Prefabricated solder assembly, heat sink device and semiconductor component

Abstract

The embodiment of the invention provides a prefabricated solder assembly, a heat sink device and a semiconductor component. The prefabricated solder assembly comprises a substrate layer, an anti-erosion layer and a solder layer which are arranged in a stacked mode. Materials of the solder layer comprise tin, copper and silver, and by taking the total mass of the solder layer as 100%, the mass percentages of the tin, the copper and the silver are K1%, K2% and K3% respectively; the mass ratio of tin to copper to silver meets the relational expression that K1 + K2 + K3 is greater than 98 and less than or equal to 100; the thicknesses of the anti-erosion layer and the solder layer are H1 [mu] m and H2 [mu] m respectively; the base layer, the anti-erosion layer and the solder layer meet a relational expression shown in the specification. According to the scheme, by prefabricating the solder assembly and prefabricating the solder layer, compared with the prior art, the welding efficiency is effectively improved, and the overall structural stability can be guaranteed.

Description

[0001] This application is a divisional application of Chinese invention patent application No. 22025117150269, filed on November 21, 2025, entitled "A pre-fabricated solder assembly, heat sink device and semiconductor device". Technical Field

[0002] This invention relates to the field of heat sink devices, and particularly to a pre-formed solder assembly, a heat sink device, and a semiconductor component. Background Technology

[0003] Currently, in high-power laser pump sources, the bonding of the CIS (chip substrate) to the housing involves placing a solder pad of a certain thickness between the CIS and the housing, and then bonding the CIS to the housing using vacuum reflow soldering. However, placing the solder pad between the housing and the CIS requires a significant amount of manual labor, which is detrimental to improving packaging efficiency.

[0004] Therefore, a solution is needed to address the problems in the existing technology. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention proposes a pre-formed solder assembly, a heat sink device, and semiconductor components. By pre-applying solder, the problem of existing technologies is solved and packaging efficiency is improved.

[0006] Specifically, the present invention proposes the following specific embodiments: This invention provides a pre-fabricated solder assembly, comprising a substrate layer, an anti-corrosion layer, and a solder layer stacked together. The solder layer is made of tin, copper, and silver, with the mass percentages of tin, copper, and silver being K1%, K2%, and K3, respectively, based on the total mass of the solder layer (100%). The mass ratio of tin, copper, and silver satisfies the following relationship: 98 < K1 + K2 + K3 ≤ 100. The thicknesses of the anti-corrosion layer and the solder layer are H1 μm and H2 μm, respectively. The substrate layer, the anti-corrosion layer, and the solder layer satisfy the following relationship: .

[0007] In one specific embodiment, the thickness of the solder layer ranges from 5 to 100 μm.

[0008] In one specific embodiment, the thickness of the solder layer ranges from 20 to 50 μm.

[0009] In one specific embodiment, the solder layer includes multiple sublayers; the materials in the sublayers include alternating stacks of tin, copper, and silver; or the materials in the sublayers include alternating stacks of tin and silver; the number of sublayers includes 2-50 layers.

[0010] In one specific embodiment, the tin, copper, and silver in the solder layer satisfy the following relationships: 90≤K1≤99; 0≤K2≤2; 1≤K3≤6.

[0011] In one specific embodiment, the anti-corrosion layer includes a nickel layer.

[0012] In one specific embodiment, the thickness of the nickel layer in the anti-corrosion layer ranges from 1 to 20 μm.

[0013] In one specific embodiment, it further includes: a first connection layer and a second connection layer; the nickel layer, the first connection layer, the second connection layer and the solder layer are stacked; The material in the first connecting layer includes one or more of titanium, chromium, nickel, and nickel-chromium alloys; The material in the second connecting layer includes one or more of gold, silver, indium, zinc, and tin.

[0014] In one specific embodiment, the substrate layer includes a copper layer or an aluminum alloy layer.

[0015] In one specific embodiment, the material of the aluminum alloy layer in the substrate layer includes one or more of silicon carbide aluminum alloy, silicon aluminum alloy, and graphene-reinforced aluminum alloy.

[0016] In one specific embodiment, the projection of the anti-corrosion layer onto the substrate layer is located within the substrate layer, and the projection of the solder layer onto the anti-corrosion layer is located within the anti-corrosion layer.

[0017] In one specific embodiment, a protective layer is also included; the protective layer is disposed on the side of the solder layer away from the anti-corrosion layer to prevent oxidation of the solder layer.

[0018] In one specific embodiment, the protective layer includes a gold layer and / or a silver layer.

[0019] In one specific embodiment, the thickness of the protective layer ranges from 20 to 500 nm.

[0020] This invention also discloses a heat sink device, including the above-described pre-fabricated solder assembly.

[0021] This invention also discloses an apparatus, characterized in that it includes the aforementioned pre-fabricated solder assembly.

[0022] Therefore, this invention provides a pre-fabricated solder assembly, comprising a substrate layer, an anti-corrosion layer, and a solder layer stacked together; the anti-corrosion layer is used to prevent the solder layer from corroding the substrate layer; the solder layer is made of tin, copper, and silver, and the mass percentages of tin, copper, and silver, based on the total mass of the solder layer being 100%, are K1%, K2%, and K3%, respectively; the mass ratio of tin, copper, and silver satisfies the relationship: 98 < K1 + K2 + K3 ≤ 100; the thicknesses of the anti-corrosion layer and the solder layer are H1 μm and H2 μm, respectively; the substrate layer, the anti-corrosion layer, and the solder layer satisfy the following relationship: This solution utilizes prefabricated solder components with prefabricated solder layers, effectively improving welding efficiency compared to existing technologies. Furthermore, by employing a specific solder layer ratio and selecting between the anti-corrosion layer and the solder layer, this solution ensures stable welding during subsequent welding processes, guaranteeing the structural stability of the welded product or device and ensuring effective heat dissipation. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a prefabricated solder assembly according to an embodiment of the present invention; Figure 2 This is a schematic diagram of another prefabricated solder assembly proposed in an embodiment of the present invention; Figure 3 This is a schematic diagram of the solder layer structure in a pre-fabricated solder assembly according to an embodiment of the present invention; Figure 4 This is a detailed structural diagram of a prefabricated solder assembly proposed in an embodiment of the present invention. Detailed Implementation

[0025] Various embodiments of this disclosure will be described more fully below. This disclosure may have various embodiments, and adjustments and changes may be made therein. However, it should be understood that there is no intention to limit the various embodiments of this disclosure to the specific embodiments disclosed herein, but rather this disclosure should be understood to cover all adjustments, equivalents, and / or alternatives falling within the spirit and scope of the various embodiments of this disclosure.

[0026] The terminology used in the various embodiments of this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the various embodiments of this disclosure. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the various embodiments of this disclosure pertain. Terms (such as those defined in a generally used dictionary) are to be interpreted as having the same meaning as in the context of the relevant technical field and are not to be interpreted as having an idealized or overly formal meaning, unless clearly defined in the various embodiments of this disclosure.

[0027] Example 1 Embodiment 1 of the present invention discloses a pre-fabricated solder assembly, such as Figure 1 As shown, the structure includes a substrate layer 1, an anti-corrosion layer 2, and a solder layer 3, which are stacked together. The anti-corrosion layer is used to prevent the solder layer from corroding into the substrate layer. The solder layer is made of tin, copper, and silver, and the mass percentages of tin, copper, and silver, based on the total mass of the solder layer being 100%, are K1%, K2%, and K3%, respectively. The mass ratio of tin, copper, and silver satisfies the following relationship: 98 < K1 + K2 + K3 ≤ 100. The thicknesses of the anti-corrosion layer and the solder layer are H1 μm and H2 μm, respectively. The substrate layer, the anti-corrosion layer, and the solder layer satisfy the following relationship: .

[0028] Specifically, such as Figure 1 As shown, the prefabricated solder assembly in this solution comprises multiple layers connected in sequence, starting from the base layer, including an anti-corrosion layer and a solder layer. The inventors of this application discovered that if the solder pad material is directly connected to the base layer to solve the problem of "the large amount of manual labor required to place the solder pad between the shell and the COS," the material difference between the shell and the solder pad can lead to reactions between elements in the solder layer and the metal in the base layer, causing the solder layer to erode the base layer. Furthermore, there are problems with poor adhesion and connection stability between the solder layer and the base layer, resulting in insufficient overall structural strength and ultimately affecting the heat dissipation and structural stability of products using this shell. Therefore, an anti-corrosion layer is needed in the middle to resist corrosion and enhance adhesion, thereby stabilizing the overall structure and ensuring the heat dissipation performance and structural stability between the solder layer and the shell.

[0029] The base layer serves as the base layer, providing support; the anti-corrosion layer separates the base layer from the solder layer and enhances the bonding strength between the base layer and the solder layer, thereby ensuring the overall stability of the product or device after soldering.

[0030] The erosion resistance is mainly determined by the thickness, therefore there is a thickness ratio between the erosion-resistant layer and the solder layer; if If the thickness is too large, the anti-corrosion layer will be insufficient compared to the solder layer, resulting in inadequate anti-corrosion capabilities and potentially failing to effectively separate the base layer from the solder layer; while if... If the thickness is too small, the thickness of the anti-corrosion layer will be too high, which will exceed the anti-corrosion requirements, resulting in material waste and excessive cost. More importantly, if the anti-corrosion layer is too thick, heat will easily cause stress concentration during the use of the heat sink device. Especially between materials with different coefficients of thermal expansion, a large thermal stress gradient will be formed, which will induce micro-cracks or peeling at the interface and further weaken the bonding force between the solder layer and the substrate layer. Therefore, there is a range between the thickness H1 of the anti-corrosion layer and the thickness H2 of the solder layer.

[0031] Furthermore, the inventors of this application discovered and There is also a connection; a better overall effect can only be achieved when these two are matched in terms of size. Therefore, it is necessary to comprehensively control multiple parameters, that is, to satisfy the following relationship: .

[0032] Therefore, taking into account the ratio of H1 to H2... It needs to be kept within a certain range to ensure overall stability, and Once a certain level is reached, further increases have little impact on the final stability. Therefore, taking all factors into consideration, The value range is between 0.01 and 0.4, which can comprehensively ensure corrosion resistance and take cost into account, and can well guarantee the overall stability of the product or device after welding.

[0033] As for the solder layer, the materials tin, copper, and silver account for 98% to 100% of the total mass of the solder layer, meaning that these three materials make up the vast majority of the total mass of the solder layer.

[0034] By controlling The mass ratio of tin, copper, and silver in the solder layer can be affected. By controlling the mass ratio, the overall quality of the solder layer can be controlled. The better the quality, the higher the welding strength, the better the fatigue resistance, and the better the wettability in the subsequent welding process. This can improve the overall quality of the solder layer and ensure the performance after welding.

[0035] By controlling This can affect whether solder erosion occurs between the base layer, the anti-corrosion layer, and the solder layer, as well as the stability of the connection. Furthermore, considering the structural stability and heat dissipation efficiency of the entire heat sink device, it was found that... and There is a connection, specifically, if When the value is large, then The value needs to be small; if When the value is large, The value of needs to be small. Therefore, compared to controlling a single parameter, collaborative control can better optimize the final welding stability and heat transfer efficiency of the entire prefabricated solder assembly. It was found that the best effect is achieved when the above formula of this application is satisfied.

[0036] Specifically, The possible values ​​are 0.01, 0.08, 0.13, 0.17, 0.19, 0.26, 0.29, 0.3, 0.32, 0.34, 0.37, 0.73, 0.84, 1.11, 1.29, 1.35, 1.49, 1.95, 2.29, 2.6, 3.57, and 4.4; the preferred range of the relation is 0.26, 0.29, 1.29, 0.08, 0.37, 0.3, 0.26, 0.32, 0.19, 1.35, 1.95, and 0.73.

[0037] In one specific embodiment, the solder layer thickness ranges from 5 to 100 μm. Specifically, if the solder layer is too thin, it can lead to poor wettability, while if it is too thick, more solder is used, increasing costs and causing waste due to overflow during soldering. Furthermore, overflowing solder can form irregular structures, altering surface roughness or affecting heat flow paths, reducing heat dissipation efficiency. Excess solder also tends to shrink unevenly during cooling after soldering, introducing additional residual stress and affecting the final connection stability. Thirdly, solder overflow causing thickness variations may affect the flatness of subsequent device mounting, negatively impacting subsequent assembly tolerance control and positioning accuracy. Therefore, a solder layer thickness range of 5-100 μm balances ensuring good wettability while minimizing solder overflow during soldering to control costs, ensure connection stability, and facilitate subsequent assembly.

[0038] In one specific embodiment, the thickness of the solder layer ranges from 20 to 50 μm. Specifically, in order to better balance the wettability of the solder layer, better control costs, improve subsequent assembly accuracy, ensure connection stability, and better avoid solder overflow during the soldering process, the thickness of the solder layer ranges from 20 to 50 μm.

[0039] Furthermore, such as Figure 2As shown, the solder layer includes multiple sublayers; the materials in the sublayers include alternating stacks of tin 31, copper 32 and silver 33; specifically, the materials in the sublayers may also include alternating stacks of tin, silver and copper; or the materials in the sublayers may include alternating stacks of tin and silver; the number of sublayers includes 2-50 layers.

[0040] Specifically, to achieve better solder layer performance, this embodiment uses one or more sublayers (alternating stacked tin, copper, and silver, or alternating stacked tin and silver) to achieve more thorough mixing of different materials in the solder, resulting in better soldering performance after soldering. Specifically, fewer sublayers can be used, but each sublayer already contains uniformly stacked tin, copper, and silver, or alternating stacked tin and silver; a larger number of sublayers can also be used. However, with a larger number of sublayers, the thickness of each layer becomes thinner, leading to excessively high processing costs. Therefore, considering both mixing effect and processing cost, 2-50 layers can effectively achieve the overall performance of the solder layer. Preferably, 5-30 layers can achieve better overall performance, balancing mixing effect and processing cost.

[0041] Furthermore, the tin, copper, and silver in the solder layer satisfy the following relationships: 90≤K1≤99; 0≤K2≤2; 1≤K3≤6.

[0042] Specifically, the tin, copper, and silver in the solder layer satisfy the following relationships: 90≤K1≤99; 0≤K2≤2; 1≤K3≤6. This allows for better overall performance of the solder layer. In this scheme, the copper content in the solder can be zero, i.e., K2=0. However, the main role of copper in the solder is to suppress the excessive growth of β-Sn grains in tin, refine the microstructure, reduce stress concentration at the solder joint, and improve the tensile strength and fatigue resistance of the solder, especially under thermal cycling conditions. Copper enhances the solder's creep resistance at high temperatures through solid solution strengthening and the formation of fine IMC particles, preventing solder joint failure due to relaxation during long-term service. Furthermore, copper can reduce the interfacial tension between the molten alloy and the adjacent substrate to be soldered, improving the solder's spreading ability on the substrate. It can also reduce silver segregation. In Sn-Ag binary alloys, Ag tends to precipitate in the form of Ag3Sn plates, leading to uneven microstructure. The addition of copper can suppress the coarsening of Ag3Sn and promote the formation of a fine Ag3Sn+Cu6Sn5 eutectic structure, making the alloy structure more compact. Therefore, it is preferable that the copper content in the solder is not zero for better results.

[0043] Specifically, such as Figure 3As shown, the anti-corrosion layer includes a nickel layer 21. Specifically, the base layer is generally a copper layer or an aluminum alloy layer; however, both copper and aluminum alloy layers are relatively easy to be eroded by the solder layer. During the soldering process, active elements in the solder (such as tin, copper, and silver) easily react directly with the base metal to form a brittle intermetallic compound layer. This not only reduces the ductility of the interface and becomes a stress concentration area, reducing structural stability (e.g., structural embrittlement may occur), but also increases thermal resistance, resulting in poor heat dissipation. In this solution, a nickel layer is selected. Nickel has low solubility for the elements in the solder, meaning it is more resistant to corrosion. Therefore, it can effectively block or inhibit the solder layer from eroding the base layer, thereby improving the overall connection stability and ensuring the overall heat dissipation effect.

[0044] Specifically, based on the solder layer thickness, the nickel layer thickness on the anti-corrosion layer ranges from 1 to 20 μm. This thickness provides adequate anti-corrosion protection; too thin a layer will fail to prevent solder layer corrosion, while too thick a layer will result in redundant anti-corrosion capabilities, material waste, and reduced overall thermal conductivity. Furthermore, an excessively thick anti-corrosion layer can easily cause stress concentration during heat sink operation, especially between materials with different coefficients of thermal expansion, creating a significant thermal stress gradient that can induce interfacial microcracks or delamination, further weakening the bond between the solder layer and the substrate. Therefore, considering all factors, selecting a nickel layer within the aforementioned range balances the need for anti-corrosion capabilities with ensuring thermal conductivity and cost savings.

[0045] In another embodiment, such as Figure 3 As shown, it may also include: a first connecting layer 22 and a second connecting layer 23; the nickel layer, the first connecting layer, the second connecting layer and the solder layer are connected in sequence; The materials in the first connecting layer include one or more of titanium, chromium, nickel, and nickel-chromium alloys; The materials in the second bonding layer include one or more of the following: gold, silver, indium, zinc, and tin.

[0046] Specifically, by setting up the first and second connection layers, the nickel layer and the solder layer can be better connected, achieving a more stable connection between the solder layer and the nickel layer, thereby improving the overall connection stability.

[0047] Specifically, the thickness of the first bonding layer can range from 5 to 300 nm; the thickness of the second bonding layer can range from 50 to 500 nm. Besides bonding effectively between the nickel layer and the second bonding layer, the thermal conductivity of the first bonding layer is relatively low compared to the thermal conductivity of the second bonding layer and the solder layer. Therefore, if the thickness of the first bonding layer is too thin, the connection will be unstable. If the thickness of the first bonding layer is too thick, the bonding effect will not change significantly, nor will it significantly affect the stability of the structure, but it will reduce the thermal conductivity, thus affecting the overall heat dissipation performance. Within the aforementioned range, both connection stability and heat dissipation can be balanced. As for the second bonding layer, it can form an alloy layer with the tin layer in the solder layer during the soldering process, improving the bonding force between the solder layer and the first bonding layer. Therefore, if the thickness of the second bonding layer is too thin, its bonding force will be too weak, which is detrimental to the overall stability of the entire pre-fabricated solder assembly. If the second bonding layer is too thick, since the material used in the second bonding layer is mainly precious metal, excessive thickness will lead to excessively high costs. Based on this, selecting the aforementioned range allows the first and second bonding layers to balance connection stability, cost, and heat dissipation capabilities.

[0048] In one specific embodiment, the substrate layer includes a copper layer or an aluminum alloy layer.

[0049] Furthermore, the aluminum alloy layer selected in the base layer can be one or more of silicon carbide aluminum alloy, silicon aluminum alloy, and graphene-reinforced aluminum alloy. This balances the requirements of support performance, heat dissipation, and cost reduction.

[0050] Specifically, in addition to the side of the substrate facing the solder layer which has a nickel layer as an anti-corrosion layer, other sides of the substrate can also have nickel layers, that is, the substrate is wrapped in nickel layers. In this way, the nickel layers can better protect the substrate and prevent oxidation.

[0051] In one specific embodiment, the projection of the anti-corrosion layer onto the substrate is located within the substrate, and the projection of the solder layer onto the anti-corrosion layer is located within the anti-corrosion layer.

[0052] Specifically, by setting the positions of the base layer, anti-corrosion layer, and solder layer, welding stability can be better achieved in subsequent welding processes, thereby ensuring the performance of the welded product or device.

[0053] In a specific embodiment, such as Figure 4 As shown, the pre-fabricated solder assembly also includes a protective layer 4; a protective layer is provided on the side of the solder layer away from the transition layer to prevent oxidation of the solder layer.

[0054] The protective layer can better protect the solder layer, prevent its oxidation, and ensure the structural stability of the solder layer when subsequent soldering is required.

[0055] In one specific embodiment, the protective layer includes a gold layer and / or a silver layer.

[0056] By setting a gold and / or silver layer as a protective layer, the antioxidant properties of gold and silver can be effectively utilized to protect the solder layer and prevent it from oxidizing. Furthermore, the protective layer can participate in the soldering process together with the solder layer during subsequent soldering.

[0057] In one specific embodiment, the thickness of the protective layer ranges from 100 to 500 nm.

[0058] Specifically, in order to better protect the solder layer and prevent it from being oxidized, the thickness of the protective layer ranges from 100 to 500 nm.

[0059] Specifically, the preparation method of the pre-fabricated solder assembly is as follows: S1. Prepare a substrate layer, optionally, a copper layer is selected as the substrate layer; S2. A nickel layer is deposited on the surface of the copper layer, and the deposited nickel layer serves as an anti-corrosion layer; S3. After cleaning the substrate and the anti-corrosion layer, deposit a solder layer on the anti-corrosion layer; or after cleaning the substrate and the anti-corrosion layer, deposit the first bonding layer and the second bonding layer in sequence, and then deposit a solder layer on the second bonding layer. S4. Deposit a protective layer on the surface of the solder layer.

[0060] Optionally, in S2, the nickel layer can be deposited by electroplating. Optionally, in S3, the cleaning can be performed by plasma cleaning, and the first bonding layer can be deposited by magnetron sputtering or vapor deposition. Optionally, in S3, the second connecting layer can be deposited by magnetron sputtering or vapor deposition. Optionally, in S3, the solder layer can be deposited by magnetron sputtering or vapor deposition.

[0061] Secondly, according to a second aspect of the present invention, a heat sink device includes: the pre-fabricated solder assembly in Embodiment 1.

[0062] Specifically, the heat sink device in Embodiment 2 of the present invention can be a heat sink device with a laser chip.

[0063] According to a third aspect of the invention, an apparatus includes the pre-formed solder assembly as described in Embodiment 1. The apparatus may include semiconductor power devices such as IGBTs (Insulated-Gate Bipolar Transistors), AMB (Advanced Memory Buffer) chips, lasers, etc. In addition, the apparatus in this invention can be any semiconductor component requiring heat dissipation, and is not limited to the specific examples listed herein.

[0064] The present application is further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of the present application.

[0065] The lasers in Examples 1-24 and Comparative Examples 1-5 were all prepared according to the following method.

[0066] 1. Prepare the base layer and the anti-corrosion layer. Specifically, electroplating is used to deposit a nickel layer with a thickness of 1-20 micrometers on the copper layer that serves as the base layer (as an anti-corrosion layer). 2. Clean the base layer and anti-corrosion layer. Specifically, perform plasma cleaning on the nickel-plated copper layer for 6 minutes. 3. Deposit the first connecting layer: After cleaning, place the sample into a shielding fixture to deposit the first connecting layer. Specifically, the first connecting layer (e.g., a titanium layer with a thickness of 50 nm) can be deposited using magnetron sputtering. 4. Deposition of transition layer: After depositing the first connecting layer, the second connecting layer (e.g., a silver layer with a thickness of 100 nm) is deposited by sputtering. 5. Deposition of tin-silver-copper solder layer: Tin-silver-copper solder is deposited by vapor deposition, using Sn / Cu / Ag or Sn / Ag / Cu stacking method, and stacking is repeated a certain number of times. The mass ratio of tin, silver and copper is controlled by the thickness (the area of ​​each Sn / Cu / Ag or Sn / Ag / Cu layer is consistent).

[0067] 6. Deposition of protective layer: After the tin-silver-copper solder is deposited, a gold or silver layer of a certain thickness is deposited to obtain the pre-fabricated solder assembly; 7. Weld the pre-made solder assembly to the laser heat sink (the laser heat sink includes a laser chip, specifically the component used to emit laser light, with a rated power of 45W) to obtain the laser. Next, we will conduct performance testing: Test the reliability of the laser and its operating condition; Specifically, the reliability test includes: soldering the laser heat sink to the pre-fabricated solder assembly via eutectic reflow soldering, and then conducting a thermal shock test to evaluate the reliability of the soldering. The thermal shock test conditions are -50℃ (held for 15 minutes) to 150℃ (held for 15 minutes), with a temperature rise / fall rate of 3 degrees Celsius per minute; 200 cycles are performed to check for any detachment of the laser heat sink from the pre-fabricated solder assembly and for any delamination, which are used as the results of the reliability test.

[0068] As for the working condition, the laser was placed in a preset environment (room temperature around 20℃, relative humidity 40%-60%), and the laser chip was started to work at the rated power (power up to 45W, fluctuating by 0.5W). The time when the laser chip finally stopped working was taken as the cutoff point, and the duration of stable operation (i.e., continuous working time) during the test was obtained. This process was repeated 5 times, and the final duration obtained by averaging the stable operation durations was used as the indicator of the working condition.

[0069] Table 1: Parameters and test results of Examples 1-24 and Comparative Examples 1-5

[0070] Specifically, a passing test result means that there is no detachment or delamination between the laser heat sink and the pre-made solder assembly; a failing test result means that there is detachment or delamination between the laser heat sink and the pre-made solder assembly.

[0071] The laser prepared in this embodiment has excellent welding stability and stable operation, which can well meet the requirement of stable operation of laser chips for 1400 hours at rated power.

[0072] In the comparative example, compared with the embodiment, the parameters in the laser generated based on the comparative example do not meet the parameter relationship required to be protected in this solution. Even if each parameter meets its own parameter range, the welding stability in the final laser is not good, the stability test is unqualified, and the laser's operation is unstable. Under rated power, the stable operation time is greatly shortened, which cannot meet the long-term stable operation requirements of the laser.

[0073] Therefore, this invention provides a pre-fabricated solder assembly, which includes a substrate layer, an anti-corrosion layer, and a solder layer stacked together. The anti-corrosion layer is used to prevent the solder layer from corroding the substrate layer. The solder layer is made of tin, copper, and silver, and the mass percentages of tin, copper, and silver, based on the total mass of the solder layer as 100%, are K1%, K2%, and K3%, respectively. The mass ratio of tin, copper, and silver satisfies the following relationship: 98 < K1 + K2 + K3 ≤ 100. The thicknesses of the anti-corrosion layer and the solder layer are H1 μm and H2 μm, respectively. The substrate layer, the anti-corrosion layer, and the solder layer satisfy the following relationship: This solution uses prefabricated solder components with prefabricated solder layers, which effectively improves welding efficiency and ensures overall structural stability compared to existing technologies.

[0074] Those skilled in the art will understand that the accompanying drawings are merely schematic diagrams of a preferred embodiment, and the modules or processes shown in the drawings are not necessarily essential for implementing the present invention.

[0075] Those skilled in the art will understand that the modules in the apparatus of the implementation scenario can be distributed within the apparatus of the implementation scenario as described, or they can be located in one or more apparatuses different from this implementation scenario, with corresponding changes. The modules of the above-described implementation scenario can be combined into one module, or they can be further divided into multiple sub-modules.

[0076] The serial numbers of the present invention mentioned above are for descriptive purposes only and do not represent the superiority or inferiority of the implementation scenarios.

[0077] The above-disclosed examples are only a few specific implementation scenarios of the present invention. However, the present invention is not limited thereto, and any variations that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A prefabricated solder assembly, characterized in that, The system comprises a substrate layer, an anti-corrosion layer, and a solder layer stacked together. The solder layer is made of tin, copper, and silver, or of tin and silver. Based on the total mass of the solder layer (100%), the mass percentages of tin, copper, and silver are K1%, K2%, and K3, respectively. The mass ratio of tin, copper, and silver satisfies the following relationship: 98 < K1 + K2 + K3 ≤ 100. The thicknesses of the anti-corrosion layer and the solder layer are H1 μm and H2 μm, respectively. The substrate layer, the anti-corrosion layer, and the solder layer satisfy the following relationship: ; The projection of the anti-corrosion layer onto the substrate layer is located within the substrate layer, and the projection of the solder layer onto the anti-corrosion layer is located within the anti-corrosion layer; It also includes a protective layer; the protective layer is provided on the side of the solder layer away from the anti-corrosion layer to prevent the solder layer from oxidizing.

2. The pre-fabricated solder assembly as described in claim 1, characterized in that, The thickness of the solder layer ranges from 5 to 100 μm.

3. The pre-fabricated solder assembly as described in claim 2, characterized in that, The thickness of the solder layer ranges from 20 to 50 μm.

4. The pre-fabricated solder assembly as described in claim 1, characterized in that, The solder layer includes multiple sublayers; the material in the sublayers includes alternating stacks of tin, copper, and silver; or the material in the sublayers includes alternating stacks of tin and silver. The number of sub-layers ranges from 2 to 50.

5. The prefabricated solder assembly as described in any one of claims 1-4, characterized in that, The tin, copper, and silver in the solder layer satisfy the following relationships: 90≤K1≤99; 0≤K2≤2; 1≤K3≤6.

6. The pre-fabricated solder assembly as claimed in claim 1, characterized in that, The corrosion-resistant layer includes a nickel layer.

7. The pre-fabricated solder assembly as described in claim 6, characterized in that, The thickness of the nickel layer in the corrosion-resistant layer ranges from 1 to 20 μm.

8. The pre-fabricated solder assembly as described in claim 6, characterized in that, It also includes: a first connection layer and a second connection layer; the nickel layer, the first connection layer, the second connection layer and the solder layer are stacked; The material in the first connecting layer includes one or more of titanium, chromium, nickel, and nickel-chromium alloys; The material in the second connecting layer includes one or more of gold, silver, indium, zinc, and tin.

9. The pre-fabricated solder assembly as claimed in claim 1, characterized in that, The base layer includes a copper layer or an aluminum alloy layer.

10. The pre-fabricated solder assembly as claimed in claim 9, characterized in that, The material of the aluminum alloy layer in the substrate includes one or more of silicon carbide aluminum alloy, silicon aluminum alloy, and graphene-reinforced aluminum alloy.

11. The pre-fabricated solder assembly as claimed in claim 1, characterized in that, The protective layer includes a gold layer and / or a silver layer.

12. The pre-fabricated solder assembly as claimed in claim 1 or 11, characterized in that, The thickness of the protective layer ranges from 20 to 500 nm.

13. A heat sink device, characterized in that, include: The prefabricated solder assembly according to any one of claims 1-12.

14. A semiconductor component, characterized in that, include: The prefabricated solder assembly according to any one of claims 1-12.

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