Three-coordinate automatic visual inspection device capable of measuring sizes of semiconductor materials in batches

Abstract

The invention relates to the technical field of measurement, and particularly discloses a three-coordinate automatic visual detection device capable of measuring the size of a semiconductor material in batches, which comprises a detection mechanism arranged at the top of a three-coordinate measuring machine and used for measuring the size of an annular semiconductor, and the detection mechanism comprises a positioning mechanism used for positioning the annular semiconductor. According to the invention, through cooperation of the auxiliary mechanism and the positioning mechanism, one side of the annular semiconductor is prevented from tilting in the process of centering and positioning the annular semiconductor, so that the annular semiconductor is prevented from deviating due to falling, the stability of centering and positioning of the annular semiconductor is prevented from being reduced, and the precision of subsequent visual detection is improved. Meanwhile, the air guide cover can be located in the groove in the top of the annular semiconductor to clean the groove in the top of the annular semiconductor, dust and other impurities accumulated in the groove in the top of the annular semiconductor are reduced, and therefore the subsequent influence on the visual detection precision is reduced.

Description

Technical Field

[0001] This invention relates to the field of measurement technology, specifically to a coordinate measuring machine (CMM) automated vision inspection device capable of batch measuring the dimensions of semiconductor materials. Background Technology

[0002] New materials refer to newly emerging or under-development materials with superior performance and special functions. Semiconductor materials (such as silicon and gallium arsenide) have conductivity between that of conductors and insulators, and their performance can be controlled through doping and processing, thus meeting the definition of new materials. In practical applications, semiconductor materials need to support workpieces of corresponding shapes according to specific conditions, such as ring-shaped semiconductor workpieces. After fabrication, their dimensions need to be monitored to determine if they meet usage requirements. The core principle of visual dimensional measurement is to allow the machine to "see" the object through a camera and then use algorithms to accurately calculate its dimensions, offering advantages such as non-contact and high efficiency.

[0003] The announcement number CN119438241B discloses a visual inspection device for motor coils, which aims to acquire images of different positions of a motor coil without using multiple cameras and image comparison devices to capture images of different positions of the motor coil, thus greatly reducing the cost of visual inspection of motor coils.

[0004] Based on existing technologies, the following problems exist: When measuring the dimensions of semiconductor ring materials, the three-coordinate automated vision inspection device needs to first place the semiconductor ring material on the inspection stage and center it so that the vision inspection device can take pictures to determine whether the semiconductor ring material has dimensional abnormalities. However, the semiconductor ring material is usually clamped from the outer periphery for centering. However, this process causes the semiconductor ring material to tilt to one side in the axial direction. After centering, the tilted part falls down, causing positioning deviation and affecting the stability of subsequent measurements. In addition, some semiconductor ring materials have grooves on the top, which can easily accumulate dust, thus affecting the accuracy of subsequent vision inspection. Referring to the above-mentioned application documents, it only clamps the ring material from the outer periphery for centering, which cannot avoid the tilting of the ring material in the axial direction, and has certain shortcomings. To solve the above problems, a three-coordinate automated vision inspection device for batch measurement of semiconductor material dimensions is proposed. Summary of the Invention

[0005] To achieve the above objectives, the present invention provides the following technical solution: a coordinate measuring machine (CMM) automated vision inspection device capable of batch measuring the dimensions of semiconductor materials, comprising a CMM and a vision inspection instrument, and further comprising an inspection mechanism disposed on the top of the CMM for measuring the dimensions of ring-shaped semiconductors, the inspection mechanism comprising: The mounting plate is fixedly mounted on the top of the coordinate measuring machine. The top of the mounting plate is fixedly equipped with an H-shaped placement plate for placing the ring semiconductor. The top of the coordinate measuring machine and the inner side of the placement plate are provided with a positioning mechanism for positioning the ring semiconductor. The frame is slidably disposed on the outside of the placement plate and has a U-shaped design. The first plate is flexibly disposed on the inside of the frame. The bottom of the first plate is rotatably disposed on the second plate. The bottom of the second plate is fixedly disposed on the third plate. The bottom of the third plate is provided with auxiliary mechanisms symmetrically arranged around the center point of the third plate. The auxiliary mechanisms cooperate with the positioning mechanism to position the ring semiconductor while limiting its tilting, and can clean the grooves on the surface of the ring semiconductor.

[0006] Furthermore, the auxiliary mechanism includes: A first connecting plate is provided with a spline shaft fixed at the bottom center of the first connecting plate, a first electromagnet is fixed at the bottom of the first connecting plate, and a second electromagnet is sleeved on the side wall of the spline shaft. Both the first electromagnet and the second electromagnet are ring-shaped and are sleeved on the side wall of the spline shaft. A telescopic sleeve is fixedly installed at the bottom of the first connecting plate and located outside the first electromagnet. A second connecting plate is fixedly installed at the bottom of the telescopic sleeve. A spline groove for fitting a spline shaft is opened at the top of the second connecting plate. A first spring is fitted on the side wall of the spline shaft between the second electromagnet and the second connecting plate.

[0007] Furthermore, the auxiliary mechanism also includes: The first connecting shell is fixedly disposed at the bottom of the second connecting plate, and the top is designed to be open. The bottom of the spline shaft extends along the spline groove into the first connecting shell. The second connecting shell is fixedly disposed at the bottom of the spline shaft and sleeved inside the first connecting shell. A connecting block is sleeved inside the second connecting shell. A connecting rod extending to the bottom of the second connecting shell is fixedly disposed at the bottom of the connecting block. The side wall diameter of the connecting rod is smaller than the side wall diameter of the connecting block to prevent the connecting block and the connecting rod from detaching from the second connecting shell.

[0008] Furthermore, the auxiliary mechanism also includes: A connecting ring is fixedly sleeved on the side wall of one end of the connecting rod located at the bottom of the second connecting shell, and is also sleeved on the inner side wall of the second connecting shell. A second spring is sleeved on the side wall of the connecting rod between the connecting ring and the second connecting shell. An air guide hood is fixedly installed at the bottom of the connecting rod, and air guide holes are arranged at intervals on the side wall and bottom of the air guide hood. An air guide pipe is fixedly installed at the bottom of the connecting rod, extending from the inside of the connecting rod and the connecting block to the outside of the first connecting shell. Connecting grooves for the air guide pipe to move are opened on the side walls of the first connecting shell and the second connecting shell.

[0009] Furthermore, the auxiliary mechanism also includes: A connection hole is provided at the bottom of the first connecting shell. The outer wall of the air guide cover fits against the inner wall of the connection hole. A sealing ring arranged at intervals is fixedly sleeved on the inner wall of the connection hole. The sealing cylinder is fixedly installed on the bottom inner wall of the first connecting shell and is fixedly connected to the bottom of the connecting ring. The inner wall of the sealing cylinder is sleeved on the outer wall of the air guide cover and fits against the outer wall of the air guide cover.

[0010] Furthermore, an electric push rod is fixedly installed on the top of the frame, and the telescopic shaft of the electric push rod extends to the inner side of the frame. A connecting cover is fixedly installed on the telescopic shaft of the electric push rod, and the bottom of the connecting cover is fixedly connected to the top of the first plate. An adjustment mechanism is provided inside the connecting cover for adjusting the two auxiliary mechanisms to move closer or further apart. The adjustment mechanism includes: The first servo motor is fixedly mounted on the top of the first plate and located inside the connecting cover; The first slide groove is opened at the bottom of the third plate and extends out of the third plate. The first slide groove contains a first slider arranged symmetrically with respect to the center point of the first slide groove. The bottom of the first slider is fixedly provided with a sliding seat, and the bottom of the sliding seat is fixedly connected to the top of the first connecting plate. The first threaded rod is rotatably mounted on the top inner wall of the first slide groove and has a bidirectional threaded design. The two ends of the side wall of the first threaded rod are respectively threaded to the two first sliders, and the middle end of the side wall of the first threaded rod is connected to the output shaft of the first servo motor through a bevel gear. The second slide is located at the bottom of the third plate and on both sides of the first slide. The second slide contains a second slider, which is fixedly connected to the top of the slide seat. The second slider is located on the side of the slide seat closer to the first servo motor.

[0011] Furthermore, the top of the first plate is provided with a rotation mechanism for driving the second plate to rotate, the rotation mechanism including: The second servo motor is fixedly mounted on the top of the first plate, and the output shaft of the second servo motor is fixedly equipped with a gear; An annular groove is formed at the bottom of the first plate, and an annular slider is placed inside the annular groove. The bottom of the annular slider is fixedly connected to the top of the second plate. The gear ring is fixedly mounted on the top of the second plate and meshes with the gear. The bottom of the first plate has a groove for providing operating space for the gear and the gear ring.

[0012] Furthermore, the positioning mechanism includes: The second threaded rod is rotatably located on the inner side of the placement plate and has a bidirectional threaded design. Both ends of the side wall of the second threaded rod are threadedly connected to positioning seats. Positioning rods are fixedly arranged symmetrically with the center point of the positioning seat on both sides of the top of the positioning seats. Rubber sleeves are fixedly fitted on the side walls of the positioning rods. The third servo motor is fixedly mounted on the top of the mounting plate and is fixedly connected to the second threaded rod via a coupling. Guide rails are fixedly mounted on the top of the mounting plate and on both sides of the second threaded rod to allow the positioning seat to slide and connect with the top of the mounting plate. Top plates are raised and lowered on the top of the mounting plate and on both sides of the placement plate, and the top plates are located between the two positioning rods.

[0013] Furthermore, the positioning mechanism also includes: The third electromagnet is fixedly installed on the upper side wall of the positioning rod. The side wall of the first plate is fixedly provided with a magnetic suction plate, which is made of magnetic metal material and has an arc-shaped design. The third slide is located on the outside of the placement plate. The third slide contains a third slider, which is fixedly connected to the inside of the frame to limit the movement of the frame.

[0014] Furthermore, the top of the coordinate measuring machine is fixedly provided with a first electric slide rail, the sliding end of the first electric slide rail is fixedly provided with a second electric slide rail, the sliding end of the second electric slide rail is fixedly provided with a third electric slide rail, and the bottom of the sliding end of the third electric slide rail is fixedly connected to a vision inspection instrument, so as to adjust the position of the vision inspection instrument by means of the first electric slide rail, the second electric slide rail and the third electric slide rail.

[0015] This invention provides a three-coordinate automated vision inspection device for batch measurement of semiconductor material dimensions. Compared with existing technologies, it has the following advantages: 1. This invention, through the cooperation of an auxiliary mechanism and a positioning mechanism, avoids one side of the ring semiconductor from tilting up during the centering and positioning process, thereby preventing the ring semiconductor from falling and shifting, thus avoiding a decrease in the stability of the ring semiconductor's centering and positioning, and improving the accuracy of subsequent visual inspection. Simultaneously, it allows the air guide shroud to be positioned within the groove on the top of the ring semiconductor, enabling the cleaning of the groove and reducing the accumulation of dust and other impurities, thereby minimizing the impact on the accuracy of subsequent visual inspection.

[0016] 2. The present invention uses a positioning mechanism to bring the positioning rods closer together to center the annular semiconductor, and at the same time moves the first plate to directly above the annular semiconductor, which facilitates subsequent positioning of the annular semiconductor from the top and facilitates cleaning of the top of the annular semiconductor. When the positioning rods move away from each other, the third electromagnet is energized, causing the first plate to move to one side of the placement plate, thereby moving the first plate away from the annular semiconductor and exposing the top of the annular semiconductor, which facilitates subsequent visual inspection and positioning.

[0017] 3. The present invention uses a first electromagnet and a second electromagnet to ensure the force of the first connecting shell in positioning the annular semiconductor, thereby adjusting the depth of the air guide shroud entering the groove at the top of the annular semiconductor, so as to facilitate cleaning of grooves at different depths at the top of the annular semiconductor. The outer wall of the air guide is sealed by a sealing ring and a sealing cylinder. This seals the portion of the air guide that does not enter the groove at the top of the annular semiconductor, according to the length of the air guide that extends out of the first connecting shell. This makes it suitable for grooves of different depths at the top of the annular semiconductor and prevents suction from leaking out along this portion of the air guide, thus avoiding a reduction in cleaning efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the left-side structure of the detection mechanism of the present invention; Figure 3 This is a schematic diagram of the right-side structure of the detection mechanism of the present invention; Figure 4 This is a schematic diagram of the longitudinal cross-sectional structure of the frame of the present invention; Figure 5 This is a schematic diagram of the positioning mechanism, the ring semiconductor, and the top plate structure of the present invention; Figure 6 This is a schematic diagram of the first plate, the second plate, the rotating mechanism, and the magnetic suction plate of the present invention; Figure 7 This is a schematic diagram of the longitudinal cross-sectional structure of the first plate body of the present invention; Figure 8 This is a schematic diagram of the longitudinal cross-sectional structure of the first plate and the second plate of the present invention; Figure 9 This is a schematic diagram of the adjustment mechanism structure of the present invention; Figure 10 This is a schematic diagram of the second slide, sliding seat, and auxiliary mechanism of the present invention; Figure 11 This is a schematic diagram of the second slider and sliding seat structure of the present invention; Figure 12 This is a schematic diagram of the auxiliary mechanism structure of the present invention; Figure 13 This is a schematic diagram of the longitudinal cross-sectional structure of the second connecting shell of the present invention; Figure 14This is a longitudinal sectional view of the second connecting shell, connecting ring, and sealing cylinder of the present invention. Figure 15 This is a schematic diagram of the overall structure of the present invention applied to automated detection.

[0019] The reference numerals in the above figures are as follows: 1. Coordinate measuring machine; 2. Inspection mechanism; 3. Ring semiconductor; 4. Tilting mechanism; 5. Robot guide rail; 6. Main control console; 7. Loading rack assembly; 8. Video center; 9. Robot; 10. Unloading rack assembly. 11. First electric slide rail; 12. Vision inspection instrument; 13. Third electric slide rail; 14. Second electric slide rail; 21. Mounting plate; 22. Placement plate; 23. Positioning mechanism; 24. Top plate; 25. Frame; 26. First plate; 27. Electric push rod; 28. Third slide rail; 29. ​​Magnetic suction plate; 291. Connecting cover; 292. Second plate; 293. Rotation mechanism; 294. Adjustment mechanism; 295. Third plate; 296. Auxiliary mechanism; 231. Third servo motor; 232. Second threaded rod; 233. Positioning seat; 234. Third electromagnet; 235. Positioning rod; 236. Rubber sleeve; 2931. Second servo motor; 2932. Annular groove; 2933. Gear ring; 2934. Gear; 2941, First servo motor; 2942, Sliding seat; 2943, First threaded rod; 2944, First slide groove; 2945, Second slide groove; 2946, Second slider; 2961. First connecting plate; 2962. Telescopic sleeve; 2963. Second connecting plate; 2964. First connecting shell; 2965. Splined shaft; 2966. Second connecting shell; 2967. Connecting through groove; 2968. Second electromagnet; 2969. First electromagnet; 29691. Connecting block; 29692. Connecting ring; 29693. Connecting rod; 29694. Air guide cover; 29695. Sealing ring; 29696. Connecting hole; 29697. Sealing cylinder; 29698. Air guide pipe. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Example 1, please refer to Figures 1-4 and Figure 9A coordinate measuring machine (CMM) automated vision inspection device capable of batch measuring the dimensions of semiconductor materials includes a CMM 1 and a vision inspection instrument 12, and further includes an inspection mechanism 2 disposed on top of the CMM 1 for measuring the dimensions of a ring-shaped semiconductor 3. The inspection mechanism 2 includes: Mounting plate 21 is fixedly mounted on the top of coordinate measuring machine 1. The top of mounting plate 21 is fixedly provided with a placement plate 22 with an H-shaped design for placing the ring semiconductor 3. The top of coordinate measuring machine 1 and inside the placement plate 22 are provided with a positioning mechanism 23 for positioning the ring semiconductor 3. The frame 25 is slidably disposed on the outside of the placement plate 22 and has a U-shaped design. The first plate 26 is provided on the inner side of the frame 25 in a lifting manner. The bottom of the first plate 26 is rotatably provided with a second plate 292. The bottom of the second plate 292 is fixedly provided with a third plate 295. The bottom of the third plate 295 is provided with an auxiliary mechanism 296 symmetrically arranged around the center point of the third plate 295. The auxiliary mechanism 296 cooperates with the positioning mechanism 23 to position the annular semiconductor 3 while restricting its tilting, and can clean the grooves on the surface of the annular semiconductor 3.

[0022] The top of the coordinate measuring machine 1 is fixedly provided with a first electric slide rail 11, the sliding end of the first electric slide rail 11 is fixedly provided with a second electric slide rail 14, the sliding end of the second electric slide rail 14 is fixedly provided with a third electric slide rail 13, and the bottom of the sliding end of the third electric slide rail 13 is fixedly connected to the vision inspection instrument 12 so as to adjust the position of the vision inspection instrument 12 by means of the first electric slide rail 11, the second electric slide rail 14 and the third electric slide rail 13.

[0023] In implementation of this invention, an external mechanical gripper places the annular semiconductor 3, whose dimensions need to be measured, on the top of the placement plate 22. After placement, the external mechanical arm resets, and then the third servo motor 231 is activated. The third servo motor 231 drives the second threaded rod 232 to rotate, thereby causing the positioning seats 233 on both sides of the inner side of the placement plate 22 to move closer together, so as to move the positioning rods 235 on the top of the positioning seats 233 closer together. During this process, the third electromagnet 234 on the top of the positioning rod 235 contacts and abuts against the magnetic plate 29, thereby driving the first plate 26 to move as the positioning rods 235 move closer together. When the rubber sleeve 236 at the bottom of the positioning rod 235 contacts the outer wall of the annular semiconductor 3... When the first plate 26 moves to the top of the annular semiconductor 3, the electric push rod 27 drives the first plate 26 and others to move downward, thereby causing the first connecting shell 2964 and others to move downward and fit tightly against the top of the annular semiconductor 3, thus positioning it from the top. In cooperation with the positioning rod 235, this prevents one side of the annular semiconductor 3 from tilting up during the clamping and limiting process when centering the annular semiconductor 3. As a result, during the resetting process of the positioning rod 235, the tilted part of the annular semiconductor 3 falls down, which may cause displacement and affect the accuracy of the centering positioning. This avoids affecting the accuracy of the subsequent visual inspection of the annular semiconductor 3 by the visual inspection instrument 12.

[0024] During the positioning of the annular semiconductor 3, the positioning rod 235 and the first connecting shell 2964 are always pressed against the outer wall and top of the annular semiconductor 3. When it is necessary to clean the groove at the top of the annular plate, the bottom of the first connecting shell 2964 is positioned at the top of the groove. At the same time that the first connecting shell 2964 is pressed against the annular semiconductor 3, the air guide hood 29694 enters the groove at the top of the annular semiconductor 3 along the connecting hole 29696. After being connected to an external air pump through the air guide pipe 29698, suction is generated and transmitted along the air guide pipe 29698 and the air guide hood 29694 to the groove at the top of the annular semiconductor 3 to remove dust and other particles from the groove, thus preventing dust accumulation from affecting the accuracy of visual inspection.

[0025] After cleaning, the third electromagnet 234 is energized to generate magnetic force, which is then magnetically connected to the magnetic plate 29. When the positioning rods 235 move away from each other and reset, the first plate 26 and the positioning seat 233 on one side of the placement plate 22 are moved, thus exposing the top of the annular semiconductor 3. This allows the visual inspection instrument 12 to measure the size of the annular semiconductor 3. Under the action of the first electric slide rail 11, the second electric slide rail 14 and the third electric slide rail 13, the visual inspection instrument 12 can move in the X, Y and Z coordinates, i.e., the three-dimensional coordinates, to adjust the position of the visual inspection instrument 12 for actual inspection.

[0026] The visual inspection instrument 12 is a visual probe to collect surface information of the ring semiconductor 3. This is existing technology and will not be described in detail here.

[0027] Please see Figures 12-14 The auxiliary mechanism 296 includes: A first connecting plate 2961 is provided with a spline shaft 2965 fixed at the bottom center of the first connecting plate 2961. A first electromagnet 2969 is fixed at the bottom of the first connecting plate 2961. A second electromagnet 2968 is sleeved on the side wall of the spline shaft 2965. Both the first electromagnet 2969 and the second electromagnet 2968 are designed in a ring shape and are both sleeved on the side wall of the spline shaft 2965. Telescopic sleeve 2962 is fixedly disposed at the bottom of the first connecting plate 2961 and located outside the first electromagnet 2969. The bottom of the telescopic sleeve 2962 is fixedly disposed with a second connecting plate 2963. The top of the second connecting plate 2963 is provided with a spline groove for fitting a spline shaft 2965. A first spring is fitted on the side wall of the spline shaft 2965 and located between the second electromagnet 2968 and the second connecting plate 2963.

[0028] The auxiliary mechanism 296 further includes: The first connecting shell 2964 is fixedly disposed at the bottom of the second connecting plate 2963, and the top is designed to be open. The bottom of the spline shaft 2965 extends along the spline groove into the first connecting shell 2964. The second connecting shell 2966 is fixedly disposed at the bottom of the spline shaft 2965 and sleeved inside the first connecting shell 2964. A connecting block 29691 is sleeved inside the second connecting shell 2966. A connecting rod 29693 extending to the bottom of the second connecting shell 2966 is fixedly disposed at the bottom of the connecting block 29691. The side wall diameter of the connecting rod 29693 is smaller than the side wall diameter of the connecting block 29691 to prevent the connecting block 29691 and the connecting rod 29693 from disengaging from the second connecting shell 2966.

[0029] The auxiliary mechanism 296 further includes: A connecting ring 29692 is fixedly sleeved on one end of the connecting rod 29693 located at the bottom of the second connecting shell 2966, and is sleeved on the inner side wall of the second connecting shell 2966. A second spring is sleeved on the side wall of the connecting rod 29693 between the connecting ring 29692 and the second connecting shell 2966. An air guide cover 29694 is fixedly installed at the bottom of the connecting rod 29693. The side wall and bottom of the air guide cover 29694 are provided with spaced air guide holes. The bottom of the connecting rod 29693 is fixedly provided with an air guide pipe 29698 that extends from the inside of the connecting rod 29693 and the connecting block 29691 to the outside of the first connecting shell 2964. The side walls of the first connecting shell 2964 and the second connecting shell 2966 are provided with connecting grooves 2967 for the air guide pipe 29698 to move.

[0030] The auxiliary mechanism 296 further includes: A connecting hole 29696 is opened at the bottom of the first connecting shell 2964. The outer wall of the air guide cover 29694 fits against the inner wall of the connecting hole 29696. A sealing ring 29695 arranged at intervals is fixedly sleeved on the inner wall of the connecting hole 29696. The sealing cylinder 29697 is fixedly disposed on the bottom inner wall of the first connecting shell 2964 and is fixedly connected to the bottom of the connecting ring 29692. The inner wall of the sealing cylinder 29697 is sleeved on the outer wall of the air guide cover 29694 and fits against the outer wall of the air guide cover 29694.

[0031] In specific implementation, when the positioning rod 235 centers the annular semiconductor 3 from its outer wall, the first plate 26 and frame 25 move to directly above the annular semiconductor 3. Then, the electric push rod 27 drives the first plate 26 downwards, which in turn drives the first connecting plate 2961 and others downwards. During this process, the bottom of the first connecting shell 2964 contacts and abuts against the top of the annular semiconductor 3. When the top of the annular semiconductor 3 has a groove, the bottom of the first connecting shell 2964 is positioned at the top of the groove on the top of the annular semiconductor 3. That is, during the process of the bottom of the first connecting shell 2964 abutting against the annular semiconductor 3, the air guide cover... 29694 enters the groove at the top of the annular semiconductor 3. As the first connecting shell 2964 moves downward, the bottom of the air guide 29694 continuously enters the groove at the top of the annular semiconductor 3. That is, the first connecting shell 2964 positions the annular semiconductor 3 from the top to prevent one side of the annular semiconductor 3 from tilting up during the centering positioning process of the positioning rod 235. This also prevents the annular semiconductor 3 from falling and shifting when the positioning rod 235 moves away from the annular semiconductor 3, thus avoiding a decrease in the stability of the centering positioning of the annular semiconductor 3 and improving the accuracy of subsequent visual inspection. Furthermore, the air guide shroud 29694 is located in the groove at the top of the annular semiconductor 3. Thus, after the air pump is connected to the air guide pipe 29698, the suction force is transmitted to the groove at the top of the annular semiconductor 3 through the air guide pipe 29698, the air guide shroud 29694 and the air guide holes opened on the side wall of the air guide shroud 29694, so as to clean the groove at the top of the annular semiconductor 3, reduce the accumulation of dust and other impurities in the groove at the top of the annular semiconductor 3, and thus reduce the impact on the accuracy of subsequent visual inspection.

[0032] When the bottom of the first connecting shell 2964 contacts and abuts against the top of the annular semiconductor 3, the first connecting shell 2964 is pressed upward by the annular semiconductor 3. This causes the first connecting shell 2964 to drive the second connecting plate 2963 to press the first spring and the telescopic sleeve 2962 upward. During this process, a repulsive force is generated on the side where the first electromagnet 2969 and the second electromagnet 2968 are close to each other, thereby limiting the resistance to the upward movement of the first connecting shell 2964, ensuring the positioning force of the annular semiconductor 3. Furthermore, since the air guide cover 29694 is fitted into the connecting hole 29... Within 696, and located in the groove at the top of the annular semiconductor 3, as the first connecting shell 2964 moves upward, the air guide 29694 extends out of the connecting hole 29696 and enters the groove at the top of the annular semiconductor 3. After connecting an air pump to the air guide pipe 29698, the groove at the top of the annular semiconductor 3 is cleaned. Since the depth of the groove at the top of the annular semiconductor 3 varies, the upward movement distance of the first connecting shell 2964 is adjusted, and the first electromagnet 2969 and the second electromagnet 2968 ensure that the first connecting shell 2964 is in contact with the annular semiconductor 3. The positioning force allows for adjustment of the depth to which the air guide 29694 enters the groove at the top of the annular semiconductor 3, facilitating the cleaning of grooves at different depths on the top of the annular semiconductor 3. The second spring and connecting ring 29692 provide elastic support for the air guide 29694, ensuring its bottom fits elastically against the inner wall of the groove at the top of the annular semiconductor 3, preventing violent collisions and allowing the bottom of the air guide 29694 to penetrate deeply into the groove at the top of the annular semiconductor 3 for cleaning. At the same time, the outer wall of the air guide cover 29694 is sealed to the inner wall of the connecting hole 29696 by the sealing ring 29695, and the upper end of the outer wall of the air guide cover 29694 is sealed by the sealing cylinder 29697. Thus, according to the length of the air guide cover 29694 extending out of the first connecting shell 2964, the part of the air guide cover 29694 that does not enter the groove at the top of the annular semiconductor 3 is sealed, so as to be applicable to grooves of different depths at the top of the annular semiconductor 3, and to prevent the suction from leaking out along this part of the air guide cover 29694, thus avoiding a reduction in the cleaning effect.

[0033] During the cleaning process, the position of the auxiliary mechanism 296 can be adjusted by the rotating mechanism 293, facilitating the cleaning of the entire groove on the top of the annular semiconductor 3 while avoiding interference with the connections and wiring of the air ducts 296 and 298. The auxiliary mechanism 296 can be rotated back and forth for practical use. In conjunction with the electric push rod 27, the auxiliary mechanism 296 is moved upwards to outside the groove on the top of the annular semiconductor 3. After adjusting its position by the adjusting mechanism 294, it is then moved downwards to another groove, thus cleaning multiple grooves on the top of the annular semiconductor 3. Throughout the cleaning process, the positioning rod 235 continuously positions the annular semiconductor 3 to ensure stability.

[0034] When the top of the annular semiconductor 3 is horizontal and has no groove, during the process of the first connecting shell 2964 pressing against the top of the annular semiconductor 3, the first electromagnet 2969 and the second electromagnet 2968 control the force of the first connecting shell 2964 pressing the annular semiconductor 3 so that the air guide cover 29694 is located in the connecting hole 29696, thereby enabling the top of the annular semiconductor 3 to be cleaned without affecting its positioning from the top of the annular semiconductor 3. Furthermore, following the above steps, different positions of the annular semiconductor 3 can be cleaned.

[0035] Please see Figure 4 , Figure 6 and Figures 8-11 An electric push rod 27 is fixedly installed on the top of the frame 25. The telescopic shaft of the electric push rod 27 extends to the inner side of the frame 25. A connecting cover 291 is fixedly installed on the telescopic shaft of the electric push rod 27. The bottom of the connecting cover 291 is fixedly connected to the top of the first plate 26. An adjustment mechanism 294 is provided inside the connecting cover 291 for adjusting the two auxiliary mechanisms 296 to move closer or further apart. The adjustment mechanism 294 includes: The first servo motor 2941 is fixedly mounted on the top of the first plate 26 and located inside the connecting cover 291; The first slide groove 2944 is opened at the bottom of the third plate 295 and extends to the outside of the third plate 295. The first slide groove 2944 has a first slider arranged symmetrically with respect to the center point of the first slide groove 2944. The bottom of the first slider is fixedly provided with a sliding seat 2942, and the bottom of the sliding seat 2942 is fixedly connected to the top of the first connecting plate 2961. The first threaded rod 2943 is rotatably mounted on the top inner wall of the first slide groove 2944 and has a bidirectional threaded rod design. The two ends of the side wall of the first threaded rod 2943 are respectively threaded to the two first sliders. The middle end of the side wall of the first threaded rod 2943 is connected to the output shaft of the first servo motor 2941 through the bevel gear 2934. The second slide groove 2945 is opened at the bottom of the third plate 295 and is located on both sides of the first slide groove 2944. The second slide groove 2945 is filled with a second slider 2946. The second slider 2946 is fixedly connected to the top of the sliding seat 2942. The second slider 2946 is located on the side of the sliding seat 2942 near the first servo motor 2941.

[0036] In specific implementation, the first servo motor 2941 drives the first threaded rod 2943 to rotate, thereby causing the sliding seat 2942 to move closer or further away from each other along the first slide groove 2944, thereby causing the two auxiliary mechanisms 296 to move closer or further away from each other to adjust the position of the auxiliary mechanisms 296. By extending the first slide groove 2944 to outside the third plate 295, the adjustment range of the auxiliary mechanism 296 is increased, avoiding the first connecting shell 2964 from being unable to move to the top edge of the annular semiconductor 3 due to the size of the sliding seat 2942 itself. Furthermore, the second slide groove 2945 limits the sliding seat 2942, improving the stability of the movement of the sliding seat 2942 and the auxiliary mechanism 296.

[0037] Please see Figure 7 The top of the first plate 26 is provided with a rotation mechanism 293 for driving the second plate 292 to rotate. The rotation mechanism 293 includes: The second servo motor 2931 is fixedly mounted on the top of the first plate 26, and the output shaft of the second servo motor 2931 is fixedly equipped with a gear 2934. An annular groove 2932 is formed at the bottom of the first plate 26. An annular slider is placed inside the annular groove 2932. The bottom of the annular slider is fixedly connected to the top of the second plate 292. The gear ring 2933 is fixedly mounted on the top of the second plate 292 and meshes with the gear 2934. The bottom of the first plate 26 has a groove for providing operating space for the gear 2934 and the gear ring 2933.

[0038] In specific implementation, the second servo motor 2931 drives the gear 2934 and the gear ring 2933 to rotate, thereby driving the second plate 292 to rotate under the limit of the annular slide groove 2932 and the annular slider, thereby driving the auxiliary mechanism 296 to rotate, which cooperates with the adjustment mechanism 294 to clean the top of the annular semiconductor 3, and facilitates the movement of the first connecting shell 2964 to the top of the groove on the top of the annular semiconductor 3.

[0039] Example 2, please refer to Figures 3-5 The technical difference between this embodiment and Embodiment 1 is that the positioning mechanism 23 includes: The second threaded rod 232 is rotatably located on the inner side of the placement plate 22 and is designed as a bidirectional threaded rod. Both ends of the side wall of the second threaded rod are threadedly connected to the positioning seat 233. The top two sides of the positioning seat 233 are fixedly provided with positioning rods 235 arranged symmetrically with the center point of the positioning seat 233. The side walls of the positioning rods 235 are fixedly fitted with rubber sleeves 236. The third servo motor 231 is fixedly mounted on the top of the mounting plate 21 and is fixedly connected to the second threaded rod 232 via a coupling. Guide rails are fixedly mounted on the top of the mounting plate 21 and on both sides of the second threaded rod 232 so that the positioning seat 233 is slidably connected to the top of the mounting plate 21. Top plates 24 are raised and lowered on the top of the mounting plate 21 and on both sides of the placement plate 22, and the top plates 24 are located between the two positioning rods 235.

[0040] The positioning mechanism 23 also includes: The third electromagnet 234 is fixedly mounted on the upper side wall of the positioning rod 235. The side wall of the first plate 26 is fixedly provided with a magnetic suction plate 29, which is made of magnetic metal material and has an arc-shaped design. The third slide 28 is opened on the outside of the placement plate 22. The third slide 28 is filled with a third slider. The third slider is fixedly connected to the inside of the frame 25 to limit the movement of the frame 25.

[0041] In specific implementation, the third servo motor 231 drives the second threaded rod 232 to rotate, thereby causing the positioning seats 233 to move closer or further apart under the limit of the guide rail. This causes the positioning rods 235 on both sides of the placement plate 22 to move closer or further apart. When they move closer, the annular semiconductor 3 is centered and simultaneously pressed against and drives the first plate 26 to move. This allows the first plate 26 to move directly above the annular semiconductor 3 while centering it, facilitating subsequent positioning from the top of the annular semiconductor 3 and making it easier to clean the top of the annular semiconductor 3. When the positioning rods 235 move further apart, the positioning of the annular semiconductor 3 is complete. The third electromagnet 234 is energized to magnetically attract the magnetic plate 29, causing the first plate 26 to move to one side of the placement plate 22. This moves the first plate 26 away from the annular semiconductor 3, exposing the top of the annular semiconductor 3 for subsequent visual inspection and for easy positioning in the next use.

[0042] Please see Figure 15 In practical applications of this invention for the dimensional inspection of toroidal semiconductor materials, to adapt to automated production lines and improve the efficiency of dimensional inspection, the following automated production process can be adopted to automate and batch inspect the toroidal semiconductor materials. Specifically: After manual scanning, the corresponding ring-shaped semiconductor product is placed on the loading rack group 7. Robot 9 moves to the loading rack group 7 via robot guide rail 5 and uses its gripper to place the ring-shaped semiconductor product onto the lifting mechanism of vision center 8. Vision center 8 then determines if the product matches the code. If not, robot 9 moves it via robot guide rail 5 and places it in unloading rack group 10. If they match, the position information of the product's feature holes is further measured. After vision center 8 completes the measurement, flipping mechanism 4 attaches the product to the detection mechanism 2 on coordinate measuring machine 1. Detection mechanism 2 measures the product to determine if the dimensions are acceptable. After a signal is given, robot 9 clamps the product into the corresponding unloading rack group 10. The loading rack group 7, unloading rack group 10, coordinate measuring machine 1, detection mechanism 2, flipping mechanism 4, main control panel 6, robot guide rail 5, robot 9, and vision center 8 are referenced. Figure 15 The layout and quantity of the components are designed, and those skilled in the art can design them according to actual application scenarios. No limitation is made here. Ring semiconductor products include, but are not limited to, the ring semiconductors in this application. Only the shape of the semiconductor material is limited. This application aims to test ring semiconductor products.

[0043] The flipping mechanism 4 mainly consists of a flipping gripper and three motion axes. It is used to transfer the ring-shaped semiconductor product from the vision center 8 to the coordinate measuring machine 1 (CMM) and to flip the ring-shaped semiconductor product when it needs to be flipped for measurement. The flipping mechanism works as follows: after the vision center 8 completes its judgment, the flipping mechanism 4 receives the product diameter information transmitted from the vision center 8, grips the product with the flipping gripper, and transfers it to the detection mechanism 2 of the CMM 1. If the ring-shaped semiconductor product needs to be flipped for measurement, the flipping mechanism 4 will flip the product, reposition it to the vision center 8 for judgment, and then clamp the flipped product back into the detection mechanism 2 of the CMM 1 for continued measurement.

[0044] Robot 9 can move on the sliding end of robot guide rail 5 to transfer ring-shaped semiconductor products from loading rack group 7 to vision center 8. At vision center 8, the coding of the ring-shaped semiconductor products is verified, and if a coding mismatch is found, the mismatched ring-shaped semiconductor products are transferred to unloading rack group 10. The robot can consist of a multi-axis robotic arm and a mechanical gripper.

[0045] The vision center 8 is used to identify the code of the ring semiconductor product to determine the standard size of the ring semiconductor product. During the inspection process, it is compared with the size information of the ring semiconductor product collected by the coordinate measuring machine 1 to determine whether the size of the ring semiconductor product meets the standard.

[0046] The loading rack group 7 is used to place untested ring-shaped semiconductor products, and the unloading rack group 10 is used to place ring-shaped semiconductor products that have been tested and ring-shaped semiconductor products with mismatched codes. Two unloading rack groups 10 can be set up.

[0047] The main control console 6 is used to control the electronic components such as the robot 9, robot guide rail 5, flipping mechanism 4, vision center 8, coordinate measuring machine 1, and detection mechanism 2, so as to facilitate actual control and use.

[0048] The main control console 6, the loading rack group 7, the unloading rack group 10, the robot 9, the robot guide rail 5, the flipping mechanism 4, and the vision center 8 are all existing technologies. Their specific composition, structure, and size can be designed according to actual conditions in this field, and will not be elaborated here.

[0049] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0050] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0051] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A coordinate measuring machine (CMM) automated vision inspection device for batch measurement of semiconductor material dimensions, comprising a CMM and a vision inspection instrument, characterized in that, It also includes a detection mechanism mounted on top of the coordinate measuring machine for measuring the dimensions of the ring semiconductor. The detection mechanism includes: The mounting plate is fixedly mounted on the top of the coordinate measuring machine. The top of the mounting plate is fixedly equipped with an H-shaped placement plate for placing the ring semiconductor. The top of the coordinate measuring machine and the inner side of the placement plate are provided with a positioning mechanism for positioning the ring semiconductor. The frame is slidably disposed on the outside of the placement plate and has a U-shaped design. The first plate is flexibly disposed on the inside of the frame. The bottom of the first plate is rotatably disposed on the second plate. The bottom of the second plate is fixedly disposed on the third plate. The bottom of the third plate is provided with auxiliary mechanisms symmetrically arranged around the center point of the third plate. The auxiliary mechanisms cooperate with the positioning mechanism to position the ring semiconductor while limiting its tilting, and can clean the grooves on the surface of the ring semiconductor.

2. The three-coordinate automated vision inspection device for batch measurement of semiconductor material dimensions according to claim 1, characterized in that, The auxiliary mechanism includes: A first connecting plate is provided with a spline shaft fixed at the bottom center of the first connecting plate, a first electromagnet is fixed at the bottom of the first connecting plate, and a second electromagnet is sleeved on the side wall of the spline shaft. Both the first electromagnet and the second electromagnet are ring-shaped and are sleeved on the side wall of the spline shaft. A telescopic sleeve is fixedly installed at the bottom of the first connecting plate and located outside the first electromagnet. A second connecting plate is fixedly installed at the bottom of the telescopic sleeve. A spline groove for fitting a spline shaft is opened at the top of the second connecting plate. A first spring is fitted on the side wall of the spline shaft between the second electromagnet and the second connecting plate.

3. The three-coordinate automated vision inspection device for batch measurement of semiconductor material dimensions according to claim 2, characterized in that, The auxiliary mechanism also includes: The first connecting shell is fixedly disposed at the bottom of the second connecting plate, and the top is designed to be open. The bottom of the spline shaft extends along the spline groove into the first connecting shell. The second connecting shell is fixedly disposed at the bottom of the spline shaft and sleeved inside the first connecting shell. A connecting block is sleeved inside the second connecting shell. A connecting rod extending to the bottom of the second connecting shell is fixedly disposed at the bottom of the connecting block. The side wall diameter of the connecting rod is smaller than the side wall diameter of the connecting block to prevent the connecting block and the connecting rod from detaching from the second connecting shell.

4. The three-coordinate automated vision inspection device for batch measurement of semiconductor material dimensions according to claim 3, characterized in that, The auxiliary mechanism also includes: A connecting ring is fixedly sleeved on the side wall of one end of the connecting rod located at the bottom of the second connecting shell, and is also sleeved on the inner side wall of the second connecting shell. A second spring is sleeved on the side wall of the connecting rod between the connecting ring and the second connecting shell. An air guide hood is fixedly installed at the bottom of the connecting rod, and air guide holes are arranged at intervals on the side wall and bottom of the air guide hood. An air guide pipe is fixedly installed at the bottom of the connecting rod, extending from the inside of the connecting rod and the connecting block to the outside of the first connecting shell. Connecting grooves for the air guide pipe to move are opened on the side walls of the first connecting shell and the second connecting shell.

5. The three-coordinate automated vision inspection device for batch measurement of semiconductor material dimensions according to claim 4, characterized in that, The auxiliary mechanism also includes: A connection hole is provided at the bottom of the first connecting shell. The outer wall of the air guide cover fits against the inner wall of the connection hole. A sealing ring arranged at intervals is fixedly sleeved on the inner wall of the connection hole. The sealing cylinder is fixedly installed on the bottom inner wall of the first connecting shell and is fixedly connected to the bottom of the connecting ring. The inner wall of the sealing cylinder is sleeved on the outer wall of the air guide cover and fits against the outer wall of the air guide cover.

6. The three-coordinate automated vision inspection device for batch measurement of semiconductor material dimensions according to claim 2, characterized in that, An electric push rod is fixedly installed on the top of the frame. The telescopic shaft of the electric push rod extends to the inside of the frame. A connecting cover is fixedly installed on the telescopic shaft of the electric push rod. The bottom of the connecting cover is fixedly connected to the top of the first plate. An adjustment mechanism is provided inside the connecting cover for adjusting the two auxiliary mechanisms to move closer or further apart. The adjustment mechanism includes: The first servo motor is fixedly mounted on the top of the first plate and located inside the connecting cover; The first slide groove is opened at the bottom of the third plate and extends out of the third plate. The first slide groove contains a first slider arranged symmetrically with respect to the center point of the first slide groove. The bottom of the first slider is fixedly provided with a sliding seat, and the bottom of the sliding seat is fixedly connected to the top of the first connecting plate. The first threaded rod is rotatably mounted on the top inner wall of the first slide groove and has a bidirectional threaded design. The two ends of the side wall of the first threaded rod are respectively threaded to the two first sliders, and the middle end of the side wall of the first threaded rod is connected to the output shaft of the first servo motor through a bevel gear. The second slide is located at the bottom of the third plate and on both sides of the first slide. The second slide contains a second slider, which is fixedly connected to the top of the slide seat. The second slider is located on the side of the slide seat closer to the first servo motor.

7. The three-coordinate automated vision inspection device for batch measurement of semiconductor material dimensions according to claim 1, characterized in that, The top of the first plate is provided with a rotation mechanism for driving the second plate to rotate. The rotation mechanism includes: The second servo motor is fixedly mounted on the top of the first plate, and the output shaft of the second servo motor is fixedly equipped with a gear; An annular groove is formed at the bottom of the first plate, and an annular slider is placed inside the annular groove. The bottom of the annular slider is fixedly connected to the top of the second plate. The gear ring is fixedly mounted on the top of the second plate and meshes with the gear. The bottom of the first plate has a groove for providing operating space for the gear and the gear ring.

8. The three-coordinate automated vision inspection device for batch measurement of semiconductor material dimensions according to claim 1, characterized in that, The positioning mechanism includes: The second threaded rod is rotatably located on the inner side of the placement plate and has a bidirectional threaded design. Both ends of the side wall of the second threaded rod are threadedly connected to positioning seats. Positioning rods are fixedly arranged symmetrically with the center point of the positioning seat on both sides of the top of the positioning seats. Rubber sleeves are fixedly fitted on the side walls of the positioning rods. The third servo motor is fixedly mounted on the top of the mounting plate and is fixedly connected to the second threaded rod via a coupling. Guide rails are fixedly mounted on the top of the mounting plate and on both sides of the second threaded rod to allow the positioning seat to slide and connect with the top of the mounting plate. Top plates are raised and lowered on the top of the mounting plate and on both sides of the placement plate, and the top plates are located between the two positioning rods.

9. The three-coordinate automated vision inspection device for batch measurement of semiconductor material dimensions according to claim 8, characterized in that, The positioning mechanism also includes: The third electromagnet is fixedly installed on the upper side wall of the positioning rod. The side wall of the first plate is fixedly provided with a magnetic suction plate, which is made of magnetic metal material and has an arc-shaped design. The third slide is located on the outside of the placement plate. The third slide contains a third slider, which is fixedly connected to the inside of the frame to limit the movement of the frame.

10. The three-coordinate automated vision inspection device for batch measurement of semiconductor material dimensions according to claim 1, characterized in that, The top of the coordinate measuring machine is fixedly equipped with a first electric slide rail, the sliding end of the first electric slide rail is fixedly equipped with a second electric slide rail, the sliding end of the second electric slide rail is fixedly equipped with a third electric slide rail, and the bottom of the sliding end of the third electric slide rail is fixedly connected to a vision inspection instrument so as to adjust the position of the vision inspection instrument by means of the first electric slide rail, the second electric slide rail and the third electric slide rail.

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