Chip multichannel parallel test device and test method
By introducing a dust removal mechanism and a feeding component into the chip testing device, multi-channel parallel synchronous testing is achieved, solving the problems of dust removal, synchronous testing, and rapid removal in chip testing, improving testing accuracy and efficiency, and adapting to high-speed automated production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 广东顺为微电子技术有限公司
- Filing Date
- 2026-02-24
- Publication Date
- 2026-05-12
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Existing chip testing equipment cannot perform dust removal before testing, which may cause dust particles to fall on chip pins or probes, resulting in poor contact; it is difficult to perform synchronous testing of multiple channels, reducing efficiency; it is difficult to quickly remove the chip after testing, which cannot match the cycle time of high-speed automated production lines; and the chip positioning is inaccurate, resulting in parameter measurement errors and equipment damage.
A dust removal mechanism is used to remove dust from the chip surface. Multi-channel parallel synchronous testing is achieved through a feeding component and a testing mechanism to ensure accurate chip positioning, rapid chip removal, and avoid poor contact and equipment damage.
It improves the accuracy and efficiency of test data, adapts to the cycle time of automated production lines, prevents damage to chips and probes, and extends the service life of equipment.
Smart Images
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Abstract
Description
Technical Field
[0001] This application relates to the field of chip testing technology, and in particular to a chip multi-channel parallel testing device and testing method. Background Technology
[0002] Chips, the core carriers of integrated circuits, are made of semiconductor materials. Their core functions include data processing, signal conversion, and memory control. During the manufacturing process, chips require testing. Chip testing is a crucial step in ensuring the performance and reliability of integrated circuits, encompassing functional verification, performance evaluation, and reliability testing. As chip complexity increases, testing demands are growing. Traditional single-channel serial testing methods are inefficient and cannot meet the needs of large-scale production. Therefore, there is an urgent need to innovate a multi-channel parallel chip testing device to achieve efficient parallel testing, thereby improving overall testing efficiency and ensuring chip quality.
[0003] The existing technology still has the following problems: 1. Existing testing equipment cannot perform dust removal on multiple chips before testing, which may cause dust particles to fall on the chip pins or probes during the testing process, resulting in poor contact and inaccurate test data.
[0004] 2. Existing testing equipment is unable to perform synchronous testing of multiple channels in parallel, thus reducing testing efficiency. After testing, it is difficult to quickly remove the chips, and manual chip removal leads to a longer chip processing cycle, which cannot match the pace of high-speed automated production lines. In addition, it is difficult to ensure accurate chip positioning when feeding chips. Positioning errors cause poor contact, resulting in parameter measurement values deviating from the true level. This may lead to misjudging good products as defective products, and may also scratch the chip surface or damage the probes, thereby causing damage to the equipment. Summary of the Invention
[0005] To overcome the shortcomings of testing devices that cannot perform dust removal on multiple chips before testing, resulting in dust particles potentially landing on chip pins or probes during testing, leading to poor contact and inaccurate test data, and the inability of testing devices to simultaneously perform parallel testing on multiple channels, thus reducing testing efficiency, and the difficulty in quickly removing chips after testing (manual chip removal prolongs chip processing cycles and cannot match the pace of high-speed automated production lines), this invention aims to provide a multi-channel parallel chip testing device and method to solve the above-mentioned deficiencies.
[0006] This application provides a multi-channel parallel testing device for chips, including a main body and a first motor. A third threaded rod is rotatably connected to the inner cavity of the main body. The first motor is disposed on the outer surface of the main body, and the output end of the first motor is sleeved with the third threaded rod. A dust removal mechanism is disposed on the outer surface of the main body. A protrusion is fixedly installed on the outer surface of the main body. A feeding assembly is disposed on the outer surface of the main body. A testing mechanism is disposed on the top and bottom walls of the main body. The feeding assembly includes a feeding rack. A feeding mechanism is disposed in the inner cavity of the feeding rack. A button is disposed on the inner wall of the feeding rack. Alarms are fixedly installed at both ends of the feeding rack. A connecting plate is disposed on the outer surface of the dust removal mechanism. A positioning rod is fixedly installed on the outer surface of the testing mechanism. A positioning wheel is rotatably connected to the bottom end of the positioning rod.
[0007] Furthermore, the feeding rack and the main body of the equipment are slidably connected, and the bottom end of the feeding rack and the third threaded rod are connected by threads. Buttons are provided on both sides of the feeding rack, and the connecting plate passes between the two buttons when the feeding rack moves. The two ends of the buttons are chamfered. The buttons and the alarm are electrically connected, and pressing the buttons controls the alarm to sound an alarm. There are two protrusions, and the two ends of the protrusions are chamfered.
[0008] Furthermore, the feeding mechanism includes a connecting block, a positioning groove is provided on the upper surface of the connecting block, feeding plates are fixedly installed at both ends of the positioning groove, feeding blocks are evenly installed on the upper surface of the feeding plates, a slide rod is fixedly installed on the outer surface of the feeding plates away from the connecting block, a second spring is sleeved on the outer surface of the slide rod, a material removal mechanism is provided in the inner cavity of the feeding plate, the connecting block and the feeding plate are slidably connected to the feeding frame, the second spring is slidably connected to the feeding frame, and the second spring is located between the inner wall of the feeding plate and the feeding frame. When the positioning rod moves down, the positioning wheel and the positioning groove engage.
[0009] Furthermore, the stripping mechanism includes a stripping plate, with rotating wheels rotatably connected to both ends of the stripping plate. A lifting rod is fixedly installed on the upper surface of the stripping plate, and a stripping disc is fixedly installed at the top of the lifting rod. A third spring is sleeved on the outer surface of the lifting rod. The distance between the rotating wheels is equal to the distance between the two protrusions, and when the feeding frame moves, the bottom end of the rotating wheel passes through the chamfer of the protrusion. The inner cavity of the stripping disc and the discharge block are tightly fitted. The lifting rod and the discharge block are slidably connected. The third spring is located between the inner wall of the feeding plate and the stripping plate. There is a gap between the stripping plate and the top inner wall of the feeding plate. The lifting rod and the feeding plate are slidably connected.
[0010] Furthermore, the dust removal mechanism includes a dust removal frame, the inner cavity of which is connected to a first threaded rod via a threaded connection, the bottom end of which is rotatably connected to a lifting plate, the outer surface of which is fixedly mounted with a first limiting rod, which is slidably connected to the dust removal frame, the lower surface of which is fixedly mounted with a storage rod, the inner cavity of which is slidably connected with a buffer rod, the inner cavity of which is provided with a first spring, which is located between the lifting plate and the buffer rod, the bottom end of which is fixedly mounted with a cleaning brush, the lower surface of which is provided with cleaning cotton, and the inner walls of both sides of the dust removal frame are fixedly mounted with connecting plates.
[0011] Furthermore, the testing mechanism includes a testing frame, a cylinder is fixedly installed on the inner wall of the top of the main body of the equipment, a piston rod is slidably connected to the inner cavity of the cylinder, the upper surface of the testing frame is fixedly connected to the piston rod, a second limiting rod is fixedly installed on the upper surface of the testing frame, a second threaded rod is rotatably connected to the inner cavity of the testing frame, a second motor is provided on the outer surface of the testing frame, a first moving block and a second moving block are slidably connected to the outer surface of the testing frame, a rotating rod is rotatably connected to the outer surface of the testing frame, a conveyor belt is sleeved on the outer surface of the rotating rod, detection probes are fixedly installed on the lower surfaces of the first moving block and the second moving block, and a positioning rod is fixedly connected to the lower surface of the testing frame.
[0012] Furthermore, the second limiting rod is slidably connected to the inner cavity of the equipment body, the output end of the second motor is sleeved with the second threaded rod, the first moving block and the second threaded rod are connected by threads, the side of the first moving block away from the second threaded rod is fixedly connected to the conveyor belt, and the side of the conveyor belt away from the first moving block is fixedly connected to the second moving block.
[0013] A multi-channel parallel testing method for chips, used in the aforementioned testing apparatus, includes the following steps: S1. The chips to be tested are sequentially placed into the inner cavity of the feeding assembly for feeding, so that the chips move to the lower end of the testing mechanism for testing. S2. During the feeding process, the first motor drives the third threaded rod to rotate. The rotation of the third threaded rod drives the dust removal mechanism to move on the main body of the equipment. When it moves to the dust removal mechanism, it continues to remove dust from the chips on the feeding assembly. S3. By coordinating the feeding components and the testing mechanism, the chip is subjected to multi-channel parallel testing, which facilitates the improvement of testing efficiency. S4. After the test is completed, the feeding component moves past the bump to facilitate the chip removal process on the feeding component, making it easy to quickly remove the chip from the feeding component.
[0014] The technical solution provided in this application has at least the following technical effects or advantages: 1. By employing a dust removal mechanism, this invention effectively solves the problem that existing testing devices cannot perform dust removal on multiple chips before testing. This results in dust particles potentially falling onto chip pins or probes during testing, leading to poor contact and inaccurate test data. The dust removal mechanism can remove dust from the outer surface of the chip before testing, and uses an adjustable and flexible cleaning method to avoid damaging the chip during cleaning, thereby ensuring good contact during testing and improving the accuracy of test data.
[0015] 2. By employing a feeding assembly and testing mechanism, this invention effectively solves the problems of existing testing devices' inability to simultaneously perform parallel testing on multiple channels, thus reducing testing efficiency. Furthermore, it addresses the difficulty of quickly removing chips after testing, leading to prolonged chip processing cycles due to manual chip removal, which cannot match the pace of high-speed automated production lines. Additionally, ensuring precise chip positioning during feeding can result in poor contact, causing parameter measurements to deviate from the true level, potentially misclassifying good chips as defective, and even scratching the chip surface or damaging probes, thus damaging the equipment. This invention, through its feeding assembly and testing mechanism, enables simultaneous parallel testing of multiple channels, significantly improving testing efficiency. It allows for rapid chip removal after testing, reducing the testing cycle and adapting to the pace of automated production lines. Moreover, it enables precise chip positioning during testing, avoiding poor contact, ensuring parameter measurements match the true level, preventing misclassification of chips, and preventing scratches or probe damage caused by inaccurate positioning, thereby extending the lifespan of the testing equipment. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the overall structure in Embodiment 1 of this application; Figure 2 This is a schematic diagram of the dust removal mechanism in Embodiment 1 of this application; Figure 3 This is a schematic diagram of the storage rod structure in Embodiment 1 of this application; Figure 4 This is a schematic diagram of the feeding component structure in Embodiment 1 of this application; Figure 5 This is a schematic diagram of the feeding mechanism structure in Embodiment 1 of this application; Figure 6 This is a partial cross-sectional view of the feeding plate in Embodiment 1 of this application; Figure 7 This is a schematic diagram of the testing mechanism structure in Embodiment 2 of this application; Figure 8 This is a schematic diagram of the second moving block structure in Embodiment 2 of this application.
[0017] In the diagram: 1. Main body of the equipment; 2. First motor; 3. Dust removal mechanism; 31. Dust removal frame; 32. First threaded rod; 33. Lifting plate; 34. First limit rod; 35. Storage rod; 36. Buffer rod; 37. First spring; 38. Cleaning brush; 39. Cleaning cotton; 4. Protrusion; 5. Feeding assembly; 51. Feeding frame; 52. Feeding mechanism; 521. Connecting block; 522. Positioning groove; 523. Feeding plate; 524. Discharge block; 525. Slide rod; 526. Second spring; 527. Unloading mechanism; 5271, unloading plate; 5272, rotating wheel; 5273, lifting rod; 5274, unloading disc; 5275, third spring; 53, button; 54, alarm; 55, connecting plate; 56, positioning rod; 57, positioning wheel; 6, testing mechanism; 61, testing frame; 62, cylinder; 63, second limit rod; 64, second threaded rod; 65, second motor; 66, first moving block; 67, rotating rod; 68, conveyor belt; 69, second moving block; 610, detection probe. Detailed Implementation
[0018] For chips that cannot be cleaned before testing, this invention uses a dust removal mechanism to remove dust from the outer surface of the chip before testing. It also employs an adjustable and flexible cleaning method to avoid damaging the chip during the cleaning process. For chips that are difficult to test simultaneously in parallel, this invention uses a feeding component and a testing mechanism to perform simultaneous testing of multiple channels in parallel, which greatly improves the efficiency of testing and allows the chip to be quickly removed after testing.
[0019] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods. Example
[0020] Please see Figure 1As shown, a multi-channel parallel chip testing device includes a main body 1 and a first motor 2. A third threaded rod is rotatably connected to the inner cavity of the main body 1. The first motor 2 is mounted on the outer surface of the main body 1, and its output end is sleeved with the third threaded rod. A dust removal mechanism 3 is mounted on the outer surface of the main body 1. A protrusion 4 is fixedly installed on the outer surface of the main body 1. A feeding assembly 5 is mounted on the outer surface of the main body 1. A testing mechanism 6 is mounted on the top and bottom walls of the main body 1. Chips to be tested are sequentially placed into the inner cavity of the feeding assembly 5 for feeding, causing the chips to move to the testing position. The lower end of the testing mechanism 6 is tested. During the feeding process, the first motor 2 drives the third threaded rod to rotate. The rotation of the third threaded rod drives the dust removal mechanism 3 to move on the main body 1 of the equipment. When it moves to the dust removal mechanism 3, the chip on the feeding assembly 5 continues to be dusted. Through the cooperation of the feeding assembly 5 and the testing mechanism 6, the chip is tested in parallel through multiple channels, which can improve the efficiency of the test. After the test is completed, the feeding assembly 5 moves past the protrusion 4 to facilitate the chip removal process on the feeding assembly 5, so that the chip can be quickly taken out of the feeding assembly 5.
[0021] Please see Figure 2 and Figure 3 As shown, the dust removal mechanism 3 includes a dust removal frame 31. A first threaded rod 32 is threadedly connected to the inner cavity of the dust removal frame 31. A lifting plate 33 is rotatably connected to the bottom end of the first threaded rod 32. A first limiting rod 34 is fixedly installed on the outer surface of the lifting plate 33, and the first limiting rod 34 is slidably connected to the dust removal frame 31. A storage rod 35 is fixedly installed on the lower surface of the lifting plate 33. A buffer rod 36 is slidably connected to the inner cavity of the storage rod 35. A first spring 37 is provided in the inner cavity of the storage rod 35, located between the lifting plate 33 and the buffer rod 36. A cleaning brush 38 is fixedly installed at the bottom end of the buffer rod 36, and a cleaning cotton 39 is provided on the lower surface of the cleaning brush 38. Connecting plates 55 are fixedly installed on the inner walls of both sides of the dust removal frame 31. When the feeding assembly 5 passes through the dust removal mechanism 3, the connecting plates 55 are connected by rotating the connecting plate 55. The first threaded rod 32 causes a change in its position within the dust removal frame 31. This changes the distance between the lifting plate 33 and the bottom wall of the top of the dust removal frame 31, thus altering the height of the cleaning brush 38. This facilitates the cleaning cotton 39 cleaning the passing chips. The first limiting rod 34 limits the lifting plate 33, ensuring its overall stability. During contact between the cleaning cotton 39 and the chip, a certain pressure is applied to the cleaning cotton 39. At this time, the cleaning brush 38 drives the buffer rod 36 to be housed within the housing rod 35 and compresses the first spring 37. This allows the cleaning cotton 39 to make flexible contact with the chip, preventing damage during cleaning and ensuring good contact during testing, thereby improving the accuracy of test data.
[0022] Please see Figure 2 , Figure 4 and Figure 8 As shown, the feeding assembly 5 includes a feeding rack 51, a feeding mechanism 52 is provided in the inner cavity of the feeding rack 51, buttons 53 are provided on the inner wall of the feeding rack 51, and alarms 54 are fixedly installed at both ends of the feeding rack 51. A connecting plate 55 is provided on the outer surface of the dust removal mechanism 3, and a positioning rod 56 is fixedly installed on the outer surface of the testing mechanism 6. A positioning wheel 57 is rotatably connected to the bottom end of the positioning rod 56. The feeding rack 51 and the main body 1 are slidably connected, and the bottom end of the feeding rack 51 and the third threaded rod are connected by threads. Buttons 53 are provided on both sides of the feeding rack 51, and the connecting plate 55 passes between the two buttons 53 when the feeding rack 51 moves. The two ends of the buttons 53 are chamfered. The buttons 53 and the alarms 54 are electrically connected. The connection is established, and pressing the button 53 controls the alarm 54 to sound an alarm. There are two protrusions 4, and the two ends of the protrusions 4 are chamfered. The operation of the first motor 2 drives the third threaded rod to rotate, so that the feeding rack 51 moves on the upper surface of the main body 1. During the movement, the connecting plate 55 passes between the buttons 53. When the feeding rack 51 tilts, the connecting plate 55 will squeeze the button 53, causing the alarm 54 to sound an alarm. This is used to detect whether the feeding rack 51 remains horizontal during the movement. At the same time, when the test rack 61 moves down, it drives the positioning rod 56 to move down. At this time, the positioning wheel 57 squeezes the feeding mechanism 52, so that the feeding mechanism 52 can feed accurately, which is convenient for subsequent testing.
[0023] Please see Figure 4 , Figure 5 and Figure 6As shown, the feeding mechanism 52 includes a connecting block 521. A positioning groove 522 is formed on the upper surface of the connecting block 521. Feeding plates 523 are fixedly installed at both ends of the positioning groove 522. Dispensing blocks 524 are evenly installed on the upper surface of the feeding plate 523, where the dispensing blocks 524 are used to place chips. A sliding rod 525 is fixedly installed on the outer surface of the feeding plate 523 away from the connecting block 521. A second spring 526 is sleeved on the outer surface of the sliding rod 525. A stripping mechanism 527 is provided in the inner cavity of the feeding plate 523. The connecting block 521 and the feeding plate 523 are slidably connected to the feeding frame 51. The second spring 526 is slidably connected to the feeding frame 51, and is located between the inner walls of the feeding plate 523 and the feeding frame 51. When the positioning rod 56 moves downwards, the positioning wheel... 57 engages with positioning groove 522. The unloading mechanism 527 includes an unloading plate 5271. Rotary wheels 5272 are rotatably connected to both ends of the unloading plate 5271. A lifting rod 5273 is fixedly installed on the upper surface of the unloading plate 5271. An unloading disc 5274 is fixedly installed at the top of the lifting rod 5273. A third spring 5275 is sleeved on the outer surface of the lifting rod 5273. The spacing between the rotary wheels 5272 is equal to the spacing between the two protrusions 4. When the feeding frame 51 moves, the bottom end of the rotary wheel 5272 passes through the chamfer of the protrusion 4. The unloading disc 5274 and the inner cavity of the discharge block 524 are tightly fitted. The lifting rod 5273 and the discharge block 524 are slidably connected. The third spring 5275 is located between the inner wall of the feeding plate 523 and the unloading plate 5271. The unloading plate 527... There is a gap between the top inner wall of the feeding plate 523 and the lifting rod 5273. The feeding plate 523 is slidably connected to the lifting rod 5273. When the feeding mechanism 52 moves directly below the test frame 61, the test frame 61 moves down, causing the positioning wheel 57 to press against the positioning groove 522 on the connecting block 521, so that the positioning wheel 57 and the positioning groove 522 fit tightly. When the positioning of the connecting block 521 is not accurate enough, the positioning wheel 57 presses against the side of the positioning groove 522, causing the connecting block 521 to move. At this time, the connecting block 521 drives the feeding plate 523 to move. The movement of the feeding plate 523 drives the sliding rod 525 to move in the inner cavity of the feeding frame 51 and press against the second spring 526. At this time, the unloading block 524 can be repositioned, which facilitates the chip on the unloading block 524. A secondary movement ensures that the detection probe 610 is aligned with the feeding block 524, preventing poor contact during testing, ensuring that the measured parameters match the true level, preventing misjudgment of the chip, and preventing scratches on the chip surface or damage to the probe due to inaccurate positioning, thus extending the service life of the testing equipment. After testing, the feed rack 51 continues to move. At this time, the ends of the stripper plate 5271 and the chamfered edges of the roller 5272 and the protrusion 4 are squeezed, causing the stripper plate 5271 to move upward and squeeze the lifting rod 5273. The upward movement of the stripper plate 5271 causes the lifting rod 5273 and the stripper disc 5274 to slide within the inner cavity of the feed plate 523 and the feeding block 524, thereby pushing the tested chip out from the inner cavity of the feeding block 524.Rapidly removing chips in batches reduces the testing cycle, thus adapting to the pace of automated production lines. Example
[0024] Please see Figure 1 , Figure 7 and Figure 8 As shown, the testing mechanism 6 includes a testing frame 61. A cylinder 62 is fixedly installed on the inner wall of the top of the main body 1. A piston rod is slidably connected to the inner cavity of the cylinder 62. The upper surface of the testing frame 61 is fixedly connected to the piston rod. A second limiting rod 63 is fixedly installed on the upper surface of the testing frame 61. A second threaded rod 64 is rotatably connected to the inner cavity of the testing frame 61. A second motor 65 is provided on the outer surface of the testing frame 61. A first moving block 66 and a second moving block 69 are slidably connected to the outer surface of the testing frame 61. A rotating rod 67 is rotatably connected to the outer surface of the testing frame 61. A conveyor belt 68 is sleeved on the outer surface of the rotating rod 67. Detection probes 610 are fixedly installed on the lower surfaces of the first moving block 66 and the second moving block 69. A positioning rod 56 is fixedly connected to the lower surface of the testing frame 61. The second limiting rod 63 is slidably connected to the inner cavity of the main body 1. The output end of the second motor 65 is sleeved with the second threaded rod 64. The first moving block 66 and the second threaded rod 64 are connected by threads. The first moving block 66 is located away from the second threaded rod 64. The side of the conveyor belt 68 is fixedly connected to the side away from the first moving block 66 and the second moving block 69. When the chip on the feeding block 524 is being tested, the piston rod is moved by the operation of the cylinder 62. At this time, the piston rod drives the test frame 61 to rise and fall, so that the test probe 610 can contact the chip on the feeding block 524. The second limit rod 63 is used to keep the test frame 61 stable during the upgrade. The second threaded rod 64 is rotated by the operation of the second motor 65. The rotation of the second threaded rod 64 drives the first moving block 66 to move on the test frame 61. The movement of the first moving block 66 drives the conveyor belt 68 to move on the rotating rod 67. At this time, the rotating rod 67 rotates on the lower surface of the test frame 61, and at the same time drives the second moving block 69 to move on the test frame 61. This allows the first moving block 66 and the second moving block 69 to move in a staggered manner, so that the test probe 610 can simultaneously test the chips on both feeding blocks 524, thereby improving the testing efficiency.
[0025] In summary, the chips to be tested are sequentially placed into the inner cavity of the feeding assembly 5 for feeding, causing the chips to move to the lower end of the testing mechanism 6 for testing. During the feeding process, the operation of the first motor 2 drives the third threaded rod to rotate. The rotation of the third threaded rod causes the dust removal mechanism 3 to move on the main body 1 of the equipment. When the chips move to the dust removal mechanism 3, the chips on the feeding assembly 5 continue to be dusted. The operation of the first motor 2 drives the third threaded rod to rotate, causing the feeding rack 51 to move on the upper surface of the main body 1 of the equipment. During the movement, the connecting plate 55 passes through the button 53. When the feeding rack 51 tilts, the connecting plate 55 will press the button 53, causing the alarm 54 to sound an alarm. This is used to detect whether the feeding rack 51 remains horizontal during movement. At the same time, when the test rack 61 moves down, it drives the positioning rod 56 to move down. At this time, the positioning wheel 57 presses the feeding mechanism 52, enabling the feeding mechanism 52 to feed accurately, which is convenient for subsequent testing. After the test is completed, the feeding assembly 5 moves past the protrusion 4 to facilitate the chip removal process on the feeding assembly 5, making it easy to quickly remove the chip from the feeding assembly 5.
[0026] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.
[0027] The above description is merely a preferred embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present application, based on the technical solution and concept of the present application, should be covered within the scope of protection of the present application.
Claims
1. A chip multi-channel parallel testing device, comprising a device body (1) and a first motor (2), wherein a third threaded rod is rotatably connected to the inner cavity of the device body (1), and the first motor (2) is disposed on the outer surface of the device body (1), wherein the output end of the first motor (2) is sleeved with the third threaded rod, characterized in that, The outer surface of the main body (1) of the equipment is provided with a dust removal mechanism (3), the outer surface of the main body (1) of the equipment is fixedly installed with a protrusion (4), the outer surface of the main body (1) of the equipment is provided with a feeding assembly (5), and the top and bottom walls of the main body (1) of the equipment are provided with a testing mechanism (6). The feeding assembly (5) includes a feeding rack (51), the inner cavity of the feeding rack (51) is provided with a feeding mechanism (52), the inner wall of the feeding rack (51) is provided with a button (53), the two ends of the feeding rack (51) are fixedly installed with an alarm (54), the outer surface of the dust removal mechanism (3) is provided with a connecting plate (55), the outer surface of the testing mechanism (6) is fixedly installed with a positioning rod (56), and the bottom end of the positioning rod (56) is rotatably connected with a positioning wheel (57).
2. The chip multi-channel parallel testing device as described in claim 1, characterized in that, The feeding rack (51) and the equipment body (1) are slidably connected, and the bottom end of the feeding rack (51) and the third threaded rod are connected by threads. Buttons (53) are provided on both sides of the feeding rack (51), and when the feeding rack (51) moves, the connecting plate (55) passes between the two buttons (53). The two ends of the button (53) are chamfered. The button (53) and the alarm (54) are electrically connected, and pressing the button (53) controls the alarm (54) to sound an alarm. There are two protrusions (4), and the two ends of the protrusions (4) are chamfered.
3. The chip multi-channel parallel testing device as described in claim 1, characterized in that, The feeding mechanism (52) includes a connecting block (521). A positioning groove (522) is provided on the upper surface of the connecting block (521). Feeding plates (523) are fixedly installed at both ends of the positioning groove (522). Dispensing blocks (524) are evenly installed on the upper surface of the feeding plate (523). A slide rod (525) is fixedly installed on the outer surface of the feeding plate (523) away from the connecting block (521). A first... Two springs (526), the inner cavity of the feeding plate (523) is provided with a material removal mechanism (527), the connecting block (521) and the feeding plate (523) are slidably connected to the feeding frame (51), the second spring (526) is slidably connected to the feeding frame (51), and the second spring (526) is located between the inner wall of the feeding plate (523) and the feeding frame (51). When the positioning rod (56) moves down, the positioning wheel (57) and the positioning groove (522) engage.
4. The chip multi-channel parallel testing device as described in claim 3, characterized in that, The unloading mechanism (527) includes an unloading plate (5271), with rotating wheels (5272) rotatably connected to both ends of the unloading plate (5271). A lifting rod (5273) is fixedly installed on the upper surface of the unloading plate (5271), and an unloading disc (5274) is fixedly installed at the top end of the lifting rod (5273). A third spring (5275) is sleeved on the outer surface of the lifting rod (5273). The spacing between the rotating wheels (5272) and the spacing between the two protrusions (4) are equal, and the feeding frame (5) 1) When moving, the bottom end of the rotating wheel (5272) passes through the chamfer of the protrusion (4), the inner cavity of the stripping disc (5274) and the feeding block (524) are tightly fitted, the lifting rod (5273) and the feeding block (524) are slidably connected, the third spring (5275) is located between the inner wall of the feeding plate (523) and the stripping plate (5271), there is a gap between the stripping plate (5271) and the top inner wall of the feeding plate (523), and the lifting rod (5273) and the feeding plate (523) are slidably connected.
5. The chip multi-channel parallel testing device as described in claim 1, characterized in that, The dust removal mechanism (3) includes a dust removal frame (31). The inner cavity of the dust removal frame (31) is connected to a first threaded rod (32) by a thread. The bottom end of the first threaded rod (32) is rotatably connected to a lifting plate (33). The outer surface of the lifting plate (33) is fixedly installed with a first limiting rod (34). The first limiting rod (34) and the dust removal frame (31) are slidably connected. The lower surface of the lifting plate (33) is fixedly installed with a storage rod (35). The inner cavity of the storage rod (35) is slidably connected with a buffer rod (36). The inner cavity of the storage rod (35) is provided with a first spring (37). The first spring (37) is located between the lifting plate (33) and the buffer rod (36). The bottom end of the buffer rod (36) is fixedly installed with a cleaning brush (38). The lower surface of the cleaning brush (38) is provided with a cleaning cotton (39). The inner walls on both sides of the dust removal frame (31) are fixedly installed with connecting plates (55).
6. The chip multi-channel parallel testing device as described in claim 1, characterized in that, The testing mechanism (6) includes a test frame (61). A cylinder (62) is fixedly installed on the inner wall of the top of the main body (1). A piston rod is slidably connected to the inner cavity of the cylinder (62). The upper surface of the test frame (61) is fixedly connected to the piston rod. A second limiting rod (63) is fixedly installed on the upper surface of the test frame (61). A second threaded rod (64) is rotatably connected to the inner cavity of the test frame (61). A second motor (65) is provided on the outer surface of the test frame (61). A first moving block (66) and a second moving block (69) are slidably connected to the outer surface of the test frame (61). A rotating rod (67) is rotatably connected to the outer surface of the test frame (61). A conveyor belt (68) is sleeved on the outer surface of the rotating rod (67). A detection probe (610) is fixedly installed on the lower surface of both the first moving block (66) and the second moving block (69). The positioning rod (56) is fixedly connected to the lower surface of the test frame (61).
7. The chip multi-channel parallel testing device as described in claim 6, characterized in that, The second limiting rod (63) is slidably connected to the inner cavity of the equipment body (1), the output end of the second motor (65) is sleeved with the second threaded rod (64), the first moving block (66) and the second threaded rod (64) are connected by threads, the side of the first moving block (66) away from the second threaded rod (64) is fixedly connected to the conveyor belt (68), and the side of the conveyor belt (68) away from the first moving block (66) is fixedly connected to the second moving block (69).
8. A method for multi-channel parallel testing of a chip, wherein the chip multi-channel parallel testing apparatus as described in any one of claims 1-7 is used for testing, characterized in that, Includes the following steps: S1. The chips to be tested are sequentially placed into the inner cavity of the feeding assembly (5) for feeding, so that the chips move to the lower end of the testing mechanism (6) for testing; S2. During the feeding process, the first motor (2) drives the third threaded rod to rotate. The rotation of the third threaded rod drives the dust removal mechanism (3) to move on the main body (1) of the equipment. When it moves to the dust removal mechanism (3), the chip on the feeding assembly (5) continues to be dusted. S3. By cooperating with the feeding component (5) and the testing mechanism (6), the chip is subjected to multi-channel parallel testing, which facilitates the improvement of testing efficiency. S4. After the test is completed, the feeding component (5) moves past the bump (4) to facilitate the chip removal process on the feeding component (5) and to quickly remove the chip from the feeding component (5).