Circuit board production equipment for LED lamp strip

Abstract

The invention relates to the technical field of integrated circuit manufacturing, in particular to circuit board production equipment for an LED lamp strip, which comprises a chip mounter and an object carrying plate mounted at a moving end of the chip mounter, a supporting plate is fixedly mounted on the object carrying plate, and a flexible suction plate for supporting and adsorbing a circuit board is arranged right above the supporting plate. Through the flexible suction plate and the plate surface tensioning mechanism, a stable and flat rigid supporting platform can be provided for the flexible circuit board in the chip mounting and welding processes, the circuit board is effectively prevented from deforming, a special jig does not need to be customized, the universality is high, and the cost is reduced; partitioned precise heating can be carried out on the back face of the circuit board, preheating uniformity is remarkably improved, meanwhile, efficient heat conduction is guaranteed through flat supporting, thermal stress deformation is reduced through uniform preheating, and therefore the thermal stability of the circuit board in the high-precision surface mounting and welding process is guaranteed.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, and in particular to a circuit board production equipment for LED light strips. Background Technology

[0002] The circuit board of an LED light strip is a flexible circuit board. It is not only the mounting carrier and electrical connection skeleton of all electronic components, but also has the functions of physical support and heat dissipation. It mainly provides a stable power supply and signal path for the LED chips through precision copper foil circuits, ensuring that all LED chips can work synchronously according to the preset mode. It is a key basic component for LED light strips to realize photoelectric conversion, intelligent control and flexible application. Since the circuit board of the light strip is usually narrow and long and the components are dense, the pick-and-place machine needs to ensure product quality through vacuum adsorption and vision positioning system, thereby ensuring the brightness uniformity and reliability of the light strip.

[0003] Currently, the following problems still exist in the production of LED light strip circuit boards: When mounting and soldering flexible circuit boards for LED light strips, special rigid carriers that match the circuit boards are usually required. Circuit boards of different shapes or sizes require customized special fixtures, which have long design and manufacturing cycles and are costly, making them unsuitable for flexible production modes with multiple varieties and small batches. Moreover, rigid fixtures are usually integral metal structures, which absorb a lot of heat during reflow soldering, resulting in uneven heating of the circuit boards and large temperature differences. This can lead to damage such as cold solder joints, poor solder joints, or thermal stress. At the same time, the support platform for the production circuit boards often uses an integral heating plate or a few fixed-area heaters to preheat the circuit boards as a whole. However, overall heating cannot cope with the differences in heat capacity of different components on the flexible board, which will still lead to local temperature differences. Summary of the Invention

[0004] In view of the problems that still exist in the production of LED light strip circuit boards in the above or existing technologies, such as the need to customize special fixtures and preheat the circuit board as a whole, the present invention is proposed.

[0005] To solve the above-mentioned technical problems, the present invention provides a circuit board manufacturing equipment for LED light strips, which is achieved by the following specific technical means:

[0006] A circuit board production equipment for LED light strips includes a pick and place machine and a carrier plate installed on its moving end. A support plate is fixedly installed on the carrier plate, and a flexible suction plate for supporting and adsorbing the circuit board is provided directly above the support plate. The flexible suction plate has multiple adsorption ports distributed on it.

[0007] A plate tensioning mechanism is connected between the support plate and the flexible suction plate, and is used to tension the flexible suction plate relative to the support plate so that the flexible suction plate changes from a flexible state to a flat state with temporary rigidity.

[0008] The carrier plate is provided with a bonding plate that is located between the flexible suction plate and the support plate and slides up and down. The upper surface of the carrier plate has several mounting holes in an array. Mounting components are inserted into the mounting holes. Multiple independent and controllable heating modules are snapped into the carrier plate through the mounting components. The heating surface of the heating modules faces the flexible suction plate.

[0009] Preferably, the flexible suction plate is fixedly installed with connecting air pipes that communicate with multiple suction ports, and right-angle protrusions are fixedly installed at the four corners of the upper surface of the flexible suction plate.

[0010] Preferably, the plate tensioning mechanism includes support blocks fixedly installed at the four corners of the upper surface of the support plate, electric push rods fixedly installed on the support blocks, push rods fixedly installed on the moving end of the electric push rods, and right-angle push blocks corresponding to right-angle protrusions are hinged to the end of the push rod away from the corresponding electric push rod through a torsion spring.

[0011] Preferably, the surface of the right-angle push block is coated with a rubber coating.

[0012] Preferably, the plate tensioning mechanism further includes a support ring slidably mounted on the push rod, a support block is fixedly mounted on the lower end of the support ring, a connecting spring is fixedly mounted between the support block and the corresponding right-angle protrusion, a limiting protrusion is fixedly mounted on the outer ring wall of the push rod, and the support ring on the same plate tensioning mechanism is located between the support block and the limiting protrusion.

[0013] Preferably, the support plate is provided with a lifting assembly for controlling the lifting and lowering of the bonding plate. The lifting assembly includes a support cross plate that is fixedly installed on the lower end face of the support plate and is symmetrical in front and behind. A cylinder that is symmetrical in the left and right is fixedly installed on the support cross plate, and the lower end of the bonding plate is fixedly connected to the upper end of the cylinder.

[0014] Preferably, two sets of positioning rods are fixedly installed on the upper surface of the support plate, which are symmetrically arranged and distributed front and back, and positioning blocks corresponding to the positioning rods are fixedly installed on the bonding plate.

[0015] Preferably, a heating connector is fixedly installed at the center of the mounting hole, and several L-shaped locking rods are fixedly installed in a circumferential array on the lower end face of the mounting hole.

[0016] Preferably, the mounting assembly includes a mounting cylinder installed in the mounting hole, a protruding ring fixedly installed on the inner ring wall of the mounting cylinder, and a through-hole groove corresponding to the corresponding L-shaped locking rod is provided on the lower end face of the inner side of the mounting cylinder.

[0017] Preferably, a heating wire is fixedly installed on the upper end face of the heating module, and the heating wire cooperates with the heating connector to conduct heat. A docking post is fixedly installed on the lower end face of the heating module, and a groove is formed on the outer ring wall of the docking post to engage with the corresponding convex ring.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: through the flexible suction plate and the board tensioning mechanism, a stable and flat rigid support platform can be provided for the flexible circuit board in the chip mounting and soldering process, effectively preventing the circuit board from deforming. Moreover, no special fixtures are required, which can reduce the cost and increase the versatility. The array of multiple independent and controllable heating modules can perform zoned and precise heating on the back of the circuit board, which can significantly improve the preheating uniformity. At the same time, the flat support ensures efficient heat conduction, and uniform preheating reduces thermal stress deformation. This ensures the thermal stability of the circuit board in the high-precision mounting and soldering process, thereby improving the component mounting accuracy, enhancing the adaptability of the production line to different products, and reducing fixture costs and production energy consumption. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a three-dimensional structural diagram of the chip mounter of the present invention.

[0021] Figure 2 This is a partial cross-sectional three-dimensional structural diagram of the chip mounter of the present invention.

[0022] Figure 3 This is a three-dimensional structural diagram of the flexible suction plate and support plate of the present invention.

[0023] Figure 4 This is a schematic diagram of the flexible suction plate and support plate of the present invention.

[0024] Figure 5 This is a partial three-dimensional structural diagram of the electric actuator of the present invention.

[0025] Figure 6 This is a bottom-view three-dimensional structural diagram of the lifting component of the present invention.

[0026] Figure 7 This is a partial exploded view of the bonding plate of the present invention.

[0027] Figure 8 This is a cross-sectional view of the mounting holes and mounting components of the present invention.

[0028] Figure 9 This is a top view of the mounting hole and mounting cylinder of the present invention.

[0029] In the diagram: 1. Patch mounter; 2. Carrier plate; 3. Support plate; 4. Flexible suction plate; 401. Suction port; 402. Connecting air pipe; 403. Right-angle protrusion; 41. Electric push rod; 411. Support block; 412. Push rod; 42. Right-angle push block; 43. Connecting spring; 431. Support ring; 432. Limiting protrusion; 5. Bonding plate; 51. Heating module; 511. Heating wire; 512. Docking post; 52. Lifting assembly; 521. Support cross plate; 522. Cylinder; 523. Positioning block; 524. Positioning rod; 53. Mounting hole; 531. Heating connector; 532. L-shaped locking rod; 54. Mounting assembly; 541. Mounting cylinder; 542. Protrusion ring; 543. Docking groove. Detailed Implementation

[0030] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0031] The terms used in this invention, such as "upper," "lower," "left," "right," "middle," and "one," are merely for clarity of description and are not intended to limit the scope of the invention. Any changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention.

[0032] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 A circuit board production equipment for LED light strips includes a pick and place machine 1 and a carrier plate 2 installed on its moving end. A support plate 3 is fixedly installed on the carrier plate 2. A flexible suction plate 4 for supporting and adsorbing the circuit board is provided directly above the support plate 3. Multiple adsorption ports 401 are distributed on the flexible suction plate 4.

[0033] Please see Figure 2 , Figure 3 , Figure 4 and Figure 5 The plate tensioning mechanism is connected between the support plate 3 and the flexible suction plate 4. It is used to tension the flexible suction plate 4 relative to the support plate 3 so that the flexible suction plate 4 changes from a flexible state to a flat state with temporary rigidity.

[0034] Please see Figure 2 , Figure 4 , Figure 7 and Figure 8The loading plate 2 is provided with a bonding plate 5 located between the flexible suction plate 4 and the support plate 3 and sliding up and down. The upper surface of the loading plate 2 is provided with a number of mounting holes 53 in an array. Mounting components 54 are inserted into the mounting holes 53. Multiple independent and controllable heating modules 51 are snapped into the loading plate 2 through the mounting components 54. The heating surface of the heating module 51 faces the flexible suction plate 4.

[0035] In actual operation, the pick-and-place machine 1 precisely mounts electronic components onto the circuit board, while the carrier plate 2 serves as a support platform and moves under the drive of the pick-and-place machine 1 to process the circuit board in different areas. The suction port 401 generates suction through a vacuum pump (not shown in the figure) to firmly attach the flexible circuit board to its surface and prevent the circuit board from shifting during processing.

[0036] The board tensioning mechanism applies a uniform tension to the edge of the flexible suction plate 4, tensioning the flexible suction plate 4 relative to the support plate 3, so that the flexible suction plate 4 changes from a naturally relaxed flexible state to a flat state with temporary rigidity, ensuring that the flexible circuit board can remain flat during the mounting and soldering process, and avoiding component mounting deviation or poor soldering caused by uneven board surface.

[0037] When it is necessary to tension or release the flexible suction plate 4, the bonding plate 5 moves upward to assist the flexible suction plate 4 in bonding, thereby optimizing the tensioning effect and facilitating the placement and removal of the circuit board.

[0038] Several mounting holes 53 allow the heating modules 51 to be flexibly configured under the circuit board. Each heating module 51 is an independent electric heater, and its power supply and control signal can be connected and adjusted independently. Therefore, operators can precisely adjust the output power of each heating module 51 according to the differences in the heat capacity of components in different areas of the circuit board, thereby achieving local heating of the circuit board and ensuring uniform temperature distribution of the entire circuit board during the soldering process.

[0039] By combining the flexible suction plate 4 with the board tensioning mechanism, universal support and flattening of the flexible circuit board can be achieved, avoiding dependence on special rigid carriers, reducing production costs and improving adaptability to multi-variety small-batch production. In addition, multiple independently controllable heating modules 51 can accurately heat different areas of the circuit board, solving problems such as large temperature differences and welding defects caused by traditional overall heating methods, and ensuring the welding quality and reliability of LED light strip circuit boards.

[0040] Please see Figure 3 , Figure 4 and Figure 5 The flexible suction plate 4 is fixedly installed with a connecting air pipe 402 that is connected to multiple suction ports 401, and right-angle protrusions 403 are fixedly installed at the four corners of the upper end face of the flexible suction plate 4.

[0041] Please see Figure 3 and Figure 5 The plate tensioning mechanism includes support blocks 411 fixedly installed at the four corners of the upper end face of the support plate 3. An electric push rod 41 is fixedly installed on the support block 411. A push rod 412 is fixedly installed on the moving end of the electric push rod 41. The end of the push rod 412 away from the corresponding electric push rod 41 is hinged to a right-angle push block 42 corresponding to the right-angle protrusion 403 by a torsion spring. The surface of the right-angle push block 42 is coated with a rubber coating.

[0042] In actual operation, the right-angle protrusions 403 at the four corners provide positioning points for the plate tensioning mechanism. The plate tensioning mechanism can apply tension force to the right-angle protrusions 403, so that the flexible suction plate 4 can be transformed from a flexible state to a flat state with temporary rigidity more evenly, thereby solving the problem of inaccurate tension force application and insufficient flatness caused by the lack of positioning structure of the flexible suction plate 4.

[0043] Before the board tensioning mechanism tensions the flexible suction plate 4, the electric push rod 41 drives the push rod 412 to move synchronously towards the circuit board on the flexible suction plate 4. The push rod 412 will straighten the circuit board from the four corners through the right-angle push block 42, thereby ensuring that the circuit board is located in the center of the flexible suction plate 4.

[0044] When the electric push rod 41 drives the push rod 412, the rubber coating on the surface of the right-angle push block 42 can avoid direct hard contact between metal parts, reduce friction noise generated during tensioning, and simultaneously prevent the right-angle push block 42 from hard pressing the circuit board.

[0045] Please see Figure 3 and Figure 5 The plate tensioning mechanism also includes a support ring 431 that is slidably mounted on the push rod 412. A support block is fixedly mounted on the lower end of the support ring 431. A connecting spring 43 is fixedly mounted between the support block and the corresponding right-angle protrusion 403. A limiting protrusion 432 is fixedly mounted on the outer ring wall of the push rod 412. The support ring 431 on the same plate tensioning mechanism is located between the support block 411 and the limiting protrusion 432.

[0046] In actual operation, when the board tensioning mechanism tensions the flexible suction plate 4, the electric push rod 41 drives the push rod 412 to move in the opposite direction, so that the right-angle push block 42 moves away from the circuit board at the same time. The force of the push rod 412 will act on the support ring 431 through the limiting convex ring 432, and then be transmitted to the right-angle convex block 403 in an elastic manner through the connecting spring 43, thereby tensioning the flexible suction plate 4.

[0047] The connecting spring 43 provides elastic buffering to absorb the rigid impact generated by the movement of the push rod 412, and avoids local deformation or stress concentration caused by uneven force during the tensioning process of the flexible suction plate 4. At the same time, it enables the flexible suction plate 4 to be tensioned to a flat state more smoothly and evenly, thereby ensuring the accuracy of circuit board mounting.

[0048] Please see Figure 4 and Figure 6 The support plate 3 is provided with a lifting assembly 52 for controlling the lifting of the bonding plate 5. The lifting assembly 52 includes a support horizontal plate 521 that is fixedly installed on the lower end face of the support plate 3 and is symmetrical in front and back. A cylinder 522 that is symmetrical in the left and right is fixedly installed on the support horizontal plate 521. The lower end of the bonding plate 5 is fixedly connected to the upper end of the cylinder 522.

[0049] Please see Figure 4 and Figure 6 Two sets of positioning rods 524, symmetrically arranged on the left and right and distributed in front and back, are fixedly installed on the upper end face of the support plate 3. Positioning blocks 523, corresponding one-to-one with the positioning rods 524, are fixedly installed on the bonding plate 5.

[0050] In actual operation, the symmetrical cylinders 522 enable the bonding plate 5 to move vertically smoothly. When the flexible suction plate 4 is converted to a temporarily rigid flat state, the bonding plate 5 rises and fits against the lower end face of the flexible suction plate 4, thereby providing rigid support to the flexible suction plate 4.

[0051] When the lifting assembly 52 drives the bonding plate 5 to rise and fall, the positioning block 523 slides along the positioning rod 524, which enhances the stability during the lifting process and ensures that the heating module 51 carried on the bonding plate 5 can be accurately aligned with the circuit board below the flexible suction plate 4. This ensures that the relative position between the heating surface and the circuit board is accurate, improves the uniformity of heating, avoids local overheating or underheating, and thus effectively improves the heat treatment quality of the circuit board and reduces the risk of cold soldering, poor soldering or thermal stress damage.

[0052] Please see Figure 4 , Figure 8 and Figure 9 A heating connector 531 is fixedly installed at the center of the mounting hole 53, and several L-shaped locking rods 532 are fixedly installed in a circumferential array on the lower end face of the mounting hole 53.

[0053] Please see Figure 2 , Figure 8 and Figure 9 The mounting component 54 includes a mounting cylinder 541 installed in the mounting hole 53. A protruding ring 542 is fixedly installed on the inner ring wall of the mounting cylinder 541. A connecting groove 543 corresponding to the corresponding L-shaped locking rod 532 is opened through the lower end face of the mounting cylinder 541.

[0054] Please see Figure 4 , Figure 7 and Figure 8 A heating wire 511 is fixedly installed on the upper end face of the heating module 51. The heating wire 511 cooperates with the heating connector 531 to conduct heat. A docking post 512 is fixedly installed on the lower end face of the heating module 51. A groove is opened on the outer ring wall of the docking post 512 to engage with the corresponding protruding ring 542.

[0055] In actual operation, the heating connector 531 directly cooperates with the heating wire 511 of the heating module 51 to ensure stable power transmission and rapid heat conduction, effectively reducing heat loss during the transfer process, thereby improving heating efficiency and temperature control accuracy. At the same time, the L-shaped locking rod 532 provides mechanical support and locking for the heating module 51, ensuring that the heating module 51 is under balanced force during the locking process.

[0056] The mounting component 54, through the mounting cylinder 541 and the mounting hole 53, provides a stable mounting base for the heating module 51. The engagement structure between the convex ring 542 and the heating module 51 achieves a snap-fit ​​connection, preventing the heating module 51 from loosening or falling off during operation. The mating groove 543, in conjunction with the L-shaped locking rod 532, ensures the precise alignment and mechanical locking of the mounting component 54 within the mounting hole 53, avoiding the problem of the heating module 51 being poorly installed. This improves the installation stability and positioning accuracy of the heating module 51, thereby ensuring the reliable operation of the independently controllable heating module 51. This makes the localized precise heating control of the LED light strip circuit board more stable and effective, ultimately improving the production quality and efficiency of the circuit board.

[0057] Each heating module 51 can be controlled independently. This robust and efficient heat conduction mechanism ensures that the heat output of each heating area is more precise and uniform, solving the problem of uneven heating and thus significantly improving the welding quality of LED light strip circuit boards and reducing defects such as cold soldering and poor soldering.

[0058] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A circuit board manufacturing equipment for LED light strips, comprising a pick-and-place machine (1) and a carrier plate (2) mounted on its moving end, wherein a support plate (3) is fixedly mounted on the carrier plate (2), characterized in that: A flexible suction plate (4) for supporting and adsorbing the circuit board is provided directly above the support plate (3), and multiple adsorption ports (401) are distributed on the flexible suction plate (4). The plate tensioning mechanism is connected between the support plate (3) and the flexible suction plate (4) to tension the flexible suction plate (4) relative to the support plate (3) so that the flexible suction plate (4) changes from a flexible state to a flat state with temporary rigidity. A bonding plate (5) is provided on the loading plate (2) between the flexible suction plate (4) and the support plate (3) and slides up and down. Several mounting holes (53) are provided on the upper surface of the loading plate (2) in an array. Mounting components (54) are inserted into the mounting holes (53). Multiple independent and controllable heating modules (51) are snapped into the loading plate (2) through the mounting components (54). The heating surface of the heating module (51) faces the flexible suction plate (4).

2. The circuit board production equipment for LED light strips as described in claim 1, characterized in that: The flexible suction plate (4) is fixedly installed with a connecting air pipe (402) that communicates with multiple suction ports (401), and right-angle protrusions (403) are fixedly installed at the four corners of the upper end face of the flexible suction plate (4).

3. The circuit board production equipment for LED light strips as described in claim 2, characterized in that: The plate tensioning mechanism includes support blocks (411) fixedly installed at the four corners of the upper end face of the support plate (3). An electric push rod (41) is fixedly installed on the support block (411). A push rod (412) is fixedly installed on the moving end of the electric push rod (41). The end of the push rod (412) away from the corresponding electric push rod (41) is hinged to a right-angle push block (42) corresponding to the right-angle protrusion (403) by a torsion spring.

4. The circuit board production equipment for LED light strips as described in claim 3, characterized in that: The surface of the right-angle push block (42) is coated with a rubber coating.

5. The circuit board production equipment for LED light strips as described in claim 3, characterized in that: The plate tensioning mechanism also includes a support ring (431) slidably mounted on the push rod (412). A support block is fixedly mounted on the lower end of the support ring (431). A connecting spring (43) is fixedly mounted between the support block and the corresponding right-angle protrusion (403). A limiting protrusion (432) is fixedly mounted on the outer ring wall of the push rod (412). The support ring (431) on the same plate tensioning mechanism is located between the support block (411) and the limiting protrusion (432).

6. The circuit board production equipment for LED light strips as described in claim 1, characterized in that: The support plate (3) is provided with a lifting assembly (52) for controlling the lifting of the bonding plate (5). The lifting assembly (52) includes a support horizontal plate (521) fixedly installed on the lower end face of the support plate (3) and symmetrically arranged front and back. A cylinder (522) symmetrically arranged on the left and right is fixedly installed on the support horizontal plate (521). The lower end of the bonding plate (5) is fixedly connected to the upper end of the cylinder (522).

7. The circuit board production equipment for LED light strips as described in claim 6, characterized in that: The upper end face of the support plate (3) is fixedly installed with two sets of positioning rods (524) that are symmetrical on the left and right and distributed in front and back. The fitting plate (5) is fixedly installed with positioning blocks (523) that correspond one-to-one with the positioning rods (524).

8. The circuit board production equipment for LED light strips as described in claim 6, characterized in that: A heating connector (531) is fixedly installed at the center of the mounting hole (53), and several L-shaped locking rods (532) are fixedly installed in a circumferential array on the lower end face of the mounting hole (53).

9. The circuit board production equipment for LED light strips as described in claim 8, characterized in that: The mounting assembly (54) includes a mounting cylinder (541) installed in the mounting hole (53). A protruding ring (542) is fixedly installed on the inner ring wall of the mounting cylinder (541). A connecting groove (543) corresponding to the corresponding L-shaped locking rod (532) is opened through the lower end face of the mounting cylinder (541).

10. The circuit board manufacturing equipment for LED light strips as described in claim 9, characterized in that: A heating wire (511) is fixedly installed on the upper end face of the heating module (51). The heating wire (511) and the heating connector (531) cooperate to conduct heat. A docking post (512) is fixedly installed on the lower end face of the heating module (51). A groove is provided on the outer ring wall of the docking post (512) to engage with the corresponding protruding ring (542).

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