Cavity type modular sound insulation and heat preservation board and preparation method thereof

Abstract

The invention relates to the technical field of construction, and particularly discloses a cavity type modular sound insulation and heat preservation board and a preparation method thereof.The sound insulation and heat preservation board is of a multi-layer composite structure and sequentially comprises a vacuum aluminized reflecting film, a polystyrene foam board layer with a cavity structure and a rubber and plastic sound insulation board layer from top to bottom; the lower surface of the polystyrene foam board layer is provided with regularly arranged grooves or through holes to form the cavity structure; the rubber and plastic sound insulation board layer is attached to the lower surface, with the cavity structure, of the polystyrene foam board layer through a composite technology. The vacuum aluminized reflecting film covers the upper surface of the polystyrene foam board layer; through the design of the composite structure, double treatment is carried out on the impact energy of the floor from the propagation path, the air layer formed by the cavity structure can effectively isolate and buffer impact, the high-damping elastic material on the lower layer can convert mechanical vibration into heat energy to be dissipated, transmission of solid-borne sound is remarkably weakened, and the impact sound insulation effect is achieved.

Description

Technical Field

[0001] This invention belongs to the field of construction technology, specifically relating to a cavity-type modular sound insulation and heat preservation board and its preparation method. Background Technology

[0002] In building floor slab construction, to improve living comfort, it is often necessary to solve the problems of thermal insulation and sound insulation (especially impact sound insulation) at the same time. In the existing technology, the common practice is to lay a single thermal insulation board (such as extruded polystyrene board) or a sound insulation pad (such as rubber pad, cork pad, etc.) on the floor slab base layer, or simply use these two materials in combination. These solutions either focus on thermal insulation or vibration isolation, and their functions are relatively simple. In addition, there are some composite pad products that attempt to combine the characteristics of different materials, but they mostly adopt a flat layer bonding or simple layering structure.

[0003] However, the functions of the aforementioned existing technical solutions are often singular or simply superimposed, failing to achieve synergistic optimization and significant improvement of sound insulation and thermal insulation performance through structural innovation. For the problem of low-to-mid frequency solid-borne sound transmission, such as impact sound from floor slabs, traditional single-material or simple composite structures lack systematic acoustic design, resulting in limited sound insulation effects, especially in improving low-frequency impact sound. At the same time, most solutions have shortcomings in moisture-proof sealing performance, and the splicing between panels is not tight and convenient enough during construction, which easily forms sound bridges and thermal bridges, affecting the continuity and stability of overall performance. Summary of the Invention

[0004] The purpose of this invention is to provide a cavity-type modular sound insulation and heat preservation board and its preparation method, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A cavity-type modular sound insulation and heat insulation board, wherein the sound insulation and heat insulation board is a multi-layer composite structure, comprising, from top to bottom: a vacuum-aluminized reflective film, a polystyrene foam board layer with a cavity structure, and a rubber and plastic sound insulation board layer. The lower surface of the polystyrene foam board layer is provided with regularly arranged grooves or through holes to form the cavity structure; The rubber and plastic sound insulation board layer is bonded to the lower surface of the polystyrene foam board layer, which has a cavity structure, through a composite process. The vacuum-metallized reflective film is laminated onto the upper surface of the polystyrene foam board layer.

[0006] Preferably, the grooves or through holes on the lower surface of the polystyrene foam board layer are arranged in a uniform array, the depth of the grooves is 1 / 3 to 2 / 3 of the thickness of the polystyrene foam board layer, and the through holes are blind holes or through holes.

[0007] Preferably, the cavity structure is cylindrical, prismatic, hemispherical, or a combination thereof.

[0008] Preferably, the rubber and plastic sound insulation board layer is a closed-cell elastic rubber and plastic material with a thickness of 3mm to 15mm; the polystyrene foam board layer is one or a combination of extruded polystyrene board or molded polystyrene board.

[0009] Preferably, the vacuum-metallized reflective film is made of PET or PE material, with its aluminized surface facing the polystyrene foam board layer.

[0010] Preferably, the sound insulation and heat preservation board has tongue and groove or tenon and mortise structure on its four sides for easy splicing.

[0011] A method for preparing a cavity-type modular sound insulation and heat preservation board includes the following steps: S1. The lower surface of the polystyrene foam board substrate is mechanically processed to form regularly arranged grooves or through holes, thereby obtaining a polystyrene foam board layer with a cavity structure. S2. The rubber and plastic sound insulation board layer is bonded to the lower surface of the polystyrene foam board layer with a cavity structure obtained in step S1 by hot pressing or adhesive bonding process. S3. The vacuum-aluminized reflective film is laminated onto the upper surface of the polystyrene foam board layer obtained in step S1 through hot pressing or adhesive bonding processes to obtain a composite board. S4. Cut the composite board obtained in step S3 into plate-shaped units of a preset size; S5. The four sides of the plate-shaped unit obtained in step S4 are processed to form a tongue and groove structure or a tenon and mortise structure to obtain the cavity modular sound insulation and heat preservation board.

[0012] Preferably, in step S1, the machining process employs CNC engraving, milling, or molding.

[0013] Preferably, in step S2, the temperature of the hot-pressing composite is 80°C to 130°C, the pressure is 0.2MPa to 0.8MPa, and the time is 30 seconds to 120 seconds; the adhesive used for the adhesive composite is a polyurethane adhesive or an epoxy resin adhesive.

[0014] Preferably, in step S3, the temperature of the hot-pressing composite is 60°C to 100°C, the pressure is 0.1MPa to 0.5MPa, and the time is 20 seconds to 60 seconds.

[0015] Compared with the prior art, the beneficial effects of the present invention are: (1) Through the composite structure design, the impact energy of the floor slab is treated in two ways from the propagation path. The air layer formed by the cavity structure can effectively isolate and buffer the impact, while the high damping elastic material in the lower layer can convert mechanical vibration into heat energy for dissipation, significantly reducing the transmission of solid sound and achieving the sound insulation effect of impact sound.

[0016] (2) By integrating sound insulation and vibration reduction, heat preservation and energy saving, moisture-proof sealing and convenient construction, the upper reflective film can improve the thermal efficiency of underfloor heating and form a reliable moisture barrier. The modular design and splicing structure make the installation quick and the joints tight, ensuring the continuity and stability of the overall performance, avoiding sound bridges and thermal bridges, and improving the controllability of construction efficiency and project quality. Attached Figure Description

[0017] Figure 1 This is a perspective view of the present invention; Figure 2 This is a perspective view of the polystyrene foam board layer of the present invention; Figure 3 This is a schematic diagram of the process of the present invention; In the diagram: 1. Vacuum-coated aluminum reflective film; 2. Polystyrene foam board layer; 3. Rubber and plastic sound insulation board layer. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example

[0019] Please see Figures 1-3 As shown, a cavity-type modular sound insulation and heat insulation board is a multi-layer composite structure, which includes, from top to bottom: a vacuum-plated aluminum reflective film 1, a polystyrene foam board layer 2 with a cavity structure, and a rubber and plastic sound insulation board layer 3. The vacuum-metallized reflective film, as the top functional layer, is preferably a PET (polyethylene terephthalate) vacuum-metallized film with a thickness of 0.05 mm to 0.12 mm, with its metallized side facing down and laminated onto the upper surface of the polystyrene foam board layer. Its main functions are threefold: first, to reflect the heat radiated downwards by the underfloor heating pipes upwards, thereby improving heat utilization; second, to act as a dense moisture barrier, preventing moisture from the base concrete or leveling layer from invading upwards, protecting the upper decorative materials (such as wood flooring) and maintaining the dryness and heat insulation performance of the extruded polystyrene board; and third, to provide a flat and smooth base surface for the upper construction.

[0020] The polystyrene foam board layer serves as the support and cavity carrier layer, preferably an extruded polystyrene board (XPS) with a density ≥35kg / m³ and a compressive strength ≥250kPa, and a thickness typically between 15mm and 30mm. Its lower surface is formed by mechanical processing to create a specific array of grooves. These grooves are evenly distributed with a center-to-center spacing of 20mm to 50mm. The grooves can be cylindrical, square, or hemispherical in shape, and their depth is 1 / 2 to 2 / 3 of the thickness of the extruded board layer. This forms a continuous and regular sealed air cavity layer at the bottom of the board.

[0021] As a vibration reduction and sound insulation functional layer, the rubber and plastic sound insulation board layer is preferably made of elastic rubber and plastic thermal insulation material with a closed-cell rate of ≥90%, an apparent density of 65±5kg / m³, and a high damping loss factor. The thickness is 5mm to 10mm. It is tightly bonded to the lower surface of the extruded board layer with grooves through a composite process, thereby sealing the above-mentioned cavity.

[0022] As can be seen from the above, when the floor slab is impacted by footsteps, falling objects, etc., the vibrational energy attempts to be transmitted downwards. First, the upper layer of polystyrene foam board itself has a certain mass and rigidity, which can initially block some high-frequency vibrations; Specifically, when the impact energy is transmitted to this system, part of the energy is stored and buffered by the elastic deformation of the air layer, while the other part of the energy is dissipated by the high-damping rubber and plastic material through internal friction into heat energy, which attenuates the low-frequency solid sound and greatly reduces the vibration sound pressure level transmitted to the floor slab base, thus solving the problem of floor impact sound interference. Polystyrene foam board itself is an excellent thermal insulation material with low thermal conductivity, which can block the exchange of heat between indoors and outdoors. The vacuum-plated aluminum reflective film on the upper layer can reflect the heat radiation of the underfloor heating pipes upward, reducing the ineffective heat loss downward, thereby improving the response speed and overall energy efficiency of the underfloor heating system, and achieving a combination of structural insulation and radiation reflection enhancement. The sound insulation and heat insulation board has a tongue and groove structure on all four sides. When laid, the adjacent boards can interlock, which not only makes the construction quick and the joints smooth, but also reduces the formation of sound bridges and thermal bridges, and improves the continuity and stability of the overall sound insulation and heat insulation performance.

[0023] A method for preparing the cavity-type modular sound insulation and heat insulation board includes the following steps: S1. Select an extruded polystyrene board substrate of a specified size (e.g., 1200mm×600mm), and use a CNC engraving machine to mill an array of cylindrical blind hole grooves on its lower surface according to a preset program. The groove diameter is 8mm, the depth is 12mm (for a 20mm thick substrate), and the center spacing is 30mm. This step forms a polystyrene foam board layer with a regular cavity structure. S2. Place the cut rubber and plastic sound insulation board layer (8mm thick) on the lower plate of the hot press. Align the extruded board layer processed in step S1 with the cavity side down and attach it to the rubber and plastic board. Hot press for 60 seconds at a temperature of 100℃ and a pressure of 0.5MPa. Utilize the characteristic of the extruded board to slightly soften when heated and melt on the surface of the rubber and plastic board to make the two firmly bonded together at the cavity edge and solid surface. After cooling, the rubber and plastic board tightly seals all the grooves on the lower surface of the extruded board, forming a sealed cavity. S3. Cover the upper surface of the composite board (extruded board layer facing up) obtained in step S2 with a vacuum-metallized PET reflective film (metallized side facing down), and send it into a hot press. Hot press for 40 seconds at a temperature of 80°C and a pressure of 0.3MPa to firmly attach the reflective film to the surface of the extruded board, forming a preliminary three-layer composite board.

[0024] S4. The large-format three-layer composite board obtained in step S3 is cut into the final required modular unit size, such as a square board of 600mm×600mm or 400mm×400mm, using a precision cutting device.

[0025] S5. Using a dedicated milling machine, matching tongue and groove structures are machined on the four sides of the plate-shaped unit obtained in step S4, thus obtaining the cavity-type modular sound insulation and heat preservation board described in this embodiment. Example

[0026] This embodiment provides another cavity-type modular sound insulation board and its preparation method. The sound insulation board is a multi-layer composite structure, which includes, from top to bottom: a vacuum-aluminized reflective film 1, a polystyrene foam board layer 2 with a cavity structure, and a rubber and plastic sound insulation board layer 3. The vacuum aluminized reflective film uses a PE (polyethylene) material with a thickness of 0.08mm, with the aluminized side facing down. Its function is the same as in Example 1, focusing on moisture protection and heat reflection.

[0027] The polystyrene foam board layer uses molded polystyrene board (EPS) with a density of 38kg / m³ and a thickness of 25mm. Its lower surface is processed to form a regularly arranged array of square through holes as a cavity structure. The through holes are through holes with a cross-sectional size of 10mm×10mm square and a center-to-center spacing of 40mm, which are distributed in a neat grid pattern. The depth of the through holes is the same as the board thickness of 25mm.

[0028] The rubber and plastic sound insulation board layer is made of 10mm thick closed-cell elastic rubber and plastic board, and its surface is roughened to increase the composite strength. This layer is responsible for sealing the bottom of all square through holes, forming a continuous elastic support surface.

[0029] The splicing structure has mortise and tenon joints on all four sides of the panel to achieve a tighter physical interlocking.

[0030] A method for preparing the cavity-type modular sound insulation and heat insulation board includes the following steps: S1. A compression molding process is adopted. Molded polystyrene board raw material granules are placed into a lower mold with a square protruding column array, and the upper mold presses down. During hot pressing and foaming, the square through-hole array cavity structure is directly formed on the lower surface of the board in one step. S2. On the lower surface (cavity surface) of the extruded polystyrene board layer with through holes obtained in step S1, a layer of two-component polyurethane adhesive is evenly applied. Then, the cut rubber-plastic sound insulation board layer is aligned and attached, and uniform pressure is applied using a roller press to ensure the adhesive layer covers and fully fills the edge area of ​​the through holes. Curing is allowed at room temperature for 24 hours to ensure a strong bond between the two, with the rubber-plastic board layer completely sealing the bottom of the through holes. S3. Apply a special film-coating adhesive to the upper surface of the extruded board layer, then flatly cover it with the vacuum-metallized PE reflective film (metallized side down), press it with a pressure roller to remove air bubbles, and cure it at room temperature to obtain the composite board.

[0031] S4. Cut the composite board into rectangular plate units of 1200mm×600mm.

[0032] S5. Using a CNC milling machine, precisely machine the matching trapezoidal tenon and mortise structure on all four sides of the plate-shaped unit. Example

[0033] This embodiment provides another cavity-type modular sound insulation and heat insulation board and its preparation method. The sound insulation and heat insulation board has a multi-layer composite structure, which includes, from top to bottom: a vacuum-aluminized reflective film 1, a polystyrene foam board layer 2 with a cavity structure, and a rubber and plastic sound insulation board layer 3. The vacuum-metallized reflective film uses a 0.10mm thick PET material with the metallized side facing down. Its function is to efficiently reflect radiant heat and isolate moisture.

[0034] The polystyrene foam board layer is made of extruded polystyrene board with a compressive strength of ≥300kPa and a thickness of 25mm. The cavity structure processed on its lower surface is a combination of hemispherical blind holes and shallow strip grooves. Specifically, the hemispherical blind holes (diameter 15mm, depth 7.5mm) are distributed in a plum blossom pattern. At the same time, a network of shallow strip guide grooves with a depth of 3mm and a width of 5mm is milled between the hemispherical blind hole array to connect the various hemispherical cavity parts.

[0035] The rubber and plastic sound insulation board layer uses medium-density closed-cell rubber and plastic material with a thickness of 5mm. Its thinner design focuses on providing the necessary elasticity and damping, rather than relying mainly on thickness for sound insulation.

[0036] The splicing structure consists of plastic locking strips installed on the four sides of the panel.

[0037] A method for preparing a cavity-type modular sound insulation and heat preservation board includes the following steps: S1. The lower surface of the polystyrene board substrate is processed in two steps: First, a hemispherical blind hole with a plum blossom dot matrix is ​​milled out using a hemispherical cutter head; then, a straight-edged cutter head is used to mill a network of interconnected shallow strip grooves on a preset path to obtain a polystyrene board layer for easy-to-coil geothermal modules with a cavity structure.

[0038] S2. Spray a layer of quick-drying epoxy resin adhesive onto the cavity surface of the processed extruded board layer, and then bond it to the cut rubber and plastic sound insulation board layer. Use a cold press to maintain the initial shape at 0.3MPa pressure for 5 minutes at room temperature. Utilize the fluidity of the adhesive to allow it to partially penetrate into the shallow groove, thereby enhancing the bond.

[0039] S3. The semi-finished product (extruded board side up) obtained in step S2 is sent into a hot press, covered with PET reflective film, and then hot-pressed for 50 seconds at a temperature of 95℃ and a pressure of 0.2MPa to make the reflective film firmly bonded.

[0040] S4. Cut the composite board into 600mm×1200mm board units.

[0041] S5. Grooves are cut into the sides of the plate-shaped unit and pre-prepared HDPE plastic locking strips are embedded and fixed with structural adhesive to form a complete locking splicing edge.

[0042] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A cavity-type modular sound insulation and heat insulation board, characterized in that, The sound insulation and heat insulation board is a multi-layer composite structure, which includes, from top to bottom: a vacuum-plated aluminum reflective film (1), a polystyrene foam board layer with a cavity structure (2), and a rubber and plastic sound insulation board layer (3). The lower surface of the polystyrene foam board layer (2) is provided with regularly arranged grooves or through holes to form the cavity structure; The rubber and plastic sound insulation board layer (3) is bonded to the lower surface of the polystyrene foam board layer (2) with a cavity structure through a composite process; The vacuum-plated aluminized reflective film (1) is coated on the upper surface of the polystyrene foam board layer (2).

2. The cavity-type modular sound insulation and heat preservation board according to claim 1, characterized in that: The grooves or through holes on the lower surface of the polystyrene foam board layer (2) are arranged in an array. The depth of the grooves is 1 / 3 to 2 / 3 of the thickness of the polystyrene foam board layer (2). The through holes are blind holes or through holes.

3. The cavity-type modular sound insulation and heat preservation board according to claim 1, characterized in that: The cavity structure is cylindrical, prismatic, hemispherical, or a combination thereof.

4. The cavity-type modular sound insulation and heat preservation board according to claim 1, characterized in that: The rubber and plastic sound insulation board layer (3) is a closed-cell elastic rubber and plastic material with a thickness of 3mm to 15mm; the polystyrene foam board layer (2) is one or a combination of extruded polystyrene board or molded polystyrene board.

5. The cavity-type modular sound insulation and heat preservation board according to claim 1, characterized in that: The vacuum-metallized reflective film (1) is made of PET or PE material, with its metallized surface facing the polystyrene foam board layer (2).

6. The cavity-type modular sound insulation and heat preservation board according to claim 1, characterized in that: The sound insulation and heat preservation board has tongue and groove or tenon and mortise structure on all four sides for easy splicing.

7. A method for preparing a cavity-type modular sound insulation and heat preservation board according to any one of claims 1 to 6, characterized in that, Includes the following steps: S1. The lower surface of the polystyrene foam board substrate is mechanically processed to form regularly arranged grooves or through holes to obtain a polystyrene foam board layer with a cavity structure (2). S2. The rubber and plastic sound insulation board layer (3) is attached to the lower surface of the polystyrene foam board layer (2) with a cavity structure by hot pressing or adhesive bonding process. S3. The vacuum-plated aluminized reflective film (1) is laminated onto the upper surface of the polystyrene foam board layer (2) obtained in step S1 through hot pressing or adhesive bonding processes to obtain a composite board. S4. Cut the composite board obtained in step S3 into plate-shaped units of a preset size. S5. The four sides of the plate-shaped unit obtained in step S4 are processed to form a tongue and groove structure or a tenon and mortise structure to obtain the cavity modular sound insulation and heat preservation board.

8. The method for preparing the cavity-type modular sound insulation and heat insulation board according to claim 7, characterized in that, In step S1, the machining process employs CNC engraving, milling, or molding.

9. The method for preparing the cavity-type modular sound insulation and heat insulation board according to claim 7, characterized in that, In step S2, the temperature of the hot-pressing composite is 80°C to 130°C, the pressure is 0.2MPa to 0.8MPa, and the time is 30 seconds to 120 seconds; the adhesive used for the adhesive composite is a polyurethane adhesive or an epoxy resin adhesive.

10. The method for preparing the cavity-type modular sound insulation and heat insulation board according to claim 7, characterized in that, In step S3, the temperature of the hot-pressing composite is 60°C to 100°C, the pressure is 0.1MPa to 0.5MPa, and the time is 20 seconds to 60 seconds.

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