Photosensitive resin laminate, method for forming resist pattern, and method for forming wiring board
By optimizing the composition and structure of the photosensitive resin composition, the problem of balancing the developability, adhesion, and resolution of the photosensitive resin layer was solved, resulting in better photolithography effects suitable for micro-wiring in electronic devices.
Patent Information
- Application Number
- CN202480063462.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-10-02
- Filing Date
- 2024-09-30
- Publication Date
- 2026-05-12
AI Technical Summary
In the existing technology, the balance between the developability of the photosensitive resin layer and the adhesion and resolution of the resist pattern has not been optimized, making it difficult to meet the needs of miniaturization and high density of electronic devices.
A photosensitive resin composition comprising a specific ratio and composition, including an alkali-soluble polymer, a compound with olefinic unsaturated bonds, and a photopolymerization initiator, is used to optimize the composition of the photosensitive resin layer by controlling the low molecular weight of the alkali-soluble polymer and the concentration of olefinic unsaturated bonds to improve developability and adhesion.
This achieves a balance between the developability of the photosensitive resin layer and the adhesion and resolution of the resist pattern, meeting the requirements of micro-wiring in electronic devices and improving the effect of photolithography.