the frame body portion of the alloy frame resistor; and a positioning module, disposed on the stage base, configured to push the alloy frame resistor to a positioning reference position.

[0043] The insulating substrate in the alloy frame resistor stage provided in this application is made of insulating material, which structurally avoids direct contact between the alloy frame resistor and the metal parts of the device, eliminating the problem of short circuits during laser processing. The support adsorption module penetrates the insulating substrate and acts only on the frame body of the alloy frame resistor, effectively avoiding the hollow area. This solves the three major problems of clamping, adsorption, and insulation caused by the soft material, hollow resistor part, and overall conductive properties of the alloy resistor, achieving accurate positioning and stable vacuum adsorption of the alloy resistor.

[0044] The optional embodiments of this application are described in detail below with reference to the accompanying drawings.

[0045] This application provides an alloy frame resistor stage, such as Figure 1 As shown, it includes an insulating base module, a support adsorption module, a positioning module, and a flexible pressing module.

[0046] In some embodiments, such as Figure 2 , Figure 3As shown, the insulating base module includes a platform base 100 and an insulating substrate 200. The platform base 100 serves as the basic support component of the entire device, providing a stable mounting foundation for the various functional structures of the excitation alloy frame resistor platform.

[0047] The insulating substrate 200 is made of insulating material and is mounted on the stage base 100 via a stage base, preventing unnecessary workpiece loss due to mechanical conductivity during subsequent resistance processing steps. When the alloy frame resistor 700 is placed on the insulating substrate 200, all components in contact with the alloy frame resistor 700 are insulated structures, both during placement and processing. This prevents any conductive parts from directly contacting the alloy metal frame, fundamentally avoiding short circuits during processing and ensuring the normal operation of resistance detection and laser processing.

[0048] In some embodiments, such as Figure 3 As shown, the insulating substrate 200 has a supporting surface 210, which is a planar area on the upper surface of the insulating substrate 200, used to directly support the alloy frame resistor 700, providing a stable foundation for the resistor.

[0049] The flatness of the supporting surface 210 is precisely machined and adjusted, with accuracy controlled within the range of 8~15μm. Limiting the flatness within this range satisfies the process requirements for the horizontality of the reference surface during laser processing of the alloy frame resistor 700, while also taking into account processing difficulty and manufacturing costs, avoiding technical and cost problems caused by excessively high or low accuracy requirements. If the flatness is greater than 15μm, the surface unevenness deviation of the supporting surface 210 will be too large, causing the alloy frame resistor 700 to warp or tilt after placement, failing to guarantee the consistency of the focal plane during laser processing, directly reducing the accuracy of resistance fine-tuning, and even causing product defects. If the flatness is less than 8μm, although the accuracy of the reference surface can be further improved, it will significantly increase the processing difficulty and manufacturing cost of the insulating substrate 200, and exceed the actual process requirements for laser processing of the alloy frame resistor 700, resulting in accuracy redundancy.

[0050] This embodiment preferably features a 10μm flatness design, which achieves an optimal balance between processing difficulty and manufacturing cost while meeting the high-precision processing requirements of laser processing. This ensures the horizontal state of the alloy frame resistor 700 when initially placed, providing a unified and accurate reference surface for subsequent positioning, adsorption and clamping processes. It also effectively ensures the consistency of the focal plane in laser processing, significantly improving the processing accuracy of the resistor and the accuracy of resistance value fine-tuning.

[0051] In some embodiments, such as Figure 1 , Figure 2As shown, since the resistor body may have a certain thickness, when the alloy frame resistor 700 is placed on the surface of the insulating substrate 200, multiple resistors may be unevenly arranged, which hinders the accuracy of processing. Therefore, this application provides a clearance portion 220 on the insulating substrate 200. The shape and position of the clearance portion 220 correspond to and match the hollow area of ​​the alloy frame resistor 700, so that the insulating substrate 200 only supports the frame body of the alloy frame resistor 700 without making any contact or support to the resistor body in the hollow area, keeping the resistor body in a natural suspended state. This avoids contact interference affecting the resistance value and can also be used with the adsorption structure to achieve air-leakage adsorption.

[0052] In some embodiments, the clearance portion 220 can be a recessed groove disposed on the insulating substrate 200. The groove has a concave structure, and its shape matches the hollow area of ​​the alloy frame resistor 700, providing sufficient clearance space for the resistor. The recessed groove structure can avoid the accumulation of debris and dust generated during laser processing, while ensuring that the laser beam path is unobstructed and free from interference, making it more suitable for subsequent laser processing steps on the resistor.

[0053] In some embodiments, such as Figure 3 As shown, the avoidance portion 220 can be a through hole penetrating the insulating substrate 200. The through hole adopts a completely transparent through-type structure, and the hole shape corresponds to the hollow area of ​​the alloy frame resistor 700, which can achieve non-contact avoidance of the entire area of ​​the resistor. The through hole structure can quickly dissipate the heat of laser processing, smoothly discharge smoke and debris, avoid processing interference and table contamination, and make the overall structure more suitable for subsequent laser processing steps on the resistor.

[0054] In some embodiments, the insulating substrate 200 further includes a limiting portion 230, which is located at the edge of the supporting surface 210, and the upper surface of the limiting portion 230 is higher than the plane of the supporting surface 210. The limiting portion 230 is configured to provide a positioning reference position when the alloy frame resistor 700 is placed, forming a boundary limit on the alloy frame resistor 700 to prevent the resistor from shifting or falling during placement or pushing. At the same time, it provides a precise positioning endpoint for the positioning module, ensuring that the positioning position is consistent each time and improving positioning accuracy.

[0055] In some embodiments, the limiting portion 230 includes a first limiting portion 231 and a second limiting portion 232. The first limiting portion 231 extends along a first direction, and the second limiting portion 232 extends along a second direction. The two are perpendicular to each other and intersect at one corner of the supporting bearing surface 210, together forming an L-shaped positioning reference surface. The inner surfaces of the first limiting portion 231 and the second limiting portion 232 serve as positioning references for the first and second directions, respectively, and can precisely fit with the adjacent sides of the alloy frame resistor 700. With the bidirectional pushing action of the positioning module, the resistor is constrained to a unique preset position, further improving positioning consistency and processing repeatability accuracy.

[0056] In some embodiments, for ease of describing the positioning direction, the direction in which the alloy frame resistor 700 approaches the first limiting part 231 is defined as the first direction, and the direction in which the alloy frame resistor 700 approaches the second limiting part 232 is defined as the second direction, wherein the first direction and the second direction are perpendicular to each other. Through the bidirectional positioning cooperation of the first direction and the second direction, the alloy frame resistor 700 can be smoothly pushed to the positioning reference position, ensuring accurate positioning.

[0057] In some embodiments, multiple first limiting portions 231 may be provided. These multiple first limiting portions 231 are arranged at intervals along a first direction, and corresponding limiting points can be selected according to the resistor length to adapt to different product specifications. The multi-segment limiting structure also enhances the overall rigidity of the L-shaped reference surface, reduces deformation during processing and use, ensures long-term repeatable positioning accuracy, and improves adaptability and positioning stability for various alloy frame resistors 700.

[0058] In some embodiments, multiple second limiting portions 232 may be provided, and the multiple second limiting portions 232 are arranged at intervals along the second direction, which can provide multi-point support and limiting in the resistance width direction, avoiding local stress concentration or positioning misalignment caused by single-segment limiting.

[0059] In some embodiments, the alloy frame resistor stage includes a support and adsorption module, which is integrally mounted on the stage base 100 and extends upward to penetrate the insulating substrate 200 to achieve stable installation and reliable adsorption. The support and adsorption module applies a vacuum adsorption force to the frame body of the alloy frame resistor 700, without acting on the hollowed-out areas, thus preventing airflow leakage in the hollowed-out areas and solving the problems of air leakage and adsorption failure in traditional stages, achieving stable and reliable adsorption and fixation.

[0060] In some embodiments, the support adsorption module includes multiple suction nozzles 300, all of which penetrate the insulating substrate 200. The insulating substrate 200 has through holes 221 for assembling the suction nozzles 300. The upper end of each suction nozzle 300 is flush with the support bearing surface 210 of the insulating substrate 200, allowing the suction nozzle 300 to fit tightly against the frame of the alloy frame resistor 700, forming a closed negative pressure adsorption space. This ensures stable and effective negative pressure adsorption, avoids localized deformation of the resistor body due to inconsistent heights of the multiple suction nozzles 300, and is suitable for the soft and easily deformable characteristics of the alloy frame resistor 700.

[0061] In some embodiments, the suction nozzles 300 and the clearance portions 220 are arranged in a staggered and non-overlapping manner. The suction nozzles 300 are all arranged in the support bearing surface 210 region of the insulating substrate 200, corresponding to the frame solid portion of the alloy frame resistor 700; the clearance portions 220 are opened corresponding to the hollowed-out region of the alloy frame resistor 700.

[0062] The nozzle 300 is positioned completely apart from the clearance part 220, allowing the nozzle 300 to only adhere to the frame of the alloy frame resistor 700 to form a negative pressure adsorption. The clearance part 220 only avoids contact with the suspended resistor body. The two do not interfere with each other, effectively preventing the nozzle 300 from connecting with the hollow area of ​​the alloy frame resistor 700 and causing air leakage. This ensures stable and reliable vacuum adsorption and also ensures that the resistor body is in a completely suspended state, improving the flatness and processing accuracy of laser processing.

[0063] In some embodiments, the alloy frame resistor stage further includes a positioning module, which is integrally mounted on the stage base 100 and located on the side of the insulating substrate 200. The positioning module is configured to smoothly push the alloy frame resistor 700 to the positioning reference position defined by the limiting part 230. The positioning module employs a flexible pushing method, avoiding rigid impact and compression on the alloy frame resistor 700, thus solving the problem of resistor deformation and scratches easily caused by traditional positioning methods, and achieving high-precision, non-destructive flexible positioning.

[0064] In some embodiments, the positioning module includes an active positioning module 400, located on the side of the insulating substrate 200 away from the first limiting portion 231. The active positioning module 400 can push the alloy frame resistor 700 to move along a first direction, gradually bringing the resistor closer to the limiting portion 230 until it reaches the positioning reference position. The active positioning module 400 provides the active driving force required for positioning the alloy frame resistor, and also provides the basic power for achieving bidirectional precise positioning.

[0065] In some embodiments, such as Figure 2 , Figure 4As shown, the active positioning module 400 includes a first driving member 410, a first guide rail 450, and an active positioning push plate 420. The first driving member 410 is mounted on the platform base 100, providing power output for the pushing of the positioning module. The active positioning push plate 420 is movably mounted on the platform base 100 via the first guide rail 450. The active positioning push plate 420 is connected to the output end of the first driving member 410 and is configured to move along a first direction under the drive of the first driving member 410 so that the active pushing surface 421 of the active positioning push plate 420 contacts and pushes the alloy frame resistor 700. The active positioning push plate 420 drives the resistor to move with a smooth pushing force, avoiding instantaneous impact force and protecting the soft alloy frame from being crushed.

[0066] Specifically, the active positioning push plate 420 can be made of engineering plastics such as polyphenylene sulfide (PPS), polyoxymethylene (POM), and polyetheretherketone (PEEK), or a metal structural component with an outer insulating layer. The plane in direct contact between the active positioning push plate 420 and the alloy frame resistor 700 is the active pushing surface 421, which is an insulating structure. Under the drive of the first driving member 410, the active pushing surface 421 directly contacts one side frame of the alloy frame resistor 700, applying an active driving force along the first direction to achieve unidirectional pushing of the alloy frame resistor 700.

[0067] In some embodiments, the active positioning module 400 further includes a first elastic element 440, which extends along a first direction, with one end connected to the active positioning push plate 420 and the other end connected to the platform base 100 or a fixed support 430 fixedly connected to the platform base 100. The first elastic element 440 is configured to provide a reset pulling force to the active positioning push plate 420, causing the active positioning push plate 420 to tend to move towards its initial retracted position. Once the active positioning module 400 has completed its positioning, the first driving member 410 no longer provides driving force to the active positioning push plate 420. At this time, the first elastic element 440 can quickly pull the active positioning push plate 420 back to its original position, avoiding interference with the robot's material handling actions.

[0068] In some embodiments, such as Figure 1 , Figure 4 As shown, the active positioning push plate 420 includes a guide inclined side 422 disposed on the side of the active positioning push plate 420. The guide inclined side 422 is in at least partial contact with the driven positioning module 500 and is configured to drive the driven positioning module 500 to move synchronously along the second direction when the active positioning module 400 moves along the first direction.

[0069] The driven positioning module 500 is a follow-up guiding structure of the active positioning module 400, which can cooperate with the active positioning module 400 to push the alloy frame resistor 700 to move along the second direction and approach the limiting part 230. When the active positioning module 400 moves towards the first direction, the driven positioning module 500 moves towards the second direction simultaneously to achieve bidirectional follow-up guidance, so that the alloy frame resistor 700 moves smoothly to the positioning reference position.

[0070] In some embodiments, such as Figure 2 As shown, the driven positioning module 500 includes a second guide rail 530 and a driven positioning push plate 510. The second guide rail 530 is fixedly mounted on the platform base 100 and extends along the second direction. The driven positioning push plate 510 is slidably connected to the second guide rail 530. The second guide rail 530 is configured to provide linear motion constraints for the driven positioning push plate 510, ensuring that the movement direction of the driven positioning push plate 510 is stable and accurate. This, in turn, cooperates with the active positioning push plate 420 to achieve bidirectional follow-up guidance, ensuring that the alloy frame resistor 700 reaches the positioning reference position smoothly and accurately.

[0071] Specifically, the driven positioning push plate 510 is arranged along the first direction, and the side end face of the driven positioning push plate 510 facing the insulating substrate 200 is the driven pushing surface 511, which is adapted to the side profile of the alloy frame resistor 700 and configured to form an elastic pressing and guiding constraint on the alloy frame resistor 700 along the second direction.

[0072] In some embodiments, such as Figure 2 , Figure 5 As shown, the driven positioning module 500 also includes a bearing 520 and a second elastic element 540.

[0073] The bearing 520 is disposed on the second guide slide rail 530 and is in direct contact with the guide inclined side 422 of the active positioning push plate 420. It is configured to convert the linear motion of the active push plate in the first direction into its own rolling friction, thereby driving the driven positioning push plate 510 to move relative to the second guide slide rail 530, reducing the motion resistance, and ensuring that the driven positioning push plate 510 moves smoothly and steadily along the second direction.

[0074] One end of the second elastic element 540 is connected to the driven positioning push plate 510, and the other end is connected to the platform base 100 or the fixed support 430. In response to the active positioning push plate 420 moving along the first direction, the second elastic element 540 stretches, storing elastic potential energy; in response to the active push plate resetting, the second elastic element 540 releases its elastic force, pushing the driven positioning push plate 510 to reset along the second direction. During the process of the driven positioning push plate 510 pushing the alloy frame resistor 700 to move along the second direction, the second elastic element 540 provides a preload force to ensure that the bearing 520 always conforms to the guide inclined edge 422 of the active push plate.

[0075] In some embodiments, the active positioning module 400 pushes the alloy frame resistor 700 to the reference position of the first limiting part 231 along the first direction via the active pushing surface 421; the driven positioning module 500, under the linkage of the bearing 520 and the guide inclined edge 422, moves synchronously along the second direction. The driven pushing surface 511 of the driven positioning push plate 510 directly contacts the alloy frame resistor 700, forming elastic pressure and guiding constraint on the side of the alloy frame resistor 700, eliminating the fit gap, and preventing the alloy frame resistor 700 from tilting, shifting, or getting stuck during the pushing process.

[0076] After positioning is completed, the first driving component 410 no longer provides driving force to the active positioning push plate 420. The active positioning push plate 420 retracts along the first direction under the action of the first elastic component 440, while the driven positioning push plate 510 resets along the second direction under the action of the second elastic component 540, ensuring that the soft and easily deformable alloy frame resistor 700 is always constrained to the unique positioning reference position, thereby improving repeatability and processing stability.

[0077] In some embodiments, the first elastic element 440 is a tension spring, and the second elastic element 540 is a compression spring; the tension spring is used to provide a reset pulling force along the first direction for the active positioning push plate 420, so that the active positioning push plate 420 can reliably retract after the drive is released; the compression spring is used to provide an elastic pushing force along the second direction for the driven positioning push plate 510, so that the driven positioning push plate 510 always maintains flexible pressing and adaptive fit against the alloy frame resistor 700, thereby achieving stable, gapless, and damage-free positioning constraint.

[0078] It should be noted separately that the accompanying drawings of this application illustrate only one implementation method, but this disclosure is not limited thereto. Equivalent substitutions, simple modifications, partial additions, subtractions, or combinations of the structures shown in the drawings without departing from the concept of this disclosure should all be covered within the protection scope of this disclosure.

[0079] In some embodiments, both the active positioning push plate 420 and the driven positioning push plate 510 are provided with an insulating buffer layer on the side facing the alloy frame resistor 700. The insulating buffer layer serves two purposes: firstly, it provides insulation, further enhancing the overall insulation effect of the device and preventing short circuits; secondly, it provides flexible buffering, avoiding rigid contact and squeezing between the push plate and the resistor, preventing deformation, indentation, or scratches on the alloy frame, and achieving non-destructive positioning.

[0080] In some embodiments, such as Figure 6 As shown, the alloy frame resistor stage also includes a flexible clamping module 600. The flexible clamping module 600 is installed on the stage base 100, and at least part of its structure is suspended above the insulating substrate 200. It is configured to flexibly level and clamp the alloy frame resistor 700, so that the resistor remains flat and attached to the surface of the insulating substrate 200, further improving the stability and flatness of the resistor during processing and ensuring the accuracy of laser processing.

[0081] In some embodiments, the flexible pressing module 600 includes a second driving member 610, a transmission linkage mechanism 620, and a floating pressure head 640. The second driving member 610 is fixedly mounted on the platform base 100, providing lifting power for the entire pressing module. Its output end extends and retracts in the vertical direction to drive the transmission linkage mechanism 620 to achieve pressing and retracting actions. The floating pressure head 640 can be made of PPS-coated silicone rubber, fluororubber, or other insulating elastomers.

[0082] In some embodiments, the transmission linkage mechanism 620 is connected to the output end of the second driving member 610. The linkage mechanism forms a lever transmission structure with the fulcrum pin 630 fixed to the base plate as the center, realizing the reversal and synchronous transmission of force and motion. When the second driving member 610 pushes the power input end of the linkage mechanism downward, the lower connecting rod rotates clockwise around the fulcrum pin 630, and drives the connecting rod to rotate synchronously around the fulcrum in the opposite direction through the shaft, thereby driving the floating pressure head 640 on the other side of the linkage mechanism to move downward synchronously in the vertical direction, so that the floating pressure heads 640 on both sides maintain a linkage state of rising and falling together, avoiding warping or uneven force on the alloy frame resistor 700 caused by unilateral pressing.

[0083] In some embodiments, the fulcrum pin 630 is fitted with a rigid support and a precision pin to provide a stable rotation center for the linkage mechanism, ensuring the displacement ratio and force transmission accuracy of the lever transmission; the segments of the linkage are connected by hinged pairs with controllable clearance, which not only ensures the smoothness of motion transmission, but also avoids idle stroke or transmission lag, so that the lifting action of the floating pressure head 640 and the driving action of the second driving member 610 form a precise timing correspondence.

[0084] During the positioning and clamping stage, the clamping surface of the floating pressure head 640 makes flexible contact with the surface of the alloy frame resistor 700. Under the synchronous constraint of the linkage mechanism, a uniformly distributed clamping force is always formed on the resistor, effectively eliminating the positioning deviation caused by assembly gaps and part tolerances. During the reset stage, the second driving component 610 drives in the reverse direction, and the linkage mechanism rotates in the opposite direction around the fulcrum, driving the floating pressure head 640 to move upward and reset. This provides sufficient space for the next loading and positioning of the alloy frame resistor 700, ensuring the stability of continuous processing and the repeatability of positioning accuracy.

[0085] In some embodiments, the transmission linkage mechanism 620 distributes the power of a single driving element to the floating pressure heads 640 on both sides through a lever structure. This achieves high synchronization of the clamping action on both sides without the need for additional synchronization control elements, which simplifies the complexity of the mechanism and improves the reliability and maintainability of the system. It is especially suitable for the high-precision positioning and clamping requirements of soft and easily deformable alloy frame resistor 700 type parts.

[0086] In some embodiments, the floating pressure head 640 is suspended directly above the frame solid area of ​​the insulating substrate 200, applying pressure only to the edge portion of the alloy frame resistor 700, completely avoiding the central hollow area to prevent damage to the suspended resistor body. The floating pressure head 640 is made of insulating elastic material or has an insulating buffer layer, providing both flexible contact and insulating protection.

[0087] In some embodiments, after the alloy frame resistor 700 completes positioning and vacuum adsorption, the second driving component 610 drives the transmission linkage mechanism 620 to rotate around the fulcrum. The other side of the linkage drives the floating pressure head 640 to descend smoothly, flexibly pressing the frame of the alloy frame resistor 700, so that the alloy frame resistor 700 further conforms to the support bearing surface 210 and remains flat. After laser processing is completed, the second driving component 610 retracts, driving the transmission linkage mechanism 620 to rotate in the opposite direction. The floating pressure head 640 moves upward with the linkage mechanism to reset, releasing the pressing state and facilitating the handling of finished resistors. The dual-sided synchronous pressing structure combined with the flexible pressure head design ensures the flatness and stability of the resistor during processing, while avoiding mechanical damage to the soft alloy frame, effectively improving laser processing accuracy and product yield.

[0088] In some embodiments, the alloy frame resistor stage further includes a negative pressure detection element, which is connected to the negative pressure pipeline of the suction nozzle 300 and configured to monitor the negative pressure value in the adsorption pipeline in real time, determine whether an effective seal adsorption is formed between the suction nozzle 300 and the alloy frame resistor 700, and only output a processing permission signal when the adsorption seal meets the standard, so as to provide safe start-up conditions for laser processing and improve the automation and safety of the device.

[0089] In some embodiments, when using the alloy frame resistor stage provided in this application, the alloy frame resistor 700 needs to be placed on the support surface 210 of the insulating substrate 200 first by a robot or other means. The positioning module is then activated, and the active positioning module 400 and the passive positioning module 500 operate synchronously to push the alloy frame resistor 700 to the positioning reference position limited by the limiting part 230 to achieve reference positioning. Next, the support adsorption module vacuum adsorbs the frame body of the alloy frame resistor 700 through the suction nozzle 300, and the flexible pressing module 600 flexibly presses and flattens the resistor. After the negative pressure detection element confirms that the adsorption is satisfactory, the laser trimming equipment begins processing. After processing is completed, the support adsorption module releases the negative pressure, the flexible pressing module 600 releases the pressure, the positioning module resets, and the processed alloy frame resistor 700 is then removed by a robot or other moving method.

[0090] This application avoids direct contact between the alloy frame resistor 700 and metal components through an insulating contact structure, thus eliminating the risk of short circuit during resistance adjustment at the source. The insulating substrate 200 supports only the resistor frame body of the alloy frame resistor 700, allowing multiple resistor bodies to be naturally suspended and flat. The adsorption module is dedicated to adsorbing the frame body of the alloy frame resistor 700, avoiding the hollow areas, thus completely solving the problem of adsorption leakage.

[0091] This application also provides a laser processing device, including the alloy frame resistor stage and a laser.

[0092] The alloy frame resistor stage is configured to provide fully insulated support for the alloy frame resistor 700. Before laser processing, the alloy frame resistor 700 is positioned on the surface of the insulating substrate 200, providing a reliable processing benchmark with consistent levelness, high positioning accuracy, and no deformation during clamping for the laser processing of the alloy frame resistor.

[0093] The laser is positioned on one side of the alloy frame resistor stage and is configured to emit a laser beam with a preset power and wavelength according to the resistance value processing requirements of the alloy frame resistor 700. After being focused by the optical path system, the laser beam acts on the surface of the resistive element of the alloy frame resistor. Through the thermal effect of the laser, the resistive element is precisely etched and adjusted, thereby changing the conductive cross-sectional area or length of the resistive element. This enables high-precision fine-tuning of the resistance value of the alloy frame resistor, meeting the resistance accuracy requirements under different application scenarios.

[0094] The specific structure, working principle, and beneficial effects of the alloy frame resistor stage provided in this application embodiment can be referred to the alloy frame resistor stage described in any of the above embodiments, and will not be repeated here.

[0095] Finally, it should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the systems or apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple, and relevant parts can be referred to the method section.

[0096] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An alloy frame resistor stage, characterized in that, include: An insulating base module includes a stage base and an insulating substrate. The stage base is configured to provide basic support, and the insulating substrate is disposed on the stage base and configured to be partially insulated from the alloy frame resistor to avoid short circuits during laser processing. A support adsorption module is provided on the platform base and penetrates the insulating substrate. It is configured to adsorb the frame body of the alloy frame resistor and avoids the hollow area of ​​the alloy frame resistor to avoid adsorption leakage. A positioning module, disposed on the platform base, is configured to push the alloy frame resistor to the positioning reference position. The insulating substrate includes: The supporting surface is configured to support the alloy frame resistor; An abutment portion is provided on the supporting bearing surface and configured to avoid the hollow area of ​​the alloy frame resistor, so that the insulating substrate only supports the frame solid part to achieve resistor suspension.

2. The alloy frame resistor stage according to claim 1, characterized in that, The insulating substrate further includes: A limiting part is disposed at the edge of the supporting bearing surface, and the upper surface of the limiting part is higher than the plane where the supporting bearing surface is located, configured to limit the positioning reference position of the alloy frame resistor.

3. The alloy frame resistor stage according to claim 1, characterized in that, The supporting adsorption module includes: A plurality of suction nozzles penetrate the insulating substrate, and the upper port of the suction nozzle is flush with the top surface of the insulating substrate, configured to fit against the frame body portion of the alloy frame resistor to form a sealed negative pressure adsorption space.

4. The alloy frame resistor stage according to claim 3, characterized in that, The suction nozzle and the avoidance part are staggered and do not overlap, which is configured to ensure stable adsorption and avoid air leakage during adsorption.

5. The alloy frame resistor stage according to claim 2, characterized in that, The positioning module includes: An active positioning module is located on the side of the insulating substrate away from the limiting portion, and is configured to push the alloy frame resistor to move along a first direction to approach the limiting portion.

6. The alloy frame resistor stage according to claim 5, characterized in that, The positioning module further includes: The driven positioning module is a follow-up guide structure of the active positioning module, configured to push the alloy frame resistor to move along the second direction to approach the limiting part; Wherein, the first direction is perpendicular to the second direction; in response to the active positioning module moving toward the first direction, the passive positioning module moves toward the second direction.

7. The alloy frame resistor stage according to claim 6, characterized in that, The active positioning module and the passive positioning module are provided with an insulating buffer layer on the side facing the alloy frame resistor, which is configured to prevent the frame resistor from deforming and to achieve insulation protection.

8. The alloy frame resistor stage according to claim 1, characterized in that, Also includes: A flexible clamping module is mounted on the platform base and at least partially suspended above the insulating substrate, configured to flexibly clamp the alloy frame resistor.

9. A laser processing device, characterized in that, include: The alloy frame resistor stage according to any one of claims 1-8 is configured to carry an alloy frame resistor; A laser configured to perform laser processing on the alloy frame resistor.

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