Complex mechanical and electrical product screening method and related equipment

Abstract

The invention provides a complex mechanical and electrical product screening method and related equipment, and the method comprises the steps: constructing a full-link complex mechanical and electrical product screening system of hierarchical adaptation, project precision, index quantification, model optimization, scientific solution and standard screening, and determining the full-hierarchical structure of a product, and core components and functions of each hierarchy. Target screening items are accurately matched according to the structure hierarchy information in combination with a preset defect library, cross-hierarchy redundant items are removed, and in other words, targeted screening items are determined based on the preset defect library. Furthermore, through screening index and model optimization, invalid investment is reduced to the maximum extent on the premise that the screening effect is guaranteed. The problems of under-screening and over-screening in the prior art are solved, and screening comprehensiveness and effectiveness are guaranteed.

Description

Technical Field

[0001] This application relates to the field of electromechanical product screening technology, and in particular to a method and related equipment for screening complex electromechanical products. Background Technology

[0002] In the design, production, and use cycle of high-reliability electromechanical equipment, the quality of equipment components is fundamental to ensuring reliability during the service phase. Manufacturing defects in products will be triggered and exposed as product failures under environmental stress during the service phase. In existing technologies, to avoid early failures, Environmental Stress Screening (ESS) is generally used to trigger potential manufacturing defects before the product enters the service phase, thereby reducing the early failure rate. Existing ESS methods are often implemented using fixed schemes under fixed standards. For complex electromechanical products with multi-level and modular structures, they are prone to under-screening and over-screening problems in multi-level electromechanical product screening scenarios. Summary of the Invention

[0003] In view of this, the purpose of this application is to propose a method and related equipment for screening complex electromechanical products, so as to solve some or all of the technical problems in the background art.

[0004] To achieve the above objectives, this application provides a method for screening complex electromechanical products, comprising: Obtain the structural hierarchy information of the complex electromechanical product to be tested; Based on the structural hierarchy information and the preset defect library, the target stress screening item information is determined; Based on the target stress screening project information, the screening criteria are determined; Based on the target stress screening project information and the screening indicators, a quality screening optimization model is constructed for quality screening of the complex electromechanical products to be tested. Solve the quality screening optimization model to obtain a quality screening scheme for the complex electromechanical product to be tested; The quality of the complex electromechanical products to be tested is screened according to the quality screening scheme.

[0005] Optionally, based on the structural hierarchy information and a preset defect database, target stress screening item information is determined, including: Based on the structural hierarchy information and the preset defect library, the initial stress screening item information is determined; The initial stress screening information is evaluated to determine the target stress screening information.

[0006] Optionally, the target stress screening project information includes screening cost information and screening cycle information; The screening criteria include total screening cost and total screening period; Based on the target stress screening project information, the screening criteria are determined, including: Based on the screening cost information, determine the total screening cost; The total screening period is determined based on the screening period information.

[0007] Optionally, the screening cost information includes: screening fees, screening time, repair costs, rework costs, and quality losses; Based on the screening cost information, the total screening cost is determined, including: The total screening cost is calculated using the following formula: ; In the formula, For product hierarchy numbering, To filter project numbers, To screen stress condition numbers, This indicates that the filter item will be executed. This indicates that the selection criteria will not be applied. For fixed costs, For variable costs, For repair costs, For quality loss, The total screening cost for item s.

[0008] Optionally, the screening cycle information includes: temperature screening information, vibration screening information, and screening process information; Determining the total screening period based on the aforementioned screening period information includes: Based on the temperature screening information, the vibration screening information, and the screening process information, determine the device-level screening cycle, the board-level screening cycle, the complete machine-level screening cycle, and the system-level screening cycle. The total screening cycle is determined based on the device-level screening cycle, board-level screening cycle, machine-level screening cycle, and system-level screening cycle.

[0009] Optionally, the temperature screening information includes the number of temperature cycles, the number of temperature cycles, the high temperature holding time, the low temperature holding time, and the temperature change rate; The vibration screening information includes: vibration batch, number of vibrations, and vibration time; The screening process information includes: screening operation time, test preparation time, scheduling and round-trip transportation time; Based on the temperature screening information, the vibration screening information, and the screening process information, the device-level screening cycle, board-level screening cycle, system-level screening cycle, and system-level screening cycle are determined, including: The device-level screening cycle and the board-level screening cycle are determined based on the screening operation time, the test preparation time, and the scheduling and round-trip transportation time. The whole-machine screening cycle is determined based on the number of temperature cycles, the batch of temperature cycles, the high temperature holding time, the low temperature holding time, the temperature change rate, the vibration batch, the number of vibrations, the vibration time, the test preparation time, and the scheduling and round-trip transportation time. The system-level screening cycle is determined based on the vibration batch, the number of vibrations, the vibration time, the test preparation time, and the scheduling and round-trip transportation time.

[0010] Optionally, the quality screening optimization model includes an objective function and objective constraints; Based on the target stress screening project information and the screening indicators, a quality screening optimization model for the complex electromechanical product to be tested is constructed, including: Based on the target stress screening project information, the total screening cost, and the total screening period, the objective function is constructed with the goal of minimizing the total screening cost and minimizing the total screening period. Based on the target stress screening project information, the target constraints are constructed.

[0011] Optionally, the objective function is constructed based on the target stress screening project information, the total screening cost, and the total screening period, including: Based on the target stress screening project information and the total screening cost, a first initial function is constructed; Based on the target stress screening project information and the total screening period, a second initial function is constructed; The target function is constructed based on the first initial function and the second initial function.

[0012] Optionally, based on the target stress screening project information, the target constraints are constructed, including: The first constraint condition is constructed as follows: ; In the formula, In order to establish a benchmark screening scheme Below, the screening cycle for products at level x; The second constraint condition is constructed as follows: ; In the formula, F(S) represents the defect coverage of scheme S. For the minimum acceptable defect coverage, Let x be the number of defect categories that can be activated by environmental stress in level x. denoted as the total number of all potential defect categories identified in level x; a represents the system level, b represents the machine level, c represents the board level, and d represents the component level. The third constraint condition is constructed as follows: ; In the formula, Let S be the probability of defect activation, and S be the selection scheme to be optimized. Use this as the benchmark screening scheme; The fourth constraint condition is constructed as follows: ; In the formula, For testing time; The first constraint, the second constraint, the third constraint, and the fourth constraint are combined to form the target constraint.

[0013] Optionally, the quality screening optimization model is solved to obtain a quality screening scheme for the complex electromechanical product to be tested, including: The quality screening optimization model is solved based on the adaptive Levy strategy quantum swarm optimization algorithm to obtain the quality screening scheme for the complex electromechanical products to be tested.

[0014] Based on the same inventive concept, this application also provides a complex electromechanical product screening device, comprising: The acquisition module is configured to acquire the structural hierarchy information of the complex electromechanical product to be tested. The first determining module is configured to determine the target stress screening item information based on the structural hierarchy information and a preset defect library; The second determining module is configured to determine the screening criteria based on the target stress screening project information; The construction module is configured to construct a quality screening optimization model for the quality screening of the complex electromechanical product to be tested based on the target stress screening project information and the screening indicators. The solver module is configured to solve the quality screening optimization model to obtain a quality screening scheme for the complex electromechanical product to be tested. The screening module is configured to screen the quality of the complex electromechanical products to be tested according to the quality screening scheme.

[0015] Based on the same inventive concept, this application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement any of the methods described above.

[0016] Based on the same inventive concept, this application also provides a non-transitory computer-readable storage medium that stores computer instructions for causing a computer to perform any of the methods described above.

[0017] As described above, this application provides a method and related equipment for screening complex electromechanical products. The method constructs a full-link complex electromechanical product screening system encompassing "hierarchical adaptation, precise project selection, indicator quantification, model optimization, scientific solution, and standardized screening." By acquiring the structural hierarchy information of the complex electromechanical product to be tested, the method clarifies the product's full-level structure, core components, and functions at each level. Based on the structural hierarchy information and a pre-set defect library, it determines the target stress screening project information. This means accurately matching target screening projects based on the structural hierarchy information and the pre-set defect library, eliminating redundant cross-level projects—in other words, relying on the pre-set defect library to determine targeted screening projects. Based on the target stress screening project information, screening indicators are determined, and a quality screening optimization model is constructed based on the target stress screening target information and screening indicators. Further optimization of the screening indicators and model maximizes the reduction of ineffective input while ensuring screening effectiveness. The quality screening optimization model is solved to obtain a quality screening scheme for the complex electromechanical product to be tested. Based on the quality screening scheme, the quality of the complex electromechanical product to be tested is screened to obtain the optimal screening result. The above methods solve the problems of under-screening and over-screening in existing technologies, ensuring the comprehensiveness and effectiveness of screening. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic flowchart of a method for screening complex electromechanical products according to an embodiment of this application; Figure 2 This is a schematic diagram of the fitness convergence curve and the cost, cycle, and defect coverage iteration curves of an embodiment of this application. Figure 3 This is a schematic diagram of a complex electromechanical product screening structure framework according to an embodiment of this application; Figure 4 This is a schematic diagram of the hardware structure of an electronic device according to an embodiment of this application. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0021] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0022] Based on the background technology, in engineering, to avoid early failures, Environmental Stress Screening (ESS) is generally used to induce potential manufacturing defects in products before they enter the use stage, thereby reducing the early failure rate. Therefore, for the manufacturing process of complex electromechanical products with multi-level, modular structures, ESS is being regarded as a key process for improving product quality. Its goal is to eliminate potential defects in advance to ensure product quality in use. Specifically, such complex electromechanical products are composed of multiple modular subsystems, and each ESS module contains a large number of functions and parameters. Considering the budget and cycle constraints in actual production, production costs and delivery time are often strictly controlled. Therefore, when implementing ESS, manufacturers need to take the cost-effectiveness ratio of screening as a key objective, aiming to develop the best screening method with the lowest cost and shortest cycle, thus constituting a typical multi-objective optimization problem. However, existing methods often implement ESS using fixed schemes under fixed standards, which easily leads to two problems in the screening scenario of multi-level electromechanical products: under-screening and over-screening. Under-screening refers to insufficient screening time and stress levels, resulting in the failure to fully expose manufacturing defects. Over-screening refers to excessively long screening times and high stress levels, causing damage and defects to normally functioning products that are not defective. The former leads to poor screening efficiency, while the latter increases screening costs and timelines, causes unnecessary waste of finished products, and further increases total production costs. Therefore, manufacturers of electromechanical products need to develop multi-objective optimization strategies for ESS (Enhanced Screening Solution) to achieve a comprehensive balance between screening costs, timelines, and screening efficiency.

[0023] Specifically, the under-screening and over-screening problems that may be caused by the existing ESS method are manifested in the following three aspects in the ESS of multi-level complex electromechanical products. Due to the complexity and multi-level nature of current equipment, screening redundancy problems occur, that is, the manufacturing process often requires an ESS for each level. For example, for electromechanical product systems with component level, board level, complete machine level and system level, after a product has been ESSed once at the lower level, it still needs to be ESSed again after being assembled and incorporated into the higher level, and the stress type of the subsequent ESS may be the same as the previous ESS. This leads to the inability of the subsequent ESS to effectively screen out defective parts, thus making the ESS inefficient and wasting a lot of unnecessary costs; (2) Screening capability problem: Due to the customizability of ESS, each type of product should have its own unique screening conditions. Strictly speaking, there is no universal screening method that has the best effect on all products. Due to the different structures, the response to environmental effects is different. Therefore, there is a screening capability problem, that is, for products with different usage environments and usage requirements, the stress conditions they are subjected to during operation may be different from those in the ESS test process. Therefore, during its use, the faults exhibited by the product (i.e., defects that are triggered into faults) may not be screened out by ESS, which leads to the problem of insufficient ESS; (3) Screening cost-effectiveness problem: Due to the dynamic nature of ESS, the screening quantity and method is a dynamic closed-loop management process. The effectiveness of screening should be adjusted continuously, and different screening processes and conditions should be adopted for products at different stages. Therefore, there is a problem of low screening efficiency. That is, with the progress of production technology, the overall reduction of manufacturing process defects leads to an overall decrease in the number of defective products screened by ESS. Often, a lot of time and cost are invested in ESS, but ESS cannot screen out any defective parts. If the traditional ESS that covers all batches and all stress types is still used, product manufacturers will often question the cost and time spent on ESS and believe that the ESS solution is inefficient. Therefore, under the condition of satisfying the dynamic coverage of ESS test, how to ensure the screening effect while controlling the screening cost and cycle for products with multi-level complex systems has become a typical multi-objective optimization problem.

[0024] To solve the above technical problems, such as Figure 1 As shown, this application provides a method for screening complex electromechanical products, including the following steps: Step 101: Obtain the structural hierarchy information of the complex electromechanical product to be tested.

[0025] In this step, by reading the design drawings, BOM (Bill of Materials), and manufacturing process documents of the complex electromechanical product to be tested, the complete structural hierarchy of the product from bottom to top (e.g., component level, board level, complete machine level, system level) is clearly defined. Simultaneously, the core components, assembly relationships, and functional positioning of each level are recorded (e.g., the component level includes resistors and chips, while the board level is assembled from multiple components). This establishes a "hierarchical framework" for subsequent screening work, avoiding the omission of potential defects at any level during screening, ensuring that the screening covers the entire product structure, and providing a basis for targeted matching of screening items.

[0026] Step 102: Determine the target stress screening item information based on the structural hierarchy information and the preset defect library.

[0027] In this step, a pre-set defect library contains common manufacturing defects at each product level (such as component soldering defects, circuit board bending, and poor overall sealing) and corresponding sensitive stress types (such as temperature cycling and random vibration). First, initial screening items are matched from the defect library based on structural hierarchy information. Then, by evaluating the feasibility of the items and their compatibility with product defects, redundant items (such as stress items unsuitable for the product level) are eliminated, ultimately determining the target screening items. This solves the problem of traditional screening methods that perform environmental stress screening according to a fixed scheme, ensuring that screening items are precisely matched with product level and defect type. This avoids ineffective screening and wastes resources, while ensuring that screening can specifically stimulate potential defects.

[0028] Step 103: Determine the screening criteria based on the target stress screening project information.

[0029] In this step, the screening indicators comprise two core dimensions: screening cost and screening cycle. Information regarding screening cost for the target stress screening project includes: screening fees, screening time, repair costs, rework costs, and quality losses. Information regarding the screening cycle includes: temperature screening information (number of temperature cycles, temperature cycle batches, high-temperature holding time, low-temperature holding time, and temperature change rate), vibration screening information (vibration batches, vibration cycles, and vibration time), and screening process information (screening operation time, test preparation time, scheduling, and round-trip transportation time). Based on the specific parameters of the screening indicators, calculable and comparable basic data can be provided for the subsequent construction of optimization models, avoiding cost overruns or cycle delays caused by empirical estimations.

[0030] Step 104: Based on the target stress screening project information and the screening index, construct a quality screening optimization model for quality screening of the complex electromechanical products to be tested.

[0031] In this step, the screening metrics include two core dimensions: screening cost and screening cycle. Target stress screening project information includes defect coverage and defect activation rate. The quality screening optimization model includes an objective function and constraints. Therefore, the objective function is constructed with minimizing the total screening cost and minimizing the total screening cycle as the core objectives. Simultaneously, constraints are set (such as screening cycles at each level not exceeding the upper limit, defect coverage not falling below the minimum standard, defect activation probability not falling below the baseline scheme, and the total test time for a single type not exceeding 30 minutes), forming a complete optimization model that balances the economy and effectiveness of screening. This provides a mathematical framework for optimizing the screening scheme, ensuring that the optimization process does not deviate from the core requirements, avoiding sacrificing screening effectiveness for cost reduction or cycle shortening, and preventing resource waste due to over-screening.

[0032] Step 105: Solve the quality screening optimization model to obtain the quality screening scheme for the complex electromechanical product to be tested.

[0033] In this step, an adaptive Levy strategy quantum swarm optimization algorithm is employed. Substituting the screening project information, cost, and cycle data, iterative calculations are used to find the optimal solution that satisfies all constraints, ultimately outputting a clear screening scheme (such as the screening items to be performed at each level, stress parameters (10 temperature cycles, 5 minutes of vibration), execution order, etc.). This method quickly and efficiently finds the optimal screening combination, significantly improving the scientific rigor and rationality of the screening scheme compared to traditional manual scheme formulation, while also shortening the scheme formulation time.

[0034] Step 106: According to the quality screening scheme, screen the quality of the complex electromechanical products to be tested.

[0035] In this step, following the optimized plan, product screening operations are performed in a tiered manner (e.g., first, high-temperature aging of components, then random vibration testing of circuit boards, and finally comprehensive stress testing of the entire machine). Screening data (such as the number of defects, screening time, and cost) is recorded during the process, generating a screening report. This achieves precise screening, maximizing the detection of potential product defects and reducing early failure rates while controlling costs and timelines. Simultaneously, the screening process is standardized and traceable, facilitating subsequent optimization and adjustment of the screening strategy.

[0036] In steps 101-106, a comprehensive screening system for complex electromechanical products was constructed, encompassing "hierarchical adaptation, precise project targeting, indicator quantification, model optimization, scientific solution, and standardized screening." Step 101 involves acquiring the structural hierarchy information of the complex electromechanical product to be tested, clarifying the product's full-level structure, core components, and functions at each level. Step 102 determines the target stress screening project information based on the structural hierarchy information and a pre-set defect library. This involves precisely matching target screening projects based on the structural hierarchy information and the pre-set defect library, eliminating redundant cross-level projects (such as vibration tests already completed at the component level, which are not repeated at the board level). In other words, targeted screening projects are determined based on the pre-set defect library (covering common defects and sensitive stresses at each level). Based on the target stress screening project information, screening indicators are determined, and a quality screening optimization model is constructed based on the target stress screening target information and screening indicators. Further optimization of the screening indicators and model maximizes the reduction of ineffective input while ensuring screening effectiveness. The quality screening optimization model is solved to obtain a quality screening scheme for the complex electromechanical products to be tested. Based on the quality screening scheme, the quality of the complex electromechanical products to be tested is screened to obtain the optimal screening result. This method solves the problems of under-screening and over-screening in existing technologies, ensuring the comprehensiveness and effectiveness of the screening process.

[0037] In some embodiments, for step 102, determining the target stress screening item information based on the structural hierarchy information and a preset defect library includes the following steps: Step 1021: Determine the initial stress screening item information based on the structural hierarchy information and the preset defect library.

[0038] In this step, for example, the structural hierarchy information of the complex electromechanical product to be tested is obtained by reading the design drawings of the electromechanical product to obtain the complete structural hierarchy of the product, and then searching for the stress screening item corresponding to the corresponding hierarchy in a preset defect library. The preset defect library stores defect types, defect names corresponding to each defect type, and stress screening items corresponding to each defect type and defect name. Determining the initial stress screening item information based on the structural hierarchy information and the preset defect library includes: determining the target structural hierarchy information based on the structural hierarchy information; and searching for stress screening items in the preset defect library based on the target structural hierarchy information to determine the target initial stress screening item. For example, secondary major quality defects and failure mechanisms are analyzed based on structural hierarchy information to determine the sensitive stresses and failure-related indicators of each major quality defect. For product quality defects at each level that require environmental stress screening for defect initiation and elimination, further classification is performed according to potential failure modes and failure mechanisms, such as solder joint defects, parameter drift, and component defects. The target structural hierarchy information is determined as shown in Table 1, the list of product quality defects at each level of complex electromechanical products, which includes: defect type, defect name, system level, potential failure mode, and failure mechanism. For example, based on the target structural hierarchy information, a search is performed in a preset defect database to find the screening items corresponding to the target structural hierarchy information. Quantitative analysis is performed by constructing a "sensitive stress-quality defect" interaction matrix to determine the weight of different screening items. Based on the failure mechanism analysis results, the interaction between each sensitive stress and each major quality defect is analyzed one by one, and different symbols are used to represent different interaction types and screening priorities. " " indicates that the stress type can effectively trigger the quality defect, meaning this screening item should be prioritized; "△" indicates that the stress type can trigger the quality defect, but the triggering effect is difficult to achieve the requirements for efficient screening, requiring the use of other stresses or research to improve stress conditions. This forms the interaction matrix of sensitive stresses and quality defects for electromechanical products, as shown in Table 2.

[0039] Table 1. List of Quality Defects in Electromechanical Products at Various Levels

[0040] Table 2 Interaction Matrix of Sensitive Stress and Quality Defects in Electromechanical Products

[0041] Step 1022: Evaluate the initial stress screening item information to determine the target stress screening item information.

[0042] In this step, the Delphi method is used to evaluate the initial stress screening item information by assigning weights to the excitation effects of the screening items (stress). For example, Step 1: Define the evaluation object and basic parameters: Determine the quality defects to be evaluated (such as solder joint defects, package cracking) and the corresponding sensitive screening items (such as temperature cycling, random vibration). Set the excitation effect weight w to n possible values ​​{x1, x2, …, x n Sort them in ascending order (e.g., x1=0.1, x2=0.3, ..., x...). n =1.0, representing weights from low to high). Invite m industry experts (with experience in product defect analysis and environmental stress screening) to participate in the evaluation. Step 2: Experts assign weight scores: Provide each expert with evaluation background information (including quality defect types, screening item descriptions, failure mechanism analysis, etc.). The i-th expert assigns a subjective probability score w to the n weight values. ij (j=1,2,…,n), w ij The expert stated that "the weight of the stimulating effect w ≤ x". j The probability of "". Collect all expert ratings and construct an expert reliability rating matrix:

[0043] Among them, w ij ∈ [0,1], and satisfy w i1 ≤w i2 ≤…≤w in (Because x1≤x2≤…≤x) n (The probability increases monotonically). Step 3: Calculate the mean and standard deviation of the scores: Calculate along the column of the matrix to obtain the value x for each weight. j The corresponding average of all expert ratings α +j This reflects the degree of expert consensus. Calculate the standard deviation d for each column. +j This measures the dispersion of expert ratings (the smaller the standard deviation, the higher the consensus). The mean is calculated as follows: Standard deviation calculation: Step 4: Expert Scoring Consistency Check: Set a maximum error tolerance ε (e.g., ε = 0.1, which can be adjusted according to industry standards or project requirements). If the standard deviation d of all columns... +j If ≤ε, it means the experts have reached a consensus and proceed to the next step; if d exists... +j If the discrepancy exceeds ε, feedback on the points of disagreement needs to be provided to the experts, and the experts need to be invited to re-evaluate. Steps 2-3 are then repeated until the consistency requirement is met. Step 5: Construct the subjective probability distribution of the weights: based on the mean α after the consistency test. j The activation effect weights are constructed according to the following formula. Subjective probability distribution .

[0044] Step 6: Solve for the final evaluation value of the activation effect weights: based on the constructed subjective probability distribution. Calculate the expected value to obtain the final weight of the stimulating effect of the selected items on the quality defect. This serves as the basis for prioritizing subsequent project selection: where, the expected value is calculated. The formula is as follows: .

[0045] By conducting the above qualitative and quantitative analysis on each screening item, we can clarify the product quality defects at each level and their corresponding screening items and priorities, providing a basis for determining the target stress screening information.

[0046] Based on the above evaluation method, the target stress screening information is determined and can be stored in the form of a screening item library. This constructs a systematic and comprehensive screening item library, providing a complete set of candidate screening items for environmental stress screening schemes.

[0047] In the reliability assurance system of complex electromechanical products, environmental stress screening is a core step in eliminating early failures and triggering potential defects. To achieve scientific and quantitative design of screening schemes, the screening project library in this application covers the entire level from components to boards to complete machines to systems. This library not only provides a systematic and comprehensive set of screening candidates, but also provides key technical support for performance prediction and multi-objective optimization of screening schemes through structured data association. For example, the decision variables for screening schemes... Screening projects The value space is constructed based on failure physics and stress-defect interaction mechanisms, specifically including: General environmental stress screening items: These items have wide applicability and form the basis for screening schemes at each level. Table 3 provides a list of general environmental stress screening items.

[0048] Table 3 List of General Environmental Stress Screening Items

[0049] For example, the component-level dedicated screening items include all 19 dedicated screening items to ensure comprehensive control over the quality of underlying materials. Table 4 provides a list of component-level dedicated screening items.

[0050] Table 4 List of Component-Level Dedicated Screening Items

[0051] For example, the systematic integration of screening projects for board-level and above products: For high-level products such as boards, complete machines, and systems, the screening focus shifts from inherent defects in components to process defects and interface compatibility issues introduced by assembly, interconnection, and system integration. The project library described in this invention achieves systematic coverage of high-level screening through two modes: "general project customization" and layer-specific enhancement. Specifically, the general environmental stress screening projects (as shown in Table 1) constitute the backbone of high-level screening, but differentiated stress conditions need to be configured according to layer characteristics. For example, for board-level products, temperature cycling projects... stress conditions Special consideration should be given to the soldering reliability of large BGAs and multi-chip modules; for system-level products, random vibration testing is also important. stress conditions This necessitates customizing the spectrum and magnitude based on the overall structural dynamics. Furthermore, higher-level screening places particular emphasis on comprehensive stress parameters. This application simulates the excitation effect of multiphysics coupling on system-level defects in real-world environments. In this way, the project library achieves seamless coverage of the entire process, from component defect removal to system-level defect excitation and compatibility verification. It constructs a solid theoretical foundation by building upon failure physics analysis and a sensitive stress-defect interaction matrix, and optimizes the stress conditions of key projects through stress limit testing. Based on this, the project library consists of three main modules: a general project library (applicable to all levels), a component-level dedicated project library (covering 19 dedicated screening projects), and board / complete machine / system-level projects derived through "customization" and "enhancement" modes. This structure achieves full-level and full-process coverage of products. Based on the constructed environmental stress screening project library, for any screening scheme and its corresponding stress conditions, four key indicators can be calculated in the following ways: (1) Cost: Based on the standard working hours, equipment loss, energy consumption and other resource consumption data of each screening project, combined with stress conditions (such as temperature cycle number, vibration time) for weighted summation; (2) Cycle: Based on the execution time of each project and whether it can be processed in parallel, the total screening cycle is calculated through the project scheduling model; (3) Defect coverage: Based on the correlation between the interaction matrix and the defect type, the proportion of defect types that the scheme can cover to the total defect types is statistically calculated; (4) Defect activation probability: Based on historical test data or modal test results, a stress-defect activation probability model is established, and the activation probability of each defect type under given stress conditions is weighted and aggregated.

[0052] In some embodiments, for step 103, the target stress screening project information includes screening cost information and screening cycle information; the screening indicators include total screening cost and total screening cycle; determining the screening indicators based on the target stress screening project information includes the following steps: Step 1031: Determine the total screening cost based on the screening cost information.

[0053] In this step, the screening cost information includes: screening fees, screening time, repair costs, rework costs, and quality losses; Based on the screening cost information, the total screening cost is determined, including: The total screening cost is calculated using the following formula: ; In the formula, Assign a hierarchical number to the product (refer to the product structure tree: including components, boards, complete machines, systems, etc.). To select the project number (refer to the environmental stress screening project and component screening project), To filter stress condition numbers (refer to the stress level serial number in the screening item library), This indicates that the filter item will be executed. This indicates that the selection criteria will not be applied. Fixed costs (including equipment depreciation, fixture costs, training costs, etc., and product level) and screening projects (related) For variable costs, Repair costs (depending on average repair cost, and product level) (related) For quality loss, The total screening cost for item s.

[0054] Furthermore, The formula for calculating variable costs is: ; In the formula, Screening cost per unit of time (or unit cycle); Screening time (e.g., number of cycles, vibration time) depends on stress conditions; Potential quality loss refers to the loss caused in subsequent stages due to defects that were not effectively identified during the screening process. The calculation formula is as follows: ; In the formula, The defect will be addressed in the subsequent section. The probability of each production stage being activated; : in the The cost of rework at each stage; Quality loss during the usage phase. The total screening cost focuses on the cumulative time spent on specific testing operations (such as the total cycle time of temperature cycling, the total vibration minutes of random vibration, and the sum of the operation time for each item). The core effects are: controlling stress intensity and preventing product damage: By quantifying the total time of a single type of test (e.g., the total time for a certain type of vibration test ≤ 30 minutes), excessive stress on defect-free products due to excessive testing time is avoided (e.g., prolonged high temperatures leading to material aging, prolonged vibration leading to structural loosening), thus solving the "over-screening" problem at its source and reducing unnecessary waste of finished products. Optimizing resource utilization: By clarifying the specific time spent on each screening item, equipment usage time can be rationally allocated (e.g., avoiding queues for other items due to excessively long single-test times on a vibration device), improving the turnover efficiency of screening equipment and reducing equipment wear and tear costs per unit time. Ensuring testing consistency: By fixing the total screening time standard for similar products (e.g., the total temperature cycling time for components in the same batch is uniformly set at 20 hours), the testing process for different batches and different operators is ensured to be consistent, avoiding fluctuations in screening results due to time differences and improving the repeatability of screening results.

[0055] For example, in order to calculate the cost function, the following data parameters are required. This application displays the data parameters in tabular form, as shown in Tables 5-8. Table 5 lists all products. The number, name, and level; Table 6 lists all the filter items. The number, name, and type; Table 7 lists the criteria for each filter item. List stress conditions Serial number, description and filtering time Table 8 lists the core data required for the cost calculation, including data for each combination. Cost parameters.

[0056] Table 5 Product Information Table

[0057] Table 6 Filtering Items Table

[0058] Table 7 Stress Condition Table

[0059] Table 8 Cost Parameter Table

[0060] Step 1032: Determine the total screening period based on the screening period information.

[0061] In this step, the screening cycle information includes: temperature screening information, vibration screening information, and screening process information; based on the screening cycle information, the total screening cycle is determined, including the following steps: Step 13021: Determine the device-level screening cycle, board-level screening cycle, machine-level screening cycle, and system-level screening cycle based on the temperature screening information, the vibration screening information, and the screening process information.

[0062] In this step, the temperature screening information includes the number of temperature cycles, the batch of temperature cycles, the high temperature holding time, the low temperature holding time, and the temperature change rate; the vibration screening information includes the vibration batch, the number of vibrations, and the vibration time; the screening process information includes the screening operation time, the test preparation time, and the scheduling and round-trip transportation time. Based on the temperature screening information, the vibration screening information, and the screening process information, the device-level screening cycle, board-level screening cycle, machine-level screening cycle, and system-level screening cycle are determined, including the following steps: Step 130211: Determine the device-level screening cycle and the board-level screening cycle based on the screening operation time, the test preparation time, and the scheduling and round-trip transportation time.

[0063] In this step, the screening operation time, test preparation time, scheduling, and round-trip transportation time are input into the following formula to obtain the device-level screening cycle: ; In the formula, For device-level screening cycle, For the time of a single screening operation, Preparation time for clamping and testing, For scheduling and round-trip transportation time, The number represents the batch number. The screening cycle for electronic components is mainly determined by the screening quantity and screening criteria, with a direct correspondence between different product types and screening criteria. The formula above uses x electronic components from a specific batch as an example.

[0064] Input the screening operation time, test preparation time, scheduling and round-trip transportation time into the following formula to obtain the board-level screening cycle: ; In the formula, For board-level screening cycle, For the time of a single screening operation, Preparation time for clamping and testing, For scheduling and round-trip transportation time, This refers to the batch number. The primary screening criterion for current board-level products is temperature shock. The above example uses a batch of x boards as an example.

[0065] Step 130212: Determine the whole machine-level screening cycle based on the number of temperature cycles, the temperature cycle batch, the high temperature holding time, the low temperature holding time, the temperature change rate, the vibration batch, the number of vibrations, the vibration time, the test preparation time, and the scheduling and round-trip transportation time.

[0066] In this step, the entire product undergoes two main screening processes: temperature cycling and random vibration. The entire product screening cycle includes a temperature cycling screening cycle and a vibration screening cycle. The temperature cycling screening cycle is obtained by inputting the number of temperature cycles, the temperature cycling batch, the high-temperature holding time, the low-temperature holding time, the temperature change rate, the test preparation time, and the scheduling and round-trip transportation time into the following formula: ; in, Temperature cycle count; Temperature cycling batch; High temperature holding time; Low temperature holding time; Upper and lower limits of temperature; : Rate of temperature change; Initial performance testing time; : Scheduling and round-trip transportation time.

[0067] The vibration screening cycle is obtained by inputting the vibration batch, the number of vibrations, the vibration time, the test preparation time, and the scheduling and round-trip transportation time into the following formula: ; in For random vibration batches, For random vibration time, For the preparation time of the experiment, For scheduling and round-trip transportation time.

[0068] Step 130214: Determine the system-level screening cycle based on the vibration batch, the number of vibrations, the vibration time, the test preparation time, and the scheduling and round-trip transportation time.

[0069] In this step, system-level products typically need to first determine the screening criteria through preliminary testing before conducting formal random vibration screening. The vibration batch, the number of vibrations, the vibration time, the test preparation time, and the scheduling and round-trip transportation time are input into the following formula to obtain the system-level screening cycle: ; in, System-level screening cycle Random vibration batch; Random vibration time; Preliminary test time; Experiment preparation time; : Scheduling and round-trip transportation time.

[0070] The total screening cycle focuses on the total time spent on the entire process from screening preparation to completion (covering screening time at each level, preparation time, scheduling and transportation time, and parallel / serial connection time). Its core effects are: matching production plans and avoiding delivery delays; by calculating and summing the cycles at the component, board, complete machine, and system levels, the total screening time is accurately predicted, ensuring that the screening cycle does not exceed the preset maximum allowable cycle at each level. max T (S0,x)≤T x To avoid supply disruptions in subsequent assembly and delivery stages due to excessively long screening times, ensuring smooth production flow. Supporting multi-objective optimization balance: As core dimensions of screening indicators, total cycle time and total cost together constitute the optimization direction of the objective function. Accurate total cycle time data allows the optimization model to find a balance between "shortening the cycle time" and "reducing costs," while simultaneously meeting constraints on defect coverage and defect triggering probability, avoiding a decline in overall efficiency due to pursuing a single objective. Improving solution executability: The total cycle time clearly defines the screening time nodes (e.g., component-level screening must be completed within 3 days, and board-level screening must be completed within 5 days), providing a clear basis for production scheduling. The production team can rationally arrange the scheduling of personnel, materials, and equipment based on the total cycle time, reducing waiting time and improving the overall efficiency of the screening process.

[0071] Step 13022: Determine the total screening cycle based on the device-level screening cycle, board-level screening cycle, machine-level screening cycle, and system-level screening cycle.

[0072] In this step, based on the above steps, the screening cycle for each product level can be obtained. For parallel screening tasks within the same level, since each product or component can be screened simultaneously, the screening cycle for that level should be the longest among the parallel tasks. For screening processes between different levels, due to dependencies, they need to be accumulated sequentially. The screening cycle calculation formula can be modified as follows: ; In the formula, For the i-th level of the screening cycle; The execution status (0 or 1) of the j-th selected item in the i-th level under stress condition k. This represents the individual filter cycle for the corresponding selection item. The longest filter time in `max` is taken as the cycle for that level. The total filter cycle is then calculated. ; In the formula, It represents the total screening cycle at the system level, reflecting the cumulative time spent on sequential screening from components, boards, complete machines to the system.

[0073] By determining the total screening period For example, in order to cooperate with the above calculation formula, it is necessary to obtain and organize the project screening cycle data, specifically in the form of the data table template required for screening cycle evaluation as shown in Table 9.

[0074] Table 9. Template for Data Table Required for Screening Cycle Assessment

[0075] In summary, the total screening time is a core component of the total screening cycle (the total cycle includes total time + auxiliary time). Together, they form a time management system of "micro-level operational control + macro-level process coordination": at the micro level, the total screening time controls the stress intensity of individual tests, ensuring that the screening effect is not "overdone"; at the macro level, the total screening cycle coordinates the time consumption of the entire process, ensuring that the screening process does not "time out"; ultimately, they jointly support the screening scheme to achieve the core goal of "completing screening with optimal time allocation within the shortest reasonable cycle, both stimulating potential defects and not damaging the product or delaying production," effectively solving the three major problems of "underscreening, overscreening, and low cost-effectiveness" in existing technologies.

[0076] In some embodiments, for step 104, the quality screening optimization model includes an objective function and objective constraints; based on the objective stress screening project information and the screening index, constructing the quality screening optimization model for the complex electromechanical product to be tested includes the following steps: Step 1041: Based on the target stress screening project information, the total screening cost, and the total screening cycle, construct the objective function with the goal of minimizing the total screening cost and minimizing the total screening cycle.

[0077] In this step, the objective function is constructed based on the target stress screening project information, the total screening cost, and the total screening period, including: Based on the target stress screening project information and the total screening cost, a first initial function is constructed.

[0078] Based on the target stress screening project information and the total screening period, a second initial function is constructed; The target function is constructed based on the first initial function and the second initial function.

[0079] Specifically, for example, the first initial function is guided by the core principle of "minimizing the total screening cost." It uses key parameters of the target stress screening projects (such as project number, stress condition number, and execution status identifier) ​​as independent variables and the total screening cost as the dependent variable to establish a quantitative mapping relationship. The function form must reflect the rule that "if a project is executed, the corresponding cost is accumulated; if it is not executed, the cost is 0," ensuring that the function can accurately reflect the impact of project selection on the total cost.

[0080] Let the first initial function be ,in ( For the first level, number The first screening item, the first The execution status of various stress conditions, 1 = executed, 0 = not executed). To filter for total cost, then: ; In the formula, Let be the unit total cost (including fixed cost ca, variable cost cb, repair cost cc, and quality loss cd) corresponding to the i-th level, the j-th screening item, and the k-th stress condition. This function directly quantifies the relationship between the combination of screening items and the total cost, providing a cost dimension calculation basis for subsequent optimization.

[0081] For example, the second initial function is guided by the core principle of "minimizing the total screening period." It uses the execution status of the target stress screening items, stress parameters, and inter-level dependencies as independent variables, and the total screening period as the dependent variable to establish a quantitative model. The function needs to reflect the "maximum value" rule for parallel tasks within a level and the "cumulative" rule for serial tasks between levels to ensure accurate calculation of the total period corresponding to different combinations of screening items.

[0082] Let the first initial function be ,in ( For the first level, number The first screening item, the first The execution status of various stress conditions, 1 = executed, 0 = not executed). To filter the total period, the period for each level is as follows: (Calculated from the execution status and stress parameters of each screening item within this level), then: ; In the formula, , (For the individual cycle of the i-th level, j-th item, and k-th stress condition), this function clearly presents the quantitative relationship between the selected item combination and the total cycle, providing a calculation basis for the optimization of the cycle dimension.

[0083] Based on the first initial function and the second initial function, the target function is constructed, including: The first initial function focuses on "minimizing cost", the second initial function focuses on "minimizing cycle time", and the objective function needs to achieve a comprehensive optimization of both - avoiding both pursuing the lowest cost to the point of excessively long cycle time and simply shortening the cycle time to the point of soaring cost.

[0084] During construction, weighting coefficients need to be introduced. (Cost weight) and (Period weight), the weight value is determined by production demand (e.g., cost priority). Periodic priority And satisfy The first initial function is used to balance the importance of the two objectives. Then, the first and second initial functions are weighted and aggregated to form the final objective function. The core logic of the objective function is "comprehensive cost minimization," which means that through weight adjustment, the two different dimensions of cost and cycle are transformed into a unified optimization objective, ensuring that the optimization model can simultaneously respond to the constraints of cost and cycle, and output a selection scheme that balances economy and timeliness.

[0085] The objective function is:

[0086] Step 1042: Based on the target stress screening project information, construct the target constraint conditions.

[0087] In this step, the target constraints are constructed based on the target stress screening project information, including: The first constraint condition is constructed as follows: ; In the formula, In order to establish a benchmark screening scheme Below, the screening cycle for products at level x; The second constraint condition is constructed as follows: ; In the formula, F(S) represents the defect coverage of scheme S. For the minimum acceptable defect coverage, Let x be the number of defect categories that can be activated by environmental stress in level x. denoted as the total number of all potential defect categories identified in level x; a represents the system level, b represents the machine level, c represents the board level, and d represents the component level. The third constraint condition is constructed as follows: ; In the formula, Let S be the probability of defect activation, and S be the selection scheme to be optimized. Use this as the benchmark screening scheme; The fourth constraint condition is constructed as follows: ; In the formula, For testing time; The first constraint, the second constraint, the third constraint, and the fourth constraint are combined to form the target constraint.

[0088] The specific objective function and constraints are as follows:

[0089] Based on the above embodiments, this application constructs a defect coverage evaluation model for the screening scheme: Specifically, this step calculates the defect coverage rate based on quality defect coverage analysis. Defect coverage rate refers to the proportion of the number of effectively triggered quality defect types to the total number of identified quality defect types. The defect coverage rate formula can be expressed as: ; Based on the aforementioned analysis results of process quality defects in complex system products, the coverage rate of each level of screening items in the integrated screening scheme for all types of process quality defects is calculated. Assume the product has [number of levels]. Among them, the hierarchy have Class defects, among which If a class can be triggered in the current or higher-level ESS, then the defect coverage should be: ; Given a minimum acceptable process quality defect coverage rate F0, a constraint inequality can be established. For all levels of major quality defects, the activation ability of quality defects in the selected projects can be verified through analysis, resulting in a template for the all-level quality defect coverage analysis data table as shown in Table 10.

[0090] Table 10 Template for Full-Level Quality Defect Coverage Analysis Data Table

[0091] Based on the above embodiments, this application also constructs a defect activation probability evaluation model for screening schemes.

[0092] Specifically, common screening schemes include categories such as temperature cycling, random vibration, and constant high temperature. The environmental stress screening items and their numbers are shown in Table 11; different screening items have different probabilities of defect activation.

[0093] Table 11

[0094] Currently, the main method for quantitatively evaluating the effectiveness of environmental stress screening is the screening degree calculation specified in GJB 34-1993 "Guideline for Quantitative Environmental Stress Screening of Electronic Products". For any level of quality defect, the probability of it being triggered as a failure during the screening stage is the product of its own screening degree and the screening degree of its higher-level sensitive stress items. The calculation method is as follows: In the formula, ESS-D represents the screening item corresponding to the sensitive stress of defect D.

[0095] Temperature cycle screening degree can be calculated using the following formula: ; In the formula, SS represents the screening degree, R represents the temperature change range, v represents the temperature change rate, and n represents the number of cycles. The screening intensity of temperature shock is similar to that calculated using temperature cycling.

[0096] Random vibration screening degree can be calculated using the following formula: In the formula, SS is the screening degree, Grms is the root mean square value of acceleration, and t is the vibration time (minutes).

[0097] The screening efficiency at constant high temperature can be calculated using the following formula: In the formula, R is the difference between the high temperature and the room temperature (room temperature is generally taken as 25℃), and t is the duration of constant high temperature (hours).

[0098] The screening degree of swept-frequency sinusoidal vibration can be calculated using the following formula: In the formula, G is the acceleration measure (g), and t is the vibration time (minutes).

[0099] In some embodiments, solving the quality screening optimization model to obtain a quality screening scheme for the complex electromechanical product to be tested includes: The quality screening optimization model is solved based on the adaptive Levy strategy quantum swarm optimization algorithm to obtain the quality screening scheme for the complex electromechanical products to be tested.

[0100] The multi-objective combinatorial optimization problem of the ESS scheme addressed in this step has a certain degree of scale and complexity. Therefore, during the optimization process, it is necessary to dynamically balance the optimization performance and convergence speed of the algorithm. For traditional heuristic algorithms, achieving a balance between optimization performance and convergence speed requires manual adjustment and experimentation of the algorithm's hyperparameters, which lacks adaptability to the dynamics of different optimization stages. Therefore, this step constructs and applies the Adaptive Levy-Quantum Particle Swarm Optimization (AL-QPSO) algorithm, and designs a dynamic weighting mechanism and an adaptive Levy flight strategy in the algorithm to achieve a dynamic balance between optimization performance and convergence speed, while ensuring the algorithm's exploration performance in the early stage and convergence performance in the later stage. As a foundation, this step first constructs a mapping... The continuous position domain of individual particles Mapping to the decision variable (three-dimensional 0 / 1 matrix) domain, i.e. The weighted sum of cost and cycle time is defined as the fitness function. .

[0101] The following are specific examples: Step 1: Conduct sensitivity stress analysis on all levels of components of the RF direct-purchase remote transponder product. In this embodiment, a certain type of RF direct-purchase remote transponder is used as the object, and sensitivity stress analysis is conducted on its component level, board level, and whole-machine level components to provide an engineering foundation for the subsequent construction of an environmental stress screening project library and screening scheme optimization model. The RF direct-purchase remote transponder mainly consists of an antenna, RF front-end, signal processing unit, and power / control management module, etc. The RF front-end includes a circulator, receiving / transmitting channel, and frequency conversion module, and the signal processing unit is based on the main control chip and RF direct-purchase transceiver. Based on the structural hierarchy of the product, the devices in the "Component Information Field Usage Instructions" are divided into the following typical categories: semiconductor discrete devices, cable assemblies and connectors, resistors, monolithic integrated circuits, capacitors, hybrid integrated circuits, RF microwave devices, inductors / transformers and magnetic components, optoelectronic devices, filters, crystal oscillators, relays, electromechanical components, sensitive elements, etc. For the above-mentioned types of devices, their actual application positions and functions in the RF direct-purchase remote transponder are shown in Table 12.

[0102] Table 12

[0103] After obtaining the structural location and function of each component category, a systematic analysis of the sensitive stresses of various components is conducted, taking into account typical manufacturing defects and failure mechanisms. Following the approach of step 1 of this invention, a "sensitive stress – quality defect" interaction matrix is ​​constructed from the perspectives of temperature cycling, random vibration, constant high temperature, electrical stress, and damp heat / combined stress, as shown in Appendix Table 13a. In the accompanying figures, " "△" indicates highly sensitive stress (preferred screening item), "△" indicates moderately sensitive stress (requires combination with other stresses or adjustment of stress level to achieve effective screening), and "—" indicates weak correlation or negligible correlation. Based on the component-level analysis, typical defects and sensitive stresses of RF front-end boards, signal processing boards, and overall assembly structures are further summarized from the board-level and system-level perspectives, as shown in Table 13b, for subsequent customized design of higher-level ESS conditions.

[0104] Table 13a

[0105] Table 13b

[0106] Based on the above analysis, this embodiment uses the Delphi method to conduct expert evaluation of the "defect excitation effect weight" corresponding to each stress type, and constructs a "sensitive stress-defect" interaction matrix for each component category and board / complete module of the RF direct-purchase remote transponder, providing quantitative parameters for the construction of the environmental stress screening project library in the subsequent technical step 2.

[0107] Step 2: After completing the full-level sensitive stress analysis of the RF direct-purchase remote transponder (Step 1), this step constructs and imports a full-level environmental stress screening project library applicable to this product based on the product structure hierarchy (components – boards – complete machine) and its typical quality defects. This project library serves as the decision variable set for the subsequent screening scheme optimization model, covering the types of defects and their sensitive stresses that may occur during the processing, assembly, and integration of products at each level, providing a complete and quantifiable set of alternative projects for the multi-objective optimization model.

[0108] 2.1. Project library construction principles: The RF direct-purchase remote control transponder involves RF front-end, digital signal processing board, power supply / control board, chassis structure and various components (semiconductor devices, RF microwave devices, resistors / capacitors / magnetic components, crystal oscillators, connectors, etc.). For typical defect types (solder cracks, package cracking, poor contact, shielding failure, parameter drift, abnormal RF link insertion loss, etc.), this step constructs a project library according to the following principles: ① Coverage principle: The project library must cover all "sensitive stress-defect combinations" identified in step 1 to ensure that all potential defects have excitation stress conditions; ② Hierarchical correspondence principle: Different levels of products use stress projects of different scales and intensities. For example, components are mainly based on "electrical-thermal-mechanical" stress, board level emphasizes solder fatigue and structural resonance, and whole machine level emphasizes comprehensive stress and interface stability verification; ③ Customizability principle: Different device categories can be configured with different intensities (such as cycle number, vibration spectrum value, temperature holding time) under the same stress project to form a "stress level library"; ④ Engineering feasibility principle: The project library only includes screening projects that can be executed by the current experimental equipment and production line to ensure that the optimization results can be directly used for engineering implementation.

[0109] 2.2. Structural composition of the environmental stress screening project library: The radio frequency direct acquisition remote transponder (ESS) project library constructed in this embodiment includes the following three parts. ① General Environmental Stress Screening Project Library: Combining thermal defects, welding fatigue defects, electrical failures, and vibration-sensitive defects in the product, a general project library as shown in Table 14 is constructed to ensure that common defects of key boards such as the RF front-end, digital processing board, and power module, as well as the overall assembly structure, are covered; ② Component-Level Dedicated Screening Project Library: Based on the actual types of components used in the RF direct-purchase remote transponder and in conjunction with electronic product screening standards, a dedicated project library as shown in Table 15 is constructed for the component layer. The dedicated projects address the main defect mechanisms of key components such as circulators, couplers, amplifiers, and AFE7422 in the RF front-end, forming the basis of the component-level ESS; ③ Based on the structural characteristics of the RF direct-purchase remote transponder, a board-level screening project library as shown in Table 16 and an overall system-level screening project library as shown in Table 17 are constructed. The screening projects correspond to the RF direct-purchase remote transponder as a typical real-world scenario of the "RF direct purchase + high-speed processing" system, ensuring that system-level assembly defects and interface compatibility issues can be exposed during the screening stage. 2.3. Importing the screening project library: Import the screening project libraries at all levels from Tables 14 to 17 into the screening optimization model in step 3 according to the three-dimensional structure of "product level - screening project - stress level", and it can be used to optimize the implementation of the ESS solution.

[0110] Table 14

[0111] Table 15

[0112] Table 16

[0113] Table 17

[0114] Step 3: After completing the full-level sensitive stress analysis of the RF direct-purchase remote transponder products and constructing a full-level environmental stress screening project library, this step establishes a comprehensive optimization model for screening schemes for RF direct-purchase remote transponders. This model uses screening cost and screening cycle as the main optimization objectives, and defect coverage and defect activation probability as constraint indicators, to achieve quantitative comprehensive optimization of screening schemes across all levels of environmental stress.

[0115] 3.1. Product Type, Level, and Defect Definition. RF direct-purchase remote control transponders are typical RF communication products within complex electromechanical equipment. Their structural levels mainly include: ① Component Level: Covering discrete semiconductor devices, RF microwave devices, various resistors / capacitors / magnetic components, crystal oscillators, connectors, and electromechanical components, etc. Typical quality defects include cold solder joints, package cracks, parameter drift, ESD damage, and insulation breakdown; ② Board Level: Including RF front-end boards, signal processing boards, power and control boards, etc. Typical defects include cracked solder balls on large BGA devices, solder joint failures caused by board bending, loose device installation, and poor contact in internal wiring; ③ Complete Unit Level: Including chassis structure, internal and external connecting cables and interfaces, heat dissipation and shielding components, etc. Typical defects include poor connector locking, insufficient RF shielding, loose cable fixing, and improper assembly tolerances.

[0116] 3.2. Mapping Decision Variables to the Project Library. Based on the environmental stress screening project library for RF direct-purchase remote transponders constructed in step 2, the screening scheme is represented as a three-dimensional 0 / 1 decision matrix. This matrix contains three dimensions: "product component index, screening project index, and stress level index." ① Product component index: Let... ① Index product components, covering component-level, board-level, and system-level components; ② Filter item index: [Note: The original text contains some formatting errors and inconsistencies. A more accurate translation would require the full context.] The selection index includes items such as temperature cycling, random vibration, constant high temperature, electrical stress, combined stress, and component-level dedicated burn-in, X-ray inspection, and sealing inspection; ③ Note To filter the stress level index for project j, decision variables can be defined based on the three index dimensions mentioned above. 3D matrix This refers to a full-level environmental stress screening scheme for RF direct-access remote transponders. To ensure the physical feasibility of the scheme, the following basic constraints are applied: ① Availability constraint: For projects marked as "unavailable for a certain component or level" in the project library, mandatory... ② Single stress level constraint: For the same component i and the same screening item j, at most one stress level can be selected, i.e. .

[0117] 3.3. Comprehensive Optimization Model Form: Combining the above decision variables The optimization model constructed in step 3 of the basic constraint import technology can be used to define the comprehensive optimization model for the full-level environmental stress screening scheme of the RF direct-purchase remote transponder product.

[0118] Among them, the cost function Periodic functions Defect coverage With the probability of defect activation The specific calculations are carried out by the evaluation models in technical steps 4–7. This comprehensive optimization model closely integrates the product hierarchy structure, typical quality defects, and environmental stress screening project library of RF direct-purchase remote transponders, providing a unified mathematical description and constraint framework for subsequent optimization of screening schemes based on the AL-QPSO algorithm.

[0119] Step 4: Optimize the environmental stress screening scheme for a certain electromechanical product using the AL-QPSO algorithm. After... After rounds of iteration, the fitness convergence curve and the iteration curves for cost, cycle time, and defect coverage are detailed in the appendix. Figure 2 As shown in the figure, the curves in the figure indicate that the algorithm tends to stabilize and converge after 200-400 iterations.

[0120] Step 5: Results Export and Analysis: Based on the results of the AL-QPSO algorithm, the optimization results of the environmental stress screening scheme for a certain RF direct-purchase remote transponder product in this use case are shown in Table 18. (See Appendix) Figure 2 As can be seen from the data, compared with the randomly generated initial samples, the ESS optimization scheme shown in Table 18 ensures that the defect coverage and the defect activation probability are not lower than the constraint conditions. , Under the premise of reducing the total screening cost by 88.02% and the total screening cycle by 80.05%, the results of this embodiment show that the multi-objective optimization method for integrated environmental stress screening scheme of complex electromechanical products of the present invention can effectively optimize the integrated ESS scheme of complex electromechanical products of different levels and obtain a high-quality optimized solution for the screening scheme.

[0121] Table 18

[0122] It should be noted that the method in this embodiment can be executed by a single device, such as a computer or server. The method can also be applied in a distributed scenario, where multiple devices cooperate to complete the task. In such a distributed scenario, one of these devices may execute only one or more steps of the method in this embodiment, and the multiple devices will interact with each other to complete the method described.

[0123] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0124] Based on the same inventive concept, corresponding to any of the above embodiments, this application also provides a complex electromechanical product screening device.

[0125] refer to Figure 3 The complex electromechanical product screening device includes: The acquisition module 302 is configured to acquire the structural hierarchy information of the complex electromechanical product to be tested. The first determining module 304 is configured to determine the target stress screening item information based on the structural hierarchy information and the preset defect library; The second determining module 306 is configured to determine the screening index based on the target stress screening project information; The construction module 308 is configured to construct a quality screening optimization model for the quality screening of the complex electromechanical product to be tested based on the target stress screening project information and the screening index. Solving module 310 is configured to solve the quality screening optimization model to obtain a quality screening scheme for the complex electromechanical product to be tested. The screening module 312 is configured to screen the quality of the complex electromechanical product to be tested according to the quality screening scheme.

[0126] For ease of description, the above devices are described in terms of function, divided into various modules. Of course, in implementing this application, the functions of each module can be implemented in one or more software and / or hardware.

[0127] The apparatus described above is used to implement a corresponding complex electromechanical product screening method in any of the foregoing embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0128] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement a complex electromechanical product screening method as described in any of the above embodiments.

[0129] Figure 4 This embodiment illustrates a more specific hardware structure of an electronic device. The device may include a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, memory 1020, input / output interface 1030, and communication interface 1040 are interconnected internally via the bus 1050.

[0130] The processor 1010 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0131] The memory 1020 can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1020 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program code is stored in the memory 1020 and is called and executed by the processor 1010.

[0132] The input / output interface 1030 is used to connect input / output modules to realize information input and output. Input / output modules can be configured as components within the device (not shown in the figure) or externally connected to the device to provide corresponding functions. Input devices may include keyboards, mice, touchscreens, microphones, various sensors, etc., while output devices may include displays, speakers, vibrators, indicator lights, etc.

[0133] The communication interface 1040 is used to connect a communication module (not shown in the figure) to enable communication between this device and other devices. The communication module can communicate via wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0134] Bus 1050 includes a pathway for transmitting information between various components of the device, such as processor 1010, memory 1020, input / output interface 1030, and communication interface 1040.

[0135] It should be noted that although the above-described device only shows the processor 1010, memory 1020, input / output interface 1030, communication interface 1040, and bus 1050, in specific implementations, the device may also include other components necessary for normal operation. Furthermore, those skilled in the art will understand that the above-described device may only include the components necessary for implementing the embodiments of this specification, and not necessarily all the components shown in the figures.

[0136] The electronic devices described above are used to implement a corresponding complex electromechanical product screening method in any of the foregoing embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0137] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this application also provides a non-transitory computer-readable storage medium that stores computer instructions for causing the computer to execute a complex electromechanical product screening method as described in any of the above embodiments.

[0138] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.

[0139] The computer instructions stored in the storage medium of the above embodiments are used to cause the computer to execute a complex electromechanical product screening method as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0140] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0141] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0142] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0143] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A method for screening complex electromechanical products, characterized in that, include: Obtain the structural hierarchy information of the complex electromechanical product to be tested; Based on the structural hierarchy information and the preset defect library, the target stress screening item information is determined; Based on the target stress screening project information, the screening criteria are determined; Based on the target stress screening project information and the screening indicators, a quality screening optimization model is constructed for quality screening of the complex electromechanical products to be tested. Solve the quality screening optimization model to obtain a quality screening scheme for the complex electromechanical product to be tested; The quality of the complex electromechanical products to be tested is screened according to the quality screening scheme.

2. The method according to claim 1, characterized in that, Based on the structural hierarchy information and the preset defect library, the target stress screening item information is determined, including: Based on the structural hierarchy information and the preset defect library, the initial stress screening item information is determined; The initial stress screening information is evaluated to determine the target stress screening information.

3. The method according to claim 1, characterized in that, The target stress screening project information includes screening cost information and screening cycle information; The screening criteria include total screening cost and total screening period; Based on the target stress screening project information, the screening criteria are determined, including: Based on the screening cost information, determine the total screening cost; The total screening period is determined based on the screening period information.

4. The method according to claim 3, characterized in that, The screening cost information includes: screening fees, screening time, repair costs, rework costs, and quality losses; Based on the screening cost information, the total screening cost is determined, including: The total screening cost is calculated using the following formula: ； In the formula, For product hierarchy numbering, To filter project numbers, To screen stress condition numbers, This indicates that the filter item will be executed. This indicates that the selection criteria will not be applied. For fixed costs, For variable costs, For repair costs, For quality loss, The total screening cost for item s.

5. The method according to claim 3, characterized in that, The screening cycle information includes: temperature screening information, vibration screening information, and screening process information; Determining the total screening period based on the aforementioned screening period information includes: Based on the temperature screening information, the vibration screening information, and the screening process information, determine the device-level screening cycle, the board-level screening cycle, the complete machine-level screening cycle, and the system-level screening cycle. The total screening cycle is determined based on the device-level screening cycle, board-level screening cycle, machine-level screening cycle, and system-level screening cycle.

6. The method according to claim 5, characterized in that, The temperature screening information includes the number of temperature cycles, the number of temperature cycles, the high temperature holding time, the low temperature holding time, and the temperature change rate. The vibration screening information includes: vibration batch, number of vibrations, and vibration time; The screening process information includes: screening operation time, test preparation time, scheduling and round-trip transportation time; Based on the temperature screening information, the vibration screening information, and the screening process information, the device-level screening cycle, board-level screening cycle, system-level screening cycle, and system-level screening cycle are determined, including: The device-level screening cycle and the board-level screening cycle are determined based on the screening operation time, the test preparation time, and the scheduling and round-trip transportation time. The whole-machine screening cycle is determined based on the number of temperature cycles, the batch of temperature cycles, the high temperature holding time, the low temperature holding time, the temperature change rate, the vibration batch, the number of vibrations, the vibration time, the test preparation time, and the scheduling and round-trip transportation time. The system-level screening cycle is determined based on the vibration batch, the number of vibrations, the vibration time, the test preparation time, and the scheduling and round-trip transportation time.

7. The method according to claim 3, characterized in that, The quality screening optimization model includes an objective function and objective constraints; Based on the target stress screening project information and the screening indicators, a quality screening optimization model for the complex electromechanical product to be tested is constructed, including: Based on the target stress screening project information, the total screening cost, and the total screening period, the objective function is constructed with the goal of minimizing the total screening cost and minimizing the total screening period. Based on the target stress screening project information, the target constraints are constructed.

8. The method according to claim 7, characterized in that, Based on the target stress screening project information, the total screening cost, and the total screening period, the objective function is constructed, including: Based on the target stress screening project information and the total screening cost, a first initial function is constructed; Based on the target stress screening project information and the total screening period, a second initial function is constructed; The target function is constructed based on the first initial function and the second initial function.

9. The method according to claim 7, characterized in that, Based on the target stress screening project information, the target constraints are constructed, including: The first constraint condition is constructed as follows: ； In the formula, In order to establish a benchmark screening scheme Below, the screening cycle for products at level x; The second constraint condition is constructed as follows: ； In the formula, F(S) represents the defect coverage of scheme S. For the minimum acceptable defect coverage, Let x be the number of defect categories that can be activated by environmental stress in level x. denoted as the total number of all potential defect categories identified in level x; a represents the system level, b represents the machine level, c represents the board level, and d represents the component level. The third constraint condition is constructed as follows: ； In the formula, Let S be the probability of defect activation, and S be the selection scheme to be optimized. Use this as the benchmark screening scheme; The fourth constraint condition is constructed as follows: ； In the formula, For testing time; The first constraint, the second constraint, the third constraint, and the fourth constraint are combined to form the target constraint.

10. The method according to claim 1, characterized in that, Solving the quality screening optimization model to obtain a quality screening scheme for the complex electromechanical product to be tested includes: The quality screening optimization model is solved based on the adaptive Levy strategy quantum swarm optimization algorithm to obtain the quality screening scheme for the complex electromechanical products to be tested.

11. A screening device for complex electromechanical products, characterized in that, include: The acquisition module is configured to acquire the structural hierarchy information of the complex electromechanical product to be tested. The first determining module is configured to determine the target stress screening item information based on the structural hierarchy information and a preset defect library; The second determining module is configured to determine the screening criteria based on the target stress screening project information; The construction module is configured to construct a quality screening optimization model for the quality screening of the complex electromechanical product to be tested based on the target stress screening project information and the screening indicators. The solver module is configured to solve the quality screening optimization model to obtain a quality screening scheme for the complex electromechanical product to be tested. The screening module is configured to screen the quality of the complex electromechanical products to be tested according to the quality screening scheme.

12. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the method as described in any one of claims 1 to 10.

13. A non-transitory computer-readable storage medium storing computer instructions, characterized in that, The computer instructions are used to cause the computer to perform the method described in any one of claims 1 to 10.

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