Vapor chamber with low thermal resistance and heat dissipation device

By introducing a capillary mesh and filter structure into the heat spreader, combined with a snap-fit ​​mechanism and a cover plate made of low thermal resistance material, the problems of dust entry and disassembly difficulties are solved, achieving efficient heat dissipation and convenient maintenance.

CN122094068APending Publication Date: 2026-05-26GUANGZHOU ZHIDE ELECTRONICS TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-03-04
Publication Date
2026-05-26

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Abstract

The invention belongs to heat exchange devices, particularly relates to the field of vapor chambers, and discloses a low-thermal-resistance vapor chamber and a heat dissipation device, the low-thermal-resistance vapor chamber comprises a vapor chamber mechanism, a capillary net is fixed on the inner side of a first cover plate, a copper column is fixed between the first cover plate and a second cover plate, and the copper column penetrates through the capillary net. According to the vapor chamber with the low thermal resistance, the purposes of blocking dust and impurities and facilitating disassembly and cleaning can be achieved, a filter screen is installed between a cooling fan set and a fin set, the filter screen can play a role in blocking the dust and impurities, the situation that the dust and impurities enter gaps of the fin set and are difficult to clean is avoided, and after a rotating rod is rotated and a clamping block leaves a second clamping hole, the filter screen is unlocked; and if the fin group and the heat dissipation fan group need to be disassembled, a rotating rod is rotated and unlocked firstly, then the rotating rod is pulled, the fin group and the first supporting frame are disassembled, and then the heat dissipation fan group can be disassembled, so that disassembly and assembly are rapid and convenient, and cleaning or maintenance is convenient.
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