Circuit board fixing and pressing device and pressing process

Abstract

The invention provides a circuit board fixing and pressing device and a pressing process, and relates to the technical field of multilayer circuit board manufacturing, the circuit board fixing and pressing device comprises a pressing machine table with a vacuum chamber inside, the pressing machine table is internally provided with a positioning mechanism and a pressing mechanism, the positioning mechanism comprises an upper positioning assembly and a lower positioning assembly, the upper positioning assembly comprises a plurality of telescopic upper positioning bodies, the lower positioning assembly comprises a plurality of telescopic lower positioning bodies, and each lower positioning body comprises a first positioning disc and a positioning pin located above the first positioning disc. The upper positioning main body comprises a positioning ring with an inclined outer side surface and a second positioning disc arranged on the outer side of the positioning ring in a sleeving manner, the multiple first positioning discs and the multiple second positioning discs are attached to achieve extrusion positioning of the multilayer circuit board, and the pressing mechanism comprises two pressing platforms. According to the invention, the residual quantity of bubbles between layers of the multilayer circuit board is greatly reduced, and the quality of the finished multilayer circuit board is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of multilayer circuit board manufacturing technology, and in particular to a circuit board fixing and pressing device and pressing process. Background Technology

[0002] In the manufacturing process of multilayer circuit boards, the lamination process is the core step that determines the stability and electrical performance of the board structure. It typically involves sequentially stacking the etched inner core board, prepreg, and outer copper foil according to the designed structure. Then, using vacuum, high-temperature, and high-pressure equipment, the prepreg is melted, flowed, and cured, ultimately bonding the multilayer boards into a rigid, integrated board. Some equipment optimizes parameters such as vacuum level, heating rate, and pressure curves to reduce defects such as interlayer bubbles, delamination, and misalignment, thus meeting the production requirements of conventional multilayer boards.

[0003] Existing lamination processes and equipment still have significant shortcomings in actual production. For high-layer and high-density circuit boards, the air exhaust path between layers is long and it is easy to form closed air bubble cavities. Simply relying on vacuum suction is not enough to completely remove the gas, which can easily lead to problems such as air bubbles, white spots, and insufficient adhesive in the board. At the same time, traditional equipment lacks a dynamic adjustment structure for the interlayer state, and cannot actively change the interlayer gap state to accelerate the exhaust during the vacuum degassing stage. The overall exhaust efficiency is low and the lamination cycle is long, making it difficult to ensure the lamination yield and production stability of high-layer and multi-layer circuit boards. Summary of the Invention

[0004] To address the aforementioned problems, this invention provides a circuit board fixing and pressing device and a pressing process. This invention significantly reduces the amount of residual air bubbles between layers of multilayer circuit boards, thereby greatly improving the quality of the final multilayer circuit board product.

[0005] To solve the above problems, the technical solution adopted by the present invention is as follows: A circuit board fixing and pressing device includes a pressing machine with an internal vacuum chamber. The pressing machine is equipped with a positioning mechanism and a pressing mechanism. The positioning mechanism includes an upper positioning component and a lower positioning component. The upper positioning component includes multiple retractable upper positioning bodies, and the lower positioning component includes multiple retractable lower positioning bodies. Each lower positioning body includes a first positioning plate and a positioning pin located above the first positioning plate. Each upper positioning body includes a positioning ring with an inclined outer surface and a second positioning plate sleeved on the outside of the positioning ring. The multiple first and second positioning plates are fitted together to achieve compression positioning of the multilayer circuit board. The pressing mechanism includes two pressing platforms. The sidewalls of the pressing platforms are equipped with retractable lifting components. Controlling the lifting components to abut against the sidewalls of the multilayer circuit board changes the interlayer state of the multilayer circuit board, accelerating the discharge of residual gas.

[0006] Preferably, the pressing platform has a receiving groove on its surface, the lifting component is located in the receiving groove, and a lifting telescopic rod is fixed on the other side of the pressing platform. When the lifting component is in the retracted state, it is flush with the surface of the pressing platform.

[0007] Preferably, the lifting assembly includes a first lifting assembly in the horizontal direction and a second lifting assembly in the vertical direction, and the first lifting assembly and the second lifting assembly are controlled independently.

[0008] Preferably, the upper positioning body further includes an upper positioning telescopic rod, the positioning ring is fixedly connected to the telescopic end of the upper positioning telescopic rod, the second positioning disk is slidably connected to the telescopic end of the upper positioning telescopic rod, and an elastic reset element is provided between the two.

[0009] Preferably, the pressing mechanism includes a retractable upper pressing body and a retractable lower pressing body. Both pressing platforms have multiple through openings on their surfaces, with the inner diameter of the through openings being larger than the outer diameter of the positioning disk. The pressing platform of the upper pressing body has a built-in limiting telescopic rod, the telescopic end of which extends through the through opening. Controlling the extension of the telescopic end of the limiting telescopic rod to extend it limits the second positioning disk. The second positioning disk descends synchronously with the pressing platform to press against the upper surface of the multilayer circuit board. Controlling the retraction of the telescopic end of the limiting telescopic rod to retract it cancels the limitation on the second positioning disk.

[0010] Preferably, the limiting telescopic rod is a double-headed telescopic rod, which is located between two through openings on the same side.

[0011] Preferably, the limiting telescopic rod is an elastic pneumatic telescopic rod, and the pneumatic telescopic rod includes a vent connector with a built-in control valve.

[0012] Preferably, the inner diameter of the positioning ring is larger than the outer diameter of the positioning pin, and the outer diameter of the positioning ring is smaller than the opening size on the surface of the multilayer circuit board.

[0013] A circuit board fixing and pressing process, using the aforementioned circuit board fixing and pressing device, includes the following steps: S1, placing a circuit board with an opening on its surface through positioning pins and placing it on the upper end of a first positioning plate to form a multilayer circuit board; S2, controlling the first positioning plate and the second positioning plate to adhere to each other to achieve compression positioning of the multilayer circuit board; S3, while evacuating the vacuum chamber, controlling the lifting component to abut against the side wall of the multilayer circuit board to change the interlayer state of the multilayer circuit board and accelerate the discharge of residual gas; S4, controlling the two pressing platforms to move closer to each other to achieve vacuum hot pressing of the multilayer circuit board.

[0014] Preferably, before the vacuum hot pressing in step S4, the positioning ring moves downward through the opening on the surface of the multilayer circuit board, and the positioning ring applies pressure to the multilayer circuit board from the side to achieve the compression and reset of the interlayer structure of the multilayer circuit board.

[0015] The beneficial effects of this invention are as follows: Compared with existing technologies, in summary, the above structural design enables precise and efficient positioning of multilayer circuit boards through the positioning mechanism, ensuring stable interlayer positioning; the pressing mechanism effectively squeezes the multilayer circuit boards from both sides, ensuring stable interlayer bonding; and the lifting component breaks the trapped air bubbles, allowing residual gas to be vacuumed away more quickly, greatly reducing the amount of residual air bubbles between the layers of the multilayer circuit board and significantly improving the quality of the final multilayer circuit board. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0017] Figure 2 For the present invention Figure 1 A schematic diagram of the main structure.

[0018] Figure 3 This is a schematic diagram of the pressing plate structure of the present invention.

[0019] Figure 4 For the present invention Figure 3 A top-view structural diagram.

[0020] Figure 5 For the present invention Figure 3 A schematic diagram of the main structure.

[0021] Figure 6 This is a schematic diagram of the second positioning disk and positioning ring structure of the present invention.

[0022] Figure 7 This is a schematic diagram showing the different positional states of the second positioning disk of the present invention.

[0023] Figure 8 For the present invention Figure 6 A top-view structural diagram.

[0024] Figure 9 This is a schematic diagram showing the states corresponding to different steps in this invention.

[0025] Figure 10 For the present invention Figure 9 A magnified structural diagram at point A.

[0026] Figure 11 For the present invention Figure 9 A magnified structural diagram at point B.

[0027] Figure 12 For the present invention Figure 9 A magnified structural diagram at point C.

[0028] In the diagram: 100, pressing machine platform; 110, vacuum chamber; 200, positioning mechanism; 210, upper positioning body; 211, upper positioning telescopic rod; 212, second positioning plate; 2121, positioning plate body; 2122, guide cylinder; 213, positioning ring; 220, lower positioning body; 221, positioning pin; 222, first positioning plate; 223, lower positioning telescopic rod; 300, pressing mechanism; 310, upper pressing body; 311, upper pressing plate; 3111, pressing platform; 3112, first lifting assembly; 3113, second lifting assembly; 3114, through opening; 3115, limiting telescopic rod; 3116, vent connector; 3117, lifting telescopic rod; 312, upper pressing telescopic rod; 320, lower pressing body; 321, lower pressing plate; 322, lower pressing telescopic rod; 400, multi-layer circuit board. Detailed Implementation

[0029] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0030] To address the problems mentioned in the background art, see Appendix Figure 1 - Appendix Figure 12 A circuit board fixing and pressing device includes a pressing machine 100 with a vacuum chamber 110 inside. The pressing machine 100 is equipped with a positioning mechanism 200 and a pressing mechanism 300. The positioning mechanism 200 stacks circuit boards to form a multilayer circuit board 400. Then, the pressing mechanism 300 presses and presses the two sides of the multilayer circuit board 400 together. The pressing of the pressing mechanism 300 is carried out at a certain temperature. During the hot pressing process, the PP sheets between the circuit board layers melt, flow and solidify, and finally firmly bond all the copper layers and core boards into a complete and strong hard board without delamination or misalignment.

[0031] Specifically, the positioning mechanism 200 includes an upper positioning component and a lower positioning component, which efficiently and accurately position the multilayer circuit board 400 from both the upper and lower sides.

[0032] The lower positioning component includes multiple retractable lower positioning bodies 220. Each lower positioning body 220 includes a first positioning disk 222 and a positioning pin 221 located above the first positioning disk 222. During the circuit board stacking process, circuit boards with openings on their surfaces are sequentially passed through the positioning pin 221 and stacked on the upper end of the first positioning disk 222 to form a multi-layer circuit board 400. At this time, the layers of the multi-layer circuit board 400 are not completely fixed and there are certain gaps between the layers, where gas exists.

[0033] The upper positioning component includes multiple retractable upper positioning bodies 210. Each upper positioning body 210 includes a positioning ring 213 with an inclined outer surface and a second positioning disk 212 sleeved on the outside of the positioning ring 213. Multiple first positioning disks 222 and second positioning disks 212 fit together to achieve compression positioning of the multilayer circuit board 400. Here, the outer surface dimension of the lower opening side of the positioning ring 213 is narrowed, and it can use the inclined conical structure to extend into the surface opening of the circuit board to compress the side of the circuit board, thereby controlling the lateral compression positioning of the multilayer circuit board and ensuring accurate and effective positioning between the multilayer circuit boards.

[0034] Specifically, the pressing mechanism 300 includes two pressing platforms 3111. The side walls of the pressing platforms 3111 are equipped with retractable lifting components. The lifting components are controlled to abut against the side walls of the multilayer circuit board 400 to change the interlayer state of the multilayer circuit board 400 and accelerate the discharge of residual gas. The two pressing platforms 3111 are controlled to abut against both sides of the multilayer circuit board 400 to achieve hot pressing on both sides of the multilayer circuit board 400, thereby completing the vacuum hot pressing process of the multilayer circuit board 400. After cooling, all copper layers and core boards are firmly bonded together into a complete and sturdy hard board.

[0035] Vacuum chamber 110 is a sealed cavity inside the pressing machine 100. The vacuum degree is adjustable to meet the requirements of vacuum hot pressing of multilayer circuit boards 400 of different sizes and types. Before pressing, residual air between the layers of the multilayer circuit board 400 is discharged to avoid problems such as bubbles, delamination and loose connections after hot pressing.

[0036] The positioning mechanism 200 ensures that the multilayer circuit board 400 does not shift or misalign during the entire lamination process, with the positioning pin 221 precisely engaging with the opening on the circuit board surface. Both the first positioning disc 222 and the second positioning disc 212 are made of high-temperature resistant, high-flatness alloy material with polished surfaces, ensuring uniform bonding pressure and preventing edge damage or warping of the circuit board. The lifting assembly can gently push the surface of the multilayer circuit board 400 from the side, creating minute gap changes between layers, disrupting air bubble retention, and allowing residual gas to be vacuum-extracted more quickly, significantly improving vacuum degassing efficiency.

[0037] In summary, through the above structural design, the positioning mechanism 200 can accurately and efficiently position the multilayer circuit board 400, ensuring the stability of interlayer positioning. The pressing mechanism 300 can effectively squeeze the multilayer circuit board 400 from both sides, ensuring the stability of interlayer bonding. The lifting component can break the state of trapped air bubbles, allowing residual gas to be vacuumed away more quickly, greatly reducing the amount of residual air bubbles between the layers of the multilayer circuit board 400, and greatly improving the quality of the final product multilayer circuit board 400.

[0038] Specifically, a receiving groove is opened on the surface of the pressing platform 3111, the lifting component is located in the receiving groove, and a lifting telescopic rod 3117 is fixed on the other side of the pressing platform 3111. When the lifting component is in the retracted state, it is flush with the surface of the pressing platform 3111.

[0039] The depth of the receiving groove is consistent with the thickness of the lifting component, ensuring that the lifting component does not protrude from the surface of the pressing platform 3111 after retraction, and will not interfere with the flat hot pressing of the multilayer circuit board 400 by the pressing platform 3111. The lifting telescopic rod 3117 is a heat-resistant servo electric telescopic rod or pneumatic telescopic rod, with stable thrust and precise extension and retraction, which can realize interlayer micro-movement venting without causing circuit board misalignment or layer deviation.

[0040] The lifting assembly includes a first lifting assembly 3112 in the horizontal direction and a second lifting assembly 3113 in the vertical direction, and the first lifting assembly 3112 and the second lifting assembly 3113 are controlled independently.

[0041] The horizontal and vertical lifting components are driven independently, enabling sequential, alternating, or synchronous movements. This allows for micro-pushing of the multi-layer circuit board 400 from both the X and Y directions, driving air bubbles out from different directions for more thorough venting. The independent control mode allows for flexible adjustment of the pushing sequence based on the circuit board size, number of layers, and film type, broadening its applicability.

[0042] Please refer to the appendix. Figure 3 The first lifting assembly 3112 and the second lifting assembly 3113 are arranged in a manner that is staggered and independent of each other. Figure 3 The arrangement method described herein is not the only arrangement method in this application. Those skilled in the art can adjust the arrangement method and the number of arrangements according to actual needs.

[0043] Specifically, the upper positioning body 210 also includes an upper positioning telescopic rod 211, a positioning ring 213 is fixedly connected to the telescopic end of the upper positioning telescopic rod 211, and a second positioning disk 212 is slidably connected to the telescopic end of the upper positioning telescopic rod 211, with an elastic reset element provided between them. The elastic reset element can control the second positioning disk 212 to be normally in the top position, allowing the bottom positioning ring 213 to be exposed, ensuring that the positioning ring 213 can smoothly extend into the opening of the circuit board to achieve efficient and accurate positioning.

[0044] It should be noted that the second positioning disk 212 includes a positioning disk body 2121 and a guide cylinder 2122. The axial length of the guide cylinder 2122 is greater than the thickness of the positioning disk body 2121, and the surface area of ​​the positioning disk body 2121 is greater than the cross-sectional area of ​​the guide cylinder 2122. The guide cylinder 2122 can slide with the telescopic end of the upper positioning telescopic rod 211. The aforementioned elastic reset element is hidden inside the guide cylinder 2122.

[0045] The upper positioning telescopic rod 211 drives the positioning ring 213 to move up and down, achieving precise guidance and positioning of the holes on the circuit board. The second positioning disk 212 can slide along the axial direction of the telescopic rod, and the elastic reset element provides reset pressure. The aforementioned elastic reset element can be selected as an elastic element that can withstand the temperature of hot pressing.

[0046] Specifically, the pressing mechanism 300 includes a retractable upper pressing body 310 and a retractable lower pressing body 320. The pressing platforms 3111 of the upper pressing body 310 and the lower pressing body 320 are close to each other to achieve compression of the multilayer circuit board 400. The surfaces of the two pressing platforms 3111 are each provided with multiple through openings 3114 that pass through vertically. The inner diameter of the through openings 3114 is larger than the outer diameter of the positioning disk. Without any limit, the pressing platform 3111 can move freely through the second positioning disk 212 to achieve complete hot pressing of both sides of the multilayer circuit board 400, avoiding obstacles formed by the second positioning disk 212 and preventing hot pressing that cannot achieve complete hot pressing.

[0047] To enable the second positioning disc 212 to function effectively during the positioning and venting phase, a limiting telescopic rod 3115 is built into the pressing platform 3111 of the upper pressing body 310. The telescopic end of the limiting telescopic rod 3115 extends through the through opening 3114. By controlling the extension of the telescopic end of the limiting telescopic rod 3115, the second positioning disc 212 is limited. During the descent of the pressing platform 3111, the limiting telescopic rod 3115 can press and limit the second positioning disc 212, controlling it to descend synchronously below the pressing platform 3111. At this time, the second positioning disc 212 is brought into contact with the surface of the multilayer circuit board 400, achieving a non-complete contact and limiting of the multilayer circuit board 400. That is, the second positioning disc 212 squeezes and positions the four corners of the multilayer circuit board 400, preventing swaying deviations during the subsequent venting process of the lifting assembly squeezing the multilayer circuit board 400, and ensuring accurate and stable positioning of the multilayer circuit board 400 during the deformation and venting process.

[0048] The second positioning plate 212 descends synchronously with the pressing platform 3111 to press against the upper surface of the multilayer circuit board 400. The extension end of the control limit telescopic rod 3115 retracts to cancel the restriction on the second positioning plate 212. After the limit telescopic rod 3115 retracts to cancel the restriction, the restriction on the second positioning plate 212 disappears. The second positioning plate 212 can be reset under the action of elasticity, pass upward through the pressing platform 3111, and be located above the pressing platform 3111 to avoid hindering the subsequent hot pressing.

[0049] In summary, the opening 3114 provides an active channel for the second positioning disk 212, ensuring that the pressing platform 3111 will not interfere with the positioning structure when it descends. When the limiting telescopic rod 3115 extends, it locks the second positioning disk 212, causing the pressing platform 3111 and the second positioning disk 212 to form a single unit and press down synchronously, completing the pre-pressing of the circuit board. After the limiting telescopic rod 3115 retracts, it unlocks the limit, the second positioning disk 212 stops pressing down, and the pressing platform 3111 continues to perform the formal hot pressing action, realizing the step-by-step process of first positioning and pressing, and then overall pressing.

[0050] Furthermore, the limiting telescopic rod 3115 is a double-headed telescopic rod, located between two through openings 3114 on the same side. Taking a rectangular multilayer circuit board 400 and a pressing platform 3111 as an example, by arranging a through opening 3114 at each of the four corners of the pressing platform 3111, and by setting it as a double-headed telescopic rod, only two sets need to be arranged, reducing the structural layout. At the same time, the telescopic ends on both sides of the double-headed telescopic rod can extend synchronously and quickly, simplifying the control effect and improving the limit control efficiency.

[0051] At the same time, the double-headed telescopic rod can simultaneously limit the second positioning discs 212 on both sides, ensuring symmetrical force and synchronized action. This guarantees that multiple positioning points are pressed or released simultaneously, preventing the multi-layer circuit board 400 from tilting or shifting due to force on one side, and ensuring uniform pressure across the entire board.

[0052] The limit telescopic rod 3115 is an elastic pneumatic telescopic rod. The pneumatic telescopic rod includes an air connector 3116 with a built-in control valve. The built-in control valve enables rapid air intake, pressure holding, and exhaust. It has a fast action response, and the limit and unlocking switches quickly, improving the pressing cycle efficiency.

[0053] Under normal conditions, the pneumatic telescopic rod is in an extended state due to its own elasticity. The telescopic end of the pneumatic telescopic rod can extend into the corresponding through opening 3114 to limit the second positioning plate 212. At this time, the second positioning plate 212 will not rise synchronously with the pressing platform 3111, but will fall synchronously with the pressing platform 3111 to achieve tight sealing before hot pressing.

[0054] Before hot pressing, the pressure inside the vacuum chamber 110 is gradually reduced by drawing a vacuum. After the exhaust is completed and the limit is tightened, the vent connector 3116 is opened to control the pneumatic telescopic rod to connect with the vacuum chamber 110. At this time, the gas inside the pneumatic telescopic rod is extracted. Under the action of negative pressure, the double-headed telescopic rod can be controlled to overcome the elastic effect and automatically retract, thus canceling the limit on the second positioning plate 212. The second positioning plate 212 can move upward and be offset from the pressing platform 3111 to avoid affecting the subsequent hot pressing of the pressing platform 3111.

[0055] It should also be noted that before the extension end of the limit telescopic rod 3115 retracts, the pressing platform 3111 can be raised to a predetermined height and offset from the second positioning plate 212. At this time, the extension end of the limit telescopic rod 3115 is prevented from contacting the surface of the second positioning plate 212, and excessive friction is avoided from affecting the normal retraction of the limit telescopic rod 3115.

[0056] It should also be noted that the inner diameter of the positioning ring 213 is larger than the outer diameter of the positioning pin 221, and the outer diameter of the positioning ring 213 is smaller than the opening size on the surface of the multilayer circuit board 400. The positioning ring 213 can smoothly slide downwards onto the outside of the positioning pin 221, and at the same time, it can pass into the positioning hole of the circuit board, straightening, aligning, and slightly squeezing the hole wall of the circuit board from the inside, so that the holes of each layer of the circuit board are completely aligned, eliminating interlayer misalignment, and ensuring that the hole diameter accuracy and position accuracy meet the standards after lamination. The outer wall of the positioning ring 213 is smoothly chamfered to prevent scratching the hole wall.

[0057] It should also be noted that the outer diameter of the positioning pin 221 should be significantly smaller than the size of the opening on the surface of the multilayer circuit board 400. This ensures that there is a certain gap between the two, preventing the inner wall of the opening on the surface of the multilayer circuit board 400 from fitting with the positioning pin. This allows the positioning ring 213 to descend normally through the gap between the two to achieve lateral compression positioning.

[0058] Finally, it should be noted that the aforementioned lower pressing body 320 includes a lower pressing plate 321 and a lower pressing telescopic rod 322. The structure of the lower pressing plate 321 is similar to that of the upper pressing plate 311, and there is no need to arrange the limiting telescopic rod 3115. The other structures are similar. The lower positioning body 220 also includes a lower positioning telescopic rod 223. The function of the lower positioning telescopic rod 223 is the same as that of the upper positioning telescopic rod 211. The above content will not be repeated here.

[0059] The invention will be further described below with reference to specific pressing processes.

[0060] A circuit board fixing and pressing process, using the above-mentioned circuit board fixing and pressing device, includes the following steps: S1. The circuit boards with openings on their surfaces are sequentially passed through the positioning pins 221 and stacked on the upper end of the first positioning plate 222 to form a multi-layer circuit board 400. The placement of the circuit boards and PP sheets can be done manually or by a robotic arm to ensure that the final multi-layer circuit board 400 is in a relatively accurate position. At the same time, the inner wall of the opening on the surface of the multi-layer circuit board 400 should be kept away from the upper positioning telescopic rod 211.

[0061] S2. Control the first positioning disk 222 and the second positioning disk 212 to achieve compression positioning of the multilayer circuit board 400. At this time, the four corners of the multilayer circuit board 400 are in the compression positioning state, and the middle part of the multilayer circuit board 400 can be adjusted and swung slightly. Then, while evacuating the vacuum chamber 110, control the lifting component to abut against the side wall of the multilayer circuit board 400 to change the interlayer state of the multilayer circuit board 400 and accelerate the discharge of residual gas. The lifting component extends out and abuts against the side wall of the multilayer circuit board 400. Under the action of external force, control the multilayer circuit board 400 to bend slightly, change the interlayer state between two adjacent circuit boards, and accelerate the discharge of residual gas.

[0062] The lifting assembly can be used to lift alternately using the first lifting assembly 3112 and the second lifting assembly 3113, which can change the interlayer state of the multilayer circuit board 400 from two directions respectively. The upper lifting assembly and the lower lifting assembly also lift alternately, controlling the multilayer circuit board 400 to bend slightly upward or downward, further accelerating the discharge of residual gas.

[0063] S3. Before vacuum hot pressing, the positioning ring 213 moves downward through the opening on the surface of the multilayer circuit board 400. The positioning ring 213 applies pressure to the multilayer circuit board 400 from the side to achieve the compression and reset of the interlayer structure of the multilayer circuit board 400. The positioning ring 213 can cooperate with the positioning pin 221 to reduce the gap between the positioning pin 221 and the inner wall of the opening on the surface of the multilayer circuit board 400. The gap between the positioning pin 221 and the inner wall of the opening on the surface of the multilayer circuit board 400 is relatively consistent, and the circuit board is squeezed from the side to achieve adjustment control.

[0064] After the positioning ring 213 extends downward into the positioning hole of the circuit board, it performs micro-expansion alignment of each layer of the circuit board from the inside out, quickly resetting and aligning any slight misalignment between layers, while further squeezing out residual air bubbles around the holes. This action is completed during the vacuum stage without adding extra time, ensuring the alignment accuracy between layers and further improving the venting effect, thus significantly improving the yield of the final laminated product.

[0065] S4. Two pressing platforms 3111 are brought close together to achieve vacuum hot pressing of the multilayer circuit board 400. Resistance wire heating elements can be installed within the pressing platforms 3111. The side of the pressing platform 3111 closest to the multilayer circuit board 400 is made of metal to achieve rapid heat conduction, while the side furthest from the multilayer circuit board 400 can be made of heat-insulating material to prevent reverse heat conduction and thermal impact on related external structures. After hot pressing, cooling is performed to finally form the finished multilayer circuit board 400.

[0066] In summary, positioning pin 221 ensures rapid and precise loading of each circuit board layer, eliminating the need for repeated manual alignment. Flexible pre-pressing by upper and lower positioning plates initially fixes the multi-layer circuit board 400, preventing displacement during vacuuming. Simultaneously, the lifting assembly is activated during vacuuming, using micro-motion to allow residual gas between layers to escape quickly, significantly shortening the vacuum holding time. Hot pressing is performed in a high-vacuum environment, with temperature, pressure, and time precisely controlled according to the board's process parameters, resulting in a bubble-free, non-delaminating bond with high adhesion strength after pressing.

[0067] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A circuit board fixing and pressing device, comprising a pressing machine (100) having an internal vacuum chamber (110), characterized in that: The pressing machine (100) is provided with a positioning mechanism (200) and a pressing mechanism (300). The positioning mechanism (200) includes an upper positioning component and a lower positioning component. The upper positioning component includes multiple retractable upper positioning bodies (210). The lower positioning component includes multiple retractable lower positioning bodies (220). The lower positioning body (220) includes a first positioning plate (222) and a positioning pin (221) located above the first positioning plate (222). The upper positioning body (210) includes a positioning ring (213) with an inclined outer surface and a second positioning plate (212) sleeved on the outside of the positioning ring (213). The pressing mechanism (300) includes two pressing platforms (3111). The sidewalls of the pressing platforms (3111) are provided with retractable lifting components. The lifting components are controlled to abut against the sidewalls of the multilayer circuit board (400) to change the interlayer state of the multilayer circuit board (400) and accelerate the discharge of residual gas.

2. The circuit board fixing and pressing device according to claim 1, characterized in that, The pressing platform (3111) has a receiving groove on its surface, and the lifting component is located in the receiving groove. A lifting telescopic rod (3117) is fixed on the other side of the pressing platform (3111). When the lifting component is in the retracted state, it is flush with the surface of the pressing platform (3111).

3. The circuit board fixing and pressing device according to claim 1, characterized in that, The lifting assembly includes a first lifting assembly (3112) in the horizontal direction and a second lifting assembly (3113) in the vertical direction, and the first lifting assembly (3112) and the second lifting assembly (3113) are independently controlled.

4. The circuit board fixing and pressing device according to claim 1, characterized in that, The upper positioning body (210) also includes an upper positioning telescopic rod (211), the positioning ring (213) is fixedly connected to the telescopic end of the upper positioning telescopic rod (211), the second positioning disk (212) is slidably connected to the telescopic end of the upper positioning telescopic rod (211), and an elastic reset element is provided between the two.

5. The circuit board fixing and pressing device according to claim 4, characterized in that, The pressing mechanism (300) includes a retractable upper pressing body (310) and a retractable lower pressing body (320). Both pressing platforms (3111) have multiple through openings (3114) that pass through vertically. The inner diameter of the through opening (3114) is larger than the outer diameter of the positioning disk. The pressing platform (3111) of the upper pressing body (310) has a built-in limiting telescopic rod (3115). The telescopic end of the limiting telescopic rod (3115) passes through the through opening (3114). By controlling the extension of the telescopic end of the limiting telescopic rod (3115), the second positioning disk (212) is limited.

6. The circuit board fixing and pressing device according to claim 5, characterized in that, The limiting telescopic rod (3115) is a double-headed telescopic rod, which is located between two through openings (3114) on the same side.

7. The circuit board fixing and pressing device according to claim 5, characterized in that, The limiting telescopic rod (3115) is an elastic pneumatic telescopic rod, which includes a vent connector (3116) with a built-in control valve.

8. The circuit board fixing and pressing device according to any one of claims 1-7, characterized in that, The inner diameter of the positioning ring (213) is greater than the outer diameter of the positioning pin (221), and the outer diameter of the positioning ring (213) is smaller than the opening size on the surface of the multilayer circuit board (400).

9. A circuit board fixing and pressing process, characterized in that, The circuit board fixing and pressing device according to any one of claims 1-8 includes the following steps: S1. The circuit boards with openings on the surface are sequentially passed through the positioning pins (221) and stacked on the upper end of the first positioning plate (222) to form a multilayer circuit board (400). S2. Control the first positioning disk (222) and the second positioning disk (212) to fit together to achieve the extrusion positioning of the multilayer circuit board (400); S3. While evacuating the vacuum chamber (110), control the lifting component to abut against the side wall of the multilayer circuit board (400) to change the interlayer state of the multilayer circuit board (400) and accelerate the discharge of residual gas. S4. Control the two pressing platforms (3111) to move closer to each other to achieve vacuum hot pressing of the multilayer circuit board (400).

10. The circuit board fixing and pressing process according to claim 9, characterized in that, Before vacuum hot pressing in step S4, the positioning ring (213) moves downward through the opening on the surface of the multilayer circuit board (400), and the positioning ring (213) applies pressure to the multilayer circuit board (400) from the side to achieve the compression and reset of the interlayer structure of the multilayer circuit board (400).

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