A low-loss design-based storage BGA packaging method and system

Abstract

The application relates to the technical field of packaging technology regulation, and relates to a storage BGA packaging method and system based on a low-loss design, which comprises the following steps: according to a standard heat transfer ratio, the length and thickness of a solder wire scheme in a BGA packaging scheme are adjusted to obtain a primary solder wire adjustment scheme; according to an expected plastic package structure, plastic package information is adjusted before solidification to obtain updated plastic package information; the updated plastic package information is solidified to obtain an updated solidification body, stress change identification is performed on the updated solidification body to obtain a stress distribution change sequence; according to the stress distribution change sequence, stress bending-tension prediction operation is performed on the primary solder wire adjustment scheme to obtain the least tensile solder wire; according to the least tensile solder wire and the primary solder wire adjustment scheme, the solder wire thermal resistance change value is calculated, the outer layer thermal resistance of the updated plastic package information is configured according to the solder wire thermal resistance change value, and the expected plastic package information is obtained. The application improves the packaging accuracy of a BGA chip.

Description

Technical Field

[0001] This invention relates to the field of packaging technology and control technology, and in particular to a storage BGA packaging method and system based on low-loss design. Background Technology

[0002] BGA packaging is a high-density surface mount technology that achieves electrical connections through an array of solder balls on the bottom of the package. Due to its high I / O density, low parasitic parameters, and good heat dissipation performance, it has gradually replaced the square flat package method and become the main method for packaging chips.

[0003] Memory chips are integrated circuits that enable data writing, reading, and long-term storage through electrical, magnetic, or optical means. Their high-speed read / write and low-latency characteristics make them well-suited for BGA (Block Grid Array) packaging. However, the warpage of the BGA package can cause a shift in the heat transfer path, increasing heat loss. Currently, many low-loss design schemes developed by engineers experience performance deviations during the curing process, making it difficult to determine the accuracy of the design results and hindering the verification and development of low-loss designs. Summary of the Invention

[0004] This invention provides a memory BGA packaging method based on low-loss design, the main purpose of which is to improve the packaging accuracy of BGA chips.

[0005] To achieve the above objectives, the present invention provides a memory BGA packaging method based on low-loss design, comprising: A BGA packaging scheme is obtained. Using a pre-built thermal simulation device, the length and thickness of the preset bonding wire scheme in the BGA packaging scheme are adjusted according to the preset standard heat transfer ratio to obtain a primary bonding wire adjustment scheme. The molding compound information in the BGA packaging scheme is obtained, and the molding compound information is adjusted before curing according to the preset desired molding compound structure using pre-constructed digital twin technology to obtain updated molding compound information. Using the digital twin technology, the updated molding compound information is solidified to obtain an updated solidified body. Then, using a pre-constructed finite element method, stress change identification is performed on the updated solidified body to obtain a stress distribution change sequence. Based on the stress distribution change sequence, a stress bending-stretching prediction operation is performed on the primary wire bonding adjustment scheme to obtain the wire bonding bending and stretching results. The wire bonding bending and stretching results are then minimized to obtain the least stretched wire bonding, and the initial wire bonding layout path of the least stretched wire bonding is obtained. Based on the minimum tensioned wire and the primary wire adjustment scheme, the change value of the wire thermal resistance is calculated, and based on the change value of the wire thermal resistance, the outer layer thermal resistance is configured for the updated molded body information to obtain the desired molded body information. Based on the primary wire bonding adjustment scheme, the initial wire bonding layout path, and the desired molding compound information, the desired BGA packaging scheme is constructed.

[0006] Optionally, the step of using a pre-built thermal simulation device to adjust the length and thickness of the preset bonding wire scheme in the BGA packaging scheme according to a preset standard heat transfer ratio, to obtain a primary bonding wire adjustment scheme, includes: The heat transfer path distribution is obtained by using a pre-built thermal simulation device to identify the heat dissipation ratio of the BGA packaging scheme based on the heat dissipation of the bonding wire pins and the heat dissipation of the back molded body. The difference between the heat transfer path distribution and the preset standard heat transfer ratio is calculated to obtain the heat transfer difference; Based on the heat transfer difference, the preset wire bonding scheme in the BGA packaging scheme is adjusted based on the length and thickness to obtain a primary wire bonding adjustment scheme.

[0007] Optionally, the step of adjusting the preset wire bonding scheme in the BGA packaging scheme based on the heat transfer difference, according to the feedback adjustment of length and thickness, to obtain a primary wire bonding adjustment scheme, includes: Based on the preset empirical relationship between thermal resistance and heat dissipation ratio, the heat transfer difference is weighted and calculated to obtain the thermal resistance change rate, wherein the expression for the thermal resistance change rate is:

[0008] In the formula, This represents the rate of change of thermal resistance. This represents the empirical relationship between thermal resistance and heat dissipation ratio. This represents the heat transfer difference; Obtain the default wire length and default wire thickness from the preset wire bonding scheme in the BGA packaging scheme; Using a preset wire bonding thermal resistance formula, the thermal resistance of the default wire bonding length and thickness is calculated to obtain an initial thermal resistance value, wherein the expression for the initial thermal resistance value is:

[0009]

[0010] In the formula, This represents the initial thermal resistance value. This indicates the default solder wire length. This indicates the cross-sectional area of ​​the solder wire. This indicates the default solder wire thickness. This indicates the thermal conductivity of the bonding wire material; Based on the rate of change of thermal resistance, the initial thermal resistance value is weighted and calculated to obtain the desired thermal resistance value, wherein the expression for the desired thermal resistance value is:

[0011] In the formula, This represents the desired thermal resistance value; Obtain the adjustable range of the wire bonding, and based on the adjustable range of the wire bonding, randomly adjust the default wire bonding length and default wire bonding thickness with the target of the desired thermal resistance value to obtain random wire bonding adjustment parameters; The overall volume of the random wire bonding adjustment parameters is minimized to obtain the primary wire bonding adjustment scheme.

[0012] Optionally, the step of using pre-constructed digital twin technology to adjust the molded body information before curing according to a preset desired molded body structure to obtain updated molded body information includes: Using pre-constructed digital twin technology, the information of the molded body is cured according to a preset curing strategy to obtain a cured molded body; The structure of the cured molded body is identified to obtain a structural diagram of the molded body; Calculate the structural difference between the molded body structure diagram and the preset desired molded body structure, and use a pre-trained molded body information-cured structure correspondence network to predict the molded body structure based on the structural difference to obtain the molded body structure offset information. Based on the molded body structure offset information, the layout of the molded body information is adjusted to obtain updated molded body information.

[0013] Optionally, before utilizing the pre-trained molding information-cured structure correspondence network, the method further includes: Using a pre-built random generator, a set of random packaging information is obtained. Using each random packaging information in the set of random packaging information, a pre-built standard substrate is independently packaged to obtain a set of molded sample bodies. According to the curing strategy, the encapsulated sample set is cured to obtain a cured sample set, and the cured sample set is grouped into a first training set and a second training set according to a preset ratio; Using the first training set, the pre-constructed regression network model is trained according to the pre-constructed cross-entropy loss algorithm and gradient descent algorithm to obtain the initial solidification prediction model. The input-output vector of the initial solidification prediction model is reversed to obtain the initial plastic sealing prediction model. Using the second training set, the initial molding prediction model is trained to obtain a molding information-cured structure correspondence network.

[0014] Optionally, the step of using a pre-constructed finite element method to identify stress changes in the updated solidified body and obtain a stress distribution change sequence includes: The molding morphology at each time point during the curing process of the updated molding compound information is obtained to obtain a curing intermediate sequence, wherein the last curing intermediate in the curing intermediate sequence is the updated cured compound; Based on the pre-constructed finite element method, each solidified intermediate in the solidified intermediate sequence is decomposed to obtain the intermediate matrix sequence; Obtain the target encapsulation by acquiring the encapsulation at any position in any intermediate matrix of the intermediate matrix sequence. Calculate the deformation vector of the target molding body between two adjacent intermediate body matrices, and predict the stress distribution in the target molding body corresponding to the deformation vector; The stress distribution of all target molding bodies in the intermediate matrix sequence is obtained to obtain the stress distribution change sequence.

[0015] Optionally, predicting the stress distribution in the target molding compound corresponding to the deformation vector includes: The deformation vector is classified based on bending deformation and tensile deformation to obtain the deformation type; Based on the deformation type, strain is calculated on the deformation vector to obtain a strain vector, wherein the expression of the strain vector is:

[0016] In the formula, This represents the strain vector. This represents the distance between the location of the calculated stress and the center point of the target molded body section. Indicates the bending radius. Indicates the type of deformation. This indicates that the deformation type is bending deformation. This indicates that the deformation type is tensile deformation. Indicates the amount of expansion or contraction. Indicates the original size of the target encapsulation; Based on the pre-constructed Huke's law, stress calculation is performed on the strain vector to obtain the stress distribution in the target encapsulation body.

[0017] Optionally, the step of performing a stress bending-stretching prediction operation on the primary wire bonding adjustment scheme based on the stress distribution change sequence to obtain the wire bonding bending-stretching results includes: Obtain the initial position in the primary wire bonding adjustment scheme to obtain the initial wire bonding distribution; Within a preset curing time, based on a preset time frequency, the initial solder wire distribution is used to perform three-dimensional positioning in the stress distribution change sequence to obtain the stress distribution on the solder wire surface. Using a pre-built weld wire deformation prediction model, a bending-stretching prediction operation is performed on the surface stress distribution of the weld wire to obtain an updated weld wire distribution; The updated solder wire distribution is used to replace the initial solder wire distribution, and the operation of three-dimensional positioning of the stress distribution change sequence using the initial solder wire distribution according to the preset time frequency is returned until the curing time ends. Then the updated solder wire distribution is output to obtain the solder wire bending and stretching results.

[0018] Optionally, the step of configuring the outer layer thermal resistance of the updated molding compound information based on the change value of the bonding wire thermal resistance to obtain the desired molding compound information includes: Determine the type of positive or negative value of the change in thermal resistance of the bonding wire; If the change value of the thermal resistance of the bonding wire is a preset negative number, the thermal simulation equipment is used to calculate the encapsulation volume corresponding to the change value of the thermal resistance of the bonding wire, and the updated encapsulation information is reduced based on the encapsulation volume to obtain the desired encapsulation information. If the change in thermal resistance of the bonding wire is a preset positive number, the coating material is obtained, and the coating volume corresponding to the change in thermal resistance of the bonding wire is calculated using the thermal simulation equipment. The coating material of the coating volume is then used to fill and update the information of the updated encapsulation to obtain the desired encapsulation information.

[0019] To achieve the above objectives, the present invention also provides a memory BGA packaging system based on a low-loss design, comprising: The packaging scheme acquisition module is used to acquire BGA packaging schemes. Using a pre-built thermal simulation device, the length and thickness of the preset bonding wire scheme in the BGA packaging scheme are adjusted according to the preset standard heat transfer ratio to obtain a primary bonding wire adjustment scheme. The molding compound adjustment module is used to acquire molding compound information in the BGA packaging scheme, and use pre-constructed digital twin technology to adjust the molding compound information before curing according to the preset desired molding compound structure to obtain updated molding compound information. The wire bonding layout adjustment module is used to solidify the updated molding compound information using the digital twin technology to obtain an updated solidified body, and to identify stress changes in the updated solidified body using a pre-constructed finite element method to obtain a stress distribution change sequence. Based on the stress distribution change sequence, the module performs stress bending-stretching prediction on the primary wire bonding adjustment scheme to obtain wire bending-stretching results, minimizes the wire bending-stretching results to obtain the least stretched wire, and obtains the initial wire bonding layout path of the least stretched wire. The secondary adjustment module for the package is used to calculate the change value of the thermal resistance of the bonding wires according to the minimum stretched bonding wires and the primary bonding wire adjustment scheme, and to configure the outer layer thermal resistance of the updated molded package information according to the change value of the thermal resistance of the bonding wires to obtain the desired molded package information. It is also used to construct the desired BGA package scheme according to the primary bonding wire adjustment scheme, the initial bonding wire layout path and the desired molded package information.

[0020] To address the above problems, the present invention also provides an electronic device, the electronic device comprising: Memory, storing at least one instruction; The processor executes the instructions stored in the memory to implement the memory BGA packaging method based on low-loss design described above.

[0021] To address the aforementioned problems, the present invention also provides a computer-readable storage medium storing at least one instruction, which is executed by a processor in an electronic device to implement the storage BGA packaging method based on low-loss design described above.

[0022] To address the problems described in the background section, this invention first obtains a BGA packaging scheme designed by engineers. Then, it uses thermal simulation equipment to initialize the length and thickness of the bonding wires, ensuring the thermal balance of the BGA packaging scheme. Next, this invention uses digital twin technology to simulate the curing process of the molded enclosure, predicting the curing result and extracting and refining any depressions or protrusions in the curing result to obtain updated molded enclosure information. During the curing prediction process, this invention can also predict the stress distribution, obtaining a stress distribution change sequence. This allows for the prediction of bonding wire position changes and bending / stretching conditions. If the bonding wires bend or stretch / shrink, the heat transfer efficiency of the bonding wires will change, affecting the originally configured thermal balance. Therefore, this invention can calculate the change in thermal resistance of the bonding wires, thereby making secondary adjustments to the molded enclosure to obtain the desired BGA packaging scheme that meets the engineers' design expectations. Therefore, this invention can improve the packaging accuracy of BGA chips. Attached Figure Description

[0023] Figure 1A schematic flowchart of a storage BGA packaging method based on low-loss design provided in an embodiment of the present invention; Figure 2 A functional block diagram of a low-loss BGA packaging system for storage provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of an electronic device that implements the low-loss BGA packaging method for memory according to an embodiment of the present invention.

[0024] Explanation of reference numerals in the attached figures: 10. Electronic device; 11. Processor; 12. Memory; 13. Bus.

[0025] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0026] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0027] This application provides a storage BGA packaging method based on low-loss design. The execution entity of the storage BGA packaging method based on low-loss design includes, but is not limited to, at least one of the following electronic devices that can be configured to execute the method provided in this application embodiment: a server, a terminal, etc. In other words, the storage BGA packaging method based on low-loss design can be executed by software or hardware installed on a terminal device or a server device, and the software can be a blockchain platform. The server includes, but is not limited to, a single server, a server cluster, a cloud server, or a cloud server cluster.

[0028] Reference Figure 1 The diagram shown is a flowchart illustrating a low-loss BGA packaging method for memory provided in an embodiment of the present invention. In this embodiment, the low-loss BGA packaging method for memory includes: S1. Obtain the BGA packaging scheme. Using a pre-built thermal simulation device, adjust the length and thickness of the preset bonding wire scheme in the BGA packaging scheme according to the preset standard heat transfer ratio to obtain the primary bonding wire adjustment scheme.

[0029] The BGA packaging solution refers to the structural design of the BGA by professional technicians, including the length, width, and thickness information of the molded body and the arrangement of the bonding wires.

[0030] The thermal simulation equipment is an engineering tool based on computational fluid dynamics (CFD) and heat transfer principles. It simulates the heat transfer process (including heat conduction, convection, and radiation) within an object and its surrounding environment by establishing a virtual model, thereby predicting key parameters such as temperature distribution, heat flux density, and thermal resistance. In this invention, software such as ANSYS Icepak and FloTHERM are used to implement a chip packaging heat transfer model.

[0031] The standard heat transfer ratio is 60% for heat dissipation from the wire bonding pins and 40% for heat dissipation from the molding compound.

[0032] The length and thickness adjustment refers to the process of adjusting the length and cross-sectional area of ​​the solder wire.

[0033] The wire bonding scheme refers to the set of information recording the wire length, thickness, and arrangement path included in the BGA packaging scheme.

[0034] The primary wire bonding adjustment scheme refers to a wire bonding scheme that adjusts the length and thickness information.

[0035] In detail, in this embodiment of the invention, the use of a pre-built thermal simulation device to adjust the length and thickness of the preset bonding wire scheme in the BGA packaging scheme according to a preset standard heat transfer ratio, to obtain a primary bonding wire adjustment scheme, includes: The heat transfer path distribution is obtained by using a pre-built thermal simulation device to identify the heat dissipation ratio of the BGA packaging scheme based on the heat dissipation of the bonding wire pins and the heat dissipation of the back molded body. The difference between the heat transfer path distribution and the preset standard heat transfer ratio is calculated to obtain the heat transfer difference; Based on the heat transfer difference, the preset wire bonding scheme in the BGA packaging scheme is adjusted according to the feedback of length and thickness to obtain a primary wire bonding adjustment scheme.

[0036] The heat dissipation ratio identification operation refers to the process of detecting the heat dissipation ratio of the two heat dissipation paths—the heat dissipation of the bonding wire pins and the heat dissipation of the back plastic package—when the chip is heating up using thermal simulation equipment.

[0037] The heat transfer path distribution refers to the identification result of the heat dissipation ratio identification operation, such as the heat dissipation of the bonding wire pins and the heat dissipation of the back plastic package being 50%:50%.

[0038] The heat transfer difference is the difference between the heat transfer path distribution and the preset standard heat transfer ratio. For example, if the heat dissipation of the bonding pins in the heat transfer path distribution is 50% and the standard heat transfer ratio is 60%, then the heat transfer difference is 10%.

[0039] The feedback adjustment based on length and thickness refers to the process of adjusting the length and thickness of the bonding wire according to the heat transfer difference. For example, when the heat transfer difference is positive, it indicates that the heat dissipation effect of the bonding wire pin needs to be improved. Then, since the heat dissipation effect is inversely proportional to the thermal resistance, when the heat transfer difference is positive, the thermal resistance of the bonding wire needs to be reduced. This invention can reduce the thermal resistance by reducing the bonding wire length and increasing the bonding wire diameter.

[0040] Specifically, in this embodiment of the invention, the BGA packaging scheme was designed by engineers, and its thermal balance has not yet been verified. Therefore, thermal simulation equipment can be used to identify the heat dissipation ratio based on the heat dissipation of the bonding wire pins and the heat dissipation of the back molded package, thereby obtaining the heat transfer path distribution. Considering different application scenarios of the chip and whether or not a heat sink is available, it is necessary to balance the heat dissipation effect of different heat transfer paths in advance. This invention presets the heat dissipation ratio of a main heat dissipation path (i.e., heat dissipation of the bonding wire pins) to be 60%. Then, by checking the difference between the heat transfer path distribution and the preset standard heat transfer ratio, the heat transfer difference can be obtained, which can then determine whether the heat dissipation effect of the bonding wire pins needs to be improved or suppressed, thus obtaining a primary bonding wire adjustment scheme.

[0041] In detail, in this embodiment of the invention, the step of adjusting the preset wire bonding scheme in the BGA packaging scheme based on the heat transfer difference, according to the feedback adjustment of length and thickness, to obtain a primary wire bonding adjustment scheme includes: Based on the preset empirical relationship between thermal resistance and heat dissipation ratio, the heat transfer difference is weighted and calculated to obtain the thermal resistance change rate, wherein the expression for the thermal resistance change rate is:

[0042] In the formula, This represents the rate of change of thermal resistance. This represents the empirical relationship between thermal resistance and heat dissipation ratio. This represents the heat transfer difference; Obtain the default wire length and default wire thickness from the preset wire bonding scheme in the BGA packaging scheme; Using a preset thermal resistance formula for wire bonding, the thermal resistance is calculated for the default wire bonding length and thickness to obtain an initial thermal resistance value. The expression for the initial thermal resistance value is as follows:

[0043]

[0044] In the formula, This represents the initial thermal resistance value. This indicates the default solder wire length. This indicates the cross-sectional area of ​​the solder wire. This indicates the default wire thickness. This indicates the thermal conductivity of the bonding wire material; Based on the rate of change of thermal resistance, the initial thermal resistance value is weighted and calculated to obtain the desired thermal resistance value, wherein the expression for the desired thermal resistance value is:

[0045] In the formula, This represents the desired thermal resistance value; Obtain the adjustable range of the wire bonding, and based on the adjustable range of the wire bonding, randomly adjust the default wire bonding length and default wire bonding thickness with the target of the desired thermal resistance value to obtain random wire bonding adjustment parameters; The overall volume of the random wire bonding adjustment parameters is minimized to obtain the primary wire bonding adjustment scheme.

[0046] The empirical relationship between thermal resistance and heat dissipation ratio is configured as 2, which means that increasing the thermal resistance of the bonding wire by 20% will reduce the heat dissipation effect by 10%.

[0047] The thermal resistance change rate refers to the product of the empirical relationship between thermal resistance and heat dissipation ratio and the difference in heat transfer.

[0048] The default wire length is configured to be 0.1 mm, and the default wire thickness is configured to be 0.02 mm in radius.

[0049] The thermal resistance formula for the bonding wire refers to a formula that describes the relationship between the thermal resistance value of the bonding wire and its length, cross-sectional area, and thermal conductivity. The bonding wire of this invention uses gold as its material. The configuration is 317 W / (m·K).

[0050] The thermal resistance calculation refers to the process of substituting the default wire length and thickness into the wire thermal resistance formula. The initial thermal resistance value refers to the calculation result after substituting the default wire length and thickness into the wire thermal resistance formula.

[0051] The desired thermal resistance value is the initial thermal resistance value adjusted according to the rate of change of thermal resistance.

[0052] The adjustable range of the bonding wire refers to the range of bonding wire length from 0.8 to 1.2 mm and the range of bonding wire cross-sectional radius from 0.015 to 0.025 mm.

[0053] The parameter random adjustment operation with the target being the desired thermal resistance value refers to the parameter configuration process of randomly adjusting the length and thickness to make the thermal resistance meet the desired thermal resistance value.

[0054] The random wire bonding adjustment parameters refer to a random set of length and thickness information that makes the thermal resistance equal to the desired thermal resistance value.

[0055] The total volume minimization operation refers to the process of identifying the wire parameter with the smallest wire quality (or volume) among various random wire bonding adjustment parameters.

[0056] Specifically, in this embodiment of the invention, the heat transfer difference is converted into a thermal resistance change rate based on the empirical relationship between thermal resistance and heat dissipation ratio. Then, the initial thermal resistance value is calculated using the wire bonding thermal resistance formula, and the initial thermal resistance value is configured according to the thermal resistance change rate to obtain the desired thermal resistance value.

[0057] Specifically, once the desired thermal resistance value is obtained, the length and thickness of the bonding wires can be randomly combined within the adjustable range to obtain random bonding wire adjustment parameters. Finally, considering the overall chip quality, the parameters are selected using an operation that minimizes the overall volume, resulting in a primary bonding wire adjustment scheme.

[0058] S2. Obtain the molding compound information in the BGA packaging scheme, and use the pre-constructed digital twin technology to adjust the molding compound information before curing according to the preset desired molding compound structure to obtain updated molding compound information.

[0059] The information about the encapsulated body refers to the information recording the length, width, and height of the encapsulated body.

[0060] The digital twin technology refers to the technology of reconstructing the structure and physical properties of a plastic encapsulation in a virtual environment by simulating multi-physics fields.

[0061] The desired molded body structure refers to the length, width, and height of the molded body after curing.

[0062] The pre-curing adjustment refers to the process of simulating the curing of the molding compound information using virtual means, and then making targeted corrections to the molding compound information in advance based on the defects in the simulated curing results.

[0063] The updated molding compound information refers to the molding compound information that has been corrected through a virtual simulation curing process.

[0064] In detail, in this embodiment of the invention, the step of using pre-constructed digital twin technology to adjust the molded body information before curing according to a preset desired molded body structure to obtain updated molded body information includes: Using pre-constructed digital twin technology, the information of the molded body is cured according to a preset curing strategy to obtain a cured molded body; The structure of the cured molded body is identified to obtain a structural diagram of the molded body; Calculate the structural difference between the molded body structure diagram and the preset desired molded body structure, and use a pre-trained molded body information-cured structure correspondence network to predict the molded body structure based on the structural difference to obtain the molded body structure offset information. Based on the molded body structure offset information, the layout of the molded body information is adjusted to obtain updated molded body information.

[0065] The curing strategy refers to the preset parameters of the curing process, such as a curing temperature of 170°C and a curing time of 2 hours.

[0066] The curing operation refers to the process of transforming a semi-solid encapsulated material (usually an epoxy resin-based composite material) into a solid state through physical or chemical changes. The cured encapsulated material refers to the cured encapsulated material.

[0067] The structural identification refers to the process of identifying the internal structure of the cured encapsulated body using image scanning technology. The encapsulated body structure diagram refers to the structural identification result of the cured encapsulated body.

[0068] The structural difference refers to the structural difference between the molded body structure diagram and the preset desired molded body structure. For example, there may be a depression in the molded body structure diagram within the range of a certain coordinate to a certain coordinate.

[0069] The molding information-cured structure correspondence network refers to a regression network model that has learned the mapping relationship between the molding information before curing and the cured structure after curing.

[0070] The aforementioned molding compound structure prediction refers to the process of identifying defects in the cured molding compound and transforming the defective parts into the structural modifications that the molding compound needs before curing.

[0071] The molded body structure offset information refers to the structure of the molded body that needs to be modified before curing.

[0072] The layout adjustment refers to the process of adding the molded body structure offset information to the molded body information to make the molded body information more complete.

[0073] Specifically, in this embodiment of the invention, a virtual model of the encapsulated body is first constructed using digital twin technology. Then, the virtual model is solidified and simulated according to a solidification strategy to obtain a solidified encapsulated body. Next, the structure of the solidified encapsulated body is obtained using image recognition or ray scanning to obtain a structural diagram of the encapsulated body. Finally, the structural difference between the structural diagram of the encapsulated body and the preset desired encapsulated body structure is obtained.

[0074] Specifically, in this embodiment of the invention, the correspondence between molding information and cured structure is learned in the molding information-cured structure correspondence network, thus the structural difference can be transformed into molding body structural offset information. The invention then supplements the molding body information based on the molding body structural offset information to obtain updated molding body information.

[0075] In detail, in this embodiment of the invention, before utilizing the pre-trained encapsulation information-cured structure correspondence network, the method further includes: Using a pre-built random generator, a set of random packaging information is obtained. Using each random packaging information in the set of random packaging information, a pre-built standard substrate is independently packaged to obtain a set of molded sample bodies. According to the curing strategy, the encapsulated sample set is cured to obtain a cured sample set, and the cured sample set is grouped into a first training set and a second training set according to a preset ratio; Using the first training set, the pre-constructed regression network model is trained according to the pre-constructed cross-entropy loss algorithm and gradient descent algorithm to obtain the initial solidification prediction model. The input-output vector of the initial solidification prediction model is reversed to obtain the initial plastic sealing prediction model. Using the second training set, the initial molding prediction model is trained to obtain a molding information-cured structure correspondence network.

[0076] The random generator refers to a device that randomly generates length, width, and thickness information.

[0077] The random encapsulation information set refers to the set of combinations of various length, width, and thickness information.

[0078] The standard substrate refers to the sheet-like structure that carries the chip and the molding compound.

[0079] The independent packaging refers to the process of placing a chip on a standard substrate and encapsulating part of the chip between the plastic package and the standard substrate according to random packaging information.

[0080] The molded sample set refers to the set of packaging results where each random packaging information independently packages each chip.

[0081] The cured sample set refers to a set of cured encapsulated samples.

[0082] The preset ratio is configured such that the ratio of the first training set to the second training set is 6:4.

[0083] The first training set refers to 60% of the solidified sample set. The second training set refers to 40% of the solidified sample set.

[0084] The cross-entropy loss algorithm refers to an algorithm that calculates the difference between the model's output and the actual result. The gradient descent algorithm refers to an algorithm that minimizes the loss function and finds the optimal parameters of the model.

[0085] The regression network model refers to a network model that learns the developmental relationships between multiple vectors. The training refers to a machine learning process used to learn the mapping relationship between encapsulated information and the solidified structure.

[0086] The initial fixed prediction model refers to the regression network model trained on the first training set.

[0087] The input-output vector inversion refers to the process of transforming the output object of the initial fixed prediction model into the input object, and then adjusting the parameters of the input object as the output object of the model.

[0088] The initial molding prediction model refers to the initial curing prediction model after the input-output vector inversion operation.

[0089] Specifically, this invention uses a random generator to quickly generate data, thereby obtaining a random packaging information set. Then, based on the packaging on a standard substrate, a molded sample set is obtained, which then participates in the curing process to obtain a cured sample set.

[0090] Specifically, in this embodiment of the invention, the training model not only needs to simulate the cured structure based on the encapsulation information, but also needs to predict the improved encapsulation information based on the modified cured structure. Therefore, this invention divides the cured sample set into a first training set and a second training set through forward and reverse training, thereby training and obtaining the encapsulation information-cured structure correspondence network.

[0091] S3. Using the digital twin technology, the updated encapsulated body information is solidified to obtain an updated solidified body. Then, using the pre-constructed finite element method, stress change identification is performed on the updated solidified body to obtain a stress distribution change sequence.

[0092] The updated cured body refers to the curing result of the molded body corresponding to the updated molded body information.

[0093] The finite element method refers to a method of dividing a large object into a finite number of small units, and observing the changes in each small unit to observe the changes in various positions inside the large object.

[0094] The stress change identification refers to the process of inferring the strain vector based on the deformation of the object, and then inferring the stress magnitude distribution based on the strain vector.

[0095] The stress distribution change sequence refers to the stress distribution at each time point during the process of the molded body corresponding to the updated molded body information becoming the updated cured body.

[0096] In detail, in this embodiment of the invention, the step of using a pre-constructed finite element method to identify stress changes in the updated solidified body and obtain a stress distribution change sequence includes: The molding morphology at each time point during the curing process of the updated molding compound information is obtained to obtain a curing intermediate sequence, wherein the last curing intermediate in the curing intermediate sequence is the updated cured compound; Based on the pre-constructed finite element method, each solidified intermediate in the solidified intermediate sequence is decomposed to obtain the intermediate matrix sequence; Obtain the target encapsulation by acquiring the encapsulation at any position in any intermediate matrix of the intermediate matrix sequence. Calculate the deformation vector of the target molding body between two adjacent intermediate body matrices, and predict the stress distribution in the target molding body corresponding to the deformation vector; The stress distribution of all target molding bodies in the intermediate matrix sequence is obtained to obtain the stress distribution change sequence.

[0097] The solidification intermediate sequence refers to the molded form at each time point in the process of solidifying the updated molded information.

[0098] The splitting refers to the process of breaking down the solidified intermediate into a finite number of small units.

[0099] The intermediate matrix sequence refers to the sequence of the splitting results of each solidified intermediate.

[0100] The target encapsulation refers to an encapsulation unit at any position in any intermediate matrix.

[0101] The deformation vector refers to the deformation of the target molding body between adjacent time units.

[0102] The prediction of the stress distribution corresponding to the deformation vector in the target molding body refers to the process of inferring strain from deformation based on the deformation type, and then inferring stress from strain, which will be explained in detail later.

[0103] Specifically, in this embodiment of the invention, the morphology of the encapsulated body at adjacent time points is first obtained to obtain a sequence of cured intermediates. Then, the finite element method is used to decompose each cured intermediate to obtain a sequence of intermediate matrix.

[0104] Specifically, in this embodiment of the invention, a target encapsulator is obtained by selecting an encapsulator at an arbitrary position from any intermediate matrix. This allows observation of the deformation vector of the target encapsulator between two adjacent intermediate matrices. Based on the deformation type, the stress distribution corresponding to the deformation vector in the target encapsulator is then predicted. Finally, the stress distribution change sequence of the entire curing intermediate sequence is obtained.

[0105] In detail, in this embodiment of the invention, predicting the stress distribution corresponding to the deformation vector in the target molding compound includes: The deformation vector is classified based on bending deformation and tensile deformation to obtain the deformation type; Based on the deformation type, strain is calculated on the deformation vector to obtain a strain vector, wherein the expression of the strain vector is:

[0106] In the formula, This represents the strain vector. This represents the distance between the location of the calculated stress and the center point of the target molding body cross-section. Indicates the bending radius. Indicates the type of deformation. This indicates that the deformation type is bending deformation. This indicates that the deformation type is tensile deformation. Indicates the amount of expansion or contraction. Indicates the original size of the target encapsulation; Based on the pre-constructed Huke's law, stress calculation is performed on the strain vector to obtain the stress distribution in the target encapsulation body.

[0107] The classification judgment based on bending deformation and tensile deformation refers to the process of classifying deformation types through an image recognition neural network.

[0108] The deformation type is one of the two labels configured in this invention, such as bending deformation and tensile deformation.

[0109] Wherein, the strain calculation refers to the calculation based on the above The process of calculating using the formula. The strain vector refers to the strain calculation result of the deformation vector.

[0110] Huke's Law refers to:

[0111] In the formula, Indicates stress, Represents the strain vector. The elastic modulus of the material is indicated. In this invention, the encapsulating material is epoxy resin, and the elastic modulus is approximately 2-4 GPa.

[0112] Specifically, in this embodiment of the invention, in order to predict the stress distribution, the strain distribution must first be identified. This invention can transform the deformation vector into a strain vector according to the deformation type and the expression of the strain vector, and finally transform the strain vector into a stress vector through Huke's law, thereby obtaining the stress distribution.

[0113] S4. Based on the stress distribution change sequence, perform stress bending-stretching prediction operation on the primary wire bonding adjustment scheme to obtain the wire bonding bending and stretching results, minimize the wire bonding bending and stretching results to obtain the least stretched wire bonding, and obtain the initial wire bonding layout path of the least stretched wire bonding.

[0114] The stress bending-tension prediction operation uses a neural network model to predict the deformation of the welding wire under stress.

[0115] The aforementioned wire bending and stretching result refers to the primary wire adjustment scheme after bending through a stress distribution change sequence.

[0116] Minimizing the bending and stretching results of the welding wire refers to the process of calculating the case where the stress bending and stretching variables are minimized in the stress bending-stretching prediction operation.

[0117] The minimum stretching wire refers to the bending and stretching result of the wire under stress with the least stretching variable, including length, thickness and wire path posture.

[0118] The initial wire bonding path refers to the wire bonding path posture with minimal wire stretching.

[0119] In detail, in this embodiment of the invention, the step of performing stress bending-stretching prediction operation on the primary wire bonding adjustment scheme based on the stress distribution change sequence to obtain the wire bonding bending-stretching results includes: Obtain the initial position in the primary wire bonding adjustment scheme to obtain the initial wire bonding distribution; Within a preset curing time, based on a preset time frequency, the initial solder wire distribution is used to perform three-dimensional positioning in the stress distribution change sequence to obtain the stress distribution on the solder wire surface. Using a pre-built weld wire deformation prediction model, a bending-stretching prediction operation is performed on the surface stress distribution of the weld wire to obtain an updated weld wire distribution; The updated solder wire distribution is used to replace the initial solder wire distribution, and the operation of three-dimensional positioning of the stress distribution change sequence using the initial solder wire distribution according to the preset time frequency is returned until the curing time ends. Then the updated solder wire distribution is output to obtain the solder wire bending and stretching results.

[0120] The initial wire bonding distribution refers to the initial position in the primary wire bonding adjustment scheme.

[0121] The curing time is 2 hours.

[0122] The preset time frequency is once every 10 seconds.

[0123] The three-dimensional positioning refers to the process of identifying the overlap between the initial solder wire distribution and the stress distribution change sequence in physical location.

[0124] The stress distribution on the surface of the bonding wire refers to the stress distribution that overlaps with the bonding wire distribution in the stress distribution change sequence.

[0125] The weld wire deformation prediction model refers to a regression network model that has learned the relationship between stress change and weld wire deformation.

[0126] The bending-stretching prediction operation refers to the execution process of the wire deformation prediction model, which is used to predict the deformation that will occur in the wire based on the stress distribution in the area where the wire is located.

[0127] The updated solder wire distribution refers to the initial solder wire distribution after stress changes.

[0128] Specifically, in this embodiment of the invention, the stress distribution at the location of the solder wire can be inferred based on the stress distribution change sequence of the molding compound, thereby obtaining the stress distribution on the surface of the solder wire, and then the morphological change of the solder wire can be predicted based on the stress distribution on the surface of the solder wire, thereby obtaining an updated solder wire distribution.

[0129] In this embodiment of the invention, the volume and stress distribution of the encapsulated body change constantly during the curing process. Therefore, it is necessary to update the initial solder wire distribution by updating the solder wire distribution, so as to achieve continuous prediction of the solder wire distribution and obtain the final solder wire bending and stretching results.

[0130] S5. Based on the minimum tensile bonding wire and the primary bonding wire adjustment scheme, calculate the change value of the bonding wire thermal resistance, and based on the change value of the bonding wire thermal resistance, configure the outer layer thermal resistance of the updated molding compound information to obtain the desired molding compound information.

[0131] The calculated change in thermal resistance of the wire refers to the change in thermal resistance of the wire as it changes from the initial primary wire adjustment scheme to the minimum tension wire.

[0132] The outer thermal resistance configuration refers to the process of adding thermally conductive materials such as coatings or metal plates to the outer shell of the encapsulated body.

[0133] The desired molding compound information is updated through an outer thermal resistance configuration operation.

[0134] In detail, in this embodiment of the invention, the step of configuring the outer layer thermal resistance of the updated molding compound information based on the change value of the bonding wire thermal resistance to obtain the desired molding compound information includes: Determine the type of positive or negative value of the change in thermal resistance of the bonding wire; If the change value of the thermal resistance of the bonding wire is a preset negative number, the thermal simulation equipment is used to calculate the encapsulation volume corresponding to the change value of the thermal resistance of the bonding wire, and the updated encapsulation information is reduced based on the encapsulation volume to obtain the desired encapsulation information. If the change in thermal resistance of the bonding wire is a preset positive number, the coating material is obtained, and the coating volume corresponding to the change in thermal resistance of the bonding wire is calculated using the thermal simulation equipment. The coating material of the coating volume is then used to fill and update the information of the updated encapsulation to obtain the desired encapsulation information.

[0135] The positive / negative number type refers to the label indicating whether the change in thermal resistance of the bonding wire is greater than 0.

[0136] The negative number type refers to a change in thermal resistance of the bonding wire that is less than 0. Similarly, the positive number type refers to a change in thermal resistance of the bonding wire that is greater than 0.

[0137] The encapsulated volume refers to the portion of the structure whose thermal conductivity can be altered, calculated using thermal simulation equipment.

[0138] The reduction refers to the process of cutting the thickness of the encapsulation or etching away a portion of the encapsulation.

[0139] The coating material, such as resin or patch, has a lower heat dissipation performance than the encapsulated material.

[0140] The coating volume refers to the volume of coating material required to increase the thermal resistance change of the bonding wire.

[0141] The filling update refers to the process of applying a coating to the outer shell that updates the encapsulation information.

[0142] Specifically, in this embodiment of the invention, when the change value of the thermal resistance of the bonding wire is greater than 0, it indicates that thermal resistance needs to be added to the encapsulation, such as by applying a coating or other technical means.

[0143] If the change in thermal resistance of the bonding wire is less than 0, it indicates that the heat transfer efficiency of the bonding wire is more efficient. In order to ensure thermal balance, the thermal conductivity of the molding compound needs to be improved. Therefore, etching and other methods are needed to reduce the thickness and volume of the molding compound.

[0144] Specifically, in this embodiment of the invention, by observing the change in thermal resistance of the bonding wire generated by the minimum stretched bonding wire, the molding compound is processed equivalently, thereby achieving a further change in the information of the molding compound to obtain the desired information of the molding compound.

[0145] S6. Based on the primary bonding wire adjustment scheme, the initial bonding wire layout path, and the desired molding compound information, construct the desired BGA packaging scheme.

[0146] Specifically, in this embodiment of the invention, the initial adjustment of the primary wire bonding scheme means adjusting the wire length and thickness, followed by adjusting the initial wire bonding path to obtain a wire bonding path least affected by stress changes. Finally, adjusting the desired molded package information means eliminating interference from changes in the wire bonding path, thereby achieving thermal equilibrium between the molded package and the wire bonding, resulting in the desired BGA packaging solution. This allows the BGA packaging solution designed by the designer to be accurately implemented.

[0147] To address the problems described in the background section, this invention first obtains a BGA packaging scheme designed by engineers. Then, it uses thermal simulation equipment to initialize the length and thickness of the bonding wires, ensuring the thermal balance of the BGA packaging scheme. Next, this invention uses digital twin technology to simulate the curing process of the molded enclosure, predicting the curing result and extracting and refining any depressions or protrusions in the curing result to obtain updated molded enclosure information. During the curing prediction process, this invention can also predict the stress distribution, obtaining a stress distribution change sequence. This allows for the prediction of bonding wire position changes and bending / stretching conditions. If the bonding wires bend or stretch / shrink, the heat transfer efficiency of the bonding wires will change, affecting the originally configured thermal balance. Therefore, this invention can calculate the change in thermal resistance of the bonding wires, thereby making secondary adjustments to the molded enclosure to obtain the desired BGA packaging scheme that meets the engineers' design expectations. Therefore, this invention can improve the packaging accuracy of BGA chips.

[0148] like Figure 2 The diagram shown is a functional block diagram of a storage BGA packaging system based on low-loss design provided in an embodiment of the present invention.

[0149] The low-loss BGA packaging system 100 described in this invention can be installed in electronic devices. Depending on the functions implemented, the low-loss BGA packaging system 100 may include a packaging scheme acquisition module 101, a molding compound adjustment module 102, a wire bonding layout adjustment module 103, and a secondary package adjustment module 104. The module described in this invention can also be called a unit, which refers to a series of computer program segments that can be executed by the processor of an electronic device and perform a fixed function, stored in the memory of the electronic device.

[0150] The packaging scheme acquisition module 101 is used to acquire a BGA packaging scheme, and using a pre-built thermal simulation device, adjusts the length and thickness of the preset bonding wire scheme in the BGA packaging scheme according to the preset standard heat transfer ratio to obtain a primary bonding wire adjustment scheme. The molding compound adjustment module 102 is used to acquire molding compound information in the BGA packaging scheme, and use pre-constructed digital twin technology to adjust the molding compound information before curing according to the preset desired molding compound structure to obtain updated molding compound information. The wire bonding layout adjustment module 103 is used to solidify the updated encapsulation information using the digital twin technology to obtain an updated solidified body, and to identify stress changes in the updated solidified body using a pre-constructed finite element method to obtain a stress distribution change sequence. Based on the stress distribution change sequence, the module performs stress bending-stretching prediction on the primary wire bonding adjustment scheme to obtain wire bending-stretching results, minimizes the wire bending-stretching results to obtain the least stretched wire, and obtains the initial wire bonding layout path of the least stretched wire. The secondary adjustment module 104 of the package is used to calculate the change value of the thermal resistance of the bonding wires according to the minimum stretching bonding wires and the primary bonding wire adjustment scheme, and to configure the outer layer thermal resistance of the updated molded package information according to the change value of the thermal resistance of the bonding wires to obtain the desired molded package information, and to construct the desired BGA package scheme according to the primary bonding wire adjustment scheme, the initial bonding wire layout path and the desired molded package information.

[0151] In detail, the modules in the low-loss-design-based storage BGA packaging system 100 described in this embodiment of the invention employ the same principles as described above during use. Figure 1 The method used is the same as the low-loss BGA packaging method described above, and it can produce the same technical effect, so it will not be repeated here.

[0152] like Figure 3 The diagram shown is a schematic representation of an electronic device that implements a low-loss BGA packaging method for memory, according to an embodiment of the present invention.

[0153] The electronic device 1 may include a processor 10, a memory 11 and a bus 12, and may also include a computer program stored in the memory 11 and executable on the processor 10, such as a memory BGA packaging method program based on low-loss design.

[0154] The memory 11 includes at least one type of readable storage medium, such as flash memory, portable hard drive, multimedia card, card-type memory (e.g., SD or DX memory), magnetic memory, magnetic disk, optical disk, etc. In some embodiments, the memory 11 can be an internal storage unit of the electronic device 1, such as the portable hard drive of the electronic device 1. In other embodiments, the memory 11 can be an external storage device of the electronic device 1, such as a plug-in portable hard drive, Smart Media Card (SMC), Secure Digital (SD) card, Flash Card, etc., equipped on the electronic device 1. Furthermore, the memory 11 includes both internal storage units and external storage devices of the electronic device 1. The memory 11 can be used not only to store application software and various types of data installed on the electronic device 1, such as code for a BGA packaging method program based on a low-loss design, but also to temporarily store data that has been output or will be output.

[0155] In some embodiments, the processor 10 may be composed of integrated circuits, such as a single packaged integrated circuit or multiple integrated circuits with the same or different functions, including combinations of one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and various control chips. The processor 10 is the control unit of the electronic device, connecting various components of the entire electronic device through various interfaces and lines. It executes programs or modules stored in the memory 11 (e.g., a low-loss BGA packaged storage method program) and calls data stored in the memory 11 to perform various functions of the electronic device 1 and process data.

[0156] The bus 12 can be a peripheral component interconnect (PCI) bus or an extended industry standard architecture (EISA) bus, etc. The bus 12 can be divided into an address bus, a data bus, a control bus, etc. The bus 12 is configured to realize the connection and communication between the memory 11 and at least one processor 10, etc.

[0157] Figure 3 Only electronic devices with components are shown; those skilled in the art will understand that... Figure 3 The structure shown does not constitute a limitation on the electronic device 1, and may include fewer or more components than shown, or combine certain components, or have different component arrangements.

[0158] For example, although not shown, the electronic device 1 may also include a power supply (such as a battery) to power the various components. Preferably, the power supply can be logically connected to the at least one processor 10 through a power management device, thereby enabling functions such as charging management, discharging management, and power consumption management. The power supply may also include one or more DC or AC power supplies, recharging devices, power fault detection circuits, power converters or inverters, power status indicators, and other arbitrary components. The electronic device 1 may also include various sensors, Bluetooth modules, Wi-Fi modules, etc., which will not be described in detail here.

[0159] Furthermore, the electronic device 1 may also include a network interface. Optionally, the network interface may include a wired interface and / or a wireless interface (such as a Wi-Fi interface, a Bluetooth interface, etc.), which is typically used to establish communication connections between the electronic device 1 and other electronic devices.

[0160] Optionally, the electronic device 1 may further include a user interface, which may be a display, an input unit (such as a keyboard), or a standard wired or wireless interface. Optionally, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, or an OLED (Organic Light-Emitting Diode) touchscreen, etc. The display may also be appropriately referred to as a screen or display unit, used to display information processed in the electronic device 1 and to display a visual user interface.

[0161] The memory 11 in the electronic device 1 stores a low-loss BGA packaging method program, which is a combination of multiple instructions. When run in the processor 10, it can achieve the following: A BGA packaging scheme is obtained. Using a pre-built thermal simulation device, the length and thickness of the preset bonding wire scheme in the BGA packaging scheme are adjusted according to the preset standard heat transfer ratio to obtain a primary bonding wire adjustment scheme. The molding compound information in the BGA packaging scheme is obtained, and the molding compound information is adjusted before curing according to the preset desired molding compound structure using pre-constructed digital twin technology to obtain updated molding compound information. Using the digital twin technology, the updated molding compound information is solidified to obtain an updated solidified body. Then, using a pre-constructed finite element method, stress change identification is performed on the updated solidified body to obtain a stress distribution change sequence. Based on the stress distribution change sequence, a stress bending-stretching prediction operation is performed on the primary wire bonding adjustment scheme to obtain the wire bonding bending and stretching results. The wire bonding bending and stretching results are then minimized to obtain the least stretched wire bonding, and the initial wire bonding layout path of the least stretched wire bonding is obtained. Based on the minimum tensioned wire and the primary wire adjustment scheme, the change value of the wire thermal resistance is calculated, and based on the change value of the wire thermal resistance, the outer layer thermal resistance is configured for the updated molded body information to obtain the desired molded body information. Based on the primary wire bonding adjustment scheme, the initial wire bonding layout path, and the desired molding compound information, the desired BGA packaging scheme is constructed.

[0162] Specifically, the processor 10's implementation method for the above instructions can be found in [reference needed]. Figures 1 to 3 The descriptions of the relevant steps in the corresponding embodiments are not repeated here.

[0163] Furthermore, if the modules / units integrated in the electronic device 1 are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. The computer-readable storage medium can be volatile or non-volatile. For example, the computer-readable medium may include: any entity or device capable of carrying the computer program code, a recording medium, a USB flash drive, a portable hard drive, a magnetic disk, an optical disk, a computer memory, or a read-only memory (ROM).

[0164] The present invention also provides a computer-readable storage medium storing a computer program, which, when executed by a processor of an electronic device, can perform the following: A BGA packaging scheme is obtained. Using a pre-built thermal simulation device, the length and thickness of the preset bonding wire scheme in the BGA packaging scheme are adjusted according to the preset standard heat transfer ratio to obtain a primary bonding wire adjustment scheme. The molding compound information in the BGA packaging scheme is obtained, and the molding compound information is adjusted before curing according to the preset desired molding compound structure using pre-constructed digital twin technology to obtain updated molding compound information. Using the digital twin technology, the updated molding compound information is solidified to obtain an updated solidified body. Then, using a pre-constructed finite element method, stress change identification is performed on the updated solidified body to obtain a stress distribution change sequence. Based on the stress distribution change sequence, a stress bending-stretching prediction operation is performed on the primary wire bonding adjustment scheme to obtain the wire bonding bending and stretching results. The wire bonding bending and stretching results are then minimized to obtain the least stretched wire bonding, and the initial wire bonding layout path of the least stretched wire bonding is obtained. Based on the minimum tensioned wire and the primary wire adjustment scheme, the change value of the wire thermal resistance is calculated, and based on the change value of the wire thermal resistance, the outer layer thermal resistance is configured for the updated molded body information to obtain the desired molded body information. Based on the primary wire bonding adjustment scheme, the initial wire bonding layout path, and the desired molding compound information, the desired BGA packaging scheme is constructed.

[0165] In the embodiments provided by this invention, it should be understood that the disclosed devices, systems, and methods can be implemented in other ways. For example, the system embodiments described above are merely illustrative, and actual implementations may have other classification methods.

[0166] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0167] Furthermore, the functional modules in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or in the form of hardware plus software functional modules.

[0168] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0169] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A memory BGA packaging method based on low-loss design, characterized in that, The method includes: A BGA packaging scheme is obtained. Using a pre-built thermal simulation device, the length and thickness of the preset bonding wire scheme in the BGA packaging scheme are adjusted according to the preset standard heat transfer ratio to obtain a primary bonding wire adjustment scheme. The molding compound information in the BGA packaging scheme is obtained, and the molding compound information is adjusted before curing according to the preset desired molding compound structure using pre-constructed digital twin technology to obtain updated molding compound information. Using the digital twin technology, the updated molding compound information is solidified to obtain an updated solidified body. Then, using a pre-constructed finite element method, stress change identification is performed on the updated solidified body to obtain a stress distribution change sequence. Based on the stress distribution change sequence, a stress bending-stretching prediction operation is performed on the primary wire bonding adjustment scheme to obtain the wire bonding bending and stretching results. The wire bonding bending and stretching results are then minimized to obtain the least stretched wire bonding, and the initial wire bonding layout path of the least stretched wire bonding is obtained. Based on the minimum tensioned wire and the primary wire adjustment scheme, the change value of the wire thermal resistance is calculated, and based on the change value of the wire thermal resistance, the outer layer thermal resistance is configured for the updated molded body information to obtain the desired molded body information. Based on the primary wire bonding adjustment scheme, the initial wire bonding layout path, and the desired molding compound information, the desired BGA packaging scheme is constructed.

2. The memory BGA packaging method based on low-loss design as described in claim 1, characterized in that, The method utilizes a pre-built thermal simulation device to adjust the length and thickness of the pre-set bonding wires in the BGA packaging scheme according to a preset standard heat transfer ratio, thereby obtaining a primary bonding wire adjustment scheme, including: The heat transfer path distribution is obtained by using a pre-built thermal simulation device to identify the heat dissipation ratio of the BGA packaging scheme based on the heat dissipation of the bonding wire pins and the heat dissipation of the back molded body. The difference between the heat transfer path distribution and the preset standard heat transfer ratio is calculated to obtain the heat transfer difference; Based on the heat transfer difference, the preset wire bonding scheme in the BGA packaging scheme is adjusted based on the length and thickness to obtain a primary wire bonding adjustment scheme.

3. The memory BGA packaging method based on low-loss design as described in claim 2, characterized in that, The step of adjusting the preset wire bonding scheme in the BGA packaging scheme based on the heat transfer difference, according to feedback on length and thickness, to obtain a primary wire bonding adjustment scheme includes: Based on the empirical relationship between preset thermal resistance and heat dissipation ratio, the heat transfer difference is weighted and calculated to obtain the thermal resistance change rate, wherein the expression for the thermal resistance change rate is: In the formula, This represents the rate of change of thermal resistance. This represents the empirical relationship between thermal resistance and heat dissipation ratio. This represents the heat transfer difference; Obtain the default wire length and default wire thickness from the preset wire bonding scheme in the BGA packaging scheme; Using a preset wire bonding thermal resistance formula, the thermal resistance of the default wire bonding length and thickness is calculated to obtain an initial thermal resistance value, wherein the expression for the initial thermal resistance value is: ， ， In the formula, This represents the initial thermal resistance value. This indicates the default solder wire length. This indicates the cross-sectional area of ​​the solder wire. This indicates the default wire thickness. This indicates the thermal conductivity of the bonding wire material; Based on the rate of change of thermal resistance, the initial thermal resistance value is weighted and calculated to obtain the desired thermal resistance value, wherein the expression for the desired thermal resistance value is: In the formula, This represents the desired thermal resistance value; Obtain the adjustable range of the wire bonding, and based on the adjustable range of the wire bonding, randomly adjust the default wire bonding length and default wire bonding thickness with the target of the desired thermal resistance value to obtain random wire bonding adjustment parameters; The overall volume of the random wire bonding adjustment parameters is minimized to obtain the primary wire bonding adjustment scheme.

4. The memory BGA packaging method based on low-loss design as described in claim 3, characterized in that, The method of using pre-constructed digital twin technology to adjust the molded body information before curing according to the preset desired molded body structure to obtain updated molded body information includes: Using pre-constructed digital twin technology, the information of the molded body is cured according to a preset curing strategy to obtain a cured molded body; The structure of the cured molded body is identified to obtain a structural diagram of the molded body; Calculate the structural difference between the molded body structure diagram and the preset desired molded body structure, and use a pre-trained molded body information-cured structure correspondence network to predict the molded body structure based on the structural difference to obtain the molded body structure offset information. Based on the molded body structure offset information, the layout of the molded body information is adjusted to obtain updated molded body information.

5. The memory BGA packaging method based on low-loss design as described in claim 4, characterized in that, Before utilizing the pre-trained molding information-cured structure correspondence network, the method further includes: Using a pre-built random generator, a set of random packaging information is obtained. Using each random packaging information in the set of random packaging information, a pre-built standard substrate is independently packaged to obtain a set of molded sample bodies. According to the curing strategy, the encapsulated sample set is cured to obtain a cured sample set, and the cured sample set is grouped into a first training set and a second training set according to a preset ratio; Using the first training set, the pre-constructed regression network model is trained according to the pre-constructed cross-entropy loss algorithm and gradient descent algorithm to obtain the initial solidification prediction model. The input-output vector of the initial solidification prediction model is reversed to obtain the initial plastic sealing prediction model. Using the second training set, the initial molding prediction model is trained to obtain a molding information-cured structure correspondence network.

6. The memory BGA packaging method based on low-loss design as described in claim 5, characterized in that, The method of using a pre-constructed finite element method to identify stress changes in the updated solidified body and obtain a stress distribution change sequence includes: The molding morphology at each time point during the curing process of the updated molding compound information is obtained to obtain a curing intermediate sequence, wherein the last curing intermediate in the curing intermediate sequence is the updated cured compound; Based on the pre-constructed finite element method, each solidified intermediate in the solidified intermediate sequence is decomposed to obtain the intermediate matrix sequence; Obtain the target encapsulation by acquiring the encapsulation at any position in any intermediate matrix of the intermediate matrix sequence. Calculate the deformation vector of the target molding body between two adjacent intermediate body matrices, and predict the stress distribution in the target molding body corresponding to the deformation vector; The stress distribution of all target molding bodies in the intermediate matrix sequence is obtained to obtain the stress distribution change sequence.

7. The memory BGA packaging method based on low-loss design as described in claim 6, characterized in that, The prediction of the stress distribution corresponding to the deformation vector in the target molding compound includes: The deformation vector is classified based on bending deformation and tensile deformation to obtain the deformation type; Based on the deformation type, strain is calculated on the deformation vector to obtain a strain vector, wherein the expression of the strain vector is: In the formula, This represents the strain vector. This represents the distance between the location of the calculated stress and the center point of the target molding body cross-section. Indicates the bending radius. Indicates the type of deformation. This indicates that the deformation type is bending deformation. This indicates that the deformation type is tensile deformation. Indicates the amount of expansion or contraction. Indicates the original size of the target encapsulation; Based on the pre-constructed Huke's law, stress calculation is performed on the strain vector to obtain the stress distribution in the target encapsulation body.

8. The memory BGA packaging method based on low-loss design as described in claim 7, characterized in that, The step of performing stress bending-stretching prediction on the primary wire bonding adjustment scheme based on the stress distribution change sequence to obtain the wire bonding bending-stretching results includes: Obtain the initial position in the primary wire bonding adjustment scheme to obtain the initial wire bonding distribution; Within a preset curing time, based on a preset time frequency, the initial solder wire distribution is used to perform three-dimensional positioning in the stress distribution change sequence to obtain the stress distribution on the solder wire surface. Using a pre-built weld wire deformation prediction model, a bending-stretching prediction operation is performed on the surface stress distribution of the weld wire to obtain an updated weld wire distribution; The updated solder wire distribution is used to replace the initial solder wire distribution, and the operation of three-dimensional positioning of the stress distribution change sequence using the initial solder wire distribution according to the preset time frequency is returned until the curing time ends. Then the updated solder wire distribution is output to obtain the solder wire bending and stretching results.

9. The memory BGA packaging method based on low-loss design as described in claim 8, characterized in that, The step of configuring the outer layer thermal resistance of the updated molding compound information based on the change value of the bonding wire thermal resistance to obtain the desired molding compound information includes: Determine the type of positive or negative value of the change in thermal resistance of the bonding wire; If the change value of the thermal resistance of the bonding wire is a preset negative number, the thermal simulation equipment is used to calculate the encapsulation volume corresponding to the change value of the thermal resistance of the bonding wire, and the updated encapsulation information is reduced based on the encapsulation volume to obtain the desired encapsulation information. If the change in thermal resistance of the bonding wire is a preset positive number, the coating material is obtained, and the coating volume corresponding to the change in thermal resistance of the bonding wire is calculated using the thermal simulation equipment. The coating material of the coating volume is then used to fill and update the information of the updated encapsulation to obtain the desired encapsulation information.

10. A memory BGA packaging system based on low-loss design, characterized in that, The system includes: The packaging scheme acquisition module is used to acquire BGA packaging schemes. Using a pre-built thermal simulation device, the length and thickness of the preset bonding wire scheme in the BGA packaging scheme are adjusted according to the preset standard heat transfer ratio to obtain a primary bonding wire adjustment scheme. The molding compound adjustment module is used to acquire molding compound information in the BGA packaging scheme, and use pre-constructed digital twin technology to adjust the molding compound information before curing according to the preset desired molding compound structure to obtain updated molding compound information. The wire bonding layout adjustment module is used to solidify the updated molding compound information using the digital twin technology to obtain an updated solidified body, and to identify stress changes in the updated solidified body using a pre-constructed finite element method to obtain a stress distribution change sequence. Based on the stress distribution change sequence, the module performs stress bending-stretching prediction on the primary wire bonding adjustment scheme to obtain wire bending-stretching results, minimizes the wire bending-stretching results to obtain the least stretched wire, and obtains the initial wire bonding layout path of the least stretched wire. The secondary adjustment module for the package is used to calculate the change value of the thermal resistance of the bonding wires according to the minimum stretched bonding wires and the primary bonding wire adjustment scheme, and to configure the outer layer thermal resistance of the updated molded package information according to the change value of the thermal resistance of the bonding wires to obtain the desired molded package information. It is also used to construct the desired BGA package scheme according to the primary bonding wire adjustment scheme, the initial bonding wire layout path and the desired molded package information.

Images