Spacecraft thermal response automatic test system
By constructing a parallel testing system, the relationship between the spacecraft's heating circuit and temperature sensor is automatically paired and corrected, solving the problem of misconnection and crosstalk in the spacecraft, realizing efficient and accurate thermal response testing, and improving the development quality and testing efficiency of the spacecraft.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
- Filing Date
- 2026-04-14
- Publication Date
- 2026-06-30
AI Technical Summary
Existing technologies are insufficient to effectively verify the correct correspondence between heating circuits and temperature sensors in spacecraft. In particular, problems such as misconnection, incorrect cable definition, or internal short circuits are prone to occur in complex wiring networks. Traditional testing methods cannot detect crosstalk caused by misconnections in "point-to-many" connections.
A full-channel concurrent monitoring matrix and a thermally decoupled parallel scheduling strategy are constructed. Through parameterized human-computer interaction modules, intelligent scheduling modules, dual electric and thermal control modules, acquisition modules, and interpretation modules, automatic pairing, parallel testing, and error correction of heating circuits and temperature sensors are realized. A moving average filtering algorithm and ambient temperature drift correction are adopted to realize multi-circuit parallel testing.
It significantly improved the quality of spacecraft development, shortened the testing time from several days to several hours, improved the accuracy and flexibility of testing, avoided interference from changes in ambient temperature, and ensured that the testing process was damage-free.
Smart Images
Figure CN122016366B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of spacecraft assembly technology, and in particular relates to an automatic testing system for spacecraft thermal response. Background Technology
[0002] During the assembly and vacuum thermal testing phases of spacecraft (such as satellites, spacecraft, and deep space probes), the reliability verification of the thermal control subsystem is crucial. Spacecraft thermal control systems typically contain numerous active heating loops (composed of heating elements) and corresponding temperature sensors (such as thermistors and thermocouples). During on-orbit operation, the temperature control computer controls the on / off state of the corresponding heating loops based on temperature data collected by the sensors to maintain the equipment temperature within specified ranges. Therefore, during ground testing, it is essential to rigorously verify the correct physical correspondence between the "heating loop" and the "temperature sensor" (i.e., verify that when heating loop A is working, it is indeed sensor a that detects the temperature rise, not sensor b). With the increasing complexity of spacecraft, the number of heating loops and sensors on a single satellite has surged to hundreds or even thousands, and the wiring network is extremely complex, making it highly susceptible to problems such as incorrect connector insertion, incorrect cable definitions, or internal short circuits.
[0003] Currently, industry solutions primarily rely on manual testing or semi-automatic single-point testing. Manual testing involves one person manually activating a heating circuit while another monitors the data at a terminal, observing which temperature sensor readings rise and manually recording the results. Semi-automatic single-point testing uses a handheld heating device to externally heat the sensor, with the host computer collecting data. This method is mainly used to verify the sensor's functionality, rather than verifying the internal "heater-sensor" circuit relationship within the satellite. While using a general-purpose data acquisition instrument (such as the Agilent 34970A) with a PC enables data display, it lacks intelligent interpretation logic, only verifying "point-to-point" continuity and failing to effectively detect "point-to-many" crosstalk issues. Summary of the Invention
[0004] In view of this, the present invention aims to provide an automatic testing system for spacecraft thermal response. By constructing a full-channel concurrent monitoring matrix and a thermal decoupling parallel scheduling strategy, it monitors all temperature sensors when heating a single loop, automatically identifies misconnections and crosstalk between the heating loop and the temperature sensors, automatically groups different heating loops based on their thermal coupling relationships, and realizes parallel testing of multiple loops. It also eliminates the interference of ambient temperature drift on the heating loop and achieves accurate interpretation.
[0005] To achieve the above objectives, the technical solution created by this invention is implemented as follows:
[0006] This invention provides an automatic testing system for spacecraft thermal response, comprising: a parameterized human-machine interaction module, an intelligent scheduling module, an electrothermal dual control module, a data acquisition module, and an interpretation module;
[0007] The parameterized human-computer interaction module is used to build a test task model, which includes: pairing heating circuits with corresponding temperature sensors inside the spacecraft to determine the thermal coupling relationship of different heating circuits;
[0008] The intelligent scheduling module is used to allocate non-thermally coupled heating circuits to the same test group; the control module for electric heating and cooling is used to heat the heating circuits in the current test group and monitor the cooling status of the heating circuits in the current test group. If the current test group enters a natural cooling state, the next test group is scheduled for testing.
[0009] The data acquisition module is used to collect the temperatures from all temperature sensors inside the spacecraft.
[0010] The interpretation module is used to correct the interference of ambient temperature fluctuations on the temperature sensor's temperature acquisition and obtain the net temperature rise of the current test temperature sensor; and to calculate the temperature rise rate of the current test temperature sensor and determine whether the current test temperature sensor is connected to the corresponding heating circuit based on the temperature rise rate.
[0011] Preferably, the system hardware includes: a host computer and an integrated cabinet for automatic testing equipment; a parameterized human-computer interaction module, an intelligent scheduling module, and an interpretation module are deployed on the host computer; an electric heating dual control module and an acquisition module are deployed on the integrated cabinet for automatic testing equipment; the integrated cabinet for automatic testing equipment includes: a programmable DC power supply, a multi-channel relay, and a full-channel acquisition instrument.
[0012] Preferably, all heating circuits are tested sequentially using an intelligent scheduling module; or, all heating circuits in the same test group are tested in parallel.
[0013] Preferably, the interpretation module is also used to scan the other temperature sensors inside the spacecraft besides the currently tested temperature sensor. If a temperature sensor with a net temperature rise is found, it is determined whether the temperature sensor with a net temperature rise is misconnected or has cable crosstalk with the currently tested temperature sensor.
[0014] Preferably, a programmable DC power supply is used to power the heating circuit.
[0015] Preferably, the programmable DC power supply is also used to read the current, and the multi-channel relay is used to control the switching of the heating circuit in the test group; when the heating circuit current is 0 or the current exceeds the preset threshold, the multi-channel relay cuts off the circuit; when the programmable DC power supply determines that the heating circuit current is normal, the multi-channel relay maintains the power supply to the heating circuit.
[0016] Preferably, the interpretation module uses a moving average filtering algorithm to process the temperature collected by the temperature sensor. The interpretation module sets a sliding time window of length 5. At each sampling time i, it takes the collected temperature of time i and the two sampling points before and after it, calculates the average value of these 5 sampling points, and uses it as the smoothed output temperature at time i.
[0017] The preferred moving average filtering algorithm is expressed as follows:
[0018] ;
[0019] in: Let be the output temperature of the temperature sensor after filtering and smoothing at the i-th sampling time. Let be the temperature collected by the temperature sensor at the k-th sampling time, where k is the summation index.
[0020] Preferably, the temperature rise rate is expressed as:
[0021] ;
[0022] in: R i Let i be the temperature rise rate of the i-th sensor. dt The sampling time interval, This is the net temperature rise of the temperature sensor within the sampling interval. =T smooth(tend) -T smooth(tstart) T smooth(tend) T represents the output temperature of the temperature sensor at the end of the sampling process. smooth(tstart) The output temperature of the temperature sensor at the start of sampling.
[0023] Compared with the prior art, the present invention can achieve the following beneficial effects:
[0024] This invention pairs heating circuits with corresponding temperature sensors inside the spacecraft to determine the thermal coupling relationship between different heating circuits. Heating circuits without thermal coupling are assigned to the same test group, and one of the parallel test groups is selected for testing. Heating commands are sent to the electrothermal dual control module, and all heating circuits in the test group are tested sequentially or in parallel. This breaks the limitations of traditional serial testing and reduces the single-satellite testing time from several days to several hours.
[0025] This invention collects data from all temperature sensors inside the spacecraft except the currently tested temperature sensor using a data acquisition module. If a temperature sensor with a net temperature rise is found, it is determined that the temperature sensor with a net temperature rise has a hidden fault such as misconnection or cable crosstalk with the currently tested temperature sensor, which significantly improves the quality of spacecraft development.
[0026] This invention no longer relies heavily on an absolutely stable thermal equilibrium environment. By subtracting the environmental drift rate algorithm, it allows testing under varying environmental temperature conditions, increasing the flexibility of implementation. This invention combines instantaneous current reading with temperature hysteresis reading, which not only ensures accurate measurement but also guarantees that the testing process does not damage the spacecraft. Attached Figure Description
[0027] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments and descriptions of the invention are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:
[0028] Figure 1 This is an overall hardware architecture diagram of an automatic test system for spacecraft thermal response provided according to an embodiment of the present invention;
[0029] Figure 2 This is a flowchart of the main control program of an automatic test system for spacecraft thermal response provided according to an embodiment of the present invention. Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only for explaining the invention and do not constitute a limitation thereof. Similar elements in different embodiments are referred to by associated similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the invention. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, some operations related to the invention are not shown or described in the specification. This is to avoid obscuring the core parts of the invention with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; the relevant operations can be fully understood based on the description in the specification and general technical knowledge in the art.
[0031] It should be noted that, unless otherwise specified, the embodiments and features described in this invention can be combined to form various implementations. Furthermore, the order of the steps or actions in the method description can be changed or adjusted in a manner readily apparent to those skilled in the art. Therefore, the various orders in the specification and drawings are merely for the clear description of a particular embodiment and do not imply a mandatory order, unless otherwise stated that a particular order must be followed.
[0032] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.
[0033] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0034] The invention will now be described in detail with reference to the accompanying drawings and embodiments.
[0035] Please see Figure 1 In one embodiment of the present invention, an automatic test system for the thermal response of a spacecraft is provided, comprising: a parameterized human-computer interaction module, an intelligent scheduling module, an electrothermal dual control module, an acquisition module, and an interpretation module;
[0036] The parameterized human-computer interaction module is used to build a test task model, which includes: pairing heating circuits with corresponding temperature sensors inside the spacecraft to determine the thermal coupling relationship of different heating circuits;
[0037] The intelligent scheduling module is used to allocate non-thermally coupled heating circuits to the same test group; the control module for electric heating and cooling is used to heat the heating circuits in the current test group and monitor the cooling status of the heating circuits in the current test group. If the current test group enters a natural cooling state, the next test group is scheduled for testing.
[0038] The data acquisition module is used to collect the temperatures from all temperature sensors inside the spacecraft.
[0039] The interpretation module is used to correct the interference of ambient temperature fluctuations on the temperature sensor's temperature acquisition and obtain the net temperature rise of the current test temperature sensor; and to calculate the temperature rise rate of the current test temperature sensor and determine whether the current test temperature sensor is connected to the corresponding heating circuit based on the temperature rise rate.
[0040] In this embodiment of the invention, the spacecraft thermal response automatic testing system includes: a parameterized human-machine interaction module, an intelligent scheduling module, an electrothermal dual control module, an acquisition module, and an interpretation module; the system hardware includes: a host computer and an automatic testing equipment integrated cabinet; the automatic testing equipment integrated cabinet includes: a programmable DC power supply, a multi-channel relay, and a full-channel acquisition instrument.
[0041] The host computer serves as the operating platform for the parameterized human-machine interaction module, intelligent scheduling module, and interpretation module. The parameterized human-machine interaction module is the user operation area, and the intelligent scheduling module runs automated testing software with a built-in multi-threaded parallel scheduling engine. The dual-control module for electric heating includes a programmable DC power supply and a multi-channel relay. The programmable DC power supply has real-time current feedback and supplies power to the heating circuit. The multi-channel relay controls the switching of the heating circuit in the test group and has the function of switching the power output channel to different heating circuits. The acquisition module includes a full-channel data acquisition instrument, which has the function of acquiring temperature data from temperature sensors inside the spacecraft.
[0042] The host computer is connected to the programmable DC power supply and the full-channel data acquisition instrument via cables. The programmable DC power supply is connected to the multi-channel relay via cables. The multi-channel relay is connected to the heating circuit of the spacecraft via cables. The full-channel data acquisition instrument is connected to the temperature sensor inside the spacecraft via cables.
[0043] Please see Figure 2 Testers construct test task models in the parameterized human-computer interaction module, including: pairing heating circuits with corresponding temperature sensors inside the spacecraft, importing a mapping table with pairing relationships of "heating circuit ID - temperature sensor ID" (e.g., heating circuit A corresponds to temperature sensor a, heating circuit B corresponds to temperature sensor b), determining the thermal coupling relationship of the heating circuits according to the spacecraft's structural layout, allocating non-thermally coupled heating circuits to the same parallel test group according to the thermal coupling relationship (e.g., heating circuits located on the +X side of the spacecraft and heating circuits on the -X side of the spacecraft are heated at the same time), setting the excitation voltage for each heating circuit, calculating the acquisition time for the environmental drift rate (e.g., acquisition for five minutes), preset the minimum heating rate of the heating circuit, and the thermal coupling safety protection extreme value between each heating circuit (e.g., 60℃).
[0044] Before heating, an environmental stability check is performed. The intelligent scheduling module instructs the acquisition module to synchronously collect the temperature data from all temperature sensors inside the spacecraft at a fixed high frequency (e.g., 1Hz) for five minutes using a full-channel acquisition instrument. The collected temperature data is then transmitted to the intelligent scheduling module, which in turn transmits the received temperature data to the interpretation module. The temperature data received by the interpretation module is susceptible to electromagnetic interference, including: First, spacecraft heating circuits typically involve the switching of large currents. When multi-channel relays are frequently switched on and off, transient pulse group interference can be induced in the power supply lines and surrounding signal lines. Second, the number of heating circuits and temperature sensors increases dramatically to hundreds or even thousands, and the wiring network is extremely complex. Since test cables are usually bundled together, AC or pulse currents in the heating circuit cables can interfere with the sampling signals of high-sensitivity temperature sensors through mutual inductance and capacitive coupling. Third, the heating test is conducted inside a vacuum chamber. Various industrial equipment outside the vacuum chamber, such as vacuum pumps, cryogenic pumps, and large rectifier power supplies, generate high-frequency space radiation interference during operation.
[0045] To prevent misjudgments caused by electromagnetic interference, the interpretation module uses a moving average filtering algorithm to process the temperature collected by the temperature sensor. The interpretation module sets a sliding time window of length 5. At each sampling time i, it takes the original temperature of time i plus the two sampling points before and after it, calculates the arithmetic mean of these five sampling points, and uses this as the smoothed temperature output at time i. The moving average filtering algorithm is expressed as:
[0046] ;
[0047] in: Let T be the output temperature of the temperature sensor after filtering and smoothing at the i-th sampling time. raw [k] represents the temperature collected by the temperature sensor at the kth sampling time, and k is the summation index, ranging from i-2 to i+2, representing 5 consecutive sampling points centered on the current point.
[0048] If the ambient temperature exhibits linear drift, the interpretation module calculates the ambient drift rate using the output temperature data. The interpretation module then uses this ambient drift rate to calculate the dynamic baseline for the ambient temperature, which is expressed as follows:
[0049] ;
[0050] in: The ambient temperature at time t is the dynamic reference. The initial reference temperature collected by the acquisition module before the start of automated testing is used to avoid incorrectly recording a "spiking" caused by a random electromagnetic pulse as the reference temperature. The interpretation module first performs a moving average filter on the data from this period and then takes the stable value. The environmental drift rate is calculated by pre-collecting (five minutes) data on the slope of the change in ambient temperature over time. The time elapsed during the heating test execution (time offset relative to the initial moment).
[0051] The intelligent scheduling module selects one of the parallel test groups for testing, sends a heating command to the dual-control electrothermal module, and performs heating tests on all heating circuits in the test group sequentially, or performs parallel heating tests on all heating circuits in the same test group. The programmable DC power supply releases excitation voltage to the heating circuits of the test group through a multi-channel relay. Within 100ms of sending the command, the programmable DC power supply reads back the current value of each heating circuit in real time. When the heating circuit current is 0 or the current exceeds the preset threshold, the programmable DC power supply determines that the heating circuit has a circuit fault, and the multi-channel relay cuts off the circuit. When the programmable DC power supply determines that the heating circuit current is normal, the multi-channel relay maintains the power supply to the heating circuit. During the continuous heating of the heating circuit, the acquisition module records the temperature changes of the temperature sensor in real time through the full-channel acquisition instrument and transmits them to the intelligent scheduling module. If the acquired temperature exceeds the safety protection limit of 60℃, the intelligent scheduling module immediately sends a power cut-off command to the dual-control electrothermal module and issues a warning.
[0052] The intelligent scheduling module transmits the temperature changes from the temperature sensors to the interpretation module. The interpretation module then performs a triple determination on each heating circuit in operation and its corresponding temperature sensor:
[0053] First determination: The interpretation module subtracts the dynamic reference temperature of the ambient temperature from the received temperature change data to obtain the net temperature rise of the temperature sensor;
[0054] The second step of judgment: The interpretation module calculates the temperature rise rate of each temperature sensor based on the received temperature change data. Represented as:
[0055] ;
[0056] in: R i Let i be the temperature rise rate of the i-th sensor. dt The sampling time interval, The net temperature rise of the temperature sensor within the sampling interval is given by dT = T. smooth(tend) -T smooth(tstart) T smooth(tend) T represents the output temperature of the temperature sensor at the end of the sampling process. smooth(tstart) The output temperature of the temperature sensor at the start of sampling.
[0057] when At that time, the heating circuit was determined to be normal (during the heating period of heating circuit B, sensor b showed a significant net temperature rise, indicating that the heating circuit and temperature sensor were qualified), wherein: The preset threshold for the judgment slope is the preset minimum heating rate of the heating circuit. Environmental drift rate;
[0058] The third judgment: During the heating of heating circuit A, the full-channel acquisition instrument also scans the remaining temperature sensors. When a significant net temperature rise is found in temperature sensor h, it is determined whether there is a misconnection or cable crosstalk between temperature sensor h with a net temperature rise and the currently tested temperature sensor a, and the misconnection or cable crosstalk point is accurately located.
[0059] The judgment module transmits the triple judgment results back to the intelligent scheduling module.
[0060] After the selected parallel test group has finished testing, the multi-channel relay shuts off the excitation voltage channel, and the tested parallel test group is cooled down. The intelligent scheduling module does not wait for the cooling to be completed, but immediately scans the parallel test group to be tested. The multi-channel relay turns on the excitation voltage of the corresponding parallel test group to be tested for heating, realizing pipelined parallel testing.
[0061] The intelligent scheduling module automatically generates a report based on the test results of the parallel test group, including: test time, ambient temperature, temperature rise curve of each heating circuit, and judgment result of the judgment module.
[0062] As an optional embodiment, the temperature sensor type can also be expanded to include a mixture of thermocouples, platinum resistance thermometers, and digital sensors, achieved by configuring a full-channel data acquisition instrument.
[0063] As an optional embodiment, for devices with extremely high heat capacity, the ratio of "heating power integral" to "temperature rise integral" (thermal resistance estimation) can be used as an auxiliary basis to determine whether the correspondence between the heating circuit and the temperature sensor is correct.
[0064] In summary, the above description is merely a preferred embodiment of this specification and is not intended to limit the scope of protection of this specification. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this specification should be included within the scope of protection of this specification.
[0065] The systems, apparatuses, modules, or units described in one or more of the above embodiments may be implemented by a computer chip or entity, or by a product having a certain function. A typical implementation device is a computer. Specifically, a computer may be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smartphone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or any combination of these devices.
[0066] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0067] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.
Claims
1. An automatic testing system for spacecraft thermal response, characterized in that, include: The system includes a parameterized human-computer interaction module, an intelligent scheduling module, an electric and heating dual control module, a data acquisition module, and an interpretation module. The parameterized human-computer interaction module is used to construct a test task model, which includes: pairing heating circuits with corresponding temperature sensors inside the spacecraft to determine the thermal coupling relationship of different heating circuits; The intelligent scheduling module is used to allocate non-thermally coupled heating circuits to the same test group; control the electric heating dual control module to heat the heating circuits in the current test group, and monitor the cooling status of the heating circuits in the current test group. If the current test group enters a natural cooling state, then schedule the next test group for testing. The acquisition module is used to acquire the temperatures collected by all temperature sensors inside the spacecraft; The interpretation module is used to correct the interference of ambient temperature fluctuations on the temperature sensor's temperature acquisition and obtain the net temperature rise of the current test temperature sensor; and to calculate the temperature rise rate of the current test temperature sensor and determine whether the current test temperature sensor is connected to the corresponding heating circuit based on the temperature rise rate.
2. The automatic spacecraft thermal response testing system according to claim 1, characterized in that, The system hardware includes: a host computer and an integrated cabinet for automatic testing equipment. The parameterized human-computer interaction module, the intelligent scheduling module, and the interpretation module are deployed on the host computer. The electric heating dual control module and the acquisition module are deployed on the integrated cabinet for automatic testing equipment. The integrated cabinet for automatic testing equipment includes: a programmable DC power supply, a multi-channel relay, and a full-channel acquisition instrument.
3. The automatic spacecraft thermal response testing system according to claim 1, characterized in that, The intelligent scheduling module is used to test all heating circuits sequentially; or, all heating circuits in the same test group are tested in parallel.
4. The automatic spacecraft thermal response testing system according to claim 1, characterized in that, The interpretation module is also used to scan the other temperature sensors inside the spacecraft besides the currently tested temperature sensor. If a temperature sensor with a net temperature rise is found, it determines whether the temperature sensor with a net temperature rise is misconnected or has cable crosstalk with the currently tested temperature sensor.
5. The automatic spacecraft thermal response testing system according to claim 2, characterized in that, The programmable DC power supply is used to power the heating circuit.
6. The automatic test system for spacecraft thermal response according to claim 5, characterized in that, The programmable DC power supply is also used to read the current, and the multi-channel relay is used to control the switching of the heating circuit in the test group; when the current of the heating circuit is 0 or the current exceeds a preset threshold, the multi-channel relay cuts off the circuit; when the programmable DC power supply determines that the current of the heating circuit is normal, the multi-channel relay maintains the power supply to the heating circuit.
7. The automatic spacecraft thermal response testing system according to claim 2, characterized in that, The interpretation module uses a moving average filtering algorithm to process the temperature collected by the temperature sensor. The interpretation module sets a sliding time window of length 5. At each sampling time i, it takes the collected temperature of time i and the two sampling points before and after it, calculates the average value of these 5 sampling points, and uses it as the smoothed output temperature at time i.
8. The automatic test system for spacecraft thermal response according to claim 7, characterized in that, The moving average filtering algorithm is expressed as follows: ； in: Let be the output temperature of the temperature sensor after filtering and smoothing at the i-th sampling time. Let be the temperature collected by the temperature sensor at the k-th sampling time, where k is the summation index.
9. The automatic test system for spacecraft thermal response according to claim 8, characterized in that, The temperature rise rate is expressed as: ； in: R i Let i be the temperature rise rate of the i-th sensor. dt The sampling time interval, This is the net temperature rise of the temperature sensor within the sampling interval. =T smooth(tend) -T smooth(tstart) T smooth(tend) T represents the output temperature of the temperature sensor at the end of the sampling process. smooth(tstart) The output temperature of the temperature sensor at the start of sampling.