Display panel and preparation method thereof

Abstract

This application belongs to the field of display technology, specifically relating to display panels and their manufacturing methods. The display panel includes a driving backplane, an emissive layer, and a light-shielding unit. The emissive layer is disposed on the driving backplane and includes multiple light-emitting devices. The light-shielding unit is disposed on the side of the emissive layer away from the driving backplane, with its orthographic projection on the driving backplane located between adjacent light-emitting devices. It includes a reflective structure and a light-shielding layer arranged sequentially along a direction away from the emissive layer. The reflective structure includes a reflective cavity and reflective surfaces inclined towards the light-emitting devices on both sides, with the reflective cavity located on the side of the reflective surface away from the emissive layer. The reflective surface reflects part of the light emitted by the light-emitting devices back to the emissive layer, while another part is transmitted into the reflective cavity; the reflective cavity reflects the light multiple times, with some light passing through the reflective surface and then striking the emissive layer again, and the other part escaping after multiple reflections. This application redirects the blocked light to the light-emitting side through multiple reflections, improving light extraction efficiency and increasing the light extraction angle.

Description

Technical Field

[0001] This application belongs to the field of display technology, specifically relating to a display panel and its manufacturing method. Background Technology

[0002] Currently, organic light-emitting diode (OLED) display panels commonly employ a COE (Color Filter On Encapsulation) structure, where color filters are directly fabricated on a thin-film encapsulation layer to replace polarizers, thereby improving light extraction efficiency and reducing ambient light reflection. This structure typically includes a black matrix and color photoresist, where the black matrix is ​​located between adjacent sub-pixels to block ambient light and prevent crosstalk between adjacent sub-pixels.

[0003] However, the black matrix in the COE structure of related technologies only has a light-blocking function. When the light emitted by the organic light-emitting diodes shines on the black matrix area, it will be absorbed and lost, resulting in reduced light emission efficiency. It also limits the light emission angle and affects the viewing angle performance of the display panel. Summary of the Invention

[0004] The purpose of this application is to provide a display panel and a method for manufacturing the same, which can improve the light extraction efficiency and light extraction angle of the display panel.

[0005] A first aspect of this application provides a display panel, comprising: a driving backplate; a light-emitting layer disposed on the driving backplate, the light-emitting layer including a plurality of light-emitting devices; and a light-shielding unit disposed on the side of the light-emitting layer away from the driving backplate, wherein the orthographic projection of the light-shielding unit on the driving backplate is located between adjacent light-emitting devices, the light-shielding unit including a reflective structure and a light-shielding layer sequentially arranged along a direction away from the light-emitting layer, the reflective structure including a reflective cavity and reflective surfaces respectively inclined toward the light-emitting devices on both sides, the reflective cavity being located on the side of the reflective surface away from the light-emitting layer; wherein the reflective surface is used to reflect part of the light emitted by the corresponding light-emitting device back to the light-emitting layer, and another part of the light is transmitted into the reflective cavity, the reflective cavity is used to reflect the light entering its interior multiple times, wherein a part of the light is transmitted through the reflective surface during the reflection process and then shines again toward the light-emitting layer, and another part of the light is emitted out of the display panel after multiple reflections.

[0006] In one exemplary embodiment of this application, the reflective structure includes a semi-reflective layer, a protrusion is formed on the side of the semi-reflective layer near the light-emitting layer, the protrusion is provided with the reflective surface, the reflective surface is an inclined surface, and an acute angle is formed between the reflective surface and the plane where the driving back plate is located.

[0007] In one exemplary embodiment of this application, the display panel further includes an encapsulation layer disposed between the light-emitting layer and the light-shielding unit, the encapsulation layer including a second inorganic encapsulation layer, and the protrusion being embedded in the second inorganic encapsulation layer.

[0008] In one exemplary embodiment of this application, the reflective structure further includes a transparent filling layer and a reflective layer disposed between the semi-reflective layer and the light-shielding layer. The reflective layer is disposed on the side of the transparent filling layer away from the semi-reflective layer, and two independent reflective cavities are formed between the reflective layer and the semi-reflective layer. The two reflective cavities are respectively disposed on the reflective surfaces on both sides.

[0009] In an exemplary embodiment of this application, the transparent filling layer is provided with a groove, and the width of the groove gradually decreases in the direction pointing towards the driving back plate in a direction perpendicular to the driving back plate; a portion of the reflective layer is disposed in the groove and connected to the side of the semi-reflective layer opposite to the light-emitting layer, so as to divide the reflective cavity into two independent reflective cavities.

[0010] A second aspect of this application provides a display panel, comprising: a driving backplate; a light-emitting layer disposed on the driving backplate, the light-emitting layer including a light-emitting device and an anode, the light-emitting device being disposed on the side of the anode away from the driving backplate, and the anode being connected to the driving backplate; a light-shielding unit disposed on the side of the light-emitting layer away from the driving backplate, the light-shielding unit including a reflective layer and a light-shielding layer sequentially disposed along a direction away from the light-emitting layer; and a reflective barrier disposed between adjacent light-emitting devices and extending along a direction away from the driving backplate, the reflective barrier being located between the light-shielding unit and the driving backplate, and being disposed opposite to the light-shielding unit; wherein, the side of the reflective layer facing the light-emitting layer is used to reflect light emitted by the corresponding light-emitting device to the reflective barrier, the reflective barrier is used to reflect light back to the anode, and the anode is used to reflect light again towards the light-emitting side.

[0011] In one exemplary embodiment of this application, the display panel further includes: a pixel definition layer disposed on the driving backplate and covering a portion of the anode to define the light-emitting area of ​​each of the light-emitting devices; an encapsulation layer covering the light-emitting devices and the pixel definition layer, the encapsulation layer including a first inorganic encapsulation layer, an organic encapsulation layer located on the first inorganic encapsulation layer, and a second inorganic encapsulation layer located on the organic encapsulation layer; the reflective barrier includes a first segment and a second segment, the first segment being disposed within the pixel definition layer, the anode being spaced apart from the first segment, the second segment being disposed within the organic encapsulation layer, and one end of the second segment contacting the first inorganic encapsulation layer and the other end contacting the second inorganic encapsulation layer.

[0012] In an exemplary embodiment of this application, the light-shielding unit further includes a transparent filling layer disposed between the reflective layer and the second inorganic encapsulation layer; the transparent filling layer has a groove along a direction perpendicular to the driving backplate, and the width of the groove gradually decreases along the direction pointing to the driving backplate; a portion of the reflective layer is disposed in the groove and connected to the side of the second inorganic encapsulation layer opposite to the light-emitting layer, so as to form two independent reflective structures on the second inorganic encapsulation layer.

[0013] A third aspect of this application provides a method for manufacturing a display panel, comprising: providing a driving backplate and forming a light-emitting layer on the driving backplate, the light-emitting layer including a plurality of light-emitting devices; forming an encapsulation layer on the light-emitting layer, the encapsulation layer including a second inorganic encapsulation layer; forming a photoresist layer on the second inorganic encapsulation layer, forming a pattern complementary to the inclined surface on the second inorganic encapsulation layer by a patterning process, and removing the photoresist layer; forming a semi-reflective layer on the patterned second inorganic encapsulation layer, the semi-reflective layer covering the pattern to form a protrusion, the protrusion having reflective surfaces inclined toward the light-emitting devices on both sides respectively; forming a transparent filler layer on the semi-reflective layer, forming a groove on the transparent filler layer by a patterning process, the width of the groove gradually decreasing in the direction pointing toward the driving backplate in a direction perpendicular to the driving backplate; forming a reflective layer on the transparent filler layer, the reflective layer covering the inner wall of the groove and connected to the semi-reflective layer; and forming a light-shielding layer on the reflective layer.

[0014] A fourth aspect of this application provides a method for manufacturing a display panel, comprising: providing a driving backplate; forming an anode on the driving backplate; forming a pixel definition layer on the driving backplate and the anode, and forming a first gap in the pixel definition layer by a patterning process; forming a first segment of a reflective barrier within the first gap; forming a light-emitting device within an opening area defined by the pixel definition layer; forming a first inorganic encapsulation layer on the light-emitting device, the pixel definition layer, and the first segment of the reflective barrier; forming an organic encapsulation layer on the first inorganic encapsulation layer, and forming an organic encapsulation layer corresponding to the first segment of the reflective barrier by a patterning process. A second gap is formed at the location of the first inorganic encapsulation layer, the bottom of which exposes a portion of the first inorganic encapsulation layer; a second section of the reflective barrier is formed within the second gap; a second inorganic encapsulation layer is formed on the organic encapsulation layer and the second section of the reflective barrier; a transparent filler layer is formed on the second inorganic encapsulation layer, and a groove is formed on the transparent filler layer using a patterning process; the width of the groove gradually decreases in the direction pointing towards the drive backplate in a direction perpendicular to the drive backplate; a reflective layer is formed on the transparent filler layer, the reflective layer covering the inner wall of the groove; and a light-shielding layer is formed on the reflective layer.

[0015] The display panel and its manufacturing method described in this application have at least the following beneficial effects:

[0016] The display panel and its manufacturing method provided in this application replace the black matrix in related technologies with a light-shielding unit. On the one hand, the reflective surface in the light-shielding unit is tilted towards the light-emitting device, and the reflective cavity is located on the side of the reflective surface away from the light-emitting layer. This allows some of the light emitted by the light-emitting device to be directly reflected back to the light-emitting layer for reuse when it hits the reflective surface, while the other part of the light is transmitted into the reflective cavity and, after multiple reflections within the cavity, is reflected back to the light-emitting layer. This redirects the light originally blocked by the light-shielding unit to the light-emitting side, effectively improving the light extraction efficiency. Simultaneously, because the light undergoes multiple reflections within the reflective cavity before exiting, its exit angle is larger than that of light directly incident on the black matrix, thereby increasing the viewing angle of the display panel. On the other hand, the side of the reflective layer in the light-shielding unit facing the light-emitting device reflects the light to a reflective barrier, which reflects the light back to the anode. The anode then reflects the light back to the light-emitting side, again achieving multiple reflections and utilization of the originally blocked light, improving the light extraction efficiency. Furthermore, the light path conversion between the reflective barrier and the anode increases the light extraction angle, improving the viewing angle performance of the display panel.

[0017] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.

[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0020] Figure 1 A cross-sectional structural diagram of a display panel is shown.

[0021] Figure 2 A schematic diagram of a method for displaying a panel is shown.

[0022] Figure 3 A schematic diagram of the structural process of a display panel is shown.

[0023] Figure 4 A cross-sectional structural diagram of another display panel is shown.

[0024] Figure 5 A top view of the structure is shown, indicating that the anode is located within the reflective barrier.

[0025] Figure 6 A cross-sectional schematic diagram is shown, showing a semi-reflective layer located beneath a transparent filler layer.

[0026] Figure 7 A schematic diagram of another method for displaying a panel is shown.

[0027] Figure 8 A schematic diagram of the structural process of another display panel is shown.

[0028] Explanation of reference numerals in the attached figures:

[0029] 100. Display panel; 110. Driver backplane; 120. Light-emitting layer; 121. Anode; 122. Light-emitting device; 130. Encapsulation layer; 131. First inorganic encapsulation layer; 132. Organic encapsulation layer; 133. Second inorganic encapsulation layer; 140. Light-shielding unit; 141. Semi-reflective layer; 1411. Protrusion; 14111. Reflective surface; 142. Transparent filling layer; 1421. Groove; 143. Reflective layer; 1431. Reflective wall; 144. Light-shielding layer; 145. Reflective cavity; 150. Reflective barrier; 151. First segment; 152. Second segment; 160. Pixel definition layer; 170. First gap; 180. Second gap; 190. Color photoresist. Detailed Implementation

[0030] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0031] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0032] In this application, unless otherwise expressly specified and limited, the terms "assembly," "connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0033] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0034] Example 1

[0035] This embodiment provides a display panel 100, which adopts a COE (Color filter on Encapsulation) structure, which can improve light emission efficiency and light emission angle by utilizing the principle of multiple reflections.

[0036] See Figure 1 As shown, the display panel 100 in this embodiment may include a driving backplate 110, a light-emitting layer 120, an encapsulation layer 130, and a light-shielding unit 140.

[0037] The driving backplane 110 can be a TFT (thin-film transistor) backplane made of materials such as amorphous silicon, IGZO (indium gallium zinc oxide), or polycrystalline silicon. It integrates pixel driving circuitry, including multiple transistors such as driving transistors and switching transistors, as well as storage capacitors, for controlling the light-emitting state of each light-emitting device 122. The structure and working principle of the driving backplane 110 can be implemented with reference to relevant technologies, and will not be elaborated here.

[0038] A light-emitting layer 120 is disposed on a driving backplate 110, and may include an anode 121, a light-emitting device 122, and a cathode (not shown in the figure). The anode 121, disposed on the driving backplate 110, is a reflective electrode (such as an ITO / Ag / ITO composite structure) used to reflect the light emitted by the light-emitting device 122 towards the light-emitting side. The light-emitting device 122, disposed on the anode 121, may include a hole injection layer, a hole transport layer, a light-emitting material layer, an electron transport layer, and an electron injection layer. Different colors of the light-emitting device 122 correspond to different light-emitting materials and are the core component that actually generates light. The cathode, disposed on the light-emitting device 122, may be a semi-transparent electrode (such as a Mg:Ag alloy) used for electron injection and allows some light to pass through.

[0039] The multiple light-emitting devices 122 may include red, green, and blue light-emitting devices to achieve color display. The various light-emitting devices 122 are isolated from each other by a pixel definition layer 160 (PDL). The pixel definition layer 160 is disposed on the driving backplate 110 and covers part of the anode 121, and is used to define the light-emitting area of ​​each light-emitting device 122.

[0040] The encapsulation layer 130 is disposed on the side of the light-emitting layer 120 away from the driving backplate 110, and is used to protect the light-emitting device 122 from water and oxygen corrosion. The encapsulation layer 130 may adopt a thin-film encapsulation (TFE) structure, including at least one inorganic encapsulation layer 130 and at least one organic encapsulation layer 132.

[0041] For example, see Figure 1 As shown, the encapsulation layer 130 may include a first inorganic encapsulation layer 131, an organic encapsulation layer 132, and a second inorganic encapsulation layer 133 arranged sequentially. The first inorganic encapsulation layer 131 covers the cathode to prevent water and oxygen from entering; the organic encapsulation layer 132 is disposed on the first inorganic encapsulation layer 131 to planarize the surface and release stress; the second inorganic encapsulation layer 133 is disposed on the organic encapsulation layer 132 as the outermost layer of the encapsulation layer 130 and is adjacent to the light-shielding unit 140 formed subsequently.

[0042] The inorganic encapsulation layer 130 can be formed by chemical vapor deposition using materials such as silicon nitride and silicon oxide, while the organic encapsulation layer 132 can be formed by inkjet printing or coating using materials such as acrylic resin.

[0043] See Figure 1As shown, the light-shielding unit 140 is disposed on the side of the encapsulation layer 130 opposite to the light-emitting layer 120, and the orthographic projection of the light-shielding unit 140 on the driving backplate 110 is located between adjacent light-emitting devices 122. The light-shielding unit 140 may include a reflective structure (not shown in the figure) and a light-shielding layer 144 arranged sequentially along the direction away from the light-emitting layer 120. The reflective structure is used to reflect and reuse light, and the light-shielding layer 144 is used to absorb ambient light and reduce ambient light reflection.

[0044] In some embodiments, see Figure 1 As shown, the reflective structure may include a semi-reflective layer 141. The semi-reflective layer 141 is disposed close to the light-emitting layer 120. The semi-reflective layer 141 may be made of a highly reflective metallic material (such as Mg or Ag) with a thickness of 1 nm to 20 nm. Due to its thinness, it exhibits a semi-transparent and semi-reflective characteristic, that is, it allows some light to pass through while reflecting other light.

[0045] Understandably, the thickness of the semi-reflective layer 141 can be adjusted according to actual needs. The thinner the layer, the higher the light transmittance and the lower the reflectivity, and vice versa.

[0046] See Figure 1 As shown, a protrusion 1411 is formed on the side of the semi-reflective layer 141 near the light-emitting layer 120. This protrusion 1411 is embedded within the second inorganic encapsulation layer 133 of the encapsulation layer 130, and reflective surfaces 14111 are formed on the protrusion 1411, each inclined towards the light-emitting devices 122 on both sides. The reflective surface 14111 is inclined and forms an acute angle with the plane of the driving backplate 110, for example, 45° to 85°, so that the reflective surface 14111 can reflect part of the light emitted by the light-emitting device 122 back to the direction of the light-emitting device 122.

[0047] It should be noted that the shape of the protrusion 1411 can be designed according to actual needs. For example, the protrusion 1411 can be set as a single inclined surface structure or as multiple stepped inclined surface structures. When multiple stepped inclined surface structures are used, the angle between the inclined surface near the driving backplate 110 and the plane where the driving backplate 110 is located can be set to a larger angle (e.g., 65° to 85°), and the angle between the inclined surface away from the driving backplate 110 and the plane where the driving backplate 110 is located can be set to a smaller angle (e.g., 45° to 65°), thereby forming a multi-level reflection structure. This multi-level reflection structure allows light to be reflected multiple times at inclined surfaces of different heights, further improving the light reflection efficiency and utilization rate. The specific shape of the protrusion 1411 can be achieved by adjusting the pattern of the mask in the photolithography process.

[0048] Furthermore, this embedded structure has several advantages. First, the protrusion 1411 is embedded within the second inorganic encapsulation layer 133, allowing the reflective surface 14111 to be closer to the light-emitting device 122. This shortens the propagation path of light from the light-emitting device 122 to the reflective surface 14111, reducing energy loss during propagation. Simultaneously, the reflective surface 14111 can more effectively capture the light emitted laterally from the light-emitting device 122, guiding it into the reflective cavity 145 or directly reflecting it back to the anode 121, thereby significantly improving light utilization and light extraction efficiency. Second, the protrusion 1411 is embedded within the second inorganic encapsulation layer 133, utilizing the thickness of the encapsulation layer 130 itself. This eliminates the need to increase the thickness of the light-shielding unit 140 to form the reflective surface 14111 structure, helping to reduce the overall thickness of the display panel 100 and meeting the design requirements for a thinner and lighter display panel 100. Furthermore, the tight fit between the protrusion 1411 and the second inorganic encapsulation layer 133 enhances the bonding force between the light-shielding unit 140 and the encapsulation layer 130, improves the adhesion between the film layers, and helps to improve the reliability and stability of the display panel 100.

[0049] In some embodiments, see Figure 1 As shown, the reflective structure may further include a transparent filler layer 142. The transparent filler layer 142 is disposed on the side of the semi-reflective layer 141 facing away from the light-emitting layer 120. The transparent filler layer 142 can be made of a transparent organic material (such as acrylic resin or PI resin), and it has two functions: first, it serves as a space for light reflection, increasing the distance between the semi-reflective layer 141 and the reflective layer 143, providing sufficient reflection path for light; second, it increases the thickness of the composite light-shielding unit 140, making it the same height as the colored photoresist 190, improving the flatness of the panel, and facilitating the formation of subsequent film layers.

[0050] Understandably, the thickness of the transparent filler layer 142 can be adjusted according to actual needs; for example, the thickness of the transparent filler layer 142 can be from 1 μm to 5 μm.

[0051] See Figure 3 As shown, a groove 1421 is provided on the transparent filler layer 142. In the direction perpendicular to the driving backplate 110, the width of the groove 1421 gradually decreases in the direction pointing towards the driving backplate 110, that is, the cross-section of the groove 1421 is an inverted triangle or an inverted trapezoid. The groove 1421 can be formed by photolithography, and it can be located at the midline position between adjacent light-emitting devices 122 to divide the transparent filler layer 142 into two independent parts corresponding to the light-emitting devices 122 on both sides.

[0052] The depth of the groove 1421 can be set to be similar to the thickness of the transparent filler layer 142, or it can be set to a partial depth, as long as sufficient reflection space is formed. In addition, the sidewalls of the groove 1421 can also be set in a multi-step shape to further enhance the light reflection effect.

[0053] In some embodiments, see Figure 1 As shown, the reflective structure may further include a reflective layer 143. The reflective layer 143 can be disposed on the side of the transparent filling layer 142 opposite to the semi-reflective layer 141. The reflective layer 143 can be made of a highly reflective metallic material (such as silver Ag or magnesium Mg), with a thickness of 100nm to 1000nm, exhibiting high reflectivity. A portion of the reflective layer 143 is disposed within the groove 1421 of the transparent filling layer 142 and connected to the side of the semi-reflective layer 141 opposite to the light-emitting layer 120. With this structure, two independent reflective cavities 145 are formed between the semi-reflective layer 141 and the reflective layer 143, with the two reflective cavities 145 respectively corresponding to the reflective surfaces 14111 on both sides. The reflective layer 143 covers a portion of the inner wall of the groove 1421, forming a reflective wall 1431 between adjacent sub-pixels. That is, the reflective cavity 145 is formed by the semi-reflective layer 141, the reflective wall 1431, and the reflective layer 143, allowing light to undergo multiple reflections within the reflective cavity 145.

[0054] Understandably, the thickness of the reflective layer 143 can be adjusted according to actual needs. The thicker the layer, the higher the reflectivity, but this will also increase the panel thickness.

[0055] In other embodiments, the side of the reflective layer 143 near the transparent filler layer 142 can be a plane or other structures capable of reflecting light. For example, this side can be configured as a microstructured surface (such as a microprism, microlens array, or sawtooth structure) to further control the reflection angle and direction of light, enabling the light to undergo multiple reflections more efficiently within the reflective cavity, thereby improving light extraction efficiency. It should be noted that different reflective surface structures can be selected according to actual optical design requirements to achieve optimal light extraction effect and viewing angle performance. In addition, the side of the reflective layer near the transparent filler layer can also be configured as a curved surface structure matching the semi-reflective layer to optimize the convergence or divergence characteristics of light and further improve the optical performance of the display panel.

[0056] See Figure 1As shown, the light-shielding layer 144 is disposed on the side of the reflective layer 143 opposite to the light-emitting layer 120. The light-shielding layer 144 can be made of black organic acrylic resin material, formed after photolithography patterning, and only covers the area between adjacent sub-pixels of the reflective layer 143. It is used to absorb ambient light, reduce the reflectivity of the display panel 100 to ambient light, and ensure the blackness of the display panel 100 in the off or dark state. The light-shielding layer 144 is not disposed in the pixel opening area (the location of the color photoresist 190) to ensure that light can be emitted normally. The thickness of the light-shielding layer 144 can be adjusted according to actual needs, and is generally set to 1μm to 3μm.

[0057] See Figure 1 As shown, the display panel 100 in this embodiment utilizes multiple reflections of light through the above structure, and the specific light path is as follows:

[0058] When the light emitted by the light-emitting device 122 strikes the light-shielding unit 140, it first reaches the reflective surface 14111 on the semi-reflective layer 141. Since the reflective surface 14111 is tilted towards the light-emitting device 122 and forms an acute angle with the plane of the driving backplate 110, a portion of the light is directly reflected back to the light-emitting device 122 when it strikes the reflective surface 14111. After returning to the light-emitting device 122, this portion of light is reflected again towards the light-emitting side via the anode 121, achieving the first reuse of the light and effectively improving the light utilization rate.

[0059] Another portion of the light passes through the semi-reflective layer 141 and enters the reflective cavity 145, which is composed of the semi-reflective layer 141, the reflective wall 1431, and the reflective layer 143. The reflective cavity 145 is located on the side of the reflective surface 14111 facing away from the light-emitting layer 120, and its internal space is provided by the transparent filling layer 142. After entering the reflective cavity 145, the light undergoes multiple reflections between the semi-reflective layer 141 and the reflective layer 143. During these multiple reflections, some of the light passes through the semi-reflective layer 141 again and returns to the direction of the light-emitting device 122. After returning to the light-emitting device 122, this portion of the light is reflected again by the anode 121 towards the light-emitting side, thus achieving the reuse of the light. At the same time, another portion of the light, after undergoing multiple reflections within the reflective cavity 145, can finally exit the panel from the sub-pixel opening area (color photoresist 190). Because the light has undergone multiple reflections, its exit angle is larger than that of the light directly incident on the black matrix in the related technology, thereby increasing the viewing angle of the display panel 100 and improving the display effect. With this structure, light is reflected multiple times within the reflective cavity 145 and passes through the semi-reflective layer 141 multiple times back to the direction of the light-emitting device 122, realizing the repeated use of light and significantly improving the light extraction efficiency.

[0060] Meanwhile, the reflective layer 143 covers the reflective wall 1431 formed by the inner wall of the groove 1421 of the transparent filling layer 142, further enhancing the reflection efficiency of light within the reflective cavity 145. The height and tilt angle of the reflective wall 1431 can be optimized as needed to create a more efficient reflection path for light within the reflective cavity 145. Furthermore, the reflective wall 1431 can also reflect some of the light originally directed towards adjacent sub-pixels back to its own pixel area, preventing crosstalk.

[0061] Through the above structure, this embodiment transforms the black matrix, which only has a light-shielding function, into a composite structure that has both light-shielding and light-guiding functions. The light that was originally blocked and lost is guided back to the light-emitting side through multiple reflections, which significantly improves the light emission efficiency of the display panel 100. At the same time, it increases the light emission angle and improves the viewing angle performance of the display panel 100.

[0062] See Figure 2 and Figure 3 As shown, this application embodiment also provides a method for manufacturing a display panel 100, which includes the following steps:

[0063] Step S101: Provide a driving backplate 110 and form a light-emitting layer 120 on the driving backplate 110.

[0064] The backplane 110 can be fabricated using conventional TFT processes, including forming a semiconductor layer, a gate conductive layer, a capacitor electrode layer, a first conductive layer, and a second conductive layer on a substrate. An insulating layer is provided between each pair of adjacent conductive film layers, and the two conductive film layers that need to be coupled are coupled to each other through vias that penetrate the corresponding insulating layers.

[0065] The fabrication of the light-emitting layer 120 includes: firstly, forming an anode 121 on the driving backplate 110, forming a highly reflective metal layer by sputtering or evaporation, and then patterning the anode 121 by photolithography; then forming a pixel definition layer 160 on the anode 121, forming an organic insulating material by coating, and then forming an opening region by photolithography to expose a portion of the anode 121; next, forming a light-emitting device 122 in the opening region, and depositing red, green, and blue organic light-emitting functional layers by evaporation using a fine metal mask; finally, forming a cathode on the entire surface of the light-emitting device 122 and the pixel definition layer 160, and depositing cathode material by evaporation to form a complete light-emitting layer 120.

[0066] Step S102: An encapsulation layer 130 is formed on the light-emitting layer 120.

[0067] The encapsulation layer 130 employs a thin-film encapsulation process, which may include: firstly, forming a first inorganic encapsulation layer 131 using chemical vapor deposition to cover the cathode and pixel definition layer 160; then forming an organic encapsulation layer 132 using inkjet printing or coating to planarize the surface and release stress; and finally forming a second inorganic encapsulation layer 133 using chemical vapor deposition as the outermost layer of the encapsulation layer 130. The first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 133 may be made of materials such as silicon nitride and silicon oxide, and the organic encapsulation layer 132 may be made of materials such as acrylic resin.

[0068] Step S103: A pattern complementary to the bevel is formed on the second inorganic encapsulation layer 133.

[0069] A photoresist layer is coated on the second inorganic packaging layer 133. A pattern complementary to the bevel is formed on the second inorganic packaging layer 133 using patterning processes (such as photolithography and etching), and then the photoresist layer is removed. This pattern provides a mold for the protrusion 1411 of the subsequent semi-reflective layer 141. This pattern can be formed in one step using a half-tone mask (HTM) process, or it can be fabricated in two separate layers to form a multi-level stepped structure.

[0070] Step S104: Form a semi-reflective layer 141.

[0071] A semi-reflective layer 141 is formed on the patterned second inorganic encapsulation layer 133. Metal materials such as magnesium (Mg) and silver (Ag) are deposited using physical vapor deposition (PVD) or evaporation, with a thickness controlled between 1 nm and 20 nm. The semi-reflective layer 141 naturally forms protrusions 1411 following the pattern on the second inorganic encapsulation layer 133. Reflective surfaces 14111 are formed on the protrusions 1411, each inclined towards the light-emitting devices 122 on both sides.

[0072] Understandably, the tilt angle and surface roughness of the reflective surface 14111 can be adjusted by controlling the deposition rate and temperature to obtain the best reflection effect.

[0073] Step S105: A transparent filling layer 142 is formed and a groove 1421 is formed.

[0074] A transparent filler layer 142 is formed on the semi-reflective layer 141. A transparent organic material (such as acrylic resin or polyimide PI resin) is formed by coating, with a thickness controlled between 1 μm and 5 μm. A groove 1421 is formed on the transparent filler layer 142 at the midline position corresponding to the adjacent light-emitting device 122 using a patterning process (such as photolithography). In the direction perpendicular to the driving backplate 110, the width of the groove 1421 gradually decreases in the direction pointing towards the driving backplate 110, that is, forming an inverted triangular or inverted trapezoidal cross section.

[0075] It is worth mentioning that the depth and sidewall angle of the groove 1421 can be controlled by adjusting the exposure and development conditions of the photolithography.

[0076] Step S106: Forming the reflective layer 143.

[0077] A reflective layer 143 is formed on the transparent filler layer 142. Metal materials such as silver (Ag) and magnesium (Mg) are deposited using physical vapor deposition (PVD) or evaporation, with a thickness controlled between 100 nm and 1000 nm. The reflective layer 143 covers the surface of the transparent filler layer 142 and the inner wall of the groove 1421, and connects with the semi-reflective layer 141 at the bottom of the groove 1421, thereby dividing the space between the semi-reflective layer 141 and the reflective layer 143 into two independent reflective cavities 145.

[0078] It is worth mentioning that the reflectivity and surface smoothness of the reflective layer 143 can be adjusted by controlling the deposition rate and thickness.

[0079] Step S107: Forming a light-shielding layer 144.

[0080] A light-shielding layer 144 is formed on the reflective layer 143. A black organic acrylic resin material is formed by coating, and after photolithography patterning, the desired light-shielding layer 144 pattern is formed. This layer only covers the area between adjacent sub-pixels of the reflective layer 143, absorbing ambient light and reducing the reflectivity of the display panel 100 to ambient light, thus ensuring the blackness of the display panel 100 in off-screen or dark states. No light-shielding layer 144 is provided in the pixel opening area (where the color photoresist 190 is located) to ensure that light can be emitted normally. The thickness of the light-shielding layer 144 can be adjusted according to actual needs, generally set to 1μm to 3μm.

[0081] After the light-shielding layer 144 is fabricated, colored photoresist 190 is formed between adjacent light-shielding units 140. For example, red, green, and blue photoresist are sequentially formed in the opening area between the light-shielding units 140. Red, green, and blue photoresist materials are coated using a coating method, and after photolithography patterning, the desired color resist block pattern is formed. Each color resist block corresponds to the position of the corresponding light-emitting device 122. The colored photoresist 190 is used to filter the light emitted by the light-emitting device 122 to achieve color display. The thickness of the colored photoresist 190 can be matched with the height of the light-shielding unit 140 to ensure the flatness of the display panel 100 surface.

[0082] By following the steps described above, a display panel 100 with a composite light-shielding unit 140 can be fabricated. In practice, planarization layers, protective layers, and other functional film layers can be added between the layers as needed to further improve the performance and reliability of the display panel 100.

[0083] Example 2

[0084] See Figure 4 As shown, this embodiment 2 provides another display panel 100. The display panel 100 adopts a different optical path design than that of embodiment 1. Through the cooperation of the reflective layer 143, the reflective barrier 150 and the anode 121, multiple reflections of light are utilized, which also achieves the purpose of improving light output efficiency and light output angle.

[0085] See Figure 4 As shown, the display panel 100 in this embodiment includes a driving backplate 110, an emissive layer 120, a pixel definition layer 160, an encapsulation layer 130, a light-shielding unit 140, and a reflective barrier 150.

[0086] The driving backplate 110 is similar to that in Embodiment 1, serving as the supporting substrate for the entire display panel 100, and will not be described in detail here.

[0087] See Figure 4 and Figure 5 As shown, the light-emitting layer 120 is disposed on the driving backplate 110. The light-emitting layer 120 includes an anode 121, a light-emitting device 122, and a cathode. The anode 121 is made of a highly reflective material (such as an ITO / Ag / ITO composite structure), and its area is larger than that of the anode 121 in Embodiment 1, extending to near the middle of the adjacent light-emitting device 122, providing a basis for subsequent cooperation with the reflective barrier 150 to form a reflective cavity 145.

[0088] It is worth mentioning that the area of ​​the anode 121 can be adjusted according to actual needs. A larger area results in better reflection, but it also increases parasitic capacitance, requiring a balance based on the panel's charging rate and power consumption requirements. The light-emitting device 122 is disposed on the anode 121 and includes a hole injection layer, a hole transport layer, a light-emitting material layer, an electron transport layer, and an electron injection layer. The cathode is disposed on the light-emitting device 122 and is typically a semi-transparent electrode.

[0089] A pixel definition layer 160 is disposed on the driving backplane 110 and covers a portion of the anode 121, defining the light-emitting area of ​​each light-emitting device 122. The pixel definition layer 160 can be made of a transparent organic insulating material, with an opening formed by photolithography to expose a portion of the anode 121. The thickness of the pixel definition layer 160 can be adjusted according to actual needs, for example, from 1 μm to 3 μm.

[0090] The purpose of using the transparent pixel definition layer 160 is as follows: the area of ​​the anode 121 is increased and extends to the gap between adjacent light-emitting devices 122. Since the pixel definition layer 160 is a transparent material, the light reflected by the extended portion of the anode 121 can pass through the pixel definition layer 160 and be effectively received by the upper reflective barrier 150 or reflective layer 143. Simultaneously, when light is reflected by the reflective layer 143 to the reflective barrier 150, and then by the reflective barrier 150 to the anode 121, the transparent pixel definition layer 160 does not obstruct the light propagation path, ensuring efficient light transmission between the anode 121, the reflective barrier 150, and the reflective layer 143. Furthermore, the transparent pixel definition layer 160 can reduce the obstruction of lateral light emitted from the light-emitting device 122, allowing more light to enter the reflection path and further improving light extraction efficiency.

[0091] See Figure 4 As shown, the encapsulation layer 130 covers the cathode and the pixel definition layer 160. The encapsulation layer 130 adopts a thin-film encapsulation structure, which may include a first inorganic encapsulation layer 131, an organic encapsulation layer 132, and a second inorganic encapsulation layer 133 arranged sequentially. The first inorganic encapsulation layer 131 covers the cathode and the pixel definition layer 160 and is used to prevent water and oxygen from entering; the organic encapsulation layer 132 is disposed on the first inorganic encapsulation layer 131 and is used to planarize the surface and release stress; the second inorganic encapsulation layer 133 is disposed on the organic encapsulation layer 132 and serves as the outermost layer of the encapsulation layer 130.

[0092] The inorganic encapsulation layer 130 can be formed by chemical vapor deposition using materials such as silicon nitride and silicon oxide, while the organic encapsulation layer 132 can be formed by inkjet printing or coating using materials such as acrylic resin.

[0093] A light-shielding unit 140 is disposed on the side of the encapsulation layer 130 facing away from the light-emitting layer 120. The light-shielding unit 140 includes a transparent filling layer 142, a reflective layer 143, and a light-shielding layer 144 arranged sequentially in a direction away from the light-emitting layer 120. The transparent filling layer 142 is disposed on the second inorganic encapsulation layer 133 and is made of a transparent organic material. It has a groove 1421, and the width of the groove 1421 gradually decreases in the direction pointing towards the drive backplate 110 in a direction perpendicular to the drive backplate 110. A reflective layer 143 is disposed on the side of the transparent filler layer 142 opposite to the second inorganic encapsulation layer 133, and is made of a highly reflective metallic material. A portion of the reflective layer 143 is disposed within a groove 1421 and connected to the side of the second inorganic encapsulation layer 133 opposite to the light-emitting layer 120 to form a reflective wall 1431. This reflective wall 1431 allows two independent reflective cavities 145 to be formed on the second inorganic encapsulation layer 133, with each cavity facing a corresponding light-emitting device 122. A light-shielding layer 144 is disposed on the side of the reflective layer 143 opposite to the light-emitting layer 120 and is made of a black organic material.

[0094] In another implementation, see Figure 6 As shown, the light-shielding unit 140 may further include a semi-reflective layer 141 (which is the same as the semi-reflective layer 141 in Embodiment 1) disposed between the transparent filling layer 142 and the second inorganic encapsulation layer 133. The semi-reflective layer 141 is made of a highly reflective metallic material (such as magnesium Mg or silver Ag), with a thickness of 1 nm to 20 nm, exhibiting semi-transparent and semi-reflective characteristics. A protrusion 1411 is formed on the side of the semi-reflective layer 141 near the light-emitting layer 120. The protrusion 1411 is embedded in the second inorganic encapsulation layer 133, and reflective surfaces 14111 are formed on the protrusion 1411, which are inclined toward the light-emitting devices 122 on both sides. The reflective surface 14111 is an inclined surface, forming an acute angle with the plane where the driving backplate 110 is located. At this time, a reflective cavity 145 is formed between the semi-reflective layer 141 and the reflective layer 143. Light can be reflected multiple times between the semi-reflective layer 141 and the reflective layer 143 before exiting the panel, forming a more complete light path conversion structure and further improving the light output efficiency.

[0095] A reflective barrier 150 is disposed between adjacent light-emitting devices 122 and between the light-shielding unit 140 and the driving backplate 110. The reflective barrier 150 extends in a direction away from the driving backplate 110 and is disposed opposite to the light-shielding unit 140.

[0096] For example, see Figure 4 As shown, the reflective barrier 150 includes a first segment 151 and a second segment 152. The first segment 151 is disposed within the pixel definition layer 160, and a first gap 170 is formed in the pixel definition layer 160 by photolithography and etching, and then filled with a highly reflective metallic material. The first segment 151 has a trapezoidal structure in the direction perpendicular to the driving backplate 110, that is, its cross-sectional area gradually decreases from the driving backplate 110 to the light-shielding unit 140. The anode 121 is spaced apart from the first segment 151 to reduce short-circuit problems.

[0097] By adopting this inverted trapezoidal structure, the smaller cross-sectional area at the top of the first segment 151 is conducive to forming a narrower top opening in the pixel definition layer 160, reducing the occupation of the pixel opening area and thus ensuring a high pixel aperture ratio; while the larger cross-sectional area at the bottom of the first segment 151 provides a more stable support foundation, and its sloping sidewalls can more effectively reflect the light from the reflective layer 143 to the anode 121, improving the light capture efficiency.

[0098] The second segment 152 is disposed within the organic encapsulation layer 132. A second gap 180 is formed in the organic encapsulation layer 132 through photolithography and etching. The bottom of the second gap 180 exposes a portion of the first inorganic encapsulation layer 131, which is then filled with a highly reflective metallic material. The second segment 152 also has an inverted trapezoidal structure in the direction perpendicular to the driving backplate 110, that is, its cross-sectional area gradually decreases from the driving backplate 110 to the light-shielding unit 140. One end of the second segment 152 contacts the first inorganic encapsulation layer 131, and the other end contacts the second inorganic encapsulation layer 133.

[0099] By employing this inverted trapezoidal structure, the larger cross-sectional area at the bottom of the second segment 152 can form a good connection with the first segment 151, ensuring efficient light transmission between the two. Simultaneously, the sloping sidewalls help optimize the light reflection direction, allowing light to be directed more efficiently towards the anode 121. Furthermore, the sloping sidewalls of the trapezoidal structure facilitate better step coverage during thin-film encapsulation, improving the density and reliability of the encapsulation layer 130.

[0100] Understandably, by setting the first segment 151 and the second segment 152 of the reflective barrier 150 as a trapezoidal structure, the cross-sectional area gradually decreases from the drive backplate 110 to the light-shielding unit 140, which not only ensures the pixel aperture ratio but also improves the light capture efficiency and reflection efficiency, but also facilitates the implementation of thin-film encapsulation technology and improves the overall performance of the display panel 100.

[0101] Furthermore, through this segmented structure, the reflective barrier 150 penetrates the encapsulation layer 130 but remains insulated from the inorganic encapsulation layer 130, thus ensuring the continuity of the inorganic encapsulation layer 130 and guaranteeing the encapsulation effect.

[0102] The material of the reflective barrier 150 can be the same as that of the reflective layer 143, using highly reflective metals such as silver (Ag) and magnesium (Mg), with a thickness of 100nm to 1000nm.

[0103] It is worth mentioning that the first segment 151 and the second segment 152 of the reflective barrier 150 are on the same vertical line as the reflective wall 1431 (i.e., the center of the groove 1421 on the transparent filler layer 142). This vertically aligned structural design has the following advantages: First, the first segment 151 and the second segment 152 of the reflective barrier 150 form a continuous optical path with the reflective wall 1431 on the same vertical line. When light travels from the reflective layer 143 to the reflective barrier 150 or from the reflective wall 1431 to the reflective barrier 150, it can be efficiently transmitted in a straight line, reducing scattering and energy loss during propagation. Second, the vertical alignment allows the reflective wall 1431 and the reflective barrier 150 to together form a complete optical barrier, effectively preventing crosstalk between adjacent sub-pixels. Third, this alignment design facilitates the control of alignment accuracy in the photolithography process, reducing fabrication difficulty and improving product yield. Finally, the vertical alignment structure is conducive to forming a more compact device layout, reducing the planar space occupied by the light-shielding unit 140, thereby improving the pixel aperture ratio.

[0104] See Figure 4 As shown, the display panel 100 in this embodiment achieves multiple reflections of light through the cooperation of the reflective layer 143, the reflective barrier 150, and the anode 121. The specific optical path is as follows:

[0105] When the light emitted by the light-emitting device 122 strikes the light-shielding unit 140, it first reaches the side of the reflective layer 143 facing the light-emitting layer 120. The light is reflected on this surface and splits into two paths:

[0106] The first path: Light is reflected by the reflective layer 143 to the reflective barrier 150. The reflective barrier 150 is disposed between adjacent light-emitting devices 122, extending away from the driving backplate 110, and its height is sufficient to receive light from the reflective layer 143. After being reflected by the reflective barrier 150, the light changes its propagation direction and is directed towards the anode 121. The anode 121 has a large area and extends close to the reflective barrier 150, effectively receiving light from it. The anode 121 then reflects the light again towards the light-emitting side.

[0107] The second path: Light is reflected by the reflective layer 143 to the reflective wall 1431. The reflective wall 1431 is formed by a portion of the reflective layer 143 disposed within the groove 1421 of the transparent filling layer 142 and connected to the second inorganic encapsulation layer 133, and its sidewall is a reflective surface 14111. After the light hits the reflective wall 1431, it is directly reflected by the reflective wall 1431 to the anode 121, and then reflected by the anode 121 to the light-emitting side; or, the light is reflected by the reflective wall 1431 and then hits the reflective layer 143 again, and is reflected by the reflective layer 143 to the reflective barrier 150, and then reflected by the reflective barrier 150 to the anode 121, and finally reflected by the anode 121 to the light-emitting side.

[0108] In the structural design of the reflective layer 143, a portion of the reflective layer 143 is disposed within the groove 1421 of the transparent filling layer 142 and connected to the second inorganic encapsulation layer 133 to form a reflective wall 1431. This reflective wall 1431 not only isolates the light-emitting devices 122 on both sides from each other, preventing crosstalk between adjacent sub-pixels, but its sidewalls also serve as additional reflective surfaces 14111, providing a second reflection path for the light. Through these two paths, the light undergoes multiple reflections between the reflective wall 1431, the reflective barrier 150, the reflective layer 143, and the anode 121. Light that might otherwise be blocked by the light-shielding unit 140 is redirected multiple times and then guided back to the light-emitting side, thereby improving the light extraction efficiency. Simultaneously, because the light undergoes multiple reflections, its emission angle increases, improving the viewing angle performance of the display panel 100.

[0109] In other embodiments, when a semi-reflective layer 141 is further provided in the light-shielding unit 140, the light first reaches the reflective surface 14111 on the semi-reflective layer 141. A portion of the light is directly reflected back to the light-emitting device 122 by the reflective surface 14111, and then reflected again towards the light-emitting side via the anode 121; another portion of the light passes through the semi-reflective layer 141 and enters the reflective cavity 145 composed of the semi-reflective layer 141 and the reflective layer 143. The light is reflected multiple times within the reflective cavity 145. During the reflection process, some light passes through the semi-reflective layer 141 again and returns to the direction of the light-emitting device 122, where it is reused via the anode 121. Another portion of the light, after multiple reflections, exits the panel from the sub-pixel opening area (as described in Embodiment 1). This structure further improves the light utilization rate.

[0110] It is worth mentioning that the area and shape of the anode 121 can be optimized to better receive light from the reflective barrier 150 and the reflective layer 143. For example, the extension of the anode 121 can be designed as an inclined or curved surface, so that light can be reflected more effectively to the light-emitting side. In addition, the height and angle of the reflective barrier 150 and the reflective layer 1431 can also be adjusted as needed to optimize the light reflection path.

[0111] Furthermore, the height and angle of the reflective barrier 150 can be adjusted as needed to optimize the reflection path of light. For example, the sidewalls of the reflective barrier 150 can be designed as slopes or steps, causing light to be reflected multiple times on the reflective barrier 150, further increasing the propagation path and exit angle of the light.

[0112] In addition to the three-stage reflection structure described above, other alternative solutions can be adopted. For example, the reflective layer 143 can be omitted, relying solely on the reflective barrier 150 and the anode 121 for reflection. In this case, the light is directly reflected from the reflective barrier 150 to the anode 121, resulting in a simpler structure. Furthermore, an additional reflection structure can be provided between the reflective barrier 150 and the anode 121, such as providing an additional reflective surface 14111 on the semi-reflective layer 141, forming more stages of reflection paths and further improving the utilization rate of light.

[0113] See Figure 7 and Figure 8 As shown, this embodiment also provides a method for manufacturing a display panel 100, which includes the following steps:

[0114] Step S201: Provide the drive backplane 110.

[0115] The backplane 110 can be fabricated using conventional TFT processes, similar to those in Example 1.

[0116] Step S202, forming anode 121.

[0117] An anode 121 is formed on the driving backplane 110. A highly reflective metal layer is formed by sputtering or evaporation, and the anode 121 pattern is formed after photolithography. The area of ​​the anode 121 is larger than that of the anode 121 in Embodiment 1, extending to near the middle of the adjacent light-emitting device 122. It is understood that the extension length of the anode 121 can be controlled by adjusting the pattern of the photolithography mask.

[0118] Step S203: A pixel definition layer 160 is formed and a first gap 170 is formed.

[0119] A pixel definition layer 160 is formed on the drive backplane 110 and the anode 121. A light-transmitting organic insulating material is formed by coating, and a first gap 170 is formed in the pixel definition layer 160 by a patterning process. The width and depth of the first gap 170 can be adjusted according to actual needs, for example, the width is 2μm to 5μm and the depth is 1μm to 3μm.

[0120] It should be noted that the function of the light-transmitting pixel definition layer 160 is as follows: the area of ​​the anode 121 is increased and extends to the gap between adjacent light-emitting devices 122. Since the pixel definition layer 160 is a light-transmitting material, the light reflected by the extended portion of the anode 121 can pass through the pixel definition layer 160 and be effectively received by the upper reflective barrier 150 or reflective layer 143. Simultaneously, when light is reflected by the reflective layer 143 to the reflective barrier 150, and then by the reflective barrier 150 to the anode 121, the light-transmitting pixel definition layer 160 does not obstruct the light propagation path, ensuring that light can be efficiently transmitted between the anode 121, the reflective barrier 150, and the reflective layer 143. Furthermore, the light-transmitting pixel definition layer 160 can also reduce the obstruction of the lateral light emitted from the light-emitting device 122, allowing more light to enter the reflection path and further improving the light extraction efficiency.

[0121] Step S204: Form the first segment 151 of the reflective barrier 150.

[0122] A first segment 151 of a reflective barrier 150 is formed within the first gap 170. A highly reflective metallic material is deposited using physical vapor deposition (PVD) or evaporation to fill the first gap 170, and excess material is removed to form the first segment 151. It should be noted that chemical mechanical polishing or etching-back processes can be used to remove excess material, making the upper surface of the first segment 151 flush with the upper surface of the pixel definition layer 160.

[0123] Step S205: Forming the light-emitting device 122.

[0124] A light-emitting device 122 is formed within the opening area defined by the pixel definition layer 160, and red, green and blue organic light-emitting functional layers are deposited by evaporation using a fine metal mask.

[0125] Then, a cathode is formed over the entire surface of the light-emitting device 122 and the pixel definition layer 160, and cathode material is deposited by vapor deposition to form a complete light-emitting layer 120. The cathode can also be formed by sputtering, and the material can be a transparent conductive material such as Mg:Ag magnesium-silver alloy or indium tin oxide (ITO).

[0126] Step S206: Form the first inorganic encapsulation layer 131.

[0127] A first inorganic encapsulation layer 131 is formed on the first segment 151 of the cathode and reflective barrier 150. Inorganic insulating materials such as silicon nitride or silicon oxide are formed using chemical vapor deposition to cover the entire display area. The thickness of the first inorganic encapsulation layer 131 can be adjusted according to actual needs, for example, from 0.5 μm to 1.5 μm.

[0128] Step S207: Form an organic encapsulation layer 132 and form a second gap 180.

[0129] An organic encapsulation layer 132 is formed on the first inorganic encapsulation layer 131. Organic materials such as acrylic resin are formed using inkjet printing or coating, and a second gap 180 is formed at the position corresponding to the first segment 151 of the reflective barrier 150 using a patterning process. The bottom of the second gap 180 exposes a portion of the first inorganic encapsulation layer 131. The width of the second gap 180 may be slightly larger than the width of the first gap 170 to ensure that the second segment 152 can be aligned vertically with the first segment 151.

[0130] Step S208, forming the second segment 152 of the reflective barrier 150.

[0131] A second segment 152 of the reflective barrier 150 is formed within the second gap 180. A highly reflective metallic material is deposited using physical vapor deposition (PVD) or evaporation to fill the second gap 180, forming the second segment 152. One end of the second segment 152 contacts the first inorganic encapsulation layer 131, and the other end contacts the subsequently formed second inorganic encapsulation layer 133.

[0132] The material of the second segment 152 can be the same as or different from that of the first segment 151, as long as it has good reflective properties.

[0133] Step S209: Form the second inorganic encapsulation layer 133.

[0134] A second inorganic encapsulation layer 133 is formed on the second segment 152 of the organic encapsulation layer 132 and the reflective barrier 150. Inorganic insulating materials such as silicon nitride or silicon oxide are formed using chemical vapor deposition to cover the entire display area. The thickness of the second inorganic encapsulation layer 133 can be adjusted according to actual needs, for example, from 0.5 μm to 1.5 μm.

[0135] Step S210: A transparent filler layer 142 is formed and a groove 1421 is formed.

[0136] A transparent filler layer 142 is formed on the second inorganic encapsulation layer 133. A transparent organic material (such as acrylic resin or polyimide PI resin) is formed by coating. A groove 1421 is formed on the transparent filler layer 142 at the midline position corresponding to the adjacent light-emitting devices 122 using a patterning process. In the direction perpendicular to the driving backplate 110, the width of the groove 1421 gradually decreases in the direction pointing towards the driving backplate 110. The depth of the groove 1421 can be set to be equivalent to the thickness of the transparent filler layer 142, or it can be set to a partial depth.

[0137] Step S211: Forming the reflective layer 143.

[0138] A reflective layer 143 is formed on the transparent filler layer 142. A highly reflective metallic material is deposited using physical vapor deposition (PVD) or evaporation to cover the surface of the transparent filler layer 142 and the inner wall of the groove 1421, and is connected to the second inorganic encapsulation layer 133 at the bottom of the groove 1421, thereby forming two independent reflective cavities 145 on the second inorganic encapsulation layer 133. The thickness of the reflective layer 143 can be adjusted according to actual needs, for example, from 100 nm to 1000 nm.

[0139] Step S212: Form a light-shielding layer 144.

[0140] A light-shielding layer 144 is formed on the reflective layer 143. A black organic acrylic resin material is formed by coating, with a thickness controlled between 1 μm and 3 μm. After photolithography patterning, the desired light-shielding layer 144 pattern is formed. The light-shielding layer 144 only covers the area between adjacent sub-pixels of the reflective layer 143.

[0141] After the light-shielding layer 144 is fabricated, colored photoresist 190 is formed between adjacent light-shielding units 140. For example, red, green, and blue photoresist are sequentially formed in the opening area between the light-shielding units 140. Red, green, and blue photoresist materials are coated using a coating method, and after photolithography patterning, the desired color resist block pattern is formed. Each color resist block corresponds to the position of the corresponding light-emitting device 122. The colored photoresist 190 is used to filter the light emitted by the light-emitting device 122 to achieve color display. The thickness of the colored photoresist 190 can be matched with the height of the light-shielding unit 140 to ensure the flatness of the display panel 100 surface.

[0142] It is worth mentioning that in some embodiments, a semi-reflective layer 141 is added to the light-shielding unit 140. After forming the second inorganic encapsulation layer 133, the method adds the following steps (which are the same as the method of forming the semi-reflective layer 141 in Embodiment 1 above, and will be briefly described below):

[0143] A pattern complementary to the inclined surface is formed on the second inorganic encapsulation layer 133, and then a semi-reflective layer 141 is formed. The semi-reflective layer 141 forms a protrusion 1411 in accordance with the pattern. The protrusion 1411 has reflective surfaces 14111 that are inclined toward the light-emitting devices 122 on both sides respectively. Then, a transparent filling layer 142, a reflective layer 143 and a light-shielding layer 144 are formed sequentially on the semi-reflective layer 141. A groove 1421 is formed on the transparent filling layer 142. The reflective layer 143 covers the inner wall of the groove 1421 and is connected to the semi-reflective layer 141 to form a reflective cavity 145. The subsequent steps are the same as the basic scheme and will not be described again here.

[0144] The purpose of using the semi-reflective layer 141 is twofold: First, the reflective surface 14111 on the semi-reflective layer 141 is tilted towards the light-emitting device 122, allowing some of the light emitted by the light-emitting device 122 to be directly reflected back to the light-emitting device 122 and then reflected again by the anode 121 towards the light-emitting side, achieving the first reuse of the light. Second, a reflective cavity 145 is formed between the semi-reflective layer 141, the reflective wall 1431, and the reflective layer 143. Light transmitted through the semi-reflective layer 141 undergoes multiple reflections within the reflective cavity 145. During the reflection process, some light passes through the semi-reflective layer 141 again and returns to the light-emitting device 122, where it is reused by the anode 121. The other part of the light exits the panel from the sub-pixel opening area. Through this structure, the light is reflected multiple times within the reflective cavity 145 and passes through the semi-reflective layer 141 multiple times back to the light-emitting device 122, achieving repeated use of the light and significantly improving the light extraction efficiency. Simultaneously, because the light undergoes multiple reflections, its exit angle increases, improving the viewing angle performance of the display panel 100. In addition, the reflective surface 14111 on the semi-reflective layer 141 adopts a protrusion 1411 structure embedded in the second inorganic encapsulation layer 133, which shortens the light propagation path and utilizes the thickness space of the encapsulation layer 130 itself, which helps to achieve a thinner and lighter design of the display panel 100.

[0145] In other embodiments, functional film layers such as planarization layers and protective layers may be added between the layers as needed to further improve the performance and reliability of the display panel 100.

[0146] The display panel 100 and its manufacturing method provided in this application, on the one hand, transform a single-layer black matrix into a composite structure including a semi-reflective layer 141, a transparent filling layer 142 and a reflective layer 143. By utilizing the reflective cavity 145 formed between the semi-reflective layer 141 and the reflective layer 143 and the reflective surface 14111 tilted on the reflective surface 14111, light is reflected multiple times in the reflective cavity 145 and repeatedly passes through the semi-reflective layer 141 back to the direction of the light-emitting device 122, realizing multiple reuse of light, effectively improving the light emission efficiency of the display panel 100, and increasing the light emission angle, thereby improving the viewing angle performance of the display panel 100. On the other hand, by setting up a reflective barrier 150 in conjunction with the reflective layer 143 and the anode 121, the reflective layer 143 reflects light to the reflective barrier 150, then the reflective barrier 150 reflects it to the anode 121, and finally the anode 121 reflects it towards the light-emitting side. Furthermore, a reflective wall 1431 is set in the light-shielding unit 140 to isolate the two reflective cavities 145 from each other, forming independent optical paths. This also achieves multiple reflections of light, improving light extraction efficiency and viewing angle performance. Both technical solutions can be selected according to actual application needs, possessing high practical value and promising industrial application prospects.

[0147] In the description of this specification, references to terms such as "some embodiments," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0148] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and description of this application should fall within the scope of this patent application.

Claims

1. A display panel, characterized by, include: Drive backplane; A light-emitting layer is disposed on the driving backplate, and the light-emitting layer includes a plurality of light-emitting devices; A light-shielding unit is disposed on the side of the light-emitting layer away from the driving back plate. The orthographic projection of the light-shielding unit on the driving back plate is located between adjacent light-emitting devices. The light-shielding unit includes a reflective structure and a light-shielding layer arranged sequentially along the direction away from the light-emitting layer. The reflective structure includes a reflective cavity and reflective surfaces that are inclined toward the light-emitting devices on both sides. The reflective cavity is located on the side of the reflective surface away from the light-emitting layer. The reflective surface is used to reflect part of the light emitted by the corresponding light-emitting device back to the light-emitting layer, while another part of the light is transmitted into the reflective cavity. The reflective cavity is used to reflect the light entering it multiple times. During the reflection process, a part of the light is transmitted through the reflective surface and then shines back onto the light-emitting layer, while the other part of the light is emitted out of the display panel after multiple reflections.

2. The display panel of claim 1, wherein, The reflective structure includes a semi-reflective layer, and a protrusion is formed on the side of the semi-reflective layer near the light-emitting layer. The protrusion is provided with a reflective surface, which is an inclined surface, and an acute angle is formed between the reflective surface and the plane where the drive back plate is located.

3. The display panel of claim 2, wherein, The display panel further includes an encapsulation layer disposed between the light-emitting layer and the light-shielding unit, the encapsulation layer including a second inorganic encapsulation layer, and the protrusion being embedded in the second inorganic encapsulation layer.

4. The display panel of claim 2, wherein, The reflective structure further includes a transparent filling layer and a reflective layer disposed between the semi-reflective layer and the light-shielding layer. The reflective layer is disposed on the side of the transparent filling layer away from the semi-reflective layer, and the reflective layer and the semi-reflective layer form two independent reflective cavities, with the two reflective cavities respectively corresponding to the reflective surfaces on both sides.

5. The display panel of claim 4, wherein, The transparent filler layer has grooves, and the width of the grooves gradually decreases in the direction pointing towards the drive back plate in the direction perpendicular to the drive back plate. A portion of the reflective layer is disposed within the groove and connected to the side of the semi-reflective layer opposite to the light-emitting layer, thereby dividing the reflective cavity into two independent reflective cavities.

6. A display panel, characterized by, include: Drive backplane; A light-emitting layer is disposed on the driving backplate. The light-emitting layer includes a light-emitting device and an anode. The light-emitting device is disposed on the side of the anode away from the driving backplate, and the anode is connected to the driving backplate. A light-shielding unit is disposed on the side of the light-emitting layer away from the driving back plate. The light-shielding unit includes a reflective layer and a light-shielding layer arranged sequentially along the direction away from the light-emitting layer. A reflective barrier is disposed between adjacent light-emitting devices and extends in a direction away from the driving back plate. The reflective barrier is located between the light-shielding unit and the driving back plate and is disposed opposite to the light-shielding unit. The side of the reflective layer facing the light-emitting layer is used to reflect the light emitted by the corresponding light-emitting device to the reflective barrier, the reflective barrier is used to reflect the light back to the anode, and the anode is used to reflect the light again to the light-emitting side.

7. The display panel of claim 6, wherein, The display panel also includes: A pixel definition layer is disposed on the driving backplane and covers part of the anode to define the light-emitting area of ​​each of the light-emitting devices; An encapsulation layer covers the light-emitting device and the pixel definition layer. The encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer located on the first inorganic encapsulation layer, and a second inorganic encapsulation layer located on the organic encapsulation layer. The reflective barrier includes a first segment and a second segment. The first segment is disposed within the pixel definition layer. The anode is spaced apart from the first segment. The second segment is disposed within the organic encapsulation layer. One end of the second segment contacts the first inorganic encapsulation layer, and the other end contacts the second inorganic encapsulation layer.

8. The display panel of claim 7, wherein, The light-shielding unit further includes a transparent filling layer disposed between the reflective layer and the second inorganic encapsulation layer; The transparent filler layer has a groove, and the width of the groove gradually decreases in the direction pointing towards the drive back plate along the direction perpendicular to the drive back plate. A portion of the reflective layer is disposed within the groove and connected to the side of the second inorganic encapsulation layer opposite to the light-emitting layer, thereby forming two independent reflective structures on the second inorganic encapsulation layer.

9. A method for manufacturing a display panel, characterized by, include: A driving backplane is provided and a light-emitting layer is formed on the driving backplane, the light-emitting layer including a plurality of light-emitting devices; An encapsulation layer is formed on the light-emitting layer, the encapsulation layer including a second inorganic encapsulation layer; A photoresist layer is formed on the second inorganic encapsulation layer. A pattern complementary to the bevel is formed on the second inorganic encapsulation layer by a patterning process, and then the photoresist layer is removed. A semi-reflective layer is formed on the patterned second inorganic encapsulation layer, the semi-reflective layer covering the pattern to form a protrusion, and reflective surfaces that are respectively inclined toward the light-emitting devices on both sides are formed on the protrusion. A transparent filler layer is formed on the semi-reflective layer, and a groove is formed on the transparent filler layer by a patterning process. In the direction perpendicular to the drive back plate, the width of the groove gradually decreases in the direction pointing to the drive back plate. A reflective layer is formed on the transparent filler layer, the reflective layer covering the inner wall of the groove and connected to the semi-reflective layer; A light-shielding layer is formed on the reflective layer.

10. A method for manufacturing a display panel, characterized by, include: Provides a drive backplane; An anode is formed on the drive backplate; A pixel definition layer is formed on the drive backplate and the anode, and a first gap is formed in the pixel definition layer by a patterning process. The first section of the reflective barrier is formed within the first gap; A light-emitting device is formed within the opening area defined by the pixel definition layer; A first inorganic encapsulation layer is formed on the light-emitting device, the pixel definition layer, and the first segment of the reflective barrier; An organic encapsulation layer is formed on the first inorganic encapsulation layer, and a second gap is formed at the position corresponding to the first segment of the reflective barrier by a patterning process, with the bottom of the second gap exposing a portion of the first inorganic encapsulation layer. A second section of the reflective barrier is formed within the second gap; A second inorganic encapsulation layer is formed on the organic encapsulation layer and the second section of the reflective barrier; A transparent filler layer is formed on the second inorganic encapsulation layer, and a groove is formed on the transparent filler layer by a patterning process; In the direction perpendicular to the drive back plate, the width of the groove gradually decreases in the direction pointing towards the drive back plate; A reflective layer is formed on the transparent filler layer, and the reflective layer covers the inner wall of the groove; A light-shielding layer is formed on the reflective layer.

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