Radiator structure with high heat dissipation performance

Abstract

The invention discloses a high-heat-dissipation radiator structure which comprises a base, an induction cooker body is movably connected to the upper surface of the base, a heat dissipation groove is formed in the lower portion of the induction cooker body, a heat dissipation box is fixedly connected to the inner surface of the base, a water tank is fixedly connected to the inner surface of the heat dissipation box, and a refrigerating device is arranged in the water tank. A plurality of slots are formed in the water tank, a plurality of longitudinal heat conduction fins are fixedly connected to the inner surfaces of the slots, transverse heat conduction fins are fixedly connected between the longitudinal heat conduction fins, and the longitudinal heat conduction fins are attached to the lower portion of the heat dissipation groove. And the longitudinal heat conduction fins and the transverse heat conduction fins form a multi-layer fin structure, so that the heat dissipation area is increased, heat is more uniformly transmitted to the water tank, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation structure technology for induction cookers, and particularly to a heat sink structure with high heat dissipation performance. Background Technology

[0002] In the field of high-end commercial kitchen equipment, high-power induction cookers have been widely used in the kitchens of restaurants, hotels and other places. These places usually require long-term continuous cooking. The induction cooker needs to continuously output high power. If the heat generated cannot be dissipated in time, it is very easy to cause the internal temperature of the cooker to be too high. This not only affects the cooking efficiency, but may also trigger the overheat protection mechanism to stop operation, seriously reducing the stability and service life of the equipment.

[0003] Traditional induction cookers mostly use single-air cooling, relying on natural air convection to remove heat. In the high-temperature and high-humidity environment of commercial kitchens, the heat capacity and flow of air decrease significantly, and the air cooling efficiency will be greatly reduced. At the same time, high humidity air is prone to condensation on the surface of heat dissipation components, further increasing thermal resistance and causing prominent local overheating problems. Therefore, there is an urgent need for a composite heat dissipation structure that can actively cool and efficiently conduct heat to meet the heat dissipation requirements in high humidity environments and ensure the continuous and stable operation of the induction cooker. Summary of the Invention

[0004] The purpose of this invention is to at least solve one of the technical problems existing in the prior art, and to provide a heat sink structure with high heat dissipation performance, which solves the problems of existing induction cooker heat sinks that rely solely on single air cooling or natural convection, have low heat dissipation efficiency, cannot actively cool down, are easily affected by high humidity, and have power devices that are easily damaged by high temperature.

[0005] The present invention also provides a high heat dissipation radiator structure as described above, comprising: a base, an induction cooker body movably connected to the upper surface of the base, a heat dissipation groove provided below the induction cooker body, a heat dissipation box fixedly connected to the inner surface of the base, a water tank fixedly connected to the inner surface of the heat dissipation box, a cooling device provided inside the water tank, multiple slots provided on the water tank, multiple longitudinal heat-conducting fins fixedly connected to the inner surface of the slots, transverse heat-conducting fins fixedly connected between the multiple longitudinal heat-conducting fins, the longitudinal heat-conducting fins adhering to the lower part of the heat dissipation groove, a fan assembly connected to the side surface of the heat dissipation box, a dehumidification device provided on the fan assembly, and an exhaust hole provided on the heat dissipation box.

[0006] According to the present invention, a high heat dissipation radiator structure includes a cooling device comprising: a mounting slot and a semiconductor cooling plate, wherein the mounting slot is disposed on a water tank and the semiconductor cooling plate is fixedly connected to the inner surface of the mounting slot.

[0007] According to the high heat dissipation heat sink structure of the present invention, the bottom of the mounting groove is provided with heat dissipation holes, which are located below the semiconductor cooling plate.

[0008] According to the high heat dissipation radiator structure of the present invention, the heat dissipation box is provided with a through groove, and the mounting groove is embedded in the inside of the through groove.

[0009] According to the present invention, a high heat dissipation radiator structure includes a fan assembly comprising a dehumidifying air box and an air duct, wherein the dehumidifying air box is connected to the side surface of the radiator body and the air duct is connected to the side surface of the dehumidifying air box.

[0010] According to the high heat dissipation radiator structure of the present invention, the fan assembly further includes: a bracket, a motor, and fan blades. The bracket is fixedly connected to the inner wall of the air duct, the motor is fixedly connected to the inner surface of the bracket, and the fan blades are fixedly connected to the output end of the motor.

[0011] According to the present invention, a high heat dissipation radiator structure includes a dehumidification device comprising three condensing cooling plates and a refrigeration device. The three condensing cooling plates are all fixedly connected to the inner surface of the dehumidification chamber and are staggered. The refrigeration device is fixedly connected to the side surface of the base and the output end of the refrigeration device is connected to the condensing cooling plates.

[0012] According to the high heat dissipation radiator structure of the present invention, the lower surface of the dehumidification box is connected to a drain pipe, and the inner wall of the drain pipe is movably connected to a sealing plug.

[0013] Beneficial effects:

[0014] This technical solution features a high-heat-dissipation radiator structure. The cooling device actively lowers the water temperature in the water tank, and then the heat from the bottom of the induction cooker is transferred to the water tank for heat exchange and cooling through horizontal and vertical heat-conducting fins, achieving efficient cooling. At the same time, the fan assembly accelerates airflow, further removing heat and preventing localized overheating. The overall system adopts a composite heat dissipation method that combines water cooling and air cooling to achieve efficient heat dissipation, effectively reducing the operating temperature of the induction cooker, thereby significantly improving its operational stability and service life. Furthermore, during the operation of the fan assembly, the dehumidification component can dehumidify the incoming air to prevent high humidity from interfering with heat transfer efficiency and reducing the heat dissipation effect. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0016] Figure 1 This is a front view of the high heat dissipation heat sink structure of the present invention;

[0017] Figure 2This is a front cross-sectional view of the high heat dissipation radiator structure of the present invention;

[0018] Figure 3 This is a left-side cross-sectional view of the high heat dissipation radiator structure of the present invention;

[0019] Figure 4 This is a partially enlarged structural view of the high heat dissipation radiator structure of the present invention;

[0020] Figure 5 This is a bottom view of the high heat dissipation radiator structure of the present invention;

[0021] Figure 6 This is a structural diagram of the induction cooker body with a high heat dissipation radiator structure according to the present invention.

[0022] Legend:

[0023] 1. Motor; 2. Condensing plate; 3. Induction cooker body; 4. Base; 5. Refrigeration equipment; 6. Bracket; 7. Fan blades; 8. Heat dissipation holes; 9. Exhaust vent; 10. Heat dissipation box; 11. Water tank; 12. Through slot; 13. Semiconductor cooling plate; 14. Mounting slot; 15. Air duct; 16. Dehumidification box; 17. Longitudinal heat-conducting fins; 18. Transverse heat-conducting fins; 19. Slot; 20. Heat dissipation groove; 21. Drain pipe; 22. Sealing plug. Detailed Implementation

[0024] This section will describe in detail specific embodiments of the present invention. Preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but they should not be construed as limiting the scope of protection of the present invention.

[0025] Reference Figure 1-4 An embodiment of the present invention provides a high heat dissipation radiator structure, which includes: a base 4, an induction cooker body 3 movably connected to the upper surface of the base 4, and a heat dissipation groove 20 provided below the induction cooker body 3.

[0026] Specifically: The induction cooker body 3 is placed directly above the base 4. When the induction cooker body 3 is working, a large amount of heat is generated at its bottom due to the operation of the power module (such as IGBT, rectifier bridge, etc.). This heat is diffused through the heat dissipation groove 20 and directly conducted to the longitudinal heat-conducting fins 17 attached to the bottom of the heat dissipation groove 20.

[0027] A heat dissipation box 10 is fixedly connected to the inner surface of the base 4, and a water tank 11 is fixedly connected to the inner surface of the heat dissipation box 10. A cooling device is provided inside the water tank 11. The cooling device includes: a mounting groove 14 and a semiconductor cooling plate 13. The mounting groove 14 is set on the water tank 11, and the semiconductor cooling plate 13 is fixedly connected to the inner surface of the mounting groove 14.

[0028] The bottom of the mounting slot 14 is provided with heat dissipation holes 8, which are located below the semiconductor cooling plate 13. Specifically, this is a further optimization design of the cooling device in the core technical solution. In practical applications, when the semiconductor cooling plate 13 is working, its cold end is in close contact with the coolant in the water tank 11 for cooling, while the heat generated by the hot end is directly discharged through the heat dissipation holes 8 at the bottom. This design allows the heat to leave the cooling system quickly, improving the overall heat dissipation efficiency.

[0029] The heat dissipation box 10 is provided with a through groove 12, and the mounting groove 14 is embedded in the inside of the through groove 12. Specifically, this is a specific implementation of the installation method of the cooling device in the core technical solution, which improves the heat dissipation effect. The design of the through groove 12 allows the mounting groove 14 to have direct contact with the external environment, which is conducive to the heat dissipation hole 8 to dissipate heat more effectively.

[0030] The water tank 11 is provided with multiple slots 19, and multiple longitudinal heat-conducting fins 17 are fixedly connected to the inner surface of the slots 19. Transverse heat-conducting fins 18 are fixedly connected between the multiple longitudinal heat-conducting fins 17, and the longitudinal heat-conducting fins 17 are attached to the bottom of the heat dissipation slot 20.

[0031] Specifically: The longitudinal heat-conducting fins 17 are connected by transverse heat-conducting fins 18 to form a multi-layered mesh structure. Heat is transferred from the longitudinal fins to the transverse fins and then diffuses into the water tank 11 through the slots 19. The water tank 11 is filled with coolant (such as water or a special coolant). The coolant absorbs the heat from the longitudinal heat-conducting fins 17 through heat conduction through the inner wall of the slots 19, and its own temperature gradually increases. The cooling device inside the water tank 11 is the core cooling component. The mounting slot 14 is fixed in the through slot 12, and the semiconductor cooling plate 13 on its inner surface is energized. Then it starts working: The cold end of the semiconductor cooling plate 13 is in close contact with the coolant in the water tank 11. It absorbs the heat of the coolant through the Peltier effect, causing its temperature to drop rapidly; the hot end is located at the bottom of the mounting groove 14. The heat generated is discharged through the heat dissipation hole 8. This process realizes the active cooling of the coolant, so that it can continuously absorb heat. The grid structure composed of the longitudinal heat-conducting fins 17 and the transverse heat-conducting fins 18 disperses the heat from the local area (the contact area at the bottom of the induction cooker) to the entire water tank 11, increasing the heat conduction range and improving the overall heat exchange efficiency.

[0032] A fan assembly is connected to the side surface of the heat dissipation box 10. The fan assembly includes a dehumidification box 16 and an air duct 15. The dehumidification box 16 is connected to the side surface of the heat dissipation box 10, and the air duct 15 is connected to the side surface of the dehumidification box 16. The fan assembly also includes a bracket 6, a motor 1, and a fan blade 7. The bracket 6 is fixedly connected to the inner wall of the air duct 15, the motor 1 is fixedly connected to the inner surface of the bracket 6, and the fan blade 7 is fixedly connected to the output end of the motor 1. An exhaust hole 9 is provided on the heat dissipation box 10.

[0033] Specifically: After the fan assembly on the side surface of the heat sink 10 is started, the motor 1 drives the fan blades 7 to rotate, drawing outside air into the air duct 15, and then into the heat sink 10 through the dehumidification box 16. When the airflow flows through the outer wall of the water tank 11 and the heat-conducting fin assembly, it comes into contact with the high-temperature surface. Through forced convection heat exchange, the heat of the coolant and fins is dissipated. The heated air is finally discharged from the exhaust port 9 to the outside of the base 4, forming a continuous airflow circulation. The exhaust port 9 discharges the high-temperature air into the environment outside the induction cooker, completing the entire heat dissipation process. The continuous operation of the fan assembly ensures that there is always a supply of fresh cold air inside the heat sink 10, maintaining a high heat exchange efficiency.

[0034] The fan assembly is equipped with a dehumidification device, which includes three condensing and cooling plates 2 and a refrigeration device 5. The three condensing and cooling plates 2 are all fixedly connected to the inner surface of the dehumidification box 16 and are staggered. The refrigeration device 5 is fixedly connected to the side surface of the base 4. The output end of the refrigeration device 5 is connected to the condensing and cooling plates 2. The lower surface of the dehumidification box 16 is connected to a drain pipe 21, and a sealing plug 22 is movably connected to the inner wall of the drain pipe 21.

[0035] Specifically: After the refrigeration equipment 5 is powered on, it supplies low-temperature refrigerant to the three staggered condensing plates 2, making the surface temperature of the condensing plates 2 significantly lower than the dew point temperature of the surrounding air. When the humid air drawn in by the fan assembly flows through the dehumidification box 16, the water vapor in the air liquefies on the surface of the condensing plates 2, forming liquid water droplets. The liquid water collects along the plate surface to the bottom and is discharged through the drain pipe 21 (the sealing plug 22 needs to be removed periodically for cleaning). This process continuously reduces the humidity of the air entering the heat dissipation box 10, preventing high-humidity air from condensing into a water film on the surface of the heat-conducting fins and water tank 11, increasing thermal resistance, ensuring stable heat transfer efficiency, and preventing condensate from corroding electronic components, thus improving the reliability of the heat dissipation system in high-temperature and high-humidity environments.

[0036] Specifically, the refrigeration equipment 5 is composed of a compressor, a condenser, and an expansion valve. Its working principle is as follows: the compressor draws in low-temperature, low-pressure refrigerant gas, compresses it into high-temperature, high-pressure gas, and the high-temperature, high-pressure gas enters the condenser, where it releases heat and cools into a high-pressure liquid. The high-pressure liquid passes through the expansion valve, where it is depressurized and cooled into a low-temperature, low-pressure mist or gas-liquid mixture. The low-temperature, low-pressure refrigerant enters the evaporator (condenser plate 2), absorbs heat, and evaporates into gas. The gaseous refrigerant is then drawn back into the compressor, completing one cycle. The description and working principle of this refrigeration equipment 5 are existing mature technologies, well-known to those skilled in the art. Therefore, other details will not be elaborated upon in this article.

[0037] Working principle: When the high heat dissipation radiator is working, the heat generated by the operation of the induction cooker body 3 is conducted through the heat dissipation groove 20 to the vertical heat-conducting fins 17 at the bottom. The vertical fins 17 and the horizontal heat-conducting fins 18 form a grid structure, which quickly disperses the heat and transfers it to the water tank 11 through the slot 19.

[0038] The coolant in the water tank 11 absorbs heat from the fins through heat conduction. At the same time, after the semiconductor cooling plate 13 in the mounting slot 14 is powered on, the cold end continuously absorbs heat from the coolant to cool it down. The heat generated at the hot end is discharged through the heat dissipation hole 8. The cooled coolant further absorbs the heat transferred by the fins, keeping the water tank 11 at a low temperature.

[0039] After the fan assembly is started, the motor 1 drives the fan blades 7 to rotate, drawing outside air into the air duct 15 through the air inlet 5 of the protective plate 2. The airflow enters the heat dissipation box 10 through the dehumidification box 16, and carries away heat as it flows through the outer wall of the water tank 11 and the heat-conducting fin assembly. Finally, it is discharged to the external environment through the exhaust port 9.

[0040] During the operation of the fan assembly, the refrigeration equipment 5 is powered on and delivers low-temperature refrigerant to the three staggered condensing cooling plates 2, making the surface temperature of the condensing cooling plates 2 significantly lower than the dew point temperature of the surrounding air. When the humid air drawn in by the fan assembly flows through the dehumidification box 16, the water vapor in the air liquefies on the surface of the condensing cooling plates 2 upon cooling, forming liquid water droplets. The liquid water collects along the plate surface to the bottom and is discharged through the drain pipe 21 (the sealing plug 22 needs to be removed periodically for cleaning). This process continuously reduces the humidity of the air entering the heat dissipation box 10, preventing high humidity air from condensing into a water film on the surface of the heat-conducting fins and water tank 11, increasing thermal resistance, ensuring stable heat transfer efficiency, and preventing condensate from corroding electronic components, thereby improving the reliability of the heat dissipation system in high temperature and high humidity environments.

[0041] The entire process achieves efficient and stable heat dissipation through a synergistic mechanism of "heat collection by heat-conducting fins → heat transfer by coolant → active cooling by semiconductor cooling plate 13 → forced convection cooling by fan", effectively reducing the operating temperature of the induction cooker and preventing overheating damage to power devices.

[0042] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A high-heat-dissipation radiator structure, comprising: A base (4), the upper surface of which is movably connected to an induction cooker body (3), and a heat dissipation groove (20) is provided below the induction cooker body (3), characterized in that: A heat dissipation box (10) is fixedly connected to the inner surface of the base (4). A water tank (11) is fixedly connected to the inner surface of the heat dissipation box (10). A cooling device is installed inside the water tank (11). Multiple slots (19) are provided on the water tank (11). Multiple longitudinal heat-conducting fins (17) are fixedly connected to the inner surface of the slots (19). Transverse heat-conducting fins (18) are fixedly connected between the multiple longitudinal heat-conducting fins (17). The longitudinal heat-conducting fins (17) are attached to the bottom of the heat dissipation groove (20). A fan assembly is connected to the side surface of the heat dissipation box (10). A dehumidification device is provided on the fan assembly. An exhaust hole (9) is provided on the heat dissipation box (10).

2. The high heat dissipation radiator structure according to claim 1, characterized in that, The refrigeration device includes: a mounting slot (14) and a semiconductor refrigeration plate (13). The mounting slot (14) is disposed on the water tank (11), and the semiconductor refrigeration plate (13) is fixedly connected to the inner surface of the mounting slot (14).

3. The high heat dissipation radiator structure according to claim 2, characterized in that, The bottom of the mounting slot (14) is provided with heat dissipation holes (8), which are located below the semiconductor cooling plate (13).

4. The high heat dissipation radiator structure according to claim 2, characterized in that, The heat dissipation box (10) is provided with a through groove (12), and the mounting groove (14) is embedded in the inside of the through groove (12).

5. The high heat dissipation radiator structure according to claim 1, characterized in that, The fan assembly includes a dehumidifying air box (16) and an air duct (15). The dehumidifying air box (16) is connected to the side surface of the heat dissipation box (10), and the air duct (15) is connected to the side surface of the dehumidifying air box (16).

6. The high heat dissipation radiator structure according to claim 5, characterized in that, The fan assembly also includes: a bracket (6), a motor (1), and a fan blade (7). The bracket (6) is fixedly connected to the inner wall of the air duct (15), the motor (1) is fixedly connected to the inner surface of the bracket (6), and the fan blade (7) is fixedly connected to the output end of the motor (1).

7. A high heat dissipation radiator structure according to claim 5, characterized in that, The dehumidification device includes: three condensing cooling plates (2) and a refrigeration device (5). The three condensing cooling plates (2) are all fixedly connected to the inner surface of the dehumidification box (16). The three condensing cooling plates (2) are staggered. The refrigeration device (5) is fixedly connected to the side surface of the base (4). The output end of the refrigeration device (5) is connected to the condensing cooling plates (2).

8. A high heat dissipation radiator structure according to claim 7, characterized in that, The lower surface of the dehumidification box (16) is connected to a drain pipe (21), and the inner wall of the drain pipe (21) is movably connected to a sealing plug (22).

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