Waste discharge method for FDC die cutting conductive base material

Abstract

The invention discloses a waste discharge method of an FDC die cutting conductive substrate, and relates to the technical field of flexible circuit manufacturing, and the method comprises the following steps: before die cutting of the conductive substrate, arranging a glue shielding lining between the conductive substrate and a bearing film, the viscosity of the bearing film being 650 g / 25 mm-750 g / 25 mm; after the conductive base material is subjected to die cutting, the conductive base material is covered with a waste discharging film; conducting base material waste is discharged through the waste discharging film; wherein during waste discharging, the angle between the waste discharging film and the bearing film ranges from 34.2 degrees to 36.1 degrees. By means of the method, it is guaranteed that the supporting materials cannot be discharged while the waste materials are discharged, the production cost is reduced, and the product yield is increased.

Description

Technical Field

[0001] This invention relates to the field of flexible circuit manufacturing technology, and in particular to a waste removal method for FDC die-cut conductive substrates. Background Technology

[0002] The current production process for flexible printed circuit boards (FPCBs) involves numerous steps: material preparation → baking and applying a dry film → exposure → development → etching → film removal → pretreatment → applying a cover film → lamination. As a traditional process, FPCB manufacturing faces the following key challenges in its waste removal process: 1. Waste disposal is complex and poses significant environmental pressure. Etching waste liquid treatment: Flexible printed circuit board manufacturing requires etching processes, which generate high-concentration copper and nickel-containing waste liquid, resulting in high treatment costs and long cycles.

[0003] High proportion of hazardous waste: Etching waste liquid, developing waste liquid, etc. are classified as hazardous waste (HW17, HW49 categories), which require professional treatment and increase the environmental protection costs of enterprises.

[0004] Low resource recovery rate: In traditional processes, the recovery rate of high-value materials such as copper and PI is less than 60%.

[0005] 2. Low waste discharge efficiency after the cover film is applied. The waste skeleton (web) is difficult to remove: After the cover film is applied, the waste skeleton (i.e. the border around the product) adheres to the substrate, and traditional methods require manual cleaning.

[0006] Frequent downtime: After each batch of production is completed, the machine needs to be stopped for 5-10 minutes to manually clean the mold, resulting in a 20%-30% decrease in production efficiency.

[0007] High quality risk: Manual cleaning can easily lead to waste residue, causing short circuits or open circuits in the product, increasing the defect rate by 5%-8%.

[0008] 3. Low degree of automation, relying on manual labor. Lack of automated waste removal system: Traditional flexible printed circuit board processes rely on manual waste removal, which cannot achieve continuous production.

[0009] Poor operational consistency: Different operators achieve significantly different cleaning results, affecting product consistency.

[0010] High cost: Labor costs account for 15%-20% of the manufacturing cost of flexible printed circuit boards, which is much higher than that of automated waste disposal systems.

[0011] 4. Significant material waste. Low utilization rate of cover film: Traditional waste disposal methods result in a waste of 15%-25% of cover film material.

[0012] Difficulty in recycling scrap materials: Waste skeletons cannot be effectively recycled, resulting in material waste.

[0013] Therefore, companies have proposed the FDC (Flexible Die-cut Circuit) process to improve flexible printed circuit board (PCB) technology. FDC involves directly cutting the conductive substrate and insulating film using a rotary / flat die-cutting process, eliminating the need for etching. This results in shorter processes, lower costs, and greater environmental friendliness, and is commonly used for battery sampling lines, sensor connections, and simple flexible interconnects. It simplifies the production process significantly and allows for direct recycling of physical molding waste. However, FDC currently faces technical bottlenecks in fuse precision control and waste disposal in densely packed circuit areas. For example, in high-density circuit areas, waste is difficult to completely remove, leading to increased product defect rates. Summary of the Invention

[0014] In view of this, the purpose of this invention is to provide a new waste removal method for FDC (Flexible Die-cut Circuit) die-cut conductive substrates.

[0015] This invention provides a waste removal method for FDC die-cut conductive substrates, characterized by comprising: Before die-cutting the conductive substrate, an adhesive-masking liner is placed between the conductive substrate and the carrier film, wherein the adhesiveness of the carrier film is 650g / 25mm~750g / 25mm; after die-cutting the conductive substrate, a waste removal film is covered on the conductive substrate; the waste material of the conductive substrate is discharged through the waste removal film; wherein, during waste discharge, the angle between the waste removal film and the carrier film is 34.2°~36.1°.

[0016] In one embodiment, the adhesiveness of the waste discharge membrane is less than that of the carrier membrane, and the waste discharge membrane is a PE protective film.

[0017] In one embodiment, the step "providing an adhesive-masking liner between the conductive substrate and the carrier film before die-cutting the conductive substrate" includes: The carrier film and the release film are laminated together and then die-cut. Waste from the die-cut release film is removed to form the adhesive-masking liner.

[0018] In one embodiment, the step of "discharging the conductive substrate waste through the waste discharge membrane" is completed by an auxiliary rod and a stripper.

[0019] In one embodiment, the conductive substrate waste includes: starting waste, non-starting waste, and waste blocks.

[0020] In one embodiment, the area of ​​the waste block is not less than 9 mm². 2And both the length and width are not less than 3mm.

[0021] In one embodiment, the width of the non-starting waste material is less than or equal to 0.25 mm and is connected to the waste block.

[0022] In one embodiment, the step of "discharging conductive substrate waste through a waste discharge membrane" includes: forward waste discharge and reverse waste discharge.

[0023] In one embodiment, the forward waste discharge refers to the waste discharge membrane discharging waste from the starting waste, wherein the starting waste refers to a section of the conductive substrate waste edge that can be reliably adhered to and pulled upward by the waste discharge membrane.

[0024] In one embodiment, the reverse waste removal is a process in which, during the waste removal process, the startless waste material connected to the waste material of the masking liner will detach due to the stretching effect of the waste removal membrane, and the startless waste material is carried away by the waste material in the masking liner area for waste removal. Here, the startless waste material refers to any conductive substrate waste material with free edges that can be initially peeled off.

[0025] In the waste removal method for FDC die-cut conductive substrate of the present invention, the adhesiveness range of the carrier film is 650g / 25mm to 750g / 25mm, and the angle between the waste removal film and the carrier film is 34.2° to 36.1° during waste removal. This ensures that the support material is not discharged while the waste is being discharged, thereby reducing production costs and improving product yield. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0027] Figure 1 A schematic flowchart of one embodiment of the waste removal method for FDC die-cut conductive substrate provided by the present invention; Figure 2 A schematic diagram of an embodiment of the waste removal method for FDC die-cut conductive substrate provided by the present invention; Figure 3 for Figure 2 A structural schematic diagram of embodiment 100; Figure 4 Provided by the present invention Figure 3 A schematic diagram of the structure of one embodiment of 150; Figure 5 For the present invention Figure 3 Partial structural diagram; Figure 6 For the present invention Figure 5 A schematic diagram of the structure in one embodiment of 151; Figure 7 This includes experimental data on the effect of viscosity matching between the carrier membrane and the waste discharge membrane on waste discharge performance in this invention; and Figure 8 These are experimental data on the influence of the viscosity of the carrier membrane and the angle of the waste discharge membrane on the waste discharge performance in this invention.

[0028] Explanation of icon numbers: 110. Carrier membrane; 120. Conductive substrate; 130. Waste discharge membrane; 140. Peeling knife; 160. Auxiliary rod; 1202. Conductive substrate waste; 1204. Support material; 170. Circular knife; 1502. Glue-masking liner; 1504. No-start waste; 1512. Waste block; 1514. Waste filament.

[0029] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0031] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0032] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0033] Please refer to Figure 1 , Figure 1 The diagram shown is a flowchart of one embodiment of the waste removal method for FDC die-cut conductive substrate provided by the present invention.

[0034] In this embodiment, the waste removal method for FDC die-cut conductive substrate includes: In step S10, before die-cutting the conductive substrate 120, an adhesive-masking liner 1502 is provided between the conductive substrate 120 and the carrier film 110, wherein the adhesiveness of the carrier film 110 is 650g / 25mm to 750g / 25mm.

[0035] It should be noted that the viscosity mentioned above refers to peel strength. g / 25mm is the industry standard for expressing peel strength, used to quantify the adhesive strength of an adhesive to a specific substrate (such as copper foil). For example, 700g / 25mm means that under standard test conditions, when peeling the tape from the surface of the substrate at a specified angle and speed, the force required to peel off every 25mm of width is 700 grams of force.

[0036] In this embodiment, the conductive substrate 120 is made of conductive materials such as copper, aluminum, copper alloy, or aluminum alloy.

[0037] In this embodiment, the viscosity of the waste discharge membrane 130 is less than that of the carrier membrane 110.

[0038] In this embodiment, the waste removal membrane 130 needs to be a thin release film / release paper. Preferably, the thickness of the waste removal membrane 130 is less than 6 μm. Commonly available materials include: PE protective film, OPP protective film, and PET protective film. OPP protective film has general performance and is suitable for medium-hardness materials. PET protective film is expensive and rigid, but it has wide applicability and can be used as a waste removal membrane for both rigid and flexible materials. PE protective film is inexpensive and flexible, and is generally used for die-cutting of materials with relatively high hardness.

[0039] In this embodiment, the waste discharge membrane 130 is a PE protective film. PE protective film has good weather resistance, is not prone to aging during continuous production, and can be adapted to high-speed production lines.

[0040] Please refer to the reference. Figure 7 , Figure 7 The figure shows the experimental data on the effect of viscosity matching between the carrier membrane and the waste discharge membrane on the waste discharge performance in this invention. Figure 7 The data in the cell is the waste removal integrity rate / line mis-connection rate (unit: %), where the waste removal integrity rate refers to the yield rate of completely removing waste from the reverse waste removal section, and the line mis-connection rate refers to the defect rate of the line being mis-connected. From Figure 7 It can be concluded that when the viscosity of the carrier membrane 110 is controlled at 650g / 25mm~750g / 25mm and the viscosity of the waste discharge membrane 130 is controlled at 400g / 25mm~600g / 25mm, a high waste discharge integrity rate (≥97%) and a low line miscarriage rate (≤0.4%) can be achieved.

[0041] Therefore, in this embodiment, the viscosity of the waste discharge membrane 130 is 400g / 25mm to 600g / 25mm.

[0042] In step S20, after die-cutting the conductive substrate, a waste removal film is covered on the conductive substrate; In step S30, the waste conductive substrate is discharged through the waste discharge membrane 130, wherein the angle between the waste discharge membrane 130 and the carrier membrane 110 is 34.2°~36.1° during the waste discharge.

[0043] Please refer to the reference. Figure 8 , Figure 8 The figure shows experimental data on the influence of the viscosity of the carrier membrane and the angle of the waste discharge membrane on the waste discharge performance in this invention.

[0044] from Figure 8 As can be seen, when the viscosity of the carrier membrane 110 is 650 g / 25 mm to 750 g / 25 mm, and the angle between the waste discharge membrane 130 and the carrier membrane 110 is 34.2° to 36.1°, the waste discharge rate is stable at 98.5% to 99.6%, which is significantly better than other combinations. If the angle is too small (<34.2°) or too large (>36.1°), the contact / peel angle between the waste discharge membrane 130 and the conductive substrate waste is not ideal, affecting the peeling efficiency and consistency.

[0045] In this embodiment, the viscosity of the carrier film 110 is too low (<650 g / 25mm): the conductive substrate waste 1202 is prone to fall off from the waste discharge film 130 in advance or be mispositioned, resulting in incomplete waste discharge.

[0046] In this embodiment, the adhesion of the carrier film 110 is too high (>750 g / 25 mm): the conductive substrate waste 1202 is difficult to peel off from the carrier film 110, the waste discharge force increases, and it may damage the support material 1204 or leave adhesive residue.

[0047] Please refer to the reference. Figure 2 , Figure 2 The diagram shows a structural schematic of an embodiment of the waste removal method for FDC die-cut conductive substrate provided by the present invention.

[0048] In this embodiment, a conductive substrate 120 is placed on the carrier film 110. After being die-cut by a circular cutter 170, a waste discharge film 130 is covered on the die-cut conductive substrate.

[0049] In this embodiment, step S30, "discharging the conductive substrate waste through the waste discharge membrane," is performed by the auxiliary rod 130 and the stripping blade 140. Figure 2 As can be seen, the auxiliary rod 160 assists the waste discharge membrane 130 in discharging the conductive substrate waste 1202.

[0050] Please refer to the reference. Figure 3 , Figure 3 for Figure 2 A structural schematic diagram of embodiment 100.

[0051] In this embodiment, after die-cutting, the conductive substrate 120, the carrier film 110, and the waste discharge film 130 pass through the peeling blade 140, and the waste discharge film 130 separates from the carrier film 110. The die-cut conductive substrate 120 is composed of conductive substrate waste 1202 and support material 1204.

[0052] In this embodiment, the viscosity range of the waste discharge membrane is 400g / 25mm to 600g / 25mm.

[0053] In this embodiment, during the waste discharge process, the waste discharge membrane 130 uses its adhesiveness to stick the conductive substrate waste 1202, and the auxiliary rod 160 cooperates with the waste discharge membrane 130 to discharge the conductive substrate waste 1202. Because the carrier membrane 110 has a greater adhesiveness than the waste discharge membrane 130, the support material 1204 remains on the carrier membrane 110.

[0054] In this embodiment, the conductive substrate waste 1202 includes: waste block 1512, waste without a starting point 1504, and waste with a starting point (not shown in the figure), etc.

[0055] In this embodiment, during the waste removal process, the angle between the waste removal membrane segment currently contacted by the stripper 140 and the waste removal membrane 130 currently contacted by the auxiliary rod 160, and the bearing membrane 110, is 34.2°~36.1°. During the waste removal process, if the angle is too small, the conductive substrate waste 1202 being removed in the reverse direction will pull up or deform the circuits in the support material 1204 due to the small lifting angle; if the angle is too large, a lot of support material 1204 will be removed, resulting in product defects. A suitable waste removal angle is quite important and helps to improve product yield.

[0056] Preferably, the angle between the waste discharge membrane segment currently contacted by the peeling blade 140 and the waste discharge membrane 130 currently contacted by the auxiliary rod 160 and the carrier membrane 110 is 35°, and the product yield can reach 99.6%.

[0057] Please refer to the reference. Figure 4 , Figure 5 , Figure 6 .

[0058] Figure 4 The image shown is provided by the present invention. Figure 3 A structural schematic diagram of one embodiment of 150.

[0059] Figure 5 The present invention is shown. Figure 3 A partial structural diagram.

[0060] Figure 6 The present invention is shown. Figure 5 A schematic diagram of the structure in one embodiment of 151.

[0061] In this embodiment, the masking liner 1502 is located on the carrier film 110.

[0062] In this embodiment, step S10, "providing an adhesive-masking liner between the conductive substrate 120 and the carrier film 110 before die-cutting the conductive substrate 120," includes: The carrier film 110 is laminated with the release film (not shown in the figure) and then die-cut. Waste is removed from the die-cut release film to form the adhesive-masking liner 1502.

[0063] In this embodiment, the conductive substrate waste 1202 includes: starting waste, non-starting waste 1504, and waste block 1512.

[0064] In this embodiment, the area of ​​the waste block 1512 is not less than 9 mm². 2 And both the length and width are not less than 3mm.

[0065] In this embodiment, the width of the waste material without a starting point is less than or equal to 0.25 mm, and it is connected to the waste material 1512.

[0066] Specifically, a die-cutting process (such as circular cutter) is used, and a waste removal technique is employed to retain the release film in the corresponding area of ​​the waste block 1512, thereby forming an adhesive-masking liner 1502. This results in the following difference in adhesion: due to the presence of the adhesive-masking liner 1502 beneath the waste block 1512, contact between the adhesive on the carrier film 110 and the conductive substrate 120 is blocked, preventing adhesion between them. The conductive substrate 120 directly contacts the adhesive layer of the carrier film, maintaining normal adhesion. This achieves differentiated adhesion within the conductive substrate waste 1202, making it easier for the waste block 1512 to detach from the substrate.

[0067] In this embodiment, step S30, "discharging the conductive substrate waste 1202 through the waste discharge membrane 130", includes forward waste discharge and reverse waste discharge.

[0068] In this embodiment, the forward waste discharge refers to the waste discharge membrane 130 discharging waste from the starting waste, wherein the starting waste refers to a section of the edge of the conductive substrate waste 1202 that can be reliably adhered to and pulled upward by the waste discharge membrane 130.

[0069] In this embodiment, during forward waste discharge, the angle between the waste discharge membrane 130 and the carrier membrane 110 is 34.2°~36.1°, which can discharge the conductive substrate waste 1202 with maximum efficiency and will not take away the support material 1204 on the carrier membrane.

[0070] In this embodiment, the reverse waste discharge is a process in which waste filaments 1514 in the unstarted waste 1504 connected to the waste block 1512 of the masking liner 1502 are detached due to the stretching effect of the waste discharge membrane 130. The waste filaments 1514 in the unstarted waste 1504 are carried away by the waste block 1512 of the masking liner area for waste discharge. Here, the unstarted waste 1504 refers to any conductive substrate waste with free edges that can be initially peeled off.

[0071] In this embodiment, during reverse waste discharge, the angle between the waste discharge membrane 130 and the carrier membrane 110 is 34.2°~36.1°, which can discharge the conductive substrate waste 1202 with maximum efficiency and will not take away the support material 1204 on the carrier membrane.

[0072] In this embodiment, the area of ​​the waste block 1512 is not less than 9 mm². 2 This is to ensure that the waste discharge membrane 130 can effectively grasp and provide sufficient traction.

[0073] This ensures that the waste block 1512 provides sufficient contact surface with the waste removal membrane 130, enabling the membrane to form a sufficiently strong and effective adhesive force on its surface. Meanwhile, the waste filaments 1514 in reverse waste removal, due to their small area and closed edges, are difficult for the membrane 130 to grasp individually. By connecting the two and ensuring that the waste block 1512 has sufficient "grasping redundancy," a stable and continuous traction force can be generated during waste removal. This force is transmitted through the waste block 1512 to the waste filaments 1514 in reverse waste removal, sufficient to overcome the adhesive force between them and the carrier membrane 110. This significantly improves the waste removal success rate and avoids the residue, breakage, or interruption of waste removal due to insufficient traction force. Simultaneously, since the traction force originates from the reliably grasped waste block 1512, rather than forcibly peeling off the microstructure, it effectively prevents adjacent effective lines from being mistakenly pulled up or deformed, thereby ensuring the structural integrity and product yield of the high-density interconnect area.

[0074] Preferably, the waste removal membrane 130 is made of a stretchable material. Due to its stretchable nature, the waste removal membrane 130 can evenly distribute tension during the peeling process, ensuring that the waste block 1512 is firmly held by the membrane while preventing localized stress concentration that could lead to breakage of the waste filaments 1514. This improves product yield.

[0075] In this embodiment, the waste wire 1514 for reverse waste discharge is a fine waste wire connecting the pins of a semiconductor IC chip, with a width ≤0.25mm, used to achieve physical die-cutting of a high-density interconnect structure.

[0076] In this embodiment, the reverse waste discharge wire 1514 is located between the pins of the integrated semiconductor IC chip, belonging to the key non-functional conductive substrate structure of the high-density interconnect area. The wire width does not exceed 0.25mm, and it is typically a thin strip or a closed ring, surrounded by effective signal lines or pads, with no free edges, making it a typical "headless waste". Because this type of fine waste has a small area, closed edges, and cannot be directly grasped by the waste discharge membrane 130, it is very easy to leave residue if traditional waste discharge methods are used. However, this invention transforms it into "tractionable auxiliary waste" by physically connecting it to the adjacent waste block 1512, combined with the design of the masking liner and the stretchable waste discharge membrane. When the waste block 1512, acting as a waste discharge leader, is peeled off by the waste discharge membrane, a continuous pulling force is applied to the fine reverse waste discharge section through a rigid connection, thereby achieving its forced detachment.

[0077] This implementation solves the core waste removal problem in high-density FDC (Flexible Die-Cut) processes, successfully eliminating sub-0.25mm level lead-free waste that is difficult to handle with traditional processes; ensuring IC packaging reliability by completely avoiding pin-to-pin short circuits, impedance abnormalities, or thermo-pressure failures caused by micro-waste residue; supporting advanced packaging requirements and meeting the mass production feasibility of fine lines (≤0.25mm) in high I / O density packages such as CSP and Fan-Out; and expanding the applicability of physical die-cutting processes, enabling FDC technology to replace some chemical etching scenarios and achieve green, efficient, and high-yield manufacturing. In summary, defining lead-free waste 1504 as micro-waste lines (≤0.25mm width) between IC pins not only reflects the technical targeting of this invention for high-end applications but also highlights its key value in the physical molding of high-density flexible circuits.

[0078] In this invention, the use of an adhesive-masking inner liner design achieves differentiated adhesion within the conductive substrate waste 1202 during waste discharge after die-cutting of the conductive substrate 120. Waste blocks 1512 easily detach from the carrier film 110, and the support material 1204 is less likely to be carried away by the waste blocks 1512, leading to product defects. Therefore, during reverse waste discharge, the waste blocks 1512 remain firmly attached to the waste discharge film 130, laying the foundation for a reverse waste discharge mechanism where the strong carry the weak.

[0079] In the waste removal method for FDC die-cut conductive substrate of the present invention, the adhesiveness range of the carrier film is 650g / 25mm to 750g / 25mm, and the angle between the waste removal film and the carrier film is 34.2° to 36.1° during waste removal. This ensures that the support material is not discharged while the waste is being discharged, thereby reducing production costs and improving product yield.

[0080] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A waste removal method for FDC die-cut conductive substrates, characterized in that, include: Before die-cutting the conductive substrate, an adhesive-masking liner is provided between the conductive substrate and the carrier film, wherein the adhesiveness of the carrier film is 650g / 25mm~750g / 25mm; After die-cutting the conductive substrate, a waste removal membrane is applied to the conductive substrate. The conductive substrate waste is discharged through the waste discharge membrane; During waste discharge, the angle between the waste discharge membrane and the supporting membrane is 34.2°~36.1°.

2. The waste removal method for FDC die-cut conductive substrate as described in claim 1, characterized in that, The adhesiveness of the waste discharge membrane is less than that of the carrier membrane, and the waste discharge membrane is a PE protective film.

3. The waste removal method for FDC die-cut conductive substrate as described in claim 1, characterized in that, The step "Providing an adhesive masking liner between the conductive substrate and the carrier film before die-cutting the conductive substrate" includes: The carrier film and the release film are laminated together and then die-cut. Waste from the die-cut release film is removed to form the adhesive-masking liner.

4. The waste removal method for FDC die-cut conductive substrate as described in claim 1, characterized in that, The step of "removing the waste conductive substrate material through the waste removal membrane" is completed by the auxiliary rod and the stripper.

5. The waste removal method for FDC die-cut conductive substrate as described in claim 1, characterized in that, The conductive substrate waste includes: starting waste, non-starting waste, and waste blocks.

6. The waste removal method for FDC die-cut conductive substrate as described in claim 5, characterized in that, The area of ​​the waste block is not less than 9mm². 2 And both the length and width are not less than 3mm.

7. The waste removal method for FDC die-cut conductive substrate as described in claim 6, characterized in that, The width of the waste material without a starting point is less than or equal to 0.25 mm, and it is connected to the waste block.

8. The waste removal method for FDC die-cut conductive substrate as described in claim 7, characterized in that, The step of "discharging conductive substrate waste through a waste discharge membrane" includes: forward waste discharge and reverse waste discharge.

9. The waste removal method for FDC die-cut conductive substrate as described in claim 8, characterized in that, The forward waste discharge refers to the waste discharge membrane discharging waste from the starting waste, wherein the starting waste refers to a section of the conductive substrate waste edge that can be reliably adhered to and pulled upward by the waste discharge membrane.

10. The waste removal method for FDC die-cut conductive substrate as described in claim 8, characterized in that, The reverse waste removal process involves the removal of waste materials without starting points that are connected to the waste material of the masking liner during the waste removal process. The waste material without starting points is then removed by the waste material in the masking liner area. Here, the waste material without starting points refers to any conductive substrate waste with free edges that can be initially peeled off.

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