Photosensitive resin composition, photosensitive resin layer, and semiconductor device using same

Abstract

Provided are a photosensitive resin composition, a photosensitive resin layer manufactured using the photosensitive resin composition, and a semiconductor device comprising the photosensitive resin layer, the photosensitive resin composition comprising: an alkali-soluble resin; a photopolymerizable compound; a photoinitiator; and a solvent, in which the alkali-soluble resin includes a polymer including a structural unit represented by Chemical Formula 1 and a polymer including a structural unit represented by Chemical Formula 2, and includes the polymer including the structural unit represented by Chemical Formula 1 and the polymer including the structural unit represented by Chemical Formula 2 in a weight ratio of about 1: 1 to about 1: 2. In Chemical Formula 1 and Chemical Formula 2, each substituent is as defined in the detailed description. Chemical formula 1 and chemical formula 2

Description

[0001] Cross-reference of related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0159480, filed on November 11, 2024, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Embodiments of this disclosure relate to a photosensitive resin composition, a photosensitive resin layer using the photosensitive resin composition, and a semiconductor device. Background Technology

[0004] With the advent of the hyper-connected intelligent era, including technologies such as artificial intelligence, big data, Internet of Things (IoT) devices, self-driving cars, and remote medical treatment, the development and distribution of various electronic devices, such as smartphones, are accelerating.

[0005] Therefore, fifth-generation (5G) communication technology, which can transmit ultra-high-speed and large-capacity data wirelessly, has become particularly important. In addition, the market size of communication component materials and component elements used in communication devices, including smartphones, is expected to grow exponentially from 2020 to 2026, reaching approximately US$2.3 billion (about 14,000 tons / year).

[0006] To minimize or reduce propagation loss, the dielectric substrates used in 5G communication frequencies (below 6GHz and 28GHz) utilize low dielectric constant (Dk) and low dielectric loss factor (Df), which may not be possible with polyimide (PI), which is mainly used in traditional fourth-generation (4G) Long-Term Evolution (LTE) communication.

[0007] TF International Securities analyst Ming-Chi Kuo predicted that in 2018, "modified polyimide (MPI) will replace liquid crystal polymer (LCP) as the mainstream antenna technology for new iPhone models in the second half of the year." This means that since the manufacturing process of flexible copper clad laminate (FCCL) is built on production lines using polyimide film (existing processes), and module manufacturers prefer to implement existing processes rather than modify equipment to use LCP, he expects modified PI (MPI) to be rapidly developed and applied. Furthermore, this indicates that MPI, designed to compensate for or address the shortcomings of LCP, is already under development.

[0008] Recently, there has been a rapid increase in demand for the development of polyimide precursor resins or other types (or varieties) with low dielectric constant (Dk) and dielectric loss factor (Df). Summary of the Invention

[0009] Some exemplary embodiments of this disclosure provide a photosensitive resin composition comprising an alkali-soluble resin having a low dielectric constant (Dk) and a low dielectric loss factor (Df).

[0010] Some exemplary embodiments provide a photosensitive resin layer made using a photosensitive resin composition.

[0011] Some exemplary embodiments provide a semiconductor device comprising a photosensitive resin layer.

[0012] According to some exemplary embodiments, a photosensitive resin composition comprises: an alkali-soluble resin; a photopolymerizable compound; a photoinitiator; and a solvent, wherein the alkali-soluble resin comprises a polymer containing structural units represented by Formula 1 and a polymer containing structural units represented by Formula 2, and comprises the polymer containing structural units represented by Formula 1 and the polymer containing structural units represented by Formula 2 in a weight ratio of about 1:1 to about 1:2.

[0013] Chemical Formula 1

[0014]

[0015] Chemical formula 2

[0016]

[0017] In chemical formula 1 and chemical formula 2,

[0018] L 1 It is a substituted or unsubstituted C1 to C20 alkylene, a substituted or unsubstituted C6 to C20 arylene, or a combination thereof.

[0019] L 2 It is a single bond (e.g., a monocovalent bond), *-O-*, *-S-*, *-C≡C-*, *-C(=O)-*, *-NR 0 -*、(where R) 0 It is a substituted or unsubstituted C1 to C10 alkyl group, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C6 to C20 arylene group, a substituted or unsubstituted C2 to C20 heterocyclic linking group, or a combination thereof.

[0020] L 3 It is *-O-*, *-S-*, *-C≡C-*, *-C(=O)-*, *-NR 0 -*、(where R) 0 It is a substituted or unsubstituted C1 to C10 alkyl group, or a combination thereof, and

[0021] R 1 and R 2 Each is independently represented by the chemical formula R.

[0022] Chemical formula R

[0023]

[0024] In the chemical formula R,

[0025] R 3 It is a (meth)acrylate group, and

[0026] L 4 It is a substituted or unsubstituted C1 to C20 alkylene group.

[0027] The polymer comprising the structural unit represented by chemical formula 1 may contain a functional group represented by chemical formula S at at least one of the two ends (e.g., both ends).

[0028] Chemical formula S

[0029]

[0030] The polymer comprising the structural unit represented by chemical formula 1 may contain a functional group represented by chemical formula S at one of its two ends, and the other end of the two ends may be a hydrogen atom (e.g., hydrogen may be contained at the other end of the two ends).

[0031] The photoinitiator may be included in an amount of about 2% to about 5% by weight, based on the total amount of the photosensitive resin composition.

[0032] Based on 100 parts by weight of the resin, the photosensitive resin composition may contain the photopolymerizable compound in an amount of about 5 parts by weight to about 20 parts by weight, the photoinitiator in an amount of about 3 parts by weight to about 10 parts by weight, and the solvent in an amount of about 100 parts by weight to about 500 parts by weight.

[0033] The photosensitive resin composition may further include a photosensitizer, a free radical scavenger, a silane coupling agent, an organic acid, or a combination thereof.

[0034] The photosensitive resin composition may be a negative (or negative-type) photosensitive resin composition.

[0035] Some exemplary embodiments provide a photosensitive resin layer manufactured using the aforementioned photosensitive resin composition.

[0036] The photosensitive resin layer may be a semiconductor redistribution layer insulating film (e.g., a semiconductor redistribution layer electrical insulating film).

[0037] Some exemplary embodiments provide a semiconductor device comprising a photosensitive resin layer.

[0038] Other embodiments of this disclosure are included in the following detailed description.

[0039] According to some exemplary embodiments, the alkali-soluble resin in the photosensitive resin composition contains polymers with different structures in a set or specific weight ratio, thereby reducing the dielectric constant (Dk) and dielectric loss factor (Df). Detailed Implementation

[0040] Embodiments of this disclosure are described in more detail below. However, these embodiments are examples, and this disclosure is not limited thereto.

[0041] As used herein, unless otherwise specifically defined (e.g., when not otherwise specifically defined), the term "alkyl" refers to a C1 to C20 alkyl group, the term "alkenyl" refers to a C2 to C20 alkenyl group, the term "cycloalkenyl" refers to a C3 to C20 cycloalkenyl group, the term "heterocyclic alkenyl" refers to a C3 to C20 heterocyclic alkenyl group, the term "aryl" refers to a C6 to C20 aryl group, the term "aranealkyl" refers to a C7 to C20 aranealkyl group, the term "alkylene" refers to a C1 to C20 alkylene group, the term "arylene" refers to a C6 to C20 arylene group, the term "alkylenearyl" refers to a C7 to C20 alkylenearyl group, the term "heteroaryl" refers to a C3 to C20 heteroaryl group, and the term "alkoxide" refers to a C1 to C20 alkoxide.

[0042] As used herein, unless otherwise specifically defined (e.g., when not specifically defined), the term "substituted" means that at least one hydrogen atom of a compound is replaced by a substituent selected from: halogen atoms (F, Cl, Br, or I), C1 to C20 alkyl groups substituted with halogen atoms (e.g., trifluoromethyl), hydroxyl groups, C1 to C20 alkoxy groups, nitro groups, cyano groups, amino groups, imino groups, azido groups, amido groups, hydrazyl groups, hydrazine groups, carbonyl groups, etc. The group consisting of alkyl, carbamoyl, thiol, ester, ether, carboxyl or a salt thereof, sulfonic acid or a salt thereof, phosphate or a salt thereof, C1 to C20 alkyl, C2 to C20 alkenyl, C2 to C20 alkynyl, C6 to C20 aryl, C3 to C20 cycloalkyl, C3 to C20 cycloalkenyl, C3 to C20 cycloalkynyl, C2 to C20 heterocyclic alkyl, C2 to C20 heterocyclic alkenyl, C2 to C20 heterocyclic alkynyl, C3 to C20 heteroaryl, or combinations thereof.

[0043] As used herein, unless otherwise specifically defined (e.g., when not otherwise specifically defined), the term "heterogeneous" means a chemical formula containing at least one heteroatom of N, O, S and P.

[0044] As used herein, unless otherwise specifically defined (e.g., when no specific definition is provided), the term "(meth)acrylate" refers to both "acrylate" and "methacrylate".

[0045] As used herein, unless otherwise defined (e.g., when not otherwise defined), the term “composite” means blend or copolymer. Additionally, the term “copolymer” means block copolymer, alternating copolymer, or random copolymer, and the term “copolymer” means block copolymer, alternating copolymer, or random copolymer.

[0046] As used herein, unless otherwise specifically defined (e.g., when not otherwise specifically defined), an unsaturated bond includes not only multiple bonds between carbon atoms, but also bonds involving other molecules, such as carbonyl bonds and / or azo bonds.

[0047] In the chemical formulas of this specification, unless otherwise specifically defined, if a chemical bond is not drawn at a position where it should be given (e.g., when a chemical bond is not drawn at a position where it should be given), then hydrogen bonding is at said position.

[0048] As used herein, unless otherwise defined (e.g., when not otherwise defined), "*" refers to a connecting part having the same or different atoms or chemical formulas.

[0049] With the growth of the wafer-level packaging (WLP) and panel-level packaging (PLP) markets, photosensitive materials for redistribution layers (RDLs) are being used more and more frequently. Currently, photosensitive polyimide resins, photosensitive benzocyclobutene (BCB) resins, photosensitive phenolic resins, and / or similar materials are used, with photosensitive polyimide resins that meet both processability and reliability requirements being the primary choice.

[0050] In this embodiment, as the redistribution layer becomes multi-layered and performs high-speed processing, there is a need for a design that reduces the dielectric loss of the packaging material due to the greater loss of high-frequency signals.

[0051] Embodiments of this disclosure relate to a photosensitive resin composition, a photosensitive resin layer formed using the photosensitive resin composition, and a semiconductor device comprising the photosensitive resin layer. As a key element of the photosensitive resin composition for use as a protective film in semiconductor circuits, polyimide (PI) or polybenzoxazole (PBO) resin is primarily used to ensure film properties such as elongation and Tg (glass transition temperature), which are important for reliability. The photosensitive resin composition comprising the resin ensures excellent protective film properties by using the resin in conjunction with other photocrosslinking monomers, photopolymerization initiators, and / or similar materials. To implement excellent patterning, the photosensitive resin composition should or needs to have excellent sensitivity properties without leaving residues, and storage stability at room temperature for more than two weeks is desired or required. High frequencies should or must be used to increase the processing speed of electronic devices, and materials with low dielectric constant (Dk) and dielectric loss (Df) are utilized or required to prevent or reduce transmission speed loss at this time.

[0052] The purpose of embodiments of this disclosure is to provide a photosensitive resin composition that can ensure low dielectric loss while facilitating negative pattern formation. As redistribution layers become multilayered and high-speed processing is performed, high-frequency signal loss occurs, thus necessitating a design for reducing the dielectric loss of encapsulation materials. The inventors of this disclosure have been able to reduce dielectric loss by mixing a polymer containing structural units represented by Chemical Formula 1 with a polymer containing structural units represented by Chemical Formula 2.

[0053] Chemical Formula 1

[0054]

[0055] Chemical formula 2

[0056]

[0057] In chemical formula 1 and chemical formula 2,

[0058] L1 is a substituted or unsubstituted C1 to C20 alkylene, a substituted or unsubstituted C6 to C20 arylene, or a combination thereof.

[0059] L2 is a single bond (e.g., a monocovalent bond), *-O-*, *-S-*, *-C≡C-*, *-C(=O)-*, *-NR0-* (where R0 is a substituted or unsubstituted C1 to C10 alkyl group), a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C6 to C20 arylene group, a substituted or unsubstituted C2 to C20 heterocyclic linker, or a combination thereof.

[0060] L3 is *-O-*, *-S-*, *-C≡C-*, *-C(=O)-*, *-NR0-* (where R0 is a substituted or unsubstituted C1 to C10 alkyl group), or a combination thereof, and

[0061] R1 and R2 are each independently represented by the chemical formula R.

[0062] Chemical formula R

[0063]

[0064] In the chemical formula R,

[0065] R3 is a (meth)acrylate group, and

[0066] L4 is a substituted or unsubstituted C1 to C20 alkylene group.

[0067] Each component will be described in more detail below.

[0068] (A) Resin

[0069] The composition may contain a polymer comprising a structural unit represented by Formula 1 and a polymer comprising a structural unit represented by Formula 2 in a weight ratio of about 1:1 to about 1:2. If an alkali-soluble resin is controlled in such a composition (e.g., when an alkali-soluble resin is controlled in such a composition), the dielectric constant and dielectric loss may be reduced.

[0070] For example, a polymer containing structural units represented by Formula 1 and a polymer containing structural units represented by Formula 2 may be contained in a weight ratio of about 1:1 to about 1:1.5 (e.g., about 1:1 weight ratio). In embodiments, the dielectric constant and dielectric loss may be further reduced.

[0071] For example, a polymer containing a structural unit represented by chemical formula 1 may contain a functional group represented by chemical formula S at at least one of the two ends (e.g., both ends).

[0072] Chemical formula S

[0073]

[0074] For example, a polymer containing a structural unit represented by Formula 1 may contain a functional group represented by Formula S at one of its two ends (e.g., at one of the two ends), and the other end may be a hydrogen atom (e.g., hydrogen may be located at the other end of the two ends).

[0075] The polymer containing the structural unit represented by Formula 1 may be mixed with polyamic acid and / or polyamide ester resin, and the polyamic acid and / or polyamide ester resin may be a resin polymerized using diamine hydride compounds and diamine compounds, and may contain, for example, structural units represented by Formula 3.

[0076] Chemical formula 3

[0077]

[0078] In chemical formula 3,

[0079] X1 is the portion derived from dianhydride compounds.

[0080] Y1 is a moiety derived from diamine compounds, and

[0081] R4 and R5 are each independently a substituted or unsubstituted C1 to C20 alkyl, a substituted or unsubstituted C3 to C20 cycloalkyl, a substituted or unsubstituted C6 to C20 aryl, or a substituted or unsubstituted C2 to C20 heterocyclic group.

[0082] For example, R4 and R5 can each be independently C1 to C20 alkyl groups substituted with or not substituted with (meth)acrylate groups.

[0083] If a polyamic acid or polyamide ester resin containing a structural unit represented by Formula 3 is mixed with a polymer containing a structural unit represented by Formula 1 (e.g., when a polyamic acid or polyamide ester resin containing a structural unit represented by Formula 3 is mixed with a polymer containing a structural unit represented by Formula 1), the adhesion strength to a metal layer (e.g., a copper layer, a silicon layer, and / or a titanium layer) can be very easily improved while minimizing or reducing dielectric loss, and the resin can be readily applied to negative (or negative class) compositions to greatly improve developability. Typically, in addition to copper and / or silicon, the copper layer in a semiconductor redistribution layer also contains a small amount of titanium, and the resin having the above-described structure is satisfactory in improving adhesion strength to titanium. Therefore, compared to photosensitive resin compositions using resins without the above-described structure, the photosensitive resin compositions according to some exemplary embodiments can have excellent adhesion strength to the copper and / or silicon layers in a semiconductor redistribution layer while having a low dielectric loss rate.

[0084] Typically, the problem with resins having a closed-ring structure is that the film properties are slightly reduced if cured at low temperatures (e.g., when cured at low temperatures). However, polyamic acid or polyamide ester resins containing structural units represented by Formula 3 contain ester bonds and, as described below, also contain divalent fused rings with resonant structures as linking groups, and therefore they can greatly contribute to reducing the dielectric loss factor. Photosensitive resin compositions according to some exemplary embodiments, used as alkali-soluble resins by mixing the above-mentioned resins with polymers containing structural units represented by Formula 1, are suitable for low-temperature curing or optimized for low-temperature curing, and can provide insulating films (e.g., electrically insulating films, such as (for example) cured films) with low dielectric loss factors and excellent sensitivity properties.

[0085] For example, L1 can be represented by chemical formula 4.

[0086] Chemical Formula 4

[0087]

[0088] In chemical formula 4,

[0089] L5 and L8 are each independently a substituted or unsubstituted C1 to C20 alkylene group, and

[0090] L6 and L7 are each independently substituted or unsubstituted C6 to C20 arylene groups.

[0091] For example, dihydro compounds may also include compounds represented by the chemical formula D.

[0092] Chemical formula D

[0093]

[0094] In chemical formula D,

[0095] L2 is a single bond (e.g., a monocovalent bond), *-O-*, *-S-*, *-C≡C-*, *-C(=O)-*, *-NR0-* (where R0 is a substituted or unsubstituted C1 to C10 alkyl group), a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C6 to C20 arylene group, a substituted or unsubstituted C2 to C20 heterocyclic linking group, or a combination thereof.

[0096] For example, if L2 is *-C≡C-* (e.g., when L2 is *-C≡C-*), the heat resistance, adhesive strength, and reliability of the insulating film (cured film) can be further improved.

[0097] For example, a compound represented by chemical formula D may include a compound represented by chemical formula D-1, a compound represented by chemical formula D-2, or a combination thereof.

[0098] Chemical formula D-1

[0099]

[0100] Chemical formula D-2

[0101]

[0102] In chemical formula D-1,

[0103] L9 is *-O-*, *-S-*, *-C≡C-*, *-C(=O)-*, *-NR0-* (where R0 is a substituted or unsubstituted C1 to C10 alkyl group), a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C6 to C20 arylene group, a substituted or unsubstituted C2 to C20 heterocyclic linking group, or a combination thereof.

[0104] For example, a compound represented by the chemical formula D-1 can be represented by the chemical formula D-1-1 or the chemical formula D-1-2.

[0105] Chemical formula D-1-1

[0106]

[0107] Chemical formula D-1-2

[0108]

[0109] For example, diamine compounds may include compounds represented by the chemical formula E.

[0110] Chemical formula E

[0111]

[0112] In chemical formula E,

[0113] L3 is *-O-*, *-S-*, *-C≡C-*, *-C(=O)-*, *-NR0-* (where R0 is a substituted or unsubstituted C1 to C10 alkyl group), or a combination thereof.

[0114] For example, diamine compounds may also include compounds represented by the chemical formula F.

[0115] Chemical formula F

[0116]

[0117] In chemical formula F,

[0118] R6 is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group.

[0119] L10 is a substituted or unsubstituted C6 to C20 arylene or a substituted or unsubstituted divalent fused ring, and

[0120] Divalent fused rings are represented by the chemical formula G.

[0121] Chemical formula G

[0122]

[0123] In the chemical formula G,

[0124] R7 is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group.

[0125] If the diamine compound contains a compound represented by chemical formula E and / or a compound represented by chemical formula F (e.g., when the diamine compound contains a compound represented by chemical formula E and / or a compound represented by chemical formula F), the dielectric loss factor can be appropriately or desirablely reduced. Furthermore, the compound represented by chemical formula E and the compound represented by chemical formula F can be contained in a molar ratio of about 3:7 to about 7:3 (e.g., about 50:50), in which case the dielectric loss factor can be significantly reduced.

[0126] For example, a compound represented by the chemical formula F may include a compound represented by the chemical formula F-1, a compound represented by the chemical formula F-2, or a combination thereof.

[0127] Chemical formula F-1

[0128]

[0129] Chemical formula F-2

[0130]

[0131] For example, a polymer containing a structural unit represented by chemical formula 2 can be a polymer in which a diamine hydride compound and a diamine compound are polymerized in a molar ratio of about 30:70 to about 70:30 (e.g., about 50:50).

[0132] The weight average molecular weight (Mw) of alkali-soluble resins comprising polymers containing structural units represented by Formula 1 and polymers containing structural units represented by Formula 2 can be from about 3,000 g / mol to about 300,000 g / mol. If the weight average molecular weight of the alkali-soluble resin is within the above range (e.g., when the weight average molecular weight of the alkali-soluble resin is within the above range), suitable or sufficient physical properties can be obtained, and the solubility in organic solvents is improved, thereby facilitating processing.

[0133] (B) Photopolymerizable compounds

[0134] The photosensitive resin composition according to some exemplary embodiments may further comprise a photopolymerizable compound. The photopolymerizable compound may be a single compound or a mixture of two different compounds.

[0135] Photopolymerizable compounds may be compounds containing at least two functional groups represented by chemical formula 5.

[0136] Chemical formula 5

[0137]

[0138] In chemical formula 5,

[0139] R8 is a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group, and

[0140] L11 is a single bond (e.g., a monocovalent bond) or a substituted or unsubstituted C1 to C10 alkylene group.

[0141] For example, a compound containing at least two functional groups represented by Formula 5 may contain two to six functional groups represented by Formula 5. In embodiments, suitable or sufficient polymerization may be induced during exposure in the patterning process to form a pattern with excellent heat resistance, light resistance, and chemical resistance.

[0142] For example, a compound containing at least two functional groups represented by chemical formula 5 can be a compound represented by any of chemical formulas 6 to 8, but is not limited thereto.

[0143] Chemical Formula 6

[0144]

[0145] Chemical Formula 7

[0146]

[0147] Chemical Formula 8

[0148]

[0149] In chemical formulas 6 to 8

[0150] p, q, r, s, and t are each an independent integer from 1 to 10.

[0151] If the photopolymerizable compound is a mixture of two different compounds (e.g., when the photopolymerizable compound is a mixture of two different compounds), the other of the two compounds may be a monofunctional or polyfunctional ester compound of (meth)acrylic acid having at least one ethylenically unsaturated double bond.

[0152] Monofunctional or polyfunctional ester compounds of (meth)acrylic acid having at least one olefinic unsaturated double bond can be, for example, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, etc. Pentaerythritol tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy(meth)acrylate, ethylene glycol monomethyl ether(meth)acrylate, trimethylolpropane tri(meth)acrylate, tri(meth)acryloyloxyethyl phosphate, phenolic epoxy(meth)acrylate, or combinations thereof.

[0153] Non-limiting examples of commercially available monofunctional or polyfunctional ester compounds of (meth)acrylic acid having at least one olefinic unsaturated double bond are as follows. Examples of monofunctional (meth)acrylic esters may include Aronix. and (Toagosei Chemistry Industry Co., Ltd.); KAYARAD and (Nippon Kayaku Co., Ltd.) and (Osaka Organic Chemical Ind., Ltd.) and similar products. Examples of difunctional (meth)acrylates may include Yarrowis. and (Dong-A Synthetic Chemical Co., Ltd.), Kayara and (Nippon Kayaku Co., Ltd.) (Osaka Organic Chemicals Co., Ltd.) and similar products. Examples of trifunctional (meth)acrylates may include Yarrowis. and (Dong-A Synthetic Chemical Co., Ltd.), Kayara Kayalade DPCA- Kayalade Kayalade and Kayalade (Nippon Kayaku Co., Ltd.) and (Osaka Organic Chemicals Co., Ltd.) and similar products. These photopolymerizable compounds can be used alone or as a mixture of two or more.

[0154] Photopolymerizable compounds can be used after treatment with acid anhydrides to provide better developability.

[0155] Based on 100 parts by weight of resin, the photopolymerizable compound may be included in an amount of about 5 parts by weight to about 20 parts by weight, or for example, about 7 parts by weight to about 15 parts by weight. If the photopolymerizable compound is included within the above range, curing occurs properly or sufficiently, with excellent reliability, improved heat resistance, light resistance and chemical resistance of the pattern, and improved resolution and adhesion.

[0156] (C) Photoinitiator

[0157] The photosensitive resin composition according to some exemplary embodiments may further include a photoinitiator.

[0158] For example, a photoinitiator may be included in the total amount of the photosensitive resin composition, from about 2% to about 5% by weight, or for example, from about 2% to about 4% by weight. If a photoinitiator is included within the above range (e.g., when a photoinitiator is included within the above range), the dielectric loss can be maintained at a low level without reducing the sensitivity characteristics. Even if the alkali-soluble resin contains a polymer containing a structural unit represented by Formula 1 and a polymer containing a structural unit represented by Formula 2 in a weight ratio of about 1:1 to about 1:2, it may be difficult to maintain excellent sensitivity characteristics despite low dielectric loss if a photoinitiator is not included within the above range.

[0159] Photoinitiators may be acetophenone compounds, benzophenone compounds, thioxanone compounds, benzoin compounds, triazine compounds, oxime compounds and / or similar compounds.

[0160] Examples of acetophenone compounds include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylacetophenone, p-tert-butyltrichloroacetophenone, p-tert-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinylprop-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-but-1-one, and the like.

[0161] Examples of benzophenone compounds include benzoyl benzoate, benzoyl benzoate, methyl benzoate, 4-phenylbenzophenone, hydroxybenzophenone, benzoyl acrylate, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, and the like.

[0162] Examples of thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone and the like.

[0163] Examples of benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, and the like.

[0164] Examples of triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, and 2-(p-tolyl)-4,6-bis(trichloromethyl)-s- -Triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphthyl-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthyl-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-piperyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine and the like.

[0165] Examples of oxime compounds may include O-acyloxime compounds, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]acetone, O-ethoxycarbonyl-α-oxoamino-1-phenylprop-1-one, and similar compounds. Specific examples of O-acyloxime compounds may include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butane-1-one, 1-(4-phenylthiophenyl)-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylthiophenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylthiophenyl)-octane-1-one-oxime-O-acetate, 1-(4-phenylthiophenyl)-butane-1-one-oxime-O-acetate, and the like.

[0166] In addition to the compounds mentioned above, photoinitiators may also include carbazole compounds, diketone compounds, sulfonium borate compounds, diazo compounds, imidazole compounds, biimidazole compounds, and fluorene compounds.

[0167] Based on 100 parts by weight of resin, a photopolymerization initiator may be included in an amount of about 3 parts by weight to about 20 parts by weight (e.g., about 3 parts by weight to about 10 parts by weight, or for example, about 4 parts by weight to about 9 parts by weight). If a photoinitiator is included within the above range (e.g., when a photoinitiator is included within the above range), as described above, photopolymerization occurs appropriately or sufficiently, thereby preventing or reducing the reduction of sensitivity characteristics and increasing transmittance (e.g., data transmittance).

[0168] (D) Solvent

[0169] The solvent can be a material that is compatible with alkali-soluble resins, photopolymerizable compounds, and photoinitiators but does not react.

[0170] Examples of solvents may include: alcohols, such as methanol and ethanol; ethers, such as dichloroethyl ether, n-butyl ether, diisopentyl ether, methyl phenyl ether, tetrahydrofuran, etc.; glycol ethers, such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol dimethyl ether, etc.; cellolytic acetates, such as methyl cellolytic acetate, ethyl cellolytic acetate, diethyl cellolytic acetate, etc.; carbitol, such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, etc.; propylene glycol alkyl ether acetates. Examples of alkyl esters include propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons, such as toluene and xylene; ketones, such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-pentanone, and 2-heptanone; saturated aliphatic monocarboxylic acid alkyl esters, such as ethyl acetate, n-butyl acetate, and isobutyl acetate; lactic acid esters, such as methyl lactate and ethyl lactate; alkyl glycolic acid esters, such as methyl oxyacetate, ethyl oxyacetate, and butyl acetate; and alkyl alkoxyacetate esters, such as methoxyethyl oxyacetate. Alkyl esters, such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.; alkyl 3-oxypropionic acids, such as methyl 3-oxypropionate, ethyl 3-oxypropionate, etc.; alkyl 3-alkoxypropionic acids, such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, etc.; alkyl 2-oxypropionic acids, such as methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, etc.; alkyl 2-alkoxypropionic acids, such as methyl 2-methoxypropionate, alkyl 2-methoxypropionate, alkyl 2-propionate, etc. Ethyl ester, ethyl 2-ethoxypropionate, methyl 2-ethoxypropionate, etc.; 2-oxy-2-methylpropionate, such as methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, etc.; monooxymonocarboxylic alkyl esters of 2-alkoxy-2-methylalkylpropionates, such as methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, etc.; esters, such as 2-hydroxyethylpropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutyrate, etc.; keto esters, such as ethyl pyruvate, etc. Alternatively, high-boiling-point solvents can be used, such as N-methylformamide, N,N-dimethylformamide, N-methylformaniline, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, hexanoic acid, octanoic acid, 1-octanol, 1-nonanol, benzyl alcohol, methyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, methyl 3-benzoate, ethylene carbonate, propylene carbonate, phenyl acetate solvent, etc.

[0171] Based on 100 parts by weight of resin, the solvent may be included in an amount of about 100 to about 500 parts by weight. If the solvent is included within the above range, the photosensitive resin composition has a suitable or appropriate viscosity, thereby producing excellent processability in the case of manufacturing a photosensitive resin layer (e.g., when manufacturing a photosensitive resin layer).

[0172] (E) Other additives

[0173] The photosensitive resin compositions according to some exemplary embodiments may also contain other additives.

[0174] The photosensitive resin composition may contain additives (e.g., diacids (e.g., malonic acid), alkanolamines (e.g., 3-amino-1,2-propanediol), photosensitizers, leveling agents, free radical scavengers, silane coupling agents, surfactants, organic acids, epoxy compounds, thermal latent acid generators, development control agents, curing agents, or combinations thereof) to prevent or reduce the occurrence, likelihood, or extent of stains and / or spots during coating, achieve leveling, and / or prevent or reduce the formation of residues due to non-development. The amount of these additives can be readily adjusted according to suitable or desired physical properties.

[0175] For example, according to some exemplary embodiments, organic acids can improve the electrical properties of photosensitive resin compositions, thereby ultimately helping to reduce dielectric constant and dielectric loss.

[0176] For example, organic acids can include citric acid. Citric acid can play a role in improving the ionic conductivity of electrolyte systems, which can affect electrical properties. For instance, if citric acid is doped into alginate-based solid biopolymer electrolytes (e.g., when citric acid is doped into alginate-based solid biopolymer electrolytes), the electrolyte exhibits non-Debye behavior, which can be analyzed by the complex dielectric constant (ε*) and complex electrical modulus (M*). This result indicates that citric acid induces anomalous dielectric behavior in systems containing citric acid, and that if such citric acid is added to a photosensitive resin composition, it can affect its dielectric properties through chemical interactions and structural changes in the resin, ultimately contributing to a reduction in dielectric constant and dielectric loss.

[0177] For example, silane coupling agents may have reactive substituents (e.g., vinyl, carboxyl, methacryloyloxy, isocyanate, or epoxy) to improve adhesion to the substrate and have a structure different from that of silane compounds.

[0178] Examples of silane-based coupling agents may include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, etc. These silane-based coupling agents may be used alone or in mixtures of two or more.

[0179] Based on 100 parts by weight of the photosensitive resin composition, it may contain about 0.01 parts by weight to about 10 parts by weight of a silane coupling agent. If a silane coupling agent is included within the above range, the adhesion, storage properties, etc., are improved.

[0180] For example, a surfactant is added to prevent or reduce film thickness inhomogeneity and / or improve developability, and the surfactant may include fluorinated surfactants and / or silicone surfactants.

[0181] Examples of fluorinated surfactants include commercially available fluorinated surfactants, such as those from BM Chemicals Inc. and etc.; MEGAFACE F from Dainippon Ink Kagaku Kogyo Co., Ltd. MEGAFACE F MEGAFACE F MEGAFACE F and MEGAFACE F etc.; Florard of Sumitomo 3M Co., Ltd. FULORAD FULORAD and FULORAD etc.; SURFLON of Asahi Glass Co., Ltd. SURFLON SURFLON SURFLON SURFLON etc.; and Toray Silicone Co., Ltd. and wait.

[0182] Silicone surfactants can be commercially available silicone surfactants, such as BYK-307, BYK-333, BYK-361N, BYK-051, BYK-052, BYK-053, BYK-067A, BYK-077, BYK-301, BYK-322, BYK-325, and BYK-378 from BYK Chem.

[0183] Based on 100 parts by weight of the photosensitive resin composition, a surfactant may be used in an amount from about 0.001 parts by weight to about 5 parts by weight. If a surfactant is included within the above range, coating uniformity can be ensured, contamination can be prevented (or not prevented or substantially prevented), and wettability on indium tin oxide (ITO) substrates and / or glass substrates, Si wafers and / or SiNx wafers and / or Cu substrates can be improved.

[0184] In the embodiments, the photosensitive resin composition further includes an epoxy compound to improve adhesion to the substrate, etc. Examples of epoxy compounds may include phenolic epoxy compounds, tetramethylbiphenyl epoxy compounds, bisphenol A epoxy compounds, alicyclic epoxy compounds, or combinations thereof.

[0185] Based on 100 parts by weight of the resin composition, an epoxy compound may be used in amounts from about 0.01 parts by weight to about 5 parts by weight. If an epoxy compound is included within the above range (e.g., when an epoxy compound is included within the above range), storage properties, adhesive strength, and other properties may be improved.

[0186] In the embodiments, the photosensitive resin composition may also contain a heat-potentially acid-producing agent. Examples of heat-potentially acid-producing agents may include: aryl sulfonic acids, such as p-toluenesulfonic acid and benzenesulfonic acid; perfluoroalkyl sulfonic acids, such as trifluoromethanesulfonic acid, trifluorobutyric acid and / or the like; alkyl sulfonic acids, such as methanesulfonic acid, ethanesulfonic acid, butyric acid and / or the like; or combinations thereof, but are not limited thereto.

[0187] In addition, unless other additives would degrade the properties of the photosensitive resin composition, the photosensitive resin composition may contain other additives, such as antioxidants, stabilizers, etc., in a set or predetermined amount.

[0188] Some exemplary embodiments provide a photosensitive resin layer, such as a semiconductor redistribution layer insulating film (e.g., a semiconductor redistribution layer electrical insulating film) manufactured by exposing, developing and curing the above-described photosensitive resin composition.

[0189] The method for manufacturing the photosensitive resin layer is as follows.

[0190] (1) Coating and film formation

[0191] A photosensitive resin composition is coated onto a substrate (e.g., a glass substrate and / or ITO substrate, Si wafer and / or SiNx wafer, Cu substrate, etc.) that has been pretreated to a suitable or desired thickness using spin coating and / or slot coating, roller coating, screen printing, coating machine and / or similar methods, and then heated at about 70°C to about 150°C for about 1 minute to 10 minutes to remove the solvent, thereby forming a film.

[0192] (2) Exposure

[0193] After providing a mask to form the necessary or desired pattern on the obtained photosensitive resin layer, exposure is performed by irradiation with photochemical rays of 200 nm to 500 nm. As the light source for irradiation, low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halide lamps, argon lasers, etc., can be used, and in some cases, X-rays, electron beams, etc., can be used.

[0194] The exposure dose varies depending on the type (or species) of the components in the composition, the amount of mixing, and the dry film thickness, but if a high-pressure mercury lamp is used (e.g., when using a high-pressure mercury lamp), the exposure dose is less than 500 mJ / cm2 (based on a 365 nm sensor).

[0195] (3) Development

[0196] In the development method, after the exposure step, an alkaline aqueous solution or organic solvent is used as a developer to dissolve and remove unwanted or undesirable parts, leaving only the exposed parts to form a pattern.

[0197] (4) Post-processing

[0198] A post-heating process is employed to obtain patterns that exhibit excellent heat resistance, lightfastness, adhesion, crack resistance, chemical resistance, high strength, and storage stability of the image pattern obtained through development in the aforementioned process. For example, after development, the pattern may be heated in an oven at approximately 200°C to approximately 400°C under a nitrogen atmosphere for 1 hour or more.

[0199] Some exemplary embodiments provide an electronic device that includes a photosensitive resin layer (e.g., a semiconductor redistribution layer insulating film, such as, for example, a semiconductor redistribution layer electrical insulating film).

[0200] In the following, embodiments of the present disclosure are described in more detail with reference to examples. However, the following examples are merely examples of the present disclosure, and the present disclosure is not limited to the following examples.

[0201] Example

[0202] Resin Synthesis

[0203] Synthesis example 1

[0204] While passing nitrogen gas through a four-necked flask equipped with a stirrer, temperature controller, nitrogen injection device, and condenser, 0.58 moles of a dianhydride monomer represented by Formula A were added to 600 g of γ-butyrolactone (GBL). Then, 1.22 moles of 2-hydroxyethyl methacrylate (HEMA) were added, and while stirring the mixture at room temperature, 1.16 moles of pyridine were added to obtain a reaction mixture. The reaction mixture was reacted at room temperature for 16 hours, then cooled to -10°C, and a solution prepared by dissolving 1.17 moles of dicyclohexylcarbodiimide (DCC) and 250 g of GBL was added dropwise over 30 minutes. After further stirring the mixture for 5 minutes, a solution of 0.54 moles of a diamine monomer represented by Formula B and 300 g of GBL was added over 40 minutes, and then stirred for another 2 hours. After reacting for 1 hour at room temperature, 30 g of ethanol was added and the mixture was stirred for 1 hour. Subsequently, GBL was added to the reaction solution to achieve an 18% solids content, and then added to 3 liters of ethanol to obtain a precipitate. The polymer was separated from it by filtration, dissolved in 1.5 liters of tetrahydrofuran (THF), and then added dropwise to 30 liters of water to form a precipitate. The precipitate was separated by filtration and vacuum dried. A polyimide precursor resin (polyamide ester resin) containing structural units represented by chemical formula C was prepared by drying under reduced pressure at 50°C for 24 hours or more. (Chemical formula A and chemical formula B were polymerized in a 1:1 molar ratio).

[0205] Chemical formula A

[0206]

[0207] Chemical formula B

[0208]

[0209] Chemical formula C

[0210]

[0211] Synthesis example 2

[0212] MIR-3000 (Nippon Kayaku Co., Ltd.)

[0213] Preparation of photosensitive resin compositions

[0214] Examples 1 to 7 and Comparative Examples 1 to 6

[0215] Each photosensitive resin composition was prepared according to the compositions shown in Table 1. Specifically, an alkali-soluble resin was mixed with a photopolymerizable compound, and a photoinitiator, photosensitizer, free radical scavenger, silane coupling agent, organic acid, and solvent were added and thoroughly stirred. The mixture was then filtered through a 0.45 μm polypropylene resin filter to obtain a negative (or negative-type) photosensitive resin composition.

[0216] Table 1

[0217] Unit: weight %

[0218]

[0219] Alkali-soluble resin 1: The resin of Synthesis Example 1

[0220] Alkali-soluble resin 2: The resin of Synthesis Example 2

[0221] Photopolymerizable compound: Tetraethylene dimethacrylate (TCI)

[0222] Photoinitiator: PBG-450 (Changzhou Tronly)

[0223] Photosensitizer: N-phenyldiethanolamine (Morin)

[0224] Free radical scavenger: CX-1790 (Solvay)

[0225] Silane-based coupling agent: KBM-403 (Shin-Etsu Corporation)

[0226] Organic acid: Citric acid (Samchun Chemicals Co., Ltd., South Korea)

[0227] Solvent 1: γ-Butyrolactone (DAEJUNG, South Korea)

[0228] Solvent 2: Dimethyl sulfoxide (Taejeong Corporation, South Korea)

[0229] Evaluate

[0230] The photosensitive resin compositions according to Examples 1 to 7 and Comparative Examples 1 to 6 were coated onto 8-inch Cu wafers and baked at 100°C for 4 minutes to obtain films with a thickness of 7 micrometers each. The films were then exposed using a Nikon i10C and developed in a puddle-type (or similar) liquid bath with cyclopentanone for 20 seconds to form a 20 μm hole pattern. The developed wafers were then cured in a nitrogen atmosphere at 220°C for 2 hours.

[0231] Eop assessment: The exposure dose required to form a 20 μm hole was confirmed using critical dimension-scanning electron microscopy (CD-SEM), and the results are shown in Table 2.

[0232] Evaluation of dielectric loss factor (Df): The fabricated film (cured film) was dried at 130°C for 30 minutes and then aged for 24 hours in a constant temperature and humidity chamber maintained at 23°C and 50% relative humidity as a pretreatment. The dielectric properties were then measured at a frequency of 10 GHz using Keysight's ENA with a split post dielectric resonator (SPDR) measurement method, and the results are shown in Table 2.

[0233] Reliability assessment: The manufactured film (cured film) was subjected to 2000 thermal cycles (-55°C to 125°C) as a reliability condition. Then, field emission-scanning electron microscopy (FE-SEM) was used to examine whether cracks were formed between PI and Cu, and the results are shown in Table 2.

[0234] Table 2

[0235] Eop (milliseconds) Df(10GHz) reliability Example 1 244 0.009 good Example 2 215 0.006 good Example 3 178 0.005 good Example 4 456 0.006 good Example 5 579 0.006 good Example 6 358 0.006 good Example 7 96 0.006 good Comparative Example 1 621 0.021 good Comparative Example 2 151 0.033 bad Comparative Example 3 512 0.017 good Comparative Example 4 433 0.014 good Comparative Example 5 312 0.012 good Comparative Example 6 208 0.039 bad

[0236] Table 2 shows that the photosensitive resin compositions according to some exemplary embodiments have low dielectric loss factors, as well as excellent sensitivity characteristics and reliability, and are therefore suitable for use as compositions for semiconductor redistribution layers.

[0237] Although the subject matter of this disclosure has been set forth in conjunction with exemplary embodiments now regarded as practical, it should be understood that this disclosure is not limited to the disclosed embodiments, but rather, it is intended to cover various suitable modifications and equivalent arrangements included within the spirit and scope of the appended claims and their equivalents. Therefore, the above embodiments should be understood as examples and not as limiting this disclosure in any way.

Claims

1. A photosensitive resin composition comprising: Alkali-soluble resins; Photopolymerizable compounds; Photoinitiators; and Solvent, The alkali-soluble resin comprises a polymer containing structural units represented by Formula 1 and a polymer containing structural units represented by Formula 2, and comprises the polymer containing the structural units represented by Formula 1 and the polymer containing the structural units represented by Formula 2 in a weight ratio of 1:1 to 1:

2. Chemical Formula 1 Chemical formula 2 Among them, in chemical formula 1 and chemical formula 2, L1 is a substituted or unsubstituted C1 to C20 alkylene, a substituted or unsubstituted C6 to C20 arylene, or a combination thereof. L2 is a single bond, *-O-*, *-S-*, *-C≡C-*, *-C(=O)-*, *-NR0-*, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C6 to C20 aryl group, a substituted or unsubstituted C2 to C20 heterocyclic linking group, or a combination thereof, wherein R0 is a substituted or unsubstituted C1 to C10 alkyl group. L3 is *-O-*, *-S-*, *-C≡C-*, *-C(=O)-*, *-NR0-*, or a combination thereof, wherein R0 is a substituted or unsubstituted C1 to C10 alkyl group, and R1 and R2 are each independently represented by the chemical formula R. Chemical formula R In the chemical formula R, R3 is a (meth)acrylate group, and L4 is a substituted or unsubstituted C1 to C20 alkylene group.

2. The photosensitive resin composition according to claim 1, wherein: The polymer comprising the structural unit represented by chemical formula 1 contains a functional group represented by chemical formula S at at least one of its two ends: Chemical formula S 3. The photosensitive resin composition according to claim 2, wherein: The polymer comprising the structural unit represented by chemical formula 1 contains a functional group represented by chemical formula S at one of its two ends, and the other end of the two ends is a hydrogen atom.

4. The photosensitive resin composition according to claim 1, wherein: The photoinitiator is contained in an amount of 2% to 5% by weight, based on the total amount of the photosensitive resin composition.

5. The photosensitive resin composition according to claim 1, wherein: The photosensitive resin composition comprises, Based on 100 parts by weight of the resin, From 5 parts by weight to 20 parts by weight of the aforementioned photopolymerizable compound, From 3 to 20 parts by weight of the photoinitiator, and From 100 parts by weight to 500 parts by weight of the solvent.

6. The photosensitive resin composition according to claim 1, wherein: The photosensitive resin composition further comprises a photosensitizer, a free radical scavenger, a silane coupling agent, an organic acid, or a combination thereof.

7. The photosensitive resin composition according to claim 1, wherein: The photosensitive resin composition is a negative photosensitive resin composition.

8. A photosensitive resin layer, manufactured using the photosensitive resin composition according to claim 1.

9. The photosensitive resin layer according to claim 8, wherein: The photosensitive resin layer is an insulating film for semiconductor redistribution layers.

10. A semiconductor device comprising the photosensitive resin layer as claimed in claim 8.

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