Pressing apparatus and bonding apparatus

Abstract

This application relates to a pressing device and a bonding apparatus. The pressing device includes a support, a pressing assembly, and a balancing module. The support has a receiving cavity for connecting to a positive pressure generator. The pressing assembly includes a connecting seat and a pressing head disposed on the connecting seat. The connecting seat is movably connected to the support to drive the pressing head to press down for bonding. The balancing module is disposed in the receiving cavity and connected to the connecting seat. When driven, the balancing module pulls the pressing assembly in the opposite direction to the bonding direction to balance the weight of the pressing assembly.

Description

Technical Field

[0001] This application relates to the field of chip bonding technology, and in particular to a pressing device and bonding equipment. Background Technology

[0002] Chip bonding technology is a key process for achieving three-dimensional integration and high-performance packaging of semiconductor devices. In traditional bonding equipment, it typically relies on the cooperation of a drive module and a bonding head. The bonding head picks up the chip, and the drive module transports it to a preset position and performs the bonding action. As the core execution component, the bonding head needs to simultaneously complete the chip pickup, alignment, and thermal pressing operations.

[0003] Current bonding equipment generally improves bonding accuracy and interface connection strength by adding various functional modules. For example, multi-axis precision adjustment mechanisms and additional heating and pressure control systems are used to ensure alignment stability.

[0004] However, the above method makes the overall structure of the bonding device large and complex, significantly increases the load, affects the sensitivity of the drive response, and has a negative impact on the bonding effect. Summary of the Invention

[0005] Therefore, it is necessary to provide a pressing device and a bonding apparatus to address the above problems.

[0006] This application provides a pressing device, which includes a support, a pressing assembly, and a balancing module. The support has a receiving cavity for connecting to a positive pressure generator. The pressing assembly includes a connecting seat and a pressing head disposed on the connecting seat. The connecting seat is movably connected to the support to drive the pressing head to press down and bond. The balancing module is disposed in the receiving cavity and connected to the connecting seat. When driven, the balancing module pulls the pressing assembly in a direction opposite to the bonding direction to balance the weight of the pressing assembly.

[0007] In one embodiment, the connector includes a supporting part, a mounting frame, and a connecting arm. The supporting part and the mounting frame are located on opposite sides of the receiving cavity in the bonding direction. The connecting arm connects the supporting part and the mounting frame. The balancing module abuts against the supporting part in a direction opposite to the bonding direction. The pressing head is disposed on the mounting frame.

[0008] In one embodiment, the balancing module includes a pusher and a base support, the base support being located on the side of the pusher away from the abutment in the bonding direction; the support also has a balancing channel, the base support having a connecting hole, one end of the connecting hole being connected to a positive pressure generator through the balancing channel, and the other end being connected to the area where the pusher is located.

[0009] In one embodiment, the plurality of the connecting holes are evenly arranged in a circumferential direction around the central axis of the pusher.

[0010] In one embodiment, the base member has a support surface facing the pusher member, the support surface being rotationally symmetrical about the central axis of the pusher member.

[0011] In one embodiment, the base member has a support surface facing the pusher member, and when the support surface abuts against the pusher member, a portion of the support surface has a gap with the pusher member, and the connecting hole communicates with the gap.

[0012] In one embodiment, the pusher is configured as any one of a sphere, cylinder, cone, frustum, pyramid, truncated pyramid, and ellipsoid.

[0013] In one embodiment, at least two of the connecting arms are spaced apart and respectively connected between the abutment and the mounting frame to enclose and form a receiving hole; the support includes a first upright plate and a first horizontal plate, the first horizontal plate is connected to the side of the first upright plate and extends away from the first upright plate, the first horizontal plate passes through the receiving hole, and the receiving cavity is formed in the first horizontal plate; the mounting frame includes a second upright plate and a second horizontal plate, the second horizontal plate is connected to the side of the second upright plate and extends away from the second upright plate, and the pressing head is disposed on the second horizontal plate; wherein the first upright plate and the second upright plate are slidably engaged in the bonding direction, and the first horizontal plate and the second horizontal plate are spaced apart and arranged side by side in the bonding direction.

[0014] In one embodiment, with reference to the contact portion between the balancing module and the abutting portion, the distances from the connecting arms located on opposite sides of the contact portion to the contact portion in a direction perpendicular to the bonding direction are equal.

[0015] In one embodiment, the support is used to connect an external drive device, and the connecting seat slides with the support in the bonding direction; the pressing assembly further includes a pressure-holding component, which includes a first actuator and a second actuator. The first actuator is disposed on the support, and the second actuator is disposed on the connecting seat. One of the first actuator and the second actuator has an inner cavity, and the other passes through the inner cavity and is sealed to the cavity wall. The inner cavity is used to communicate with an airflow generator.

[0016] In one embodiment, the first actuator is configured as a piston rod, and the second actuator is configured as a cylinder having the inner cavity; the pressure-holding component further includes a flow divider disposed in the inner cavity, the flow divider having a flow channel, one end of the flow channel being connected to the airflow generator, and the other end forming a plurality of airflow holes, the plurality of airflow holes being evenly spaced in a circumferential direction around the central axis of the first actuator.

[0017] In one embodiment, the connector has a through mounting hole in the bonding direction, the pressing assembly further includes an adapter, the adapter is connected to the pressure holding component, the adapter passes through the mounting hole and rotatably engages with the mounting hole, and the pressing head is disposed on the adapter; the pressing assembly further includes a rotation compensation component and a parallelism adjustment component, the rotation compensation component is disposed on the connector and connected to the pressing head, and is used to drive the pressing head to rotate relative to the connector about an axis parallel to the bonding direction.

[0018] In one embodiment, the pressing assembly further includes a parallelism adjustment component, which is disposed on the connecting seat and connected to the pressing head, for driving the pressing head to rotate about at least one axis in a plane perpendicular to the bonding direction.

[0019] This application also provides a bonding apparatus, which includes the pressing device described above.

[0020] In the aforementioned bonding apparatus, the accommodating cavity of the support is connected to a positive pressure generator. Therefore, when the positive pressure generator introduces positive pressure gas into the accommodating cavity, it drives the balancing module within the accommodating cavity to move. The balancing module within the accommodating cavity is connected to the connecting seat of the bonding assembly. Thus, when the balancing module is driven by positive pressure, it can drive the entire bonding assembly to move in the opposite direction to the bonding direction, thereby balancing the weight of the bonding assembly. This configuration ensures that the bonding action of the bonding assembly is not affected by its own weight, improving its movement sensitivity and bonding accuracy. Furthermore, since the balancing module is located within the accommodating cavity of the support, adding the balancing module will not increase the overall size of the bonding apparatus, making its structure simpler and more integrated, thus facilitating improved bonding performance. In short, this configuration of the present application can improve the bonding accuracy achievable by the bonding apparatus during chip bonding without increasing the overall size of the bonding apparatus. Attached Figure Description

[0021] Figure 1 This is an isometric schematic diagram of a pressing device provided in an embodiment of this application.

[0022] Figure 2 for Figure 1A cantilevered schematic diagram of the support, connecting seat, balancing module, and pressure-holding components of the pressing device shown.

[0023] Figure 3 for Figure 1 Axonometric schematic diagram of the support for the pressing device shown.

[0024] Figure 4 for Figure 1 Top view of the pressing device shown.

[0025] Figure 5 for Figure 4 A cross-sectional view of some components of the pressing device along line AA.

[0026] Figure 6 for Figure 1 The front view of the support portion and connecting arm of the pressing device shown.

[0027] Figure 7 for Figure 5 A cross-sectional view of the support and balancing module in the pressing device.

[0028] Figure 8 for Figure 7 The diagram shows an isometric view of the base support component in the balancing module.

[0029] Figure 9 for Figure 1 Axonometric view of the connecting seat of the pressing component in the pressing device shown.

[0030] Figure 10 for Figure 5 A cross-sectional view of the pressure-holding component and the adapter of the pressing assembly in the pressing device.

[0031] Figure 11 for Figure 10 A cross-sectional schematic diagram of the second actuator and the diverter in the pressure-holding component shown.

[0032] Reference numerals: 10, pressing device; 100, support; 101, receiving cavity; 102, balancing flow channel; 103, pressure equalizing cavity; 110, first vertical plate; 120, first horizontal plate; 200, pressing assembly; 210, connecting seat; 211, supporting part; 212, mounting bracket; 212a, second vertical plate; 212b, second horizontal plate; 212c, mounting hole; 213, connecting arm; 214, receiving hole; 215, supporting pin; 220, pressing head; 230, pressure holding component; 231, first actuator; 232, second actuator; 232a, inner cavity; 233, sub-cavity. Flow component; 233a, branch channel; 233b, airflow hole; 233c, main channel; 233d, branch channel; 233e, cylinder; 233f, disc; 240, adapter; 241, air inlet; 250, rotation compensation component; 260, parallelism adjustment component; 300, balance module; 310, pusher; 320, base support; 321, connecting hole; 322, support surface; 330, sleeve; 400, slide rail; 500, bearing; 600, pressure sensor; 700, overpressure monitoring component; 710, scale; 720, reading part; S, bonding direction. Detailed Implementation

[0033] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0034] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0035] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0038] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0039] One embodiment of this application provides a bonding apparatus for bonding a chip to a substrate. The bonding apparatus includes a pressing device and a driving device. The pressing device is used to pick up the chip to be bonded, for example, by vacuum adsorption. The driving device is connected to the pressing device to drive the pressing device to move, causing the pressing device and the picked-up chip to align with the area to be packaged on the substrate, and to perform the bonding operation.

[0040] Please see Figure 1 One embodiment of this application provides a pressing device 10, which includes a support 100, a pressing assembly 200, and a balancing module 300. The support 100 is used to connect to an external driving device so that it can move to the encapsulation area under the drive of the driving device. The pressing device 10 and the balancing module 300 can be respectively disposed on the support 100 so that they move with the support 100.

[0041] Combination Figures 2 to 5 The support 100 has a receiving cavity 101 for connecting to a positive pressure generator (not shown in the figure, the same below). Combined with Figure 1 The pressing assembly 200 includes a connecting seat 210 and a pressing head 220, with the pressing head 220 disposed on the connecting seat 210. The connecting seat 210 is movably connected to the support 100 to drive the pressing head 220 to press down for bonding. A balancing module 300 is disposed within the receiving cavity 101 and connected to the connecting seat 210. When driven, the balancing module 300 pulls the pressing assembly 200 in a direction opposite to the bonding direction S to balance the weight of the pressing assembly 200.

[0042] In the aforementioned pressing device 10, the receiving cavity 101 of the support 100 is connected to a positive pressure generator. Therefore, when the positive pressure generator introduces positive pressure gas into the receiving cavity 101, it can drive the balancing module 300 within the receiving cavity 101 to move. The balancing module 300 within the receiving cavity 101 is connected to the connecting seat 210 of the pressing assembly 200. Therefore, when the balancing module 300 is driven by positive pressure, it can drive the pressing assembly 200 as a whole to move in the opposite direction to the bonding direction S, thereby balancing the weight of the pressing assembly 200. This arrangement ensures that the bonding action of the pressing assembly 200 is not affected by its own weight, improving its movement sensitivity and bonding accuracy. Furthermore, since the balancing module 300 is located within the receiving cavity 101 of the support 100, adding the balancing module 300 will not increase the overall size of the pressing device 10, making its structure simpler and more integrated, thus facilitating improved bonding performance. In short, this application's configuration can improve the bonding accuracy that the bonding device 10 can achieve when performing chip bonding operations without increasing the overall size of the bonding device 10.

[0043] It should be noted that in traditional technologies, to improve bonding accuracy, bonding devices are typically equipped with multiple different functional modules, resulting in a complex overall structure and a significant increase in weight. It is easy to understand that the greater the weight of the bonding device, the more difficult it is to improve its motion accuracy. As an example, when the bonding device has a large self-weight, during the process of carrying the chip to the packaging area of ​​the substrate and approaching the substrate, due to the inertia of the bonding device, even slight movements will cause significant overall shaking. This not only hinders high-precision bonding but also risks chip impact with the substrate, thus limiting the bonding effect. In this application, the pressing device 10 has a balancing module 300 embedded in the support 100, which can balance the self-weight of the pressing component 200, thereby avoiding the negative impacts caused by inertia and greatly improving bonding accuracy and other bonding effects. Furthermore, the embedded balancing module 300 makes the overall integration of the pressing device 10 high, further facilitating the movement of the pressing device 10 and enabling high-precision bonding.

[0044] Furthermore, since the positive pressure generator is used in this application to provide the airflow for lifting the balance module 300, the positive pressure generator does not need to be installed on the support 100 or the connecting seat 210, nor does it need to be configured with an additional driver on the support 100 or the connecting seat 210 to provide lifting power. Therefore, the structure of the pressing device 10 can be further simplified and the weight reduced.

[0045] Please participate Figure 2 and Figure 5 In one embodiment, the connecting seat 210 includes a supporting part 211, a mounting bracket 212, and a connecting arm 213. The supporting part 211 and the mounting bracket 212 are located on opposite sides of the receiving cavity 101 in the bonding direction S, so that the part of the connecting seat 210 that is connected and cooperates with the balancing module 300 (i.e., the supporting part 211) and the part on which the pressing head 220 is installed (i.e., the mounting bracket 212) are located on opposite sides of the receiving cavity 101, so as to better configure the relative positional relationship between the pressing assembly 200 and the support 100 and reduce the complexity of the structure.

[0046] The connecting arm 213 connects the supporting part 211 and the mounting frame 212, allowing the mounting frame 212 and other components mounted on it to move together with the supporting part 211. The balancing module 300 abuts against the supporting part 211 in a direction opposite to the bonding direction S, and the pressing head 220 is located on the mounting frame 212. Therefore, when driven, the balancing module 300 can push the supporting part 211 upwards, causing the pressing assembly 200 to be pulled upwards as a whole, thus balancing its own weight. It can be understood that since the supporting part 211 is located above the receiving cavity 101, the balancing module 300 can directly abut against the bottom of the supporting part 211, so that the pressing assembly 200 is subjected to an upward pulling force, achieving the purpose of balancing its own weight.

[0047] Understandably, when the entire configuration pressing assembly 200 is located below the support 100, the connecting seat 210 needs to be inserted into the receiving cavity 101 so that the balancing module 300 can abut against the bottom of the connecting seat 210. However, the portion of the connecting seat 210 inserted into the receiving cavity 101 will occupy space within the receiving cavity 101, thus restricting the installation and arrangement of the balancing module 300, and also leading to a complex structural arrangement within the receiving cavity 101, making assembly difficult and increasing the failure rate.

[0048] It should be noted that, since the bonding direction S is usually parallel to the direction of gravity when the pressing device 10 performs the bonding operation, unless otherwise specified, the "above" and "below" mentioned in the embodiments of this application refer to the "above" and "below" in the bonding direction S, wherein the pressing head 220 presses downward along the bonding direction S to complete the pressing action.

[0049] As another example, the connector 210 can be configured to have an umbrella portion (not shown, the same below) that passes through the receiving cavity 101 so that the bottom of the umbrella portion abuts against the balancing module 300. In this case, the connector 210 can be located at the bottom of the support 100.

[0050] Please see Figure 2 In one embodiment, the number of connecting arms 213 is at least two, and at least two connecting arms 213 are spaced apart and respectively connected between the abutment 211 and the mounting frame 212, so that the abutment 211, the connecting arms 213 and the connecting seat 210 can form a ring frame, so that the abutment 211 and the connecting seat 210 are located on opposite sides of the accommodating cavity 101 and the two are stably driven.

[0051] Please see Figure 6 Combined Figure 2 In one embodiment, with reference to the contact portion (e.g., the retaining pin 215 mentioned below) between the balancing module 300 and the retaining portion 211, the distance from the connecting arms 213 located on opposite sides of the contact portion to the contact portion in the direction perpendicular to the bonding direction S (see [reference]). Figure 6 As shown, L1 and L2 are equal. Therefore, the connecting arms 213 on both sides can transmit the lifting force evenly, improving the effect of balancing the self-weight.

[0052] Please see Figure 3In one embodiment, at least two spaced connecting arms 213, together with the abutment portion 211 and the mounting bracket 212, form a receiving hole 214. The support 100 includes a first upright plate 110 and a first horizontal plate 120. The first horizontal plate 120 is connected to the side of the first upright plate 110 and extends away from the first upright plate 110, such that the first horizontal plate 120 is cantilevered to the first upright plate 110, thus the top and bottom of the first horizontal plate 120 are not obstructed by the first upright plate 110. The first horizontal plate 120 passes through the receiving hole 214, and a receiving cavity 101 is formed in the first horizontal plate 120. In this embodiment, the top and bottom of the first horizontal plate 120 are unobstructed, allowing it to be easily inserted into the receiving hole 214 to provide mounting support for the pressing assembly 200.

[0053] Please see Figure 7 Combined Figure 5 In one embodiment, the balancing module 300 includes a pusher 310 and a base support 320, the base support 320 being located within the receiving cavity 101, and at least a portion of the pusher 310 being located within the receiving cavity 101. Further, the pusher 310 can be configured to be located within the receiving cavity 101 when not driven, and to extend out of the receiving cavity 101 when driven to move.

[0054] The base support 320 is located on the side of the pusher 310 away from the supporting portion 211 in the bonding direction S. The support 100 also has a balance flow channel 102, and the base support 320 has a connecting hole 321. One end of the connecting hole 321 is connected to the positive pressure generator through the balance flow channel 102, and the other end is connected to the area where the pusher 310 is located. When the pusher 310 is driven to move by positive pressure, the base support 320 is located on the side of the pusher 310 away from the supporting portion 211. Therefore, the base support 320 can constrain the distribution and direction of airflow to improve the uniformity of the force on the pusher 310. It can be understood that the pusher 310 moves under the action of positive pressure airflow, and the distribution and direction of airflow will affect the force condition of the pusher 310. In this embodiment, by adding a bottom support 320, the distribution of the airflow that directly drives the pusher 310 can be effectively constrained, thereby improving the uniformity of the force on the pusher 310 and making the pusher 310 stably push the connecting seat 210 in a direction opposite to the bonding direction S, so as to lift the pressing assembly 200.

[0055] Please continue reading. Figure 7 The base support 320 and the pusher 310 have a pressure equalization cavity 103, which is a component of the accommodating cavity 101. By configuring the base support 320, the shape of the pressure equalization cavity 103 can be effectively controlled, providing a structural basis for balancing the force on the pusher 310.

[0056] Please see Figure 8In one embodiment, a plurality of connecting holes 321 are uniformly arranged in a circumferential direction around the central axis of the pusher 310 to improve the uniformity of airflow distribution within the equalizing chamber 103, thereby improving the uniformity of force distribution on the pusher 310. The central axis of the pusher 310 is shown below. Figure 8 The Chinese standard number is O.

[0057] Please see Figure 8 In one embodiment, the base support 320 has a support surface 322 facing the pusher 310, which is the bottom wall of the equalizing cavity 103. The support surface 322 is rotationally symmetrical about the central axis of the pusher 310 to improve the uniformity of force on the pusher 310.

[0058] Please see Figure 8 In one embodiment, when the support surface 322 abuts against the pusher 310, a portion of the support surface 322 has a gap with the pusher 310, and the connecting hole 321 communicates with the gap. This reduces the risk of airflow direction disruption caused by the pusher 310 blocking the connecting hole 321.

[0059] Please see Figure 8 In one embodiment, the pusher 310 is constructed as any one of a sphere, cylinder, cone, frustum, pyramid, truncated pyramid, and ellipsoid. The shape of the support surface 322 can be correspondingly set according to the shape of the pusher 310. As one example, the support surface 322 can be constructed as a conical surface recessed in the direction away from the pusher 310, a partial conical surface (such as a truncated cone surface, i.e., the outer circumferential surface of a frustum), a partial spherical surface, and a partial ellipsoidal surface, etc.

[0060] Please see Figure 7 In one embodiment, the balancing module 300 further includes a sleeve 330 disposed within the receiving cavity 101. A pusher 310 is disposed within the sleeve 330 and slides within it. By configuring the sleeve 330, the movement of the pusher 310 can be limited and guided, improving its movement accuracy and reducing the machining accuracy requirements of the inner wall of the receiving cavity 101.

[0061] Please refer to it again. Figure 6 In one embodiment, the connecting seat 210 further includes a retaining pin 215, which is disposed on the retaining portion 211 and extends toward the location of the pushing member 310, so as to directly and effectively abut against the pushing member 310. It is understood that the retaining pin 215 may be inserted into the receiving cavity 101 or located outside the receiving cavity 101.

[0062] like Figure 7The accommodating cavity 101 has an opening at the top, through which the pusher 310 can extend out of the accommodating cavity 101 to facilitate abutment of the holding portion 211 and / or the holding pin 215. Alternatively, the holding pin 215 can extend into the accommodating cavity 101 through the opening to directly and effectively abut the pusher 310.

[0063] Please see Figure 9 Combined Figure 5 In one embodiment, the mounting bracket 212 includes a second upright plate 212a and a second horizontal plate 212b. The second horizontal plate 212b is connected to the side of the second upright plate 212a and extends away from the second upright plate 212a. A pressing head 220 is disposed on the second horizontal plate 212b. The first upright plate 110 and the second upright plate 212a are slidably engaged in the bonding direction S. The first horizontal plate 120 and the second horizontal plate 212b are arranged side-by-side and spaced apart in the bonding direction S. In this embodiment, the second horizontal plate 212b extends away from the second upright plate 212a, so that the second horizontal plate 212b is cantilevered to the second upright plate 212a, thus the upper and lower parts of the second horizontal plate 212b are not obstructed by the second upright plate 212a. The mounting bracket 212 adopts the structure described above, which allows the first upright plate 110 and the second upright plate 212a to slide against each other. The first horizontal plate 120 and the second horizontal plate 212b can extend outwards, allowing the balancing module 300 on the first horizontal plate 120 and the pressing head 220 mounted on the second horizontal plate 212b to be arranged in a direction parallel to the bonding direction S. Thus, the balancing module 300 can directly and effectively provide lifting force to the pressing head 220 and other components mounted on the second horizontal plate 212b to balance the weight of the pressing assembly 200.

[0064] Furthermore, at least one of the first upright plate 110 and the second upright plate 212a has a slide rail 400, and the first upright plate 110 and the second upright plate 212a are slidably engaged by the slide rail 400.

[0065] Please see Figure 5 Combined Figure 8 In one embodiment, as described above, the connector 210 slides in engagement with the support 100 in the bonding direction S. The pressing assembly 200 also includes a pressure holding member 230, which drives the pressing head 220 to press down in the bonding direction S to provide the required pressing force for bonding the chip to the substrate.

[0066] The pressure-holding component 230 includes a first actuator 231 and a second actuator 232. The first actuator 231 is disposed on the support 100, and the second actuator 232 is disposed on the connecting seat 210. One of the first actuator 231 and the second actuator 232 has an inner cavity 232a, and the other passes through the inner cavity 232a and is sealed to the cavity wall of the inner cavity 232a. The inner cavity 232a is used to connect to an airflow generator (not shown in the figure, the same below). Thus, when the airflow generator provides positive pressure airflow into the inner cavity 232a, it can drive the first actuator 231 and the second actuator 232 to move relative to each other or have a tendency to move, so that the pressing head 220 disposed on the connecting seat 210 provides pressing force to the chip.

[0067] Furthermore, since the airflow provided by the airflow generator in this application provides power for the relative motion of the two actuators, the airflow generator does not need to be provided on the support 100 or the connecting seat 210, nor does it need to be configured with an additional driver on the support 100 or the connecting seat 210 to provide pressure holding power. Therefore, the structure of the pressing device 10 can be further simplified and the weight reduced.

[0068] Please see Figure 10 In one embodiment, the first actuator 231 is configured as a piston rod, and the second actuator 232 is configured as a cylinder having the aforementioned inner cavity 232a. The pressure-holding component 230 further includes a flow divider 233 disposed in the inner cavity 232a. The flow divider 233 has a flow channel 233a, one end of which is connected to an airflow generator, and the other end of which is formed with a plurality of airflow holes 233b. The plurality of airflow holes 233b are evenly spaced in the circumferential direction around the central axis of the first actuator 231 to improve the uniformity of force distribution and facilitate the accurate movement of the pressing assembly 200 in the bonding direction S.

[0069] Please see Figure 11 In one embodiment, the branch channel 233a includes a main channel 233c and multiple branch channels 233d. One end of the main channel 233c is connected to an airflow generator, and the other end is connected to the multiple branch channels 233d. Each branch channel 233d has an airflow hole 233b formed at the end away from the main channel 233c.

[0070] Furthermore, the diverter 233 includes a cylindrical portion 233e and a disc portion 233f. The disc portion 233f is connected to one end of the cylindrical portion 233e and extends away from the cylindrical portion 233e in a direction perpendicular to the axis of the cylindrical portion 233e, such that the disc portion 233f has a larger size than the cylindrical portion 233e in the direction perpendicular to the axis of the cylindrical portion 233e. The disc portion 233f is fitted into the inner cavity 232a, and a portion of the cylindrical portion 233e extends outward from the second actuator 232.

[0071] Please see Figure 5In one embodiment, the connector 210 has a mounting hole 212c that extends through the bonding direction S. The pressure holding member 230 can pass through the mounting hole 212c, so that the first actuator 231 can be connected to the upper support 100, and the second actuator 232 can be connected to the lower pressing head 220.

[0072] Furthermore, the mounting hole 212c is opened in the second horizontal plate 212b, and the pressure holding component 230 passes through the second horizontal plate 212b, so that the first actuator 231 can be connected to the support 100 located above, and the second actuator 232 can be connected to the pressing head 220 located below, so that the balance module 300, the pressure holding component 230 and the pressing head 220 are arranged coaxially.

[0073] It should be noted that the second actuator 232 can be directly connected to the pressing head 220; or, the second actuator 232 can be connected to the pressing head 220 through the connecting seat 210 and other components.

[0074] Please see Figure 5 In one embodiment, the pressing device 10 further includes a pressure sensor 600, which is disposed between the pressing assembly 200 and the support 100 to detect the force between the pressing assembly 200 and the support 100 so as to provide feedback for adjusting the pressing force.

[0075] As one example, the pressure sensor 600 may be located between the support 100 and the first actuator 231.

[0076] Please see Figure 1 Combined Figure 5 In one embodiment, the pressing assembly 200 further includes an adapter 240, which is connected to the pressure-holding component 230. The adapter 240 passes through a mounting hole 212c and rotatably engages with the mounting hole 212c. The pressing head 220 is disposed on the adapter 240. That is, in this embodiment, the pressure-holding component 230 is connected to the pressing head 220 through the adapter 240.

[0077] Please see Figure 10 In one embodiment, the adapter 240 is hollow, and the diverter 233 passes through the adapter 240. The diverter 233 can be connected to an airflow generator through the adapter 240. Further, the adapter 240 has an air inlet 241 for connecting the diverter 233 and the airflow generator.

[0078] Please see Figure 1In one embodiment, the bonding assembly 200 further includes a rotation compensation component 250, which is disposed on the connector 210 and connected to the bonding head 220. The rotation compensation component 250 is used to drive the bonding head 220 to rotate relative to the connector 210 about an axis parallel to the bonding direction S, so as to compensate for possible angular deviations between the chip and the packaging area on the substrate.

[0079] As one example, the rotation compensation component 250 can drive the adapter 240 to rotate, thereby driving the pressing head 220 to rotate, thus achieving rotation angle compensation. Furthermore, the pressing assembly 200 also includes a bearing 500, which is embedded in the mounting hole 212c. The adapter 240 is rotatably connected to the connecting seat 210 via the bearing 500, so that when the adapter 240 is driven by the rotation compensation component 250, it can smoothly drive the pressing head 220 to rotate.

[0080] Please see Figure 1 In one embodiment, the bonding assembly 200 further includes a parallelism adjustment component 260, which is disposed on the connecting seat 210 and connected to the bonding head 220. The parallelism adjustment component 260 is used to drive the bonding head 220 to rotate about at least one axis in the plane perpendicular to the bonding direction S, so as to compensate for the possible parallelism deviation between the chip and the packaging area on the substrate.

[0081] In one embodiment, along the bonding direction S, the pressure holding member 230, the adapter 240, the rotation compensation member 250, the parallelism adjustment member 260, and the pressing head 220 are connected in sequence.

[0082] In one embodiment, the balancing module 300, the pressure-holding component 230, the rotation compensation component 250, the parallelism adjustment component 260, and the pressing head 220 are arranged coaxially along an axis parallel to the bonding direction S. It is understood that this coaxial arrangement means that the projections of the balancing module 300, the pressure-holding component 230, the rotation compensation component 250, the parallelism adjustment component 260, and the pressing head 220 onto the bonding direction S have a common overlapping area.

[0083] It is understood that the balancing module 300 is used to balance the weight of the pressing assembly 200, which includes the weight of the pressing assembly 200 itself and the components mounted on it, such as the connecting seat 210, the components (second actuator 232 and flow divider 233, etc.) provided on the connecting seat 210 in the pressure holding component 230, the rotation compensation component 250, the parallelism adjustment component 260, the bearing 500, and the pressing head 220, etc.

[0084] Please see Figure 1In one embodiment, the pressing device 10 further includes an overpressure monitoring component 700. The overpressure monitoring component 700 includes a scale 710 and a reading unit 720. One of the scale 710 and the reading unit 720 is disposed on the support 100, and the other is disposed on the pressing component 200. The reading unit 720 can acquire the value on the corresponding scale 710 to determine the relative position between the support 100 and the pressing component 200. Thus, the overpressure monitoring component 700 can be used to determine whether the pressing movement of the pressing component 200 exceeds the set range.

[0085] In one embodiment, the scale 710 may be disposed on the support 100, and the reading part 720 may be disposed on the connecting seat 210. Further, the scale 710 may be configured as a grating scale, and the reading part 720 may be configured as a grating reading head.

[0086] As one example, when the bonding device 10 is not interacting with the substrate, the value read by the reading head at this time is used as a reference. When the bonding device 10 presses down until the bonding head 220 interacts with the substrate, the bonding assembly 200 will be lifted by a certain displacement under the force. The reading unit 720 can obtain the difference between the value on the scale 710 and the reference, that is, read the overpressure amount. When the overpressure amount exceeds the set range, the airflow generator or external drive device can be controlled to stop output. At the same time, the overpressure amount value can be used to troubleshoot problems and improve the bonding yield.

[0087] In one embodiment, the balancing module 300 and the pressure holding component 230 may be calibrated before the bonding operation is performed.

[0088] As one example, the calibration of the balancing module 300 involves first controlling the pressure within the accommodating cavity 101 and the inner cavity 232a to be the same as atmospheric pressure. This is achieved by disconnecting the corresponding pipes connecting the accommodating cavity 101 to the positive pressure generator, and disconnecting the corresponding pipes connecting the inner cavity 232a to the airflow generator. Then, a detection sensor is placed below the pressure head. By adjusting the output of the positive pressure generator, the value of the detection sensor is brought to zero, thus achieving self-weight balance.

[0089] As one example, for the calibration of the pressure-holding component 230: a detection sensor is also arranged below the pressure head 220. By adjusting the airflow generator to have different outputs, the detection sensor has different readings, and these readings are recorded along with the value of the pressure sensor 600. Multiple sets of data can be used to determine the difference between the values ​​of the external detection sensor and the pressure sensor 600. When the difference is within the permissible range, the calibration is successful.

[0090] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A press device characterized by comprising: The pressing device includes: A support having a receiving cavity for connecting a positive pressure generator; A pressing assembly, comprising a connecting seat and a pressing head disposed on the connecting seat, wherein the connecting seat is movably connected to the support to drive the pressing head to press down and bond; A balancing module is disposed within the accommodating cavity and connected to the connecting seat. When driven, the balancing module pulls the pressing assembly in a direction opposite to the bonding direction to balance the weight of the pressing assembly. The connecting seat includes a supporting part, a mounting frame, and a connecting arm. The supporting part and the mounting frame are located on opposite sides of the receiving cavity in the bonding direction. The connecting arm connects the supporting part and the mounting frame. The balancing module abuts against the supporting part in a direction opposite to the bonding direction. The pressing head is located on the mounting frame. The balancing module includes a pusher and a base support. The base support is located on the side of the pusher away from the abutment in the bonding direction. The support also has a balancing channel. The base support has a connecting hole. One end of the connecting hole is connected to the positive pressure generator through the balancing channel, and the other end is connected to the area where the pusher is located. The support is used to connect an external drive device, and the connecting seat slides with the support in the bonding direction; the pressing assembly further includes a pressure holding component, which includes a first actuator and a second actuator. The first actuator is disposed on the support, and the second actuator is disposed on the connecting seat. The second actuator is configured as a cylinder and has an inner cavity. The first actuator is configured as a piston rod. The first actuator passes through the inner cavity and is sealed with the cavity wall of the inner cavity. The inner cavity is used to communicate with an airflow generator.

2. The pressing device according to claim 1, characterized in that, The plurality of the connecting holes are evenly arranged in a circumferential direction around the central axis of the pusher.

3. The press according to claim 1, wherein The base support has a support surface facing the pusher, and the support surface is rotationally symmetrical about the central axis of the pusher.

4. The press according to claim 1, wherein The base support has a support surface facing the pusher. When the support surface abuts against the pusher, a portion of the support surface has a gap with the pusher, and the connecting hole communicates with the gap.

5. The press according to claim 1, wherein The pusher is constructed as any one of the following: spherical, cylindrical, conical, frustum, pyramidal, truncated pyramid, and ellipsoidal.

6. The press device of claim 1, wherein At least two of the connecting arms are spaced apart and respectively connected between the supporting portion and the mounting bracket to enclose and form a receiving hole; The support includes a first vertical plate and a first horizontal plate. The first horizontal plate is connected to the side of the first vertical plate and extends away from the first vertical plate. The first horizontal plate passes through the receiving hole, and the receiving cavity is formed in the first horizontal plate. The mounting bracket includes a second vertical plate and a second horizontal plate. The second horizontal plate is connected to the side of the second vertical plate and extends away from the second vertical plate. The pressing head is located on the second horizontal plate. The first vertical plate and the second vertical plate are slidably engaged in the bonding direction, and the first horizontal plate and the second horizontal plate are arranged side by side and spaced apart in the bonding direction.

7. The press according to claim 1, wherein With reference to the contact point between the balancing module and the abutting part, the distances from the connecting arms located on opposite sides of the contact point to the contact point are equal in a direction perpendicular to the bonding direction.

8. The press according to claim 1, wherein The pressure-holding component further includes a flow divider, which is disposed in the inner cavity. The flow divider has a flow channel, one end of which is used to connect to the airflow generator, and the other end of which forms a plurality of airflow holes. The plurality of airflow holes are evenly spaced in the circumferential direction around the central axis of the first actuator.

9. The press device of claim 8, wherein, The connecting seat has a through mounting hole in the bonding direction. The pressing assembly also includes an adapter seat, which is connected to the pressure holding component. The adapter seat passes through the mounting hole and is rotatably engaged with the mounting hole. The pressing head is located on the adapter seat. The pressing assembly further includes: A rotational compensation component, disposed on the connecting seat and connected to the pressing head, is used to drive the pressing head to rotate relative to the connecting seat about an axis parallel to the bonding direction; and / or A parallelism adjustment component is disposed on the connecting seat and connected to the pressing head, and is used to drive the pressing head to rotate about at least one axis in a plane perpendicular to the bonding direction.

10. A bonding apparatus characterized by comprising: The bonding apparatus includes the pressing device as described in any one of claims 1 to 9.

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