Detection method, detection system, laser processing method and laser processing equipment

Abstract

The invention provides a detection method, a detection system, a laser processing method and laser processing device.The detection method is used for conducting real-time detection on laser processing quality and comprises the steps that in the process that pulse laser is used for conducting through hole processing on a to-be-processed base material, a first pulse signal is synchronously obtained from the first side of the to-be-processed base material, and a second pulse signal is obtained from the second side of the to-be-processed base material; acquiring a second pulse signal from a second side of the to-be-processed base material; whether the machining state of the through hole is abnormal or not is judged based on the first pulse signal and / or the second pulse signal; and when the machining state is judged to be abnormal, recording the coordinates of the through hole. According to the embodiment of the invention, the product yield can be improved.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a detection method, a detection system, a laser processing method, and laser processing equipment. Background Technology

[0002] In the field of pulsed laser processing, such as through-hole processing of transparent or semi-transparent substrates like glass, ceramics, and silicon wafers, as well as opaque substrates like metals, real-time control of processing quality directly determines product yield and production efficiency. Abnormalities such as laser anomalies (e.g., energy fluctuations, pulse leakage), surface contamination, and internal abnormalities of the substrate material (e.g., cracks) are the main factors causing through-hole processing anomalies. Timely detection of through-hole processing anomalies is a key link in ensuring processing accuracy.

[0003] In related technologies, laser processing methods often rely on post-processing image analysis to detect processing anomalies. This involves manually inspecting a batch of workpieces using a high-powered microscope or scanning them with a machine vision system after processing is complete to determine if defects exist. This approach cannot achieve real-time detection of processing defects during the process, meaning defects cannot be interrupted and corrected in a timely manner, resulting in low product yield. Summary of the Invention

[0004] This application provides a testing method, testing system, laser processing method, and laser processing equipment that can improve product yield.

[0005] In a first aspect, embodiments of this application provide a detection method for real-time detection of laser processing quality, the method comprising: During the process of using pulsed laser to process through holes in the substrate to be processed, a first pulse signal is simultaneously acquired from the first side of the substrate to be processed and a second pulse signal is acquired from the second side of the substrate to be processed. The processing status of the through hole is determined based on the first pulse signal and / or the second pulse signal. When the processing status is determined to be abnormal, record the coordinates of the through hole.

[0006] Secondly, this application provides a detection system, which includes: The optical detection module is configured to simultaneously acquire a first pulse signal from a first side of the substrate to be processed and a second pulse signal from a second side of the substrate to be processed during the process of processing a through hole using a pulsed laser. The optical detection module includes a first detection device and a second detection device. The first detection device is disposed on a first side of the substrate to be processed to acquire a first pulse signal; the second detection device is disposed on a second side of the substrate to be processed to acquire a second pulse signal. A processing control module is connected to the first detection device and the first detection device; The processing control module includes: The feature extraction unit is configured to extract at least one feature parameter from the synchronously acquired first pulse signal and second pulse signal; An anomaly diagnosis unit is configured to determine processing anomalies and identify the anomaly type based on the at least one feature parameter. The position recording unit is configured to record the coordinates of the through hole when the processing state of the through hole is determined to be abnormal; The image recognition module is configured to perform visual re-inspection of the locations of through holes that are determined to be abnormal.

[0007] Thirdly, embodiments of this application provide a laser processing method, which includes: Using pulsed laser to process through holes in the substrate; It also includes detection methods as described in the first aspect and any embodiment of the first aspect.

[0008] Fourthly, embodiments of this application provide a laser processing apparatus, which includes: A laser processing module, comprising a pulsed laser, a laser processing head, and a processing table, configured to emit pulsed laser light toward a substrate to be processed; It also includes detection systems as described in the second aspect and any embodiment of the second aspect.

[0009] Fifthly, embodiments of this application provide an electronic device, which includes: a processor and a memory storing computer program instructions; When the processor executes computer program instructions, it implements the detection method as described in any embodiment of the first aspect, or the laser processing method as described in any embodiment of the second aspect.

[0010] In a sixth aspect, embodiments of this application provide a computer storage medium storing computer program instructions. When the computer program instructions are executed by a processor, they implement the detection method as described in any embodiment of the first aspect, or the laser processing method as described in any embodiment of the second aspect.

[0011] In a seventh aspect, embodiments of this application provide a computer program product in which instructions, when executed by a processor of an electronic device, cause the electronic device to perform a detection method as described in any of the embodiments of the first aspect above, or a laser processing method as described in any of the embodiments of the second aspect.

[0012] In the detection method, detection system, laser processing method, and laser processing equipment provided in this application embodiment, by simultaneously acquiring a first pulse signal and a second pulse signal from the first and second sides of the substrate to be processed during the through-hole processing of the substrate by pulsed laser, the processing and detection processes are synchronized, breaking the lag detection mode that relies on image analysis after processing in related technologies. Subsequently, based on the synchronously acquired first pulse signal and / or second pulse signal, the state of the currently processed through-hole is abnormally determined. This allows for real-time identification of abnormalities during the processing of each through-hole, thereby avoiding or reducing the continuous impact of abnormal processing states on subsequent processing steps and the generation of batch defects. Simultaneously, when the processing state is determined to be abnormal, the coordinates of the through-hole are recorded, enabling each abnormal through-hole to be accurately located, thereby avoiding or reducing the continuous impact of abnormal states on subsequent processing steps and the generation of batch defects, thus improving product yield. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic flowchart of the detection method provided in the embodiments of this application; Figure 2 This is a schematic diagram illustrating the principle of a detection method provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a detection system and laser processing equipment provided in an embodiment of this application; Figure 4 This is a schematic diagram of a detection system provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0015] To better understand the above-mentioned objectives, features, and advantages of this disclosure, the solutions disclosed herein will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0016] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure.

[0017] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the term "comprising" or any other variations thereof is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0018] In the field of pulsed laser micromachining, the demand for precision machining of glass and other transparent and semi-transparent materials is increasing. Machining these materials often requires laser energy to penetrate the material bulk to form through-holes or specific functional structures that meet precision requirements. However, unexpected attenuation of laser energy can lead to defects such as contamination, scratches, and adhesive residue on the material surface during machining. Furthermore, uneven energy absorption caused by abnormal internal material properties can result in insufficient penetration, leaks, and other defects in through-hole machining, severely impacting product quality.

[0019] To avoid the above problems, the processing and inspection process is crucial, but the inspection methods in related technologies have obvious shortcomings: mainstream inspection methods mostly rely on offline microscopic inspection or image analysis technology, which requires retrospective inspection after a batch of workpieces has been processed. This not only fails to achieve real-time judgment and dynamic feedback control during the processing, resulting in the inability to intervene in defects that have already occurred in a timely manner, but also makes it difficult to adapt to processing materials with different light transmittance.

[0020] To address the problems existing in related technologies, embodiments of this application provide a detection method, a detection system, a laser processing method, and a laser processing equipment.

[0021] The detection method provided in the embodiments of this application will be described below. Figure 1 As shown, this method is used for real-time detection of laser processing quality, and the method specifically includes the following steps: S100, during the process of processing through holes in the substrate to be processed using a pulsed laser, a first pulse signal is simultaneously obtained from the first side of the substrate to be processed, and a second pulse signal is obtained from the second side of the substrate to be processed.

[0022] Optionally, in this embodiment, the pulsed laser is the energy carrier for processing through-holes in the substrate, referring to a laser beam emitted by a laser processing device and output in the form of intermittent pulses. It has adjustable parameters such as wavelength, pulse energy, peak power, and time interval, and can be focused on the target processing location of the substrate, achieving through-hole formation through energy deposition. After the pulsed laser acts on the substrate, it generates light signals such as reflection, transmission, or scattering. Simultaneously, its propagation process in the optical path also forms a captureable beam, providing a basis for the acquisition of the first and second pulse signals.

[0023] Pulsed lasers can be ultrafast lasers, meaning ultrashort pulse lasers with pulse widths less than or equal to picoseconds. Ultrafast laser drilling of through-holes in substrates uses lasers with pulse widths in the picosecond (10⁻¹² seconds) to femtosecond (10⁻¹⁵ seconds) range as the light source. A specific optical system focuses the laser beam onto the processing point on the substrate, achieving high-precision and high-efficiency drilling. However, it is not limited to this; pulsed lasers can also be lasers with other pulse widths, emitted as single pulses or pulse trains.

[0024] The substrate to be processed is the object of pulsed laser through-hole processing, referring to various material components that need to have through holes formed by laser processing. It includes a first main surface and a second main surface that are arranged opposite each other. The substrate to be processed can cover transparent materials (such as glass and sapphire), translucent materials, and opaque materials (such as ceramics, silicon wafers, metal sheets, resins, etc.).

[0025] The first side of the substrate to be processed refers to the spatial region along the thickness direction of the substrate that is parallel to the outward normal direction of the first main surface. The first side is the key area for pulsed laser processing, and it can be either the side where the laser is incident or the detection position can be flexibly arranged according to the detection requirements.

[0026] The first pulse signal is an optical signal (or its converted electrical signal) related to the pulsed laser, synchronously acquired from the first side of the substrate to be processed during the through-hole machining process. The source of the first pulse signal is diverse; it can originate from reflected or scattered light generated after the pulsed laser acts on the first main surface of the substrate; or it can originate from emitted light at a preset position in the laser processing optical path. A first detection device can be flexibly arranged on the first side according to detection requirements; see appendix. Figure 4 For example, the first detection device can be arranged off-axis (at a certain angle) in the reflected light path (coaxial with the processing light path, but in the opposite direction) to receive diffuse reflected light; or the first detection device can be arranged in the transmission direction of any mirror in the reflected light path to detect partially reflected light; in addition, the first detection device can also be arranged in the transmission direction of any mirror in the processing light path to detect the outgoing light of the processing light path.

[0027] The second side of the substrate to be processed refers to the spatial region along the thickness direction of the substrate, which is aligned with the outer normal direction of the second main surface, and is positioned opposite to the first side. The second side provides the spatial layout for acquiring the second pulse signal, and its location is usually related to the propagation direction of the pulsed laser, typically being the exit side after the laser penetrates the substrate. A second detection device can be placed on the second side to capture the relevant optical signal after the pulsed laser passes through the substrate.

[0028] The second pulse signal is an optical signal (or its converted electrical signal) synchronously collected from the second side of the substrate during the through-hole processing. It works in conjunction with the first pulse signal to determine processing abnormalities. The source of the second pulse signal is related to the light transmittance of the substrate: for transparent or semi-transparent substrates, the second pulse signal is mainly the transmitted light signal after the pulsed laser penetrates the substrate, which can directly reflect the degree of penetration of the through hole; for opaque substrates, the second pulse signal is mostly the scattered light signal generated by the pulsed laser acting on the back side of the substrate.

[0029] Optionally, in one feasible implementation of this application, the substrate to be processed is transparent glass. A first detection device of the optical detection module is arranged on a first side of the substrate to be processed to capture reflected light after the laser acts on the substrate; a second detection device is arranged on a second side of the substrate to be processed, opposite to the first detection device, to capture transmitted light that penetrates the substrate.

[0030] During processing, a pulsed laser is incident from the first side and penetrates the glass. In the process of forming a through hole, the first detection device simultaneously collects the reflected light signal generated after the pulsed laser interacts with the first main surface of the glass and converts it into a first pulse signal; the second detection device simultaneously collects the transmitted light signal after penetrating the glass and converts it into a second pulse signal.

[0031] S200, determine whether the processing status of the through hole is abnormal based on the first pulse signal and / or the second pulse signal.

[0032] Optionally, in the embodiments of this application, the processing state refers to the comprehensive state presented by the through-hole formation process and the final shape during the through-hole processing of the substrate to be processed by pulsed laser. Its core is a comprehensive characterization of whether the through-hole meets the preset processing requirements.

[0033] Abnormal processing conditions can stem from three core issues: first, laser-side problems, including abnormal laser supply caused by pulsed laser energy fluctuations (including leaky pulses) and waveform distortion; second, substrate surface contamination problems, such as foreign matter or processing residues affecting laser energy transfer and absorption; and third, inherent defects in the substrate material itself, such as internal cracks, bubbles, and impurity clusters. These three types of problems ultimately affect the processing effect of the through-hole, leading to issues like incomplete penetration, abnormal hole shape, or uneven energy deposition. Therefore, whether the processing condition is abnormal is essentially determined by analyzing the first and / or second pulse signals to identify whether the through-hole exhibits defects that do not meet preset standards due to the aforementioned three types of problems, thereby achieving accurate judgment of processing quality. It should be noted that the defect types listed above are only partial examples. The detection method of this application is not limited to detecting processing defects caused by the specific abnormal reasons mentioned above. The core of this application lies in determining whether the processing condition of the through-hole is abnormal through the first and / or second pulse signals.

[0034] Optionally, this application may employ various methods, including but not limited to, the following, to determine whether an abnormality has occurred in the processing of a through hole: 1. Judgment based solely on the first pulse signal: Extract characteristic parameters such as pulse energy, waveform, and peak power of the first pulse signal and compare them with preset reference parameters (determined according to laser parameters and the type of substrate to be processed). If a certain characteristic parameter deviates significantly from the reference (such as pulse energy being lower than the average value or waveform distortion), the processing status is determined to be abnormal.

[0035] 2. Judgment based solely on the second pulse signal: For transparent, semi-transparent or opaque substrates, extract characteristic parameters such as amplitude, energy, intensity, and time response of the second pulse signal. If the transmission signal of the transparent substrate is lower than the preset threshold T1, the processing status can be determined to be abnormal. If the backscattering signal of the opaque substrate is abnormal, the processing status can be determined to be abnormal in combination with the preset standard. Thus, the processing abnormality can be determined solely by the second pulse signal.

[0036] By judging solely based on the first or second pulse signal, it is possible to quickly and easily determine the abnormality of the through hole processing status.

[0037] 3. Judgment based on the combination of the first pulse signal and the second pulse signal: The determination of the first pulse signal and the second pulse signal group can be made by extracting one or more characteristic parameters of each of them for comprehensive judgment. The following explanation uses characteristic parameters such as single pulse amplitude and time delay of transmitted light appearance as examples.

[0038] For example, if the single pulse amplitude of the first pulse signal and the second pulse signal... 、 If all values ​​are below the corresponding thresholds R1 and R2, and the amplitude ratio K is within the normal range, then the abnormality type is determined to be an abnormal laser supply, specifically a laser energy fluctuation. Signal amplitude ratio:

[0039] For example, if K≈0 and the pulsed laser trigger signal is normal, then the abnormality type is determined to be an abnormal laser supply, specifically a leaky pulse. For example, if the single pulse amplitude of the first pulse signal and the second pulse signal... 、 If all values ​​are below the corresponding thresholds R1 and R2, and the amplitude ratio K is not within the normal range, then the abnormality type is determined to be surface contamination abnormality, specifically, it may be surface contamination of absorbent foreign matter. For example, if the single pulse amplitude of the first pulse signal The amplitude of the second pulse signal is higher than the corresponding threshold R1. If the value is below the corresponding threshold R2 and the amplitude ratio K is not within the normal range, the abnormality type is determined to be substrate surface contamination abnormality, specifically reflective foreign matter surface contamination. For example, if the time delay between the appearance of transmitted light and reflected light is greater than the corresponding threshold, the abnormality type is determined to be an abnormality in the internal material of the substrate.

[0040] In addition, there are also comparisons based on combinations of characteristic parameters such as energy, waveform, pulse width, and intensity, not limited to the methods disclosed above.

[0041] This combination method integrates complementary information from both sides of the signal, resulting in higher accuracy and comprehensive coverage of various abnormal situations such as surface contamination, abnormal laser supply, and internal defects in the substrate.

[0042] S300, when the processing state is determined to be abnormal, the coordinates of the through hole are recorded.

[0043] Optionally, in one feasible implementation of this application, when the through-hole processing status is determined to be abnormal by the first pulse signal and / or the second pulse signal, the coordinate recording process is triggered.

[0044] First, the real-time position data of the motion platform in the laser processing module is retrieved. Combined with the preset processing coordinate system, the target processing position of the pulsed laser is converted into precise drilling coordinates. At the same time, key information corresponding to the anomaly can be synchronously associated, including the anomaly judgment criteria (such as signal ratio K being greater than threshold K1, transmitted signal being lower than threshold T1, etc.), anomaly type (surface contamination, leaking pulse, etc.), and detection timestamp, which are bound to the drilling coordinates to form a complete anomaly data entry.

[0045] Subsequently, the data entry can be stored in a preset list of abnormal coordinates according to the processing time sequence. This facilitates the subsequent tracing of the cause of the abnormality and provides a clear and accurate location basis for closed-loop re-mapping, ensuring that each abnormal through hole can be accurately located and processed.

[0046] Optionally, the coordinates of the abnormal through holes can be recorded for a re-drilling process.

[0047] Specifically, if the real-time re-firing mode is adopted, the laser processing equipment will immediately adjust the laser parameters according to the type of abnormality (such as increasing the pulse energy for non-penetration), control the motion platform to accurately reset to the abnormal coordinates, drive the pulse laser to emit laser to perform real-time re-firing, and after re-firing, the signal is collected again by the optical detection module for verification until the detection is qualified before continuing the subsequent processing.

[0048] If the centralized re-mapping mode is adopted after completion, the system will store the abnormal data entries into the preset abnormal coordinate list according to the processing time sequence. After all through holes of the current batch of substrate are processed, all abnormal hole positions are located in batches according to the list, and re-mapping and re-inspection operations are performed in sequence to ensure that all abnormal through holes are corrected, and finally achieve closed-loop control of "zero missing holes", which not only ensures processing efficiency, but also accurately controls processing quality.

[0049] In a detection method provided in this application embodiment, by simultaneously acquiring a first pulse signal and a second pulse signal from the first and second sides of the substrate during the through-hole processing of the substrate by pulsed laser, the processing and detection processes are synchronized, breaking the lag detection mode that relies on image analysis after processing in related technologies. Subsequently, based on the synchronously acquired first pulse signal and / or second pulse signal, anomaly determination is made on the current processed through-hole state. Anomalies can be identified in real time during the processing of each through-hole, thereby avoiding or reducing the continuous effect of abnormal processing states on subsequent processing steps and causing batch defects. At the same time, when the processing state is determined to be abnormal, the coordinates of the through-hole are recorded, so that each abnormal through-hole can be accurately located, thereby avoiding or reducing the continuous effect of abnormal states on subsequent processing steps and causing batch defects, thereby improving product yield.

[0050] In one embodiment, the first pulse signal is obtained from the reflected light of the laser acting on the substrate to be processed; the second pulse signal is obtained from the transmitted light of the laser acting on the substrate to be processed.

[0051] Optionally, in one feasible implementation of this application, for a single-sided signal, the amplitude, waveform (rising edge slope, falling edge slope), pulse energy, intensity and other features of the first pulse signal are extracted and compared with a preset benchmark. If the amplitude of the reflected light signal is higher than the threshold R1, the waveform is distorted or the pulse energy deviates significantly from the average value, it is determined that there is an abnormality in the through-hole processing. At the same time, the amplitude of the second pulse signal is extracted. If it is lower than the threshold T1, it is determined that there is an abnormality in the through-hole processing.

[0052] In other implementations, the determination can also be made through the linkage of signals on both sides. For specific determination methods, please refer to the above embodiments, which will not be repeated here.

[0053] In these alternative embodiments, real-time and comprehensive determination of processing anomalies can be achieved through comparative analysis of the characteristics of reflected and transmitted light.

[0054] In one embodiment, determining whether the processing status of the through hole is abnormal based on the first pulse signal and / or the second pulse signal includes any one of the following: If the deviation between the first pulse signal and the first preset standard signal is greater than the first deviation threshold, the processing state is determined to be abnormal; the first preset standard signal is a pulse signal obtained from the first side of the substrate to be processed when the processing state of the through hole meets the preset requirements. If the deviation between the second pulse signal and the second preset standard signal is greater than the second deviation threshold, the processing state is determined to be abnormal; the second preset standard signal is a pulse signal obtained from the second side of the substrate to be processed when the processing state of the through hole meets the preset requirements.

[0055] Optionally, in the embodiments of this application, the first preset standard signal refers to a reference benchmark established through a calibration or learning process before formal processing and testing. The first preset standard signal represents the standard pulse signal pattern that is expected to be collected from the first side of the substrate to be processed under ideal conditions where the through-hole processing state fully meets the preset quality requirements (e.g., smooth hole walls, complete penetration, and no contamination).

[0056] The specific methods for determining the first preset standard signal may include, but are not limited to: 1. Under stable equipment and material conditions, through multiple successful processing experiments, collect multiple sets of qualified pulse signals from the first side, and establish their average value or typical waveform as the first preset standard signal.

[0057] 2. Collect the first-side pulse signals containing qualified and unqualified processing cases as a training dataset, train it through signal processing algorithms or machine learning models, and finally generate a signal model or feature vector to represent the qualified state as the "first preset standard signal".

[0058] The first deviation threshold is a pre-set, numerically defined critical standard used to quantify whether the difference between the real-time detection signal and the standard signal constitutes an anomaly. Its determination hinges on defining an allowable range of normal process fluctuations. Specific methods may include, but are not limited to: 1. Based on the historical qualified data used when establishing the first preset standard signal, calculate the statistical distribution (e.g., standard deviation) of the deviation between each qualified signal and the standard signal. Set the first deviation threshold to a reasonable value within this statistical distribution range so that the vast majority of minor fluctuations in normal processing will not be misjudged as abnormal.

[0059] 2. By introducing known, slightly non-conforming process conditions for testing, and observing the signal deviation values, a critical value that can effectively distinguish between acceptable edges and definite defects is determined as the first deviation threshold.

[0060] It should be noted that the determination principle of the second preset standard signal is exactly the same as that of the first preset standard signal. The only difference is that its signal is a standard pulse signal representing the qualified state of processing, collected from the second side of the substrate to be processed. It can also be determined based on historical qualified data or model training results.

[0061] The logic for determining the second deviation threshold is the same as that for the first deviation threshold. It is a critical value used to determine whether the difference between the real-time detection signal on the second side and the standard signal on the second side exceeds the limit. Its setting also relies on statistical analysis or experimental verification of the fluctuation of the qualified signal on the second side. Since the determination principles of the second preset standard signal and the second deviation threshold correspond to those of the first preset standard signal and the first deviation threshold, only the signal source (second side signal) used is different, this application will not elaborate further here.

[0062] Optionally, in this embodiment, by extracting multi-dimensional feature parameters of the first pulse signal or the second pulse signal and comparing them with the corresponding preset standard signal, the through-hole processing state is determined to be abnormal when the deviation between the two is greater than a preset threshold. The feature parameters may include temporal features, spatial (spot) features, and spectral features.

[0063] Temporal characteristics refer to the attributes of a pulse signal in the time dimension, including the waveform shape, amplitude, rise / fall slope, pulse width, and stability of continuous multi-pulse signals, which directly reflect the temporal response law of the interaction between the laser and the substrate.

[0064] Spatial (spot) characteristics refer to the spatial distribution attributes of the spot corresponding to the pulse signal, including the uniformity, morphological integrity, and energy distribution state of the spot, reflecting the spatial propagation changes of the optical signal after the laser acts on the substrate.

[0065] Spectral characteristics refer to the intensity distribution of a pulse signal at different wavelengths and the intensity ratio of characteristic wavelengths, which can reflect the absorption and reflection characteristics of pollutants or materials inside the substrate to light of a specific wavelength.

[0066] The specific determination method based on the first pulse signal or the second pulse signal may include, but is not limited to, the following methods: 1. Anomaly detection based on time-domain waveform characteristics: In this embodiment, the first pulse signal (reflected light signal) is used as the detection object, the first preset standard signal is the time domain feature template of reflected light when the through hole is qualified under the same processing conditions, and the first deviation threshold is the preset time domain feature deviation critical value.

[0067] Extract the rising / falling edge slope characteristics of the first pulse signal. If, compared with the first preset standard signal, the rising edge is flat and the falling edge is long, and the slope deviation between the two is greater than the first deviation threshold, it indicates that the laser energy is insufficient and is judged as an abnormal laser supply. If the rising or falling edge shows step-like fluctuations or jitters and the deviation exceeds the first deviation threshold, it indicates that the light scattering and energy absorption path is nonlinear due to internal cracks in the substrate and is judged as an abnormal internal crack in the substrate.

[0068] The pulse width characteristics of the first pulse signal can also be extracted. If the pulse width deviation between the first pulse signal and the first preset standard signal is greater than the first deviation threshold, it can be determined as an abnormal laser supply (energy fluctuation changes the effective pulse width) or an abnormal surface contamination (contaminants are prematurely or delayed in initial ablation) in combination with the processing scenario.

[0069] The stability of the signal from multiple consecutive pulses can also be compared. If the amplitude and waveform fluctuate violently between pulses and the deviation is greater than the first deviation threshold, it can be determined that the laser supply is abnormal. If the pulse waveform is distorted only at a specific location and meets the standard at other locations, it indicates that there is localized surface contamination.

[0070] 2. Anomaly identification based on spatial (spot) morphology characteristics: In this embodiment, the second pulse signal (transmitted light signal) is used as the detection object, the second preset standard signal is the transmitted light spatial feature template corresponding to the qualified through hole, and the second deviation threshold is the critical value of the light spot shape deviation.

[0071] The uniformity and distortion characteristics of the transmitted light spot of the second pulse signal are extracted. The light spot corresponding to the second preset standard signal is a uniform circle. If the actual light spot is striped, split, or diffuse, and the morphological deviation from the standard light spot is greater than the second deviation threshold, it is determined to be an abnormal internal crack in the substrate. This is a significant manifestation of the scattering and refraction of transmitted light caused by the internal crack in the substrate.

[0072] If local dark spots or shadows appear on the transmitted light spot, and the uniformity deviation from the standard light spot is greater than the second deviation threshold, it indicates that there are large particles of surface pollutants blocking the light, and it is judged as an abnormal surface pollution.

[0073] The distribution characteristics of the reflected light spot corresponding to the first pulse signal can also be extracted for anomaly judgment: the energy distribution of the reflected light spot corresponding to the first preset standard signal is concentrated, which is a typical feature of normal interaction between laser and substrate when there is no surface contamination; if the energy distribution of the reflected light spot corresponding to the actual first pulse signal is more diffuse than that of the standard light spot, and the distribution deviation between the two is greater than the first deviation threshold, it indicates that there are contaminants on the substrate surface. This is because contaminants will increase the diffuse reflection effect of the laser, causing the reflected light energy to be unable to be concentrated and propagated, thus forming a diffuse light spot. Based on this, it can be judged as an abnormal surface contamination.

[0074] 3. Anomaly detection based on spectral characteristics: In this embodiment, the first pulse signal (reflected light signal) is used as the detection object, the first preset standard signal is the spectral feature template of the reflected light when the through hole is processed to be qualified, and the first deviation threshold is the critical value of the spectral feature deviation.

[0075] During detection, the characteristic wavelength intensity ratio parameter of the first pulse signal is extracted. If the signal intensity of a specific absorption wavelength (such as the characteristic absorption wavelength of oil in a certain infrared band) is significantly attenuated compared with the corresponding wavelength intensity in the first preset standard signal, and the intensity ratio deviation between the two is greater than the first deviation threshold, it indicates that there are corresponding contaminants such as oil and dust on the substrate surface. This is because such contaminants will selectively absorb reflected light of a specific wavelength, thereby changing the intensity distribution of the reflection spectrum. Based on this, it is determined that the surface is abnormally contaminated.

[0076] If the characteristic fluorescence spectrum of the first pulse signal is detected to be significantly different from the fluorescence spectrum morphology and intensity of the first preset standard signal, and the deviation is greater than the first deviation threshold, it indicates that there are impurities or changes in the crystal state inside the substrate. Such material abnormalities will affect the fluorescence emission characteristics after laser treatment, and it is therefore determined that the material inside the substrate is abnormal.

[0077] If the second pulse signal (transmitted light signal) is used as the detection object, the judgment logic is the same as above, only the signal acquisition source is changed to transmitted light. The corresponding second preset standard signal is the transmitted light spectral feature template of the qualified through hole. The second deviation threshold is adapted to the spectral deviation judgment requirements of transmitted light. This application will not elaborate further here.

[0078] In these alternative embodiments, using the pulse signal of a qualified processing scenario as a standard, the signal deviation is quantified by thresholding to accurately identify anomalies, thereby achieving real-time and accurate determination of processing anomalies and improving processing yield.

[0079] In one embodiment, determining whether the processing status of the through hole is abnormal based on the first pulse signal and / or the second pulse signal includes: The processing state is determined to be abnormal based on at least one feature parameter extracted from the first pulse signal or the second pulse signal. The feature parameters include: single pulse amplitude, single pulse energy, single pulse waveform, single pulse width, and single pulse intensity.

[0080] Optionally, in this embodiment, the feature parameters used to determine whether the through-hole processing state is abnormal are specifically extracted based on the first pulse signal or the second pulse signal, and the core parameters include the single pulse amplitude U and the single pulse energy. Single pulse width Single pulse intensity And five types of single-pulse waveforms: 1. The amplitude U of a single pulse refers to the peak value of the electrical signal (voltage / current) after the laser's optical power / energy is converted into an electrical signal by a photodetector (such as a photodiode or photomultiplier tube). It is a parameter at the measurement level. Within the linear response range of the detector, the amplitude is directly proportional to the laser peak power (i.e., the higher the peak power, the larger the amplitude). The proportionality coefficient is the detector's responsivity (R, unit: V / W or A / W), and the formula is: U peak =R×Ppeak×G (G is the amplification gain of the detector).

[0081] 2. Single pulse energy This refers to the total energy carried by a single laser pulse. The value of the single pulse energy directly determines the laser's etching capability on the substrate. If the single pulse energy deviates significantly from the corresponding energy value in the first or second preset standard signal, it may indicate abnormal laser energy fluctuations.

[0082] 3. Single pulse width refers to the effective duration of a single laser pulse (i.e., the duration of the pulse signal in the time dimension). Its length affects the deposition efficiency of laser energy on the substrate. If the single pulse width changes abnormally, it may lead to insufficient processing depth or over-etching, which in turn causes abnormal through-hole processing.

[0083] 4. Single pulse intensity is a key parameter characterizing laser energy density, and its calculation formula is as follows:

[0084] in The laser spot area is the area of ​​the laser beam acting on the surface of the substrate to be processed, directly reflecting the laser energy received by the substrate per unit time and per unit area. Abnormally high or low single-pulse intensity will directly lead to the through-hole penetration effect and hole shape accuracy failing to meet the preset requirements.

[0085] 5. Single pulse waveform: mainly includes the rising edge slope and falling edge slope of the pulse signal. The rising edge slope reflects the rate of laser energy rise and the falling edge slope reflects the rate of laser energy decay. Together, they reflect the dynamic process of laser energy acting on the substrate. If the slope is flat, elongated, or has a "step" jitter, it can be directly related to abnormal conditions such as unstable laser energy, substrate surface contamination, or internal cracks.

[0086] Optionally, the specific method for determining the single-sided detection mode of the processing state based on at least one characteristic parameter of the first pulse signal or the second pulse signal may include, but is not limited to, the following methods: 1. Anomaly detection based on single-pulse energy: In this embodiment, the first pulse signal (reflected light signal) is used as the detection object, and the first preset standard signal is the reference value of the single pulse energy of the reflected light when the through hole processing is qualified. The first deviation threshold is a preset energy deviation critical value. .when Significantly lower than And exceeds the threshold If this occurs, it indicates insufficient laser energy supply, which may result in the through-hole not being penetrated; if Significantly higher If the laser energy fluctuation causes excessive etching, it is considered an abnormal laser supply.

[0087] 2. Anomaly detection based on a combination of single-pulse energy and single-pulse width: In this embodiment, the first pulse signal (reflected light signal) is used as the detection object, and the first preset standard signal includes the single pulse energy reference value of a qualified processing scenario. and single pulse width reference value The first deviation threshold corresponds to the energy deviation critical value. Critical value of width deviation . Below the standard value and Longer than the standard value This indicates insufficient laser energy and an abnormally prolonged effective action time, which may result in the through-hole not being penetrated; if High and Shorter laser lines may lead to over-etching, both of which are considered abnormal laser supply.

[0088] In these alternative embodiments, core characteristic parameters such as single pulse energy and waveform are covered, which can capture abnormal processing signals from multiple dimensions, realize real-time detection and accurate judgment, and help improve processing yield.

[0089] In one embodiment, determining whether the processing status of the through hole is abnormal based on the first pulse signal and / or the second pulse signal includes: The processing state is determined as abnormal and the corresponding abnormality type based on at least one feature parameter extracted from the first pulse signal and the second pulse signal. The feature parameters include: single pulse amplitude, single pulse energy, single pulse waveform, single pulse width, single pulse intensity, the time delay of the second pulse signal relative to the first pulse signal, and the amplitude ratio of the single pulses of the first pulse signal and the second pulse signal.

[0090] Optionally, in this embodiment, the time delay of the second pulse signal relative to the first pulse signal refers to the time difference between the moment the first pulse signal is detected and the moment the second pulse signal is detected after the laser acts on the substrate to be processed. This time delay directly reflects the propagation, energy absorption, and efficiency of the laser in the substrate: during normal processing, the laser will quickly generate the second pulse signal after penetrating or acting on the substrate, and the time delay is within a stable preset range; if there is contamination on the surface of the substrate, internal cracks, or insufficient laser energy, the laser propagation path will be blocked, energy will be attenuated, or the action process will be delayed, causing the appearance time of the second pulse signal to be significantly delayed, exceeding the preset threshold, which can help determine the abnormal processing status and the type of abnormality.

[0091] Optionally, the specific method for determining the processing state using a double-sided detection mode based on at least one feature parameter extracted from the first pulse signal and the second pulse signal may include, but is not limited to, the following methods: 1. Determination based on the combination of the single pulse amplitude ratio K and the rising edge slope of the second pulse signal: This embodiment uses a dual-sided detection mode, where the first pulse signal is a reflected light signal and the second pulse signal is a transmitted light signal. The amplitude of the first pulse is extracted. Second pulse amplitude Calculate the amplitude ratio:

[0092] Simultaneously, the rising edge slope k of the second pulse signal is extracted. The preset standard value is the value during qualified processing. , The corresponding threshold is , .like and ,at the same time (The rising edge is flat), which indicates that the reflected light is strong, the transmitted light is weak, and the energy rise rate is slow. This is determined to be an abnormal surface contamination. The contaminants cause uneven laser energy absorption and reduced penetration efficiency.

[0093] 2. Determination based on a combination of pulse width and occurrence time delay: This embodiment uses a dual-sided detection mode, extracting the first pulse width. Second pulse width And record the time delay of the second pulse relative to the first pulse. The default standard value is , , The threshold is , .like , The deviation from the standard value is less than ,but And the amplitude of the first pulse reflected light A high value indicates that the laser energy propagation is delayed due to surface contaminants blocking it, which is judged as an abnormal surface contamination; if No obvious deviation but Significantly shorter than If so, it is determined to be a processing abnormality caused by laser energy fluctuations.

[0094] It should be noted that the above method of determining anomalies using combinations of feature parameters is merely an illustrative example. Those skilled in the art will understand that, based on the core idea of ​​"determining anomalies by analyzing multi-dimensional feature parameters and their combination relationships" disclosed in this application, various modifications and extensions can be made to the extracted feature parameter types, quantities, and specific combination logic and threshold conditions. All such implementation methods fall within the protection scope of this application.

[0095] Optionally, the above-mentioned single-sided inspection mode and double-sided inspection mode can be combined in the following ways to balance inspection efficiency and reliability: 1) Single-sided inspection mode can be executed first. If the feature parameters analyzed by single-sided inspection are all within the normal range, the current processing status is determined to be normal, and double-sided inspection does not need to be started again, so as to improve the overall inspection efficiency.

[0096] 2) If the single-sided detection mode detects one or more abnormal feature parameters, it will automatically start or switch to the double-sided detection mode, and use the correlation features of the two signals (such as amplitude ratio and time delay) for verification and in-depth diagnosis to accurately determine the type of abnormality.

[0097] 3) Single-sided and double-sided inspections can be performed simultaneously. With this configuration, if the output result of either inspection mode (single-sided or double-sided) indicates an anomaly, the through-hole processing status can be determined to be abnormal, thereby achieving the highest level of real-time reliability.

[0098] In these alternative embodiments, the integration of multiple feature parameters with bilateral signal correlation analysis can accurately determine anomalies and clarify the anomaly type, adapt to the dual-sided detection mode, achieve real-time and comprehensive anomaly identification, and improve processing yield and stability.

[0099] In one embodiment, the determination of the anomaly type includes at least one of the following: If the single pulse amplitude of the first pulse signal is lower than the first amplitude range, the single pulse amplitude of the second pulse signal is lower than the second amplitude range, and the amplitude ratio is within the normal ratio range, then the abnormality type is determined to be an abnormal laser supply. If the single pulse amplitude of the first pulse signal deviates from the first amplitude range, and the amplitude of the second pulse signal is lower than the second amplitude range, and the amplitude ratio deviates from the normal ratio range, then the abnormality type is determined to be an abnormal surface contamination of the substrate. If the occurrence time delay is greater than the first time range, the abnormality type is determined to be an abnormality in the internal material of the substrate.

[0100] Optionally, in this embodiment, when the single-pulse amplitudes of both the first pulse signal and the second pulse signal are lower than their respective first amplitude range and second strong amplitude range, and the amplitude ratio between the two is within the standard range of a normal processing scenario, it is determined that the laser supply is abnormal. This is because the synchronously low amplitude of both signals directly reflects insufficient overall laser energy supply, which cannot meet the energy threshold required for substrate processing; while the normal amplitude ratio indicates that the energy distribution ratio in the substrate reflection and transmission (or scattering) process is not disturbed, excluding factors such as surface contamination and internal defects. The core problem stems from insufficient or fluctuating laser energy output, resulting in the processing energy not reaching the preset standard.

[0101] When the single-pulse amplitude of the first pulse signal is higher than the first amplitude range, and the single-pulse amplitude of the second pulse signal is lower than the second amplitude range, and the amplitude ratio deviates from the normal ratio range, it is determined to be an abnormal surface contamination of the substrate. This is because reflective contaminants on the substrate surface (such as metals, dense oxide layers, etc.) enhance the reflection effect of the laser, causing the single-pulse amplitude of the first pulse signal (such as reflected light signal) to be higher; at the same time, contaminants absorb or block some laser energy, resulting in a significant reduction in the energy penetrating to the other side of the substrate, causing the single-pulse amplitude of the second pulse signal (such as transmitted light signal) to be lower. This characteristic of "strong reflection and weak transmission" is a typical manifestation of abnormal energy propagation and absorption caused by reflective surface contamination, which can be used to accurately locate surface contamination anomalies.

[0102] When the single-pulse amplitude of the first pulse signal is lower than the first amplitude range, and the single-pulse amplitude of the second pulse signal is lower than the second amplitude range, and the amplitude ratio deviates from the normal range, it is determined to be an abnormal surface contamination of the substrate. This is because absorbing contaminants on the substrate surface (such as dust, fingerprints, oil, etc.) weaken the reflection effect of the laser, causing the single-pulse amplitude of the first pulse signal (such as reflected light signal) to be lower; at the same time, contamination reduces the energy penetrating to the other side of the substrate, causing the single-pulse amplitude of the second pulse signal (such as transmitted light signal) to be lower. This characteristic of "weak reflection and weak transmission" is a typical manifestation of abnormal energy propagation and absorption caused by absorbing surface contamination, which can be used to accurately locate the type of anomaly. It is understandable that although both the first pulse signal and the single-pulse amplitude of the second pulse signal decrease, their amplitude ratio does not conform to the ideal uniform decrease model in reality. The amplitude ratio will deviate abnormally due to the non-uniformity and strong scattering of contaminants.

[0103] If the time delay of the second pulse signal relative to the first pulse signal is greater than a first time range, it is determined that there is an abnormality in the internal material of the substrate. This abnormality includes the presence of cracks, bubbles, or impurity clusters within the substrate. The first time range is the time delay range of the second pulse signal relative to the first pulse signal when the through-hole processing condition fully meets the preset quality requirements.

[0104] Internal cracks can alter the laser propagation path, leading to prolonged laser penetration time. They can also cause light scattering, resulting in striped or split-shaped distortions in the laser spot. Internal bubbles can refract the laser, causing propagation delays and localized dispersion of the laser spot. Impurity clusters can absorb some laser energy, resulting in dark spots or uneven energy distribution in the transmitted light spot. These characteristics all directly reflect abnormalities in the internal structure of the substrate.

[0105] Optionally, in other implementations, when the laser trigger signal is normal, but the first pulse signal is present while the second pulse signal has almost no response (single pulse amplitude is close to 0), and the amplitude ratio K≈0, it is determined that the laser supply is abnormal, specifically a leaky pulse. This is because the laser has not effectively penetrated the substrate to form a through structure, or the pulsed laser has not acted normally on the substrate, resulting in only the surface reflection signal being detected, while there is no transmission or scattering signal on the other side.

[0106] In these alternative embodiments, by using clear rules for matching signal characteristics with anomaly types, the anomalies can be accurately located and classified, which can specifically address issues such as insufficient energy, contamination, and internal defects, thereby improving the processing yield.

[0107] In one embodiment, the method further includes: The image recognition module is used to re-inspect the through holes whose processing status is determined to be abnormal, and the abnormal through holes are screened out.

[0108] Optionally, in one specific implementation of this application, after determining that the processed through-hole is abnormal, an image recognition module is activated to perform a targeted re-inspection of the abnormal through-hole. The image recognition module can be equipped with a high-definition industrial camera, a microscopic imaging component, or other equipment. By adjusting the shooting parameters (such as focal length and exposure), it focuses on the coordinate position of the abnormal through-hole and acquires a high-resolution image of the through-hole.

[0109] Subsequently, key visual features of the through-holes in the image are extracted, including hole shape integrity, hole diameter, hole wall smoothness, presence of unpenetrated residue, and surface contaminant adhesion marks, and compared with a preset visual standard template for qualified through-holes. If the through-hole in the image exhibits hole shape distortion, hole diameter exceeding allowable tolerance, unpenetrated material at the bottom of the hole, obvious defects on the hole wall, or contamination marks on the surface consistent with the type determined by signal detection, and the deviation of these visual features from the standard template exceeds a preset threshold, then it is screened as an abnormal through-hole that has passed verification; if the image shows that the actual processing state of the through-hole meets the qualified standard, and only the signal detection shows a misjudgment, then the abnormal record is excluded to ensure the accuracy of the abnormality judgment.

[0110] In these alternative embodiments, by re-inspecting the through holes that are determined to be abnormal through the image recognition module, false judgments in signal detection can be eliminated, and truly abnormal through holes can be screened out, ensuring the accuracy of anomaly determination.

[0111] In one embodiment, the method further includes: Based on the type of anomaly detected, corresponding processing measures are initiated, wherein the processing measures include at least one of the following: In case of abnormal laser supply, laser status detection is performed, laser emission parameters are adjusted to normal, and then laser re-firing is performed; For abnormal surface contamination, surface cleaning is performed, followed by laser re-penetration. For abnormalities in the internal material of the substrate, perform material abnormality area detection, and make a decision to scrap the substrate or to repair it with laser based on the characteristics of the abnormal area.

[0112] Optionally, in the specific implementation of this application, when the abnormality type is determined to be an abnormal laser supply, the laser status detection process is automatically initiated: continuously monitoring parameters such as the single pulse amplitude, energy, and intensity of the continuous pulses, and combining the laser processing operation log to investigate the cause of energy attenuation (such as laser power output offset, focusing lens loss in the laser processing head, etc.); then, based on the detection results, the laser emission parameters are automatically adjusted. If the energy is too low, the laser output power is gradually increased to the preset standard range, and the focusing lens position is calibrated to ensure energy focusing accuracy. During the adjustment process, the signal parameters are fed back in real time until the single pulse amplitude, energy, and intensity return to normal and stabilize.

[0113] When the anomaly is determined to be surface contamination of the substrate, the system triggers a surface cleaning process: First, based on the coordinates of the abnormal through-hole, the motion platform is controlled to move the contaminated area to the cleaning station; if it is minor dust or residual adhesive contamination, the high-pressure air blowing cleaning device is activated to blow dry and clean compressed air directionally across the contaminated surface to remove floating dust and loose residual adhesive; if the contamination is oil or stubborn residual adhesive, the cleaning module is activated to bombard the contaminated area with plasma to decompose the oil and residual adhesive molecules, achieving efficient cleaning; after cleaning, the system re-performs laser re-mapping and signal detection on the area to confirm that the contamination has been removed and the processing status has returned to normal before continuing the subsequent laser re-mapping process.

[0114] When the anomaly is determined to be an internal material anomaly of the substrate (including internal cracks, bubbles, or impurity clusters), the system initiates the material anomaly area detection process: through the signal feedback from the image recognition module and the optical detection module, the range, size, and distribution density of the anomaly area are accurately located. If the anomaly area is small (such as a single microbubble or short crack) and does not exceed the allowable processing tolerance, the data processing and closed-loop control module controls the laser processing module to adjust the re-mapping parameters (such as appropriately increasing the single pulse energy and optimizing the pulse width) based on the coordinates of the anomaly location, and performs targeted re-mapping of the anomaly area to compensate for the impact of internal defects on processing quality. Specifically, within the allowable tolerance (e.g., 3µm), the re-mapping location is selected for laser re-mapping. If the detected anomaly area is large and the defects are dense (such as large-area cracks or a large number of impurity clusters), exceeding the re-mapping repair threshold, the system automatically marks the substrate as a defective product, issues a scrap warning, and suspends processing to avoid ineffective processing and resource waste.

[0115] In these alternative embodiments, different processing methods are adopted for different anomaly types to achieve targeted resolution of anomalies, reduce ineffective processing, and significantly improve processing yield and efficiency.

[0116] This application also provides a laser processing method, which includes: Using pulsed laser to process through holes in the substrate; It also includes detection methods as described in the first aspect and any embodiment of the first aspect.

[0117] It should be noted that the various optional implementation methods described in the embodiments of this application can be combined with each other or implemented individually without conflict, and the embodiments of this application do not limit this.

[0118] To facilitate understanding of the detection method provided in the above embodiments, the following describes the detection method using a specific scenario embodiment.

[0119] like Figure 2As shown, the laser system provides pulsed laser light, which is focused onto the workpiece by the processing head; the first and second detection devices on the upper and lower sides of the workpiece collect the signals after the laser action; the pulse monitoring and control system simultaneously receives the two signals, completes analysis, anomaly judgment and other processing, and links with the PC to realize data interaction and platform control system to adjust the motion platform, ultimately forming a closed-loop processing flow of "laser emission - signal detection - data processing - equipment control", which is suitable for the precision laser processing needs of multiple scenarios.

[0120] Figure 3 A schematic diagram of the detection system and laser processing equipment provided in another embodiment of this application is shown. For ease of explanation, only the parts related to the embodiment of this application are shown.

[0121] Reference Figure 3 The laser processing equipment includes a laser processing module 301, which includes a pulsed laser, a laser processing head, and a processing table, configured to emit pulsed laser light onto the substrate to be processed; it also includes a detection system.

[0122] Optionally, in this embodiment, the laser processing module 301 is an execution unit for realizing through-hole processing, and consists of a pulsed laser, a laser processing head, and a processing table.

[0123] The laser processing head includes at least one of the following optical elements: beam expander, focusing lens, conical lens, galvanometer, and reflector.

[0124] Pulsed lasers can emit pulsed lasers of any wavelength. After being adjusted by the processing head, the pulsed laser is precisely applied to the substrate to be processed. For example, the beam size is adjusted by a beam expander and the energy is focused by a focusing lens, so that it is precisely applied to the substrate to be processed.

[0125] The processing table can adopt a frame structure with enclosed edges. On the one hand, it can stably support the substrate to be processed, providing solid support for the processing process and ensuring processing accuracy. On the other hand, the frame design can avoid the through-hole processing area of ​​the substrate, allowing the transmitted light to pass smoothly from the second main surface of the substrate to the second detection device below, ensuring the effective acquisition of the second pulse signal, and finally realizing the function of emitting pulsed laser to the substrate to be processed and completing the through-hole processing.

[0126] The detection system may include: The optical detection module 302 is configured to simultaneously acquire a first pulse signal from a first side of the substrate to be processed and a second pulse signal from a second side of the substrate to be processed during the process of processing a through hole using a pulsed laser. The optical detection module 302 includes a first detection device and a second detection device. The first detection device is disposed on a first side of the substrate to be processed to acquire a first pulse signal; the second detection device is disposed on a second side of the substrate to be processed to acquire a second pulse signal. The processing control module 303 is connected to the first detection device and the first detection device; The processing control module 303 includes: The feature extraction unit is configured to extract at least one feature parameter from the synchronously acquired first pulse signal and second pulse signal; An anomaly diagnosis unit is configured to determine processing anomalies and identify the anomaly type based on the at least one feature parameter. The position recording unit is configured to record the coordinates of the through hole when the processing state of the through hole is determined to be abnormal; The image recognition module is configured to perform visual re-inspection of the locations of through holes that are determined to be abnormal.

[0127] The optical detection module 302 is responsible for the synchronous acquisition of pulse signals during processing, and includes a first detection device and a second detection device. The first detection device is disposed on the first side of the substrate to be processed, and is used to capture the first pulse signal formed by reflection and scattering during processing; the second detection device is disposed on the second side of the substrate to be processed, and is used to acquire the second pulse signal formed by penetrating the substrate or acting on the back of the substrate. The first and second detection devices are compatible with various sensors capable of detecting pulse energy or waveforms, such as PDs, avalanche photodiodes (APDs), and fiber optic sensors.

[0128] like Figure 4 As shown, the arrangement of the first detection device is highly flexible. It can be flexibly installed at any suitable position in front of the object being processed, such as the side of the processing head, the side of the transmission light direction of the reflected light path where reflector 1 or reflector 2 is located, etc., as long as it can effectively capture the first pulse signal. It can adapt to different equipment layout requirements and improve the installation and application flexibility of the system.

[0129] The processing control module 303 is connected to the first and second detection devices of the optical detection module 302 to perform functions such as signal processing, anomaly detection, and position recording, ensuring the realization of the processing closed loop. Specifically, it may include: (1) Feature extraction unit The function of this unit is to perform data analysis on the first and second pulse signals synchronously acquired by the optical detection module 302, and extract key feature parameters from the two types of signals. The extracted parameters include single pulse amplitude, single pulse energy, single pulse waveform (including rising edge slope and falling edge slope), single pulse width, single pulse intensity, amplitude ratio of the two-sided signals, and the time delay of the second pulse relative to the first pulse.

[0130] (2) Abnormal diagnosis unit This unit, based on at least one feature parameter obtained by the feature extraction unit, determines whether there are any abnormalities in the through-hole processing according to preset judgment rules, and identifies the type of abnormality. Identifiable abnormalities include abnormal laser supply, abnormal surface contamination of the substrate, and abnormal internal material of the substrate. Specific judgment and identification methods can be found in the aforementioned embodiments, and will not be repeated here.

[0131] (3) Location recording unit When the anomaly diagnosis unit determines that the through-hole processing status is abnormal, the unit will automatically record the coordinate information of the abnormal through-hole and store it in the anomaly coordinate table to ensure that the anomaly handling can be accurately located.

[0132] (4) Image recognition module This module is primarily used for visual re-inspection of vias identified as abnormal by the anomaly diagnosis unit, serving as a secondary verification step in the anomaly determination. By integrating a high-definition imaging device, it acquires high-resolution images of the abnormal via locations, extracting visual features such as via shape, diameter, wall condition, and surface deposits, and comparing these features with a standard template of acceptable vias. Ultimately, this process filters out truly abnormal vias, eliminating potential misjudgments from signal detection and further improving the accuracy of anomaly detection.

[0133] In a detection system provided in this application embodiment, by simultaneously acquiring first and second pulse signals from the first and second sides of the substrate during the through-hole processing of the substrate by pulsed laser, the processing and detection processes are synchronized, breaking the lag detection mode that relies on image analysis after processing in related technologies. Subsequently, based on the synchronously acquired first and / or second pulse signals, anomaly determination is made on the current processed through-hole status. Anomalies can be identified in real time during the processing of each through-hole, thereby avoiding or reducing the continuous impact of abnormal processing states on subsequent processing steps and causing batch defects. At the same time, when the processing state is determined to be abnormal, the coordinates of the through-hole are recorded, so that each abnormal through-hole can be accurately located, thereby avoiding or reducing the continuous impact of abnormal states on subsequent processing steps and causing batch defects, thus improving product yield.

[0134] In one embodiment, the processing control module further includes a compensation processing module, which is configured to: generate corresponding laser parameter adjustment instructions and positioning movement instructions according to the anomaly diagnosis module and / or the determined anomaly type, and control the laser processing module 301 to re-drill the coordinate positions recorded by the position recording unit.

[0135] Optionally, in this embodiment, the compensation processing module receives the abnormality type output by the abnormality diagnosis module, and generates targeted laser parameter adjustment instructions and positioning movement instructions by combining the abnormal through-hole coordinates stored by the position recording module. The laser parameter adjustment needs to be adapted to the corresponding abnormality type (the specific re-mapping strategy can be referred to the aforementioned embodiment, which will not be repeated here). The positioning movement instructions guide the processing table to move the substrate so that the laser processing module 301 is aligned with the abnormal through-hole position.

[0136] Subsequently, the compensation processing module sends a control signal to the laser processing module 301, driving it to perform re-mapping according to the adjusted parameters. After the re-mapping, the optical detection module 302 is synchronously linked to perform another detection until the abnormal through hole meets the processing standard, thus completing the closed-loop repair.

[0137] In these alternative embodiments, the compensation processing module generates parameter adjustment and positioning instructions based on the anomaly type, driving the laser processing module 301 to perform supplementary processing on the abnormal coordinates, thereby realizing a closed-loop processing of anomaly detection and supplementary processing without manual intervention, which greatly improves the processing yield and automation level.

[0138] In one embodiment, the first detection device and / or the second detection device is a photodiode, an avalanche photodiode, a fiber optic sensor, an oscilloscope, a spot quality analyzer, or a charge-coupled device (CCD) sensor or a combination thereof.

[0139] It should be noted that obtaining single-pulse characteristic parameters (such as single-pulse energy, pulse width, waveform, intensity, and spot area) requires the coordinated operation and computational transformation of multiple types of detection instruments. Specifically, photodiodes, avalanche photodiodes, and fiber optic sensors can initially acquire the pulse signal amplitude, thereby further calculating basic parameters such as energy and intensity. Oscilloscopes can accurately capture the pulse waveform morphology, rise / fall slope, pulse width, and other time-domain and morphological characteristics. These detection devices can be flexibly combined according to actual detection needs, and through the collaborative computational transformation of the raw signals acquired by various instruments, the complete characteristic parameters required to determine the processing status are ultimately obtained, ensuring the accuracy and comprehensiveness of anomaly diagnosis and adapting to diverse processing and detection scenarios for transparent, semi-transparent, and opaque materials.

[0140] It should be noted that the information interaction and execution process between the above-mentioned devices / units are based on the same concept as the method embodiments of this application, and are devices corresponding to the above-mentioned methods. All implementation methods in the above-mentioned method embodiments are applicable to the embodiments of this device. For details on its specific functions and the technical effects it brings, please refer to the method embodiment section, which will not be repeated here.

[0141] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0142] Figure 5 A schematic diagram of the hardware structure of the electronic device provided in an embodiment of this application is shown.

[0143] The device may include a processor 501 and a memory 502 storing program instructions.

[0144] When processor 501 executes the program, it implements the steps in any of the above method embodiments.

[0145] For example, the program can be divided into one or more modules / units, one or more of which are stored in memory 502 and executed by processor 501 to complete this application. One or more modules / units can be a series of program instruction segments capable of performing a specific function, which describe the program's execution process in the device.

[0146] Specifically, the processor 501 may include a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits that can be configured to implement the embodiments of this application.

[0147] Memory 502 may include mass storage for data or instructions. For example, and not limitingly, memory 502 may include a hard disk drive (HDD), floppy disk drive, flash memory, optical disk, magneto-optical disk, magnetic tape, or Universal Serial Bus (USB) drive, or a combination of two or more of these. Where appropriate, memory 502 may include removable or non-removable (or fixed) media. Where appropriate, memory 502 may be internal or external to the integrated gateway disaster recovery device. In a particular embodiment, memory 502 is non-volatile solid-state memory.

[0148] Memory may include read-only memory (ROM), random access memory (RAM), disk storage media devices, optical storage media devices, flash memory devices, and electrical, optical, or other physical / tangible memory storage devices. Therefore, typically, memory includes one or more tangible (non-transitory) readable storage media (e.g., memory devices) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described with reference to the methods according to one aspect of this disclosure.

[0149] The processor 501 implements any of the methods described in the above embodiments by reading and executing program instructions stored in the memory 502.

[0150] In one example, the electronic device may also include a communication interface 505 and a bus 510. The processor 501, memory 502, and communication interface 505 are connected via the bus 510 and communicate with each other.

[0151] The communication interface 505 is mainly used to realize communication between various modules, devices, units and / or equipment in the embodiments of this application.

[0152] Bus 510 includes hardware, software, or both, that couples components of an online data traffic metering device together. For example, and not limitingly, the bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an Infinite Bandwidth Interconnect, a Low Pin Count (LPC) bus, a memory bus, a Microchannel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local (VLB) bus, or other suitable buses, or combinations of two or more of these. Where appropriate, bus 510 may include one or more buses. Although specific buses are described and illustrated in embodiments of this application, any suitable bus or interconnect is contemplated herein.

[0153] Furthermore, in conjunction with the methods in the above embodiments, this application embodiment can provide a storage medium for implementation. This storage medium stores program instructions; when these program instructions are executed by a processor, they implement any of the methods in the above embodiments.

[0154] This application also provides a chip, which includes a processor and a communication interface. The communication interface and the processor are coupled. The processor is used to run programs or instructions to implement the various processes of the above method embodiments and achieve the same technical effect. To avoid repetition, it will not be described again here.

[0155] It should be understood that the chip mentioned in the embodiments of this application may also be referred to as a system-on-a-chip, system chip, chip system, or system-on-a-chip, etc.

[0156] This application provides a computer program product, which is stored in a storage medium and executed by at least one processor to implement the various processes of the above method embodiments and achieve the same technical effects. To avoid repetition, it will not be described again here.

[0157] It should be clarified that this application is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of this application is not limited to the specific steps described and shown. Those skilled in the art can make various changes, modifications, and additions, or change the order of steps, after understanding the spirit of this application.

[0158] The functional modules shown in the above block diagram can be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, they can be, for example, electronic circuits, application-specific integrated circuits (ASICs), appropriate firmware, plug-ins, function cards, etc. When implemented in software, the elements of this application are programs or code segments used to perform the required tasks. Programs or code segments can be stored on machine-readable media or transmitted over a transmission medium or communication link via data signals carried on a carrier wave. "Machine-readable media" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, fiber optic media, radio frequency (RF) links, etc. Code segments can be downloaded via computer grids such as the Internet, intranets, etc.

[0159] It should also be noted that the exemplary embodiments mentioned in this application describe methods or systems based on a series of steps or apparatus. However, this application is not limited to the order of the above steps; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

[0160] The aspects of this disclosure have been described above with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and program products according to embodiments of this disclosure. It should be understood that each block in the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to create a machine such that these instructions, executable via the processor of the computer or other programmable data processing apparatus, enable the implementation of the functions / actions specified in one or more blocks of the flowchart illustrations and / or block diagrams. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field-programmable logic circuit. It is also understood that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can also be implemented by special-purpose hardware performing the specified functions or actions, or can be implemented by a combination of special-purpose hardware and computer instructions.

[0161] The above are merely specific embodiments of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.

Claims

1. A detection method for real-time detection of laser processing quality, characterized in that, The method includes: During the process of using pulsed laser to process through holes in the substrate to be processed, a first pulse signal is simultaneously obtained from the first side of the substrate to be processed, and a second pulse signal is obtained from the second side of the substrate to be processed. The processing status of the through hole is determined based on the first pulse signal and / or the second pulse signal. When the processing state is determined to be abnormal, the coordinates of the through hole are recorded.

2. The detection method according to claim 1, characterized in that, The first pulse signal is obtained from the reflected light of the laser acting on the substrate to be processed; the second pulse signal is obtained from the transmitted light of the laser acting on the substrate to be processed.

3. The detection method according to claim 1, characterized in that, The determination of whether the processing status of the through hole is abnormal based on the first pulse signal and / or the second pulse signal includes any one of the following: If the deviation between the first pulse signal and the first preset standard signal is greater than the first deviation threshold, the processing state is determined to be abnormal; the first preset standard signal is a pulse signal obtained from the first side of the substrate to be processed when the processing state of the through hole meets the preset requirements. If the deviation between the second pulse signal and the second preset standard signal is greater than the second deviation threshold, the processing state is determined to be abnormal. The second preset standard signal is a pulse signal obtained from the second side of the substrate to be processed when the processing state of the through hole meets the preset requirements.

4. The detection method according to claim 1, characterized in that, The step of determining whether the processing status of the through hole is abnormal based on the first pulse signal and / or the second pulse signal includes: The processing state is determined to be abnormal based on at least one feature parameter extracted from the first pulse signal or the second pulse signal. The feature parameters include: single pulse amplitude, single pulse energy, single pulse waveform, single pulse width, and single pulse intensity.

5. The detection method according to claim 1, characterized in that, The step of determining whether the processing status of the through hole is abnormal based on the first pulse signal and / or the second pulse signal includes: The processing state is determined as abnormal and the corresponding abnormality type based on at least one feature parameter extracted from the first pulse signal and the second pulse signal. The feature parameters include: single pulse amplitude, single pulse energy, single pulse waveform, single pulse amplitude, single pulse intensity, the time delay of the second pulse signal relative to the first pulse signal, and the amplitude ratio of the single pulses of the first pulse signal and the second pulse signal.

6. The method according to claim 5, characterized in that, The determination of the anomaly type includes at least one of the following: If the single pulse amplitude of the first pulse signal is lower than the first amplitude range, the single pulse amplitude of the second pulse signal is lower than the second amplitude range, and the amplitude ratio is within the normal ratio range, then the abnormality type is determined to be a laser supply abnormality. If the single pulse amplitude of the first pulse signal deviates from the first amplitude range, and the amplitude of the second pulse signal is lower than the second amplitude range, and the amplitude ratio deviates from the normal ratio range, then the abnormality type is determined to be an abnormal surface contamination of the substrate. If the occurrence time delay is greater than the first time range, the abnormality type is determined to be an abnormality in the internal material of the substrate.

7. The detection method according to any one of claims 1 to 6, characterized in that, The method further includes: The image recognition module is used to re-inspect the through holes whose processing status is determined to be abnormal, and the abnormal through holes are screened out.

8. The method according to claim 6, characterized in that, The method further includes: Based on the type of anomaly detected, corresponding processing measures are initiated, wherein the processing measures include at least one of the following: In case of abnormal laser supply, laser status detection is performed, laser emission parameters are adjusted to normal, and then laser re-firing is performed; For abnormal surface contamination, surface cleaning is performed, followed by laser re-penetration. For abnormalities in the internal material of the substrate, perform material abnormality area detection, and make a decision to scrap the substrate or to repair it with laser based on the characteristics of the abnormal area.

9. A detection system for real-time detection of laser processing quality, characterized in that, include: The optical detection module is configured to simultaneously acquire a first pulse signal from a first side of the substrate to be processed and a second pulse signal from a second side of the substrate to be processed during the process of processing a through hole using a pulsed laser. The optical detection module includes a first detection device and a second detection device. The first detection device is disposed on a first side of the substrate to be processed to acquire a first pulse signal; the second detection device is disposed on a second side of the substrate to be processed to acquire a second pulse signal. A processing control module is connected to the first detection device and the first detection device; The processing control module includes: The feature extraction unit is configured to extract at least one feature parameter from the synchronously acquired first pulse signal and second pulse signal; An anomaly diagnosis unit is configured to determine processing anomalies and identify the anomaly type based on at least one feature parameter. The position recording unit is configured to record the coordinates of the through hole when the processing state of the through hole is determined to be abnormal; The image recognition module is configured to perform visual re-inspection of the locations of through holes that are determined to be abnormal.

10. The system according to claim 9, characterized in that, The processing control module further includes a compensation processing module, which is configured to: generate corresponding laser parameter adjustment instructions and positioning movement instructions based on the anomaly diagnosis module and / or the determined anomaly type, and control the laser processing module to re-drill the coordinate positions recorded by the position recording unit.

11. The system according to claim 10, characterized in that, The first detection device and / or the second detection device are photodiodes, avalanche photodiodes, fiber optic sensors, oscilloscopes, or CCD sensors and combinations thereof.

12. A laser processing method, characterized in that, include: Using pulsed laser to process through holes in the substrate; It also includes the detection method as described in any one of claims 1-8.

13. A laser processing device, characterized in that, include: A laser processing module, comprising a pulsed laser, a laser processing head, and a processing table, configured to emit pulsed laser light toward a substrate to be processed; It also includes the detection system as described in any one of claims 9-11.

14. An electronic device, characterized in that, include: Processor and memory storing computer program instructions; When the processor executes the computer program instructions, it implements the detection method as described in any one of claims 1-8, or the laser processing method as described in claim 12.

15. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer program instructions that, when executed by a processor, implement the detection method as described in any one of claims 1-8, or the laser processing method as described in claim 12.

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