Screening and testing method and screening device for solder mask PINs

Abstract

The invention relates to a screening test method and screening device for solder mask PINs, and the method comprises the steps: forming a rectangular test groove in a flat plate part, and enabling the test groove to penetrate through the flat plate part in the thickness direction of the flat plate part; defining the wide edge of the test groove as a first direction, enabling the thickness direction of the PIN to be parallel to the first direction, and putting the PIN into the test groove; if the PIN nail cannot pass through the test slot, the current PIN nail is qualified; and if so, determining that the product is unqualified. The device is used for executing the screening test method for the solder mask PIN nails so as to screen the solder mask PIN nails. Compared with traditional manual visual detection, the screening and testing method for the solder mask PINs has the advantages that errors and subjectivity of manual visual inspection and manual measurement are avoided, qualified PINs and worn unqualified products can be accurately distinguished, the screening accuracy is higher, and the efficiency is higher.

Description

Technical Field

[0001] This invention relates to the field of PCB technology, and more specifically, to a screening test method and device for solder mask pins. Background Technology

[0002] In the process of printing solder resist ink on circuit boards, one side of the PCB board is printed first. When printing the second side, since the ink on the first side has not been baked into wet ink, the PCB board needs to be lifted up to ensure that there is a gap of 2-3mm between the PCB board and the worktable to prevent the wet ink from sticking back onto the worktable. Currently, pins are usually used for lifting operations in the production process.

[0003] During long-term production, the pin heads used to support the PCB board wear down, causing changes in the pin's lifting height. This leads to uneven ink distribution on the PCB during printing, and the inconsistent pin heights also cause ink to adhere to the pin heads, resulting in product scrap or rework, significantly increasing production costs. Currently, defective pins are typically screened manually by visual inspection. Workers pick up old pins one by one and observe the wear on the pin heads to discard defective ones. However, manual inspection has significant errors, low accuracy, and is slow and inefficient. Summary of the Invention

[0004] In view of this, the present invention provides a screening test method and screening device for solder resist pins, so as to quickly screen worn and unqualified pins.

[0005] The objective of this invention is achieved through the following technical solution: In a first aspect, the present invention provides a screening test method for solder resist PINs, the method comprising: forming a test groove on a flat plate, the test groove being rectangular in shape and penetrating the flat plate along its thickness direction; defining the wide side of the test groove as a first direction, making the thickness direction of the PIN parallel to the first direction, and placing the PIN into the test groove; if the PIN cannot pass through the test groove, the current PIN is qualified; if it can pass through, it is unqualified.

[0006] In the above scheme, this method is used to test the wear condition of PINs to screen out qualified and unqualified PINs, preventing worn PINs from affecting solder mask operation. First, according to the specifications of qualified PINs that meet usage requirements, a through-hole test slot is set on the flat part, with the width of the test slot matching the thickness of the PIN. Then, the PINs to be tested are taken out and placed one by one into the test slot. When placing them into the test slot, the thickness direction of the PIN is kept parallel to the direction of the width of the test slot. If the PIN is worn, its thickness will be less than the width of the test slot, and the PIN can pass through the test slot, indicating that the current PIN is a worn and unqualified product. If the PIN does not show severe wear, it cannot pass through the test slot, indicating that the current PIN is a qualified product. This method enables rapid screening of solder mask PINs, which is faster, more efficient, and more accurate than traditional manual visual inspection, and is particularly suitable for the rapid testing needs of production sites.

[0007] Optionally, in one possible implementation, the width of the test slot is a, and the thickness of the qualified PIN pin is b, where a < b.

[0008] In the above scheme, the width of the test slot is appropriately smaller than the thickness of the qualified PIN, which can block the qualified PIN and prevent it from passing through, thus screening out the qualified PIN; when the PIN is worn, its thickness will be smaller than the width of the test slot, and the PIN can pass through the test slot, thus screening out the unqualified PIN.

[0009] Alternatively, in one possible implementation, the range of ab is 1-2 mm.

[0010] In the above scheme, when the PIN is worn by 1-2mm, it can no longer be used normally and is judged as a defective product that needs to be scrapped. Therefore, the value range of ab is 1-2mm, and the specific value is set according to the actual production needs.

[0011] Optionally, in one possible implementation, a recycling box is provided below the flat component, the recycling box being located below the test slot for recycling defective PINs that have passed through the test slot.

[0012] In the above solution, the recycling box is located below the test slot on the flat component. Defective PINs fall directly into the recycling box after passing through the test slot, making the recycling operation more convenient and faster.

[0013] Alternatively, in one possible implementation, the PIN includes a substrate and a PIN head disposed on the substrate.

[0014] In the above solution, the PIN consists of a substrate and a pin head. When in use, the substrate is placed horizontally on the workbench, and the pin head supports the circuit board.

[0015] Alternatively, in one possible implementation, during screening testing, the side of the substrate away from the pin head is first placed against the long side of the test slot, and then the pin is driven through the test slot.

[0016] In the above scheme, during testing, the side of the substrate away from the pin head is placed against the long side of the test slot to keep the pin in a preset posture. This ensures that the thickness direction is always strictly parallel to the wide side of the test slot, avoiding the problem of unworn pins accidentally passing through or worn pins accidentally getting stuck due to pin skew or deflection. This improves the accuracy and reliability of the screening test.

[0017] Alternatively, in one possible implementation, the substrate is integrally formed with the nail head.

[0018] In the above solution, the one-piece molding design can ensure a more secure connection between the substrate and the pin head, reducing the impact of loose connections on the normal functioning of the pin support.

[0019] Alternatively, in one possible implementation, the PIN is made of metal or plastic.

[0020] In the above solution, metal materials can ensure the structural strength and service life of the PIN itself, while plastic materials can balance lightweight, low cost and insulation compatibility.

[0021] Secondly, the present invention provides a screening device for performing the aforementioned screening test method for solder resist PINs, for screening solder resist PINs.

[0022] Alternatively, in one possible implementation, the screening device includes a mounting bracket for mounting the flat plate.

[0023] In the above scheme, the mounting bracket is used to support the flat component so that staff can perform screening and testing of the PINs.

[0024] Compared with the prior art, the beneficial effects of this application are as follows: This application's testing only requires placing the PIN in the test slot after aligning its thickness direction with the wide side of the test slot. No specialized tools, complex operations, or high-precision equipment are needed. Testing a single PIN takes extremely little time, enabling rapid, one-by-one screening of batches of PINs. This significantly improves the efficiency of solder mask PIN testing and screening, meeting the needs of rapid on-site testing. Furthermore, the test slot width is set based on the standard thickness of a qualified PIN, ensuring a unique and quantifiable standard. Whether a PIN passes through the test slot directly indicates excessive wear. Compared to traditional manual visual inspection, this eliminates the errors and subjectivity of manual inspection and measurement, accurately distinguishing between qualified PINs and worn-out defective products, resulting in higher screening accuracy.

[0025] The core testing component involved in this application is only a flat plate with a through rectangular test slot. It has a simple structure, is easy to process, and does not require customized precision tooling or the purchase of special testing instruments. It is low in cost and economical, and can be widely adapted to various anti-welding production operation scenarios. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a perspective view of a screening device according to an embodiment.

[0028] Figure 2 This is a top view of the PIN.

[0029] Figure 3 This is a front view of the PIN.

[0030] Explanation of the reference numerals in the figure: 1-Plate component; 11-Test slot; 2-PIN pin; 21-Substrate; 22-Pin head; 3-Mounting bracket; 31-Working platform; 32-Column; 4-Recycling box. Detailed Implementation

[0031] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0032] The technical solutions in this application will now be described with reference to the accompanying drawings. Example 1

[0033] This embodiment provides a screening test method for solder mask PINs. The method includes: opening a test groove 11 on a flat plate 1. The test groove 11 is rectangular and extends through the flat plate 1 along its thickness direction; defining the wide side of the test groove 11 as a first direction, making the thickness direction of the PIN 2 parallel to the first direction, and placing the PIN 2 into the test groove 11; if the PIN 2 cannot pass through the test groove 11, the current PIN 2 is qualified; if it can pass through, it is unqualified.

[0034] It should be noted that the first direction mentioned above, namely... Figure 2 The X direction in the diagram refers to the thickness direction of PIN 2, which is the direction of the height of PIN 2 when it supports and lifts the circuit board.

[0035] Specifically, this method is used to test the wear condition of PIN 2 to screen out qualified and unqualified PIN 2, preventing worn PIN 2 from affecting the solder mask operation. (Refer to...) Figure 1 First, according to the specifications of qualified PINs 2 that meet the usage requirements, a through-hole test groove 11 is set on the flat part 1. The width of the test groove 11 matches the thickness of the PIN 2. Then, the PINs 2 to be tested are taken out and placed one by one into the test groove 11. When placing them into the test groove 11, the thickness direction of the PIN 2 is kept parallel to the direction of the width of the test groove 11. If the PIN 2 is worn, its thickness will be less than the width of the test groove 11, and the PIN 2 can pass through the test groove 11. In this case, the current PIN 2 is a worn and unqualified product. If the PIN 2 is not severely worn, it cannot pass through the test groove 11, and in this case, the current PIN 2 is a qualified product. Through the above method, the solder mask PINs 2 can be quickly screened. Compared with traditional manual visual inspection, it is faster, more efficient, and more accurate, especially suitable for the rapid inspection needs of the production site.

[0036] It should be noted that the flat plate 1 is made of a suitable hard material as needed, which can be metal or plastic.

[0037] like Figure 2 and Figure 3 As shown, in this embodiment, the PIN 2 includes a substrate 21 and a PIN head 22 disposed on the substrate 21. The PIN 2 consists of the substrate 21 and the PIN head 22. In use, the substrate 21 is placed horizontally on a workbench, and the circuit board is supported by the PIN head 22. The thickness of the PIN 2 is the thickness of the substrate 21 plus the height of the PIN head.

[0038] Specifically, in this embodiment, the substrate 21 of the PIN 2 has a size of 22mm×22mm, and the overall thickness of the PIN 2 is 2.5mm.

[0039] In this embodiment, the width of the test groove 11 is a, the thickness of the qualified PIN pin 2 is b, and a < b.

[0040] The width of the test slot 11 is appropriately smaller than the thickness of the qualified PIN 2, so as to block the qualified PIN 2 from passing through, thus screening out the qualified PIN 2; when the PIN 2 is worn, its thickness will be smaller than the width of the test slot 11, and the PIN 2 can pass through the test slot 11, thus screening out the unqualified PIN 2.

[0041] Furthermore, the range of ab is 1-2mm. In actual production, when the PIN 2 is worn by 1-2mm, it can no longer be used normally and will be judged as a defective product, which needs to be scrapped. Therefore, the value range of ab is 1-2mm, that is, the width of the test groove 11 must be 1-2mm less than the thickness of the qualified PIN 2, so as to screen out the unqualified PIN 2 that can no longer be used.

[0042] Specifically, in this embodiment, the width of the test slot 11 is 4mm, and the overall thickness of the PIN pin 2 is 2.5mm, i.e., ab=1.5mm. Specific values ​​can be adjusted according to actual needs and are not specifically limited here.

[0043] It should be understood that in this embodiment, the long side of the test groove 11 is 22mm, corresponding to the specifications of the substrate 21.

[0044] In this embodiment, a recycling box 4 is provided below the flat plate 1, and the recycling box 4 is located below the test slot 11, for recycling the unqualified PIN nails 2 that have passed through the test slot 11.

[0045] The recycling box 4 is located below the test slot 11 on the flat part 1. The unqualified PIN 2 falls directly into the recycling box 4 after passing through the test slot 11, so as to recycle the unqualified PIN 2. The recycling operation is more convenient and faster.

[0046] In this embodiment, when performing the screening test, the side of the substrate 21 away from the nail head 22 is first attached to the long side of the test groove 11, and then the PIN nail 2 is driven through the test groove 11.

[0047] During testing, the side of the substrate 21 away from the pin head 22 is placed against the long side of the test slot 11, so that the PIN pin 2 maintains the preset posture and ensures that the thickness direction is always strictly parallel to the wide side of the test slot 11. This avoids the problem of the PIN pin 2 being skewed or deflected, causing the unworn PIN pin 2 to pass through accidentally or the worn PIN pin 2 to get stuck accidentally, thus improving the accuracy and reliability of the screening test.

[0048] In this embodiment, the substrate 21 and the nail head 22 are integrally formed. The integral forming design can ensure a more secure connection between the substrate 21 and the nail head 22, reducing the impact on the normal functioning of the PIN nail 2 support due to loose connection.

[0049] In this embodiment, the PIN 2 is made of metal or plastic, which are two mainstream materials commonly used for PINs in the prior art. Metal materials can ensure the structural strength and service life of the PIN itself, while plastic materials can balance lightweight, low cost, and insulation compatibility. The choice is made based on actual needs.

[0050] Based on the foregoing, refer to Figure 1 The overall steps of the screening test method in this embodiment are as follows: S1: Collect used PINs 2 in preparation for screening tests; S2: The staff removes the PINs 2 one by one, aligns the side of the substrate 21 away from the PIN head 22 with the long side of the test slot 11, and then moves the PINs 2 along the Z direction to test whether the PINs 2 can pass through the test slot 11. S3: Place the qualified PINs 2 that cannot pass through into other areas for collection, and let the unqualified PINs 2 that can pass through fall freely into the recycling box 4 below for recycling. Example 2

[0051] Reference Figure 1 This embodiment provides a screening device for performing the screening test method for solder resist PINs 2 in Embodiment 1, in order to screen the solder resist PINs 2.

[0052] In this embodiment, the screening device includes a mounting bracket 3, a flat plate 1, and a recycling box 4. The flat plate 1 is mounted on the mounting bracket 3, and the recycling box 4 is located below the flat plate 1.

[0053] The mounting bracket 3 includes a working platform 31 and a column 32. The flat plate 1 is mounted on the working platform 31. The working platform 31 is provided with through holes corresponding to the test slots 11 on the flat plate 1, so that unqualified PINs 2 can fall into the recycling box 4 below.

[0054] In practice, staff members take out the old PINs 2 to be tested one by one and put them into the test slot 11. The qualified PINs 2 that fail to pass are placed in the qualified area for collection by staff members. The unqualified PINs 2 fall directly into the recycling box 4 below after passing through the test slot 11 for recycling.

[0055] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0056] Furthermore, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0057] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The various embodiments can be combined as needed, and the same or similar parts can be referred to each other.

[0058] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A screening test method for solder resist PINs, characterized in that, The method includes: A test groove is formed on a flat plate. The test groove is rectangular in shape and extends through the flat plate along its thickness direction. Define the wide side of the test slot as the first direction, make the thickness direction of the PIN parallel to the first direction, and place the PIN into the test slot; if the PIN cannot pass through the test slot, the current PIN is qualified; if it can pass through, it is unqualified.

2. The screening and testing method for solder resist PINs according to claim 1, characterized in that, The width of the test slot is 'a', and the thickness of a qualified PIN is 'b', where a < b.

3. The screening and testing method for solder resist PINs according to claim 2, characterized in that, The range of ab is 1-2mm.

4. The screening and testing method for solder resist PINs according to claim 1, characterized in that, It also includes a recycling box located below the flat component, which is used to recycle defective PINs that have passed through the test slot.

5. The screening and testing method for solder resist PINs according to claim 1, characterized in that, The PIN includes a substrate and a PIN head disposed on the substrate.

6. The screening test method for solder resist PINs according to claim 5, characterized in that, During the screening test, the side of the substrate away from the pin head is first placed against the long side of the test slot, and then the pin is driven through the test slot.

7. The screening test method for solder resist PINs according to claim 5, characterized in that, The substrate and the nail head are integrally formed.

8. The screening test method for solder resist PINs according to claim 1, characterized in that, The PIN is made of metal or plastic.

9. A screening device, characterized in that, The apparatus is used to perform the screening test method for solder resist PINs according to any one of claims 1 to 8, for screening solder resist PINs.

10. The screening device according to claim 9, characterized in that, The screening device includes a mounting bracket for mounting the flat plate.

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