Detection method and detection system for gluing amount in material compounding process

Abstract

The invention belongs to the technical field of sizing amount detection, and particularly relates to a method for detecting the sizing amount in the material compounding process, which comprises the following steps: S1, taking glue formed by completely mixing a main agent and a curing agent, and measuring the weight M1 of the glue; s2, carrying out aging treatment on the glue in the S1, and measuring the weight M2 and the density rho of the glue after aging treatment; s3, calculating the solid content N of the glue under the aging condition in S2, wherein N is equal to 1; s4, performing aging treatment on the to-be-compounded material under the same aging condition as that in the S2, quickly curing the adhesive layer, observing the section of a slice, and measuring to obtain the thickness d of the adhesive layer; s5, the glue layer volume V in the unit area is calculated, V = S * d, the glue weight M3 in the unit area after aging is calculated, M3 = V * rho = S * d * rho, and the glue weight M4 in the unit area before aging is calculated, and M4 = S * d * rho; wherein the glue weight M4 is the gluing amount in the material compounding process.

Description

Technical Field

[0001] This invention belongs to the field of adhesive application amount detection technology, specifically relating to a method and system for detecting adhesive application amount during material lamination. Background Technology

[0002] With the rapid development of the materials processing industry in recent years, the industry has also put forward more stringent requirements for the material production and manufacturing process. At present, the industry relies too much on online detection instruments to control the amount of adhesive applied to the composite material during the production process, and calculates the amount of adhesive applied after the production is completed by using the total amount of adhesive used. A mature and reliable detection method for detecting the amount of adhesive applied during the production process has not been formed.

[0003] Therefore, how to quickly detect the amount of adhesive applied during the production process is a technical problem that urgently needs to be solved in this field.

[0004] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Summary of the Invention

[0005] This disclosure provides at least one method and system for detecting the amount of adhesive applied during the material lamination process.

[0006] In a first aspect, embodiments of this disclosure provide a method for detecting the amount of adhesive applied during material lamination, comprising the following steps: S1, taking a completely mixed adhesive of main agent and curing agent and measuring its weight M1; S2, subjecting the adhesive in S1 to aging treatment and measuring the weight M2 and density ρ of the adhesive after aging treatment; S3, calculating the solid content N of the adhesive under the aging conditions in S2, where N = S4, aging the composite material under the same conditions as S2, rapidly curing the adhesive layer, and observing the cross-section to measure the thickness d of the adhesive layer; S5, calculating the adhesive layer volume V per unit area, where V = S * d; calculating the adhesive weight M3 per unit area after aging, where M3 = V * ρ = S * d * ρ; calculating the adhesive weight M4 per unit area before aging, where M4 = ... Wherein, the adhesive weight M4 is the amount of adhesive applied during the material compounding process.

[0007] In one optional implementation, the aging treatment conditions in S2 include: a temperature range of 100–150°C and a time range of 30–120 min.

[0008] In one optional embodiment, the composite material to be used in S4 includes a thin film material with a thickness of no more than 200 μm and a metallic material with a thickness of no more than 100 μm.

[0009] In one optional embodiment, the method for detecting the thickness d of the adhesive layer in S4 includes: observing the thickness under a microscope after slicing.

[0010] Secondly, embodiments of this disclosure also provide a detection system for the amount of adhesive applied during material compounding, comprising: a measurement unit including a weighing sensor to collect weights M1 and M2, a densitometer to collect density ρ, and a microscope to collect thickness d; an aging unit including an oven for aging treatment; and a control module electrically connected to the measurement unit and the aging unit, and performing detection as described in any one of claims 1-4 to calculate the adhesive weight M4.

[0011] The beneficial effect of this invention is that the method for detecting the amount of adhesive applied during the composite process is based on the curing of the adhesive under different aging conditions, calculating the solid content and measuring its density, and then observing and measuring the adhesive thickness through a section microscope to calculate the volume, thereby calculating the amount of adhesive applied per unit area. Finally, it can quickly determine whether the amount of adhesive applied during the production process is consistent with the design requirements, without the need for additional online detection instruments or calculating the amount of adhesive applied after production based on the total amount of adhesive used, which may have large deviations.

[0012] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention are realized and obtained through the structures particularly pointed out in the description and the drawings.

[0013] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0014] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of material composites provided for embodiments of this disclosure; Figure 2 This is a cross-sectional view of the adhesive thickness test provided in an embodiment of this disclosure.

[0016] In the picture: 1. Material A; 2. Composite adhesive layer; 3. Material B. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0019] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0020] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise clearly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0021] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0022] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0023] This disclosure provides a method for detecting the amount of adhesive applied during material lamination, comprising the following steps: S1, taking a completely mixed adhesive of main agent and curing agent and measuring its weight M1; S2, subjecting the adhesive in S1 to aging treatment and measuring the weight M2 and density ρ of the adhesive after aging treatment; S3, calculating the solid content N of the adhesive under the aging conditions in S2, where N = S4, aging the composite material under the same conditions as S2, rapidly curing the adhesive layer, and observing the cross-section to measure the thickness d of the adhesive layer; S5, calculating the adhesive layer volume V per unit area, where V = S * d; calculating the adhesive weight M3 per unit area after aging, where M3 = V * ρ = S * d * ρ; calculating the adhesive weight M4 per unit area before aging, where M4 = ... Wherein, the adhesive weight M4 is the amount of adhesive applied during the material compounding process.

[0024] In some embodiments, the conditions for the aging process in S2 specifically include: a temperature range of 100–150°C and a time range of 30–120 min.

[0025] Specifically, in the industrial field, aging usually refers to the time management required for an adhesive to fully cure and reach its optimal bond strength after application. Its core lies in the curing time, which is affected by various factors such as the type of adhesive, ambient temperature, and the material of the bonded objects.

[0026] Optionally, aging condition 1 is 100℃ for 60 min; aging condition 2 is 150℃ for 30 min.

[0027] Please see Figure 1 Specifically, the composite material to be used in S4 includes a thin film material with a thickness of no more than 200 μm and a metal material with a thickness of no more than 100 μm. The thin film material is material A (1), and the composite adhesive layer (2) is used to bond the metal material material B (3).

[0028] Optionally, the composite material can be a 20μm PP and a 30μm Al layer, or a 15μm PA and a 50μm Al layer.

[0029] In some embodiments, specifically, the method for detecting the thickness d of the adhesive layer in S4 includes: observing the thickness under a microscope after slicing.

[0030] This disclosure also provides a system for detecting the amount of adhesive applied during material lamination, comprising: a measuring unit including a weighing sensor to collect weights M1 and M2, a densitometer to collect density ρ, and a microscope to collect thickness d; an aging unit including an oven for aging treatment; and a control module electrically connected to the measuring unit and the aging unit, and performing the detection as described in any one of claims 1-4 to calculate the adhesive weight M4.

[0031] Please see Figure 2 Specifically, the glue application amount detection in Examples 1-4 is shown below.

[0032] S1, take a 20μm PP and a 30μm Al layer as object 1, take a 15μm PA and a 50μm Al layer as object 2, weigh the initial weight, the initial weight M1-1 of object 1 is 10g, and the initial weight M1-2 of object 2 is 10g. S2, then measure the weights M2-1, M2-2, M2-3, and M2-4 of the glue after aging treatment under aging conditions 1 and aging conditions 2, respectively, as shown in Table 1 below; Table 1

[0033] S3, calculate N1-N4 and density ρ1-ρ4 for samples 1-4 respectively, as shown in Table 2 below; Table 2

[0034] S4. After placing the corresponding composite samples under the corresponding aging conditions, take them out and observe the corresponding adhesive layer thicknesses d1-d4 under a microscope, as shown in Table 3 below. Table 3

[0035] S5, calculate the adhesive weight within a 1m² area after aging according to the formula M3=V*ρ=S*d*ρ;

[0036] S6, then according to the formula Calculate the weight of adhesive in a 1m² area before aging;

[0037] S7 and M4 represent the amount of adhesive applied within a 1m² area of ​​the sample. The test results M4-1 and M4-2 are the results of the adhesive application of the same sample under different aging conditions, and M4-3 and M4-4 are the results of the adhesive application of the same sample under different aging conditions. The deviation of the above two sets of test results is within 0.2g / m² and is consistent with the designed adhesive application amount, indicating that this test method can effectively monitor the adhesive application amount in the composite process of different materials.

[0038] In summary, the method for detecting the amount of adhesive applied during the composite process of this material is based on the curing of the adhesive under different aging conditions, calculating the solid content and measuring its density, and then observing and measuring the adhesive thickness through a section microscope to calculate the volume, thereby calculating the amount of adhesive applied per unit area. Ultimately, it can quickly determine whether the amount of adhesive applied during the production process is consistent with the design requirements, without the need for additional online detection instruments or calculating the amount of adhesive applied after production based on the total amount of adhesive used, which may result in significant deviations.

[0039] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A method for detecting the amount of adhesive applied during material lamination, characterized in that, Includes the following steps: S1, take the glue from which the main agent and curing agent are completely mixed, and measure its weight M1; S2, the glue in S1 is aged, and the weight M2 and density ρ of the glue after aging are measured; S3, calculate the solid content N of the glue under the aging conditions in S2, and N = ; S4. Take the composite material to be aged and perform aging treatment under the same conditions as S2 to rapidly cure the adhesive layer. Observe the cross-section and measure the thickness d of the adhesive layer. S5, calculate the adhesive layer volume V per unit area, where V = S * d; calculate the adhesive weight M3 per unit area after aging, where M3 = S * d * ρ; calculate the adhesive weight M4 per unit area before aging, where M4 = ... ; Wherein, the adhesive weight M4 is the amount of adhesive applied during the material compounding process.

2. The detection method as described in claim 1, characterized in that, The aging treatment conditions in S2 include: a temperature range of 100–150°C and a time range of 30–120 min.

3. The detection method as described in claim 1, characterized in that, The composite material to be used in S4 includes thin film materials with a thickness of no more than 200 μm and metallic materials with a thickness of no more than 100 μm.

4. The detection method as described in claim 1, characterized in that, The method for detecting the thickness d of the adhesive layer in S4 includes: observing the thickness under a microscope after slicing.

5. A system for detecting the amount of adhesive applied during material lamination, characterized in that, include: The measuring unit includes a weighing sensor to acquire weights M1 and M2, a densitometer to acquire density ρ, and a microscope to acquire thickness d. Aging unit, including an oven for aging treatment; The control module is electrically connected to the measuring unit and the aging unit, and performs the detection according to any one of claims 1-4 to calculate the glue weight M4.

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