Voltage regulating device, manufacturing method and electronic equipment

Abstract

The invention relates to the technical field of voltage regulation, and discloses a voltage regulation device, a manufacturing method and electronic equipment, and the device comprises an inductor which comprises a magnetic core, a first winding wire and a second winding wire; the first winding wire and the second winding wire are Z-shaped, the middle parts of the first winding wire and the second winding wire penetrate through the magnetic core, and the middle parts of the first winding wire and the second winding wire are parallel to the bottom plate or the top plate of the voltage regulating device; two ends of the first winding wire and two ends of the second winding wire are led out from the magnetic core; the two ends of the first winding wire are opposite to the two ends of the second winding wire; the first winding and the second winding are used for generating magnetic flux perpendicular to the top plate or the bottom plate, and the magnetic flux is used for adjusting voltage. The middle part of the Z-shaped first winding wire and the middle part of the Z-shaped second winding wire are parallel to the bottom plate or the top plate of the inductor, so that the first winding wire and the second winding wire generate magnetic flux in a plane vertical to the top plate or the bottom plate, the height of the winding wires of the inductor is reduced, and the height of the voltage regulating device is reduced.

Description

Technical Field

[0001] This application relates to the field of voltage regulation technology, and in particular to a voltage regulation device, manufacturing method, and electronic device. Background Technology

[0002] Vertical power supply is a promising option for mitigating the higher power loss caused by the kiloamp-level current requirements of AI chips. However, the height of the rear connector's I / O interface limits the height of the voltage regulator module (VRM). Therefore, to accommodate the height limitations of vertical power supply, the voltage regulator module needs to be as low as possible in height to meet this requirement.

[0003] In summary, there is a need to provide a voltage regulation device, manufacturing method, and electronic device with low voltage. Summary of the Invention

[0004] To address the above problems, this application proposes a voltage regulation device, a manufacturing method, and an electronic device.

[0005] On one hand, this application proposes a voltage regulating device, comprising:

[0006] The inductor includes a magnetic core, a first winding, and a second winding;

[0007] Both the first winding and the second winding are Z-shaped, and the middle part of both the first winding and the second winding passes through the magnetic core. The middle part of both the first winding and the middle part of the second winding are parallel to the bottom plate or top plate of this voltage regulating device.

[0008] Both ends of the first winding and both ends of the second winding are led out from the magnetic core;

[0009] The two ends of the first winding are opposite to the two ends of the second winding;

[0010] The first winding and the second winding are used to generate magnetic flux in a plane perpendicular to the top plate or the bottom plate, and the magnetic flux is used to adjust the voltage.

[0011] Preferably, it further includes: the top plate and the bottom plate;

[0012] One side of the top plate is connected to one end of the first winding, and the other side is connected to one end of the second winding.

[0013] One side of the base plate is connected to the other end of the first winding, and the other side is connected to the other end of the second winding.

[0014] Preferably, the top plate includes a top plate substrate, the top of the top plate substrate has a plurality of top plate top electrodes, and the bottom of the top plate substrate has a plurality of top plate bottom electrodes; one of the plurality of top plate bottom electrodes is connected to one end of the first winding, and one of the plurality of top plate bottom electrodes is connected to one end of the second winding.

[0015] The base plate includes a base plate substrate, the top of the base plate substrate has a plurality of base plate top electrodes, and the bottom of the base plate substrate has a plurality of base plate bottom electrodes; one of the plurality of base plate top electrodes is connected to the other end of the first winding, and one of the plurality of base plate top electrodes is connected to the other end of the second winding.

[0016] Both the top plate substrate and the bottom plate substrate include through holes and blind buried holes;

[0017] At least one of the plurality of bottom electrodes of the base plate is connected to the input and / or output of the external I / O interface.

[0018] Preferably, it further includes: power devices, integrated circuit chips, and passive devices;

[0019] The power device, the integrated circuit chip, and the passive device are all located on the top of the top plate and connected to the top electrode of the top plate;

[0020] The power devices include discrete power devices with a thermal resistance of less than or equal to 2K / W and an on-resistance of less than or equal to 3 milliohms.

[0021] Preferably, the inductor includes EI, UI, EE, and QE forms.

[0022] Preferably, it further includes an interconnection device; the interconnection device is between the top plate and the bottom plate for electrically connecting the top plate and the bottom plate.

[0023] Secondly, this application proposes a method for manufacturing a voltage regulating device, used to manufacture the voltage regulating device as described in any one of the first aspects, comprising:

[0024] The four substrates are pressed together in pairs to obtain the top substrate and the bottom substrate;

[0025] Through holes are formed on the upper and lower surfaces of the top plate substrate and the bottom plate substrate, respectively;

[0026] Mounting electrodes are formed on the upper and lower surfaces of the top plate substrate and the bottom plate substrate, respectively, to obtain the top plate and the bottom plate;

[0027] An inductor is mounted on the mounting electrode on the upper surface of the base plate;

[0028] The mounting electrode on the lower surface of the top plate is attached to the inductor to obtain a voltage regulating device.

[0029] Preferably, after forming mounting electrodes on the upper and lower surfaces of the top plate substrate and the bottom plate substrate respectively to obtain the top plate and the bottom plate, the method further includes:

[0030] Power devices, integrated circuit chips, and resistors / capacitors are mounted on the mounting electrodes on the upper surface of the top plate.

[0031] Preferably, before attaching the mounting electrodes on the upper surface of the top plate to the inductor to obtain the voltage regulating device, the method further includes:

[0032] Interconnect devices are mounted on the mounting electrodes on the upper surface of the base plate and the lower surface of the top plate.

[0033] Thirdly, this application provides an electronic device comprising: a processor and a voltage regulating device as described in any of the first aspects.

[0034] The advantage of this application is that by making the middle part of the first winding and the middle part of the second winding parallel to the bottom plate or top plate, the first winding and the second winding generate magnetic flux in a plane perpendicular to the top plate or bottom plate, thereby reducing the height of the inductor winding in the voltage regulating device and reducing the height of the voltage regulating device. Attached Figure Description

[0035] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0036] Figure 1 This is a schematic diagram of an existing voltage regulation module;

[0037] Figure 2 This is a top view schematic diagram of an inductor in an existing voltage regulation module;

[0038] Figure 3 This is a schematic diagram of an inductor for a voltage regulation device provided in this application;

[0039] Figure 4 This is a front view schematic diagram of an inductor in a voltage regulation device provided in this application;

[0040] Figure 5 This is a side view of the inductor of a voltage regulation device provided in this application;

[0041] Figure 6 This is a schematic diagram of a voltage regulation device provided in this application;

[0042] Figure 7 This is a schematic diagram of another voltage regulation device provided in this application;

[0043] Figure 8 This is a schematic flowchart illustrating a method for manufacturing a voltage regulating device provided in this application;

[0044] Figure 9 This is a schematic diagram of the fabrication of the top plate substrate for a method of manufacturing a voltage regulating device provided in this application;

[0045] Figure 10 This is a schematic diagram of the fabrication of the top plate substrate in another method for manufacturing a voltage regulating device provided in this application;

[0046] Figure 11 This is a schematic diagram of the fabrication top plate of a method for manufacturing a voltage regulating device provided in this application;

[0047] Figure 12 This is a schematic diagram of the base plate used in the manufacturing method of a voltage regulating device provided in this application;

[0048] Figure 13 This is a schematic diagram of the mounting power device and integrated circuit chip in a method for manufacturing a voltage regulation device provided in this application;

[0049] Figure 14 This is a schematic diagram of a mounting inductor used in a method for manufacturing a voltage regulating device provided in this application. Detailed Implementation

[0050] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0051] A voltage regulator module is a device that provides a suitable supply voltage to a microprocessor. It can be directly soldered onto the motherboard or installed as a module daughter card. Because it can change and adjust the supply voltage, it allows the same motherboard to be used with processors that have different supply voltages.

[0052] like Figure 1As shown, the overall dimensions of a traditional high current density voltage regulation module are approximately 9mm*10mm*7.7mm. The top plate contains two DrMOS transistors and a resistor-capacitor device (DrMOS and resistor-capacitor). The middle section contains a gapless horizontal flux structure iron powder core inductor and an interconnecting PCB. The flux path lies in a plane parallel to the substrate, such as the bottom plate, top plate, or the chip's substrate. The flux path is as follows: Figure 2 As shown, the arrow indicates the direction of magnetic flux F. The plane containing the magnetic flux is parallel to the plane containing the bottom electrode of the voltage regulation module (such as the base plate or top plate). The base plate implements input and output through a pad array, and the top plate is interconnected with the base plate through a PCB board. The inductor occupies 50% of the volume and more than 60% of the height of the entire voltage regulation module, which greatly restricts the reduction of the voltage regulation module's height.

[0053] Furthermore, due to the limitations of EUV lithography machine photomask size, the size of the vertical power supply voltage regulation module should be as close as possible to the chip size while possessing high current output capability. Therefore, the voltage regulation module should at least achieve a current density comparable to that of the integrated circuit chip (determined by dividing the current that the voltage regulation module can provide by the projection of the voltage regulation module). However, the power devices in traditional DrMOS modules use horizontal channels, which have higher on-resistance and thermal resistance compared to vertical channels, making heat dissipation difficult and unable to adapt to the temperature rise of power devices under high current conditions, thus hindering further improvement in the current density of the voltage regulation module.

[0054] Therefore, reducing the height of the voltage regulation module and increasing the current density are problems that need to be solved.

[0055] Firstly, to address the aforementioned problems, embodiments of this application propose a voltage regulation device, such as... Figure 3 As shown, the device includes: an inductor 100; the inductor 100 includes a magnetic core 103, a first winding 101, and a second winding 102; both the first winding 101 and the second winding 102 are Z-shaped, with the middle portions of both passing through the magnetic core 103, and the middle portions of both windings being parallel to the base plate 200 or top plate 300 of the voltage regulating device; both ends of the first winding 101 and the second winding 102 are led out from the magnetic core 103; the two ends of the first winding 101 and the two ends of the second winding 102 are opposite in direction to each other. The first winding 101 and the second winding 102 are used to generate magnetic flux (F1 and F2) in a plane perpendicular to the top plate 300 or the base plate 200, and the magnetic flux is used to adjust the voltage. Figure 3As shown, I1 and I2 are both directions of current flow. Current I1 flows in from one end of the first winding 101, flows through the middle transverse portion of the first winding 101, and flows out from the other side of the first winding 101; current I2 flows in from one end of the second winding 102, flows through the middle transverse portion of the second winding 102, and flows out from the other side of the second winding 102.

[0056] Among them, such as Figure 4 As shown, the first winding 101 and the second winding 102 are located on opposite sides of the magnetic core 103. The arrows indicate examples of the directions of magnetic flux (magnetic flux) F1 and F2. The paths of magnetic flux F1 and F2 lie in a plane perpendicular to the substrate (bottom plate 200 or top plate 300). The magnetic flux F1 generated by the first winding 101 is opposite to the magnetic flux F2 generated by the second winding 102; that is, the flow directions of magnetic flux F1 and magnetic flux F2 are opposite in the plane containing the top surface of the magnetic core 103, and opposite in the plane containing the bottom surface of the magnetic core 103. Figure 5 As shown, the first winding 101 has a first upper end 111 and a first lower end 112 at both ends, and the second winding 102 has a second upper end 121 and a second lower end 122 at both ends. The middle portion 113 of the first winding is parallel to the middle portion 123 of the second winding. Both the middle portions 113 and 123 of the first and second windings are inside the magnetic core 103 and are parallel to the bottom plate 200 or the top plate 300. Both ends of the first winding 101 and the second winding 102 are led out from both ends of the magnetic core. Current I1 flows in from the first upper end 111 of the first winding 101, flows through the middle portion 113 of the first winding 101, and flows out from the first lower end 112 of the first winding 101; current I2 flows in from the second upper end 121 of the second winding 102, flows through the middle portion 123 of the second winding 102, and flows out from the second lower end 122 of the second winding 102. The material of the magnetic core 103 includes ferrite.

[0057] Because the inductor 100 has a vertical flux structure, wherein the flux path is located in a plane perpendicular to the substrate, the height of the magnetic core 103 can be reduced, thereby reducing the overall height of the voltage regulator (VRM).

[0058] The embodiments of this application also include: a top plate 300 and a bottom plate 200; one side of the top plate 300 is connected to one end of the first winding 101 and the other side is connected to one end of the second winding 102; one side of the bottom plate 200 is connected to the other end of the first winding 101 and the other side is connected to the other end of the second winding 102.

[0059] like Figure 6As shown, one side of the top plate 300 is connected to the first upper end 111 of the first winding 101, and the other side is connected to the second upper end 121 of the second winding 102. One side of the bottom plate 200 is connected to the first lower end 112 of the first winding 101, and the other side is connected to the second lower end 122 of the second winding 102.

[0060] like Figure 6 As shown, the first winding 101 and the second winding 102 are electrically connected by welding to the bottom electrode 320 of the top plate and by welding to the top electrode 210 of the bottom plate. Taking the first winding 101 as an example, current flows in from the port where the first winding 101 is welded to the top plate 300, passes through the magnetic core 103, and flows out from the port where the first winding 101 is welded to the bottom plate 200.

[0061] like Figure 6 As shown, the top plate 300 includes a top plate substrate 330, with a plurality of top plate top electrodes 310 on the top and a plurality of top plate bottom electrodes 320 on the bottom; one of the top plate bottom electrodes 320 is connected to one end of the first winding 101, and another of the top plate bottom electrodes 320 is connected to one end of the second winding 102; the bottom plate 200 includes a bottom plate substrate 230, with a plurality of bottom plate top electrodes 2100 on the top. The bottom has multiple bottom plates 220; one of the multiple top plates 210 is connected to the other end of the first winding 101, and another of the multiple top plates 210 is connected to the other end of the second winding 102; both the top plate substrate 330 and the bottom plate substrate 230 include through holes 10 and blind / buried vias; at least one of the multiple bottom plates 220 is connected to the input and / or output of an external I / O interface. The diameter of the through holes is less than or equal to 0.2 mm.

[0062] like Figure 6 As shown, one of the multiple top plate bottom electrodes 320 is connected to the upper end (first upper end 111) of the first winding, and one of the multiple top plate bottom electrodes 320 is connected to the lower end (second lower end 122) of the second winding. The top plate 300 and the bottom plate 200 also include solder resist 20.

[0063] like Figure 7As shown, it also includes: a power device 400, an integrated circuit chip 500, and a passive device 600; the power device 400, integrated circuit chip 500, and passive device 600 are all located on the top of the top plate 300 and connected to the top electrode 310 of the top plate; the power device 400 includes a discrete power device 400 with a thermal resistance less than or equal to 2K / W and an on-resistance less than or equal to 3 milliohms. That is, the power device 400 needs to simultaneously meet the following requirements: thermal resistance less than or equal to 2K / W, on-resistance less than or equal to 3 milliohms, and being a discrete power device.

[0064] Replacing the monolithically integrated DrMOS in the traditional structure with discrete power devices that have low thermal resistance and low on-resistance can alleviate the temperature rise problem of power devices under high current conditions, thereby further improving the current density of voltage regulation devices.

[0065] Inductor 100 includes inductors in EI, UI, EE and QE forms.

[0066] like Figure 7 As shown, it also includes an interconnection device 700 for electrical interconnection; the interconnection device 700 is located between the top plate 300 and the bottom plate 200 for electrically connecting the top plate 300 and the bottom plate 200.

[0067] The top plate (top plate packaging substrate) 300 includes a core plate and / or a coreless substrate; the bottom plate (bottom plate packaging substrate) 200 includes a core plate and / or a coreless substrate.

[0068] The top electrode 310 of the top plate connects to the power device 400, integrated circuit chip 500 and resistor-capacitor device on the top plate 300, and can also realize external input and output.

[0069] The bottom electrode 320 of the top plate and the top electrode 210 of the bottom plate are connected to the inductor 100 and the electrical interconnection structure (interconnection device 700) to realize the interconnection between the top plate 300 and the bottom plate 200.

[0070] The bottom electrode 220 of the base plate is used to realize external input and output.

[0071] Power devices 400 include power chips of different types such as Si, SiC, and GaN.

[0072] The materials of inductor 100 include magnetic materials such as ferrite, amorphous alloy, and nanocrystalline materials.

[0073] The connection structure includes: substrate, copper pillar, side electrode and other structural methods that can provide electrical connection.

[0074] Secondly, such as Figure 8As shown, according to an embodiment of this application, a method for manufacturing a voltage regulating device is also proposed, for manufacturing a voltage regulating device as described in any one of the first aspects, comprising:

[0075] S101, press the four core boards together in pairs to obtain the top plate substrate 330 and the bottom plate substrate 230;

[0076] S102, through holes are made on the upper and lower surfaces of the top plate substrate 330 and the bottom plate substrate 230, respectively;

[0077] S103, mounting electrodes are formed on the upper and lower surfaces of the top plate substrate 330 and the bottom plate substrate 230 respectively to obtain the top plate 300 and the bottom plate 200.

[0078] S104, an inductor is mounted on the mounting electrode on the upper surface of the base plate 200;

[0079] S105, the mounting electrodes on the lower surface of the top plate 300 are mounted with an inductor to obtain a voltage regulating device.

[0080] After forming mounting electrodes on the upper and lower surfaces of the top plate substrate 330 and the bottom plate substrate 230 respectively to obtain the top plate 300 and the bottom plate 200, the method further includes mounting a power device 400, an integrated circuit chip 500 and a resistor-capacitor device on the mounting electrodes on the upper surface of the top plate 300.

[0081] Before mounting the mounting electrodes on the upper surface of the top plate 300 with the inductor to obtain the voltage regulating device, the method further includes mounting interconnecting devices 700 on the mounting electrodes on the upper surface of the bottom plate 200 and the lower surface of the top plate 300.

[0082] The embodiments of this application will be further described below.

[0083] like Figure 9 and Figure 10 As shown, four substrates are pressed together in pairs to obtain a top substrate 330 and a bottom substrate 230, including: S111, pressing the first substrate D1 and the second substrate D2 together to form the top substrate 330; wherein, all four substrates can be core boards.

[0084] The four substrates are pressed together in pairs to obtain the top substrate 330 and the bottom substrate 230. The process also includes repeating step S111, that is, pressing the third substrate and the fourth substrate together to obtain the bottom substrate 230.

[0085] like Figure 11As shown, through holes are made on the upper and lower surfaces of the top plate substrate 330 and the bottom plate substrate 230, respectively, including: S121, mechanical drilling is performed on the upper and lower surfaces of the top plate substrate 330, and the hole walls are metallized and plugged with solder resist material; wherein, the hole wall metallization method includes electroplating, etc.

[0086] like Figure 12 As shown, through holes are made on the upper and lower surfaces of the top plate substrate 330 and the bottom plate substrate 230, respectively. The method also includes: S122, mechanical drilling is performed on the upper and lower surfaces of the bottom plate substrate 230, and the hole walls are metallized, and then the holes are plugged with solder resist material.

[0087] like Figure 11 As shown, mounting electrodes are formed on the upper and lower surfaces of the top plate substrate 330 and the bottom plate substrate 230 respectively to obtain a top plate 300 and a bottom plate 200, including: S131, forming a first upper surface mounting electrode (top plate top electrode 310) and a first lower surface mounting electrode (top plate bottom electrode 320) on the upper and lower surfaces of the top plate substrate 330 respectively to obtain a top plate 300.

[0088] like Figure 12 As shown, mounting electrodes are formed on the upper and lower surfaces of the top plate substrate 330 and the bottom plate substrate 230, respectively, to obtain the top plate 300 and the bottom plate 200. The method further includes: S132, forming a second upper surface mounting electrode (bottom plate top electrode 210) and a second lower surface mounting electrode (bottom plate bottom electrode 220) on the upper and lower surfaces of the bottom plate substrate 230, respectively, to obtain the bottom plate 200.

[0089] like Figure 13 As shown, after forming mounting electrodes on the upper and lower surfaces of the top plate 300 and the bottom plate 200 respectively, the method further includes: S161, mounting a power device 400, an integrated circuit chip 500 and a resistor / capacitor device 600 on the mounting electrodes on the upper surface of the top plate 300, that is, mounting a power device 400, an integrated circuit chip 500 and a resistor / capacitor device 600 sequentially on the mounting electrodes on the first upper surface.

[0090] like Figure 14 As shown, an inductor 100 is mounted on a mounting electrode on the upper surface of the base plate 200, including: S141, mounting an inductor 100 (power inductor) on a mounting electrode on the second upper surface of the base plate 200.

[0091] Before mounting the inductor on the upper surface of the top plate 300 to obtain the voltage regulation device, the method further includes mounting interconnect devices 700 on the mounting electrodes on the upper surface of the bottom plate 200 and the lower surface of the top plate 300, that is, mounting interconnect devices 700 on the mounting electrodes on the second upper surface of the bottom plate 200. The interconnect devices 700 include side-interconnect printed circuit boards (PCBs). The interconnect devices 700, by connecting the top electrode 210 of the bottom plate and the bottom electrode 320 of the top plate, can simultaneously connect to the upper and lower surfaces of the top plate 300 and the upper surface of the bottom plate 200, forming a path.

[0092] Finally, as Figure 6 As shown, the mounting electrodes on the upper surface of the top plate 300 are mounted with inductors and interconnection devices to obtain a voltage regulation device, including: S151, mounting the bottom plate 200 with the inductor 100 obtained in step S141 onto the mounting electrodes on the first lower surface of the top plate 300, which is sequentially mounted with power devices 400, integrated circuit chips 500 and resistor-capacitor devices 600 obtained in step S161, to obtain a voltage regulation device with high current density vertical power supply, wherein the input and output are both realized through the mounting electrodes on the second lower surface of the bottom plate 200.

[0093] Thirdly, according to embodiments of this application, an electronic device is also proposed, comprising: a processor and a voltage regulation device as described in any one of the first aspects.

[0094] In the embodiments of this application, by aligning the middle portions of the Z-shaped first winding and the second winding with the bottom or top plate of the inductor, magnetic flux (vertical flux) is generated in a plane perpendicular to the top or bottom plate, thereby reducing the height of the inductor windings in the voltage regulator and consequently lowering the overall height of the voltage regulator. Furthermore, this vertical flux structure design not only reduces the inductor height but also the overall height of the voltage regulator, thus better avoiding the limitation imposed by the rear connector's I / O interface height on the voltage regulator's height in vertical power supply scenarios. Further, this application employs discrete power devices with a thermal resistance less than or equal to 2K / W and an on-resistance less than or equal to 3 milliohms, enabling better heat dissipation and mitigating the temperature rise problem under high current conditions. This provides greater room for increasing the current density of the voltage regulator, solving the problems of high overall height, low conversion efficiency under high current conditions, and limitations on further current density increases in traditional high-current-density voltage regulators. The embodiments of this application can be widely applied in the field of industrial power electronics.

[0095] The above description is merely a preferred embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A voltage regulating device, characterized in that, include: Inductor; The inductor includes a magnetic core, a first winding, and a second winding; Both the first winding and the second winding are Z-shaped, and the middle part of both the first winding and the second winding passes through the magnetic core. The middle part of both the first winding and the middle part of the second winding are parallel to the bottom plate or top plate of the voltage regulating device. Both ends of the first winding and both ends of the second winding are led out from the magnetic core; The two ends of the first winding are opposite to the two ends of the second winding; The first winding and the second winding are used to generate magnetic flux in a plane perpendicular to the top plate or the bottom plate, and the magnetic flux is used to adjust the voltage.

2. The apparatus as claimed in claim 1, characterized in that, Also includes: The top plate and the bottom plate; One side of the top plate is connected to one end of the first winding, and the other side is connected to one end of the second winding. One side of the base plate is connected to the other end of the first winding, and the other side is connected to the other end of the second winding.

3. The apparatus as described in claim 2, characterized in that, The top plate includes a top plate substrate, the top of the top plate substrate has a plurality of top plate top electrodes, and the bottom of the top plate substrate has a plurality of top plate bottom electrodes; one of the plurality of top plate bottom electrodes is connected to one end of the first winding, and one of the plurality of top plate bottom electrodes is connected to one end of the second winding. The base plate includes a base plate substrate, the top of the base plate substrate has a plurality of base plate top electrodes, and the bottom of the base plate substrate has a plurality of base plate bottom electrodes; one of the plurality of base plate top electrodes is connected to the other end of the first winding, and one of the plurality of base plate top electrodes is connected to the other end of the second winding. Both the top plate substrate and the bottom plate substrate include through holes and blind buried holes; At least one of the plurality of bottom electrodes of the base plate is connected to the input and / or output of the external I / O interface.

4. The apparatus as claimed in claim 1, characterized in that, Also includes: Power devices, integrated circuit chips, and passive devices; The power device, the integrated circuit chip, and the passive device are all located on the top of the top plate and connected to the top electrode of the top plate; The power devices include discrete power devices with a thermal resistance of less than or equal to 2K / W and an on-resistance of less than or equal to 3 milliohms.

5. The apparatus as claimed in claim 1, characterized in that, The inductors include EI, UI, EE, and QE types.

6. The apparatus as claimed in claim 1, characterized in that, It also includes an interconnection device; the interconnection device is between the top plate and the bottom plate for electrically connecting the top plate and the bottom plate.

7. A method for manufacturing a voltage regulating device, characterized in that, For manufacturing a voltage regulating device as described in any one of claims 1 to 6, comprising: The four substrates are pressed together in pairs to obtain the top substrate and the bottom substrate; Through holes are formed on the upper and lower surfaces of the top plate substrate and the bottom plate substrate, respectively; Mounting electrodes are formed on the upper and lower surfaces of the top plate substrate and the bottom plate substrate, respectively, to obtain the top plate and the bottom plate; An inductor is mounted on the mounting electrode on the upper surface of the base plate; The mounting electrode on the lower surface of the top plate is attached to the inductor to obtain a voltage regulating device.

8. The method as described in claim 7, characterized in that, After forming mounting electrodes on the upper and lower surfaces of the top plate substrate and the bottom plate substrate, respectively, to obtain the top plate and the bottom plate, the method further includes: Power devices, integrated circuit chips, and resistors / capacitors are mounted on the mounting electrodes on the upper surface of the top plate.

9. The method as described in claim 7, characterized in that, Before attaching the mounting electrodes on the lower surface of the top plate to the inductor to obtain the voltage regulating device, the method further includes: Interconnect devices are mounted on the mounting electrodes on the upper surface of the base plate and the lower surface of the top plate.

10. An electronic device, characterized in that, include: The processor and the voltage regulation device as described in any one of claims 1 to 6.

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