Water immersion laser processing device and method based on negative pressure adsorption

Abstract

The invention belongs to the technical field of underwater laser combined machining, particularly relates to a water immersion laser machining device and method based on negative pressure adsorption, and effectively overcomes the defects of insufficient water film control precision and poor universality in existing water immersion laser machining by integrating a negative pressure adsorption fixing mechanism and a linkage pressing mechanism. The same negative pressure source is used for driving the pressing block to move downwards and adsorb and fix the workpieces, self-adaptive pressing and sealing of the workpieces with different thicknesses are achieved, and it is ensured that a stable and uniform thin water layer with the controllable thickness is formed on the surfaces of the workpieces. According to the integrated design, the stability and controllability of water film formation are remarkably improved, a continuous and reliable efficient cooling and chip removal environment is provided for laser machining, therefore, a heat affected zone can be more effectively restrained, slag and deformation are reduced, and finally the machining precision and the surface quality are greatly improved; meanwhile, the device is compact in structure and easy and convenient to adjust, and the adaptability to different working conditions and the process consistency are enhanced.

Description

Technical Field

[0001] This invention belongs to the field of underwater laser composite processing technology, and particularly relates to a water immersion laser processing device and processing method based on negative pressure adsorption. Background Technology

[0002] Water immersion laser processing is a novel technology that utilizes water as a medium to improve processing quality. Its core principle is that when a laser acts on the workpiece, a layer of water is formed or maintained at the processing point. This water layer efficiently absorbs and carries away the heat generated during processing, thereby significantly suppressing the heat-affected zone, reducing slag and thermal deformation, and ultimately improving processing accuracy and the quality of hole walls and cut surfaces.

[0003] Based on the form of the water layer, this technology is mainly divided into two modes: full immersion and semi-immersion. Full immersion machining involves completely submerging the workpiece in water, utilizing a stable and uniform enveloping water layer to achieve powerful cooling from all directions, making it particularly suitable for high-precision micro-hole machining that is extremely sensitive to heat input. Semi-immersion machining, on the other hand, typically forms a localized, thinner water film or flow on the workpiece surface, focusing on auxiliary cooling and chip removal in specific machining areas.

[0004] However, existing technologies have significant shortcomings in terms of the precision of water film formation and control. The current mainstream approach relies on a simple overflow system, which involves continuously injecting water into a fixed container, submerging the workpiece, and allowing it to overflow naturally, thus forming a flowing water film on the surface. This device is limited by its fixed physical structure and support method, resulting in poor versatility. When the thickness of the workpiece changes, the thickness of the water film also changes, failing to meet processing requirements. Summary of the Invention

[0005] The purpose of this invention is to provide a water immersion laser processing device and method based on negative pressure adsorption to solve the above-mentioned problems.

[0006] To achieve the above objectives, the present invention provides the following solution:

[0007] A water immersion laser processing device based on negative pressure adsorption includes: a support block, a workpiece disposed at the top of the support block, baffles disposed on opposite sides of the workpiece, the baffles being fixedly connected to the support block, a water flow channel disposed inside the support block for water flow, a flow channel inlet opened on the side wall of the water flow channel, the flow channel inlet communicating with a flow channel outlet, the flow channel outlet being located on the side of the baffles near the workpiece, and the flow channel outlet being located above the workpiece;

[0008] The bearing block is equipped with a negative pressure adsorption mechanism for fixing the workpiece. The negative pressure adsorption mechanism is connected to a negative pressure generating mechanism. Two pressure blocks are arranged above the bearing block. Each pressure block has a through groove along its length. There is a distance between the through groove and the bottom surface of the pressure block. Both pressure blocks are located between two baffles. The two ends of each pressure block are in sliding contact with the two baffles. The two pressure blocks are located at the two ends of the baffles. The pressure blocks are located at the movable end of the displacement mechanism. The displacement mechanism is driven by the negative pressure generating mechanism to move the pressure blocks downward.

[0009] In the water immersion laser processing device based on negative pressure adsorption of the present invention, the negative pressure generating mechanism includes a negative pressure housing, which is disposed below the support block. A negative pressure cavity is formed inside the negative pressure housing, and a negative pressure pump is connected to the negative pressure cavity. The negative pressure adsorption mechanism is connected to the negative pressure cavity.

[0010] In the water immersion laser processing device based on negative pressure adsorption of the present invention, the negative pressure adsorption mechanism includes a plurality of vertically arranged through holes, which are opened on the support block and located at the four corners of the support block respectively. A suction tube is inserted through the through hole, the top end of the suction tube is in contact with the workpiece, and the bottom end of the suction tube is connected to the negative pressure cavity.

[0011] In the water immersion laser processing device based on negative pressure adsorption of the present invention, the displacement mechanism includes a U-shaped frame with the opening of the U-shaped frame facing downward. The pressure block is connected to the upper part of the U-shaped frame, and sliders are fixed to both ends of the U-shaped frame. The sliders are vertically slidably connected inside the sliding tube, and the sliding tube is connected to the negative pressure cavity.

[0012] In the water immersion laser processing device based on negative pressure adsorption of the present invention, the bottom end of the slider abuts against a spring, and the bottom end of the spring abuts against the bottom end of the sliding tube.

[0013] In the water immersion laser processing device based on negative pressure adsorption of the present invention, a sleeve is horizontally slidably connected on the U-shaped frame, and the pressure block is fixed to the bottom end of the sleeve.

[0014] In the water immersion laser processing device based on negative pressure adsorption of the present invention, a baffle is fixedly connected inside the negative pressure housing, and a connecting hole is opened in the baffle. The bottom end of the connecting hole extends out of the negative pressure housing and is connected to the outlet of the water pump. The water pump is fixedly installed at the bottom end of the negative pressure housing, and the top end of the connecting hole extends into the bearing block and is connected to the water flow tank.

[0015] In the water immersion laser processing device based on negative pressure adsorption of the present invention, the support block is disposed in the box, and an overflow trough is provided between the support block and the box.

[0016] In the water immersion laser processing device based on negative pressure adsorption of the present invention, a water outlet pipe is connected to the side wall of the box, and the water outlet pipe is connected to the water inlet of the water pump.

[0017] A processing method based on a water immersion laser processing device using negative pressure adsorption, comprising the following steps:

[0018] Place the workpiece on top of the support block and between the two baffles. Activate the negative pressure generating mechanism. The negative pressure generating mechanism will adsorb the workpiece onto the top surface of the support block and drive the pressure block to move down and press on the top surface of the workpiece. Water is supplied to the water tank. The water flows in from the inlet of the flow channel and flows out from the outlet of the flow channel, forming a water film on the top surface of the workpiece. The laser drilling device will drill a through hole at the set position of the workpiece. Turn off the laser drilling device, wait for the workpiece to cool down, stop the negative pressure generating mechanism, stop the water supply, and remove the workpiece.

[0019] Compared with the prior art, the present invention has the following advantages and technical effects:

[0020] This invention effectively overcomes the shortcomings of insufficient water film control precision and poor versatility in existing water immersion laser processing by integrating a negative pressure adsorption and clamping mechanism. Utilizing a single negative pressure source to drive the pressure block downwards and adsorb and fix the workpiece, it achieves adaptive clamping and sealing for workpieces of varying thicknesses, ensuring the formation of a stable, uniform, and controllable thin water layer on the workpiece surface. This integrated design significantly improves the stability and controllability of water film formation, providing a continuous, reliable, and efficient cooling and chip removal environment for laser processing. This more effectively suppresses the heat-affected zone, reduces slag and deformation, and ultimately greatly improves processing accuracy and surface quality. Simultaneously, the device has a compact structure, is easy to adjust, and enhances adaptability to different working conditions and process consistency. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly described below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Figure 1 This is a top view of the present invention; Figure 2 for Figure 1 AA section view in the middle; Figure 3 for Figure 1 BB section view in the middle; Figure 4 for Figure 2 A magnified view of a section at point C; Figure 5 for Figure 2 A magnified view of a section at point D; Among them, 1. Sleeve; 2. Pressure block; 3. Box body; 4. Suction pipe; 5. U-shaped frame; 6. Negative pressure shell; 7. Water pump; 8. Negative pressure pump; 9. Water outlet pipe; 10. Through hole; 11. Overflow trough; 12. Baffle; 13. Workpiece; 14. Bearing block; 15. Retaining ring; 16. Stop block; 17. Sliding tube; 18. Spring; 19. Slider; 20. Connecting hole; 21. Flow channel; 22. Flow channel inlet; 23. Flow channel outlet; 24. Through groove. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] Reference Figures 1 to 5 This invention discloses a water immersion laser processing device based on negative pressure adsorption, comprising: a support block 14, a workpiece 13 disposed at the top of the support block 14, baffles 12 disposed on opposite sides of the workpiece 13, the baffles 12 being fixedly connected to the support block 14, a water flow channel 21 disposed inside the support block 14 for water flow, a flow channel inlet 22 being provided on the side wall of the water flow channel 21, the flow channel inlet 22 being connected to a flow channel outlet 23, the flow channel outlet 23 being disposed on the side of the baffle 12 near the workpiece 13, and the flow channel outlet 23 being located above the workpiece 13;

[0025] The bearing block 14 is equipped with a negative pressure adsorption mechanism for fixing the workpiece 13. The negative pressure adsorption mechanism is connected to a negative pressure generating mechanism. Two pressure blocks 2 are arranged above the bearing block 14. A through groove 24 is opened on the pressure block 2. The through groove 24 is arranged along the length direction of the pressure block 2. A distance is left between the through groove 24 and the bottom surface of the pressure block 2. The two pressure blocks 2 are located between the two baffles 12. The two ends of the pressure blocks 2 are in sliding contact with the two baffles 12. The two pressure blocks 2 are respectively located at the two ends of the baffles 12. The pressure blocks 2 are set at the movable end of the displacement mechanism. The displacement mechanism is driven by the negative pressure generating mechanism to move the pressure blocks 2 downward.

[0026] The through-slot 24 is 1mm high, 120mm long, and 5mm wide. It ensures water flow on the surface of workpiece 13, guaranteeing a stable and uniformly thick flowing water film, effectively reducing debris and bubbles that easily occur during underwater laser processing. In traditional static underwater laser processing, debris and bubbles interfere with the laser propagation path, reducing processing accuracy and surface quality. Dynamic water flow can promptly remove these debris and bubbles, ensuring stable laser beam propagation and thus improving the quality of the processed holes.

[0027] First, the workpiece 13 to be processed is placed on top of the support block 14, positioned between the baffles 12 fixed on both sides. After the negative pressure generating mechanism is activated, the negative pressure adsorption mechanism inside the support block 14 begins to work, using negative pressure to firmly adsorb and fix the workpiece 13 to the top surface of the support block 14, which is the first layer of fixation. At the same time, the negative pressure generating mechanism drives the displacement mechanism, causing its movable end to move the two pressure blocks 2 located above the workpiece 13 downwards until the pressure blocks 2 press firmly against the top surface of the workpiece 13, which is the second layer of fixation. The two ends of the pressure blocks 2 slide in contact with the baffles 12 and are located at the two ends of the baffles 12, which ensures the uniformity and stability of the clamping force. After fixation is completed, water is introduced into the water channel 21 inside the support block 14. The water enters from the inlet 22 and finally flows out from the outlet 23 located on the baffles 12 with the opening above the workpiece 13, thereby forming a water film covering the processing area on the top surface of the workpiece 13. The groove 24 on the pressure block 2 provides a channel for the flow of water film, avoiding stagnant water zones and helping to maintain the stability and uniformity of the water film. Furthermore, the distance between the groove 24 and the bottom surface of the pressure block 2 is constant, ensuring that the thickness of the water film remains constant regardless of changes in workpiece thickness. Through the combined action of negative pressure adsorption and mechanical pressing, the workpiece 13 is reliably fixed, effectively preventing workpiece displacement caused by water flow or equipment vibration during laser processing, thus guaranteeing extremely high processing accuracy. Simultaneously, the groove 24 on the pressure block 2 forms a stable and uniform flowing water film on the surface of the workpiece 13. This water film can promptly remove heat and debris generated during processing, greatly reducing the heat-affected zone and improving the surface quality and precision of laser micro-hole processing. The displacement mechanism allows the pressing action of the pressure block 2 to be synchronized and automatically performed with the negative pressure adsorption, improving the automation level and operational efficiency of the equipment.

[0028] In one alternative embodiment, the negative pressure generating mechanism includes a negative pressure housing 6, which is disposed below the support block 14. A negative pressure cavity is formed inside the negative pressure housing 6, and a negative pressure pump 8 is connected to the negative pressure cavity. The negative pressure adsorption mechanism is connected to the negative pressure cavity.

[0029] In use, starting the negative pressure pump 8 will generate the required negative pressure in the negative pressure chamber. This ensures a stable and reliable air supply for the negative pressure adsorption mechanism, and its compact structure facilitates unified power management and maintenance.

[0030] In one alternative embodiment, the negative pressure adsorption mechanism includes a plurality of vertically arranged through holes 10, which are opened on the support block 14 and located at the four corners of the support block 14 respectively. A suction tube 4 is inserted through the through hole 10, the top end of the suction tube 4 is in contact with the workpiece 13, and the bottom end of the suction tube 4 is connected to the negative pressure chamber.

[0031] The suction tube 4 has an outer diameter of 16mm, an inner diameter of 14mm, and a suction end orifice diameter of 4mm. The radius of the through hole 10 is 10mm.

[0032] A retaining ring 15 is coaxially fixed to the top of the through hole 10, and the inner edge of the retaining ring 15 abuts against the outer wall of the suction end of the suction tube 4.

[0033] Under theoretical conditions, the suction end of the suction tube 4 is flush with the top of the support block 14 and is set to adsorb the workpiece 13 under negative pressure, and the bottom surface of the workpiece 13 is in contact with the top surface of the support block 14.

[0034] The baffle 12 is 5mm high and the distance between it and the through hole 10 is 15mm.

[0035] Multiple vertical through holes 10 are made at the four corners of the support block 14, and a suction tube 4 is inserted into each through hole 10. In use, the top end of the suction tube 4 contacts the bottom surface of the workpiece 13, and the bottom end is connected to the negative pressure chamber. When the negative pressure chamber generates negative pressure, the suction force acts directly on the workpiece 13 through the suction tube 4, realizing multi-point, uniform and efficient adsorption and fixation of the workpiece, ensuring the reliability of the fixation.

[0036] In one alternative embodiment, the displacement mechanism includes a U-shaped frame 5 with its opening facing downwards. A pressure block 2 is connected to the upper part of the U-shaped frame 5, and sliders 19 are fixed to both ends of the U-shaped frame 5. The sliders 19 are vertically slidably connected inside a sliding tube 17, which is connected to a negative pressure chamber.

[0037] A U-shaped frame 5 with its opening facing downwards is connected to a pressure block 2 at its upper part, and sliders 19 are fixed at both ends. The sliders 19 are vertically slidably connected within a sliding tube 17 that communicates with a negative pressure chamber. When a negative pressure is generated in the negative pressure chamber, the sliders 19 slide downwards within the sliding tube 17 under the influence of the air pressure difference, thereby causing the U-shaped frame 5 and the pressure block 2 to move downwards and press the workpiece. This structure ingeniously converts negative pressure power into mechanical downward force, achieving automated pressing.

[0038] In one alternative embodiment, the bottom end of the slider 19 abuts against the spring 18, and the bottom end of the spring 18 abuts against the bottom end of the sliding tube 17.

[0039] Inside the sliding tube 17, the bottom end of the slider 19 abuts against the spring 18, and the bottom end of the spring 18 abuts against the bottom end of the sliding tube 17. When the negative pressure is released, the restoring force of the compressed spring 18 will push the slider 19 upward, thereby lifting the U-shaped frame 5 and the pressure block 2, detaching them from the workpiece 13. This design achieves automatic reset of the pressure block 2, providing convenience for removing the processed workpiece and improving operating efficiency.

[0040] In one alternative, a sleeve 1 is horizontally slidably connected to the U-shaped frame 5, and a pressure block 2 is fixed to the bottom end of the sleeve 1.

[0041] A sleeve 1 is horizontally slidably connected to the U-shaped frame 5, while the pressure block 2 is fixed to the bottom end of the sleeve 1. This design allows the operator to adjust the horizontal position of the pressure block 2 on the U-shaped frame 5 by sliding the sleeve 1 horizontally, thereby flexibly adapting to workpieces 13 of different sizes, ensuring that the pressure block 2 can accurately press on the effective part of the workpiece, and enhancing the applicability of the device.

[0042] In one alternative, a stop block 16 is fixedly connected inside the negative pressure housing 6. A connecting hole 20 is provided inside the stop block 16. The bottom end of the connecting hole 20 extends out of the negative pressure housing 6 and is connected to the outlet of the water pump 7. The water pump 7 is fixedly installed at the bottom end of the negative pressure housing 6. The top end of the connecting hole 20 extends into the bearing block 14 and is connected to the water channel 21.

[0043] The water pump 7 is fixed to the bottom of the negative pressure housing 6, and its outlet is connected to the bottom of the connecting hole 20 inside the baffle 16. Water flows out from the water pump 7 and enters the water tank 21 through the connecting hole 20. The water supply system is integrated into the negative pressure housing 6, which is compact and realizes a stable water delivery from the bottom to the top, providing a reliable water source for the formation of the water film.

[0044] In one alternative, the support block 14 is disposed inside the housing 3, and an overflow trough 11 is provided between the support block 14 and the housing 3.

[0045] The entire support block 14 is housed within a larger enclosure 3, and an overflow trough 11 is provided between the support block 14 and the enclosure 3. This overflow trough 11 is used to collect and guide excess water flowing out of the workpiece 13 area, preventing water from overflowing disorderly outside the processing area, maintaining a clean working environment, and facilitating centralized recycling and treatment of wastewater, reflecting a good environmental protection design.

[0046] In one alternative, a water outlet pipe 9 is connected to the side wall of the housing 3, and the water outlet pipe 9 is connected to the water inlet of the water pump 7.

[0047] A water outlet pipe 9 is connected to the side wall of the housing 3, and this water outlet pipe 9 is connected to the water inlet of the water pump 7. After water is collected from the overflow tank 11, it is pumped back into the system by the water pump 7 through the water outlet pipe 9. This realizes the recycling of processing water, reduces water consumption, lowers operating costs, and makes the equipment more energy-efficient and environmentally friendly.

[0048] A processing method based on a water immersion laser processing device using negative pressure adsorption, comprising the following steps:

[0049] Place the workpiece 13 on top of the support block 14 and between the two baffles 12. Start the negative pressure generating mechanism. The negative pressure generating mechanism will adsorb the workpiece on the top surface of the support block 14 and drive the pressure block 2 to move down and press on the top surface of the workpiece 13. Water is supplied to the water tank 21. The water flows in from the inlet 22 and out from the outlet 23, forming a water film on the top surface of the workpiece 13. The laser drilling device will drill a through hole at the set position of the workpiece 13. Turn off the laser drilling device, wait for the workpiece to cool down, stop the negative pressure generating mechanism, stop the water supply, and remove the workpiece 13.

[0050] Detailed working process: The operator places the workpiece 13 to be processed steadily on top of the support block 14, ensuring it is positioned between the fixed baffles 12 on both sides. Then, the negative pressure pump 8 is turned on. The negative pressure pump 8 quickly generates a stable negative pressure in the negative pressure chamber within the negative pressure housing 6. This negative pressure, through the four suction tubes 4 of the four corner holes 10 of the support block 14, uses atmospheric pressure to firmly adhere the workpiece 13 to the top surface of the support block 14, achieving the first layer of reliable fixation. Simultaneously, a low pressure is formed inside the sliding tube 17 connected to the negative pressure chamber, causing the slider 19 inside to slide downwards against the elastic force of the spring 18 under the action of external atmospheric pressure. The slider 19 drives the U-shaped frame 5, which is fixed to it, to move downwards synchronously. The pressure block 2 connected to the U-shaped frame 5 via the sleeve 1 moves downwards accordingly, ultimately pressing smoothly against the top surface of the workpiece 13, forming the second layer of mechanical fixation. The sliding contact at both ends of the pressure block 2 ensures a uniform distribution of the clamping force. At this point, the workpiece is firmly fixed by the combined action of negative pressure adsorption and mechanical pressing, effectively resisting the impact and vibration of water flow during the processing.

[0051] After fixing, the water pump 7 starts working, pumping water from the outlet pipe 9 on the side wall of the housing 3, and delivering it through the connecting hole 20 in the baffle 16 to the water channel 21 inside the support block 14. The water accumulates and rises in the water channel 21, enters a specific path through the flow channel inlet 22, and finally flows out from the flow channel outlet 23 located inside the baffle 12 and above the workpiece 13, thereby forming a flowing water film covering the processing area on the top surface of the workpiece 13. The through groove 24 designed on the pressure block 2 provides a key lateral flow channel for the water film, ensuring that the water film maintains a stable and uniform thickness regardless of the workpiece thickness, effectively removing processing heat and debris. Excess water is collected in the overflow trough 11 between the support block 14 and the housing 3, and is recycled by the water pump 7 through the outlet pipe 9, forming a highly efficient closed-loop water circulation system.

[0052] Once the environment is ready, the laser drilling device can be started for finishing. The laser beam penetrates a uniform water film and acts on the set position of the workpiece 13. The water film greatly reduces the heat-affected zone and improves the processing quality. After processing, the laser device is first turned off, and the workpiece is allowed to cool down. Then, the negative pressure pump 8 and the water pump 7 are stopped in sequence. After the negative pressure is released, the spring 18 in the displacement mechanism releases its stored energy, pushing the slider 19 and the U-shaped frame 5 to rise. The pressure block 2 automatically resets, and the operator can easily remove the processed workpiece 13. The entire process is highly automated. The combination of double fixation and a stable water film significantly improves the accuracy, quality, and efficiency of water immersion laser processing.

[0053] In the description of this invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0054] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. A water immersion laser processing device based on negative pressure adsorption, characterized in that, include: The support block (14) and the workpiece (13) are set at the top of the support block (14). Baffles (12) are provided on both sides of the workpiece (13). The baffles (12) are fixed to the support block (14). A water channel (21) for water flow is provided inside the support block (14). A flow channel inlet (22) is opened on the side wall of the water channel (21). The flow channel inlet (22) is connected to the flow channel outlet (23). The flow channel outlet (23) is opened on the side of the baffle (12) near the workpiece (13). The flow channel outlet (23) is located above the workpiece (13). The bearing block (14) is provided with a negative pressure adsorption mechanism for fixing the workpiece (13). The negative pressure adsorption mechanism is connected to a negative pressure generating mechanism. Two pressure blocks (2) are provided above the bearing block (14). A through groove (24) is provided on the pressure block (2). The through groove (24) is provided along the length direction of the pressure block (2). There is a distance between the through groove (24) and the bottom surface of the pressure block (2). The two pressure blocks (2) are located between the two baffles (12). The two ends of the pressure block (2) are in sliding contact with the two baffles (12). The two pressure blocks (2) are located at the two ends of the baffles (12). The pressure block (2) is provided at the movable end of the displacement mechanism. The displacement mechanism is driven by the negative pressure generating mechanism to move the pressure block (2) downward.

2. The water immersion laser processing device based on negative pressure adsorption according to claim 1, characterized in that: The negative pressure generating mechanism includes a negative pressure housing (6), which is located below the support block (14). A negative pressure cavity is provided inside the negative pressure housing (6), and the negative pressure cavity is connected to a negative pressure pump (8). The negative pressure adsorption mechanism is connected to the negative pressure cavity.

3. The water immersion laser processing device based on negative pressure adsorption according to claim 2, characterized in that: The negative pressure adsorption mechanism includes a plurality of vertically arranged through holes (10), which are opened on the support block (14) and located at the four corners of the support block (14). A suction tube (4) is inserted through the through hole (10), the top end of the suction tube (4) is in contact with the workpiece (13), and the bottom end of the suction tube (4) is connected to the negative pressure cavity.

4. The water immersion laser processing device based on negative pressure adsorption according to claim 2, characterized in that: The displacement mechanism includes a U-shaped frame (5) with its opening facing downwards. The pressure block (2) is connected to the upper part of the U-shaped frame (5). Slider blocks (19) are fixed to both ends of the U-shaped frame (5). The sliders (19) are vertically slidably connected inside the sliding tube (17). The sliding tube (17) is connected to the negative pressure chamber.

5. The water immersion laser processing device based on negative pressure adsorption according to claim 4, characterized in that: The bottom end of the slider (19) abuts against a spring (18), and the bottom end of the spring (18) abuts against the bottom end of the sliding tube (17).

6. The water immersion laser processing device based on negative pressure adsorption according to claim 4, characterized in that: A sleeve (1) is horizontally slidably connected to the U-shaped frame (5), and the pressure block (2) is fixed to the bottom end of the sleeve (1).

7. The water immersion laser processing device based on negative pressure adsorption according to claim 2, characterized in that: A stop block (16) is fixedly connected inside the negative pressure housing (6). A connecting hole (20) is provided inside the stop block (16). The bottom end of the connecting hole (20) extends out of the negative pressure housing (6) and is connected to the outlet of the water pump (7). The water pump (7) is fixedly installed at the bottom end of the negative pressure housing (6). The top end of the connecting hole (20) extends into the bearing block (14) and is connected to the water channel (21).

8. The water immersion laser processing device based on negative pressure adsorption according to claim 1, characterized in that: The support block (14) is installed inside the box (3), and an overflow trough (11) is provided between the support block (14) and the box (3).

9. The water immersion laser processing device based on negative pressure adsorption according to claim 8, characterized in that: A water outlet pipe (9) is connected to the side wall of the box (3), and the water outlet pipe (9) is connected to the water inlet of the water pump (7).

10. A processing method using a water immersion laser processing apparatus based on negative pressure adsorption, wherein the water immersion laser processing apparatus based on negative pressure adsorption as described in any one of claims 1-9 is characterized in that, The steps are as follows: Place the workpiece (13) on the top of the support block (14) and between the two baffles (12). Start the negative pressure generating mechanism. The negative pressure generating mechanism will adsorb the workpiece on the top surface of the support block (14) and drive the pressure block (2) to move down and press on the top surface of the workpiece (13). Water is supplied to the water tank (21). The water flows in from the inlet (22) and out from the outlet (23), forming a water film on the top surface of the workpiece (13). A through-hole is drilled at the set position of the workpiece (13) by the laser drilling device. The laser drilling device is turned off. After the workpiece cools down, the negative pressure generating mechanism is stopped, the water supply is stopped, and the workpiece (13) is removed.

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