A high-consistency MEMS array device and its fabrication process

By forming grooves and a suspended diaphragm design on the front side of the MEMS cell substrate, and relying on the diaphragm layer on the front side to ensure diaphragm consistency, the problem of insufficient diaphragm consistency in MEMS array devices is solved, and a MEMS array device with high consistency and reliability is realized.

CN122079063APending Publication Date: 2026-05-26HEFEI NAVIGATION MICROSYSTEM INTEGRATION CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HEFEI NAVIGATION MICROSYSTEM INTEGRATION CO LTD
Filing Date
2026-02-11
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

In existing MEMS array devices, insufficient diaphragm consistency leads to overall performance bottlenecks. In particular, the etching angle deviation and PZT stress difference during back cavity etching cause frequency inconsistencies, making it difficult to control overall consistency.

Method used

By depositing a sacrificial layer and forming trenches on the front side of the MEMS cell substrate, the diaphragm consistency is ensured by relying on the film layer on the front side. Combined with the design of piezoelectric thin film layer and structural layer, the projected area of ​​the suspended diaphragm region from top to bottom is larger than that of the back cavity. Arc-shaped trenches are used to reduce stress concentration, and wafer consistency is ensured by adjusting the through-slot size.

Benefits of technology

It improves the overall consistency and reliability of MEMS array devices, reduces manufacturing difficulty, ensures stable vibration performance of the diaphragm area and flexibility of electrical control, and improves product yield.

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Abstract

This invention discloses a highly consistent MEMS array device and its fabrication process, comprising M×N MEMS units. Each MEMS unit includes a substrate with opposing front and back sides. The back side of the substrate has a back cavity. Each MEMS unit further includes: a sacrificial layer deposited on the front side of the substrate, with a central cutout exposing the back cavity, and the projected area of ​​the cutout region of the sacrificial layer from top to bottom being larger than the back cavity; a structural layer and a piezoelectric thin film layer sequentially deposited on the sacrificial layer, with the structural layer forming grooves along the circumferential inner wall of the sacrificial layer. The region between the grooves forms a diaphragm region, which is suspended above the back cavity; wherein the projected area of ​​the diaphragm region from top to bottom is larger than the projected area of ​​the back cavity from top to bottom. This MEMS array device exhibits high consistency.
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