Material screening methods, systems, devices, apparatuses, and media

Abstract

This application provides a material screening method, system, apparatus, equipment, and medium. The material screening method includes: performing image scanning processing on materials on a conveyor belt to obtain a test image; uploading the test image to a host computer for identification processing to receive an abnormal material rejection signal fed back by the host computer; responding to the abnormal material rejection signal, performing phase alignment processing between the current scanning sequence and the abnormal material rejection signal based on a synchronous clock to obtain an aligned abnormal material rejection signal; and rejecting abnormal materials according to the aligned abnormal material rejection signal. The material screening method of this application can directly control material screening using hardware, improving the accuracy and efficiency of material screening.

Description

Technical Field

[0001] This application belongs to the field of material screening technology, and relates to a material screening method, and particularly to a material screening method, system, apparatus, equipment and medium. Background Technology

[0002] In industrial production, material screening is a crucial pre-processing step to ensure product quality and production efficiency, widely used in mining, food, chemical, and renewable resources industries. Its core objective is to achieve efficient and accurate grading and purification based on the material's size, shape, density, or optical properties. Current mainstream automated screening technologies heavily rely on the coordinated control of software programs and sensing systems. Typically, the system scans material images or signals using visual sensors or spectrometers, performs feature analysis and identification through preset algorithms, and finally, an actuator (such as a valve or robotic arm) completes the sorting action. However, this approach has significant limitations: firstly, its recognition accuracy is constrained by the robustness of the software algorithm and the resolution of the sensing hardware. When faced with complex backgrounds, overlapping materials, or subtle differences in properties, it is prone to misjudgments and missed judgments, making it difficult to continuously improve sorting accuracy; secondly, the entire process involves multiple interconnected stages from data scanning and computational analysis to physical execution, resulting in system response lag, making it difficult to match high-speed, continuous production cycles and limiting overall processing efficiency.

[0003] Therefore, existing screening technologies that rely on traditional software control modes face dual bottlenecks in terms of accuracy and efficiency, making it difficult to meet the ever-increasing demands of modern industry for sorting effectiveness and production capacity, and urgently requiring technological breakthroughs and innovations. Summary of the Invention

[0004] This application provides a material screening method, system, apparatus, equipment, and medium to solve the problem that material screening in the prior art relies on software control and has low accuracy.

[0005] In a first aspect, this application provides a material screening method. The material screening method includes: performing image scanning processing on materials on a conveyor belt to obtain a test image; uploading the test image to a host computer for identification processing to receive an abnormal material rejection signal fed back by the host computer; responding to the abnormal material rejection signal, performing phase alignment processing between the current scanning sequence and the abnormal material rejection signal based on a synchronous clock to obtain an aligned abnormal material rejection signal; and rejecting abnormal materials according to the aligned abnormal material rejection signal.

[0006] In this application, an abnormal material rejection signal is obtained by using the recognition result of the material image to be tested by a host computer. Synchronization and calculation are performed based on the abnormal material rejection signal to control the rejection device to reject the abnormal material. The material screening method of this application can directly control material screening using hardware, improving the accuracy and efficiency of material screening.

[0007] In one implementation of the first aspect, performing image scanning processing on the material on the conveyor belt to obtain a test image includes: performing scanning processing according to the speed of the conveyor belt to obtain at least one frame of the test image; generating a synchronization signal based on the at least one frame of the test image; and sending the synchronization signal and the at least one frame of the test image to the host computer.

[0008] In one implementation of the first aspect, the material screening method further includes: establishing a coordinate system based on the longitudinal and transverse directions of the conveyor belt to obtain the physical distance from the detector to the rejection device; and calculating a fixed delay amount for the detector based on the physical distance from the detector to the rejection device.

[0009] In one implementation of the first aspect, in response to the abnormal material rejection signal, performing phase alignment processing between the current scan timing and the abnormal material rejection signal based on a synchronization clock to obtain an aligned abnormal material rejection signal includes: in response to the abnormal material rejection signal, attaching the abnormal material rejection signal to a row synchronization clock; performing phase alignment processing according to the current scan timing and the fixed delay amount to obtain the clock cycle for the abnormal material to arrive at the rejection device; and generating the aligned abnormal material rejection signal according to the clock cycle for the abnormal material to arrive at the rejection device.

[0010] In one implementation of the first aspect, removing abnormal materials based on the aligned abnormal material removal signal includes: parsing the aligned abnormal material removal signal to obtain the location and removal time of the abnormal material; matching the location of the abnormal material with the removal device to obtain a matching removal device; and sending a pulse signal to the removal device at the removal time based on the location of the abnormal material to remove the abnormal material.

[0011] In one implementation of the first aspect, the abnormal material rejection signal includes the location information of the abnormal material, the rejection device is associated with the lateral location information of the abnormal material, and the rejection time is associated with the longitudinal location information of the abnormal material.

[0012] Secondly, this application provides a material screening system. The material screening system includes: an image scanning module for scanning materials on a conveyor belt to obtain a test image; a signal acquisition module for uploading the test image to a host computer for identification processing, and receiving an abnormal material rejection signal from the host computer; a signal alignment module for aligning the current scanning sequence with the abnormal material rejection signal based on a synchronization clock in response to the abnormal material rejection signal, to obtain an aligned abnormal material rejection signal; and a material rejection module for rejecting abnormal materials according to the aligned abnormal material rejection signal.

[0013] Thirdly, this application provides a material screening device. The material screening device includes: a host computer configured to receive a test image and perform identification processing on the test image to generate an abnormal material rejection signal; a detector configured to acquire the test image according to the material screening method described in any one of the first aspects, transmit the test image to the host computer, and generate a pulse signal to control the rejection device in response to the abnormal material rejection signal from the host computer; and a rejection device configured to reject abnormal materials in response to the pulse signal.

[0014] Fourthly, this application provides an electronic device. The electronic device includes: a memory for storing a computer program; and a processor for executing the computer program stored in the memory to cause the electronic device to perform the material screening method as described in any one of the first aspects.

[0015] Fifthly, this application provides a computer-readable storage medium. The computer-readable storage medium stores a computer program that, when executed by a processor, implements the material screening method described in any one of the first aspects.

[0016] As described above, the material screening method, system, apparatus, equipment, and medium described in this application have the following beneficial effects:

[0017] The material screening method proposed in this application can solve the problems of time jitter and positioning deviation caused by non-real-time operating systems, achieving microsecond-level hardware triggering and control, and improving the accuracy of material screening. By utilizing the direct correlation between the detector and the rejection device, the rejection operation of any abnormal material has a corresponding pulse signal, reducing the difficulty of equipment debugging and troubleshooting.

[0018] Furthermore, by eliminating uncertain delays through direct hardware-based control, the distance threshold between the detector and the rejection device is reduced, thereby enabling the miniaturization and integration of the equipment. Decentralizing control to the hardware layer also resolves the conflict between computational load and real-time control accuracy, ensuring that the accuracy of rejecting abnormal materials remains high even during high-speed operation. Attached Figure Description

[0019] Figure 1 The diagram shown illustrates an application scenario of the material screening method described in this application.

[0020] Figure 2 The diagram shown is a structural schematic of the end-to-cloud interaction scenario described in the embodiments of this application.

[0021] Figure 3 The diagram shown is a flowchart illustrating the material screening method described in the embodiments of this application.

[0022] Figure 4 The diagram shown is a structural schematic corresponding to the material screening method described in the embodiments of this application.

[0023] Figure 5 The diagram shown is a flowchart illustrating the material screening method described in the embodiments of this application.

[0024] Figure 6 The diagram shown is a flowchart illustrating the material screening method described in the embodiments of this application.

[0025] Figure 7 The diagram shown is a structural schematic of the material screening system described in an embodiment of this application.

[0026] Figure 8 The diagram shown is a structural schematic of the material screening system described in an embodiment of this application.

[0027] Figure 9 The diagram shown is a timing diagram of the linkage between the detector and the rejection device described in the embodiments of this application.

[0028] Figure 10 The diagram shown is a structural schematic of the electronic device described in an embodiment of this application.

[0029] Component designation explanation

[0030] 1 Sorting station 11 Conveying equipment 12 Local processor 13 nozzle 2 End-to-Cloud Interaction System 20 terminal 21 cloud server 100 Material screening system 110 Image scanning module 120 Signal acquisition module 130 Signal alignment module 140 Material rejection module 200 Material screening device 210 host computer 220 detector 230 rejection device 300 electronic devices 310 memory 320 processor 330 monitor S11~S14 step S131~S133 step S141~S143 step Detailed Implementation

[0031] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, unless otherwise specified, the following embodiments and features in the embodiments can be combined with each other.

[0032] It should be noted that in the embodiments of this application, the words "optionally" or "for example" indicate examples, illustrations, or descriptions. Any embodiment or design scheme described as "optionally" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of the words "optionally" or "for example" is intended to present the relevant concepts in a specific manner.

[0033] In this application embodiment, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0034] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. Therefore, the drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0035] In existing food processing lines, foreign object detection typically uses X-ray detectors to image items on a conveyor belt. Image processing identifies foreign objects, and a downstream rejection device (such as a nozzle) removes the material containing them. However, existing material screening methods have the following significant drawbacks: 1. Poor positioning accuracy: Foreign object location relies on the timestamp of each frame returned by the detector or the clock of the PC system. Image transmission and CPU processing are affected by system resource consumption, leading to unstable frame intervals. This software-level time jitter causes a deviation between the calculated foreign object position and the actual position, resulting in inaccurate rejection. 2. Difficult debugging and troubleshooting: The detector is only responsible for imaging; nozzle control is entirely controlled independently by the delay logic of the host computer software. There is no direct hardware signal linkage between the detector and the nozzle. When rejection fails, it is difficult to determine whether the problem is caused by image scanning delay, algorithm processing delay, or I / O card output delay, increasing the difficulty of troubleshooting system anomalies. 3. Large equipment size redundancy: Due to significant uncertainties in software processing and system scheduling, a long physical distance is usually required as a "time buffer" to ensure that the rejection action is completed before the object reaches the nozzle. This necessitates a longer conveyor belt, limiting the overall size of the equipment and making it unsuitable for production environments with limited space.

[0036] At least to address the aforementioned problems, embodiments of this application provide a material screening method. The material screening method includes: performing image scanning processing on materials on a conveyor belt to obtain a test image; uploading the test image to a host computer for identification processing to receive an abnormal material rejection signal fed back by the host computer; responding to the abnormal material rejection signal, performing phase alignment processing between the current scanning sequence and the abnormal material rejection signal based on a synchronization clock to obtain an aligned abnormal material rejection signal; and rejecting abnormal materials according to the aligned abnormal material rejection signal.

[0037] In this embodiment, the abnormal material rejection signal is obtained by using the recognition result of the material image to be tested by the host computer. Synchronization and calculation are performed based on the abnormal material rejection signal to control the rejection device to reject the abnormal material. The material screening method of this application can directly control material screening using hardware, improving the accuracy and efficiency of material screening.

[0038] Figure 1 This diagram illustrates an application scenario of the material screening method described in this application. The sorting table 1 can be used to implement the material screening method provided in this application embodiment, but the application scenarios of the material screening method provided in this application embodiment are not limited to this. Figure 1 The sorting station 1 is shown. (As shown in the image) Figure 1As shown, the sorting station 1 includes a conveying device 11, a local processor 12, and a nozzle 13. The material sorting method provided in this embodiment can be applied to the local processor 12.

[0039] in, Figure 1 The local processor 12 can be a single local processor, a cluster of multiple local processors, or a cloud computing center, etc., and is not specifically limited here. Although Figure 1 Only one transmission device 11, one local processor 12, and one nozzle 13 are shown, but it should be understood that... Figure 1 The examples in the text are only for understanding this solution. The specific number of local processors 12 and nozzles 13 should be flexibly determined based on the actual situation.

[0040] In some other implementations, the material selection method described in this application can be applied to edge-cloud interaction scenarios. Figure 2 The diagram shown is a structural schematic of the end-to-cloud interaction scenario described in an embodiment of this application. For example... Figure 2 As shown, the terminal-cloud interaction system 2 includes a terminal 20 and a cloud server 21. The terminal 20 and the cloud server 21 can communicate with each other, and the communication method is not limited to wired or wireless.

[0041] The terminal 20 can be mobile or fixed. For example, it can be a wireless terminal or a wired terminal. A wireless terminal can refer to a device with wireless transceiver capabilities, which can be deployed indoors, outdoors, and in industrial workshops. The terminal 20 can be a mobile phone, tablet computer, laptop computer, etc., and is not limited thereto. The cloud server 21 can include one or more servers, or one or more processing nodes, or one or more virtual machines running on the server. The cloud server 21 can also be referred to as a server cluster, management platform, data processing center, etc., and is not limited thereto in this embodiment.

[0042] The technical solutions in the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0043] The following embodiments of this application provide a material screening method, which, for example, can be achieved through... Figure 1 The local processor 12 shown Figure 2 The cloud server 21 shown is used to implement this. Figure 3 The diagram shown is a schematic flowchart of the material screening method described in an embodiment of this application. Figure 3 As shown, the material screening method includes steps S11 to S14.

[0044] Step S11: Perform image scanning processing on the material on the conveyor belt to obtain the image to be tested.

[0045] Step S12: Upload the image to be tested to the host computer for recognition and processing, so as to receive the abnormal material rejection signal fed back by the host computer.

[0046] Step S13: In response to the abnormal material rejection signal, the current scan timing is phase-aligned with the abnormal material rejection signal based on the synchronization clock to obtain the aligned abnormal material rejection signal.

[0047] Step S14: Remove abnormal materials according to the aligned abnormal material removal signal.

[0048] Among some possible implementations, Figure 4 The diagram shown is a structural schematic corresponding to the material screening method described in the embodiments of this application. Figure 4 As shown, the green rectangle represents a schematic diagram of the conveyor belt, the yellow dot represents the material, and the four blue squares correspond to the four nozzles of the rejection device. The Complementary Metal-Oxide-Semiconductor Time-Delay and Integration Detector (CMOS TDI detector) scans the material on the conveyor belt at time T0 to obtain the image to be tested. The CMOS TDI detector is a special image sensor that achieves a higher signal-to-noise ratio and sensitivity than ordinary sensors under high-speed scanning or low-light conditions through time-delay integration technology. After completing the scanning of any frame, the CMOS TDI detector simultaneously generates a hardware synchronization signal, Syncout, as a pulse signal indicating the completion of the current frame scan, which is sent to the host computer. Upon receiving the pulse signal indicating the completion of the current frame scan, the host computer identifies and processes the image to be tested, and sends an abnormal material rejection signal back to the CMOS TDI detector based on the identified abnormal material. In response to the abnormal material rejection signal from the host computer, the detector performs phase alignment processing between the current scanning sequence and the abnormal material rejection signal based on its internal high-precision synchronization clock to obtain the aligned abnormal material rejection signal. The CMOS TDI detector calculates based on the aligned abnormal material rejection signal and directly controls the rejection device to reject the abnormal material. The rejection device may be, for example, a nozzle, push rod, swing arm, or flip-plate mechanism, and this application is not limited thereto.

[0049] In this embodiment, the abnormal material rejection signal is obtained by using the recognition result of the material image to be tested by the host computer. Synchronization and calculation are performed based on the abnormal material rejection signal to control the rejection device to reject the abnormal material. The material screening method of this application can directly control material screening using hardware, improving the accuracy and efficiency of material screening.

[0050] In one embodiment of this application, image scanning processing of materials on a conveyor belt to obtain a test image includes: performing scanning processing according to the speed of the conveyor belt to obtain at least one frame of the test image; generating a synchronization signal based on the at least one frame of the test image; and sending the synchronization signal and the at least one frame of the test image to a host computer.

[0051] In some possible implementations, the CMOS TDI detector performs time-delay and integration scanning (TDI) based on the conveyor belt speed. TDI scanning is a special scanning imaging technique and operating mode based on a TDI (time-delay integration) image sensor. After each frame or several rows of images are scanned, the CMOS TDI detector outputs a synchronization signal Syncout, at which point the image data under test is transmitted to the host computer.

[0052] In one embodiment of this application, the material screening method further includes: establishing a coordinate system based on the longitudinal and transverse directions of the conveyor belt to obtain the physical distance from the detector to the rejection device; and calculating based on the physical distance from the detector to the rejection device to obtain a fixed delay amount of the detector.

[0053] In some possible implementations, a spatial mapping relationship is established between the detector's field of view and the rejection device at the rear. A coordinate system is established by defining the lower left corner of the conveyor belt as the origin, the longitudinal direction of the conveyor belt as the x-axis, and the transverse direction as the y-axis, based on the conveyor belt's placement and orientation. The longitudinal direction of the conveyor belt, i.e., its width, is divided into several regions, each corresponding to a nozzle of the rejection device. For example, the longitudinal direction of the conveyor belt may be divided into four equal regions, each corresponding to one of the four nozzles of the rejection device. In other possible implementations, the longitudinal direction of the conveyor belt may be divided into several regions greater than 20, depending on the size of the material. The transverse direction of the conveyor belt, i.e., its length, is defined as the time axis. The physical distance from the detector to the rejection device is calculated and converted into the number of scan lines of the detector, which is recorded as the detector's fixed delay.

[0054] Figure 5 The diagram shown is a schematic flowchart of the material screening method described in an embodiment of this application. Figure 5 As shown, step S13 includes steps S131 to S133.

[0055] Step S131: In response to the abnormal material rejection signal, the abnormal material rejection signal is attached to the row synchronization clock.

[0056] Step S132: Perform phase alignment processing based on the current scanning timing and fixed delay to obtain the clock cycle for abnormal materials to arrive at the rejection device.

[0057] Step S133: Generate an aligned abnormal material rejection signal based on the clock cycle of the abnormal material arriving at the rejection device.

[0058] In some possible implementations, the CMOS TDI detector responds to an abnormal material rejection signal fed back from the host computer, attaching the rejection signal to the row synchronization clock. The abnormal material rejection signal is the Pos_to_FPD signal, a key hardware control signal used in precision imaging systems to achieve strict synchronization between mechanical movement and image acquisition. Based on its internal control logic (e.g., the Field-Programmable Gate Array Control Board, or FPGA control board), the detector calculates the clock information corresponding to the moment the abnormal material arrives at the rejection device, adding a fixed delay to the current scanned row number, and generates the aligned abnormal material rejection signal.

[0059] Figure 6 The diagram shown is a schematic flowchart of the material screening method described in an embodiment of this application. Figure 6 As shown, step S14 includes steps S141 to S143.

[0060] Step S141: Analyze the aligned abnormal material rejection signal to obtain the location and rejection time of the abnormal material.

[0061] Step S142: Match the location of the abnormal material with the rejection device to obtain a matching rejection device.

[0062] Step S143: Based on the location of the abnormal material, a pulse signal is sent to the rejection device at the rejection time to reject the abnormal material.

[0063] In some possible implementations, the location and rejection time of the abnormal material are obtained through analytical calculations based on the aligned rejection signal. The vertical position of the abnormal material determines its location within a specific area, thus identifying a matching rejection device. When the detector's row counter reaches the calculated rejection time, a pulse signal is directly output to the rejection device via the GPO interface. At this point, the abnormal material moves to the front of the rejection device, where it is precisely rejected.

[0064] In one embodiment of this application, the abnormal material rejection signal includes the location information of the abnormal material, the rejection device is associated with the lateral location information of the abnormal material, and the rejection time is associated with the longitudinal location information of the abnormal material.

[0065] In some possible implementations, the abnormal material rejection signal includes the horizontal and vertical coordinate information of the abnormal material. The rejection device is associated with the horizontal coordinate of the abnormal material, and the corresponding rejection device is matched according to the horizontal coordinate position of the abnormal material. The rejection time is associated with the vertical coordinate of the abnormal material and is calculated based on a fixed delay between the current scanning time of the detector and the time when the abnormal material arrives at the rejection device. In other possible implementations, the placement of the rejection device and the detector can also be varied in other combinations. For example, the rejection device can be associated with the vertical position information of the abnormal material, and the rejection time can be associated with the horizontal position information of the abnormal material. This application is not limited to this.

[0066] Figure 7 The diagram shown is a structural schematic of the material screening system described in an embodiment of this application. Figure 7 As shown, the material screening system 100 includes an image scanning module 110, a signal acquisition module 120, a signal alignment module 130, and a material rejection module 140.

[0067] The image scanning module 110 is used to perform image scanning processing on the material on the conveyor belt to obtain the image to be tested.

[0068] The signal acquisition module 120 is used to upload the image to be tested to the host computer for recognition and processing, and to receive the abnormal material rejection signal fed back by the host computer.

[0069] The signal alignment module 130 is used to respond to the abnormal material rejection signal by performing phase alignment processing between the current scanning timing and the abnormal material rejection signal based on the synchronous clock, so as to obtain the aligned abnormal material rejection signal.

[0070] The material rejection module 140 is used to reject abnormal materials according to the aligned abnormal material rejection signal.

[0071] In some possible implementations, the image scanning module 110 is used to perform image scanning processing on the material on the conveyor belt at time T0 using a CMOS TDI detector to acquire the image to be tested. The signal acquisition module 120, after the detector completes scanning any frame, simultaneously generates a hardware synchronization signal Syncout as a pulse signal indicating the completion of the current frame scan, and sends it to the host computer. Upon receiving the pulse signal indicating the completion of the current frame scan, the host computer performs identification processing on the image to be tested and sends an abnormal material rejection signal back to the CMOS TDI detector based on the identified abnormal material. The signal alignment module 130, in response to the abnormal material rejection signal from the host computer, performs phase alignment processing between the current scanning sequence and the abnormal material rejection signal based on the high-precision synchronization clock inside the detector to acquire the aligned abnormal material rejection signal. The material rejection module 140 calculates based on the aligned abnormal material rejection signal and directly controls the rejection device to reject the abnormal material.

[0072] In this embodiment, the abnormal material rejection signal is obtained by using the recognition result of the material image to be tested by the host computer. Synchronization and calculation are performed based on the abnormal material rejection signal to control the rejection device to reject the abnormal material. The material screening system 100 of this application can directly control material screening using hardware, improving the accuracy and efficiency of material screening.

[0073] Figure 8 The diagram shown is a structural schematic of the material screening system described in an embodiment of this application. Figure 8 As shown, the material screening device 200 includes a host computer 210, a detector 220, and a rejection device 230.

[0074] The host computer 210 is configured to receive the image to be tested and perform recognition processing on the image to generate an abnormal material rejection signal.

[0075] The detector 220 is configured to acquire a test image according to the material screening method according to any embodiment of the present application, transmit the test image to a host computer, and generate a pulse signal to control the rejection device in response to an abnormal material rejection signal from the host computer.

[0076] The rejection device 230 is configured to respond to a pulse signal to reject abnormal materials.

[0077] Among some possible implementations, Figure 9 This is a timing diagram showing the linkage between the detector and the rejection device as described in an embodiment of this application. Figure 9As shown, when detector 220 begins image scanning of the material on the conveyor belt, it sends a short pulse Syncout signal to host computer 210. Host computer 210 receives the Syncout signal, which is the scanned image signal shown in the figure, and performs identification processing on the image to obtain the location of abnormal material. The coordinate information of the abnormal material on the x and y axes is hardware-encoded to generate an abnormal material rejection signal, which is then fed back to detector 220. Due to different processing times, the abnormal material rejection signal may be offset to the previous or next frame time. To solve this offset problem, detector 220 responds to the abnormal material rejection signal by performing phase alignment processing between the current scanning sequence and the abnormal material rejection signal based on the synchronization clock to obtain an aligned abnormal material rejection signal. Based on the aligned abnormal material rejection signal, the rejection device 230 matching the y-axis coordinate and the rejection time associated with the x-axis coordinate are determined. At the rejection time, a pulse Trigger signal is sent to the rejection device 230 to reject the abnormal material.

[0078] In some other possible implementations, detector 220 can also be a linear X-ray detector or a high-speed industrial camera. Sensors with hardware line synchronization output function can be applied to material screening device 200.

[0079] The material screening method, system, apparatus, equipment, and medium described in the above embodiments of this application have the following beneficial effects:

[0080] It eliminates the need to mark the location of foreign objects based on the system time of the host computer operating system, thus solving the problems of time jitter and positioning deviation caused by non-real-time operating systems and achieving microsecond-level hardware deterministic triggering.

[0081] Establishing a direct hardware connection between the detector and the rejection device ensures that each rejection action has a definite hardware clock cycle, greatly reducing the difficulty of equipment debugging and troubleshooting.

[0082] By eliminating uncertain delays, the problem of physical space redundancy—the need to lengthen the physical distance of the transmission belt to address uncertain delays—is solved. This allows the distance between the detector and the nozzle to be compressed to the extreme, achieving miniaturization and integration of the equipment.

[0083] By delegating synchronization control to the FPGA control board or other hardware layers, the contradiction between computing load and real-time control accuracy is resolved, ensuring that the system maintains a high consistency in elimination accuracy even under high-speed operation.

[0084] In the embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, or methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For instance, the division of modules / units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or units may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection of apparatuses or modules or units may be electrical, mechanical, or other forms.

[0085] The modules / units described as separate components may or may not be physically separate. The components shown as modules / units may or may not be physical modules; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules / units can be selected to achieve the objectives of the embodiments of this application, depending on actual needs. For example, the functional modules / units in the various embodiments of this application may be integrated into one processing module, or each module / unit may exist physically separately, or two or more modules / units may be integrated into one module / unit.

[0086] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0087] This application also provides an electronic device. Figure 10 The diagram shown is a structural schematic of the electronic device described in an embodiment of this application. Figure 10 As shown, in this embodiment, the electronic device 300 includes a memory 310 and a processor 320.

[0088] The memory 310 is used to store computer programs; preferably, the memory 310 includes various media that can store program code, such as ROM, RAM, magnetic disk, USB flash drive, memory card or optical disk.

[0089] Specifically, memory 310 may include computer system readable media in the form of volatile memory, such as random access memory (RAM) and / or cache memory. Electronic device 300 may further include other removable / non-removable, volatile / non-volatile computer system storage media. Memory 310 may include at least one program product having a set (e.g., at least one) of program modules configured to perform the functions of the embodiments of this application. It is understood that memory 310 may be volatile memory or non-volatile memory, or both. Non-volatile memory may be read-only memory (ROM) or programmable read-only memory (PROM), which serves as an external cache. By way of example, but not limitation, many forms of RAM are available, such as static random access memory (SRAM) and synchronous static random access memory (SSRAM). The memories described in the embodiments of this invention are intended to include, but are not limited to, these and any other suitable categories of memories.

[0090] The processor 320 is connected to the memory 310 and is used to execute the computer program stored in the memory 310 so that the electronic device 300 performs the material screening method described in any embodiment of this application.

[0091] Optionally, the processor 320 may be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it may also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components.

[0092] Optionally, the electronic device 300 in this embodiment may further include a display 330. The display 330 is communicatively connected to the memory 310 and the processor 320, and is used to display the relevant graphical user interface (GUI) of the material screening method described in this application embodiment.

[0093] This application also provides a computer-readable storage medium storing a computer program. When executed by a processor, the program implements the material screening method described in any embodiment of this application. Those skilled in the art will understand that all or part of the steps in the methods of the above embodiments can be implemented by a program instructing a processor. The program can be stored in a computer-readable storage medium, which is a non-transitory medium, such as random access memory, read-only memory, flash memory, hard disk, solid-state drive, magnetic tape, floppy disk, optical disk, and any combination thereof. The storage medium can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., digital video disc (DVD)), or a semiconductor medium (e.g., solid-state disk (SSD)).

[0094] As used in this specification, the terms "component," "module," "system," etc., are used to refer to computer-related entities, hardware, firmware, combinations of hardware and software, software, or software in execution. For example, a component can be, but is not limited to, a process running on a processor, a processor, an object, an executable file, an execution thread, a program, and / or a computer. As illustrated, applications running on computing devices and computing devices can both be components. One or more components may reside in a process and / or an execution thread, and components may be located on a single computer and / or distributed among two or more computers. Furthermore, these components can be executed from various computer-readable media on which various data structures are stored. Components can communicate, for example, via local and / or remote processes based on signals having one or more data packets (e.g., data from two components interacting with another component between a local system, a distributed system, and / or a network, such as the Internet interacting with other systems via signals).

[0095] The descriptions of the processes or structures corresponding to the above figures each have their own emphasis. For parts of a process or structure that are not described in detail, please refer to the relevant descriptions of other processes or structures.

[0096] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.

Claims

1. A method of screening material, characterized by, The method comprises the following steps: image scanning processing is performed on the materials on the conveying belt to obtain a to-be-tested image; uploading the to-be-tested image to an upper computer for identification processing to receive an abnormal material rejection signal fed back by the upper computer; in response to the abnormal material rejection signal, phase alignment processing is performed on the current scanning timing and the abnormal material rejection signal based on a synchronization clock to obtain an aligned abnormal material rejection signal; rejection of abnormal materials according to the aligned abnormal material rejection signal.

2. The method of claim 1, wherein, The image scanning processing on the materials on the conveying belt to obtain a to-be-tested image comprises the following steps: scanning processing is performed according to the speed of the conveying belt to obtain at least one frame of the to-be-tested image; a synchronization signal is generated based on at least one frame of the to-be-tested image, and the synchronization signal and at least one frame of the to-be-tested image are sent to the upper computer.

3. The method of claim 1, wherein, Further comprising: establishing a coordinate system according to the longitudinal and transverse directions of the conveying belt to obtain the physical distance from the detector to the rejection device; calculating according to the physical distance from the detector to the rejection device to obtain the fixed delay amount of the detector.

4. The method of claim 3, wherein, In response to the abnormal material rejection signal, phase alignment processing is performed on the current scanning timing and the abnormal material rejection signal based on a synchronization clock to obtain an aligned abnormal material rejection signal, which comprises the following steps: in response to the abnormal material rejection signal, the abnormal material rejection signal is mounted on a line synchronization clock; phase alignment processing is performed according to the current scanning timing and the fixed delay amount to obtain the clock period of the arrival of the abnormal material at the rejection device; generating the aligned abnormal material rejection signal according to the clock period of the arrival of the abnormal material at the rejection device.

5. The method of claim 1, wherein, According to the aligned abnormal material rejection signal, the abnormal materials are rejected, which comprises the following steps: based on the aligned abnormal material rejection signal, the position and rejection time of the abnormal materials are obtained; matching the position of the abnormal materials with the rejection device to obtain a matched rejection device; sending a pulse signal to the rejection device at the rejection time according to the position of the abnormal materials to reject the abnormal materials.

6. The method of claim 1, wherein, The abnormal material rejection signal includes position information of the abnormal materials, the rejection device is associated with the transverse position information of the abnormal materials, and the rejection time is associated with the longitudinal position information of the abnormal materials.

7. A material screening system characterized by, The method comprises the following steps: an image scanning module for image scanning processing on the materials on the conveying belt to obtain a to-be-tested image; a signal acquisition module for uploading the to-be-tested image to an upper computer for identification processing to receive an abnormal material rejection signal fed back by the upper computer; a signal alignment module for, in response to the abnormal material rejection signal, phase alignment processing on the current scanning timing and the abnormal material rejection signal based on a synchronization clock to obtain an aligned abnormal material rejection signal; a material rejection module for rejecting abnormal materials according to the aligned abnormal material rejection signal.

8. A material screening device, characterized by The method comprises the following steps: an upper computer configured to receive a to-be-tested image and perform identification processing on the to-be-tested image to generate the abnormal material rejection signal; A detector configured to acquire the image to be detected according to the material screening method of any one of claims 1 to 6, and transmit the image to be detected to the host computer, and generate a pulse signal for controlling the rejection device in response to an abnormal material rejection signal of the host computer; A rejection device configured to reject abnormal materials in response to the pulse signal.

9. An electronic device, comprising: The electronic device comprises: a memory for storing a computer program; a processor configured to execute the computer program stored in the memory, so that the electronic device executes the material screening method of any one of claims 1 to 6.

10. A computer-readable storage medium having stored thereon a computer program, characterized in that, The program is executed by the processor to implement the material screening method of any one of claims 1 to 6.

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