Electronic component and electronic equipment

Abstract

The invention provides an electronic assembly and electronic equipment. The electronic assembly comprises a circuit board assembly and a cold plate. The circuit board assembly comprises a single board, a first heating device and a second heating device, wherein the first heating device and the second heating device are arranged on the single board. The cold plate comprises a liquid inlet and a liquid outlet, and the cooling port flows into the cold plate from the liquid inlet and flows out of the cold plate from the liquid outlet. The cold plate comprises a first cooling area and a second cooling area, and the second cooling area is closer to the liquid outlet relative to the first cooling area. Cooling liquid firstly flows through the first cooling area from the liquid inlet and then flows to the second cooling area, and the heat dissipation capacity of the first cooling area is higher than that of the second cooling area. The heating density of the first heating device is higher than that of the second heating device, so that the first heating device is in heat-conducting connection with the first cooling area, and the second heating device is in heat-conducting connection with the second cooling area. The heat dissipation capacity of the cold plate is reasonably utilized, the heat dissipation effect of the first heating device and the second heating device is improved, and energy consumption can be reduced.

Description

[0001] This application is a divisional application. The original application has the application number 202211291005.5 and the original application date is October 21, 2022. The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This application relates to the field of heat dissipation equipment technology, and more particularly to an electronic component and electronic device. Background Technology

[0003] With the vigorous development of new energy vehicles, the power of charging piles is also gradually increasing, and the charging module is the core component of the charging pile. At present, air cooling is still the mainstream heat dissipation architecture for charging modules. With the development of high-power charging modules, the heat dissipation requirements of charging modules are gradually increasing, and liquid cooling is one of the main development directions in the future.

[0004] Figure 1 This is a schematic diagram of a structure of an electronic component in the prior art. For example... Figure 1 As shown, in the prior art, electronic components include a circuit board assembly 1 and a cold plate 2. The circuit board assembly 1 includes a single board 11 and a heat-generating device 12, with the heat-generating device 12 disposed on the single board 11. The cold plate 2 has a liquid cooling cavity inside, where a liquid cooling medium flows. The cold plate 2 is thermally connected to the heat-generating device 12, allowing the liquid cooling medium to remove the heat generated by the heat-generating device 12, thus dissipating heat. Electronic components typically have multiple heat-generating devices 12, and a single cold plate 2 is used to dissipate heat from multiple heat-generating devices 12. However, in electronic components, the heat density of the multiple heat-generating devices 12 may differ, making targeted heat dissipation impossible, resulting in poor heat dissipation and potential waste of resources. Summary of the Invention

[0005] This application provides an electronic component and an electronic device. This solution makes reasonable use of the heat dissipation capacity of different areas of the cold plate, improves the heat dissipation effect of heat-generating devices, and can also save energy.

[0006] In a first aspect, this application provides an electronic component comprising a circuit board assembly and a cold plate. The circuit board assembly includes a single board, a first heating element, and a second heating element, both disposed on the single board. Specifically, the single board may have a circuit pattern, and the first and second heating elements are electrically connected to the circuit pattern. The cold plate includes an inlet and an outlet, with the coolant flowing into the liquid-cooled cavity of the cold plate from the inlet and then out of the cold plate from the outlet. Thus, the cold plate can be used to dissipate heat for the circuit board assembly. The cold plate includes a first cooling zone and a second cooling zone, with the second cooling zone closer to the outlet than the first cooling zone. That is, the coolant flows from the inlet through the first cooling zone first, and then to the second cooling zone, making the heat dissipation capacity of the first cooling zone stronger than that of the second cooling zone. The heat density of the first heating element is higher than that of the second heating element, causing the first heating element to be thermally connected to the first cooling zone, and the second heating element to be thermally connected to the second cooling zone. The first cooling zone is used to dissipate heat for the first heat-generating device, and the second cooling zone is used to dissipate heat for the second heat-generating device. This allows for the efficient use of the heat dissipation capacity of the cold plate, improving the heat dissipation effect of the first and second heat-generating devices, and also saving energy.

[0007] In the specific technical solution, the first cooling zone has multiple first heat dissipation fins to enhance its heat dissipation capacity; the second cooling zone has multiple second heat dissipation fins to enhance its heat dissipation capacity. The density of the multiple first heat dissipation fins is greater than the density of the multiple second heat dissipation fins, making the heat dissipation capacity of the first cooling zone even stronger than that of the second cooling zone.

[0008] In the specific technical solution, the aforementioned electronic component also includes a toothed heat sink, which is disposed in the first cooling zone and fixedly connected to the cold plate. The gap between adjacent fins of the toothed heat sink can be made smaller, resulting in a higher density of multiple fins. Therefore, the toothed heat sink has a stronger heat dissipation capacity, which is beneficial for further improving the heat dissipation capacity of the first cooling zone.

[0009] In another specific technical solution, the aforementioned electronic component further includes a baffle plate comprising multiple protruding structures. The first cooling zone of the aforementioned cold plate includes multiple fourth heat dissipation fins. The protruding structures and fourth heat dissipation fins are sequentially spaced apart, with a predetermined gap between adjacent protruding structures and fourth heat dissipation fins. When the liquid coolant flows in the first cooling zone, it is squeezed and agitated by the protruding structures, increasing the flow velocity of the liquid coolant and forming eddies, thereby enhancing the heat exchange capacity of the cold plate and improving the heat dissipation effect of the first cooling zone on the first heat-generating device. Furthermore, the protruding structures of the baffle plate turbulent the liquid coolant, causing it to impact the fourth heat dissipation fins, which also enhances the heat exchange capacity of the cold plate.

[0010] The shape of the protruding structures in the aforementioned spoiler is not limited; they can be trapezoidal teeth or curved teeth. Both of these tooth shapes provide good turbulence and can improve the heat dissipation capacity of the first cooling zone. Furthermore, these two tooth shapes can also be manufactured using a stamping process, which is relatively simple.

[0011] In a specific embodiment, the aforementioned cold plate may include two parts: a die-cast cold plate and a cover plate. The die-cast cold plate is prepared using a die-casting process, which is relatively simple. The die-cast cold plate and the cover plate are fitted together to form a flow channel, within which the liquid cooling medium flows, thus dissipating heat for the heat dissipation device. The aforementioned baffle includes a positioning element, which is connected to the die-cast cold plate to limit its position, thereby fixing the relative positions of the baffle and the die-cast cold plate. Furthermore, the baffle is pressed between the cover plate and the die-cast cold plate. The installation method of the baffle in this solution is relatively simple, and the installation structure is reliable and not prone to leakage.

[0012] When specifically configuring the first heating element, the distance between the two surfaces of the first cooling zone and the first heating element facing each other can be less than or equal to 0.1 mm. In other words, the distance between the surface of the first cooling zone facing the first heating element and the surface of the first heating element facing the first cooling zone is less than or equal to 0.1 mm. This facilitates thermal conductivity between the first heating element and the first cooling zone, shortens the heat conduction path between them, and improves the heat exchange efficiency between them.

[0013] Specifically, the first heating element and the first cooling zone are thermally connected through a first thermally conductive connection layer. This first thermally conductive connection layer is flexible, which can increase the fit between the first heating element and the first cooling zone, increase the heat exchange area, and also increase the heat exchange efficiency.

[0014] The first thermally conductive bonding layer can be a thermally conductive bonding layer such as silicone grease, curing adhesive, or thermally conductive film. The first thermally conductive bonding layer made of the above materials can be made relatively thin and has good thermal conductivity, which can improve the heat exchange efficiency between the first heating device and the first cooling zone.

[0015] Specifically, when setting the second heating element, a potting groove is provided on the side of the second cooling zone facing the second heating element. The second heating element is located inside the potting groove, and the second heating element and the potting groove are thermally connected through potting compound. Compared to setting the first heating element, the gap between the second heating element and the potting groove can be larger, allowing for a larger manufacturing tolerance in the cold plate.

[0016] In the specific technical solution, one second heating device is placed in each potting tank. This allows the cold plate to have multiple potting tanks, and the increased tank walls increase the heat dissipation area of ​​the cold plate, thereby improving the heat dissipation efficiency of the second heating device.

[0017] Furthermore, the gap between the second heating element and the potting groove can be made smaller than or equal to a preset width. This reduces the distance between the second heating element and the potting groove, resulting in a shorter heat conduction path and higher heat conduction efficiency, which is beneficial for improving the heat dissipation effect between the second heating elements.

[0018] In a further technical solution, the aforementioned circuit board assembly also includes a third heating element. This third heating element is also mounted on a single board, and the heating density of the second heating element is higher than that of the third heating element. Correspondingly, the aforementioned cold plate also includes a third cooling zone, which is located on both sides of the second cooling zone. That is, the third, second, and first cooling zones are arranged sequentially from the liquid outlet to the liquid inlet, with the heat dissipation capacity increasing sequentially. The aforementioned third heating element is thermally connected to the third cooling zone. This solution arranges the heating elements according to their heating density, maximizing the use of the liquid cooling medium to dissipate heat from the heating elements of the electronic components and reducing the power consumption of the liquid cooling system.

[0019] When specifically configuring the third heating element, the distance between the two surfaces of the third cooling zone and the third heating element facing each other is less than or equal to 2.5 mm. In other words, the gap between the third heating element and the third cooling zone is less than or equal to 2.5 mm. This design allows for a wider range of acceptable gaps between the surfaces of the third heating element and the third cooling zone, which is beneficial for absorbing tolerances.

[0020] Specifically, when the third heating element is configured, it is thermally connected to the third cooling zone via a second thermally conductive connection layer. This second thermally conductive connection layer is flexible, which increases the fit between the third heating element and the third cooling zone, thereby increasing the heat exchange area and efficiency. It also absorbs tolerances, protects the third heating element, and reduces the probability of damage from impacts.

[0021] The aforementioned second thermally conductive connection layer can be a thermally conductive pad, thermally conductive gel, or thermally conductive tape, etc. This second thermally conductive connection layer has good thermal conductivity, which can improve the heat exchange efficiency between the third heating device and the third cooling zone.

[0022] The aforementioned cold plate includes multiple flow channels, the extension direction of which intersects the direction from the liquid inlet to the liquid outlet; the multiple flow channels are connected in series, and columnar teeth are provided between two adjacent flow channels. The columnar teeth are provided between two adjacent flow channels, which is equivalent to being provided at the bend of the liquid cooling medium, so that the speed and temperature of the cooling medium are more uniform at the bend.

[0023] In another technical solution, the circuit board assembly includes at least two first heating elements, and the first cooling zone includes a main flow channel and at least two sub-flow channels. Each sub-flow channel is connected to the main flow channel, and adjacent sub-flow channels are arranged in parallel, resulting in similar temperatures of the cooling medium in each sub-flow channel and similar heat dissipation capacities. The sub-flow channels are thermally connected to the first heating elements in a one-to-one correspondence, ensuring that the heat dissipation capacity of the first cooling zone for each first heating element is relatively similar. Furthermore, the relatively short length of the sub-flow channels results in lower flow resistance of the cooling medium within them, which helps to increase the flow rate of the cooling medium and improve heat exchange efficiency.

[0024] In a specific technical solution, the aforementioned electronic component can be a charging module.

[0025] Secondly, this application provides an electronic device including a housing and the electronic components described in the first aspect. The electronic components are disposed within the housing. In this technical solution, the heat-generating devices of the electronic device can be arranged according to the heat dissipation capacity of the cold plate, thereby improving the heat dissipation effect of the heat-generating devices.

[0026] The aforementioned electronic device can specifically be a charging station. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of a structure of an electronic component in the prior art; Figure 2 This is a schematic diagram of the structure of an electronic device in an embodiment of this application; Figure 3 This is a schematic diagram of one structure of the cold plate in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of an electronic component in an embodiment of this application; Figure 5 This is a cross-sectional structural diagram of an electronic component in an embodiment of this application; Figure 6 This is an exploded structural diagram of an electronic component in an embodiment of this application; Figure 7This is a schematic diagram of another structure of the electronic component in an embodiment of this application; Figure 8 This is a schematic diagram of another exploded structure of the electronic component in an embodiment of this application; Figure 9 This is a partial enlarged view of an electronic component in an embodiment of this application; Figure 10 This is a schematic diagram of one structure of the spoiler in an embodiment of this application; Figure 11 This is a partial top view of the cold plate structure in an embodiment of this application; Figure 12 This is a schematic diagram of another structure of the spoiler in the embodiments of this application; Figure 13 This is a partial top view of another cold plate structure in an embodiment of this application; Figure 14 This is a schematic diagram of another structure of electronic components in the prior art; Figure 15 This is a partial structural diagram of the electronic component in an embodiment of this application; Figure 16 This is a schematic diagram of another structure of the cold plate in an embodiment of this application.

[0028] Figure label: 100 - Housing; 200 - Electronic components; 300 - Water tank; 400 - Water pump; 500 - Heat exchanger; 1 - Circuit board assembly; 11-Single board; 12-Heating element; 13-First heating element; 14-Second heating element; 15 - Third heating element; 2 - Cold plate; 21-liquid inlet; 22-liquid outlet; 23-First cooling zone; 231-First heat dissipation fin; 232 - Fourth heat dissipation fin; 233 - Main flow channel; 234 - Sub-channel; 24 - Second cooling zone; 241 - Second heat dissipation fin; 242 - Glue potting groove; 25 - Third cooling zone; 251 - Third heat dissipation fin; 26-Die-cast cold-rolled steel plate; 27-Cover plate; 28-Columnar teeth; 3-Shovel-tooth radiator; 4-Spoiler; 41-Protruding structure; 42 - Positioning component. Detailed Implementation

[0029] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0030] References to “an embodiment” or “a specific embodiment” as used in this specification mean that one or more embodiments of this application include a particular feature, structure, or characteristic described in connection with that embodiment. The terms “comprising,” “including,” “having,” and variations thereof mean “including, but not limited to,” unless otherwise specifically emphasized.

[0031] To facilitate understanding of the electronic components and electronic devices provided in the embodiments of this application, their application scenarios are first introduced below. With the development of electronic technology, the power of heat-generating components in electronic devices is increasing, resulting in more and more heat generation. Therefore, the heat dissipation requirements of electronic devices are gradually increasing. To improve heat dissipation efficiency, liquid cooling technology is being used more and more widely, utilizing cold plates to dissipate heat from the heat-generating components of electronic devices.

[0032] Because the operating power and heating efficiency of heat-generating devices differ, their heat dissipation requirements also vary. However, cold plates have a uniform heat dissipation capacity, making it impossible to tailor heat dissipation according to the heat dissipation requirements of the heat-generating devices, which easily leads to a waste of resources.

[0033] To address the aforementioned problems, this application provides an electronic component and an electronic device. To make the objectives, technical solutions, and advantages of this application clearer, the application will be described in further detail below with reference to the accompanying drawings.

[0034] Figure 2 This is a schematic diagram of the structure of an electronic device in an embodiment of this application, such as... Figure 2 As shown, this application provides an electronic device, which includes a housing 100 and an electronic component 200, the electronic component 200 being mounted on the housing 100. In specific embodiments, the electronic component 200 may be installed inside the housing 100, or it may be disposed in other locations within the housing 100; this application does not impose any limitations on this. The electronic device may further include a water tank 300, a water pump 400, and a heat exchanger 500, which are used to dissipate heat or cool the electronic component 200. Specifically, the water tank 300 is used to hold a cooling medium, the water pump 400 is used to provide power for the flow of the cooling medium, and the heat exchanger 500 is used to cool the cooling medium.

[0035] Figure 3 This is a schematic diagram of one structure of the cold plate in an embodiment of this application. Figure 4 This is a schematic diagram of the structure of an electronic component in an embodiment of this application. Figure 5 This is a schematic cross-sectional view of an electronic component in an embodiment of this application. Figures 3 to 5 As shown, the electronic component 200 includes a circuit board assembly 1 and a cold plate 2. The circuit board assembly 1 includes a single board 11, a first heating element 13, and a second heating element 14. The single board 11 can specifically be a circuit board. The first heating element 13 and the second heating element 14 are disposed on the single board 11. In a specific embodiment, the first heating element 13 and the second heating element 14 can be electrically connected to the single board 11 or fixedly disposed on the single board 11. The first heating element 13 and the second heating element 14 have different heat densities, which refer to the heat emitted per unit area of ​​the heating element per unit time. Specifically, the heat density of the first heating element 13 is higher than that of the second heating element 14.

[0036] The aforementioned cold plate 2 includes a liquid cooling cavity, and an inlet 21 and an outlet 22 communicating with the liquid cooling cavity. The cooling medium flows into the liquid cooling cavity of the cold plate 2 from the inlet 21 and flows out of the liquid cooling cavity of the cold plate 2 from the outlet 22. That is, within the liquid cooling cavity of the cold plate 2, the cooling medium flows from the inlet 21 to the outlet 22. The aforementioned cold plate 2 includes a first cooling zone 23 and a second cooling zone 24, with the second cooling zone 24 being closer to the outlet 22 than the first cooling zone 23. The cooling medium enters the liquid cooling cavity from the inlet 21, first passing through the first cooling zone 23, and then through the second cooling zone 24. It is understood that the temperature of the cooling medium in the first cooling zone 23 is lower than its temperature in the second cooling zone 24.

[0037] The first heating element 13 is thermally connected to the first cooling zone 23, and the second heating element 14 is thermally connected to the second cooling zone 24. Since the cooling medium flows through the first cooling zone 23 first and then through the second cooling zone 24, the heat dissipation capacity of the first cooling zone 23 is stronger than that of the second cooling zone 24. By utilizing the first cooling zone 23 to dissipate heat for the first heating element 13 and the second cooling zone 24 to dissipate heat for the second heating element 14, the heat dissipation capacity of the cold plate 2 can be rationally utilized, improving the heat dissipation effect of the first heating element 13 and the second heating element 14, and also saving energy.

[0038] It is worth noting that in the embodiments of this application, "thermally conductive connection" between A and B means that heat exchange can occur between A and B. Specifically, A and B can be directly connected to exchange heat; or A and B can be indirectly connected through a thermally conductive layer or other thermally conductive structure to exchange heat. In short, as long as A and B can exchange heat, it is acceptable.

[0039] Please continue to refer to this. Figures 3 to 5The circuit board assembly 1 also includes a third heating element 15, which is also disposed on the single board 11. The heating density of the second heating element 14 is higher than that of the third heating element 15, and the heating densities of the first heating element 13, the second heating element 14, and the third heating element 15 decrease sequentially. The cold plate 2 also includes a third cooling zone 25, which is disposed on both sides of the first cooling zone 24. That is, the third cooling zone 25, the second cooling zone 24, and the first cooling zone 23 are arranged sequentially along the direction from the liquid outlet 22 to the liquid inlet 21, and the heat dissipation capacity increases sequentially. The third heating element 15 is thermally connected to the third cooling zone 25. In this embodiment, the arrangement of the heating elements according to their heating density can maximize the use of the liquid cooling medium to dissipate heat from the heating elements of the electronic component 200 and reduce the power consumption of the liquid cooling system.

[0040] Please continue to refer to this. Figures 3 to 5 In a specific embodiment, the first cooling zone 23 has multiple first heat dissipation fins 231, the second cooling zone 24 has multiple second heat dissipation fins 241, and the third cooling zone 25 has multiple third heat dissipation fins 251. This enhances the heat dissipation capacity of the first cooling zone 23, the second cooling zone 24, and the third cooling zone 25, thereby improving the heat dissipation capacity of the cold plate 2. In a specific embodiment, the density of the multiple first heat dissipation fins 231 in the first cooling zone 23 is greater than the density of the multiple second heat dissipation fins 241 in the second cooling zone 24, and the density of the multiple second heat dissipation fins 241 in the second cooling zone 24 is greater than the density of the multiple third heat dissipation fins 251 in the third cooling zone 25. This further strengthens the heat dissipation capacity of the first cooling zone 23 compared to the second cooling zone 24, and the heat dissipation capacity of the second cooling zone 24 compared to the third cooling zone 25, thereby improving the heat dissipation capacity of the first heat-generating device 13, making reasonable use of the liquid cooling medium, and saving energy.

[0041] In a specific embodiment, the aforementioned cold plate 2 can be prepared using a die-casting process to simplify the manufacturing process of the cold plate 2. However, because the cold plate 2 prepared using a die-casting process is difficult to manufacture multiple first heat dissipation fins 231 with a high density, the number of first heat dissipation fins 231 in the first cooling zone 23 is limited, resulting in a limited heat dissipation area, which is insufficient to meet the heat dissipation requirements of the first heat-generating device 13.

[0042] Figure 6 This is an exploded structural diagram of an electronic component in an embodiment of this application, such as... Figure 3 , Figure 5 and Figure 6As shown, in one embodiment, the first cooling zone 23 may be equipped with a toothed radiator 3, which is fixedly connected to the cold plate 2. The toothed radiator 3 has multiple fins, and a flow channel for liquid cooling medium is formed between the toothed radiator 3 and the cold plate 2, with the fins located within the flow channel. In a specific embodiment, the toothed radiator 3 can be fixedly connected to the cold plate 2 by friction stir welding. The gap between adjacent fins of the toothed radiator 3 can be made smaller, resulting in a higher density of multiple fins in the toothed radiator 3. Therefore, the toothed radiator 3 has a stronger heat dissipation capacity, which is beneficial for further improving the heat dissipation capacity of the first cooling zone 23.

[0043] also, Figure 7 This is a schematic diagram of another structure of the electronic component in an embodiment of this application. Figure 8 This is a schematic diagram of another exploded structure of the electronic component in an embodiment of this application. For example... Figure 7 and Figure 8 As shown, in one embodiment, the electronic component 200 may further include a spoiler 4, which is specifically disposed in the first cooling zone 23 of the cold plate 2. Figure 9 This is a partial enlarged view of an electronic component in an embodiment of this application, such as... Figure 9 As shown, the aforementioned baffle 4 includes multiple protruding structures 41, and the first cooling zone 23 includes multiple fourth heat dissipation fins 232. A preset interval exists between adjacent fourth heat dissipation fins 232, forming a flow channel for the liquid cooling medium. The liquid cooling medium flows between adjacent fourth heat dissipation fins 232. The protruding structures 41 and fourth heat dissipation fins 232 are sequentially spaced apart, meaning the protruding structures 41 are located within the flow channel. A preset gap exists between adjacent protruding structures 41 and fourth heat dissipation fins 232, allowing the liquid cooling medium to flow through the flow channel via the preset gap. In this design, when the liquid cooling medium flows between adjacent fourth heat dissipation fins 232, it is squeezed and agitated by the protruding structures 41, increasing the flow velocity of the liquid cooling medium and forming vortices. The aforementioned baffle 4 can increase the flow velocity of the liquid cooling medium, thereby improving the heat exchange capacity of the cold plate 2 and enhancing the heat dissipation effect of the first cooling zone 23 on the first heat-generating device 13. In addition, the protruding structure 41 of the aforementioned baffle 4 can turbulent the liquid cooling medium, causing the liquid cooling medium to impact the fourth heat dissipation fin 232, which can also improve the heat exchange capacity of the cold plate 2.

[0044] There are no restrictions on the installation method of the aforementioned spoiler 4. For example... Figure 7 and Figure 8As shown, the aforementioned cold plate 2 includes a die-cast cold plate 26 and a cover plate 27. The die-cast cold plate 26 and the cover plate 27, when closed, form a flow channel, which is the liquid cooling cavity of the cold plate 2, within which the liquid cooling medium flows. In a specific embodiment, the die-cast cold plate 26 and the cover plate 27 can be connected and fixed using a friction stir welding process. The aforementioned baffle 4 also includes a positioning member 42, which can be a bent structure for easy forming. The positioning member 42 is connected to the die-cast cold plate 26 for limiting connection. For example, the positioning member 42 engages with the heat dissipation fins of the die-cast cold plate 26, thereby fixing the position of the baffle 4 relative to the position of the fourth heat dissipation fin 232 of the die-cast cold plate 26. The cover plate 27 presses the baffle 4 onto the die-cast cold plate 26, meaning that the cover plate 27 and the die-cast cold plate 26 are sandwiched on both sides of the baffle 4. The installation method of the baffle 4 in this solution is relatively simple, and the installation structure is reliable and not prone to leakage.

[0045] In other embodiments, the aforementioned spoiler 4 can also be fixed to the die-cast cold plate 26 by welding or other means, simply by fixing the aforementioned spoiler 4 to the cold plate 2.

[0046] The protruding structure 41 of the aforementioned spoiler 4 is not limited. Figure 10 This is a schematic diagram of one structure of the spoiler 4 in an embodiment of this application. Figure 11 This is a partial top view of a cold plate structure in an embodiment of this application. Figure 10 and Figure 11 As shown, in one embodiment, the protruding structure 41 of the aforementioned baffle 4 can be trapezoidal teeth. Specifically, the baffle 4 can be manufactured using a stamping process, which is relatively simple and produces a good turbulence effect, effectively improving the heat dissipation capacity of the cold plate 2. Furthermore, the baffle 4 in this design has strong resistance to deformation, can withstand long-term water flow impact, and extends the service life of the baffle 4.

[0047] Figure 12 This is a schematic diagram of another structure of the spoiler 4 in an embodiment of this application. Figure 13 This is a partial top view of another cold plate structure in an embodiment of this application. (See attached diagram.) Figure 12 and Figure 13 As shown, in another embodiment, the protruding structure 41 of the aforementioned spoiler 4 can be an arc-shaped tooth. Specifically, the spoiler 4 can also be manufactured using a stamping process, which is relatively simple and produces a good turbulence effect, effectively improving the heat dissipation capacity of the cold plate 2. Furthermore, the spoiler 4 in this design has strong resistance to deformation and can withstand long-term water flow impact, thus extending its service life.

[0048] Figure 14 This is a schematic diagram of another structure of an electronic component in the prior art, such as... Figure 14As shown, in the prior art, to dissipate heat from heat-generating devices of varying heights in the electronic component 200, multiple independent cold plates 2 are installed in the electronic component 200, each cold plate 2 being thermally connected to a heat-generating device. The multiple independent cold plates 2 are connected by pipes, allowing liquid cooling fluid to flow between the cold plates 2, thereby dissipating heat from each heat-generating device. This technical solution involves a large number of cold plates 2 and numerous pipes connecting them, making installation difficult. Furthermore, the numerous connection points in this solution increase the likelihood of leakage and reduce reliability in vibrating environments or during long-term operation.

[0049] like Figure 7 and Figure 8 As shown, the cold plate 2 in this embodiment is a die-casting cold plate 2. The shape of the cold plate 2 is set according to the position of the heat-generating device, and the shape of the side of the cold plate 2 facing the heat-generating device is adjusted, or in other words, the height of the side of the cold plate 2 facing the heat-generating device is different. This solution allows the distance between the heat dissipation surface of the cold plate 2 and the heat-generating device to be relatively short, which facilitates thermal conductivity connection and improves the thermal conductivity efficiency between the heat-generating device and the cold plate 2.

[0050] In a specific embodiment, the distance between the surface of the first cooling zone 23 of the cold plate 2 facing the first heating element 13 and the surface of the first heating element 13 facing the first cooling zone 23 is less than or equal to 0.1 mm. In other words, a gap of less than or equal to 0.1 mm between the first heating element 13 and the first cooling zone 23 facilitates a thermally conductive connection between them, shortens the heat conduction path, and improves the heat exchange efficiency.

[0051] Specifically, to improve the heat exchange efficiency between the first heating element 13 and the cold plate 2, a first thermally conductive connection layer can be used to connect the surfaces of the first heating element 13 and the first cooling zone 23. This first thermally conductive connection layer can be a thermally conductive layer such as silicone grease, curing adhesive, or a thermally conductive film. The aforementioned first thermally conductive connection layer can be made relatively thin and has good thermal conductivity, which can improve the heat exchange efficiency between the first heating element 13 and the first cooling zone 23. Furthermore, the first thermally conductive connection layer is flexible, which can increase the fit between the first heating element 13 and the first cooling zone 23, increase the heat exchange area, and also increase the heat exchange efficiency.

[0052] Please continue to refer to this. Figure 7 and Figure 8The second cooling zone 24 has a potting groove 242 on the side facing the second heating device 14. The second heating device 14 is located inside the potting groove 242, and the second heating device 14 and the potting groove 242 are thermally connected by potting compound. The surface of the second cooling zone 24 facing the second heating device 14 and the surface of the first cooling zone 23 facing the first heating device 13 can be on the same plane or on different planes. In short, the gap between the surface of the first cooling zone 23 facing the first heating device 13 and the first heating device 13 is less than or equal to a first preset value, and the gap between the surface of the second cooling zone 24 facing the second heating device 14 and the second heating device 14 is less than or equal to a second preset value. This allows the cold plate 2 to efficiently dissipate heat for the first heating device 13 and the second heating device 14.

[0053] Specifically, the second heating element 14 can be configured such that one second heating element 14 is placed within one potting groove 242. In this scheme, the cold plate 2 has multiple potting grooves 242, and the groove walls of the potting grooves 242 are numerous, which can increase the heat dissipation area of ​​the cold plate 2, thereby improving the heat dissipation efficiency of the second heating element 14.

[0054] Figure 15 This is a partial structural diagram of the electronic component in an embodiment of this application, such as... Figure 15 As shown in the specific embodiment, the die-cast shape inside the potting groove 242 can be the same as the outer contour of the second heating device 14 housed therein, which helps to shorten the heat conduction path, improve the heat conduction efficiency, reduce the amount of potting compound used, reduce costs, and reduce the weight of the electronic component 200.

[0055] In addition, in a specific embodiment, the gap between the second heating device 14 and the potting groove 242 is less than or equal to the preset width, thereby reducing the distance between the second heating device 14 and the potting groove 242, resulting in a shorter heat conduction path and higher heat conduction efficiency, which is beneficial to improving the heat dissipation effect between the second heating device 14.

[0056] When specifically configuring the third cooling zone 25, the surface of the third cooling zone 25 facing the third heating element 15 can be the same as or different from the surface of the second cooling zone 24 facing the second heating element 14; this application does not impose any restrictions on this. Specifically, the distance between the surface of the third cooling zone 25 facing the third heating element 15 and the surface of the third heating element 15 facing the third cooling zone 25 is less than or equal to 2.5 mm. In other words, the gap between the third heating element 15 and the third cooling zone 25 is less than or equal to 2.5 mm. In this design, the range of selectable gaps between the surfaces of the third heating element and the third cooling zone 25 is relatively wide, which is beneficial for absorbing tolerances. Furthermore, the relatively small gap between the third heating element 15 and the third cooling zone 25 facilitates thermal conductivity between the third heating element 15 and the third cooling zone 25, improving the heat exchange efficiency between them.

[0057] Specifically, when configuring the first heating element 13, a second thermally conductive connection layer can be provided between the third heating element 15 and the third cooling zone 25 to achieve a thermally conductive connection between them. This second thermally conductive connection layer can be a thermally conductive pad, thermally conductive gel, or thermally conductive tape, etc. The second thermally conductive connection layer has good thermal conductivity, which can improve the heat exchange efficiency between the third heating element 15 and the third cooling zone 25. Furthermore, the second thermally conductive connection layer is flexible, which can increase the fit between the third heating element 15 and the third cooling zone 25, increase the heat exchange area, and also increase the heat exchange efficiency. It can also absorb tolerances, protect the third heating element 15, and reduce the probability of damage from impacts. In addition, the cost of the second thermally conductive connection layer is low, which helps to reduce the cost of the electronic component 200.

[0058] It is worth noting that, in this embodiment, the surface of the first cooling zone 23 facing the first heat-generating device 13 can be a plane. Alternatively, when the electronic component 200 includes multiple first heat-generating devices 13, and the heights of the multiple first heat-generating devices 13 are different, the heights of different areas of the first cooling zone 23 can also be different. That is, the surface of the first cooling zone 23 facing the first heat-generating device 13 can be located on different planes, mainly to ensure that the gap between the first cooling zone 23 and the first heat-generating device 13 is a preset distance, thereby shortening the heat conduction path between the first cooling zone 23 and the first heat-generating device 13 and improving the heat dissipation effect on the first heat-generating device 13.

[0059] Similarly, the surface of the second cooling zone 24 facing the second heat-generating device 14 can also be a plane. Alternatively, when the electronic assembly 200 includes multiple second heat-generating devices 14, and the heights of the multiple second heat-generating devices 14 are different, the heights of different areas of the second cooling zone 24 can also be different. That is to say, the surface of the second cooling zone 24 facing the second heat-generating device 14 can be located on different planes, mainly to ensure that the gap between the second cooling zone 24 and the second heat-generating device 14 is a preset distance, thereby shortening the heat conduction path between the second cooling zone 24 and the second heat-generating device 14 and improving the heat dissipation effect on the second heat-generating device 14.

[0060] Similarly, the surface of the third cooling zone 25 facing the third heat-generating device 15 can also be a plane. Alternatively, when the electronic component 200 includes multiple third heat-generating devices 15, and the heights of the multiple third heat-generating devices 15 are different, the heights of different areas of the third cooling zone 25 can also be different. That is to say, the surface of the third cooling zone 25 facing the third heat-generating device 15 can be located on different planes, mainly to ensure that the gap between the third cooling zone 25 and the third heat-generating device 15 is a preset distance, thereby shortening the heat conduction path between the third cooling zone 25 and the third heat-generating device 15 and improving the heat dissipation effect on the third heat-generating device 15.

[0061] In a specific embodiment, the cold plate 2 includes multiple flow channels, the extension direction of which intersects the direction from the liquid inlet 21 to the liquid outlet 22. Further, the extension direction of the flow channels is perpendicular to the direction from the liquid inlet 21 to the liquid outlet 22. Specifically, the multiple flow channels can be connected in series, with columnar teeth 28 provided between adjacent flow channels. These columnar teeth 28, positioned between adjacent flow channels, are equivalent to being located at bends in the liquid cooling medium, ensuring more uniform velocity and temperature of the cooling medium at bends. The flow channels are separated by ribs, which can be fixed by welding. This design avoids long-term high-speed impact of the cooling medium on the weld seam, improving the structural reliability of the cold plate 2.

[0062] Figure 16 This is a schematic diagram of another structure of the cold plate in an embodiment of this application, as shown below. Figure 16As shown, the circuit board assembly 1 includes at least two first heating elements 13, and the first cooling zone 23 includes a main flow channel 233 and at least two sub-flow channels 234. Each sub-flow channel 234 is connected to the main flow channel 233, and adjacent sub-flow channels 234 are arranged in parallel, resulting in similar temperatures of the cooling medium in each sub-flow channel 234 and similar heat dissipation capabilities. Each sub-flow channel 234 is thermally connected to one of the first heating elements 13, ensuring that the heat dissipation capacity of the first cooling zone 23 for each first heating element 13 is relatively similar. Furthermore, the relatively short length of the sub-flow channels 234 results in lower flow resistance of the cooling medium, which helps to increase the flow rate of the cooling medium and improve heat exchange efficiency.

[0063] In a specific embodiment, the electronic device of this application can be a charging pile, and the aforementioned electronic component 200 is a charging module. In this scenario, the aforementioned first heat-generating device 13 can be an electronic device with high heat density, such as an Insulated Gate Bipolar Transistor (IGBT) module; the second heat-generating device 14 can be an electronic device with medium heat density, such as a transformer, inductor, and capacitor; and the third heat-generating device 15 can be an electronic device with low heat density, such as a relay, fuse, surface mount device, and single-board current-carrying device.

[0064] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A charging module, characterized in that, The device includes a circuit board assembly and a cold plate. The circuit board assembly includes a single board and multiple heating elements, including a first heating element and a second heating element. The first heating element and the second heating element are disposed on the surface of the circuit board facing the cold plate. The heating density of the first heating element is greater than that of the second heating element. The cold plate includes a liquid inlet and a liquid outlet. The first heating element and the second heating element are arranged sequentially along the direction from the liquid inlet to the liquid outlet.

2. The charging module according to claim 1, characterized in that, The cold plate is provided with multiple heat dissipation fins, and the density of the heat dissipation fins corresponding to the first heat-generating device is greater than the density of the heat dissipation fins corresponding to the second heat-generating device.

3. The charging module according to claim 1 or 2, characterized in that, The cold plate includes a die-cast cold plate and a cover plate. The cavity enclosed by the die-cast cold plate and the cover plate is used for the flow of coolant. The circuit board, the die-cast cold plate and the cover plate are arranged in sequence. The surface of the die-cast cold plate facing the cover plate is provided with multiple heat dissipation fins.

4. The charging module according to any one of claims 1-3, characterized in that, The charging module also includes a toothed heat sink, which is disposed between the first heat-generating device and the cold plate.

5. The charging module according to claim 4, characterized in that, The spade-shaped heat sink includes a first substrate and a plurality of heat dissipation teeth disposed on the first substrate. The first substrate is disposed facing the first heat-generating device, and the plurality of heat dissipation teeth are disposed facing the cold plate.

6. The charging module according to claim 2 or 3, characterized in that, The number of heat dissipation fins corresponding to the first heating device is multiple. A protrusion structure is provided between every two adjacent heat dissipation fins of the first heating device. The protrusion structure is provided on the second substrate and protrudes relative to the second substrate.

7. The charging module according to claim 6, characterized in that, The protruding structure is a trapezoidal tooth or an arc-shaped tooth.

8. The charging module according to claim 6 or 7, characterized in that, The cold plate includes a die-cast cold plate and a cover plate, and the cavity enclosed by the cover plate and the die-cast cold plate is used for the flow of coolant. The second substrate has a bending structure on its side, which bends toward the circuit board and engages with the heat dissipation fins corresponding to the first heat-generating device.

9. The charging module according to any one of claims 1-8, characterized in that, A portion of the surface of the cold plate facing the circuit board protrudes towards the circuit board, and the height of the heating element corresponding to the portion of the surface is less than the height of the heating element corresponding to the other surfaces of the cold plate facing the circuit board, excluding the portion of the surface.

10. The charging module according to any one of claims 1-9, characterized in that, The surface of the cold plate facing the second heating device includes multiple surrounding plates. The multiple surrounding plates and the surface of the cold plate facing the second heating device form a potting groove. The second heating device is located in the potting groove, which is filled with potting adhesive.

11. The charging module according to any one of claims 1-10, characterized in that, The cold plate includes multiple flow channels, and each pair of adjacent flow channels is connected. The multiple flow channels are arranged sequentially along the direction from the liquid inlet to the liquid outlet, and the extension direction of each flow channel intersects the direction from the liquid inlet to the liquid outlet.

12. The charging module according to claim 11, characterized in that, The charging module also includes columnar teeth, which are disposed at the connection between two adjacent flow channels.

13. The charging module according to any one of claims 11 or 12, characterized in that, Each of the at least one flow channel includes a main flow channel and multiple sub-flow channels communicating with the main flow channel. The multiple sub-flow channels are arranged in parallel. Each of the at least one flow channel corresponds to multiple first heating devices. The multiple sub-flow channels are arranged in a one-to-one correspondence with the multiple first heating devices.

14. The charging module according to claim 13, characterized in that, The extension direction of the main flow channel is the same as the extension direction of each flow channel. The plurality of first heating devices are arranged sequentially along the extension direction of the main flow channel, and the plurality of sub-flow channels are arranged sequentially along the extension direction of the main flow channel. The extension direction of each of the plurality of sub-flow channels intersects the extension direction of the main flow channel.

15. The charging module according to any one of claims 1-14, characterized in that, The circuit board assembly also includes a third heating device, which is disposed on the single board. The heating density of the second heating device is higher than that of the third heating device. The first heating device, the second heating device, and the third heating device are arranged in sequence along the direction from the liquid inlet to the liquid outlet.

16. A charging pile, characterized in that, It includes a housing and a charging module as described in any one of claims 1-15, wherein the charging module is disposed within the housing.

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