Low-temperature quick-drying bar-planting adhesive and preparation method thereof

Abstract

The invention belongs to the technical field of embedded steel bar adhesives, and particularly relates to a low-temperature quick-drying embedded steel bar adhesive which comprises a material A and a material B. The material A comprises the following components in parts by weight: 18-22 parts of epoxy resin, 4.8-5.3 parts of a diluent, 0.5-0.6 part of first white carbon black and 18-22 parts of first silica powder; and the material B comprises the following components in parts by weight: 10-12 parts of a curing agent, 0.1 part of a coupling agent, 0.5-0.8 part of second white carbon black, 6.5-11.5 parts of second silica powder and 0.03-0.06 part of color paste. The overall structure provided by the embodiment of the invention has certain thixotropy and does not flow during construction; good bonding performance with most structural materials is achieved; the adhesive is free of crystallization and low-temperature curing, can well meet various requirements specified in the national standard, meets the construction requirement at the low temperature of-10 DEG C, can be stressed for 2 hours at the normal temperature of 23 DEG C, is high in corrosion resistance, does not flow during construction, and has high adhesive property.

Description

Technical Field

[0001] This application relates to the field of rebar adhesive technology, and in particular to a low-temperature fast-drying rebar adhesive and its preparation method. Background Technology

[0002] Chemical anchoring, also known as rebar installation or rebar planting, involves drilling holes in hard substrates such as concrete, walls, or rocks, injecting anchoring adhesive, and then inserting ordinary steel bars or bolts. After the adhesive cures, the steel bars or bolts bond with the substrate, thereby strengthening and reinforcing the connection between the concrete and the steel bars, enabling them to work together to withstand various stresses.

[0003] The "Technical Specification for Safety Appraisal of Strengthening Materials for Engineering Structures" GB 50728-2011 has specific regulations for the safety appraisal of low-temperature fast-curing anchoring adhesives. The specification requires that the adhesive be prepared and bonded at the lowest temperature specified in the instruction manual, and that the specimens be cured and maintained at low temperature for the specified time. It also requires that the percentage decrease in the tensile shear strength of the adhesive relative to steel in the low-temperature environment should not exceed 10%. Since the minimum operating temperature for epoxy resin anchoring adhesives is generally 5℃, with some products at -5℃, this low-temperature fast-curing adhesive can be used in environments as low as -10℃, curing and meeting the performance requirements. This allows for construction even in northern regions during winter, extending the construction period in those areas. Furthermore, this adhesive cures very quickly at room temperature and develops strength rapidly. The main materials of the fast-curing anchoring adhesive are generally vinyl esters or acrylic esters, and its main characteristics are rapid curing and a short construction period. However, a major drawback is its strong odor, especially when construction is carried out in poorly ventilated tunnels. The pungent smell is very unfriendly to the human body. Furthermore, after curing, it is quite brittle and has poor toughness. Under long-term dynamic loads or vibration environments, the colloid is prone to cracking or failure to bond with the substrate, thus leading to safety hazards. Based on this situation, Mancot has developed an anchoring adhesive that uses modified epoxy resin as the main material combined with nano-scale materials. It has a low odor and its toughness after curing is far superior to that of fast-drying anchoring adhesives such as vinyl esters. Moreover, it is designed as a rigid injection-type anchoring adhesive, which is convenient to apply and easy to inject. Its curing speed is also exceptionally fast, close to that of vinyl ester systems. At a room temperature of around 23°C, the adhesive has cured after 2-3 hours of curing following the planting of chemical anchors or rebars. It can bear loads and is passable by vehicles. Currently, some projects, especially shield tunnels, high-speed rail, and subway tunnels, require rapid repair and fixation with a construction cycle of only 3-4 hours. The anchoring adhesives on the market are generally vinyl ester or acrylic ester systems. From the perspective of product characteristics, although they cure quickly, they are brittle, have poor toughness, and the cured product is prone to cracking and aging. They also have a strong odor during construction. Therefore, this invention proposes a low-temperature fast-drying anchoring adhesive and its preparation method. Summary of the Invention

[0004] This application provides a low-temperature fast-drying rebar adhesive and its preparation method to solve the problems mentioned above.

[0005] This application provides a low-temperature, fast-drying rebar adhesive, comprising component A and component B, each comprising the following components in parts by weight: Component A: 18-22 parts epoxy resin, 4.8-5.3 parts diluent, 0.5-0.6 parts silica, and 18-22 parts silica powder; Material B: 10-12 parts curing agent, 0.1 parts coupling agent, 0.5-0.8 parts second silica, 6.5-11.5 parts second silica powder, and 0.03-0.06 parts color paste.

[0006] Preferably, the epoxy resin comprises a mixture of 1828 resin and 170 resin, wherein the weight ratio of 1828 resin to 170 resin is 4:1.

[0007] Preferably, the diluent comprises a mixture of 692 diluent and 622 diluent, wherein the weight ratio of 692 diluent to 622 diluent is 1:4.

[0008] Preferably, the particle size of the first silicon micro powder includes a mixture of first 400-mesh silicon micro powder and first 1500-mesh silicon micro powder, wherein the weight ratio of the first 400-mesh silicon micro powder to the first 1500-mesh silicon micro powder is 1:1.

[0009] Preferably, the particle size of the second silicon micro powder includes a mixture of second 400-mesh silicon micro powder and second 1500-mesh silicon micro powder, wherein the weight ratio of the second 400-mesh silicon micro powder to the second 1500-mesh silicon micro powder is 1:1.

[0010] Preferably, material A and material B are respectively: Material A: 1828 resin, 170 resin, 692 diluent, 622 diluent, first N20 silica, first 400 mesh silica powder and first 1500 mesh silica powder; Material B: 5230B curing agent, KH-550 coupling agent, second N20 silica, second 400 mesh silica powder, second 1500 mesh silica powder, SB2008 blue paste.

[0011] Preferably, the optimal weight proportions of material A and material B respectively include the following components in the following weight proportions: Material A: 16 parts of 1828 resin, 4 parts of 170 resin, 1 part of 692 diluent, 4 parts of 622 diluent, 0.6 parts of first N20 silica, 10 parts of first 400 mesh silica powder, and 10 parts of first 1500 mesh silica powder. Material B: 10.91 parts of 5230B curing agent, 0.1 parts of KH-550 coupling agent, 0.65 parts of second N20 silica, 4.55 parts of second 400 mesh silica powder, 4.55 parts of second 1500 mesh silica powder, and 0.05 parts of SB2008 blue paste.

[0012] Preferably, material A and material B are mixed before use, and the volume ratio of material A to material B is 2:1.

[0013] A method for preparing a low-temperature fast-drying rebar adhesive includes the following steps: S1. Preparation of material A and preparation of material B: Preparation of Material A: First, add the set amount of mixed resin to the mixing tank, then add the set amount of mixed diluent, turn on the power switch of the mixer, start the stirring switch, and stir for 2 minutes; then turn off the mixer, add the set amount of first N20 silica, and stir for 5 minutes; then add the set amount of mixed first silica powder, and stir for 20 minutes, adding the first N20 silica powder first and stirring evenly before adding the first silica powder; after discharging, return to the tank and continue stirring until the colloid is evenly mixed, then turn off the mixer.

[0014] Preparation of material B: First, add the set amount of 5230B curing agent to the mixing tank, then add the set amount of accelerator and the set amount of SB2008 blue paste. Turn on the power switch of the mixer and start the mixer. Mix for 2 minutes. Then add the set amount of KH-550 coupling agent and mix for 2 minutes. Turn off the mixer. Add the set amount of N20 silica and mix for 5 minutes. Then add the set amount of silica powder and mix for 20 minutes. After discharge, return the material to the pot and continue mixing until the colloid is uniform before turning off the mixer.

[0015] S2, Grinding materials A and B: Start the grinder, open the mixer discharge valve, turn on the discharge switch and the mixing switch, adjust the distance between the three rollers of the grinder to an appropriate distance for optimal discharge, place the transfer bucket at the discharge port of the grinder, and inject material A and material B into the grinder respectively. Pour the full bucket of adhesive into the glue hoppers of the A and B glue dispensing machines respectively.

[0016] S3, Glue application: Connect the power supply and high-pressure air pump of the dispensing machine, turn on the power switch of the dispensing machine, and adjust the reading of material A on the dispensing valve to 7745; adjust the reading of material B to 8812. Place the two sets of glue bottles directly below the outlet of the dispensing machine. Each set of glue bottles is packaged in 500mL bottles, with material A containing 333mL and material B containing 167mL.

[0017] The technical solutions provided in this application have the following advantages compared with the prior art: The overall structure provided in this application embodiment features a solvent-free, two-component injection-type anchoring adhesive, which can be applied to the anchoring of concrete to steel bars or chemical anchors. It is mixed using a mixer, making injection application convenient and simple. It cures extremely quickly, develops strength rapidly, and can be applied at ultra-low temperatures of -10°C. It exhibits some thixotropy, preventing flow during application. It has good adhesion to most structural materials, does not crystallize, and can cure at low temperatures, meeting the requirements of national standards and the need for application at -10°C. It can withstand stress within 2 hours at room temperature (23°C), has strong corrosion resistance, does not flow during application, and possesses high bonding performance. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram illustrating the preparation method of the low-temperature fast-drying rebar adhesive of the present invention. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] Various embodiments of this application may exist in the form of a range. It should be understood that the description in the form of a range is merely for convenience and brevity and should not be construed as a rigid limitation on the scope of this application. Therefore, it should be considered that the range description has specifically disclosed all possible sub-ranges and single numerical values ​​within that range. For example, it should be considered that the range description from 1 to 6 has specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., and single numbers within the range, such as 1, 2, 3, 4, 5, and 6, regardless of the range. In addition, whenever a numerical range is indicated in this application, it means including any referenced number (fraction or integer) within the indicated range. Unless otherwise specified, all raw materials, reagents, instruments, and equipment used in this application can be purchased commercially or prepared using existing equipment.

[0023] In this application, unless otherwise stated, directional terms such as "above" and "below" specifically refer to the drawing directions in the accompanying drawings. Furthermore, in this application, terms such as "including" and "comprising" mean including but not limited to. In this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. In this application, "and / or" describes the relationship between related objects, indicating that three relationships may exist, for example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Where A and B can be singular or plural. In this application, "at least one" means one or more, and "more than one" means two or more. "At least one," "at least one of the following," or similar expressions refer to any combination of these items, including any combination of a single item or a plural item. For example, at least one of a, b, or c, or at least one of a, b, and c, can all represent: a, b, c, ab, i.e., a and b, ac, bc, or abc, where a, b, and c can be single or multiple.

[0024] like Figure 1 As shown: This application provides a low-temperature fast-drying rebar adhesive, comprising component A and component B, each comprising the following components in parts by weight: Component A: 18-22 parts epoxy resin, 4.8-5.3 parts diluent, 0.5-0.6 parts silica, and 18-22 parts silica powder; Material B: 10-12 parts curing agent, 0.1 parts coupling agent, 0.5-0.8 parts second silica, 6.5-11.5 parts second silica powder, and 0.03-0.06 parts color paste.

[0025] Preferably, the epoxy resin comprises a mixture of 1828 resin and 170 resin, wherein the weight ratio of 1828 resin to 170 resin is 4:1.

[0026] The diluent comprises a mixture of 692 diluent and 622 diluent, wherein the weight ratio of 692 diluent to 622 diluent is 1:4.

[0027] The particle size of the first silicon micro powder includes a mixture of first 400-mesh silicon micro powder and first 1500-mesh silicon micro powder, wherein the weight ratio of the first 400-mesh silicon micro powder to the first 1500-mesh silicon micro powder is 1:1.

[0028] The particle size of the second silicon micro powder includes a mixture of second 400-mesh silicon micro powder and second 1500-mesh silicon micro powder, wherein the weight ratio of the second 400-mesh silicon micro powder to the second 1500-mesh silicon micro powder is 1:1.

[0029] The specific components A and B are as follows: Material A: 1828 resin, 170 resin, 692 diluent, 622 diluent, first N20 silica, first 400 mesh silica powder and first 1500 mesh silica powder; Material B: 5230B curing agent, KH-550 coupling agent, second N20 silica, second 400 mesh silica powder, second 1500 mesh silica powder, SB2008 blue paste.

[0030] The optimal weight proportions of material A and material B respectively include the following components in the following weight proportions: Material A: 16 parts of 1828 resin, 4 parts of 170 resin, 1 part of 692 diluent, 4 parts of 622 diluent, 0.6 parts of first N20 silica, 10 parts of first 400 mesh silica powder, and 10 parts of first 1500 mesh silica powder. Material B: 10.91 parts of 5230B curing agent, 0.1 parts of KH-550 coupling agent, 0.65 parts of second N20 silica, 4.55 parts of second 400 mesh silica powder, 4.55 parts of second 1500 mesh silica powder, and 0.05 parts of SB2008 blue paste.

[0031] Material A and Material B are mixed before use, and the volume ratio of Material A to Material B is 2:1.

[0032] A method for preparing a low-temperature fast-drying rebar adhesive includes the following steps: S1. Preparation of material A and preparation of material B: Preparation of Material A: First, add the set amount of mixed resin to the mixing tank, then add the set amount of mixed diluent, turn on the power switch of the mixer, start the stirring switch, and stir for 2 minutes; then turn off the mixer, add the set amount of first N20 silica, and stir for 5 minutes; then add the set amount of mixed first silica powder, and stir for 20 minutes, adding the first N20 silica powder first and stirring evenly before adding the first silica powder; after discharging, return to the tank and continue stirring until the colloid is evenly mixed, then turn off the mixer.

[0033] Preparation of material B: First, add the set amount of 5230B curing agent to the mixing tank, then add the set amount of accelerator and the set amount of SB2008 blue paste. Turn on the power switch of the mixer and start the mixer. Mix for 2 minutes. Then add the set amount of KH-550 coupling agent and mix for 2 minutes. Turn off the mixer. Add the set amount of N20 silica and mix for 5 minutes. Then add the set amount of silica powder and mix for 20 minutes. After discharge, return the material to the pot and continue mixing until the colloid is uniform before turning off the mixer.

[0034] S2, Grinding materials A and B: Start the grinder, open the mixer discharge valve, turn on the discharge switch and the mixing switch, adjust the distance between the three rollers of the grinder to an appropriate distance for optimal discharge, place the transfer bucket at the discharge port of the grinder, and inject material A and material B into the grinder respectively. Pour the full bucket of adhesive into the glue hoppers of the A and B glue dispensing machines respectively.

[0035] S3, Glue application: Connect the power supply and high-pressure air pump of the dispensing machine, turn on the power switch of the dispensing machine, and adjust the reading of material A on the dispensing valve to 7745; adjust the reading of material B to 8812. Place the two sets of glue bottles directly below the outlet of the dispensing machine. Each set of glue bottles is packaged in 500mL bottles, with material A containing 333mL and material B containing 167mL.

[0036] Specifically: the epoxy resin is a mixture of 1828 resin and 170 resin, with a weight ratio of 4:1. The 1828 resin provides the main performance material of the cured product, while the 170 resin provides the low-temperature curing speed and prevents crystallization and hardening in low-temperature environments, and can appropriately increase the curing speed of the system; The diluent is a mixture of 692 diluent and 622 diluent, with a weight ratio of 1:4. 692 diluent is a monofunctional diluent with extremely low viscosity, which mainly reduces the colloidal viscosity of the system. 622 diluent is a difunctional diluent with higher activity, which can slightly improve the curing speed and low-temperature curing performance. The first silicon micro powder has a particle size comprising a mixture of first 400-mesh silicon micro powder and first 1500-mesh silicon micro powder, wherein the weight ratio of the first 400-mesh silicon micro powder to the first 1500-mesh silicon micro powder is 1:1. The first silicon micro powder improves the shrinkage rate and material rigidity of the colloid. The two different particle sizes of the first 400-mesh silicon micro powder and the first 1500-mesh silicon micro powder can fill the gaps in the molecular structure, thereby improving the bonding strength and colloidal properties of the cured product, especially at low temperatures. First N20 silica improves the thixotropy and anti-sagging properties of the colloid, so that the colloid will not flow when it is on the side or up during construction. Curing agent 5230B is both a key material for rapid curing at room temperature and a key material for curing at low temperature. Due to its modified phenolic amine structure, the primary and tertiary amine groups are highly active. Once they encounter epoxy groups, they will quickly undergo a ring-opening reaction. Even at very low temperatures of -10℃, it still has great activity and can undergo a normal ring-opening reaction. The reaction is rapid at room temperature of 23℃, and the strength develops rapidly. The active amine groups in accelerator K54 react rapidly and can promote faster polymerization of colloids in the system, thereby accelerating the curing process. Coupling agent KH-560 reduces the molecular tension of the system through the effective component of silane, thereby improving the wettability of the colloid and the binder, so as to improve the bonding strength of the colloid. Color paste SB2008 improves the color of the colloid, making the cured product look more comfortable.

[0037] Material A and Material B are mixed before use, and the volume ratio of Material A to Material B is 2:1.

[0038] Example 1 This embodiment takes the preparation of 66.86 kg of low-temperature fast-drying anchoring adhesive as an example.

[0039] Prepare component A: 14.4 kg of 1828 resin, 3.6 kg of 170 resin, 1.06 kg of 692 diluent, 4.24 kg of 622 diluent, 0.54 kg of N20 silica, 9.0 kg of 400 mesh silica powder, and 9.0 kg of 1500 mesh silica powder. Prepare the following components for component B: 12.0 kg of 5230B curing agent, 0.6 kg of K-54 accelerator, 0.1 kg of KH-550 coupling agent, 0.76 kg of N20 silica, 5.75 kg of 400 mesh silica powder, 5.75 kg of 1500 mesh silica powder, and 0.06 kg of SB2008 blue paste.

[0040] (1) Preparation of material A First, add 18.0 kg of the above-mentioned mixed resin to the mixing tank, then add 5.3 kg of mixed diluent, turn on the mixer power switch, start the mixing switch, and mix for 2 minutes; then turn off the mixer, add 0.54 kg of the first N20 silica, and mix for 5 minutes; then add 18.0 kg of the mixed first silica powder, and mix for 20 minutes. It is important to note that the first N20 silica must be added and mixed evenly before adding the silica powder, otherwise the first N20 silica will be difficult to mix evenly and will not settle easily; after discharging 2.0 kg, return it to the tank and continue mixing until the colloid is evenly mixed (40 minutes in this example), then turn off the mixer.

[0041] (2) Preparation of material B First, add 12.0 kg of 5230B curing agent to the mixing tank, then add 0.6 kg of K-54 accelerator and 0.06 kg of SB2008 blue paste. Turn on the mixer power switch and start the mixer. Mix for 2 minutes, then add 0.1 kg of KH-550 coupling agent and mix for 2 minutes. Turn off the mixer, add 0.76 kg of N20 silica and mix for 5 minutes, then add 11.5 kg of silica powder and mix for 20 minutes. Discharge 1.0 kg of the product back into the mixing tank and continue mixing until the colloid is uniform before turning off the mixer.

[0042] (3) Grinding Start the grinder, open the mixer discharge valve, and turn on the discharge and mixing switches. Adjust the distance between the three rollers of the grinder to an appropriate level for optimal discharge. Place the transfer bucket at the grinder discharge port. When the transfer bucket is full, replace it with another bucket. Pour the full bucket of adhesive into the glue hoppers of the A and B dispensing machines respectively. After discharge, use a tool to clean the adhesive from the discharge pipe. Then clean the adhesive dripping from the glue receiving plate of the three rollers. Finally, use a scraper to clean the adhesive from the three rollers of the grinder and stop the grinder.

[0043] (4) Glue pouring Connect the power supply and high-pressure air pump of the glue dispensing machine. Turn on the power switch of the glue dispensing machine and adjust the reading of material A on the glue mixing valve to 7745; adjust the reading of material B to 8812 (the heating switch needs to be turned on in winter, and turned off in other seasons; the standard for winter is a minimum temperature below 10℃). Place the glue bottle directly below the dispensing machine's outlet, adjust the clamp spacing to ensure the glue bottle is clamped, and set the dispensing switch to the jog position. Place your hand within 1-2 cm of the light sensor, and the dispensing switch will detect and dispense the glue. After filling the glue bottle, replace it with an empty one. Then, bring your hand within 1-2 cm of the light sensor. The dispensing switch will detect the material and dispense it into the glue bottle. Use a special tool to insert the large and small plugs into the designated positions on the glue bottle. Then, tighten the vent pins on the large and small plugs to seal the glue bottle and ensure that no glue spills out. If any glue comes out of the vent, wipe it clean. The double-bottle packaging is 500mL per bottle, with material A containing 333mL and material B containing 167mL.

[0044] Example 2 This embodiment takes the preparation of 66.95 kg of low-temperature fast-curing anchoring adhesive as an example.

[0045] Prepare the following components for component A: 16.0 kg of 1828 resin, 4.0 kg of 170 resin, 1.0 kg of 692 diluent, 4.0 kg of 622 diluent, 0.6 kg of N20 silica, 10.0 kg of 400 mesh silica powder, and 10.0 kg of 1500 mesh silica powder. Prepare the following components for component B: 10.91 kg of 5230B curing agent, 0.54 kg of K-54 accelerator, 0.1 kg of KH-550 coupling agent, 0.65 kg of N20 silica, 4.55 kg of 400 mesh silica powder, 4.55 kg of 1500 mesh silica powder, and 0.05 kg of SB2008 blue paste.

[0046] (1) Preparation of material A First, add 20 kg of the above-mentioned mixed resin to the mixing tank, then add 5.0 kg of mixed diluent, turn on the mixer power switch, start the mixing switch, and mix for 2 minutes; then turn off the mixer, add 0.6 kg of the first N20 silica, and mix for 5 minutes; then add 20.0 kg of the mixed first silica powder, and mix for 20 minutes. It should be noted that the first N20 silica must be added and mixed evenly before adding the powder, otherwise the first N20 silica will be difficult to mix evenly and will not settle easily; after discharging 2.0 kg, return it to the tank and continue mixing until the colloid is evenly mixed (40 minutes in this example), then turn off the mixer.

[0047] (2) Preparation of material B First, add 10.91 kg of 5230B curing agent to the mixing tank, then add 0.54 kg of K-54 accelerator and 0.05 kg of SB2008 blue paste. Turn on the mixer power switch and start the mixer. Mix for 2 minutes, then add 0.1 kg of KH-550 coupling agent and mix for 2 minutes. Turn off the mixer, add 0.65 kg of second N20 silica and mix for 5 minutes, then add 9.1 kg of mixed second silica powder and mix for 20 minutes. Discharge 1.0 kg of the material back into the mixing tank and continue mixing until the colloid is uniform before turning off the mixer.

[0048] (3) Grinding Start the grinder, open the mixer discharge valve, and turn on the discharge and mixing switches. Adjust the distance between the three rollers of the grinder to an appropriate level for optimal discharge. Place the transfer bucket at the grinder discharge port. When the transfer bucket is full, replace it with another bucket. Pour the full bucket of adhesive into the glue hoppers of the A and B dispensing machines respectively. After discharge, use a tool to clean the adhesive from the discharge pipe. Then clean the adhesive dripping from the glue receiving plate of the three rollers. Finally, use a scraper to clean the adhesive from the three rollers of the grinder and stop the grinder.

[0049] (4) Glue pouring Connect the power supply and high-pressure air pump of the glue dispensing machine. Turn on the power switch of the glue dispensing machine and adjust the reading of material A on the glue mixing valve to 7745; adjust the reading of material B to 8812 (the heating switch needs to be turned on in winter, and turned off in other seasons; the standard for winter is a minimum temperature below 10℃). Place the glue bottle directly below the dispensing machine's outlet, adjust the clamp spacing to ensure the glue bottle is clamped, and set the dispensing switch to the jog position. Place your hand within 1-2 cm of the light sensor, and the dispensing switch will detect and dispense the glue. After filling the glue bottle, replace it with an empty one. Then, bring your hand within 1-2 cm of the light sensor. The dispensing switch will detect the material and dispense it into the glue bottle. Use a special tool to insert the large and small plugs into the designated positions on the glue bottle. Then, tighten the vent pins on the large and small plugs to seal the glue bottle and ensure that no glue spills out. If any glue comes out of the vent, wipe it clean. The double-bottle packaging is 500mL per bottle, with material A containing 333mL and material B containing 167mL.

[0050] Example 3 This embodiment takes the preparation of 67.05 kg of low-temperature fast-curing anchoring adhesive as an example.

[0051] Prepare component A: 17.6 kg of 1828 resin, 4.4 kg of 170 resin, 0.96 kg of 692 diluent, 3.84 kg of 622 diluent, 0.5 kg of N20 silica, 11.0 kg of 400 mesh silica powder, and 11.0 kg of 1500 mesh silica powder. Prepare the following components for component B: 10.0 kg of 5230B curing agent, 0.5 kg of K-54 accelerator, 0.1 kg of KH-550 coupling agent, 0.6 kg of N20 silica, 3.26 kg of 400 mesh silica powder, 3.26 kg of 1500 mesh silica powder, and 0.03 kg of SB2008 blue paste.

[0052] (1) Preparation of material A First, add 22.0 kg of the above-mentioned mixed resin to the mixing tank, then add 4.8 kg of mixed diluent, turn on the mixer power switch, start the mixing switch, and mix for 2 minutes; then turn off the mixer, add 0.5 kg of first N20 silica, and mix for 5 minutes; then add 22.0 kg of mixed silica powder, and mix for 20 minutes. It is important to note that the first N20 silica must be added and mixed evenly before adding the powder, otherwise the first N20 silica will be difficult to mix evenly and will not settle easily; after discharging 2.0 kg, return it to the tank and continue mixing until the colloid is evenly mixed (40 minutes in this example), then turn off the mixer.

[0053] (2) Preparation of material B First, add 10.0 kg of 5230B curing agent to the mixing tank, then add 0.5 kg of K-54 accelerator and 0.03 kg of SB2008 blue paste. Turn on the mixer power switch and start the mixer. Mix for 2 minutes. Then add 0.1 kg of KH-550 coupling agent and mix for 2 minutes. Turn off the mixer and add 0.6 kg of second N20 silica. Mix for 5 minutes. Then add 6.52 kg of mixed second silica powder and mix for 20 minutes. Discharge 1.0 kg of the material back into the mixing tank and continue mixing until the colloid is uniform before turning off the mixer.

[0054] (3) Grinding Start the grinder, open the mixer discharge valve, and turn on the discharge and mixing switches. Adjust the distance between the three rollers of the grinder to an appropriate level for optimal discharge. Place the transfer bucket at the grinder discharge port. When the transfer bucket is full, replace it with another bucket. Pour the full bucket of adhesive into the glue hoppers of the A and B dispensing machines respectively. After discharge, use a tool to clean the adhesive from the discharge pipe. Then clean the adhesive dripping from the glue receiving plate of the three rollers. Finally, use a scraper to clean the adhesive from the three rollers of the grinder and stop the grinder.

[0055] (4) Glue pouring Connect the power supply and high-pressure air pump of the glue dispensing machine. Turn on the power switch of the glue dispensing machine and adjust the reading of material A on the glue mixing valve to 7745; adjust the reading of material B to 8812 (the heating switch needs to be turned on in winter, and turned off in other seasons; the standard for winter is a minimum temperature below 10℃). Place the glue bottle directly below the dispensing machine's outlet, adjust the clamp spacing to ensure the glue bottle is clamped, and set the dispensing switch to the jog position. Place your hand within 1-2 cm of the light sensor, and the dispensing switch will detect and dispense the glue. After filling the glue bottle, replace it with an empty one. Then, bring your hand within 1-2 cm of the light sensor. The dispensing switch will detect the material and dispense it into the glue bottle. Use a special tool to insert the large and small plugs into the designated positions on the glue bottle. Then, tighten the vent pins on the large and small plugs to seal the glue bottle and ensure that no glue spills out. If any glue comes out of the vent, wipe it clean. The double-bottle packaging is 500mL per bottle, with material A containing 333mL and material B containing 167mL.

[0056] The performance of the low-temperature fast-curing anchoring adhesives prepared under the three embodiment conditions was tested according to GB50728-2011 "Technical Specification for Safety Appraisal of Strengthening Materials for Engineering Structures" (Table 1). The test results are shown in the table below: The application process of the low-temperature fast-curing rebar adhesive provided by this research and development is as follows: (1) Drilling: Drill holes according to the dimensions required by the design drawings; (2) Cleaning the hole: After drilling the hole, use a high-pressure water gun to blow away the mud and mortar inside the hole, then use a special brush to brush away the loose concrete on the surface of the hole wall, and finally use a high-pressure water gun to clean the hole and keep it ready for use. (3) Glue injection: Attach the glue bottle to the mixer and check that the glue injection nozzle must have a spiral tube, otherwise it is not allowed to be used. It is strictly forbidden to remove the spiral tube from the glue injection nozzle on site. Attach the glue bottle to the special glue gun and squeeze out the glue at a uniform speed. The glue in the first three shots should be discarded. Insert the glue injection nozzle into the bottom of the hole and slowly pull it out while injecting the glue. The normal glue injection volume is 2 / 3 of the hole volume. After the glue is finished, replace the glue bottle and the glue injection nozzle should also be replaced. Remove the glue injection nozzle and wipe the glue outlet clean. Tighten the nut and it can be used again next time. (4) Rebar installation: After the adhesive is injected, insert the threaded steel bar or ribbed steel bar into the bottom of the hole slowly in a clockwise direction. It is good if a little adhesive overflows. Wipe away the excess adhesive. (5) Curing: Let the anchoring adhesive cure naturally. The curing time depends on the temperature and refers to the curing time table. Do not rotate or knock the screw during the curing period.

[0057] For M12 through-wire anchors planted at different temperature ranges with a burial depth of 110mm, the curing time when the pull-out value reaches 45.6KN is recorded as the curing time, and the curing time when the nut can be tightened is recorded as the stress-bearing time. The curing time schedule is calculated as follows: Curing schedule Refer to the technical parameter table for use with screws. The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed in this application.

Claims

1. A low-temperature, fast-drying rebar adhesive, comprising component A and component B, characterized in that, The components are comprised in the following parts by weight: Component A: 18-22 parts epoxy resin, 4.8-5.3 parts diluent, 0.5-0.6 parts silica, and 18-22 parts silica powder; Material B: 10-12 parts curing agent, 0.1 parts coupling agent, 0.5-0.8 parts second silica, 6.5-11.5 parts second silica powder, and 0.03-0.06 parts color paste.

2. The low-temperature fast-drying rebar adhesive according to claim 1, characterized in that: The epoxy resin includes a mixture of 1828 resin and 170 resin, wherein the weight ratio of 1828 resin to 170 resin is 4:

1.

3. The low-temperature fast-drying rebar adhesive according to claim 1, characterized in that: The diluent comprises a mixture of 692 diluent and 622 diluent, wherein the weight ratio of 692 diluent to 622 diluent is 1:

4.

4. The low-temperature fast-drying rebar adhesive and its application method according to claim 1, characterized in that: The particle size of the first silicon micro powder includes a mixture of first 400-mesh silicon micro powder and first 1500-mesh silicon micro powder, wherein the weight ratio of the first 400-mesh silicon micro powder to the first 1500-mesh silicon micro powder is 1:

1.

5. The low-temperature fast-drying rebar adhesive and its application method according to claim 1, characterized in that: The particle size of the second silicon micro powder includes a mixture of second 400-mesh silicon micro powder and second 1500-mesh silicon micro powder, wherein the weight ratio of the second 400-mesh silicon micro powder to the second 1500-mesh silicon micro powder is 1:

1.

6. The low-temperature fast-drying rebar adhesive and its application method according to claim 1, characterized in that: The specific components A and B are as follows: Material A: 1828 resin, 170 resin, 692 diluent, 622 diluent, first N20 silica, first 400 mesh silica powder and first 1500 mesh silica powder; Material B: 5230B curing agent, KH-550 coupling agent, second N20 silica, second 400 mesh silica powder, second 1500 mesh silica powder, SB2008 blue paste.

7. The low-temperature fast-drying rebar adhesive according to claim 6, characterized in that: The optimal weight proportions of material A and material B respectively include the following components in the following weight proportions: Material A: 16 parts of 1828 resin, 4 parts of 170 resin, 1 part of 692 diluent, 4 parts of 622 diluent, 0.6 parts of first N20 silica, 10 parts of first 400 mesh silica powder, and 10 parts of first 1500 mesh silica powder. Material B: 10.91 parts of 5230B curing agent, 0.1 parts of KH-550 coupling agent, 0.65 parts of second N20 silica, 4.55 parts of second 400 mesh silica powder, 4.55 parts of second 1500 mesh silica powder, and 0.05 parts of SB2008 blue paste.

8. The low-temperature fast-drying rebar adhesive according to claim 1, characterized in that: Material A and Material B are mixed before use, and the volume ratio of Material A to Material B is 2:

1.

9. A method for preparing a low-temperature fast-drying rebar adhesive, characterized in that: Including the following methods: S1. Preparation of material A and preparation of material B: Preparation of Material A: First, add the set amount of mixed resin to the mixing tank, then add the set amount of mixed diluent, turn on the power switch of the mixer, start the stirring switch, and stir for 2 minutes; then turn off the mixer, add the set amount of first N20 silica, and stir for 5 minutes; then add the set amount of mixed first silica powder, and stir for 20 minutes, adding the first N20 silica powder first and stirring evenly before adding the first silica powder; after discharging, return to the tank and continue stirring until the colloid is evenly mixed, then turn off the mixer. Preparation of material B: First, add the set amount of 5230B curing agent to the mixing tank, then add the set amount of accelerator and the set amount of SB2008 blue paste. Turn on the power switch of the mixer and start the mixer. Mix for 2 minutes. Then add the set amount of KH-550 coupling agent and mix for 2 minutes. Turn off the mixer. Add the set amount of N20 silica and mix for 5 minutes. Then add the set amount of silica powder and mix for 20 minutes. After discharge, return the material to the pot and continue mixing until the colloid is uniform before turning off the mixer. S2, Grinding materials A and B: Start the grinder, open the mixer discharge valve, turn on the discharge switch and the mixing switch, adjust the distance between the three rollers of the grinder to an appropriate distance for optimal discharge, place the transfer bucket at the discharge port of the grinder, and inject material A and material B into the grinder respectively. Pour the full bucket of adhesive into the glue hoppers of the A and B glue dispensing machines respectively. S3, Glue application: Connect the power supply and high-pressure air pump of the dispensing machine, turn on the power switch of the dispensing machine, and adjust the reading of material A on the dispensing valve to 7745; adjust the reading of material B to 8812. Place the two sets of glue bottles directly below the outlet of the dispensing machine. Each set of glue bottles is packaged in 500mL bottles, with material A containing 333mL and material B containing 167mL.

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