Thermosetting temporary bonding adhesive as well as preparation method and application thereof
By controlling the ratio and crosslinking degree of vinyl raw rubber and hydrogen-containing silicone oil, a high-temperature resistant and easy-to-clean thermosetting temporary bonding adhesive was prepared, which solved the problems of softening and cleaning difficulties at high temperatures in the existing technology, and achieved the effects of efficient debonding and cost reduction, and is suitable for wafer HBM processing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN SAMCIEN NEW MATERIALS TECHNOLOGY CO LTD
- Filing Date
- 2026-02-03
- Publication Date
- 2026-05-12
AI Technical Summary
Existing thermosetting temporary bonding adhesives are prone to softening, detachment, or difficulty in cleaning at high temperatures, failing to meet the high-temperature resistance and easy-to-clean requirements of wafer HBM processing.
By precisely controlling the ratio and crosslinking degree of vinyl raw rubber and hydrogen-containing silicone oil, and combining appropriate amounts of inhibitors and catalysts, a thermosetting temporary bonding adhesive that can withstand temperatures above 150°C and is easy to clean is prepared, achieving one-time residue-free debonding.
It maintains the integrity of the adhesive film structure at high temperatures, quickly removes adhesive without residue, simplifies the cleaning process, reduces solvent consumption, improves processing yield and reduces costs, and is suitable for wafer HBM processing requirements.
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Abstract
Description
Technical Field
[0001] This invention belongs to the field of semiconductor materials technology, and relates to a thermosetting temporary bonding adhesive, its preparation method, and its application. Background Technology
[0002] With the rapid development of semiconductor technology, high-bandwidth memory (HBM), as a new type of stacked memory, has been widely used in high-performance computing, artificial intelligence, data centers, and other fields due to its advantages of high bandwidth and low power consumption. In the wafer HBM fabrication process, temporary bonding is a crucial step. This process requires temporarily bonding an ultra-thin wafer to a carrier wafer to provide sufficient support strength, ensuring the smooth progress of subsequent processing steps such as dicing, grinding, and bonding.
[0003] Temporary bonding adhesives are the core materials in temporary bonding processes, and their performance directly affects the precision and yield of wafer fabrication. Currently available temporary bonding adhesives have several shortcomings. Some adhesives lack sufficient high-temperature resistance, unable to withstand temperatures exceeding 150°C during processing, leading to softening, detachment, and bubbling, resulting in wafer fabrication failure. Other adhesives, while exhibiting excellent high-temperature resistance, are difficult to remove and clean after processing, easily leaving residues on the wafer surface, affecting subsequent packaging and performance. Therefore, developing a temporary bonding adhesive that combines high-temperature resistance and easy cleaning has become a pressing technical challenge in the field of wafer HBM processing.
[0004] The current field of thermosetting temporary bonding adhesives faces two major technical challenges: First, epoxy resin systems are heat-resistant but require cumbersome post-processing, necessitating repeated spin coating and cleaning (time ≥10 min, large solvent consumption), resulting in residual adhesive particles, high cleaning agent consumption, and significant environmental pressure. Second, existing silicon-based two-layer non-crosslinked temporary bonding adhesives, such as CN114096633A, focus only on improving TTV in wafer processing, failing to address the core contradiction of "high-temperature stability and efficient debonding," and do not disclose key performance quantitative indicators such as debonding time and solvent consumption, thus failing to meet the precise performance requirements of bonding materials in high-end processes. In the invention CN120158266A, reinforcing agents such as vinyl MQ resin, methyl MQ resin, and octamethylcyclotetrasiloxane are specifically introduced into the organosilicon temporary bonding material system. Although these components can significantly enhance the overall mechanical strength of the cured film and the bonding strength with the wafer and carrier interface by increasing the crosslinking density of the film, they also increase the contact resistance between the film and the cleaning agent due to the strengthening of the crosslinking structure, thus slowing down the rate of swelling and demolding. As can be seen from the embodiments of this patent, the cleaning time is 3.5 to 6 minutes, and it is necessary to rely on ultrasonic assistance or additional removal of small molecule residues. Compared with the system without reinforcing agents, it not only prolongs the cleaning process time, but also indirectly increases solvent consumption and process cost, which significantly restricts the rapid, efficient and residue-free demolding of the film. Summary of the Invention
[0005] To address the shortcomings of existing technologies, the present invention aims to provide a thermosetting temporary bonding adhesive, its preparation method, and its applications. The thermosetting temporary bonding adhesive of the present invention overcomes the difficulty of post-processing cleaning of existing thermosetting temporary bonding adhesives, achieving a performance balance between the thermosetting system's ability to withstand temperatures above 150°C and its ability to be removed without residue after a single immersion in cleaning agents, thus meeting the requirements of wafer HBM processing.
[0006] To achieve this objective, the present invention adopts the following technical solution: On one hand, the present invention provides a thermosetting temporary bonding adhesive, which comprises, by weight, the following components: 20-80 parts (e.g., 20, 26, 32, 38, 44, 50, 56, 62, 68, 70, 72, 75, 78, or 80 parts, etc.) of organic solvent, 5-35 parts (e.g., 5, 9, 13, 17, 21, 25, 29, 33, or 35 parts, etc.) of vinyl raw rubber, 5-35 parts (e.g., 5, 9, 13, 17, 21, 25, 29, 33, or 35 parts, etc.) of hydrogen-containing silicone oil, and 0.01-5 parts (e.g., 0. Additives in quantities of 0.1 parts, 0.1 parts, 1 part, 2 parts, 3 parts, 4 parts, or 5 parts, etc., including antioxidants, leveling agents, inhibitors, and catalysts, wherein the ratio of the molar amount of vinyl in the vinyl raw rubber to the molar amount of hydrogen in the hydrogen-containing silicone oil is between 1.1 and 1.4 (e.g., 1.1, 1.14, 1.18, 1.22, 1.26, 1.3, 1.34, 1.38, or 1.4, etc.), and the mass ratio of the inhibitors and catalysts is (50-500):1 (e.g., 50:1, 100:1, 150:1, 200:1, 250:1, 300:1, 350:1, 400:1, 450:1, or 500:1, etc.).
[0007] In this invention, by precisely controlling the ratio and crosslinking degree of vinyl ester raw rubber and hydrogen-containing silicone oil, the film can stably withstand temperatures above 150°C and maintain its structural integrity and reliable adhesion after the entire PECVD process, free from process defects such as bubbles and delamination. Immersing the film surface in cleaning agent allows for rapid absorption and swelling, facilitating complete peeling from the wafer surface. This method offers significant advantages in terms of fast cleaning speed and low solvent consumption, achieving complete film removal in as little as 1 minute, leaving no residue and without damaging the wafer or surface devices. It adapts to the requirements of temporary bonding materials in wafer HBM processing, improving yield and reducing costs.
[0008] In this invention, the vinyl molar amount in the vinyl raw rubber The molar amount of hydrogen in hydrogen-containing silicone oil .
[0009] In this invention, the mass ratio of inhibitor to catalyst is controlled at (50-500):1 to control the degree of crosslinking of the adhesive film, thereby achieving high temperature resistance and easy cleaning. The temporary bonding adhesive of this invention has advantages such as easy cleaning and bubble-free PECVD, and is suitable for temporary bonding processes in wafer HBM processing.
[0010] Preferably, the organic solvent is selected from one or a combination of at least two of toluene, xylene, trimethylbenzene, petroleum ether, n-hexane, cyclohexane, ethylcyclohexane, chloroform, or carbon tetrachloride.
[0011] Preferably, the vinyl content of the vinyl raw rubber is 0.1-5%, such as 0.1%, 0.6%, 1.1%, 1.6%, 2.1%, 2.6%, 3.1%, 3.6%, 4%, 4.5% or 5%, and more preferably 0.5%-4.5%.
[0012] Preferably, the weight average molecular weight of the vinyl raw rubber is 30,000 to 1,200,000 (e.g., 30,000, 80,000, 130,000, 180,000, 230,000, 280,000, 330,000, 380,000, 430,000, 480,000, 530,000, 580,000, 630,000, 680,000, 730,000, 780,000, 830,000, 880,000, 930,000, or 1,200,000, etc.), and more preferably 50,000 to 1,000,000.
[0013] Preferably, the hydrogen content of the hydrogen-containing silicone oil is 0.001-3% (e.g., 0.001%, 0.25%, 0.50%, 0.75%, 1%, 1.25%, 1.5%, 1.75%, 2.0%, 2.5% or 3%), and more preferably 0.002-2.5%.
[0014] Preferably, the weight-average molecular weight of the hydrogen-containing silicone oil is 1,000 to 500,000, such as 1,000, 2,000, 3,000, 4,000, 5,000, 10,000, 15,000, 20,000, 25,000, 30,000, 35,000, 40,000, 45,000, 5,000, 100,000, 150,000, 200,000, 250,000, 300,000, 350,000, 400,000, 450,000, or 500,000, and is preferably 5,000 to 400,000.
[0015] Preferably, the ratio of the molar amount of vinyl in the vinyl raw rubber to the molar amount of hydrogen in the hydrogen-containing silicone oil is 1.11-1.35.
[0016] Preferably, the antioxidant is selected from one or a combination of at least two of hindered phenolic antioxidants, hindered amine antioxidants, phosphite antioxidants or sulfur-containing antioxidants, preferably one or two of hindered phenolic antioxidants or hindered amine antioxidants, and more preferably hindered phenolic antioxidants.
[0017] Preferably, the leveling agent is selected from one or a combination of at least two of acrylic leveling agents, silicone leveling agents, and fluorocarbon leveling agents, and more preferably one or two of silicone leveling agents.
[0018] Preferably, the inhibitor is selected from one or a combination of at least two of alkynyl alcohols, phosphorus / nitrogen-containing organic compounds, cyclic siloxanes, etc., and is preferably an alkynyl alcohol.
[0019] Preferably, the catalyst is selected from one or a combination of at least two of platinum-based catalysts, nickel-based catalysts, etc., preferably a platinum-based catalyst, and more preferably a cassette catalyst.
[0020] Preferably, the mass ratio of the inhibitor to the catalyst is (80-300):1.
[0021] On the other hand, the present invention provides a method for preparing the thermosetting temporary bonding adhesive as described above, the method comprising the following steps: (1) Add the vinyl raw rubber to an organic solvent and stir until completely dissolved to obtain a premix; (2) Add hydrogen-containing silicone oil to the premixed liquid obtained in step (1), stir and mix to obtain a mixed liquid; (3) Add the inhibitor to the mixture obtained in step (2), stir and mix to obtain the mixture; (4) Add antioxidant and leveling agent to the mixture obtained in step (3), stir and mix to obtain a mixture; (5) Add the catalyst to the mixture obtained in step (4), stir and mix, and then degas to obtain the thermosetting temporary bonded adhesive.
[0022] Preferably, the stirring in step (1) is carried out at 25~40℃ (e.g., 25℃, 26℃, 27℃, 28℃, 29℃, 30℃, 31℃, 32℃, 33℃ or 40℃, etc.).
[0023] Preferably, the stirring rate in step (1) is 100~500 r / min (e.g., 100 r / min, 125 r / min, 150 r / min, 175 r / min, 200 r / min, 225 r / min, 250 r / min, 275 r / min, 300 r / min, 325 r / min, 350 r / min, 375 r / min, 400 r / min, 425 r / min or 500 r / min, etc.).
[0024] Preferably, the stirring time in step (1) is 12-48h (e.g., 12h, 16h, 20h, 24h, 28h, 32h, 36h, 40h, 44h or 48h, etc.).
[0025] Preferably, the stirring and mixing in step (2) is carried out at 25~40℃ (e.g., 25℃, 26℃, 27℃, 28℃, 29℃, 30℃, 31℃, 32℃, 33℃ or 40℃, etc.).
[0026] Preferably, the stirring and mixing in step (2) is carried out at a stirring rate of 100~500 r / min (e.g., 100 r / min, 125 r / min, 150 r / min, 175 r / min, 200 r / min, 225 r / min, 250 r / min, 275 r / min, 300 r / min, 325 r / min, 350 r / min, 375 r / min, 400 r / min, 425 r / min or 500 r / min, etc.).
[0027] Preferably, the mixing time in step (2) is 30 to 60 minutes (e.g., 30 minutes, 34 minutes, 38 minutes, 42 minutes, 46 minutes, 50 minutes, 54 minutes or 60 minutes).
[0028] Preferably, the stirring and mixing in step (3) is carried out at 25-40°C (e.g., 25°C, 26°C, 27°C, 28°C, 29°C, 30°C, 31°C, 32°C, 33°C or 40°C).
[0029] Preferably, the stirring and mixing in step (3) is carried out at a stirring rate of 100~300r / min (e.g., 100r / min, 120r / min, 140r / min, 160r / min, 180r / min, 200r / min, 220r / min, 240r / min, 260r / min or 300r / min, etc.).
[0030] Preferably, the mixing time in step (3) is 20 to 60 minutes (e.g., 20 minutes, 30 minutes, 40 minutes, 50 minutes or 60 minutes).
[0031] Preferably, the stirring and mixing in step (4) is carried out at 25-40°C (e.g., 25°C, 26°C, 27°C, 28°C, 29°C, 30°C, 31°C, 32°C, 33°C or 40°C).
[0032] Preferably, the stirring and mixing in step (4) is carried out at a stirring rate of 100~300r / min (e.g., 100r / min, 120r / min, 140r / min, 160r / min, 180r / min, 200r / min, 220r / min, 240r / min, 260r / min or 300r / min, etc.).
[0033] Preferably, the mixing time in step (4) is 20 to 60 minutes (e.g., 20 minutes, 30 minutes, 40 minutes, 50 minutes or 60 minutes).
[0034] Preferably, the stirring and mixing in step (5) is carried out at 25-40°C (e.g., 25°C, 26°C, 27°C, 28°C, 29°C, 30°C, 31°C, 32°C, 33°C or 40°C).
[0035] Preferably, the stirring and mixing in step (5) is carried out at a stirring rate of 100~300r / min (e.g., 100r / min, 120r / min, 140r / min, 160r / min, 180r / min, 200r / min, 220r / min, 240r / min, 260r / min or 300r / min, etc.).
[0036] Preferably, the mixing time in step (5) is 20 to 60 minutes (e.g., 20 minutes, 30 minutes, 40 minutes, 50 minutes or 60 minutes).
[0037] Preferably, the degassing in step (5) is performed under a vacuum of -0.08 to -0.1 MPa (e.g., -0.1 MPa, -0.095 MPa, -0.09 MPa, -0.085 MPa or -0.08 MPa, etc.) for 10 to 20 minutes (e.g., 10 minutes, 11 minutes, 12 minutes, 13 minutes, 14 minutes, 15 minutes, 16 minutes, 17 minutes, 18 minutes or 20 minutes, etc.).
[0038] On the other hand, the present invention provides an application of the thermosetting temporary bonding adhesive as described above in the temporary bonding process of wafer HBM processing.
[0039] Compared with the prior art, the present invention has the following beneficial effects: The thermosetting temporary bonding adhesive of the present invention solves the problem of difficult cleaning after the existing thermosetting temporary bonding adhesive process, and achieves a performance balance between the thermosetting system's "resistance to high temperature above 150°C" and "one-time immersion in cleaning agent without residue debonding", which is suitable for wafer HBM processing requirements.
[0040] The thermosetting temporary bonding adhesive of this invention exhibits significantly improved high-temperature stability, exhibiting no softening, bubbling, or delamination failures after high-temperature processes such as PECVD, providing crucial assurance for wafer processing stability. Debonding and cleaning are convenient and efficient, eliminating the need for repeated cleaning with large amounts of organic solvents; a small amount of solvent immersion is sufficient for rapid removal of the adhesive film, greatly simplifying subsequent processes, reducing solvent procurement and waste disposal costs, and benefiting environmental protection. It also avoids the adverse effects of solvent residue on wafer and device performance. Excellent adaptability and compatibility precisely match the temporary bonding process requirements of wafer HBM processing, meeting the stringent demands of high-precision semiconductor device processing for temporary bonding materials, thus helping to improve product yield and production efficiency. Strong process feasibility is demonstrated through a clear preparation method with easily controllable parameters, facilitating industrial mass production and possessing significant industrial application value. Detailed Implementation
[0041] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.
[0042] The following is some information about the raw materials used in the examples below: Vinyl raw rubber: Dow RBG0730, 3% vinyl content, Mw is 70w.
[0043] Hydrogen-containing silicone oil: Silicon Power MH100, hydrogen content 0.1%, Mw is 1000.
[0044] Antioxidant: 1076; Leveling agent: BYK323; Inhibitor: diallyl maleate; Catalyst: Castel catalyst.
[0045] The components and amounts (by weight) of the thermosetting temporary bonding adhesives provided in the examples and comparative examples are shown in Table 1.
[0046] Table 1 The preparation methods of Examples 1-5 and Comparative Examples 1-4 include the following steps: Step 1: Weigh the organic solvent and vinyl raw rubber according to the mass ratio, add the vinyl raw rubber to the organic solvent, and stir for 12 hours at 25°C and a stirring rate of 300 r / min until completely dissolved to obtain a premixed solution; Step 2: Add hydrogen-containing silicone oil to the premix and continue stirring at 25°C and 300 r / min for 40 min to obtain the mixture; Step 3: Add the inhibitor to the mixture and stir for 30 minutes at 25°C and 200 rpm to obtain the mixture. Step 4: Add antioxidant and leveling agent to the mixture, and stir for 30 minutes at 25℃ and 200r / min to obtain the mixture; Step 5: Add catalyst to the mixture and stir for 30 min at 25℃ and 200 r / min. Then degas for 10 min under a vacuum of -0.08 MPa to obtain temporary bonding adhesive.
[0047] The preparation method of Comparative Example 5 includes the following steps: Organic solvent, vinyl raw rubber, hydrogen-containing silicone oil, inhibitor, leveling agent, catalyst, and antioxidant are added to a container according to the mass ratio, and stirred for 12 hours at 25°C and 200 r / min to obtain a mixture.
[0048] The preparation method of Comparative Example 6 includes the following steps: Step 1: Weigh the organic solvent and vinyl raw rubber according to the mass ratio, add the vinyl raw rubber to the organic solvent, and stir for 12 hours at 25°C and a stirring rate of 300 r / min until completely dissolved to obtain a premixed solution; Step 2: Add hydrogen-containing silicone oil to the premix and continue stirring at 25°C and 300 r / min for 40 min to obtain the mixture; Step 3: Add inhibitor, leveling agent, catalyst and antioxidant to the mixture, and stir for 30 minutes at 25℃ and 200r / min to obtain the mixture.
[0049] The performance of the organosilicon temporary bonding materials provided in the examples and comparative examples was tested using the following methods: (1) Film surface condition: The temporary silicone bonding material was spin-coated with the same parameters (1000 rpm, 90 s) and cured. The film surface was observed to be free of defects, bubbles and dirt. (2) Bonding test: After spin coating and pre-curing of the temporary silicone bonding material, it is bonded to a glass sheet with a release layer. The bonded pair has no defects such as chipping or bubbles. (3) PECVD test: The bond pair is subjected to PECVD test. The bond pair has no defects such as edge chipping or bubbles. It is sent into a nitrogen oven to simulate a high-temperature process environment. Specific parameters: 25℃ to 250℃. (4) PI Cure test: The bond pair is subjected to PI Cure test. The bond pair has no defects such as chipping or bubbles.
[0050] (5) Cleaning test: After laser debonding, the adhesive film is immersed and cleaned using Huaxun's self-made cleaning agent (Remover3). The time for complete film removal is recorded. No adhesive film residue is required after cleaning.
[0051] The test results are shown in Table 2.
[0052] Table 2 The test result is qualified. "Unqualified" is " ".
[0053] As can be seen from the table above, when the molar ratio of vinyl to hydrogen is too low or too high, it will not only affect the performance of the film in the process, but also will not significantly help improve the cleaning rate. Moreover, when the amount of inhibitor is too small, the catalytic efficiency of the catalyst is weakly inhibited, causing some raw materials to react prematurely in the mixing stage, resulting in failure. Excessive inhibitor will greatly limit the reaction and cause process abnormalities.
[0054] The applicant declares that this invention illustrates the thermosetting temporary bonding adhesive, its preparation method, and its application through the above embodiments. However, this invention is not limited to the above embodiments, meaning that this invention does not necessarily rely on the above embodiments for implementation. Those skilled in the art should understand that any improvements to this invention, equivalent substitutions of raw materials, additions of auxiliary components, and selection of specific methods, etc., all fall within the protection and disclosure scope of this invention.
Claims
1. A thermosetting temporary bonding adhesive, characterized in that, The thermosetting temporary bonding adhesive comprises the following components by weight: 20-80 parts organic solvent, 5-35 parts vinyl raw rubber, 5-35 parts hydrogen-containing silicone oil, and 0.01-5 parts additives, wherein the additives include antioxidants, leveling agents, inhibitors, and catalysts, wherein the molar ratio of vinyl in the vinyl raw rubber to the molar ratio of hydrogen in the hydrogen-containing silicone oil is between 1.1 and 1.4, and the mass ratio of the inhibitor to the catalyst is (50-500):
1.
2. The thermosetting temporary bonding adhesive according to claim 1, characterized in that, The organic solvent is selected from one or a combination of at least two of toluene, xylene, trimethylbenzene, petroleum ether, n-hexane, cyclohexane, ethylcyclohexane, chloroform, or carbon tetrachloride.
3. The thermosetting temporary bonding adhesive according to claim 1 or 2, characterized in that, The vinyl content of the raw vinyl rubber is 0.1-5%, preferably 0.5%-4.5%; Preferably, the weight-average molecular weight of the vinyl rubber is 30,000 to 1,200,000, and more preferably 50,000 to 1,000,000.
4. The thermosetting temporary bonding adhesive according to any one of claims 1-3, characterized in that, The hydrogen-containing silicone oil has a hydrogen content of 0.001-3%, preferably 0.002-2.5%; Preferably, the weight-average molecular weight of the hydrogen-containing silicone oil is 1,000 to 500,000, more preferably 5,000 to 400,000.
5. The thermosetting temporary bonding adhesive according to any one of claims 1-4, characterized in that, The ratio of the molar amount of vinyl in vinyl raw rubber to the molar amount of hydrogen in hydrogen-containing silicone oil is 1.11-1.
35.
6. The thermosetting temporary bonding adhesive according to any one of claims 1-5, characterized in that, The antioxidant is selected from one or a combination of at least two of hindered phenolic antioxidants, hindered amine antioxidants, phosphite antioxidants or sulfur-containing antioxidants, preferably one or two of hindered phenolic antioxidants or hindered amine antioxidants, more preferably hindered phenolic antioxidants. Preferably, the leveling agent is selected from one or a combination of at least two of acrylic leveling agents, silicone leveling agents, and fluorocarbon leveling agents, and more preferably one or two of silicone leveling agents; Preferably, the inhibitor is selected from one or a combination of at least two of alkynol compounds, phosphorus / nitrogen-containing organic compounds, and cyclic siloxane compounds, with alkynol compounds being the most preferred. Preferably, the catalyst is selected from one or a combination of at least two of platinum-based catalysts and nickel-based catalysts, preferably a platinum-based catalyst, and more preferably a cassette catalyst; Preferably, the mass ratio of the inhibitor to the catalyst is (80-300):
1.
7. The method for preparing the thermosetting temporary bonding adhesive according to any one of claims 1-6, characterized in that, The preparation method includes the following steps: (1) Add the vinyl raw rubber to an organic solvent and stir until completely dissolved to obtain a premix; (2) Add hydrogen-containing silicone oil to the premixed liquid obtained in step (1), stir and mix to obtain a mixed liquid; (3) Add the inhibitor to the mixture obtained in step (2), stir and mix to obtain the mixture; (4) Add antioxidant and leveling agent to the mixture obtained in step (3), stir and mix to obtain a mixture; (5) Add the catalyst to the mixture obtained in step (4), stir and mix, and then degas to obtain the thermosetting temporary bonded adhesive.
8. The preparation method according to claim 7, characterized in that, The stirring in step (1) is carried out at 25~40℃; Preferably, the stirring rate in step (1) is 100~500 r / min; Preferably, the stirring time in step (1) is 12-48 hours; Preferably, the stirring and mixing in step (2) is carried out at 25~40°C; Preferably, the stirring and mixing in step (2) is carried out at a stirring rate of 100~500 r / min; Preferably, the mixing time in step (2) is 30~60 min.
9. The preparation method according to claim 7, characterized in that, The stirring and mixing in step (3) is carried out at 25-40℃; Preferably, the stirring and mixing in step (3) is carried out at a stirring rate of 100~300 r / min; Preferably, the mixing time in step (3) is 20~60 min; Preferably, the stirring and mixing in step (4) is carried out at 25-40°C; Preferably, the stirring and mixing in step (4) is carried out at a stirring rate of 100~300 r / min; Preferably, the mixing time in step (4) is 20~60 min; Preferably, the stirring and mixing in step (5) is carried out at 25-40°C; Preferably, the stirring and mixing in step (5) is carried out at a stirring rate of 100~300 r / min; Preferably, the mixing time in step (5) is 20~60 min; Preferably, the degassing in step (5) is performed under a vacuum of -0.08 to -0.1 MPa for 10 to 20 minutes.
10. The application of the thermosetting temporary bonding adhesive according to any one of claims 1-6 in the temporary bonding process of wafer HBM processing.