Method for adapting components

Abstract

The invention relates to a method for adapting a component, comprising the following steps: determining a first distance between a surface of a circuit board and a first reference on the component, ascertaining a first difference between the first distance and a predetermined position of the component relative to the circuit board, adapting the first distance by means of melting of the component caused by laser beam welding, the first difference is minimized.

Description

Technical Field

[0001] The present invention relates to a method for adapting components, a radar sensor unit, and a vehicle. Background Technology

[0002] Currently, there are many different solutions for monitoring and controlling welded joints. Due to the increasing number of welded joints and higher quality requirements in the automotive sector, there is a growing need for innovative and robust laser beam welding monitoring methods.

[0003] In the automotive sector, ongoing weight reduction efforts aimed at reducing fuel consumption and increased competition have created cost pressures, leading to a greater demand for cheaper and more efficient vehicle components. Summary of the Invention

[0004] The method for adapting components according to the invention, having the features of claim 1, has the advantages over known solutions in that the position of the housing or the distance between the circuit board and the reference point of each component can be determined individually, and the component is optimally modified according to the individual determination to reduce possible gaps, etc. Here, in particular, the actual dimensions of the splicing starting piece from the circuit board to the component can be measured, thereby determining the ideal length for the corresponding component. The component is adapted accordingly based on the optimal length, particularly by means of laser beam welding, which eliminates material to achieve the optimal value. More preferably, additional parts can be spliced ​​to the adapted portion simultaneously and / or in subsequent steps, for example by means of adaptive splicing.

[0005] According to the present invention, this is achieved in such a way that the method for adapting the component includes the following steps:

[0006] - Determine a first distance between the surface of the circuit board and a first reference on the component;

[0007] - Calculate the first difference between the first distance and the predetermined position of the component relative to the circuit board;

[0008] - The first distance is adapted by using the melting caused by welding the components with a laser beam to minimize the first difference.

[0009] In other words, by eliminating the support surface through laser beam welding, the distance between the circuit board arranged in the component and the component fixed to the component is arranged in a predetermined position. Here, the component can be, in particular, the housing of a radar sensor, etc. More preferably, the component can be, in particular, a cover that is transparent to the laser, which then acts as a so-called radome to enable the formation of a radar signal. Here, the laser transmitter cover or component should be arranged at a predetermined distance relative to the circuit board. To achieve this, the height of the component is adapted by means of melting caused by laser beam welding. For this purpose, the difference between the current position and the ideal position can be determined to adapt the laser beam welding accordingly. For example, the first measuring point can be located on the surface of the circuit board. For example, the second measuring point can also be located on the upper edge of the component. The first distance can be determined by means of the two measuring points. More preferably, the position of the component when it is installed without modifying the component can be determined by means of the first measuring point and / or the first distance. This position can be compared with the predetermined position of the component to form a first difference, which has a predetermined distance between the component and the circuit board. The component can be adapted based on a first difference, such that when the element is connected to the component, the element is located in a predetermined position.

[0010] The dependent claims illustrate preferred improvements to the invention.

[0011] Preferably, the method further includes the following steps:

[0012] - Determine the second distance between the mounting surface of the component and the first reference on the component.

[0013] - Starting from the first reference, the second distance is reduced by the first difference by means of the melting caused by the welding of the components by the laser beam.

[0014] The advantage of this embodiment is that the mounting surface can be automatically controlled during the welding of components using a laser beam, so that the first difference will not be exceeded during the process. Here, the second distance can in particular be the height of the component. More preferably, the height of the component is reduced by the first difference, especially by means of the melting caused by laser beam welding.

[0015] More preferably, the method includes the following steps:

[0016] - Determine and / or receive the predetermined position of the element relative to the first reference.

[0017] - Adapt the first difference based on the predetermined location.

[0018] The advantage of this implementation is that a predetermined position can be determined individually for each component based on a first reference. Therefore, potential errors or error chains can be detected in a timely manner when the first difference is determined.

[0019] More preferably, the method includes the following steps:

[0020] - Determine and / or the third difference between the position of the optical portion of the receiving element and the support surface of the element;

[0021] - Adapt the first difference based on the third difference.

[0022] The advantage of this embodiment is that if the element has protrusions, these protrusions can be further considered during the construction or fitting of the component. Therefore, in particular, the correct distance can be formed between the optical portion of the element and the circuit board.

[0023] Preferably, the method further includes the following steps:

[0024] - To obtain and / or receive at least one characteristic of the component,

[0025] - The components are adapted to the characteristics by melting caused by laser beam welding.

[0026] The advantage of this implementation is that laser beam melting can be adapted to the characteristics of the component, such as the material or substance. The component may be made of a specific plastic, such as PA6, wherein laser beam melting is adapted to the corresponding characteristics of the plastic so that the first defect of the component can be eliminated as accurately as possible.

[0027] More preferably, the method further includes the following steps:

[0028] - Determine the melting power based on the first difference.

[0029] - Calculate the second difference between the melting power and the cooling power.

[0030] - Adapt the first difference based on the second difference.

[0031] The advantage of this implementation is that subsequent paths can be taken into account during melting when cooling components or connecting parts, so as to suppress possible shape deviations.

[0032] More preferably, the method further includes the following steps:

[0033] - Receive and / or obtain process parameterization of melting caused by laser beam welding of components;

[0034] - Adapt the first difference based on process parameterization.

[0035] The advantage of this implementation is that the corresponding characteristics of the laser beam device can be taken into account, and therefore the corresponding parameters of the laser beam device can be adapted to the first difference, or adapted to the first difference according to the process parameters.

[0036] More preferably, the method further includes the following steps:

[0037] - The first distance is determined using optical or tactile measurement methods.

[0038] The advantage of this implementation is that if the components can already be arranged on the laser beam device, then the first difference can be obtained, and therefore the manufacturing cost can be reduced due to the short manufacturing time.

[0039] Another aspect of the present invention relates to a radar sensor unit having:

[0040] - Casing unit,

[0041] - Circuit board,

[0042] - Components,

[0043] The circuit board is arranged in the housing unit, and the components are arranged on the housing unit, wherein the components have predetermined positions relative to the circuit board, and the predetermined positions are achieved by adapting the housing unit by means of the methods described above and below.

[0044] Another aspect of the invention relates to a vehicle having a radar sensor unit as described above and subsequently and / or components adapted using the methods described above and subsequently. Attached Figure Description

[0045] Embodiments of the present invention will then be described in detail with reference to the accompanying drawings. In the drawings:

[0046] Figure 1 A radar sensor unit according to an embodiment is shown.

[0047] Figure 2 and Figure 3 A flowchart illustrating the steps of the method according to an embodiment is shown.

[0048] Figure 4 The radar sensor unit is shown, and

[0049] Figure 5 The vehicle is shown. Detailed Implementation

[0050] Preferably, all identical components, elements, and / or units in all figures are provided with the same reference numerals.

[0051] Figure 1A radar sensor unit 200 according to an embodiment is shown. The radar sensor unit 200 here has a housing unit 102 or a component 102. A circuit board 14 is arranged in the component 102 or housing unit 102. More preferably, an element 18 is arranged on the housing unit 102 or component 102. Here, the element 18 can be arranged in a predetermined position relative to the circuit board 14. A difference 17 may exist between the predetermined position and the actual position of the element 18. More preferably, a first difference 10 can be determined between a first reference 16 of the component 102 and the circuit board 14. The first difference can be obtained based on a comparison between the first distance 10 and the predetermined position of the element 18. More preferably, the first distance 10 can be processed by melting caused by laser beam welding of the component 102 based on the first difference. More preferably, a second distance 19 exists between the mounting plane 20 of the component 102 and the first reference 16 of the component 102. More preferably, a third difference 21 can be obtained between the position of the optical portion 22 of the element 18 and the support surface 24 of the element 18. More preferably, the circuit board 14 has a surface 12, and a first distance 10 can be formed between the surface and the first reference 16.

[0052] Figure 2 A flowchart illustrating the steps of method 100 according to an embodiment is shown. Method 100 for adapting component 102 includes the following steps:

[0053] - Determine the first distance 10 between the surface 12 of the S1 circuit board 14 and the first reference 16 on the component 102.

[0054] - Calculate the first difference between the first distance S2 10 and the predetermined position of component 18 relative to circuit board 14.

[0055] - The first distance 10 of S3 is adapted by means of the melting caused by laser beam welding of component 102 to minimize the first difference.

[0056] Figure 3 An embodiment of method 100 according to the embodiment is shown. Here, in Figure 3 In the middle, method 100 has the characteristics related to... Figure 2 The steps S1 to S3 described above are identical. Furthermore, method 100 also includes the step of determining the second distance 19 in step S4. More preferably, the method includes the steps of determining and / or receiving the predetermined position of element 18 in step S6 and adapting the first difference in step S7. More preferably, method 100 has the steps of determining and / or receiving the third difference 21 in step S8 and adapting the first difference in step S9.

[0057] Preferably, method 100 includes the steps of obtaining and / or receiving at least one characteristic of component 102 in step S10 and adapting to the melting caused by laser beam welding of component S11. Preferably, method 100 includes the steps of determining melting power in step S12, obtaining second difference in step S13, and adapting to first difference in step S14.

[0058] Preferably, method 100 has the steps of receiving and / or obtaining process parameterization S15 and adapting the first difference S16 according to the process parameterization.

[0059] More preferably, method 100 includes the step of determining the first distance 10 of S18 by means of an optical measurement method or a tactile measurement method.

[0060] Figure 4 A radar sensor unit 200 according to an embodiment is shown. The radar sensor unit 200 here has a housing unit 102, a circuit board 14, and an element 18. Furthermore, the circuit board 14 is arranged in the housing unit 102, wherein the element 18 is arranged on the housing unit 102, wherein the element 18 has a predetermined position relative to the circuit board 14, wherein the predetermined position is achieved by adapting the housing unit 102 by means of a method 100 as described above and subsequently.

[0061] Figure 5 A vehicle 300 according to an embodiment is shown. The vehicle 300 has a radar sensor unit 200 as described above and subsequently and / or a component 102 adapted using the method 100 as described above and subsequently.

Claims

1. A method for adapting a component (102), comprising the following steps: - Determine (S1) the first distance (10) between the surface (12) of the circuit board (14) and the first reference (16) on the component (102). - Calculate (S2) the first difference between the first distance (10) and the predetermined position of the component (18) relative to the circuit board (14). - The first distance (10) is adapted (S3) by means of the component (102) through the melting caused by laser beam welding to minimize the first difference.

2. The method (100) according to claim 1 further includes the following step: - Determine (S4) the second distance (19) between the mounting surface (20) of the component (102) and the first reference (16) on the component (102). - Starting from the first reference (16), the second distance (19) is reduced by the first difference (S5) by means of the melting caused by laser beam welding of the component (102).

3. The method (100) further includes the following steps: - Determine and / or receive (S6) the predetermined position of the element (18) relative to the first reference (16), - Adapt the first difference according to the predetermined position (S7).

4. The method (100) according to claim 3 further includes the following step: - Determine and / or receive (S8) the third difference (21) between the position of the optical portion (22) of the element (18) and the support surface (24) of the element (18). - Adapt (S9) the first difference based on the third difference (21).

5. The method (100) according to any one of the preceding claims further includes the following step: - To obtain and / or receive (S10) at least one characteristic of the component (102), - The component (102) is adapted (S11) to the characteristics of the laser beam welding caused by the melting of the laser beam welding.

6. The method (100) according to any one of the preceding claims further includes the following step: - Determine the melting power based on the first difference (S12), - Calculate the second difference between the melting power and the cooling power mentioned in (S13). - Adapt the first difference according to the second difference (S14).

7. The method (100) according to any one of the preceding claims further includes the following step: - Receive and / or obtain (S15) the process parameterization of the melting of the component (102) caused by laser beam welding. - Adapt the first difference according to the process parameterization (S16).

8. The method (100) according to any one of the preceding claims further includes the following step: - The first distance (10) is obtained by means of optical measurement methods or tactile measurement methods (S18).

9. A radar sensor unit (200) comprising: - Casing unit (102). - Circuit board (14). - Component (18) in, The circuit board (14) is arranged in the housing unit (102), wherein the element (18) is arranged on the housing unit (102), wherein the element (18) has a predetermined position relative to the circuit board (14), wherein the predetermined position is achieved by adapting the housing unit (102) by means of the method (100) according to any one of the preceding claims.

10. A vehicle (300) having a radar sensor unit (200) according to claim 9 and / or a component (102) adapted using the method (10) according to any one of claims 1 to 8.

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