Whole-surface light-emitting intelligent card capable of collecting wireless energy

Abstract

The invention discloses a wireless energy acquisition full-surface light-emitting smart card, which belongs to the technical field of smart cards, and comprises an IC (integrated circuit) module for realizing data interaction; the LED module comprises an LED FPC (Flexible Printed Circuit) board, a plurality of LED light sources, a rectifying element and an energy storage element; the INLAY structure layer comprises an FPC board fixing layer, a light guide layer, an upper compensation layer and a lower compensation layer. According to the invention, large-area uniform light emission on the front side, synchronous light emission on the side edges, uniform brightness, strong visual impact force, improved visual effect, independent work of IC communication and LED light emission functions, no electromagnetic interference, prolonged communication distance, good function compatibility, strict compatibility with ISO / IEC 7810 standard size, direct application to existing card reading equipment, size standardization, and wide application prospect are realized. The manufacturing process is compatible with existing card manufacturing equipment, the yield is improved, the method is suitable for large-scale mass production, the production efficiency is high, a built-in battery is not needed, energy is obtained through a card reader electromagnetic field, the service life is long, and environmental protection and energy conservation are achieved.

Description

Technical Field

[0001] This invention belongs to the field of smart card technology, and in particular relates to a wireless energy harvesting all-surface light-emitting smart card. Background Technology

[0002] With the development of the Internet of Things and mobile payment, traditional magnetic stripe cards have been gradually replaced by smart cards. Currently, the widely used IC cards (also known as RFID cards or NFC cards) usually follow the ISO / IEC 7816 or ISO / IEC 14443 standards and achieve contactless data exchange through built-in chips and antennas.

[0003] In existing technologies, some smart cards use LED lights as status indicators, such as flashing to indicate successful card swiping. However, these products mostly adopt a "point light source" design, which can only light up a small area of ​​the card, resulting in limited visual performance and making it difficult to meet high-end customization needs.

[0004] Furthermore, existing smart cards with light-guiding structures are mostly limited to low-light borders or specific icon illumination, failing to achieve a large-area, highly uniform "surface illumination" effect. In addition, since the IC circuit and LED circuit share the same frequency antenna system, signal interference is easily caused, affecting communication reliability.

[0005] More importantly, existing luminescent cards generally suffer from the following problems: small luminescent area (generally less than 40%), unable to cover the entire visible surface; low optical efficiency, resulting in unclear viewing at a distance; complex structure, with poor interlayer matching leading to card bending and delamination; lack of effective electromagnetic isolation mechanism, causing mutual interference between IC and LED modules; and uncontrollable manufacturing process, resulting in low yield. Summary of the Invention

[0006] The purpose of this invention is to provide a wireless energy harvesting, all-surface luminescent smart card. It achieves uniform illumination over a large front area, with simultaneous side illumination, uniform brightness, strong visual impact, and enhanced visual effects. IC communication and LED illumination functions operate independently, eliminating electromagnetic interference, extending communication distance, and providing good functional compatibility. It strictly adheres to ISO / IEC standard dimensions, allowing direct application to existing card reading devices. The standardized dimensions and manufacturing process are compatible with existing card manufacturing equipment, improving yield and suitability for mass production. It boasts high production efficiency, eliminates the need for a built-in battery, harvests energy through the reader's electromagnetic field, and offers a long service life. It is also environmentally friendly and energy-saving, thus solving the aforementioned technical problems.

[0007] The technical solution of this invention to solve the above-mentioned technical problems is as follows: A wireless energy harvesting all-surface light-emitting smart card, comprising:

[0008] IC modules are used to enable data interaction;

[0009] LED modules include LEDFPC boards, multiple LED light sources, rectifier components, and energy storage components;

[0010] The INLAY structural layer includes an FPC board fixing layer, a light guide layer, an upper compensation layer, and a lower compensation layer;

[0011] The external packaging structure includes an upper printed layer, a lower printed layer, and an adhesive film.

[0012] The LED module obtains energy from the electromagnetic field of the card reader through the LED antenna, and drives multiple LED light sources to work after rectification; the light guide layer is made of transparent light guide material and has a reflective dot array to guide the light emitted from the side of the LED to the front or edge of the card, so as to achieve surface light emission of at least 85% of the area and side light emission of the four edges.

[0013] Preferably, the IC module includes an IC chip and an IC antenna. The IC antenna is a coil structure wound on the fixed layer of the FPC board, with an operating frequency range of 13.56MHz±0.7MHz, and supports the ISO / IEC 14443 standard protocol.

[0014] Preferably, the LED FPC board in the LED module has a thickness of 0.06mm, the LED height does not exceed 0.42mm, and the heights of the diodes and capacitors are both controlled below 0.42mm to ensure that the overall INLAY thickness is compatible with standard smart card dimensions.

[0015] Preferably, the LED module forms a closed-loop circuit, including an LED antenna, a rectifier diode and at least one LED connected in series, and multiple LEDs are connected in parallel to ensure brightness consistency; the energy storage element is a capacitor connected in parallel across the LED antenna, used to adjust the resonant frequency and stabilize the voltage output.

[0016] Preferably, the LED module operates in the frequency range of 19MHz to 30MHz, which is isolated from the operating frequency range of the IC module to avoid electromagnetic interference when the two are sensing simultaneously.

[0017] Preferably, the light guide layer is made of transparent PC or acrylic material with a thickness of 0.17mm to 0.25mm, and the surface is distributed with microstructured reflective dots of adjustable density. The optical design is optimized according to the LED layout to achieve uniform brightness distribution in the light distribution area.

[0018] Preferably, the light guide layer is provided with component clearance holes, including LED clearance holes, capacitor clearance holes and diode clearance holes, to accommodate the corresponding electronic components and prevent damage during the lamination process.

[0019] Preferably, in the INLAY structure, the FPC board fixing layer uses white PVC, PC or PETG material as the substrate, the IC antenna or LED antenna is wound onto its surface by ultrasonic welding, and the chip or LED FPC board is electrically connected by thermo-press welding or laser welding.

[0020] Preferably, the upper printing layer is made of a light-transmitting material, with some areas screen-printed with black patterns for light blocking, and the non-light-blocking areas forming light-emitting windows; the lower printing layer has a full-page black ink print on the front to block light leakage from the back, and a white background and other colored graphics are printed on the back. Attached Figure Description

[0021] The advantages of the present invention, both above and / or other aspects, will become clearer and more readily understood through the following detailed description taken in conjunction with the accompanying drawings, which are merely illustrative and do not limit the invention, wherein:

[0022] Figure 1 This is a schematic diagram of a smart card circuit according to an embodiment of the present invention;

[0023] Figure 2 This is a circuit schematic diagram of an LED module according to an embodiment of the present invention;

[0024] Figure 3 This is a flowchart illustrating the manufacturing process of a smart card according to an embodiment of the present invention.

[0025] In the attached diagram, the components represented by each number are as follows:

[0026] 1. IC chip, 2. IC antenna, 3. LED antenna, 4. LEDFPC board, 5. LED light source, 6. Diode, 7. Capacitor. Detailed Implementation

[0027] In the following text, reference will be made to the appendix. Figure 1-3 This invention describes an embodiment of a wireless energy harvesting all-surface light-emitting smart card.

[0028] The embodiments described herein are specific implementations of the present invention, used to illustrate the concept of the invention, and are illustrative and exemplary, and should not be construed as limiting the implementation or scope of the invention. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.

[0029] The accompanying drawings in this specification are schematic diagrams to aid in illustrating the concept of the invention, and schematically show the shapes of the various parts and their interrelationships. Please note that, in order to clearly demonstrate the structure of the components in the embodiments of the invention, the drawings are not drawn to the same scale. The same reference numerals are used to indicate the same parts.

[0030] Example 1:

[0031] A wireless energy harvesting all-surface light-emitting smart card, comprising:

[0032] IC modules are used to enable data interaction;

[0033] LED module, including LED FPC board, multiple LED light sources, rectifier components and energy storage components;

[0034] The INLAY structural layer includes an FPC board fixing layer, a light guide layer, an upper compensation layer, and a lower compensation layer;

[0035] The external packaging structure includes an upper printed layer, a lower printed layer, and an adhesive film.

[0036] The LED module obtains energy from the electromagnetic field of the card reader through the LED antenna 3, and drives multiple LED light sources 5 to work after rectification; the light guide layer is made of transparent light guide material and has a reflective dot array to guide the light emitted from the side of the LED to the front or edge of the card, so as to achieve surface light emission of at least 85% of the area and side light emission of the four edges.

[0037] The IC module includes an IC chip 1 and an IC antenna 2. The IC antenna 2 is a coil structure wound on the fixing layer of the FPC board. The IC chip adopts NXP MIFARE Classic 1KMF1S50YYX / V1 and supports the ISO / IEC 14443A protocol. The IC antenna is a 12-turn coil wound with φ0.1mm enameled copper wire, with a resonant capacitance of 180pF and an operating frequency of 13.56MHz. The antenna is fixed to a 0.2mm thick white PVC substrate by ultrasonic welding.

[0038] The LED FPC board in the LED module uses a 0.06mm thick polyimide substrate, with a 35μm copper foil covering the surface;

[0039] Four 0603 side-emitting LEDs with a wavelength of 550nm and a brightness of 120mcd are selected and arranged in parallel at the four corners of the card.

[0040] The rectifier element is a 1N4148W high-speed diode, and the energy storage capacitor is a 100nF multilayer ceramic capacitor.

[0041] The LED antenna is an 8-turn coil wound with φ0.1mm enameled copper wire, with an operating frequency of 25MHz. The distance between the LED antenna and the IC antenna is ≥5mm. The height of the LED does not exceed 0.42mm. The heights of diode 6 and capacitor 7 are both controlled below 0.42mm to ensure that the overall INLAY thickness is compatible with standard smart card dimensions.

[0042] The LED module forms a closed-loop circuit, including an LED antenna 3, a rectifier diode 6 and at least one LED connected in series, and multiple LEDs are connected in parallel to ensure brightness consistency; the energy storage element is a capacitor 7 connected in parallel across the LED antenna 3, used to adjust the resonant frequency and stabilize the voltage output.

[0043] The LED module operates in the frequency range of 19MHz to 30MHz, which is isolated from the operating frequency range of the IC module to avoid electromagnetic interference when the two are sensing simultaneously.

[0044] The light guide layer is made of transparent PC or acrylic material. The light guide layer uses 0.2mm thick transparent PC material, and the surface is laser-engraved to form a hemispherical reflective dot array with a diameter of 100μm and a spacing of 200μm.

[0045] The light guide layer has φ1.2mm LED clearance holes, φ0.8mm capacitor clearance holes, and φ0.6mm diode clearance holes.

[0046] Both the upper and lower compensation layers are made of 0.1mm thick white PVC material to adjust the overall thickness. The optical design is optimized according to the LED layout to achieve uniform brightness distribution in the uniform light distribution area.

[0047] The light guide layer is provided with component clearance holes, including LED clearance holes, capacitor clearance holes 7 and diode clearance holes 6, which are used to accommodate the corresponding electronic components and prevent damage during the lamination process.

[0048] In the INLAY structure, the FPC board fixing layer uses white PVC, PC or PETG material as the substrate, the IC antenna 2 or LED antenna 3 is wound on its surface by ultrasonic welding, and the chip or LED FPC board is electrically connected by thermo-press welding or laser welding.

[0049] The upper printing layer is made of a light-transmitting material, with some areas screen-printed with black patterns to block light, and the non-shielded areas forming light-emitting windows; the lower printing layer has a full-page black ink print on the front to shield light from the back, and a white background and other colored graphics are printed on the back.

[0050] External packaging structure design:

[0051] The upper printing layer uses 0.1mm thick transparent PETG material, with black ink screen printing in some areas to form the logo pattern, and the non-light-blocking areas are light-emitting windows;

[0052] The lower printing layer uses 0.1mm thick white PVC material, with black ink printed all over the front and colorful promotional patterns printed on the back;

[0053] The encapsulating film uses 0.05mm thick low-temperature hot melt adhesive, with a lamination temperature of 120℃ and a pressure of 15 bar.

[0054] The method for manufacturing this wireless energy harvesting all-surface light-emitting smart card includes the following steps:

[0055] S1 uses ultrasonic energy to wind IC antenna 2 and / or LED antenna 3 on the FPC board fixing layer;

[0056] S2 machining chip mounting holes and LED FPC board positioning holes;

[0057] S3 binds IC chip 1 and LED FPC board to their respective positions and completes the electrical connection through thermo-press welding or laser welding;

[0058] S4 superimposed light guide layer, upper compensation layer and lower compensation layer form a complete INLAY structure;

[0059] S5 has an upper and lower printed layer laminated on the top and bottom of the INLAY, respectively, with the upper printed layer having a selective light-transmitting area;

[0060] S6 uses single-sided low-temperature adhesive tape for final encapsulation, and then laminates to obtain the finished card.

[0061] The S7 performs optical testing and frequency calibration on the luminescent area to ensure full-surface luminescence and communication stability.

[0062] It should be noted that the present invention has improved visual effects: it achieves uniform light emission of ≥85% of the front area, synchronous light emission from the sides, brightness uniformity of ≥85%, and strong visual impact;

[0063] Good functional compatibility: IC communication and LED lighting functions work independently, with no electromagnetic interference and a communication distance of ≥5cm;

[0064] Standardized dimensions: Strictly compatible with ISO / IEC 7810 standard dimensions, and can be directly applied to existing card reader devices;

[0065] High production efficiency: The manufacturing process is compatible with existing card making equipment, with a yield rate of ≥95%, making it suitable for large-scale mass production;

[0066] Energy-saving and environmentally friendly: No built-in battery required, it obtains energy through the electromagnetic field of the card reader, has a long service life, and is green and environmentally friendly.

[0067] Example 2

[0068] A wireless energy harvesting all-surface light-emitting smart card, comprising:

[0069] IC modules are used to enable data interaction;

[0070] LED module, including LED FPC board, multiple LED light sources, rectifier components and energy storage components;

[0071] The INLAY structural layer includes an FPC board fixing layer, a light guide layer, an upper compensation layer, and a lower compensation layer;

[0072] The external packaging structure includes an upper printed layer, a lower printed layer, and an adhesive film.

[0073] The LED module obtains energy from the electromagnetic field of the card reader through the LED antenna 3, and drives multiple LED light sources 5 to work after rectification; the light guide layer is made of transparent light guide material and has a reflective dot array to guide the light emitted from the side of the LED to the front or edge of the card, so as to achieve surface light emission of at least 85% of the area and side light emission of the four edges.

[0074] The IC module includes an IC chip 1 and an IC antenna 2. The IC antenna 2 is a coil structure wound on the fixing layer of the FPC board. The IC chip adopts NXP MIFARE Classic 1KMF1S50YYX / V1 and supports the ISO / IEC 14443A protocol. The IC antenna is a 12-turn coil wound with φ0.1mm enameled copper wire, with a resonant capacitance of 180pF and an operating frequency of 13.56MHz. The antenna is fixed to a 0.2mm thick white PVC substrate by ultrasonic welding.

[0075] The LED FPC board in the LED module uses a 0.06mm thick polyimide substrate, with a 35μm copper foil covering the surface;

[0076] Four 0603 side-emitting LEDs with a wavelength of 550nm and a brightness of 120mcd are selected and arranged in parallel at the four corners of the card.

[0077] The rectifier element is a 1N4148W high-speed diode, and the energy storage capacitor is a 100nF multilayer ceramic capacitor.

[0078] The LED antenna is an 8-turn coil wound with φ0.1mm enameled copper wire, with an operating frequency of 25MHz. The distance between the LED antenna and the IC antenna is ≥5mm. The height of the LED does not exceed 0.42mm. The heights of diode 6 and capacitor 7 are both controlled below 0.42mm to ensure that the overall INLAY thickness is compatible with standard smart card dimensions.

[0079] The LED module forms a closed-loop circuit, including an LED antenna 3, a rectifier diode 6 and at least one LED connected in series, and multiple LEDs are connected in parallel to ensure brightness consistency; the energy storage element is a capacitor 7 connected in parallel across the LED antenna 3, used to adjust the resonant frequency and stabilize the voltage output.

[0080] The LED module operates in the frequency range of 19MHz to 30MHz, which is isolated from the operating frequency range of the IC module to avoid electromagnetic interference when the two are sensing simultaneously.

[0081] The light guide layer is made of transparent PC or acrylic material. The light guide layer uses 0.2mm thick transparent PC material, and the surface is laser-engraved to form a hemispherical reflective dot array with a diameter of 100μm and a spacing of 200μm.

[0082] The light guide layer has φ1.2mm LED clearance holes, φ0.8mm capacitor clearance holes, and φ0.6mm diode clearance holes.

[0083] Both the upper and lower compensation layers are made of 0.1mm thick white PVC material to adjust the overall thickness. The optical design is optimized according to the LED layout to achieve uniform brightness distribution in the uniform light distribution area.

[0084] The light guide layer is provided with component clearance holes, including LED clearance holes, capacitor clearance holes 7 and diode clearance holes 6, which are used to accommodate the corresponding electronic components and prevent damage during the lamination process.

[0085] In the INLAY structure, the FPC board fixing layer uses white PVC, PC or PETG material as the substrate, the IC antenna 2 or LED antenna 3 is wound on its surface by ultrasonic welding, and the chip or LED FPC board is electrically connected by thermo-press welding or laser welding.

[0086] The upper printing layer is made of a light-transmitting material, with some areas screen-printed with black patterns to block light, and the non-shielded areas forming light-emitting windows; the lower printing layer has a full-page black ink print on the front to shield light from the back, and a white background and other colored graphics are printed on the back.

[0087] External packaging structure design:

[0088] The upper printing layer uses 0.1mm thick transparent PETG material, with black ink screen printing in some areas to form the logo pattern, and the non-light-blocking areas are light-emitting windows;

[0089] The lower printing layer uses 0.1mm thick white PVC material, with black ink printed all over the front and colorful promotional patterns printed on the back;

[0090] The encapsulating film uses 0.05mm thick low-temperature hot melt adhesive, with a lamination temperature of 120℃ and a pressure of 15 bar.

[0091] A method for manufacturing a wireless energy harvesting all-surface light-emitting smart card includes the following steps:

[0092] (S1) Antenna winding:

[0093] S1.1 The IC antenna and LED antenna are wound on the FPC board fixing layer using an ultrasonic winding machine, and the winding tension is controlled at 50g±5g.

[0094] The S1.2 antenna tip is connected to the chip pad via thermocompression bonding at a temperature of 320°C for 1.5 seconds.

[0095] (S2) Chip bonding:

[0096] S2.1 uses a COGChip On Glass bonding device to fix the IC chip in the mounting hole with a bonding accuracy of ±0.02mm;

[0097] S2.2 uses ACFAnisotropic Conductive Film for electrical connection, with a curing temperature of 180℃ and a curing time of 10s.

[0098] (S3) INLAY lamination:

[0099] S3.1 The layers are stacked in the following order: lower compensation layer → FPC board fixing layer → light guide layer → upper compensation layer. The lamination temperature is 100℃, the pressure is 10 bar, and the time is 30s.

[0100] After lamination (S3.2), the card is punched to obtain a standard-sized INLAY card.

[0101] (S4) Printed Packaging:

[0102] S4.1 The upper printing layer is laminated on the front of the INLAY and the lower printing layer is laminated on the back, using a screen printing process;

[0103] S4.2 uses single-sided low-temperature tape film for encapsulation, with a lamination temperature of 120°C, a pressure of 15 bar, and a time of 60 seconds;

[0104] S4.3 finally punches out the finished card with a dimensional accuracy of ±0.05mm.

[0105] (S5) Testing and Calibration:

[0106] S5.1 The uniformity of luminous intensity is tested using an optical testing instrument, and the requirement is ≥85%;

[0107] S5.2 Use an RFID tester to test the communication distance, requiring ≥5cm;

[0108] S5.3 adjusts the resonant frequency of the LED antenna to ensure it is within the range of 19MHz to 30MHz.

[0109] In summary, this wireless energy harvesting all-surface luminescent smart card and its manufacturing process achieve uniform illumination over a large area on the front, synchronous illumination from the sides, uniform brightness, strong visual impact, and enhanced visual effects. The IC communication and LED illumination functions operate independently, eliminating electromagnetic interference, extending communication distance, and providing excellent functional compatibility. It strictly adheres to the ISO / IEC 7810 standard dimensions, allowing direct application to existing card reader devices. The standardized dimensions and manufacturing process are compatible with existing card manufacturing equipment, improving yield and suitability for mass production. It boasts high production efficiency, requires no built-in battery, obtains energy through the reader's electromagnetic field, has a long service life, and is environmentally friendly and energy-saving.

[0110] The technical features disclosed above are not limited to the combinations of the disclosed features with other features. Those skilled in the art can also make other combinations of the technical features according to the purpose of the invention to achieve the purpose of the invention.

Claims

1. A wireless energy harvesting all-surface light-emitting smart card, characterized in that, include: IC modules are used to enable data interaction; LED module, including LEDFPC board (4), multiple LED light sources (5), rectifier and energy storage components; The INLAY structural layer includes an FPC board fixing layer, a light guide layer, an upper compensation layer, and a lower compensation layer; The external packaging structure includes an upper printed layer, a lower printed layer, and an adhesive film. The LED module obtains energy from the electromagnetic field of the card reader through the LED antenna (3), and drives multiple LED light sources (5) to work after rectification; the light guide layer is made of transparent light guide material and has a reflective dot array to guide the light emitted from the side of the LED to the front or edge of the card, so as to achieve surface light emission of at least 85% of the area and side light emission of the four edges.

2. The all-surface luminescent smart card for wireless energy harvesting according to claim 1, characterized in that, The IC module includes an IC chip (1) and an IC antenna (2). The IC antenna (2) is a coil structure wound on the fixed layer of the FPC board, with a working frequency range of 13.56MHz±0.7MHz, and supports the ISO / IEC 14443 standard protocol.

3. A wireless energy harvesting all-surface light-emitting smart card according to claim 1, characterized in that, The LED FPC board in the LED module is 0.06mm thick, the LED height is no more than 0.42mm, and the heights of the diode (6) and capacitor (7) are both controlled below 0.42mm to ensure that the overall INLAY thickness is compatible with the standard smart card size.

4. A wireless energy harvesting all-surface luminescent smart card according to claim 1, characterized in that, The LED module forms a closed-loop circuit, including an LED antenna (3), a rectifier diode (6) and at least one LED connected in series. Multiple LEDs are connected in parallel to ensure brightness consistency. The energy storage element is a capacitor (7) connected in parallel across the LED antenna (3) to adjust the resonant frequency and stabilize the voltage output.

5. A wireless energy harvesting all-surface light-emitting smart card according to claim 1, characterized in that, The LED module operates in the frequency range of 19MHz to 30MHz, which is isolated from the operating frequency range of the IC module to avoid electromagnetic interference when the two are sensing simultaneously.

6. A wireless energy harvesting all-surface light-emitting smart card according to claim 1, characterized in that, The light guide layer is made of transparent PC or acrylic material with a thickness of 0.17mm to 0.25mm. The surface is distributed with microstructured reflective dots of adjustable density. The optical design is optimized according to the LED layout to achieve uniform brightness distribution in the light distribution area.

7. A wireless energy harvesting all-surface light-emitting smart card according to claim 6, characterized in that, The light guide layer is provided with component clearance holes, including LED clearance holes, capacitor (7) clearance holes and diode (6) clearance holes, which are used to accommodate the corresponding electronic components and prevent damage during the lamination process.

8. A wireless energy harvesting all-surface light-emitting smart card according to claim 1, characterized in that, In the INLAY structure, the FPC board fixing layer uses white PVC, PC or PETG material as the substrate, the IC antenna (2) or LED antenna (3) is wound on its surface by ultrasonic welding, and the chip or LED FPC board is electrically connected by thermo-press welding or laser welding.

9. A wireless energy harvesting all-surface light-emitting smart card according to claim 1, characterized in that, The upper printing layer is made of a light-transmitting material, with some areas screen-printed with black patterns to block light, and the non-shielded areas forming light-emitting windows; the lower printing layer has a full-page black ink print on the front to shield light from the back, and a white background and other colored graphics are printed on the back.

Images