Multi-slice silicon wafer detection self-adaptive adjusting device

Abstract

The invention provides a multi-wafer silicon wafer detection self-adaptive adjusting device which comprises a bottom plate, a plurality of detection assembly self-adaptive adjusting mechanisms which are arranged in parallel at intervals and independently arranged are installed on the bottom plate, and each detection assembly self-adaptive adjusting mechanism is correspondingly provided with a probe detection assembly. The detection assembly self-adaptive adjusting mechanism comprises a first end edge adjusting mechanism and a second end edge adjusting mechanism which are installed on the bottom plate side by side in a spaced mode in the X direction, and a middle adjusting mechanism is installed between the first end edge adjusting mechanism and the second end edge adjusting mechanism. The first end edge adjusting mechanism and the second end edge adjusting mechanism are connected with the middle adjusting mechanism through a detection assembly mounting plate, and the probe detection assembly is fixed on the detection assembly mounting plate. The multi-slice silicon wafer detection self-adaptive adjusting device can simultaneously detect a plurality of silicon wafers at one time, and can accurately adapt to independent detection of multi-slice silicon wafers with different batches, different specifications or deviated incoming material positions.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer production equipment technology, and specifically to a multi-wafer silicon wafer detection adaptive adjustment device. Background Technology

[0002] As silicon wafer production becomes increasingly smaller, the entire wafer is divided into two halves, three halves, four halves, and even six halves, collectively referred to as multi-wafer production. In the actual production process of multi-wafer silicon wafers, each wafer requires IV testing. This IV testing process involves precisely contacting hundreds of probes with the wafer surface. However, current technologies still face the following technical challenges in the actual IV testing process: (1) It is impossible to accurately adjust the position of the probe in the detection device, and it lacks the ability to automatically adjust to changes in the size, position and thickness of silicon wafers, making it difficult to adapt to positional deviations of different batches and specifications of silicon wafers or incoming materials; (2) Using a fixed probe group to inspect each wafer individually results in low inspection efficiency and makes it difficult to meet the inspection requirements of multi-wafer silicon wafers; (3) Traditional probe testing components can usually only test one side of the silicon wafer (such as the top surface). If it is necessary to test both sides, the silicon wafer needs to be flipped or another testing device needs to be used, resulting in low testing efficiency. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention proposes a multi-wafer silicon wafer detection adaptive adjustment device. This device can simultaneously detect multiple silicon wafers at once and can accurately adapt to the independent detection of multi-wafer silicon wafers of different batches, specifications, or with deviations in the incoming material location.

[0004] To achieve the above technical solution, the present invention provides a multi-wafer silicon wafer detection adaptive adjustment device, comprising: a base plate, on which multiple parallel and independently arranged detection component adaptive adjustment mechanisms are mounted, each detection component adaptive adjustment mechanism having a corresponding probe detection component mounted on it; each detection component adaptive adjustment mechanism includes a first end-edge adjustment mechanism and a second end-edge adjustment mechanism mounted side-by-side and spaced along the X direction on the base plate, with an intermediate adjustment mechanism installed between the first end-edge adjustment mechanism and the second end-edge adjustment mechanism; the first end-edge adjustment mechanism and the second end-edge adjustment mechanism have the same structure, both including a first Y-axis slide rail mounted on the base plate, a first Y-axis slider seat mounted on the first Y-axis slide rail, a first X-axis slide rail mounted on the top of the first Y-axis slider seat, a first X-axis slider seat mounted on the top of the first X-axis slide rail, a first connecting bearing mounted on the top of the first X-axis slider seat, and a first transmission screw drive motor mounted on one side of the first Y-axis slider seat on the base plate. A first transmission screw pair is installed on the end side of the slider seat. The first transmission screw drive motor is connected to the first transmission screw pair via the first transmission screw. The intermediate adjustment mechanism includes a second X-axis slide rail mounted on the base plate. The second X-axis slide rail is located between the first Y-axis slide rails of the first end-side adjustment mechanism and the second end-side adjustment mechanism. The second X-axis slider seat is mounted on the second X-axis slide rail. A second Y-axis slide rail is mounted on the top of the second X-axis slider seat. A second Y-axis slider seat is mounted on the top of the second Y-axis slide rail. A second connecting bearing is mounted on the top of the second Y-axis slider seat. A second screw pair is mounted on the bottom of the second X-axis slider seat. The second screw drive motor is mounted on one side of the second screw pair. The second screw drive motor is connected to the second screw pair via the second screw. The first connecting bearings on the first end-side adjustment mechanism and the second end-side adjustment mechanism are connected to the second connecting bearing on the intermediate adjustment mechanism via a detection component mounting plate. The probe detection component is fixed on the detection component mounting plate.

[0005] In the above technical solution, during actual operation, each detection component's adaptive adjustment mechanism can precisely move in the X and Y directions and precisely rotate in the Z direction according to the positional deviation of different batches, specifications of silicon wafers, or incoming materials. During actual adjustment, if the system detects a deviation between the position of the silicon wafer conveyed by the turntable feeding mechanism and the position of the detection probe in one or more probe detection components, the adaptive adjustment mechanism of the detection component corresponding to that probe detection component begins adaptive adjustment. The specific process of adaptive adjustment is as follows: the first transmission screw drive motor in the first and second end-edge adjustment mechanisms drives the first transmission screw to move the first Y-axis slider seat precisely in the same direction along the Y direction, thereby driving the probe detection component mounted on the detection component mounting plate to move precisely in the Y direction; simultaneously, the second screw drive motor in the intermediate adjustment mechanism drives the second screw to move the first Y-axis slider seat precisely in the same direction along the Y direction. The two X-axis sliders move precisely along the X-axis, thereby driving the probe detection assembly mounted on the detection assembly mounting plate to move precisely in the X-axis. When the probe detection assembly needs to be rotated, the first transmission screw in the first and second end-edge adjustment mechanisms drives the first transmission screw to move the first Y-axis slider precisely in the opposite direction along the Y-axis (for example, the first Y-axis slider in the first end-edge adjustment mechanism moves forward along the Y-axis, and the first Y-axis slider in the second end-edge adjustment mechanism moves backward along the Y-axis). Utilizing diagonal shearing action and in conjunction with the connecting bearing, the probe detection assembly can be rotated along the Z-axis. This allows each probe detection assembly to move precisely in the X and Y directions and rotate precisely in the Z-axis independently, accurately adapting to the positional deviation of the incoming silicon wafer and ensuring that the probes in the probe detection assembly can accurately contact the silicon wafer, thus improving the detection quality.

[0006] Preferably, the probe detection assembly includes a detection mounting base fixed to a detection assembly mounting plate. A Z-axis slide rail is provided on the detection mounting base along the Z-axis. An upper probe moving base and a lower probe moving base are mounted side-by-side and spaced apart on the Z-axis slide rail. An upper moving base drive motor is vertically upward along the Z-axis and connected to the upper probe moving base via a transmission screw. A lower moving base drive motor is vertically downward along the Z-axis and connected to the lower probe moving base via a transmission screw. An upper probe module is vertically downward mounted at the front end of the upper probe moving base, and a lower probe module is vertically upward mounted at the front end of the lower probe moving base. A gap is maintained between the upper and lower probe modules to allow the silicon wafer to pass through. In actual operation, the upper and lower moving base drive motors can precisely drive the upper and lower probe moving bases upward or downward, respectively, thereby causing the upper and lower probe modules mounted on the upper and lower probe moving bases to move up and down, achieving contact with the silicon wafer. By integrating the upper and lower probe modules and their independent Z-axis drive mechanisms onto the same detection mounting base, not only is dual-sided synchronous detection achieved, but also the stepless and precise adjustment of the spacing between the upper and lower probes is realized through independent control, which can flexibly adapt to silicon wafers of different thicknesses.

[0007] Preferably, the Z-axis slide rail is provided with an intermediate limiting block in the middle to separate the upper probe moving seat and the lower probe moving seat, so as to prevent the two sets of expensive probes from colliding and being damaged due to misoperation.

[0008] Preferably, a photoelectric sensor is provided on one side of the base plate opposite to the first transmission screw pair, and a sensing block corresponding to the photoelectric sensor is installed on the first transmission screw pair.

[0009] Preferably, a photoelectric sensor is disposed on one side of the base plate opposite the second lead screw pair, and a sensing block corresponding to the photoelectric sensor is mounted on the second lead screw pair. Through the configuration of the photoelectric sensor and the sensing block, the system can perceive the position of each moving component in real time, forming a closed-loop control.

[0010] Preferably, limit posts are installed at both ends of the first Y-axis slide rail and both ends of the second X-axis slide rail to effectively prevent overtravel collisions caused by vibration or accidents.

[0011] Preferably, the device further includes a turntable feeding mechanism mounted on one side of the probe detection assembly. The turntable feeding mechanism includes a turntable drive motor fixed to the base plate and vertically upwards. A central rotating shaft is mounted on the output shaft of the turntable drive motor. The turntable body is mounted on the central rotating shaft and rotates with it. The turntable body has four working stations, each with the same number of perforated silicon wafer placement slots as the adaptive adjustment mechanism of the detection assembly. In actual operation, the turntable drive motor drives the central rotating shaft to rotate the four working stations on the turntable body, conveying the silicon wafers placed in the wafer placement slots between the upper and lower probe modules of the probe detection assembly. The intermittent rotational motion of the turntable body and the high-precision positioning motion of the detection mechanism achieve precise coordination in time and space.

[0012] Preferably, each hollowed-out silicon wafer is fitted with a support bracket in the slot to ensure that the thin and brittle silicon wafer does not bend or shift during the testing process.

[0013] The beneficial effects of the multi-wafer detection adaptive adjustment device provided by the present invention are as follows: (1) The present invention utilizes a composite motion platform consisting of a first end-edge adjustment mechanism, a second end-edge adjustment mechanism, and an intermediate adjustment mechanism. Each probe detection component can independently and precisely adjust its position in the X and Y directions, as well as rotate precisely in the Z direction. This automatically compensates for positional deviations and dimensional tolerances of the silicon wafers during processing and transportation, ensuring that the probes are accurately aligned with the preset detection points each time. This greatly reduces the risk of false detections, missed detections, or damage to the silicon wafers caused by misalignment, thereby directly improving the accuracy of product testing and production yield.

[0014] (2) In this invention, the upper probe module and the lower probe module are driven by independent motors and can move simultaneously toward or away from each other. This allows the device to simultaneously complete the electrical performance testing of the upper and lower surfaces when the silicon wafer passes through once. Compared with the traditional single-sided testing method that requires flipping the silicon wafer or changing workstations, the testing efficiency is theoretically increased by nearly 100%, and the risk of contamination and damage caused by the flipping process is avoided.

[0015] (3) This invention forms a highly efficient workflow of "continuous feeding - parallel testing - continuous unloading" by installing multiple parallel and independent testing units on the base plate and cooperating with a turntable feeding mechanism with four stations. When one station is testing, other stations can perform loading and unloading operations, realizing seamless connection of production cycle and significantly improving overall testing efficiency. At the same time, the modular design makes it easy to add or remove testing units according to the size of silicon wafers, and has strong adaptability. Attached Figure Description

[0016] Figure 1 This is a front view of the three-dimensional structure of the present invention.

[0017] Figure 2 This is a rear view of the three-dimensional structure of the present invention.

[0018] Figure 3 This is a front view of the three-dimensional structure of the adaptive adjustment mechanism of the detection component and the probe detection component in this invention.

[0019] Figure 4 This is a rear view of the three-dimensional structure of the adaptive adjustment mechanism of the detection component and the probe detection component in this invention.

[0020] Figure 5 This is a side view of the assembly structure of the adaptive adjustment mechanism of the detection component and the probe detection component in this invention.

[0021] Figure 6 This is a three-dimensional assembly structure diagram of the adaptive adjustment mechanism of the detection component in this invention.

[0022] Figure 7 This is a bottom view of the three-dimensional assembly structure of the adaptive adjustment mechanism of the detection component in this invention.

[0023] In the diagram: 1. Adaptive adjustment mechanism for the detection component; 11. First end adjustment mechanism; 111. First transmission screw drive motor; 112. First transmission screw; 113. First transmission screw pair; 114. First Y-axis slider seat; 115. First X-axis slide rail; 116. First Y-axis slide rail; 117. First X-axis slider seat; 118. First connecting bearing; 119. Photoelectric sensor; 1110. Sensing block; 1111. Limiting post; 12. Intermediate adjustment mechanism; 121. Second screw drive motor; 122. Second transmission screw; 123. Second screw pair; 124. Second X-axis slide rail; 125. Second X-axis slider seat; 126. Second Y-axis slide rail; 127. Second Y-axis slider seat; 128. Second connecting bearing; 13. Second end edge adjustment mechanism; 14. Detection component mounting plate; 2. Probe detection component; 21. Detection mounting base; 22. Z-axis slide rail; 23. Lower probe moving seat; 24. Intermediate limit block; 25. Upper probe moving seat; 26. Lower moving seat drive motor; 27. Lower probe module; 28. Upper probe module; 29. ​​Upper moving seat drive motor; 3. Turntable feeding mechanism; 31. Turntable drive motor; 32. Central rotating shaft; 33. Turntable body; 34. Working station; 35. Silicon wafer placement slot; 36. Base support bracket; 4. Base plate. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present invention.

[0025] Example: An adaptive adjustment device for detecting multi-segment silicon wafers.

[0026] Reference Figures 1 to 7 As shown, a multi-wafer silicon wafer detection adaptive adjustment device specifically includes: a base plate 4, on which four parallel and independently arranged detection component adaptive adjustment mechanisms 1 are installed, and each detection component adaptive adjustment mechanism 1 is equipped with a corresponding probe detection component 2.

[0027] The adaptive adjustment mechanism 1 of the detection component includes a first end adjustment mechanism 11 and a second end adjustment mechanism 13 that are installed side by side at intervals on the base plate 4 along the X direction, and an intermediate adjustment mechanism 12 is installed between the first end adjustment mechanism 11 and the second end adjustment mechanism 13. The first end-edge adjustment mechanism 11 and the second end-edge adjustment mechanism 13 have the same structure, both including a first Y-axis slide rail 116 mounted on the base plate 4, a first Y-axis slider seat 114 mounted on the first Y-axis slide rail 116, a first X-axis slide rail 115 mounted on the top of the first Y-axis slider seat 114, a first X-axis slider seat 117 mounted on the top of the first X-axis slide rail 115, a first connecting bearing 118 mounted on the top of the first X-axis slider seat 117, a first transmission screw drive motor 111 mounted on one side of the first Y-axis slider seat 114 on the base plate 4, a first transmission screw pair 113 mounted on the end side of the first Y-axis slider seat 114, and the first transmission screw drive motor 111 and the first transmission screw pair 113 are connected by a first transmission screw 112.

[0028] The intermediate adjustment mechanism 12 includes a second X-axis slide rail 124 mounted on the base plate 4. The second X-axis slide rail 124 is located between the first Y-axis slide rail 116 of the first end-edge adjustment mechanism 11 and the second end-edge adjustment mechanism 13. A second X-axis slider seat 125 is mounted on the second X-axis slide rail 124. A second Y-axis slide rail 126 is mounted on the top of the second X-axis slider seat 125. A second Y-axis slider seat 127 is mounted on the top of the second Y-axis slide rail 126. A second connecting bearing is mounted on the top of the second Y-axis slider seat 127. 128. A second lead screw assembly 123 is installed at the bottom of the second X-axis slider seat 125. A second lead screw drive motor 121 is installed on one side of the second lead screw assembly 123. The second lead screw drive motor 121 and the second lead screw assembly 123 are connected by a second lead screw 122. The first connecting bearing 118 on the first end adjustment mechanism 11 and the second end adjustment mechanism 13 is connected to the second connecting bearing 128 on the intermediate adjustment mechanism 12 by a detection assembly mounting plate 14. The probe detection assembly 2 is fixed on the detection assembly mounting plate 14.

[0029] In this embodiment, during actual operation, each detection component adaptive adjustment mechanism 1 can be independently adjusted according to the positional deviation of different batches, different specifications of silicon wafers, or incoming materials. During actual adjustment, if the system detects a deviation between the position of the silicon wafer conveyed by the turntable feeding mechanism 3 and the position of the detection probe in one or more probe detection components 2, the detection component adaptive adjustment mechanism 1 corresponding to that probe detection component 2 will begin adaptive adjustment. The specific process of adaptive adjustment is as follows: the first transmission screw drive motor 111 in the first end adjustment mechanism 11 and the second end adjustment mechanism 13 drives the first transmission screw 112 to drive the first Y-axis slider seat 114 to move precisely in the same direction along the Y direction, thereby driving the probe detection component 2 mounted on the detection component mounting plate 14 to move precisely in the Y direction; at the same time, the second screw drive motor 121 in the intermediate adjustment mechanism 12 drives the second screw 122 to drive the second X-axis slider seat 125 to move along the X-axis. The probe detection assembly 2, mounted on the detection assembly mounting plate 14, can move precisely in the X direction. When the probe detection assembly 2 needs to be rotated, the first transmission screw drive motor 111 in the first end edge adjustment mechanism 11 and the second end edge adjustment mechanism 13 drives the first transmission screw 112 to move the first Y-axis slider seat 114 precisely in the reverse direction of the Y direction (for example, the first Y-axis slider seat 114 in the first end edge adjustment mechanism 11 moves in the forward direction of the Y direction, and the first Y-axis slider seat 114 in the second end edge adjustment mechanism 13 moves in the reverse direction of the Y direction). By utilizing the diagonal shearing action and cooperating with the connecting bearing, the probe detection assembly can be rotated in the Z direction. This allows each probe detection assembly 2 to move precisely in the X and Y directions and rotate precisely in the Z direction independently, so as to accurately adapt to the positional deviation of the silicon wafer and ensure that the probes in the probe detection assembly 2 can accurately contact the silicon wafer, thereby improving the detection quality.

[0030] This invention cleverly decomposes and distributes the two-dimensional (XY) adjustment function of a single detection component to two end adjustment mechanisms (mainly responsible for Y-axis adjustment and X-axis following with one end fixed) and one intermediate adjustment mechanism (mainly responsible for X-axis main adjustment and Y-axis following). This "three-point support, coordinated drive" layout, compared with the traditional integral cross slide, significantly reduces the mass of moving parts, improves dynamic response speed, and reduces the load and cost of individual drive components while ensuring rigidity and accuracy. It also saves installation space, allowing for the independent layout of four detection component adaptive adjustment mechanisms 1 in the narrow base plate area 4.

[0031] This invention utilizes a composite motion platform comprised of a first end-edge adjustment mechanism 11, a second end-edge adjustment mechanism 13, and an intermediate adjustment mechanism 12. Each probe detection component 2 can independently and precisely adjust its position on the X and Y axes, as well as rotate accurately in the Z direction. This automatically compensates for positional deviations and dimensional tolerances in silicon wafers during processing and transportation, ensuring that the probes are accurately aligned with the preset detection points each time. This significantly reduces the risk of false detections, missed detections, or damage to the silicon wafers due to misalignment, thereby directly improving the accuracy of product testing and production yield.

[0032] Reference Figure 6 and Figure 7 As shown, a photoelectric sensor 119 is disposed on one side of the first transmission lead screw pair 113 on the base plate 4, facing the first transmission lead screw pair 113. A sensing block 1110 corresponding to the photoelectric sensor 119 is mounted on the first transmission lead screw pair 113. A photoelectric sensor 119 is disposed on one side of the second lead screw pair 123 on the base plate 4, facing the second lead screw pair 123. A sensing block 1110 corresponding to the photoelectric sensor 119 is mounted on the second lead screw pair 123. Through the configuration of the photoelectric sensor 119 and the sensing block 1110, the system can sense the position of each moving component in real time, forming a closed-loop control. Limiting posts 1111 are installed at both ends of the first Y-axis slide rail 116 and at both ends of the second X-axis slide rail 124, which can effectively prevent overtravel collisions caused by vibration or accidents.

[0033] Reference Figures 1 to 5As shown, the probe detection assembly 2 includes a detection mounting base 21, which is fixed on the detection assembly mounting plate 14. A Z-axis slide rail 22 is provided on the detection mounting base 21 along the Z-axis. An upper probe moving seat 25 and a lower probe moving seat 23 are installed on the Z-axis slide rail 22, arranged side by side at intervals. An upper moving seat drive motor 29 is arranged vertically upward along the Z-axis and connected to the upper probe moving seat 25 through a transmission screw. A lower moving seat drive motor 26 is arranged vertically downward along the Z-axis and connected to the lower probe moving seat 23 through a transmission screw. An upper probe module 28 is installed vertically downward at the front end of the upper probe moving seat 25, and a lower probe module 27 is installed vertically upward at the front end of the lower probe moving seat 23. A gap is maintained between the upper probe module 28 and the lower probe module 27 to allow the silicon wafer to pass through. The Z-axis slide rail 22 has a middle limiting block 24 at its center to separate the upper probe moving seat 25 and the lower probe moving seat 23, preventing damage to the two sets of expensive probes due to accidental operation. In actual operation, the upper moving seat drive motor 29 and the lower moving seat drive motor 26 can precisely drive the upper probe moving seat 25 and the lower probe moving seat 23 upwards or downwards, thereby causing the upper probe module 28 and the lower probe module 27 mounted on the upper probe moving seat 25 and the lower probe moving seat 23 to move up and down, achieving contact with the silicon wafer. By integrating the upper probe module 28 and the lower probe module 27 and their independent Z-axis drive mechanisms onto the same detection mounting base 21, not only is double-sided synchronous detection achieved, but also stepless and precise adjustment of the upper and lower probe spacing is achieved through independent control, flexibly adapting to silicon wafers of different thicknesses.

[0034] In this invention, the upper probe module 28 and the lower probe module 27 are driven by independent motors and can move simultaneously towards or away from each other. This allows the device to simultaneously complete the electrical performance testing of the upper and lower surfaces while the silicon wafer passes through once. Compared to the traditional single-sided testing method that requires flipping the silicon wafer or changing workstations, the testing efficiency is theoretically nearly doubled, and the risks of contamination and damage caused by the flipping process are avoided.

[0035] Reference Figure 1 and Figure 2As shown, this multi-wafer silicon wafer inspection adaptive adjustment device also includes a turntable feeding mechanism 3 installed on one side of the probe inspection component 2. The turntable feeding mechanism 3 includes a turntable drive motor 31 fixed on the base plate 4 and vertically upward. A central rotating shaft 32 is installed on the output shaft of the turntable drive motor 31. The turntable body 33 is installed on the central rotating shaft 32 and rotates with the central rotating shaft 32. The turntable body 33 is provided with four working stations 34. Each working station 34 is provided with the same number of hollow silicon wafer placement slots 35 as the inspection component adaptive adjustment mechanism 1. Each hollow silicon wafer placement slot 35 is provided with a bottom support bracket 36 to ensure that the thin and brittle silicon wafer does not bend or shift during the inspection process. In actual operation, the turntable drive motor 31 drives the central rotating shaft 32 to rotate the four working stations 34 set on the turntable body 33, which transport the silicon wafers placed in the silicon wafer placement slots 35 to the upper probe module 28 and the lower probe module 27 of the probe detection assembly 2. The intermittent rotation of the turntable body 33 and the high-precision positioning motion of the detection mechanism are precisely coordinated in time and space, which improves the efficiency and quality of silicon wafer detection.

[0036] This invention, by installing four parallel and independent detection units on the base plate 4 and cooperating with a turntable feeding mechanism 3 with four stations, forms a highly efficient workflow of "continuous feeding - parallel detection - continuous unloading". While one station is performing detection, the other stations can perform loading and unloading operations, achieving seamless connection of production cycles and significantly improving overall detection efficiency. At the same time, the modular design allows for the addition or removal of detection units according to the silicon wafer size, providing strong adaptability.

[0037] The above description is only a preferred embodiment of the present invention, but the present invention should not be limited to the content disclosed in the embodiments and drawings. Therefore, any equivalent or modified embodiments made without departing from the spirit of the present invention shall fall within the protection scope of the present invention.

Claims

1. A multi-wafer silicon wafer detection adaptive adjustment device, comprising a base plate, characterized in that: Multiple parallel and independently arranged adaptive adjustment mechanisms for detection components are installed on the base plate. Each adaptive adjustment mechanism for detection components is equipped with a corresponding probe detection component. Each adaptive adjustment mechanism includes a first end-edge adjustment mechanism and a second end-edge adjustment mechanism installed side-by-side and spaced along the X-direction on the base plate. An intermediate adjustment mechanism is installed between the first and second end-edge adjustment mechanisms. The first and second end-edge adjustment mechanisms have the same structure, both including a first Y-direction slide rail installed on the base plate. A first Y-direction slider seat is installed on the first Y-direction slide rail. A first X-direction slide rail is installed on top of the first Y-direction slider seat. A first X-direction slider seat is installed on top of the first X-direction slide rail. A first connecting bearing is installed on top of the first X-direction slider seat. A first transmission screw drive motor is installed on one side of the first Y-direction slider seat on the base plate. A first transmission screw pair is installed on the end side of the first Y-direction slider seat. The first transmission screw drive motor is connected to the first transmission screw pair via the first transmission screw; the intermediate adjustment mechanism includes a second X-axis slide rail mounted on the base plate, the second X-axis slide rail being located between the first Y-axis slide rails of the first end-edge adjustment mechanism and the second end-edge adjustment mechanism, a second X-axis slider seat mounted on the second X-axis slide rail, a second Y-axis slide rail mounted on the top of the second X-axis slider seat, a second Y-axis slider seat mounted on the top of the second Y-axis slide rail, a second connecting bearing mounted on the top of the second Y-axis slider seat, a second screw pair mounted on the bottom of the second X-axis slider seat, a second screw drive motor mounted on one side of the second screw pair, the second screw drive motor and the second screw pair being connected via the second screw, the first connecting bearings on the first end-edge adjustment mechanism and the second end-edge adjustment mechanism being connected to the second connecting bearings on the intermediate adjustment mechanism via a detection component mounting plate, and a probe detection component fixed on the detection component mounting plate.

2. The multi-wafer silicon wafer detection adaptive adjustment device as described in claim 1, characterized in that: The probe detection assembly includes a detection mounting base, which is fixed to a detection assembly mounting plate. A Z-axis slide rail is provided on the detection mounting base along the Z-axis. An upper probe moving base and a lower probe moving base are mounted side by side and spaced apart on the Z-axis slide rail. An upper moving base drive motor is set vertically upward along the Z-axis and connected to the upper probe moving base through a transmission screw. A lower moving base drive motor is set vertically downward along the Z-axis and connected to the lower probe moving base through a transmission screw. An upper probe module is mounted vertically downward at the front end of the upper probe moving base, and a lower probe module is mounted vertically upward at the front end of the lower probe moving base. A gap is maintained between the upper probe module and the lower probe module to allow the silicon wafer to pass through.

3. The multi-wafer silicon wafer detection adaptive adjustment device as described in claim 2, characterized in that: The Z-axis slide rail is provided with an intermediate limiting block in the middle to separate the upper probe moving seat from the lower probe moving seat.

4. The multi-wafer silicon wafer detection adaptive adjustment device as described in claim 1, characterized in that: A photoelectric sensor is provided on one side of the base plate, facing the first transmission lead screw pair, and a sensing block corresponding to the photoelectric sensor is installed on the first transmission lead screw pair.

5. The multi-wafer silicon wafer detection adaptive adjustment device as described in claim 1, characterized in that: A photoelectric sensor is provided on one side of the second lead screw pair on the base plate, facing the second lead screw pair. A sensing block corresponding to the photoelectric sensor is installed on the second lead screw pair.

6. The multi-wafer silicon wafer detection adaptive adjustment device as described in claim 1, characterized in that: Limiting posts are installed at both ends of the first Y-axis slide rail and at both ends of the second X-axis slide rail.

7. The multi-wafer silicon wafer detection adaptive adjustment device as described in claim 1, characterized in that... Also includes: A turntable feeding mechanism is installed on one side of the probe detection component. The turntable feeding mechanism includes a turntable drive motor fixed on the base plate and arranged vertically upward. A central rotating shaft is installed on the output shaft of the turntable drive motor. The turntable body is installed on the central rotating shaft and rotates with the central rotating shaft. The turntable body is provided with four working stations. Each working station is provided with a number of hollow silicon wafer placement slots that are the same as the number of adaptive adjustment mechanisms of the detection component.

8. The multi-wafer detection adaptive adjustment device as described in claim 7, characterized in that: Each hollowed-out silicon wafer is fitted with a base support bracket in its placement slot.

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