Adapter plate and manufacturing method thereof
By fixing conductive pillars on a temporary carrier substrate to form an encapsulation structure, and then processing the ends of the conductive pillars after removing the substrate, the complexity and high cost of traditional adapter board processes are solved, achieving high-density signal transmission and stable connection, and meeting the miniaturization requirements of electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-05
- Publication Date
- 2026-05-15
AI Technical Summary
Traditional adapter boards are complex and costly to manufacture, making it difficult to meet the needs of high-density and complex interconnections. They also lack signal transmission stability and anti-interference capabilities, and cannot adapt to the miniaturization and high-performance development of electronic devices.
The conductive pillars are fixed by a temporary substrate, and a package structure is formed by encapsulation. After the temporary substrate is removed, the ends of the conductive pillars are processed to form an anti-oxidation conductive layer. The structure is then cut into independent adapter board units, using flexible materials and processes.
It achieves reliable connection between conductive posts and external components, improves signal transmission stability and adapter board lifespan, reduces production costs, adapts to diverse packaging scenarios, and is suitable for the miniaturization and high-performance design of electronic devices.
Smart Images
Figure CN122055016A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electronic packaging technology, and in particular to an adapter board and its manufacturing method. Background Technology
[0002] In the field of electronic packaging, the interposer is a key component for achieving high-density, high-speed signal transmission and heterogeneous integration between different chips or components. It is located between the chip and the substrate and acts as a bridge.
[0003] Traditional methods for fabricating adapter boards typically involve creating conductive lines on a substrate using photolithography and etching processes, followed by the application of insulating layers to construct the adapter board structure. However, as electronic devices evolve towards miniaturization and higher performance, traditional processes are showing significant limitations. On one hand, the photolithography and etching steps involved in traditional processes are complex, requiring high levels of equipment and process control, resulting in higher production costs. On the other hand, traditional processes struggle to meet the demands of high-density, complex interconnections in terms of the flexibility and efficiency of conductive structure arrangement. Furthermore, the resulting adapter boards are increasingly ill-suited to the requirements of advanced electronic packaging in terms of signal transmission stability and interference resistance. To meet the market's evolving demands for adapter board performance and production capabilities, this invention proposes a novel method for fabricating adapter boards. This innovative process optimizes the fabrication of adapter boards, better aligning with the development trends in the electronic packaging field. Summary of the Invention
[0004] The purpose of this invention is to provide an adapter board and its manufacturing method to solve the above-mentioned problems.
[0005] According to a first aspect of the present invention, a method for manufacturing an adapter plate is provided, comprising the following steps: Provide a temporary substrate; The conductive pillars are fixed to the surface of the temporary support substrate, and the arrangement of the conductive pillars is adapted to the interconnection requirements of the target packaging structure. The conductive pillar and the surface area of the temporary support substrate in contact with the conductive pillar are encapsulated to form an encapsulation structure; Remove the temporary carrier substrate from the packaging structure; At least two opposing surfaces of the encapsulation structure are processed so that the two ends of the conductive post are exposed from the two opposing surfaces of the encapsulation structure, respectively. The processed packaging structure is cut into multiple independent adapter board units; An anti-oxidation conductive layer is formed at the exposed ends of the conductive posts in the adapter plate unit.
[0006] Furthermore, in the method for manufacturing the adapter plate, the temporary support substrate is made of FR4 board.
[0007] Furthermore, in the method for manufacturing the adapter plate, the material of the conductive post includes at least one of copper post, copper alloy post, silver post, or gold-plated metal post, and the cross-sectional shape of the conductive post includes at least one of circular, square, or polygonal shapes.
[0008] Furthermore, in the method for manufacturing the adapter plate, when fixing the conductive post to the surface of the temporary support substrate, the adhesive material used includes at least one of thermally conductive adhesive, conductive adhesive, or insulating film.
[0009] Furthermore, in the method for manufacturing the adapter board, when encapsulating the conductive post and the surface area of the temporary support substrate that contacts the conductive post, the encapsulation material used includes at least one of epoxy resin molding compound, polyimide molding compound, or cyanate ester resin molding compound.
[0010] Furthermore, in the method for manufacturing the adapter board, the process of removing the temporary carrier substrate from the encapsulation structure employs at least one method including physical peeling, chemical dissolution, or laser removal.
[0011] Furthermore, in the method for manufacturing the adapter board, the processing of at least two opposing surfaces of the packaging structure employs at least one of the following processing methods: grinding, etching, or laser processing.
[0012] Furthermore, in the method for manufacturing the adapter board, the anti-oxidation conductive layer includes one of a tin layer, a tin alloy layer, a nickel-gold layer, or a silver layer.
[0013] According to a second aspect of the present invention, an adapter plate is provided, prepared using the method described in the first aspect, comprising: Insulating encapsulation substrate; At least two conductive pillars are embedded inside the insulating encapsulation substrate, and the two ends of the conductive pillars extend to two opposite surfaces of the insulating encapsulation substrate, respectively. An anti-oxidation conductive layer is provided, which covers both ends of the conductive post.
[0014] Furthermore, in the aforementioned adapter plate, the length of the conductive post is the same as the thickness of the insulating encapsulation substrate.
[0015] Compared with the prior art, the present invention has at least the following technical effects: First, the process offers greater flexibility and adaptability. This invention can flexibly arrange conductive pillars according to the interconnection requirements of the target packaging structure, eliminating the dependence of traditional processes on specific substrates and complex photolithography and etching processes, making it more suitable for the miniaturization and high-performance design of electronic devices. Second, it boasts high production efficiency and low cost. The process steps are relatively simple, requiring no complex equipment, shortening the production cycle, reducing production costs, and facilitating large-scale industrial production. Third, the adapter board offers superior performance. Through processing, the ends of the conductive pillars are exposed, and an anti-oxidation conductive layer is formed, ensuring reliable connection between the conductive pillars and the external environment, slowing down the oxidation rate of the conductive pillars, and improving signal transmission stability and the lifespan of the adapter board. Attached Figure Description
[0016] Figure 1 This is a flowchart of a method for manufacturing an adapter board according to an embodiment of the present invention; Figure 2 This is a schematic diagram of fixing conductive pillars on a temporary support substrate in step S2 of an embodiment of the present invention; Figure 3 This is a schematic diagram of the encapsulation of the contact area between the conductive pillar and the temporary support substrate in step S3 of an embodiment of the present invention. Figure 4 This is a schematic diagram of removing the temporary carrier substrate in the packaging structure in step S4 of an embodiment of the present invention; Figure 5 This is a schematic diagram of step S5 of the present invention, in which the relative surfaces of the encapsulation structure are processed to expose the two ends of the conductive pillars. Figure 6 This is a schematic diagram of cutting the processed packaging structure into adapter board units in step S6 of an embodiment of the present invention; Figure 7 This is a schematic diagram of forming an anti-oxidation conductive layer at the exposed end of the conductive post of the adapter plate unit in step S7 of an embodiment of the present invention.
[0017] The components include: 1. Temporary support substrate; 2. Conductive pillars; 3. Encapsulation material; 4. Adhesive material; 5. Adapter board unit; and 6. Anti-oxidation conductive layer. Detailed Implementation
[0018] The following is a more detailed description of an adapter plate and its manufacturing method according to the present invention, with reference to the accompanying drawings, which illustrate preferred embodiments of the invention. It should be understood that those skilled in the art can modify the invention described herein while still achieving its advantageous effects. Therefore, the following description should be understood as being of general knowledge to those skilled in the art and is not intended to limit the invention.
[0019] For clarity, not all features of the actual embodiments are described. In the following description, well-known functions and structures are not detailed in detail, as they would obscure the invention with unnecessary detail. It should be understood that in the development of any actual embodiment, numerous implementation details must be made to achieve the developer's specific objectives, such as changes from one embodiment to another according to limitations related to the system or business. Furthermore, it should be understood that such development work may be complex and time-consuming, but is merely routine work for those skilled in the art.
[0020] Based on the teachings of this specification, those skilled in the art can form new technical solutions by combining different implementation methods without creating technical contradictions. Such variations should be considered to fall within the protection scope of this application.
[0021] The invention is described more specifically by way of example in the following paragraphs with reference to the accompanying drawings. The advantages and features of the invention will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the invention.
[0022] like Figure 1 As shown, this embodiment provides a method for manufacturing an adapter board. Through a series of steps, an adapter board with excellent performance is produced. This adapter board enables high-density, high-speed signal transmission between different chips or components, and its manufacturing process is flexible, low-cost, and highly efficient. The method includes the following steps: S1: Provide a temporary support substrate; S2: Fix the conductive pillars to the surface of the temporary support substrate, wherein the arrangement of the conductive pillars is adapted to the interconnection requirements of the target package structure; S3: The conductive pillar and the surface area of the temporary support substrate in contact with the conductive pillar are encapsulated to form an encapsulation structure; S4: Remove the temporary carrier substrate from the encapsulation structure; S5: Process at least two opposite surfaces of the encapsulation structure so that the two ends of the conductive post are exposed from the two opposite surfaces of the encapsulation structure, respectively; S6: Cut the processed packaging structure into multiple independent adapter board units; S7: An anti-oxidation conductive layer is formed at the exposed ends of the conductive posts in the adapter plate unit.
[0023] For step S1, the temporary support substrate 1 provided in this step is an FR4 board. FR4 board is a commonly used epoxy glass cloth laminate with good compatibility. Specifically, it has three advantages: First, it has excellent mechanical strength, which can stably support the conductive pillars 2 in subsequent processes, avoiding substrate deformation or damage that could cause the conductive pillars 2 to shift and ensuring positional accuracy; second, it has excellent insulation performance, with no conductivity on the surface or inside, preventing unnecessary electrical connections or signal interference when supporting the conductive pillars 2; and third, it has good heat resistance and chemical stability, which can withstand the temperature and chemical environment of subsequent processes without performance degradation, ensuring the stability of the temporary support function.
[0024] Furthermore, the selection of FR4 board as the temporary support substrate also takes into account its mature manufacturing process and reasonable cost. FR4 board is widely used in the electronics industry, has a high degree of standardization, and its thickness and size can be flexibly selected according to actual production needs, facilitating large-scale production; and compared with other special support materials, its cost is easier to control, which helps to reduce the overall manufacturing cost of the adapter board and provides a reliable operating platform for subsequent processes.
[0025] like Figure 2 In step S2, firstly, based on the interconnection requirements such as the signal transmission path and pin distribution between the chip and the substrate in the target package structure, the arrangement scheme of the conductive pillars 2 is pre-planned. This arrangement scheme needs to accurately match the electrical connection points of the subsequent mounted components to ensure that the conductive pillars 2 can accurately achieve signal conduction between different components after packaging. The arrangement density, spacing, and array form can be flexibly adjusted according to actual needs. For example, a tightly arranged matrix layout can be adopted for high-density packaging scenarios, and an irregular distribution structure can be designed for specific signal transmission requirements. This ensures that the final adapter board can better adapt to the functional requirements of the target package structure, thereby significantly improving the adaptability of the adapter board to diverse packaging scenarios.
[0026] In this embodiment, the conductive pillar 2 is made of at least one of copper pillar, copper alloy pillar, silver pillar or gold-plated metal pillar, and the cross-sectional shape of the conductive pillar 2 includes at least one of circular, square or polygonal shapes.
[0027] Specifically, in the selection of conductive pillar 2, this embodiment prioritizes copper pillars as conductive pillar 2, which have excellent conductivity, good mechanical strength and cost advantages, and can meet the signal transmission requirements of most electronic packaging scenarios. At the same time, depending on the differentiated requirements of conductivity, corrosion resistance and cost in actual applications, conductive pillars made of materials such as copper alloy pillars (such as copper-nickel alloy pillars, which can improve oxidation resistance), silver pillars (suitable for high-frequency signal transmission scenarios) or gold-plated metal pillars (enhancing surface conductivity and corrosion resistance) can also be selected.
[0028] In addition, the cross-sectional shape of the conductive post 2 can be designed according to the arrangement density and current distribution characteristics. In this embodiment, a circular cross-section is used to simplify the processing flow. In scenarios where it is necessary to increase the conductive area per unit area or optimize the signal transmission path, a square or polygonal cross-section can be selected. By tightly splicing, the gap is reduced, further improving the integration of the adapter board, thereby further adapting to the space constraints and performance requirements of different packaging structures.
[0029] Furthermore, when fixing the conductive post 2 to the surface of the temporary support substrate 1, the adhesive material 4 used includes at least one of thermally conductive adhesive, conductive adhesive, or insulating film.
[0030] Specifically, in the fixing operation, this embodiment uses DA adhesive (a type of thermally conductive adhesive) as the bonding material 4. It possesses both good bonding strength and thermal conductivity, firmly fixing the conductive pillars 2 to the surface of the temporary support substrate 1 made of FR4 material, preventing displacement or detachment during subsequent encapsulation and processing. It also helps dissipate the heat generated by the conductive pillars 2 during subsequent processes and use, improving the heat dissipation performance of the adapter board. Depending on the specific requirements of the encapsulation scenario for bonding strength, conductivity, or insulation, other bonding materials 4, such as conductive adhesive (suitable for scenarios requiring auxiliary conductivity) or insulating film (suitable for scenarios with high insulation requirements), can also be selected. During operation, the bonding material 4 is first evenly coated on the surface of the temporary support substrate 1 corresponding to the arrangement positions of the conductive pillars 2. Then, the conductive pillars 2 are precisely placed according to the preset arrangement scheme and appropriate pressure is applied to ensure that the conductive pillars 2 are tightly adhered to the substrate surface. After curing, a stable fixing structure is formed, laying a reliable foundation for the subsequent encapsulation process in step S3.
[0031] like Figure 3 In the encapsulation process of step S3, a specific process is required to fully and tightly encapsulate the conductive pillar 2 and the surface area of the temporary support substrate 1 that is in contact with the conductive pillar 2, so as to form a structurally stable integrated encapsulation structure.
[0032] Specifically, firstly, a suitable encapsulation material 3 is selected based on the encapsulation requirements. The encapsulation material 3 includes at least one of epoxy resin molding compounds, polyimide molding compounds, or cyanate ester resin molding compounds. In this embodiment, epoxy resin molding compounds are preferred. However, in practical applications, polyimide molding compounds or cyanate ester resin molding compounds can be selected based on requirements such as insulation performance and heat resistance, or a combination of multiple materials can be used. This encapsulation material 3 must possess excellent insulation performance, mechanical strength, and chemical stability to ensure that the subsequently formed encapsulation structure can provide reliable protection for the internal conductive pillars 2 and meet the insulation and structural support requirements of electronic packaging scenarios.
[0033] During the encapsulation process, this embodiment uses specialized encapsulation equipment to uniformly inject molten epoxy resin into a pre-set mold cavity. This allows the encapsulation material 3 to fully fill the gaps between the conductive pillars 2 and completely cover the sides and top of the conductive pillars 2, while also fully covering the surface area of the temporary support substrate 1 in contact with the conductive pillars 2. In this process, precise control of process parameters such as injection pressure, temperature, and time is crucial. Specifically, the injection pressure must be sufficient to allow the encapsulation material 3 to fully penetrate every tiny gap, avoiding air bubbles or voids; the temperature must be maintained within the range suitable for the material's properties to ensure smooth flow and full curing of the encapsulation material 3; and the curing time must be strictly controlled to ensure that the encapsulation material 3 forms a stable cross-linked structure, thereby improving the overall strength of the encapsulation structure.
[0034] After the encapsulation material 3 has fully cured, the resulting integrated encapsulation structure firmly fixes the conductive post 2 within it, and the area where the temporary support substrate 1 contacts the conductive post 2 is tightly covered, physically isolating the conductive post 2 from the external environment. This structure not only effectively prevents the conductive post 2 from being mechanically damaged or chemically corroded during subsequent processes and use, but also prevents short circuits between adjacent conductive posts 2 through the insulating properties of the encapsulation material 3, providing a fundamental guarantee for the electrical performance stability of the adapter board. Simultaneously, the integrated encapsulation gives the entire structure good integrity and resistance to deformation, enabling it to adapt to temperature changes and vibration environments during electronic device operation, further improving the reliability of the adapter board.
[0035] In step S4, during the removal of the temporary carrier substrate 1 from the encapsulation structure, at least one method is employed, including physical peeling, chemical dissolution, or laser removal.
[0036] In this embodiment, considering that the temporary carrier substrate 1 is made of FR4 board, and it is bonded to the encapsulation material 3 (such as epoxy resin molding compound) through an adhesive material 4 (such as DA glue), physical peeling is preferred for removal. Specifically, a precision mechanical device is used to clamp the edge of the temporary carrier substrate 1, and a uniform pulling force parallel to the surface of the encapsulation structure is applied. Utilizing the difference in mechanical properties at the bonding interface between the temporary carrier substrate 1 and the encapsulation material 3, the two separate. The advantage of this method is that the operation is gentle, minimizing damage to the conductive pillars 2 and the encapsulation material 3 inside the encapsulation structure, thus ensuring the overall integrity of the encapsulation structure.
[0037] In addition, depending on actual production needs and the material characteristics of the temporary carrier substrate 1, chemical dissolution or laser removal methods, or a combination of methods, can be flexibly selected. If chemical dissolution is used, the encapsulation structure can be immersed in a specific solvent that selectively dissolves the temporary carrier substrate 1 (such as the resin component in an FR4 board) or its bonding layer with the adhesive material 4, without affecting the performance of the encapsulation material 3 and the conductive pillars 2. After dissolution reaches a certain level, the temporary carrier substrate 1 can be easily separated and removed. If laser removal is used, a high-energy laser beam is focused on the contact interface between the temporary carrier substrate 1 and the encapsulation structure. The thermal or photochemical effects of the laser destroy the bonding force between the two, while precisely controlling the laser parameters to avoid damaging the interior of the encapsulation structure, achieving efficient and precise removal of the temporary carrier substrate 1. After removing the temporary carrier substrate 1 using any of the above methods, such as... Figure 4 The encapsulation structure will exist in an independent form, with its original surface that was in contact with the temporary carrier substrate 1 fully exposed.
[0038] like Figure 5 The core objective of step S5 is to precisely remove the packaging material 3 covering both ends of the conductive pillar 2 on the surface of the packaging structure, so that both ends of the conductive pillar 2 are fully exposed from the two opposite surfaces of the packaging structure, thereby laying the foundation for subsequent electrical connection with external components (such as chips, substrates, etc.).
[0039] Furthermore, the processing of at least two opposing surfaces of the packaging structure employs at least one of the following processing methods: grinding, etching, or laser processing.
[0040] In this embodiment, a grinding process is preferred. Specifically, the encapsulation structure after removing the temporary support substrate 1 is fixed on the worktable of a precision grinding machine. Grinding parameters (including grinding pressure, grinding speed, and grinding time) are set according to the thickness of the encapsulation structure and the preset exposed length of the conductive post 2. During grinding, the surface of the encapsulation structure that was originally in contact with the temporary support substrate 1 is first ground to remove the encapsulation material 3 covering the end of the conductive post 2, until one end of the conductive post 2 is fully exposed and the surface is flat. Then, the encapsulation structure is flipped over, and the same grinding process is performed on the opposite surface to fully expose the other end of the conductive post 2, ensuring that the lengths of the exposed portions at both ends are consistent, thus ensuring the stability of the subsequent connection. This grinding method can precisely control the amount of material removed, ensuring the flatness and consistency of the exposed portion of the conductive post 2, and avoiding connection problems caused by uneven surfaces.
[0041] In addition to grinding, at least one of etching or laser processing methods can be selected according to actual production needs. If etching is used, the packaged structure can be placed in a prepared etching solution (such as an alkaline etching solution for epoxy resin molding compounds). By controlling the etching time and temperature, the insulating packaging material 3 on the surface of the packaged structure is gradually etched away until both ends of the conductive pillars 2 are exposed. During etching, the conductive pillars 2 are resistant to corrosion by the etching solution, effectively preventing over-etching. If laser processing is used, a high-energy laser beam is focused on the surface of the packaged structure. The insulating packaging material 3 covering the ends of the conductive pillars 2 is removed layer by layer through the thermal or photochemical effects of the laser. This method features high processing precision and speed, and is particularly suitable for processing small-sized conductive pillars 2.
[0042] By using any of the above processing methods or combinations thereof, precise processing of the relative surfaces of the packaging structure can be achieved, ensuring that both ends of the conductive post 2 are fully exposed from the packaging structure, and that the surface condition of the exposed part meets the process requirements for subsequent electrical connection, thus ensuring reliable interconnection between the adapter board and external components.
[0043] like Figure 6 In step S6, the processed overall packaging structure is divided into multiple independent adapter board units 5 through a cutting process.
[0044] In practice, the first step is to precisely plan the cutting path on the processed packaging structure surface based on the design dimensions (including length, width, and thickness) of the target adapter board unit 5. The cutting path setting must comprehensively consider the arrangement density and positional distribution of the conductive posts 2, ensuring that each independent adapter board unit 5 contains a predetermined number of conductive posts 2 that meet interconnection requirements, and that the cutting boundaries of adjacent adapter board units 5 do not damage the internal conductive post 2 structure. For example, if the conductive posts 2 in the packaging structure are arranged in an array, the cutting path should be set along the gaps between adjacent arrays to avoid mechanical damage to the conductive posts 2 or causing their positional displacement during the cutting process.
[0045] The cutting operation can be completed using high-precision laser cutting equipment. Laser cutting, with its non-contact processing characteristics, can effectively reduce mechanical stress on the packaging structure, and is especially suitable for cutting composite structures of packaging material 3 and conductive pillar 2, ensuring a smooth and flat cut surface and reducing edge burrs.
[0046] The independent adapter board unit 5 formed after cutting not only achieves separation in physical structure, but also ensures that each unit has complete signal transmission capability. Both ends of the conductive post 2 in each unit remain exposed from the surface of the insulating encapsulation substrate, and the new surface formed by cutting will not interfere with the anti-oxidation treatment process of the conductive post 2.
[0047] For step S7, as Figure 7 After obtaining the independent adapter board unit 5, the ends of the conductive posts 2 are directly exposed to the external environment. Since the conductive posts 2 are typically made of easily oxidizable metals such as copper, without protection, their ends are highly susceptible to oxidation by oxygen in the air, forming an oxide film. This oxide film significantly increases the contact resistance of the conductive posts 2, severely interfering with the stability and reliability of signal transmission, and may even cause electrical connection failure. Therefore, an anti-oxidation conductive layer 6 must be formed on the exposed ends of the conductive posts 2 in the adapter board unit 5 to protect the conductive posts 2 and maintain their excellent conductivity.
[0048] In this embodiment, a tinning process is used to form the anti-oxidation conductive layer 6. Specifically, solder paste is precisely applied to the exposed ends of the conductive pillars 2 in the adapter board unit 5 using solder paste printing equipment. Subsequently, the adapter board unit 5 coated with solder paste is heated using a reflow soldering process, causing the solder paste to melt and spread evenly at the ends of the conductive pillars 2. After cooling, the solder paste solidifies to form a dense tin layer. The tin layer, as the anti-oxidation conductive layer 6, has two significant advantages: Firstly, tin has good chemical stability and does not easily react with oxygen at room temperature, effectively blocking the contact between the conductive pillars 2 (such as copper pillars) and air, thereby delaying or even preventing oxidation of the conductive pillars 2. Secondly, tin itself has good conductivity and will not negatively affect the original signal transmission performance of the conductive pillars 2, thus ensuring that the adapter board maintains a stable and efficient electrical connection during long-term use.
[0049] It is worth noting that, in addition to the tin layer used in this embodiment, tin alloy layer, nickel-gold layer, or silver layer can also be selected as the anti-oxidation conductive layer 6, depending on the actual application scenario and performance requirements. For example, the tin alloy layer can be optimized by adjusting its alloy composition to improve its melting point, hardness, and other properties, thereby adapting to different welding processes; the nickel-gold layer has superior anti-oxidation and wear resistance properties, enabling it to play a role in high-frequency, high-reliability electronic packaging scenarios (such as high-end servers, aerospace electronic equipment, etc.); the silver layer has excellent conductivity, making it suitable for applications with extremely high requirements for signal transmission loss (such as high-frequency signal transmission in high-speed communication equipment). These different types of anti-oxidation conductive layer 6 materials can all ensure the conductivity of the conductive pillar 2 while achieving anti-oxidation function, further demonstrating the flexibility of the process in terms of material adaptability and meeting diverse electronic packaging needs.
[0050] By forming an anti-oxidation conductive layer 6 at the end of the conductive post 2 in step S7, the problem of easy oxidation of the conductive post 2 after exposure is effectively solved, and the reliability and service life of the adapter board are greatly improved. Furthermore, the diverse material selection enhances the adaptability of the invention to different application scenarios, providing strong support for the application of the adapter board in a wider range of electronic devices.
[0051] In summary, the adapter board manufacturing method of the present invention is flexible and can adjust the arrangement of conductive posts 2 according to different target packaging structures; it has high production efficiency and low cost, and simplifies the traditional complex process; the manufactured adapter board has stable connection between conductive posts 2 and the outside, good anti-oxidation performance, stable signal transmission and long service life, which well meets the needs of the electronic packaging field for high-density, high-speed signal transmission and heterogeneous integration.
[0052] In another aspect of this embodiment, an adapter board obtained by the manufacturing method described in steps S1-S7 is also proposed. The overall structure consists of three parts: an insulating encapsulation substrate, conductive pillars 2, and an anti-oxidation conductive layer 6. There are at least two conductive pillars 2, which are embedded inside the insulating encapsulation substrate, with each end of the conductive pillar 2 penetrating to two opposite surfaces of the insulating encapsulation substrate. The anti-oxidation conductive layer 6 covers the ends of the conductive pillars 2.
[0053] Specifically, the insulating encapsulation substrate is formed by an encapsulation process using insulating encapsulation materials 3 such as epoxy resin molding compounds, polyimide molding compounds, or cyanate ester resin molding compounds. This not only provides a robust structural support for the entire adapter board but also performs the crucial function of insulation and isolation. These materials possess excellent electrical insulation properties, effectively preventing signal interference between the embedded conductive posts 2 and ensuring the independence and accuracy of signal transmission. Simultaneously, their good mechanical strength and high-temperature resistance allow them to adapt to the complex environment of electronic equipment operation, ensuring the adapter board maintains structural stability during long-term use and is less prone to cracking or deformation. Compared to the substrate materials relied upon by traditional adapter boards, the insulating encapsulation substrate in this embodiment is formed through an integrated encapsulation process, without a layered structure. This significantly reduces the risk of signal loss or structural failure due to poor interlayer bonding, further improving the reliability of the adapter board.
[0054] Conductive post 2 serves as a bridge for electrical signal transmission. Its material can be selected from copper, copper alloy, silver, or gold-plated metal pillars, depending on the requirements. The excellent conductivity of these metal materials ensures efficient signal transmission within the adapter board, reducing transmission loss. The cross-sectional shape of conductive post 2 can be flexibly designed as circular, square, or polygonal to adapt to different current carrying requirements or space constraints. Crucially, the length of conductive post 2 is the same as the thickness of the insulating package substrate, and both ends penetrate to the two opposite surfaces of the insulating package substrate. This through-type design ensures a direct and tight electrical connection between conductive post 2 and external components (such as chips or substrates), avoiding poor contact problems caused by uneven buried depth of conductive structures in traditional adapter boards. Furthermore, the arrangement of conductive post 2 can be precisely designed according to the interconnection requirements of the target package structure, meeting the interconnection needs of high-density pins and adapting to complex signal routing designs, significantly improving the adapter board's adaptability to different electronic packaging scenarios.
[0055] To further ensure the long-term stable operation of the conductive posts 2, the adapter board also includes an anti-oxidation conductive layer 6 covering both ends of the conductive posts 2. This layer can be made of materials such as tin, tin alloy, nickel-gold, or silver. Its core function is to prevent direct contact between the ends of the conductive posts 2 and the air, thus preventing oxidation of easily oxidized metals such as copper. Furthermore, these anti-oxidation conductive layers 6 themselves have excellent conductivity and do not increase the contact resistance for signal transmission, ensuring low-loss connections between the conductive posts 2 and external components. This design solves the problem of easy oxidation of exposed conductive structures in traditional adapter boards, leading to unstable signal transmission and significantly extending the service life of the adapter board.
[0056] In summary, the adapter board of this embodiment, through the synergistic design of the insulating encapsulation substrate, the through-through conductive pillars, and the anti-oxidation conductive layer, not only achieves high-density, low-loss signal transmission, but also has advantages such as structural stability, strong anti-interference ability, and wide applicability. It effectively overcomes the limitations of traditional adapter boards in terms of performance and application flexibility, and provides key support for the miniaturization and high-performance development of electronic devices.
[0057] The above are merely preferred embodiments of the present invention and do not constitute any limitation on the present invention. Any equivalent substitutions or modifications made by those skilled in the art to the technical solutions and content disclosed in the present invention without departing from the scope of the present invention shall be deemed to have remained within the protection scope of the present invention.
Claims
1. A method for manufacturing an adapter board, characterized in that, Includes the following steps: Provide a temporary substrate; The conductive pillars are fixed to the surface of the temporary support substrate, and the arrangement of the conductive pillars is adapted to the interconnection requirements of the target packaging structure. The conductive pillar and the surface area of the temporary support substrate in contact with the conductive pillar are encapsulated to form an encapsulation structure; Remove the temporary carrier substrate from the packaging structure; At least two opposing surfaces of the encapsulation structure are processed so that the two ends of the conductive post are exposed from the two opposing surfaces of the encapsulation structure, respectively. The processed packaging structure is cut into multiple independent adapter board units; An anti-oxidation conductive layer is formed at the exposed ends of the conductive posts in the adapter plate unit.
2. The manufacturing method according to claim 1, characterized in that, The temporary support substrate is made of FR4 board.
3. The manufacturing method according to claim 1, characterized in that, The conductive pillar is made of at least one of copper pillar, copper alloy pillar, silver pillar, or gold-plated metal pillar, and the cross-sectional shape of the conductive pillar is at least one of circular, square, or polygonal.
4. The manufacturing method according to claim 1, characterized in that, When fixing the conductive post to the surface of the temporary support substrate, the adhesive material used includes at least one of thermally conductive adhesive, conductive adhesive, or insulating film.
5. The manufacturing method according to claim 1, characterized in that, When encapsulating the conductive post and the surface area of the temporary support substrate in contact with the conductive post, the encapsulation material used includes at least one of epoxy resin molding compound, polyimide molding compound, or cyanate ester resin molding compound.
6. The manufacturing method according to claim 1, characterized in that, The process of removing the temporary carrier substrate from the packaging structure employs at least one method, including physical peeling, chemical dissolution, or laser removal.
7. The manufacturing method according to claim 1, characterized in that, The processing of at least two opposing surfaces of the encapsulation structure employs at least one of the following processing methods: grinding, etching, or laser processing.
8. The manufacturing method according to claim 1, characterized in that, The anti-oxidation conductive layer includes one of a tin layer, a tin alloy layer, a nickel-gold layer, or a silver layer.
9. A converter board manufactured using the method described in any one of claims 1-8, characterized in that, include: Insulating encapsulation substrate; At least two conductive pillars are embedded inside the insulating encapsulation substrate, and the two ends of the conductive pillars extend to two opposite surfaces of the insulating encapsulation substrate, respectively. An anti-oxidation conductive layer is provided, which covers both ends of the conductive post.
10. The adapter board according to claim 9, characterized in that, The length of the conductive post is the same as the thickness of the insulating encapsulation substrate.