Composite system fuze transmitting and receiving assembly based on SIP (Session Initiation Protocol) module
By integrating RF chips through SiP module packaging, the reliability and anti-interference issues of radio fuze transceiver components are solved, achieving miniaturized and low-cost modular design suitable for mass production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GUIZHOU AEROSPACE ELECTRONICS TECH CO LTD
- Filing Date
- 2026-01-27
- Publication Date
- 2026-05-15
AI Technical Summary
Existing bare-chip designs in radio fuze transceiver components suffer from low reliability, mechanical fragility, poor heat dissipation, sensitivity to electromagnetic interference, and high application barriers, making it difficult to meet the requirements of large-scale production and high anti-interference capabilities.
The SiP module packaging structure integrates key RF chips, including a transmit SIP module, a receive SIP module, a frequency source SIP module, and an intermediate frequency signal module. Electromagnetic shielding and modular design are implemented to simplify the cavity structure and reduce the printed circuit board layout area.
It improves the reliability and anti-interference capability of the fuze, reduces the system size and cost, and achieves modular design and high integration, making it suitable for mass production.
Smart Images
Figure CN122052827A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of radio frequency communication equipment technology. Background Technology
[0002] The main principle of a radio fuze is to utilize the reflection of electromagnetic waves by the target and obtain information such as the target's distance and relative velocity based on the analysis of the echo. Currently, radio fuzes mainly operate in pulse, frequency modulation, phase modulation, and coded modulation modes. The transceiver module, as the core component of the fuze, typically determines the overall size of the fuze. Currently, transceiver modules are usually designed based on bare chips for the radio frequency link.
[0003] The working principle of the random code phase modulation system is to generate randomly encoded high-frequency noise (such as pseudo-random code) in the transmitter. This signal has random characteristics similar to noise. When this signal encounters a target, it is reflected and received by the receiver. The receiver then performs calculations with the locally stored original random code. Finally, through correlation processing, only the target's reflected signal will form a significant peak, thereby extracting information such as the target's range and velocity. This system has the advantages of strong anti-interference capability, low interception rate, and high range resolution, but it also has disadvantages such as low transmit power utilization, difficulty in multi-target processing, and complex signal processing.
[0004] The working principle of linear frequency modulation (LFM) is to generate a high-frequency signal that varies linearly with time in the transmitter. This signal is reflected when it encounters a target and enters the receiver. The received signal experiences a time delay due to the target distance, and while its frequency variation follows the same pattern as the transmitted signal, it has a time offset. After processing this signal with a local reference signal, information such as the target's distance and velocity can be extracted. The advantages of this system are high transmit power utilization, mature technology, and simple structure. The disadvantages are the presence of Doppler coupling and susceptibility to interference.
[0005] In the transceiver components of the fuze front end, key RF chips are typically designed as bare chips. This aims to reduce the impact of parasitic parameters on high-frequency signals and offers advantages such as flexible integration and excellent high-frequency performance. However, it also has the following disadvantages: High reliability requirements: Bare chips have no packaging protection and are subject to high requirements for the operating environment. Humidity, dust, etc. need to be strictly controlled, otherwise chip failure may occur. Mechanical fragility: Bare chips lack the protection of traditional packages (such as QFN, BGA, etc.) and are easily damaged by mechanical stress during transportation, assembly, or use; High application threshold: The assembly processes such as welding and bonding of bare chips require extremely high operational precision and specialized equipment and technicians. They are not suitable for large-scale automated production of ordinary consumer products and are more often used in high-end or customized scenarios. Poor heat dissipation: The bare chip is directly exposed to the environment and lacks the heat dissipation structure of traditional packaging, resulting in high thermal resistance; Electromagnetic interference sensitive: Bare chips lack packaging shielding and are easily affected by external electromagnetic interference. Summary of the Invention
[0006] The purpose of this invention is to provide a composite fuse transceiver component based on a SIP module. By integrating key radio frequency chips into a fixed-function bare chip using a SiP packaging structure, the reliability of the circuit can be improved, while reducing the design and fabrication difficulty of related cavity structures, thereby achieving the goals of reducing costs and system size.
[0007] To address the aforementioned technical problems, this invention provides a composite fuse transceiver assembly based on a SIP module, comprising a transmitting SIP module and a receiving SIP module. The transmitting SIP module is pre-connected to a phase-modulation SIP module, which is connected to a frequency source SIP module and a digital signal processing unit. The frequency source SIP module is connected to the receiving SIP module, which is also connected to the digital signal processing unit via an intermediate frequency (IF) signal module. The transmitting SIP module amplifies the excitation signal of the transmitting branch and outputs it to the transmitting antenna. The frequency source SIP module generates a linear frequency modulated (LFM) signal, which is output as the frequency-converted local oscillator signal of the receiving SIP module and the excitation signal of the transmitting branch. The phase-modulation SIP module modulates the phase of the excitation signal of the transmitting branch, forming the excitation signal of the transmitting branch, which is then input to the transmitting SIP module. The receiving SIP module receives the target echo signal, down-converts it, and transmits it to the IF signal module. The IF signal module amplifies the down-converted signal.
[0008] The receiving SIP module is an amplifier, filter, and mixer integrated and packaged in a single housing.
[0009] The transmit SIP module is made by integrating a frequency multiplier, filter, amplifier and power divider into a single package.
[0010] The transmitting SIP module splits the signal power into two paths and outputs them to the transmitting antenna, while the receiving SIP module amplifies the target echo signal and combines it into one path.
[0011] The phase-shifting SIP module is made by integrating a single-pole double-throw switch and a phase shifter into a single housing.
[0012] The frequency source SIP module and the intermediate frequency signal module are integrated into the first module on the same layer, and the transmitting SIP module and the receiving SIP module are integrated into the second module on the same layer. The first module and the second module overlap and are fixedly installed with screws.
[0013] The first module and the second module are located in relatively independent chambers.
[0014] The frequency source SIP module is made by integrating an operational amplifier, a voltage-controlled oscillator, a filter, a power divider, and a frequency multiplier into a single package.
[0015] The phase-shifting SIP module is made by integrating a single-pole double-throw switch and a phase shifter into a single housing.
[0016] The intermediate frequency signal module consists of an amplifier, an attenuator, and a temperature-compensated attenuator.
[0017] Compared to existing technologies, this invention integrates all the bare RF chips into the SIP module. Therefore, electromagnetic shielding of the RF chips can be designed during the design process without considering electromagnetic compatibility issues in the cavity structure. This simplifies the complexity of the cavity structure and has the advantages of higher space utilization, higher integration, shorter trace distances between devices, and fewer solder joints. At the same time, integrating all the bare chips greatly reduces the area of the printed circuit board layout, thus enabling the module to be miniaturized and integrated.
[0018] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description
[0019] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.
[0020] Figure 1 This is a schematic diagram of the connection principle of at least one embodiment of the present invention; Figure 2 yes Figure 1 The circuit diagram is shown. Detailed Implementation
[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the embodiments of this invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details are presented in the embodiments of this invention to facilitate a better understanding of this application. However, the technical solutions claimed in this application can be implemented even without these technical details and various variations and modifications based on the following embodiments. The division of the following embodiments is for ease of description and should not constitute any limitation on the specific implementation of this invention. The embodiments can be combined with and referenced by each other without contradiction.
[0022] Example 1 like Figure 1 The illustrated composite fuse transceiver assembly based on a SIP module includes a transmitting SIP module and a receiving SIP module. The transmitting SIP module is pre-connected to a phase-modulation SIP module, which is connected to a frequency source SIP module and a digital signal processing unit. The frequency source SIP module is connected to the receiving SIP module, which is also connected to the digital signal processing unit via an intermediate frequency (IF) signal module. The transmitting SIP module amplifies the excitation signal of the transmitting branch and outputs it to the transmitting antenna. The frequency source SIP module generates a linear frequency modulated (LFM) signal, which is output as the frequency-converted local oscillator signal of the receiving SIP module and the excitation signal of the transmitting branch. The phase-modulation SIP module modulates the phase of the excitation signal of the transmitting branch, forming the excitation signal of the transmitting branch, which is then input to the transmitting SIP module. The receiving SIP module receives the target echo signal, down-converts it, and transmits it to the IF signal module. The IF signal module amplifies the down-converted signal.
[0023] Example 2 Based on Example 1, the receiving SIP module is made by integrating an amplifier, filter, and mixer into a single package.
[0024] Furthermore, the transmit SIP module is made by integrating a frequency multiplier, filter, amplifier, and power divider into a single package.
[0025] Furthermore, the transmitting SIP module splits the signal power into two paths and outputs them to the transmitting antenna, while the receiving SIP module amplifies the target echo signal and combines it into one path.
[0026] Furthermore, the phase-shifting SIP module is made by integrating a single-pole double-throw switch and a phase shifter into a single package.
[0027] Example 3 Based on Embodiment 1, the frequency source SIP module and the intermediate frequency signal module are integrated into the first module on the same layer, and the transmit SIP module and the receive SIP module are integrated into the second module on the same layer. The first module and the second module overlap and are fixedly installed with screws.
[0028] Furthermore, the first module and the second module are located in relatively independent chambers.
[0029] Furthermore, the frequency source SIP module is made by integrating an operational amplifier, voltage-controlled oscillator, filter, power divider, and frequency multiplier into a single package.
[0030] Furthermore, the phase-shifting SIP module is made by integrating a single-pole double-throw switch and a phase shifter into a single package.
[0031] Furthermore, the intermediate frequency signal module consists of an amplifier, an attenuator, and a temperature-compensated attenuator.
[0032] Example 4 In conjunction with the above embodiments, the component part includes a transmit SIP module, a receive SIP module, a frequency source SIP module, a phase modulation SIP module, and an intermediate frequency signal module.
[0033] In the transceiver components, the receiving SIP module mainly consists of amplifiers, filters, mixers, etc. Its main function is to use a low-noise amplifier to amplify the received target echo signal and synthesize it into a single channel, which is then mixed with the local oscillator signal of the receiving channel in the mixer to obtain a zero intermediate frequency signal.
[0034] The transmit SIP module mainly consists of a frequency multiplier, a filter, an amplifier, and a power divider. Its main function is to use the filter to suppress out-of-band harmonics, and then use a driver amplifier and a power amplifier to saturate and amplify the signal of the transmit branch, and then divide the signal into two outputs to the transmit antenna.
[0035] The frequency source SIP module mainly consists of operational amplifiers, voltage-controlled oscillators, filters, power dividers, frequency multipliers, and other components. Its function is to generate a linear frequency-modulated signal using the voltage-controlled oscillator and operational amplifier, divide it into two paths, and use a frequency multiplier to multiply the signal to the desired frequency band, serving as the local oscillator signal for the receiving module and the excitation signal for the transmitting module.
[0036] The intermediate frequency signal module mainly consists of amplifiers, attenuators, temperature-compensated attenuators, and other components. Its main function is to further amplify the down-converted signal to ensure that the digital signal processing module can effectively acquire the data.
[0037] The phase modulation SIP module mainly consists of a single-pole double-throw switch and a phase shifter. Its main function is to phase the linear frequency modulation signal output from the frequency source SIP according to the phase modulation control signal, and then input it to the transmit SIP for amplification and filtering.
[0038] Structurally, the design consists of two independent modules, overlapping each other and secured with screws. Module one comprises a frequency source SIP module, an intermediate frequency (IF) signal module, and a power supply section, handling power conversion, linear frequency modulation (LFM) signal generation, and IF amplification. Module two is the transceiver module, responsible for transmitting and receiving RF signals. This design prioritizes modularity and cavity isolation. The lower-level module is divided into two independent cavities. One cavity houses a DC-DC converter to convert the input voltage to the required ±5V, shielded by a cover plate to effectively isolate low-frequency oscillations from the power supply. The other cavity houses the frequency source SIP module and the IF signal module. An SMP interface connects the IF signal module's input to the receiver's IF output, allowing for independent testing of the IF signal module and receiver performance, separate from the high-frequency circuitry. The upper-level module comprises a high-frequency transmitting circuit and a high-frequency receiving circuit. Since the radio frequency interface of the high-frequency transceiver section is a waveguide interface, its position is fixed in structure and all of them are radio frequency circuits. This part of the circuit is designed independently, and the high-frequency part is functionally divided and tested independently, which has the advantages of high isolation and strong testability.
[0039] Therefore, this invention uses only one transceiver component to combine two fuze operating modes, taking into account the advantages of both modes. It improves the fuze's anti-interference capability while ensuring high ranging accuracy. All bare chips are integrated using SiP (System-in-Package) design. The designed SiP module can be directly surface-mounted onto the printed circuit board surface, eliminating the need for complex gold wire bonding processes and hermetic cavity laser sealing processes, thus reducing design complexity. Simultaneously, the simplified cavity structure further reduces the system size, achieving miniaturization. SiP module packaging effectively reduces device costs for mass production designs, achieving low cost.
[0040] Those skilled in the art will understand that the above embodiments can be modified in form and detail in practical applications without departing from the spirit and scope of the invention.
Claims
1. A composite fuse transceiver component based on a SIP module, characterized in that: The system includes a transmit SIP module and a receive SIP module. The transmit SIP module is pre-connected to a phase modulation SIP module, which is connected to a frequency source SIP module and a digital signal processing unit. The frequency source SIP module is connected to the receive SIP module, which is also connected to the digital signal processing unit via an intermediate frequency signal module. The transmit SIP module amplifies the excitation signal of the transmit branch and outputs it to the transmit antenna. The frequency source SIP module generates a linear frequency modulated signal and outputs it as the frequency-converted local oscillator signal of the receive SIP module and the excitation signal of the transmit branch. The phase modulation SIP module modulates the phase of the excitation signal of the transmit branch to form the excitation signal of the transmit branch, which is then input to the transmit SIP module. The SIP receiving module receives the target echo signal, down-converts it to a frequency converter, and then sends it to the intermediate frequency signal module. The intermediate frequency signal module amplifies the down-converted signal.
2. The composite fuse transceiver component based on a SIP module as described in claim 1, characterized in that: The receiving SIP module is an amplifier, filter, and mixer integrated and packaged in a single housing.
3. The composite fuse transceiver component based on a SIP module as described in claim 1, characterized in that: The transmit SIP module is made by integrating a frequency multiplier, filter, amplifier and power divider into a single package.
4. The composite fuse transceiver component based on a SIP module as described in claim 1, characterized in that: The transmitting SIP module splits the signal power into two paths and outputs them to the transmitting antenna, while the receiving SIP module amplifies the target echo signal and combines it into one path.
5. The composite fuse transceiver component based on a SIP module as described in claim 1, characterized in that: The phase-shifting SIP module is made by integrating a single-pole double-throw switch and a phase shifter into a single housing.
6. The composite fuse transceiver component based on a SIP module as described in claim 1, characterized in that: The frequency source SIP module and the intermediate frequency signal module are integrated into the first module on the same layer, and the transmitting SIP module and the receiving SIP module are integrated into the second module on the same layer. The first module and the second module overlap and are fixedly installed with screws.
7. The composite fuse transceiver component based on a SIP module as described in claim 6, characterized in that: The first module and the second module are located in relatively independent chambers.
8. The composite fuse transceiver component based on a SIP module as described in claim 1, characterized in that: The frequency source SIP module is made by integrating an operational amplifier, a voltage-controlled oscillator, a filter, a power divider, and a frequency multiplier into a single package.
9. The composite fuse transceiver component based on a SIP module as described in claim 1, characterized in that: The phase-shifting SIP module is made by integrating a single-pole double-throw switch and a phase shifter into a single housing.
10. The composite fuse transceiver component based on a SIP module as described in claim 1, characterized in that: The intermediate frequency signal module consists of an amplifier, an attenuator, and a temperature-compensated attenuator.