Semiconductor manufacturing apparatus and setting method

Abstract

The semiconductor manufacturing apparatus is used for manufacturing a semiconductor, and includes: a container provided inside an apparatus frame of the semiconductor manufacturing apparatus; and a holding member which is housed inside the device frame together with the housed object and which can hold the housed object. The holding member includes: a base body; an attachment body attached to the lower portion of the storage object; and a lifting structure which is provided between the base body and the mounting body and which is capable of lifting the mounting body from the base body.

Description

Technical Field

[0001] This invention relates to semiconductor manufacturing apparatus and setup methods. Background Technology

[0002] Patent Document 1 discloses a semiconductor manufacturing apparatus comprising multiple multi-chamber processing modules. This apparatus houses a gas chamber for supplying gas to the processing modules and an electrical box for supplying electrical power to the processing modules in a storage space on the lower side of each processing module. Furthermore, the gas chamber and electrical box are equipped with casters at the bottom, allowing them to be pulled out to the outside of the processing modules.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: US Patent No. 9312155 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] This invention provides a technique for easily setting up a storage container for a semiconductor manufacturing apparatus.

[0008] Means for solving technical problems

[0009] According to one aspect of the present invention, a semiconductor manufacturing apparatus is provided, which is a semiconductor manufacturing apparatus for manufacturing semiconductors, characterized in that it includes: a housing disposed inside the apparatus frame of the semiconductor manufacturing apparatus; and a holding member disposed together with the housing inside the apparatus frame, capable of holding the housing, the holding member including: a base body; a mounting body mounted on the lower part of the housing; and a lifting structure disposed between the base body and the mounting body, capable of lifting the mounting body from the base body.

[0010] Invention Effects

[0011] Using one aspect of the present invention, it is possible to simply set up a storage container for a semiconductor manufacturing apparatus. Attached Figure Description

[0012] Figure 1 This is a diagram that schematically illustrates a plasma processing system according to an embodiment.

[0013] Figure 2 (A) is a schematic side view showing the power supply of the plasma processing device housed in the device rack. Figure 2 (B) is a three-dimensional diagram showing the state of the power supply setup process.

[0014] Figure 3 It is a three-dimensional view representing the retaining component.

[0015] Figure 4 This is the implementation method. Figure 3 An exploded perspective view of the retaining component.

[0016] Figure 5 It is a three-dimensional view showing the state in which the power supply housing is held by the retaining component.

[0017] Figure 6 This is a side view illustrating the adjustment of the height position of the retaining component.

[0018] Figure 7 (A) is a flowchart illustrating the process of mounting the power supply in a housing on the device frame. Figure 7 (B) is a flowchart illustrating the process of removing the power supply from the device frame using its housing.

[0019] Figure 8 (A) is a first perspective view showing a process of setting up the power supply housing 60. Figure 8 (B) indicates that it follows immediately. Figure 8 The second stereoscopic diagram of a process following (A). Figure 8 (C) indicates that it follows immediately. Figure 8 The third stereoscopic view of the process following (B). Detailed Implementation

[0020] Hereinafter, the embodiments for carrying out the present invention will be described with reference to the accompanying drawings. In the drawings, the same reference numerals are used to label the same components, and repeated descriptions are omitted.

[0021] First, refer to Figure 1 A plasma processing system is described, which includes a capacitively coupled plasma processing apparatus 1, which is an example of a semiconductor manufacturing apparatus as an embodiment. Figure 1 This is a diagram that schematically illustrates a plasma processing system according to an embodiment.

[0022] The plasma processing system includes a capacitively coupled plasma processing device 1 and a control unit 2. The capacitively coupled plasma processing device 1 includes a plasma processing chamber 10, a gas supply unit 20, a power supply 30, and an exhaust system 40. Additionally, the plasma processing device 1 includes a substrate support 11 and a gas inlet. The gas inlet is capable of introducing at least one processing gas into the plasma processing chamber 10. The gas inlet includes a spray head 13. The substrate support 11 is disposed within the plasma processing chamber 10. The spray head 13 is disposed above the substrate support 11. In one embodiment, the spray head 13 constitutes at least a portion of the ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the spray head 13, the sidewall 10a of the plasma processing chamber 10, and the substrate support 11. The plasma processing chamber 10 has at least one gas supply port for supplying at least one processing gas to the plasma processing space 10s; and at least one gas outlet for discharging gas from the plasma processing space. The sidewall 10a is grounded. The spray head 13 and the substrate support 11 are electrically insulated from the housing of the plasma processing chamber 10.

[0023] The substrate support portion 11 includes a main body portion 111 and a ring assembly 112. The main body portion 111 has a central region (substrate support surface) 111a for supporting a substrate (wafer) W; and an annular region (ring support surface) 111b for supporting the ring assembly 112. The annular region 111b of the main body portion 111 surrounds the central region 111a of the main body portion 111 when viewed from above. The substrate W is disposed on the central region 111a of the main body portion 111, and the ring assembly 112 is disposed on the annular region 111b of the main body portion 111 in such a way that it surrounds the substrate W on the central region 111a of the main body portion 111. In one embodiment, the main body portion 111 includes a base and an electrostatic chuck. The base includes conductive components. The conductive components of the base can function as a lower electrode. The electrostatic chuck is disposed on the base. The upper surface of the electrostatic chuck has the substrate support surface 111a. The ring assembly 112 includes one or more annular components. At least one of the one or more annular components is an edge ring. Additionally, although not shown in the figures, the substrate support 11 may include a temperature control module for adjusting at least one of the electrostatic chuck, ring assembly 112, and substrate to a target temperature. The temperature control module may include a heater, a heat transfer medium, a flow path, or a combination thereof. A heat transfer fluid such as brine or gas may flow in the flow path. Furthermore, the substrate support 11 may include a heat transfer gas supply section for supplying heat transfer gas between the back surface of the substrate W and the substrate support surface 111a.

[0024] The spray head 13 is capable of introducing at least one type of processing gas from the gas supply unit 20 into the plasma processing space 10s. The spray head 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b, and multiple gas inlets 13c. The processing gas supplied to the gas supply port 13a can be introduced into the plasma processing space 10s through the gas diffusion chamber 13b and the multiple gas inlets 13c. In addition, the spray head 13 includes a conductive component. The conductive component of the spray head 13 can function as an upper electrode. In addition, the gas inlet unit may include, in addition to the spray head 13, one or more side gas injectors (SGIs) installed on one or more openings formed on the sidewall 10a.

[0025] The gas supply unit 20 may include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply unit 20 is capable of supplying at least one type of processing gas from its respective gas source 21 to the spray head 13 via its respective flow controller 22. Each flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Furthermore, the gas supply unit 20 may include one or more flow modulation devices for modulating or pulsed the flow rate of the at least one type of processing gas.

[0026] The power supply 30 includes an RF power supply 31 coupled to the plasma processing chamber 10 via at least one impedance matching circuit. The RF power supply 31 is capable of supplying at least one RF signal (RF power), such as a source RF signal and a bias RF signal, to the conductive components of the substrate support 11 and / or the conductive components of the spray head 13. This allows plasma to be formed from at least one type of processing gas supplied to the plasma processing space 10s. Therefore, the RF power supply 31 can function as at least part of a plasma generation unit capable of generating plasma from one or more processing gases within the plasma processing chamber 10. Furthermore, by supplying a bias RF signal to the conductive components of the substrate support 11, a bias potential can be generated on the substrate W, attracting the ionic components of the formed plasma to the substrate W.

[0027] In one embodiment, the RF power supply 31 includes a first RF generation unit 31a and a second RF generation unit 31b. The first RF generation unit 31a is coupled to a conductive component of the substrate support 11 and / or a conductive component of the spray head 13 via at least one impedance matching circuit, and is capable of generating a source RF signal (source RF power) for plasma generation. In one embodiment, the source RF signal has a frequency in the range of 13MHz to 150MHz. In one embodiment, the first RF generation unit 31a may be capable of generating multiple source RF signals with different frequencies. The generated one or more source RF signals are supplied to the conductive components of the substrate support 11 and / or the conductive components of the spray head 13. The second RF generation unit 31b is coupled to a conductive component of the substrate support 11 via at least one impedance matching circuit, and is capable of generating a bias RF signal (bias RF power). In one embodiment, the bias RF signal has a frequency lower than that of the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 400kHz to 13.56MHz. In one embodiment, the second RF generation unit 31b may be capable of generating multiple bias RF signals with different frequencies. The generated one or more bias RF signals are supplied to the conductive components of the substrate support unit 11. Furthermore, in various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0028] Additionally, the power supply 30 may include a DC power supply 32 coupled to the plasma processing chamber 10. The DC power supply 32 includes a first DC generating unit 32a and a second DC generating unit 32b. In one embodiment, the first DC generating unit 32a is connected to a conductive component of the substrate support 11 and is capable of generating a first DC signal. The generated first DC signal is applied to the conductive component of the substrate support 11. In one embodiment, the first DC signal may also be applied to other electrodes, such as electrodes within an electrostatic chuck. In one embodiment, the second DC generating unit 32b is connected to a conductive component of the spray head 13 and is capable of generating a second DC signal. The generated second DC signal is applied to the conductive component of the spray head 13. In various embodiments, at least one of the first DC signal and the second DC signal may be pulsed. Furthermore, the first DC generating unit 32a and the second DC generating unit 32b may be provided in addition to the RF power supply 31, or the first DC generating unit 32a may replace the second RF generating unit 31b.

[0029] The exhaust system 40 can be connected, for example, to a gas outlet 10e located at the bottom of the plasma processing chamber 10. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure within the plasma processing space 10s can be regulated using the pressure regulating valve. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0030] The control unit 2 is capable of processing computer-executable commands to cause the plasma processing apparatus 1 to perform the various steps described herein. The control unit 2 may be configured to control various elements of the plasma processing apparatus 1 to perform the various steps described herein. In one embodiment, the control unit 2 may be part or entirely included in the plasma processing apparatus 1. The control unit 2 may, for example, include a computer 2a. The computer 2a may, for example, include a processing unit (CPU) 2a1, a storage unit 2a2, and a communication interface 2a3. The processing unit 2a1 may be configured to perform various control actions based on a program stored in the storage unit 2a2. The storage unit 2a2 may include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or combinations thereof. The communication interface 2a3 may communicate with the plasma processing apparatus 1 via a communication line such as a LAN (Local Area Network).

[0031] Figure 2 (A) is a schematic side view showing the state in which the power supply 30 of the plasma processing device 1 is housed in the device frame 50. Figure 2 (B) is a three-dimensional diagram showing the state of the power supply 30 during the setup process. For example... Figure 2 As shown in (A), the plasma processing apparatus 1 uses a power supply 30 installed in the plasma processing chamber 10 (see reference 10). Figure 1 The plasma processing devices 1 are assembled into an integrated unit on the lower side of the device frame 50. The device frame 50 defines the installation range of the plasma processing devices 1 in the width direction by housing each structure of the plasma processing device 1 inside and in the vertical direction. As a result, in a multi-chamber type substrate processing system having multiple plasma processing devices 1, each plasma processing device 1 can be installed in a manner that does not contact each other.

[0032] The device frame 50 of the embodiment is formed by assembling a pair of side frames 51 extending in the vertical direction and a plurality of bridging frames 52 erected between the pair of side frames 51 in the horizontal direction. Each side frame 51 and each bridging frame 52 can use components such as cylindrical rods or panels. By fixing each side frame 51 and each bridging frame 52 to each other using fixing means such as threaded fixing or welding, the device frame 50 can strongly support the various structures of the plasma processing apparatus 1 inside. The space of the device frame 50 that is lower than the plasma processing chamber 10 and surrounded by the pair of side frames 51 and the upper and lower bridging frames 52 becomes a storage space 50s for housing the power supply housing 60 for housing the power supply 30.

[0033] The power supply housing 60 is a housing that houses part or all of the power supply 30 described above. For example, the power supply housing 60 houses an RF power supply 31 for supplying electrical power to the substrate support 11 of the plasma processing chamber 10 (see reference). Figure 1 DC power supply 32 (refer to) Figure 1 In addition, the power supply housing 60 can also house power sources for supplying power to various structures of the plasma processing apparatus 1 (such as power sources for supplying power to electrostatic chucks and temperature control modules). Furthermore, other parts of the power supply 30 for supplying power to the spray head 13 of the plasma processing chamber 10 can be positioned above the plasma processing chamber 10.

[0034] The power supply housing 60 includes: a main housing 61 for housing the RF power supply 31 and the DC power supply 32 themselves; and a secondary housing 62 for housing the impedance matching circuit. The impedance matching circuit enables the impedance on the load side (substrate support 11 side) of the RF power supply 31 to match the output impedance of the RF power supply 31. The secondary housing 62 is formed smaller than the main housing 61, for example, it is fixed to the top plate of the main housing 61.

[0035] The dimensions (width, depth, height, etc.) of the power supply housing 60 vary accordingly, for example, in relation to the maximum voltage supplied by the power supply 30. Therefore, the storage space 50s of the device frame 50 that houses the power supply housing 60 has a size that is somewhat larger than the power supply housing 60 it houses.

[0036] As described above, the device frame 50 forms a storage space 50s for housing the power supply housing 60 using a pair of side frames 51 and two upper and lower bridging frames 52. Hereinafter, the lower bridging frame 52 will be referred to as the bottom frame 521, and the upper frame 52 will be referred to as the middle frame 522. Furthermore, a control box 53 is provided on one of the pair of side frames 51, which houses a control circuit board for controlling the power supply 30.

[0037] Multiple fixing structures 54 for securing the device frame 50 to the ground are provided on the lower part of a pair of side frames 51 and on the bottom frame 521. Each fixing structure 54 includes a leveling device 541 and a fixing fixture 542 fixed to the outside of the leveling device 541. Each leveling device 541 is mounted on the lower part of the bottom frame 521 and is height-adjustable. By adjusting the height of each leveling device 541, each bridging frame 52, including the bottom frame 521, can be set to be parallel to the horizontal direction. Each fixing fixture 542 is formed as a right-angled triangle and is connected to a pair of side frames 51 of the device frame 50 whose height is adjusted by each leveling device 541, thereby supporting the upright posture of the device frame 50.

[0038] like Figure 2 (A) and Figure 2 As shown in (B), with the power supply housing 60 placed in the storage space 50s, a trolley 70 and a lifting fixture 75 are used. That is, the operator mounts the power supply housing 60 on the trolley 70 and inserts the power supply housing 60 into the storage space 50s by moving the power supply housing 60 and the trolley 70. Figure 2 (A) shows the power supply housing 60 mounted on the trolley 70. Then, the operator inserts a... Figure 2 The lifting fixture 75 shown in (B) is used to raise the power supply housing 60 and the trolley 70. Then, with the power supply housing 60 raised, the operator inserts a pair of retaining members 80 to hold the power supply housing 60 in place. After holding the power supply housing 60 in place with the retaining members 80, the lifting fixture 75 is removed from the device frame 50. The trolley 70 can be integrated with the power supply housing 60, or it can be detached from the power supply housing 60 and removed from the device frame 50.

[0039] The trolley 70 has a flat panel 71 and multiple casters 72 mounted on the underside of the panel 71. Additionally, a tilting frame 55 is assembled on the opening side of the storage space 50s in the bottom frame 521, allowing the trolley 70, which carries the power supply housing 60, to move on the tilting frame 55. The tilting frame 55 can be configured such that it is mounted on the bottom frame 521 when the power supply housing 60 is stored in the storage space 50s using the trolley 70, and is removed after storage.

[0040] The lifting fixture 75 includes a main body 76, a platform 77 that is in direct contact with the power supply housing 60 above the main body 76, and a handle 78 protruding from the main body 76. The main body 76 has a lifting mechanism (not shown) inside, which can raise the platform 77 based on rotation of the handle 78 in a first direction and lower the platform 77 based on rotation of the handle 78 in a second direction.

[0041] The vertical height of the storage space 50s is higher than the overall height of the power supply housing 60 obtained by overlapping the main housing 61 and the secondary housing 62. Therefore, the plasma processing apparatus 1 is configured such that the height position of the power supply housing 60 can be maintained by a pair of holding members 80, which slide and insert relative to the power supply housing 60. During the storage space 50s, the power supply housing 60 is stably held by the pair of holding members 80, allowing the lifting fixture 75 and the trolley 70 to smoothly detach from the power supply housing 60.

[0042] Figure 3 This is a perspective view showing the holding member 80 of the embodiment. Figure 4 yes Figure 3 An exploded perspective view of the retaining component 80. (See attached image.) Figure 3 and Figure 4 As shown, a pair of retaining components 80 are assembled from multiple components to be able to be stored in the storage space 50s (see reference). Figure 2 A long, narrow fixture is inserted into the depth direction of the device frame 50 through the opening of (B). Specifically, the holding member 80 has: a base body 81 disposed below; a mounting body 82 that can be mounted on the power supply housing 60 above the base body 81; and a lifting structure 83 disposed between the base body 81 and the mounting body 82 that allows the mounting body 82 to rise from the base body 81. In addition, the mounting body 82 in the embodiment is connected via the lower side fixture 90 described later (see Figure 5 The power supply housing 60 is installed, but the plasma processing device 1 can also be a structure in which the mounting body 82 is directly installed in the power supply housing 60.

[0043] The base body 81 is formed into a square tube shape that is thicker than the mounting body 82 and the lifting structure 83, and extends in a straight line. The length of the base body 81 in the extension direction (length direction) is set to be slightly shorter than the length in the depth direction of the storage space 50s.

[0044] At one end of the upper surface of the base body 81, a threaded hole 811 and a locking hole 812 for mounting the lifting structure 83 are formed. Furthermore, the end of the base body 81 with the threaded hole 811 and the locking hole 812 forms a stepped surface 81a that is lower than the other parts. Moreover, on the upper surface of the base body 81, adjacent to the stepped surface 81a, a guide groove 813 for guiding the lifting structure 83 is formed. The guide groove 813 extends from the stepped surface 81a to a position at the middle of the extending direction of the base body 81.

[0045] At one end of the base body 81, there are side frames 51 for connecting the retaining component 80 to the device frame 50 (see reference). Figure 2 The connecting member 89 is formed in an L-shape by bending a long plate. The connecting member 89 includes: a base body side connecting portion 891 connected to the base body 81; and a frame side connecting portion 892 connected to the base body side connecting portion 891 in a manner orthogonal to the base body side connecting portion 891 and extending in the width direction of the base body 81 to connect to the side frame 51.

[0046] On one end of the base body 81, on a pair of left and right side surfaces, threaded holes 814 are formed through for threading the base body side connecting portion 891 of the connecting member 89. For example, the base body side connecting portion 891 of the connecting member 89 can be threaded to the left side of the base body 81, so that the frame side connecting portion 892 protrudes to the right side of the base body 81 (see reference). Figure 3 Therefore, the rack-side connecting portion 892 can be connected to the right side rack 51 (threaded fixation). Conversely, the base-side connecting portion 891 of the connecting member 89 can be threaded to the right side of the base body 81, so that the rack-side connecting portion 892 protrudes to the left side of the base body 81. Therefore, the rack-side connecting portion 892 can be connected to the left side rack 51 (threaded fixation).

[0047] Additionally, the base body 81 has a positioning portion 815 at the opposite end to one end, which is used to position the base body 81 in the depth direction when the holding member 80 is housed in the storage space 50s. In this embodiment, the positioning portion 815 is formed by cutting off the corners of the other end face and the lower surface of the base body 81.

[0048] On the other hand, the mounting body 82, like the base body 81, is cylindrical and extends in a straight line. The length of the mounting body 82 in the extending direction (length direction) is shorter than the length of the base body 81 in the extending direction. For example, the length of the mounting body 82 in the extending direction is the same as the length of the lower side fixture 90 installed at the lower part of the power supply housing 60 (see reference). Figure 5 At one end of the mounting body 82, a threaded hole 824 is provided for threaded fixing to the lower side fixture 90.

[0049] A through hole 821 extending vertically is formed within a certain range in the middle of the mounting body 82. The other end of the support body 84 of the lifting structure 83 is inserted into the through hole 821. The through hole 821 in the mounting body 82 is formed in a configuration where a pair of left and right extension plates 822 extend along the length direction. Each extension plate 822 has a connecting hole 823 for connecting to the support body 84 of the lifting structure 83. The pair of left and right connecting holes 823 are located exactly in the middle of the extending direction of the mounting body 82.

[0050] The lifting structure 83 is a structure disposed between the base body 81 and the mounting body 82. The lifting structure 83 includes: a support body 84; and a height adjustment member 85 connected to one end of the support body 84 and to the base body 81. In addition, the lifting structure 83 has a connecting pin 86 for connecting the support body 84 and the height adjustment member 85, and a connecting pin 87 for connecting the support body 84 and the mounting body 82.

[0051] The support body 84 is formed into a square tube shape that is slightly thinner than the mounting body 82, and extends in an arc shape along its length. A pin hole 841 extending through in the left-right direction is formed on one end side of the support body 84. In addition, a pin hole 842 extending through in the left-right direction is formed on the other end side of the support body 84.

[0052] By inserting the other end of the support body 84 into the through hole 821 of the mounting body 82, and inserting the connecting pin 87 with the connecting hole 823 of the mounting body 82 overlapping the pin hole 842, the other end of the support body 84 can be connected to the mounting body 82. The connecting pin 87 can be prevented from disengaging by the anti-disengagement member 87a. The mounting body 82 is connected to the support body 84 in a rotatable manner (free state), and the angle between the mounting body 82 and the support body 84 can be freely changed.

[0053] On the other hand, the height adjustment member 85, when viewed from above, is shaped like a U-shape capable of clamping the support body 84. Specifically, the height adjustment member 85 has: a block-shaped base 851; a pair of protruding pieces 852 that protrude shortly from the base 851 to the other end; and a locking pin 853 that protrudes downward from the lower surface of the base 851. In addition, the height adjustment member 85 includes a height adjustment screw 88 (see reference). Figure 5 The height adjustment screw 88 can be inserted into the insertion hole 854 at one end of the base 851 (opposite to the side of the locking pin 853 and each protruding piece 852 (the connection part connected to the support body 84)).

[0054] One end of the support body 84 can be housed between a pair of protruding pieces 852 of the height adjustment member 85. Connecting holes 855 are formed through each of the protruding pieces 852. By inserting one end of the support body 84 between the pair of protruding pieces 852 of the height adjustment member 85, and inserting a connecting pin 86 with each connecting hole 855 overlapping with a pin hole 842, one end of the support body 84 can be connected to the height adjustment member 85. The connecting pin 86 is prevented from disengaging by an anti-disengagement member 86a. The height adjustment member 85 and the support body 84 are connected in a manner that allows them to rotate relative to each other (free state).

[0055] The engagement pin 853 of the height adjustment component 85 is inserted into the engagement hole 812 of the base body 81 and engages with the base body 81. The engagement pin 853 is formed to be slightly thicker than the engagement hole 812, so that the distance between the height adjustment component 85 and the base body 81 can be changed and its height maintained as the height of the height adjustment component 85 is adjusted.

[0056] Figure 5 This is a perspective view showing the power supply housing 60 being held by the retaining member 80. (For example...) Figure 5 As shown, when the retaining member 80 holds the power supply housing 60, it is held in place by inserting the height adjustment screw 88 into the insertion hole 854 and the threaded hole 811 of the base body 81 (see reference). Figure 4 The support body 84 is used for threaded fixing, and the height of the mounting body 82 can be adjusted. By adjusting the engagement degree of the height adjusting screw 88 with the nut 88n or the threaded hole 811, the height can be changed in the vertical direction. Therefore, the height adjusting component 85 can adjust the height of one end of the support body 84 based on the engagement degree of the height adjusting screw 88.

[0057] The support body 84 is supported in the guide groove 813 of the base body 81 at a midpoint between the end connected to the height adjustment member 85 and the other end connected to the mounting body 82. Specifically, the lower surface of one end of the support body 84 contacts the bottom surface of the guide groove 813. From this contact portion, as the support body 84 bends, the other end of the support body 84 extends obliquely upward and supports the mounting body 82. The contact portion of the support body 84 serves as a fulcrum supporting the mounting body 82 and the power supply housing 60.

[0058] In other words, the lifting structure 83 uses the contact portion of the support body 84 as the fulcrum, one end of the support body 84 (the connection part connected to the height adjustment component 85) as the force application point, and the other end of the support body 84 (the connection part connected to the mounting body 82) as the action point, using the lever principle to support the mounting body 82. That is to say, the support body 84 is an integral and continuous component with a force application point, a fulcrum, and an action point. As a result, the operator of the power supply housing 60 can easily adjust the height position of the mounting body 82 connected to the action point by operating the height adjustment component 85 on one end of the holding component 80.

[0059] Additionally, the retaining member 80 holds the power supply housing 60 via the lower side fixture 90. The lower side fixture 90, when viewed from the front of the power supply housing 60, is L-shaped, holding the corners of the power supply housing 60 in the left-right direction, and extends in the depth direction of the power supply housing 60. The mounting body 82 of the lower side fixture 90 and the retaining member 80 is connected by a fastening bolt 91 and a threaded hole 824 formed at one end of the mounting body 82 (see reference). Figure 3 They are screwed together and fixed to each other. That is to say, the connection between the mounting body 82 and the lower side fixture 90 can also be made at one end of the retaining component 80, and the operator can easily set up the power supply housing 60.

[0060] Figure 6 This is a side view illustrating the height position adjustment of component 80. Figure 6 (A) indicates a configuration where the mounting body 82 is positioned high. Figure 6 (B) indicates a configuration where the mounting body 82 is positioned low. For example... Figure 6 As shown in (A), the lower support fixture 90 and the power supply housing 60 (see reference) are to be installed. Figure 5 When the height of the mounting body 82 is set high, the height adjusting screw 88 is screwed deeper into the nut 88n or the base body 81. The height adjusting member 85, pressed by the height adjusting screw 88, is displaced to a lower position. In other words, the height adjusting member 85 is positioned such that the gap between the base body 81 and the base 851 of the height adjusting member 85 is narrowed. As a result, one end of the support body 84 connected to the height adjusting member 85 is also pushed down to a lower position.

[0061] The support body 84, which is pushed down at one end by the height adjustment member 85, extends in a generally straight line from one end (the point of force application) to a certain range. This part contacts the base body 81 to form a fulcrum (support range). The curved portion of the support body 84 extends at a steeper angle after leaving the fulcrum, thereby enabling the mounting body 82, which is connected to the other end (the point of application), to be positioned at a higher position.

[0062] On the other hand, such as Figure 6As shown in (B), when the height of the mounting body 82 is to be set low, the height adjusting screw 88 is screwed shallowly into the nut 88n or the base body 81. The height adjusting member 85, pressed by the height adjusting screw 88, is displaced to a higher position. In other words, the height adjusting member 85 is positioned such that the gap between the base body 81 and the base 851 of the height adjusting member 85 is widened. As a result, one end of the support body 84 connected to the height adjusting member 85 is also pushed upward to a higher position.

[0063] The support body 84, which is pushed upward by the height adjustment member 85 at one end, extends downward with a slight bend from one end (the point of force application). Furthermore, the bent extension of the support body 84 contacts the base body 81, thus forming a fulcrum (support range). At this time, the fulcrum of the support body 84 becomes... Figure 6 The fulcrum of the support body 84 in (A) has been moved in the depth direction. The length of the bend in the support body 84 from the fulcrum to the mounting body 82 connected to the other end (point of action) is shortened, allowing the mounting body 82 to be positioned at a lower position.

[0064] As described above, the retaining member 80 can easily adjust the height position of the mounting body 82 supported by the support body 84 using the height adjustment member 85 and the height adjustment screw 88 on one end. Thus, the retaining member 80 can absorb differences in equipment and assembly errors in the power supply housing 60, and position the power supply housing 60 in the appropriate position within the storage space 50s.

[0065] The semiconductor manufacturing apparatus (plasma processing apparatus 1) of the embodiment is basically configured as described above. Hereinafter, the method of setting the power supply housing 60 in the apparatus frame 50 will be described. Figure 7 (A) is a flowchart illustrating the method of mounting the power supply housing 60 on the device frame 50. Figure 7 (B) is a flowchart illustrating the process of removing the power supply housing 60 from the device frame 50. Figure 8 (A) is a first perspective view showing a process of setting up the power supply housing 60. Figure 8 (B) indicates that it follows immediately. Figure 8 The second stereoscopic diagram of a process following (A). Figure 8 (C) indicates that it follows immediately. Figure 8 The third stereoscopic view of the process following (B).

[0066] like Figure 7As shown in (A), in the setup method, the power supply housing 60 is first mounted on the trolley 70 to integrate them, and the power supply housing 60 together with the trolley 70 is then placed into the storage space 50s of the device frame 50 (step S101). Additionally, the lower side fixture 90 can be installed on the power supply housing 60 after it is mounted on the trolley 70 (see [reference]). Figure 5 Alternatively, the lower side fixture 90 can be pre-installed before being mounted on the trolley 70. After climbing the inclined frame 55 of the device frame 50, the trolley 70 moves on the bottom frame 521, thereby entering the storage space 50s. Thus, the operator can smoothly position the power supply housing 60 in the storage space 50s.

[0067] Next, the operator moves the lifting fixture 75 into the lower part of the power supply housing 60, which is supported by the trolley 70, within the storage space 50s of the device frame 50, and then uses the lifting fixture 75 to raise the power supply housing 60 (step S102). Specifically, as... Figure 8 As shown in (A), the lifting fixture 75 is inserted into the space between the bottom frame 521 and the panel 71 of the trolley 70 through the opening of the storage space 50s. The lifting fixture 75 is positioned approximately at the center of the width of the power supply housing 60. The operator then raises the platform 77 by rotating the handle 78 of the lifting fixture 75, bringing the platform 77 into contact with the panel 71 of the trolley 70, and further raises the power supply housing 60.

[0068] After the power supply housing 60 is raised using the lifting fixture 75, the operator inserts a pair of retaining members 80 into the lower part of the power supply housing 60 within the storage space 50s, and sets each retaining member 80 on the device frame 50 (step S103). Figure 8 As shown in (B), the operator adjusts the extension direction of each retaining component 80 so that it extends from the opening of the storage space 50s towards the depth direction, and inserts each retaining component 80 in a straight line. Figure 5 As shown, a guide member 56 is fixed to the upper surface of the bottom frame 521 of the device frame 50. This guide member 56 guides the insertion direction of the retaining member 80 and restricts its movement in the depth direction. When the retaining member 80 enters in the depth direction, a positioning portion 815, formed by cutting off the lower part of its other end, is caught by the guide member 56. This allows the retaining member 80 to be positioned relative to the bottom frame 521.

[0069] Next, the operator lifts the mounting body 82 from the base body 81 to fix the lower side fixture 90 of the power supply housing 60 and the mounting body 82, and then screws in the height adjustment screw 88 of the height adjustment component 85, thereby lifting the power supply housing 60 from the lifting fixture 75 (step S104). Figure 8As shown in (C), a pair of retaining members 80 raise the power supply housing 60, thereby making the power supply housing 60 held by only the retaining members 80.

[0070] like Figure 2 As shown in (A), the power supply housing 60 can be fixed to the device frame 50 by the fixing member 58 while being held by a pair of holding members 80. Additionally, in Figure 2 In (A), the state in which the sub-housing 62 is fixed to the intermediate frame 522 by the fixing member 58 is shown. However, the method of fixing the device frame 50 and the power supply housing 60 is not limited to this. For example, a structure in which the main housing 61 is connected to the device frame 50 (side frame 51, etc.) can also be used.

[0071] Finally, the operator removes the lifting fixture 75 from the device frame 50 and disengages the trolley 70 from the lower part of the power supply housing 60, which is raised by a pair of retaining components 80, so that the trolley 70 retracts from the device frame 50. Figure 7 (Step S105). Thus, the operator can efficiently construct a state in which the power supply housing 60 and each holding component 80 are housed in the storage space 50s of the device frame 50.

[0072] Furthermore, during maintenance operations of the plasma processing apparatus 1, the power supply housing 60 is removed from the apparatus frame 50 for inspection, repair, replacement, etc. The method for removing the power supply housing 60 from the apparatus frame 50 is as follows: Figure 7 As shown in (B), the power supply housing 60 can be easily removed by performing the process that is the reverse of the setting method.

[0073] Specifically, the operator first moves the trolley 70 and the lifting fixture 75 into the lower part of the power supply housing 60, which is raised by a pair of holding members 80, inside the device frame 50, and uses the platform 77 of the lifting fixture 75 to support the power supply housing 60 (step S111).

[0074] Then, the operator operates the height adjustment screw 88 on one end side of the retaining member 80 (the opening side of the storage space 50s) to release the lifting of the power supply housing 60 achieved by the retaining member 80 (step S112). At this time, the operator releases the fixing of the mounting body 82 to the lower side fixture 90 and gradually loosens the screw of the height adjustment screw 88. As a result, each retaining member 80 smoothly descends relative to the lower side fixture 90 of the power supply housing 60.

[0075] Then, the operator detaches the pair of retaining members 80 from the device frame 50 (step S113). That is, each retaining member 80 is stored in a detachable manner relative to the power supply housing 60 while the power supply housing 60 is inside the device frame 50, so that it can be removed at different times from the power supply housing 60.

[0076] Then, the operator operates the handle 78 of the lifting fixture 75 to lower the platform 77, thereby bringing the casters 72 of the trolley 70, which houses the power supply housing 60, into contact with the bottom frame 521 (step S114). The operator further lowers the platform 77 to disengage the lifting fixture 75 from the trolley 70, allowing the lifting fixture 75 to be removed. Thus, the operator detaches the lifting fixture 75 from the device frame 50.

[0077] Finally, the operator reverses the trolley 70, thereby pulling the power supply housing 60 out of the device frame 50 (step S115). By using the removal method described above, the operator can smoothly remove the power supply housing 60 from the device frame 50.

[0078] As described above, by using the holding members 80, the plasma processing apparatus 1 can easily position and fix the power supply housing 60, which is a storage item housed in the apparatus frame 50. Therefore, the plasma processing apparatus 1 can improve the operator's operational efficiency in relative to the internal arrangement of the apparatus frame 50, and in retrieving the power supply housing 60. In particular, by using a pair of holding members 80 to hold the power supply housing 60, the plasma processing apparatus 1 can stably hold the power supply housing 60 within the apparatus frame 50.

[0079] Furthermore, the retaining member 80 utilizes a lever principle to raise the power supply housing 60, allowing the operator to operate from one end of the retaining member 80, thus avoiding operation from the inner (deep) side of the device frame 50. Moreover, the retaining member 80 utilizes an integrally continuous support body 84 to achieve the lever principle, thereby increasing the strength of the power supply housing 60. In particular, the support body 84 is formed with a curved shape near the fulcrum, further enhancing strength. Furthermore, by engaging the height adjustment screw 88 of the operating height adjustment member 85, the operator can easily adjust the height of the mounting body 82.

[0080] Furthermore, the technology of the present invention is not limited to the embodiments described above, and various modifications can be made. For example, the storage object housed inside the device frame 50 is not limited to the power supply housing 60, and can be applied to various components of a semiconductor manufacturing apparatus. In this case, by using a holding member 80 on the component of the semiconductor manufacturing apparatus, the component can also be configured in a raised form.

[0081] Furthermore, the semiconductor manufacturing apparatus is not limited to the plasma processing apparatus 1 described above. For example, it can also be applied to various apparatuses that perform substrate processing such as film formation, etching, cleaning, temperature regulation, bonding, and stripping, or to apparatuses that inspect substrates W or transport substrates W.

[0082] Furthermore, the retaining member 80 housed within the device frame 50 is not limited to a pair; it can be one or more than three. For example, when using one retaining member 80, one could widen the base body 81, mounting body 82, and support body 84 in the width direction, or increase the number of base bodies 81, mounting bodies 82, and support bodies 84.

[0083] The embodiments disclosed above include, for example, the following technical solutions.

[0084] [Postscript 1]

[0085] A semiconductor manufacturing apparatus, which is a semiconductor manufacturing apparatus for manufacturing semiconductors, is characterized by comprising:

[0086] Storage items, which are arranged inside the device rack of the semiconductor manufacturing apparatus; and

[0087] A retaining component, which, together with the storage item, is housed inside the device frame, is capable of holding the storage item.

[0088] The retaining component includes: a base body; a mounting body installed at the lower part of the storage object; and a lifting structure disposed between the base body and the mounting body, enabling the mounting body to rise from the base body.

[0089] [Postscript 2]

[0090] The semiconductor manufacturing apparatus according to Appendix 1 is characterized in that:

[0091] The lifting structure is a structure that uses the lever principle to raise the mounting body.

[0092] [Postscript 3]

[0093] The semiconductor manufacturing apparatus according to Appendix 2 is characterized in that:

[0094] The lifting structure includes an integral, continuous support body having a force application point, a fulcrum supported by the base body, and an action point connected to the mounting body.

[0095] [Postscript 4]

[0096] The semiconductor manufacturing apparatus according to Appendix 3 is characterized in that:

[0097] The lifting structure has a height adjustment component connected to the force application point of the support body, which can adjust the height of the force application point.

[0098] [Postscript 5]

[0099] The semiconductor manufacturing apparatus according to Appendix 4 is characterized in that:

[0100] The height adjustment component has a height adjustment screw at the end opposite to the connection portion that connects to the support body, which can be screwed into the base body.

[0101] [Postscript 6]

[0102] The semiconductor manufacturing apparatus according to any one of Appendices 3 to 5 is characterized in that:

[0103] The support extends in a curved manner from the point of force application toward the point of action.

[0104] [Postscript 7]

[0105] The semiconductor manufacturing apparatus according to any one of Appendices 3 to 6 is characterized in that:

[0106] The support body is rotatably connected to the mounting body at the point of application.

[0107] [Postscript 8]

[0108] The semiconductor manufacturing apparatus according to any one of Appendices 1 to 7 is characterized in that:

[0109] The retaining component is detachable from the storage object when the storage object is located inside the device frame.

[0110] [Postscript 9]

[0111] The semiconductor manufacturing apparatus according to Appendix 8 is characterized in that:

[0112] The retaining member has a positioning portion that can slide relative to the device frame and thus be positioned on the device frame.

[0113] [Postscript 10]

[0114] The semiconductor manufacturing apparatus according to any one of Appendices 1 to 9 is characterized in that:

[0115] A pair of retaining members are provided at the bottom of the storage item.

[0116] [Postscript 11]

[0117] The semiconductor manufacturing apparatus according to any one of Appendices 1 to 10 is characterized in that:

[0118] The housing is a power supply housing that houses a power source that can be used in the semiconductor manufacturing apparatus.

[0119] [Postscript 12]

[0120] A method for setting up a housing in a semiconductor manufacturing apparatus for manufacturing semiconductors, characterized by comprising:

[0121] Step (A) involves storing the container inside the apparatus frame of the semiconductor manufacturing apparatus;

[0122] Step (B), after step (A), involves retrieving the retaining component inside the device frame and at the lower part of the retrieved item; and

[0123] Step (C), after step (B), involves operating a lifting structure disposed between the base of the retaining member and the mounting body installed at the lower part of the storage object, so that the mounting body rises relative to the base.

[0124] The semiconductor manufacturing apparatus and arrangement method disclosed herein are illustrative and not limiting in all respects. The embodiments can be modified and altered in various ways without departing from the appended claims and their spirit. The items described in the foregoing embodiments can also be employed in other configurations and combinations without contradiction.

[0125] The substrate processing apparatus of the present invention can be applied to any type of apparatus among atomic layer deposition (ALD) apparatus, capacitively coupled plasma (CCP) apparatus, inductively coupled plasma (ICP) apparatus, radial line slot antenna (RLSA) apparatus, electron cyclotron resonance plasma (ECR) apparatus, and helicon wave plasma (HWP) apparatus.

[0126] This application claims priority to Basic Application No. 2023-187933 filed with the Japan Patent Office on November 1, 2023, the entire contents of which are incorporated herein by reference.

[0127] Explanation of reference numerals in the attached figures

[0128] 1. Plasma processing apparatus, 50. Apparatus frame, 60. Power supply housing, 80. Holding component, 81. Base body, 82. Mounting body, 83. Lifting structure.

Claims

1. A semiconductor manufacturing apparatus, which is a semiconductor manufacturing apparatus for manufacturing semiconductors, characterized in that, include: Storage items, which are arranged inside the device rack of the semiconductor manufacturing apparatus; and A retaining component, which, together with the storage item, is housed inside the device frame, is capable of holding the storage item. The retaining component includes: a base body; a mounting body installed at the lower part of the storage object; and a lifting structure disposed between the base body and the mounting body, enabling the mounting body to rise from the base body.

2. The semiconductor manufacturing apparatus according to claim 1, characterized in that: The lifting structure is a structure that uses the lever principle to raise the mounting body.

3. The semiconductor manufacturing apparatus according to claim 2, characterized in that: The lifting structure includes an integral, continuous support body having a force application point, a fulcrum supported by the base body, and an action point connected to the mounting body.

4. The semiconductor manufacturing apparatus according to claim 3, characterized in that: The lifting structure has a height adjustment component connected to the force application point of the support body, which can adjust the height of the force application point.

5. The semiconductor manufacturing apparatus according to claim 4, characterized in that: The height adjustment component has a height adjustment screw at the end opposite to the connection portion that connects to the support body, which can be screwed into the base body.

6. The semiconductor manufacturing apparatus according to claim 3, characterized in that: The support extends in a curved manner from the point of force application toward the point of action.

7. The semiconductor manufacturing apparatus according to claim 3, characterized in that: The support body is rotatably connected to the mounting body at the point of application.

8. The semiconductor manufacturing apparatus according to any one of claims 1 to 7, characterized in that: The retaining component is detachable from the storage object when the storage object is located inside the device frame.

9. The semiconductor manufacturing apparatus according to claim 8, characterized in that: The retaining member has a positioning portion that can slide relative to the device frame and thus be positioned on the device frame.

10. The semiconductor manufacturing apparatus according to any one of claims 1 to 7, characterized in that: A pair of retaining members are provided at the bottom of the storage item.

11. The semiconductor manufacturing apparatus according to any one of claims 1 to 7, characterized in that: The housing is a power supply housing that houses a power source that can be used in the semiconductor manufacturing apparatus.

12. A method for setting up a housing in a semiconductor manufacturing apparatus for manufacturing semiconductors, characterized in that, have: Step (A) involves storing the container inside the apparatus frame of the semiconductor manufacturing apparatus; Step (B), after step (A), involves retrieving the retaining component inside the device frame and at the lower part of the retrieved item; and Step (C), after step (B), involves operating a lifting structure disposed between the base of the retaining member and the mounting body installed at the lower part of the storage object, so that the mounting body rises relative to the base.

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