A glass substrate optoelectronic co-packaging structure and its fabrication method

Abstract

This invention provides a glass substrate optoelectronic co-packaging structure and its fabrication method, addressing the technical problems of existing glass substrate-based optoelectronic co-packaging structures, such as easy mounting errors during assembly, poor structural stability, and easy displacement relative to the glass substrate during operation, resulting in transmission loss. The glass substrate optoelectronic co-packaging structure of this invention innovatively embeds optoelectronic integrated chips and integrated circuit chips within the glass substrate, and also incorporates a microbridge structure and a pluggable fiber array within the glass substrate. This not only reduces the overall volume of the packaging structure but also effectively improves the structural stability of each component, reducing failures caused by poor packaging or component detachment, and increasing packaging yield. More importantly, this design effectively ensures alignment accuracy, enabling precise docking between the optoelectronic integrated chip and the external optical signal array, achieving efficient and low-loss transmission of optical signals.

Description

Technical Field

[0001] This invention relates to optoelectronic co-packaging structures and their preparation methods, specifically to a glass substrate optoelectronic co-packaging structure and its preparation method. Background Technology

[0002] In traditional optoelectronic packaging technology, optical and electronic components are typically packaged separately, which increases the size and weight of the system to some extent, and also faces problems such as low photoelectric conversion efficiency and difficulty in thermal management. Especially in the field of high-speed optical communication, how to reduce energy loss during photoelectric conversion and improve the integration and stability of optoelectronic modules has become a major bottleneck in its technological development.

[0003] Currently, with the increasing demand for applications in optical communication, optical sensing, and display devices, optical-electrical co-packaging technology has received widespread attention and research in recent years. As a novel packaging technology, optical-electrical co-packaging integrates optical and electronic components within the same structure, significantly improving system performance, reducing space occupation, and enhancing data transmission rates and efficiency. Existing optical-electrical co-packaging structures mainly rely on silicon-based, ceramic-based, or organic substrates, playing a crucial role in the integration and protection of optoelectronic devices (such as lasers, photodetectors, and integrated photonic circuits). However, these solutions face numerous problems and challenges. First, thermal management is a significant challenge: high-power-density optoelectronic devices generate substantial heat, and the coefficient of thermal expansion (CTE) of silicon-based packaging is mismatched with the optoelectronic device materials, leading to thermal stress accumulation, device deformation, or failure. Especially in data centers and 5G applications, low heat dissipation efficiency has become a bottleneck. Second, signal integrity is limited: in high-speed optoelectronic signal transmission, the high dielectric constant of traditional packaging causes signal loss, crosstalk, and delay, failing to meet Tb / s-level transmission requirements. In addition, the high cost and manufacturing complexity: silicon-based or ceramic-based packaging requires precision processing and multi-layer stacking, which increases the risk of alignment errors and contamination, resulting in low packaging yield and soaring production costs.

[0004] With the rise of AI and quantum computing, the requirements for optoelectronic integration are becoming increasingly stringent. Existing optoelectronic co-packaging structures are struggling to achieve miniaturization and multi-chip heterogeneous integration, facing scalability challenges. Glass substrates, due to their superior flatness and low roughness, enable finer wiring and higher interconnect density (up to 10 times or more), thereby improving signal performance and ensuring dense integration, gradually becoming an important direction for the development of optoelectronic packaging technology. However, existing glass substrate-based optoelectronic co-packaging structures typically mount chips onto the glass substrate, and then mount fiber arrays and microbridge structures on the glass substrate to receive external optical signal arrays. This structure is prone to mounting errors and has poor structural stability, easily shifting relative to the glass substrate during operation, causing transmission losses. Summary of the Invention

[0005] The purpose of this invention is to solve the technical problems of existing optoelectronic co-packaging structures based on glass substrates, which are prone to mounting errors during mounting and have poor structural stability, and are prone to displacement relative to the glass substrate during operation, resulting in transmission loss. The invention provides a new optoelectronic co-packaging structure based on glass substrates and its preparation method.

[0006] To achieve the above objectives, the technical solution provided by this invention is as follows: A glass substrate optoelectronic co-packaging structure is characterized by comprising a glass substrate, an optoelectronic integrated chip, an integrated circuit chip, a redistribution layer, a microbridge structure, a pluggable fiber array, and multiple metal connectors. The upper surface of the glass substrate is provided with photoelectric mounting grooves and circuit mounting grooves; the bottom of the photoelectric mounting grooves and the bottom of the circuit mounting grooves are respectively provided with multiple metal bumps; the photoelectric integrated chip is installed in the photoelectric mounting groove and electrically connected to the corresponding metal bump; the integrated circuit chip is installed in the circuit mounting groove and electrically connected to the corresponding metal bump. Multiple metal connectors are respectively located in the glass substrate below the corresponding photoelectric mounting slot and circuit mounting slot, and one end of each metal connector is connected to at least one metal bump. The redistribution layer includes a dielectric layer disposed on the lower surface of the glass substrate and multiple metal wires encapsulated within the dielectric layer; the two ends of the metal wires are respectively connected to the other ends of the metal connectors corresponding to the optoelectronic integrated chip and the integrated circuit chip, or respectively connected to the other ends of the metal connectors corresponding to the optoelectronic integrated chip / integrated circuit chip and external devices / other external substrates. The upper surface of the glass substrate is provided with a fiber array mounting groove on one side edge of the glass substrate; the pluggable fiber array is installed in the fiber array mounting groove, and its multiple input ends are used to receive external optical signal arrays. The microbridge structure includes multiple parallel optical waveguides, one end of which is connected to one of the multiple output ends of the pluggable fiber array, and the other end is directly opposite the optical input end of the optoelectronic integrated chip.

[0007] Furthermore, the optoelectronic integrated chip is a silicon-based optical transceiver-switching chip, a group III-V optical chip, a quantum dot optical chip, or an organic light-emitting chip; The integrated circuit chip is a silicon-based integrated circuit chip, a III-V circuit chip, an organic circuit chip, or a graphene chip.

[0008] Furthermore, the dielectric layer is made of SiO2, SiN, or organic materials; The metal wiring is made of copper, aluminum, or gold.

[0009] Furthermore, the metal wiring is a single-layer structure or a double-layer structure.

[0010] Furthermore, the optical waveguide is formed by etching on a glass substrate.

[0011] Furthermore, the microbridge structure also includes multiple parallel linear grooves; The straight trenches are formed by etching on a glass substrate, and the two ends of each straight trench are respectively connected to the fiber array mounting groove and the optoelectronic mounting groove. Each of the optical waveguides is installed in a corresponding linear trench along its length using a curing technique.

[0012] Furthermore, the optical waveguide is made of SiO2 material.

[0013] Furthermore, the pluggable fiber array and the microbridge structure are aligned via a snap-fit ​​mechanism; The microbridge structure and the optoelectronic integrated chip are aligned through adhesive dispensing and curing.

[0014] In addition, the present invention also provides a method for preparing the above-mentioned glass substrate optoelectronic co-packaging structure, which is characterized by including the following steps: Step 1: Prepare a glass substrate and fabricate a dielectric layer and various metal wirings on the lower surface of the glass substrate; Step 2: Photoelectric mounting grooves, circuit mounting grooves and fiber array mounting grooves are etched on the upper surface of the glass substrate, and a microbridge structure is fabricated. Step 3: Using the TGV process, multiple through holes are fabricated at the positions corresponding to the metal wiring ends at the bottom of the optoelectronic mounting groove and the circuit mounting groove, and multiple metal connectors are deposited in each through hole. Step 4: Prepare multiple metal bumps on the bottom of the optoelectronic mounting groove and the circuit mounting groove respectively; embed the optoelectronic integrated chip and the integrated circuit chip in the optoelectronic mounting groove and the circuit mounting groove respectively, and make the corresponding components in the optoelectronic integrated chip and the integrated circuit chip contact with the corresponding metal bumps respectively. Step 5: Install and fix the pluggable fiber array in the fiber array mounting slot to complete the fabrication of the glass substrate optoelectronic co-packaging structure.

[0015] Further, in step 2, the preparation of the microbridge structure specifically involves: Multiple optical waveguides were directly etched onto a glass substrate to complete the fabrication of the microbridge structure; Alternatively, multiple linear trenches can be etched on a glass substrate first, and then multiple externally prepared optical waveguides can be placed in the corresponding linear trenches along their length using a curing technique to complete the fabrication of the microbridge structure.

[0016] Compared with the prior art, the present invention has the following beneficial technical effects: 1. This invention provides a glass substrate optoelectronic co-packaging structure that innovatively embeds optoelectronic integrated chips and integrated circuit chips within a glass substrate, and also incorporates a microbridge structure and a pluggable fiber array within the glass substrate. This not only reduces the overall volume of the packaging structure but also effectively improves the structural stability of the optoelectronic integrated chip, integrated circuit chip, microbridge structure, and pluggable fiber array, reducing failures caused by poor packaging or component detachment and improving packaging yield. More importantly, this design effectively ensures alignment accuracy, enabling precise docking between the optoelectronic integrated chip and the external optical signal array, reducing optical signal transmission loss, and achieving efficient, low-loss optical signal transmission. It is not only applicable to traditional optical communication and data transmission fields but can also be extended to emerging technology fields such as lidar, optical computing, and intelligent sensing.

[0017] 2. The optoelectronic co-packaging structure provided by the present invention directly etches microbridge structures on the glass substrate, avoiding the risk of mounting errors during the mounting process of existing optoelectronic co-packaging structures based on glass substrates; at the same time, combined with the design of pluggable fiber array, it can greatly improve the ease of application and packaging stability.

[0018] 3. The glass substrate optoelectronic co-packaging structure provided by the present invention uses only glass as the packaging carrier, which can not only effectively solve the thermal management and signal transmission problems in traditional optoelectronic packaging technology, but also effectively improve the packaging stability, integration degree and overall performance of the optoelectronic co-packaging structure by processing metal bumps, metal connectors and redistribution layers in the glass substrate, while ensuring the electrical connection between the optoelectronic integrated chip, the integrated circuit chip and the underlying circuit.

[0019] 4. The present invention provides a method for preparing a glass substrate optoelectronic co-packaging structure. By etching the upper surface of the glass substrate, optoelectronic integrated chips, integrated circuit chips, microbridge structures and pluggable fiber arrays are embedded in the glass substrate. The method is convenient to operate, has fewer packaging steps, and achieves efficient and reliable packaging while ensuring reliable transmission of optical signals. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of a first embodiment of a glass substrate optoelectronic co-packaging structure according to the present invention; Figure 2 This is a schematic diagram of the microbridge structure etched on the glass substrate in Embodiment 1 of the present invention; Figure 3 This is a top view of the microbridge structure fabricated on a glass substrate in Embodiment 2 of the present invention; Figure 4 This is a left view of the microbridge structure fabricated on a glass substrate in Embodiment 2 of the present invention.

[0021] The annotations in the attached figures are explained as follows: 1-Glass substrate; 11-Optical mounting groove; 12-Circuit mounting groove; 2-Rewiring layer; 21-Dielectric layer; 22-Metal wiring; 3-Microbridge structure; 31-Optical waveguide; 32-Linear trench; 4-Pluggable fiber optic array; 5-Metal bump; 6-Metal connector; 7-Optical integrated chip; 8-Integrated circuit chip. Detailed Implementation

[0022] To make the objectives, advantages, and features of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Those skilled in the art should understand that these embodiments are merely used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0023] Example 1

[0024] like Figure 1 As shown, a glass substrate optoelectronic co-packaging structure specifically includes a glass substrate 1, an optoelectronic integrated chip 7 (PIC), an integrated circuit chip 8 (EIC), a redistribution layer 2, a microbridge structure 3, a pluggable fiber array 4, and multiple metal connectors 6. In this invention, the optoelectronic co-packaging structure uses a glass substrate 1, which not only provides excellent heat dissipation performance but also has low high-frequency loss, making it very suitable for high-power, high-speed optoelectronic applications.

[0025] The upper surface of the glass substrate 1 is etched with a photoelectric mounting groove 11, a circuit mounting groove 12 and a fiber array mounting groove, wherein the fiber array mounting groove is located on one side edge of the glass substrate 1, and the microbridge structure 3 is disposed between the fiber array mounting groove and the photoelectric mounting groove 11.

[0026] Multiple metal bumps 5 are respectively provided on the bottom of the optoelectronic mounting slot 11 and the bottom of the circuit mounting slot 12. The optoelectronic integrated chip 7 typically integrates multiple optical and optoelectronic components, and the integrated circuit chip 8 typically integrates multiple electronic components. In this invention, the optoelectronic integrated chip 7 and the integrated circuit chip 8 are correspondingly mounted in the optoelectronic mounting slot 11 and the circuit mounting slot 12, and electrically connected to the redistribution layer 2 through the metal bumps 5. This ensures electrical connection between some optical and optoelectronic components in the optoelectronic integrated chip 7 and the electronic components in the integrated circuit chip 8, and simultaneously ensures electrical connection between some optical and optoelectronic components in the optoelectronic integrated chip 7 and some electronic components in the integrated circuit chip 8 and external devices and other external substrates, thereby achieving efficient transmission and interconnection of optoelectronic signals.

[0027] In this embodiment, the optoelectronic integrated chip 7 is a silicon-based optical transceiver-switching chip, which includes a modulator, a detector, a wavelength division multiplexer, a wavelength demultiplexer, and an optical switching device. The optoelectronic integrated chip 7 is entirely embedded in the optoelectronic mounting slot 11. The integrated circuit chip 8 is a silicon-based integrated circuit chip, which includes a driver and an amplifier. The integrated circuit chip 8 is entirely embedded in the circuit mounting slot 12.

[0028] In addition, the modulator, detector, and optical switching device within the optoelectronic integrated chip 7 are electrically connected to the corresponding metal bumps 5 within the optoelectronic mounting slot 11, and the driver and amplifier within the integrated circuit chip 8 are electrically connected to the corresponding metal bumps 5 within the circuit mounting slot 12. It is worth noting that each device may have one or more metal bumps 5, depending on the specific design requirements.

[0029] Multiple metal connectors 6 are respectively disposed within the glass substrate 1 below the photoelectric mounting groove 11 and the circuit mounting groove 12. One end of some metal connectors 6 is connected to a metal bump 5 in the photoelectric mounting groove 11, and one end of other metal connectors 6 is connected to a metal bump 5 in the circuit mounting groove 12. It is worth noting that the metal bumps 5 connected to different metal connectors 6 do not overlap, and one end of each metal connector 6 is connected to at least one metal bump 5.

[0030] The redistribution layer 2 includes a dielectric layer 21 disposed on the lower surface of the glass substrate 1 and multiple metal wires 22 embedded in the dielectric layer 21. Some of the metal wires 22 are connected at both ends to the other ends of the metal connectors 6 corresponding to the optoelectronic integrated chip 7 and the integrated circuit chip 8, respectively, while the other two metal wires 22 are connected at both ends to the other ends of the metal connectors 6 corresponding to the optoelectronic integrated chip 7 / integrated circuit chip 8 and to external devices / other external substrates.

[0031] In this embodiment, the modulator in the optoelectronic integrated chip 7 and the driver in the integrated circuit chip 8 are connected via corresponding metal bumps 5, metal connectors 6, and metal wiring 22, for the driver to provide a drive signal to the modulator; the detector in the optoelectronic integrated chip 7 and the amplifier in the integrated circuit chip 8 are connected via corresponding metal bumps 5, metal connectors 6, and metal wiring 22, for transmitting the electrical signal output by the detector to the amplifier for amplification. The modulator, detector, optical switching device, driver, and amplifier are also connected to external devices via corresponding metal bumps 5, metal connectors 6, and metal wiring 22, for the external devices to provide operating voltage to each device; in addition, the amplifier is also connected via corresponding metal bumps 5, metal connectors 6, metal wiring 22, and ball bearings (…). Figure 1 The gray sphere at the bottom of the redistribution layer 2 is connected to other external substrates to output the amplified signal to those substrates. It is worth noting that the above connection is a specific connection method in this embodiment, and other embodiments of the present invention are not limited herein.

[0032] The pluggable fiber array 4 is installed in the fiber array mounting slot, and its multiple inputs are used to receive external optical signal arrays. The design of the pluggable fiber array 4 makes it easier to connect external optical signal arrays, improves the maintainability and flexibility of the system, and is particularly suitable for application scenarios that require frequent replacement of fiber optic connections.

[0033] The microbridge structure 3 includes multiple parallel optical waveguides 31. One end of each waveguide 31 is connected to a corresponding output of a pluggable fiber array 4, and the other end faces the optical input of the optoelectronic integrated chip 7. An external optical signal array is incident on the optoelectronic integrated chip 7 inside the glass substrate 1 via the pluggable fiber array 4 and the multiple waveguides 31. Because the glass substrate 1 of this invention has very good light transmittance, such as... Figure 2 As shown, in this embodiment, the optical waveguide 31 is preferably fabricated on the glass substrate 1 by etching. The optical waveguide 31 fabricated in this way has a stable structure and will not be displaced relative to the glass substrate 1. This allows for precise docking between the optical waveguide 31 and the optical input terminal of the optoelectronic integrated chip 7, avoiding transmission loss of optical signals.

[0034] In this invention, the model of the pluggable fiber array 4 needs to be determined based on the external optical signal array, and the number of optical waveguides 31 is determined based on the number of output terminals of the pluggable fiber array 4. Preferably, in this embodiment, the pluggable fiber array 4 and the microbridge structure 3 are aligned by a mechanical structure, such as a snap-fit, while the microbridge structure 3 and the optoelectronic integrated chip 7 are aligned by adhesive dispensing and curing.

[0035] The external optical signal array sequentially enters the optoelectronic integrated chip 7 via the pluggable fiber array 4 and the microbridge structure 3. After being modulated by a modulator, wavelength division multiplexed by a wavelength division multiplexer (WDM), and demultiplexed by a WDM, it enters the detector. The detector converts the received optical signal into an electrical signal, which is then transmitted to the integrated circuit chip 8 via corresponding metal bumps 5, metal connectors 6, and metal wiring 22. The electrical signal is amplified by an amplifier and then output to the outside via metal wiring 22. The optical switching device is used to realize multi-channel transmission and reception. During multi-channel transmission and reception, the optical signal is emitted through the transmitter (including the modulator and WDM) of any channel and transmitted to the receiver (including the WDM and detector) of any channel via the optical switching device.

[0036] This invention innovatively embeds the optoelectronic integrated chip 7 and the integrated circuit chip 8 within a glass substrate 1, and also houses the microbridge structure 3 and the pluggable fiber array 4 within the glass substrate 1. This design effectively improves the structural stability of the optoelectronic integrated chip 7, the integrated circuit chip 8, the microbridge structure 3, and the pluggable fiber array 4, thereby ensuring alignment accuracy, improving packaging yield, and achieving precise docking between the optoelectronic integrated chip 7 and the external optical signal array. This effectively reduces the transmission loss of optical signals and achieves efficient and low-loss transmission of optical signals. In addition, this design also avoids the risk of mounting errors during the mounting process of existing optoelectronic co-packaging structures based on glass substrates.

[0037] Furthermore, this invention uses only glass as the packaging carrier, and by designing metal bumps 5, metal connectors 6, and a redistribution layer 2 within the glass substrate 1, it effectively improves the packaging stability, integration level, and overall performance of the optoelectronic co-packaging structure while ensuring the electrical connection between the optoelectronic integrated chip 7, the integrated circuit chip 8, and the underlying circuitry. The glass substrate 1 in this invention can be used as an intermediary board packaged together with other external substrates, or it can be used directly as an independent module.

[0038] The fabrication method of the above-mentioned glass substrate optoelectronic co-packaging structure specifically includes the following steps: Step 1: Prepare a glass substrate 1. Based on the electrical connection relationship between the optoelectronic integrated chip 7 and the integrated circuit chip 8, as well as the electrical connection relationships between the optoelectronic integrated chip 7 and the integrated circuit chip 8 and external devices and other external substrates, determine the number of metal wirings 22 and the connection positions at both ends of each metal wiring 22. After obtaining the number of metal wirings 22 and the connection positions at both ends of each metal wiring 22, use deposition and etching techniques to prepare a dielectric layer 21 and each metal wiring 22 on the lower surface of the glass substrate 1, completing the preparation of the redistribution layer 2.

[0039] Step 2: Etch photoelectric mounting groove 11, circuit mounting groove 12, multiple optical waveguides 31, and fiber array mounting groove on the upper surface of glass substrate 1. During etching, the fiber array mounting groove must be located on one side edge of glass substrate 1, and each optical waveguide 31 must be connected between the fiber array mounting groove and the photoelectric mounting groove 11.

[0040] Step 3: Using the TGV process, multiple through-holes are fabricated at the ends of the metal wiring 22 at the bottom of the optoelectronic mounting groove 11 and the circuit mounting groove 12, respectively. Metal is deposited in each through-hole to form a corresponding number of metal connectors 6. The number of through-holes at the bottom of the optoelectronic mounting groove 11 is determined based on the connection requirements between the optoelectronic integrated chip 7 and the integrated circuit chip 8, as well as between the optoelectronic integrated chip 7 and external devices and other external substrates. Similarly, the number of through-holes at the bottom of the circuit mounting groove 12 is determined based on the connection requirements between the integrated circuit chip 8 and the optoelectronic integrated chip 7, as well as between the integrated circuit chip 8 and external devices and other external substrates.

[0041] Step 4: Prepare multiple metal bumps 5 on the bottom of the optoelectronic mounting groove 11 and the circuit mounting groove 12 respectively; embed the optoelectronic integrated chip 7 and the integrated circuit chip 8 in the optoelectronic mounting groove 11 and the circuit mounting groove 12 respectively, and make some optical components and optoelectronic components in the optoelectronic integrated chip 7 and some electronic components in the integrated circuit chip 8 contact with the corresponding metal bumps 5 respectively to achieve subsequent electrical connection.

[0042] Step 5: Install and fix the pluggable fiber array 4 in the fiber array mounting slot to complete the fabrication of the glass substrate optoelectronic co-packaging structure.

[0043] Example 2

[0044] The only difference between this embodiment and Embodiment 1 is the structure and preparation method of the microbridge structure 3. Figure 3 , Figure 4 As shown, in this embodiment, the microbridge structure 3 includes a plurality of parallel linear grooves 32 and an optical waveguide 31 disposed in the corresponding linear groove 32 by a curing technology along the length direction. The two ends of each linear groove 32 are respectively connected to the fiber array mounting groove and the optoelectronic mounting groove 11.

[0045] The fabrication method is as follows: First, multiple linear trenches 32 are etched on the glass substrate 1. Then, multiple externally fabricated optical waveguides 31 are placed in the corresponding linear trenches 32 along their length direction using a curing technique. Compared with the existing microbridge structure, the structural stability of the optical waveguides 31 fabricated by this method is greatly improved. Preferably, in this embodiment, the optical waveguides 31 are made of SiO2 material.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the present invention.

Claims

1. A glass substrate optoelectronic co-packaging structure, characterized in that: It includes a glass substrate (1), an optoelectronic integrated chip (7), an integrated circuit chip (8), a redistribution layer (2), a microbridge structure (3), a pluggable fiber array (4), and multiple metal connectors (6). The upper surface of the glass substrate (1) is provided with a photoelectric mounting groove (11) and a circuit mounting groove (12); the bottom of the photoelectric mounting groove (11) and the bottom of the circuit mounting groove (12) are respectively provided with a plurality of metal bumps (5); the photoelectric integrated chip (7) is installed in the photoelectric mounting groove (11) and is electrically connected to the corresponding metal bump (5); the integrated circuit chip (8) is installed in the circuit mounting groove (12) and is electrically connected to the corresponding metal bump (5); Multiple metal connectors (6) are respectively disposed in the glass substrate (1) below the photoelectric mounting groove (11) and the circuit mounting groove (12), and one end of each metal connector (6) is connected to at least one metal protrusion (5); The redistribution layer (2) includes a dielectric layer (21) disposed on the lower surface of the glass substrate (1) and multiple metal wires (22) encapsulated in the dielectric layer (21); the two ends of the metal wires (22) are respectively connected to the other ends of the metal connectors (6) corresponding to the optoelectronic integrated chip (7) and the integrated circuit chip (8), or respectively connected to the other ends of the metal connectors (6) corresponding to the optoelectronic integrated chip (7) / integrated circuit chip (8) and external devices / other external substrates; The upper surface of the glass substrate (1) is provided with a fiber array mounting groove on one side edge of the glass substrate (1); the pluggable fiber array (4) is installed in the fiber array mounting groove, and its multiple input ends are used to receive external optical signal arrays. The microbridge structure (3) includes multiple parallel optical waveguides (31), one end of which is connected to multiple output ends of the pluggable fiber array (4), and the other end is directly opposite the optical input end of the optoelectronic integrated chip (7).

2. The glass substrate optoelectronic co-packaging structure according to claim 1, characterized in that: The optoelectronic integrated chip (7) is a silicon-based optical transceiver-switching chip, a group III-V optical chip, a quantum dot optical chip, or an organic light-emitting chip; The integrated circuit chip (8) is a silicon-based integrated circuit chip, a III-V circuit chip, an organic circuit chip, or a graphene chip.

3. The glass substrate optoelectronic co-packaging structure according to claim 2, characterized in that: The dielectric layer (21) is made of SiO2, SiN or organic materials; The metal wiring (22) is made of copper, aluminum or gold.

4. The glass substrate optoelectronic co-packaging structure according to claim 3, characterized in that: The metal wiring (22) is a single-layer structure or a double-layer structure.

5. A glass substrate optoelectronic co-packaging structure according to any one of claims 1-4, characterized in that: The optical waveguide (31) is formed by etching on a glass substrate (1).

6. The glass substrate optoelectronic co-packaging structure according to any one of claims 1-4, characterized in that: The microbridge structure (3) also includes multiple parallel straight grooves (32); The straight grooves (32) are formed by etching on the glass substrate (1), and the two ends of each straight groove (32) are respectively connected to the fiber array mounting groove and the optoelectronic mounting groove (11); Each of the optical waveguides (31) is installed in the corresponding straight groove (32) along the length direction by a curing technology.

7. The glass substrate optoelectronic co-packaging structure according to claim 6, characterized in that: The optical waveguide (31) is made of SiO2 material.

8. The glass substrate optoelectronic co-packaging structure according to claim 1, characterized in that: The pluggable fiber array (4) and the microbridge structure (3) are aligned by a snap-fit ​​mechanism; The microbridge structure (3) and the optoelectronic integrated chip (7) are aligned by dispensing and curing.

9. A method for preparing a glass substrate optoelectronic co-packaging structure according to any one of claims 1-8, characterized in that, Includes the following steps: Step 1: Prepare a glass substrate (1), and prepare a dielectric layer (21) and various metal wirings (22) on the lower surface of the glass substrate (1). Step 2: Photoelectric mounting groove (11), circuit mounting groove (12) and fiber array mounting groove are respectively etched on the upper surface of the glass substrate (1), and a microbridge structure (3) is prepared. Step 3: Using the TGV process, multiple through holes are prepared at the positions corresponding to the ends of the metal wiring (22) at the bottom of the optoelectronic mounting groove (11) and the circuit mounting groove (12), and multiple metal connectors (6) are deposited in each through hole. Step 4: Prepare multiple metal bumps (5) at the bottom of the optoelectronic mounting groove (11) and the circuit mounting groove (12); embed the optoelectronic integrated chip (7) and the integrated circuit chip (8) in the optoelectronic mounting groove (11) and the circuit mounting groove (12) respectively, and make the corresponding components in the optoelectronic integrated chip (7) and the integrated circuit chip (8) contact with the corresponding metal bumps (5); Step 5: Install and fix the pluggable fiber array (4) in the fiber array mounting slot to complete the fabrication of the glass substrate optoelectronic co-packaging structure.

10. The method for preparing the glass substrate optoelectronic co-packaging structure according to claim 9, characterized in that, In step 2, the preparation of the microbridge structure (3) specifically involves: Multiple optical waveguides (31) are directly etched on the glass substrate (1) to complete the fabrication of the microbridge structure (3); Alternatively, multiple straight grooves (32) can be etched on the glass substrate (1) first, and then multiple optical waveguides (31) prepared externally can be placed in the corresponding straight grooves (32) along the length direction by curing technology to complete the fabrication of the microbridge structure (3).

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