Wafer cleaning device and wafer cleaning method in wafer de-bonding process

Abstract

The invention discloses a wafer cleaning device and a wafer cleaning method in a wafer de-bonding process, and the device comprises a process cavity which comprises a cavity wall and a cavity; the bearing mechanism comprises a bearing disc and a rotating mechanism which is connected with the bearing disc and drives the bearing disc to rotate, the bearing disc is provided with a bearing surface for bearing a to-be-cleaned piece, the to-be-cleaned piece is a wafer or a wafer with a frame, the wafer with the frame comprises a pressing ring, a wafer and a bearing film which are sequentially stacked, and the bearing film is in contact with the bearing surface when the wafer with the frame is placed; the cover plate mechanism comprises an annular body and an inner cavity; the annular body is provided with a groove with an opening facing the bearing disc. The lifting mechanism is connected with the cover plate mechanism and used for driving the cover plate mechanism to move up and down so that the cover plate mechanism can abut against the bearing disc; and the liquid spraying mechanism is arranged in the cavity and is used for being connected with the photoresist removing liquid medicine supply device and discharging waste liquid.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, specifically to wafer cleaning apparatus and wafer cleaning method in wafer debonding process. Background Technology

[0002] Wafer debonding is a key process step in semiconductor manufacturing. The commonly used method is laser debonding, which uses the high energy of a laser to carbonize the release layer. Then, deionized water is used to clean and remove the carbon ash, but a certain thickness of release layer adhesive layer will still remain.

[0003] To completely remove the residual adhesive layer, existing technologies typically require immersion in a chemical solution for adhesive removal. There are two main methods for wafer adhesive removal: one is to spray the chemical solution directly onto the wafer surface through a nozzle to remove the adhesive by rinsing; the other is to transfer the wafer to a dedicated immersion device for overall immersion, and then transfer it to another unit for cleaning after the adhesive layer has softened.

[0004] With the continuous advancement of semiconductor manufacturing processes, wafer thickness is decreasing. Ultra-thin wafers are usually bonded to standard wafer frames with adhesive films, also known as frame carriers. However, during the removal of adhesive from the frame carrier, the chemical solution can easily come into contact with the adhesive film used to fix the wafer on the carrier, also known as a UV film. Once the UV film comes into contact with the chemical solution, surface wrinkles will appear, which will lead to wafer damage.

[0005] Therefore, there is an urgent need for a device and method that can ensure the adhesive film (UV film) is not damaged during the immersion and removal of adhesive from the frame substrate. Summary of the Invention

[0006] The technical problem to be solved by this application is to provide a wafer cleaning apparatus and a wafer cleaning method in the wafer debonding process that can ensure that the adhesive film (UV film) is not damaged when the frame wafer is immersed for adhesive removal.

[0007] To address the aforementioned technical problems, according to a first aspect of the embodiments of this application, a wafer cleaning apparatus is provided. The wafer cleaning apparatus includes a process cavity, comprising a cavity wall and a chamber enclosed by the cavity wall; a carrier mechanism, comprising a carrier plate disposed within the chamber and a rotating mechanism connected to and driving the carrier plate to rotate, the carrier plate having a carrier surface for carrying a component to be cleaned, the component to be cleaned being a wafer or a framed wafer, the framed wafer comprising a pressure ring, a wafer, and a carrier film stacked sequentially, the carrier film contacting the carrier surface when the framed wafer is placed; and a cover plate mechanism located above the carrier plate, the cover plate mechanism comprising an annular body and an inner cavity enclosed by the annular body. The cavity includes a groove on the annular body with an opening facing the support plate; a lifting mechanism connected to the cover plate mechanism for moving the cover plate mechanism up and down, so that the cover plate mechanism presses against the support plate; a spraying mechanism located in the cavity for connecting to a desizing agent supply device and for discharging waste liquid; when the framed wafer is placed on the support plate, the lifting mechanism drives the cover plate mechanism to move toward the support plate until it contacts the framed wafer, the groove accommodates the pressure ring, and the annular body and the wafer located in the cavity form an immersion tank, wherein the spraying mechanism is used to spray the desizing agent into the immersion tank.

[0008] In one embodiment, the support mechanism further includes multiple sets of clamping mechanisms, all of which are arranged around the support plate for clamping the annular body.

[0009] In one embodiment, the clamping mechanism includes a clamping member and a driving mechanism connected to the clamping member. The driving mechanism drives the clamping member to move away from or towards the support plate. When the annular body is located on the support plate, the clamping member is used to clamp the annular body to the support plate.

[0010] In one embodiment, the lifting mechanism includes: a first driving member fixed to the cavity wall; a first transmission part connected to the first driving member for converting the output power of the first driving member into linear power; a second transmission part including two intersecting transmission members rotatably connected at the intersection, and the rotatable connection of the two transmission members being connected to the first transmission part for amplifying the stroke of the first transmission part to a required multiple; one end of each of the two transmission members being rotatably connected to the cavity wall; and a gripping part rotatably connected to the other end of the two transmission members; the gripping part being used to grip or remove the annular body.

[0011] In one embodiment, the lifting mechanism further includes a guide member, which is disposed perpendicular to the top of the cavity wall; the first transmission part includes a lead screw and a nut pair connected in transmission, and a converter connected to the nut pair; the lead screw is connected in transmission to the first driving member, and the converter passes through the guide member and is connected to the rotational connection of the two transmission members.

[0012] In one embodiment, the gripping part includes an adsorption plate and a gripper assembly disposed on the adsorption plate; the adsorption plate is connected to the transmission member, and the adsorption plate is provided with a suction cup for adsorbing the annular body; the gripper assembly includes: a fixed base connected to the adsorption plate; a second driving member disposed on the fixed base; and a claw portion rotatably connected to the fixed base; the second driving member is drively connected to the claw portion and is adapted to drive the claw portion to rotate about the position connected to the fixed base, so as to open or close the claw portion.

[0013] In one embodiment, the adsorption plate has a ring structure; the gripper assembly has at least two sets, and all the gripper assemblies are evenly spaced around the adsorption plate.

[0014] In one embodiment, the rotating mechanism includes a base, a rotating shaft rotatably connected to the base, and a third driving member drivingly connected to the rotating shaft; the base is fixed to the cavity wall, the bearing plate is fixed to the rotating shaft, and the third driving member is adapted to drive the rotating shaft to rotate about an axis.

[0015] In one embodiment, the bearing surface of the bearing plate is provided with an air suction hole, and the rotating shaft is provided with an air suction channel, which communicates with the air suction hole.

[0016] According to a second aspect of the embodiments of this application, a wafer cleaning method in a wafer debonding process is provided, employing a wafer cleaning apparatus as described in any of the preceding claims. The wafer cleaning method includes: placing a framed wafer on a carrier tray; controlling a cover plate mechanism to descend and be placed on the framed wafer, with a pressure ring on the framed wafer located in the groove, the wafer on the framed wafer being accommodated in the inner cavity to form an immersion tank with the annular body; controlling the spraying mechanism to spray a desmearing agent into the immersion tank, thereby performing and completing the immersion desmearing cleaning process.

[0017] In one embodiment, the process of performing and completing the immersion desmearing cleaning process includes: during the spraying of the desmearing solution, controlling the carrier plate to drive the cover plate mechanism and the framed wafer to rotate at a first rotational speed; after the framed wafer has been immersed in the immersion tank for a preset time, controlling the carrier plate to rotate at a second rotational speed, increasing the spraying pressure of the spraying mechanism to a preset value, and spraying the solution back and forth at a uniform speed above the wafer; stopping the spraying of the desmearing solution, controlling the carrier plate to slow down until it stops; and controlling the spraying mechanism to discharge the waste liquid containing the adhesive film from the immersion tank, thus completing the immersion desmearing cleaning process.

[0018] Compared with the prior art, the beneficial effects of this application are as follows: by setting a cover plate mechanism, which includes an annular body and an inner cavity surrounded by the annular body, and the annular body is provided with a groove adapted to the size of the pressure ring; by setting a lifting mechanism, which can drive the cover plate mechanism to move toward the carrier plate, so that the cover plate mechanism cooperates with the framed wafer, wherein the groove is used to accommodate the retaining ring, the annular body is pressed against the framed wafer, and the inner cavity is used to accommodate the wafer so that the annular body and the wafer form an immersion tank, and then the spraying mechanism sprays the adhesive remover into the immersion tank, so as to achieve the purpose of immersing and removing adhesive only on the wafer, isolating the adhesive remover from contact with the carrier film, avoiding wrinkles or failure of the carrier film from the root, ensuring that the carrier film is not damaged, ensuring the integrity of the carrier film, that is, avoiding damage to the wafer. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a wafer immersion resist removal apparatus according to an exemplary embodiment.

[0020] Figure 2 yes Figure 1 The diagram shows a schematic of the carrier tray in the wafer immersion and resist removal device.

[0021] Figure 3 yes Figure 2 The diagram shows the fit between the carrier film, wafer, and pressure ring on the carrier disk.

[0022] Figure 4 yes Figure 1 The diagram shows a lifting mechanism in a wafer immersion and resist removal device.

[0023] Figure 5 yes Figure 4 A schematic diagram of the gripper assembly in the lifting mechanism shown.

[0024] Figure 6 yes Figure 1 The diagram shows a schematic of the support mechanism in the wafer immersion and resist removal device.

[0025] Figure 7 For use Figure 1 The flowchart shown is a process for removing resist from a wafer using a wafer immersion and resist removal apparatus.

[0026] Explanation of reference numerals in the attached figures

[0027] 1. Process cavity; 11. Cavity wall; 12. Chamber; 2. Bearing mechanism; 21. Bearing plate; 22. Rotating mechanism; 221. Base; 222. Rotating shaft; 2221. Suction channel; 223. Third driving component; 3. Cover plate mechanism; 31. Annular body; 311. Groove; 32. Inner cavity; 4. Lifting mechanism; 41. First driving component; 42. Lead screw; 43. Adapter; 44. Transmission component; 45. Gripping part; 451. Adsorption plate; 452. Gripper assembly; 4521. Fixing seat; 4522. Second driving component; 4523. Claw part; 4524. Linkage assembly; 453. Suction cup; 46. Guide component; 5. Immersion tank; 6. Spraying mechanism; 7. Clamping component; 8. Framed wafer; 81. Pressure ring; 82. Wafer; 83. Bearing film; 9. Outer cover. Detailed Implementation

[0028] Unless otherwise defined, the technical or scientific terms used in this specification and claims shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. Specific embodiments of this application will be described below in conjunction with the accompanying drawings. It should be noted that, in order to provide a concise description, this specification cannot exhaustively describe all features of the actual embodiments. Without departing from the spirit and scope of this application, those skilled in the art can modify and substitute the embodiments of this application, and the resulting embodiments are also within the protection scope of this application.

[0029] In related technologies, wafer resist removal processes often employ direct spraying or overall immersion methods. Both of these methods have significant drawbacks when processing ultrathin wafers: when immersing the frame carrier, the chemical solution comes into contact with the UV film on the back of the frame carrier, causing the UV film to wrinkle or even fail, thereby affecting the quality of the wafer in the frame carrier; the frame carrier is a conventional component, referring to the frame structure used to support and fix the ultrathin wafer, and will not be elaborated on here.

[0030] Figure 1 This is a schematic diagram of a wafer immersion resist removal apparatus according to an exemplary embodiment. Figure 2 yes Figure 1 The diagram shows a support tray in a wafer immersion and resist removal device. Figure 3 yes Figure 2 The diagram shows the fit between the carrier film, the wafer, and the retaining ring on the carrier disk. Figure 4 yes Figure 1 The diagram shows a lifting mechanism in a wafer immersion and resist removal device. Figure 5 yes Figure 4The diagram shows a gripper assembly in the lifting mechanism. Figure 6 yes Figure 1 The diagram shows a schematic of the support mechanism in the wafer immersion and resist removal device.

[0031] refer to Figures 1 to 6 This application provides a wafer cleaning apparatus comprising a process chamber 1, a support mechanism 2, a cover plate mechanism 3, a lifting mechanism 4, and a liquid spraying mechanism 6. The technical features described above are as follows: The process cavity 1 may include a cavity wall 11 and a chamber 12 enclosed by the cavity wall 11.

[0032] The carrier mechanism 2 may include a carrier disk 21 disposed in the chamber 12, and a rotating mechanism 22 connected to the carrier disk 21 and driving the carrier disk 21 to rotate. The carrier disk 21 has a carrier surface for carrying the workpiece to be cleaned. The workpiece to be cleaned is a wafer or a framed wafer 8. The framed wafer 8 includes a pressure ring 81, a wafer 82 and a carrier film 83 stacked in sequence. When the framed wafer 8 is placed, the carrier film 83 is in contact with the carrier surface.

[0033] The cover plate mechanism 3 may be located above the support plate 21, and may include an annular body 31 and an inner cavity 32 enclosed by the annular body 31; the annular body is provided with a groove 311 with an opening facing the support plate 21.

[0034] The lifting mechanism 4 can be connected to the cover plate mechanism 3 to drive the cover plate mechanism 3 to move up and down, so that the cover plate mechanism 3 presses against the bearing plate 21.

[0035] The spraying mechanism 6 is located in the chamber 12 and is used to connect to the adhesive removal liquid supply device and to discharge waste liquid.

[0036] When a framed wafer 8 is placed on the carrier plate 21, the lifting mechanism 4 drives the cover plate mechanism 3 to move toward the carrier plate 21 until it contacts the framed wafer 8. The groove 311 accommodates the pressure ring 81, and the annular body 31 and the wafer 82 located in the inner cavity 32 form an immersion tank 5. The spraying mechanism 6 is used to spray the adhesive remover into the immersion tank 5.

[0037] It should be noted that, as Figure 3 As shown, the framed wafer 8, also known as a frame wafer, includes a pressure ring 81, a wafer 82, and a carrier film 83 stacked sequentially. The carrier film 83 is an adhesive film, and the adhesive layer on the carrier film 83 is used to fix the wafer 82. The pressure ring 81 is pressed onto the carrier film 83 to limit and fix the carrier film 83. The carrier disk 21 is also known as a chuck disk. The carrier film 83 is also known as a UV film or blue film. The annular body 31 is also known as a cover ring or a focusing ring.

[0038] In this embodiment, a cover plate mechanism 3 is provided, which includes an annular body and an inner cavity 32 formed by the annular body 31. The annular body is provided with a groove 311 that matches the size of the pressure ring 81. A lifting mechanism 4 is provided, which can drive the cover plate mechanism 3 to move toward the carrier plate 21, so that the cover plate mechanism 3 cooperates with the framed wafer 8. The groove 311 is used to accommodate the retaining ring, the annular body is pressed against the carrier film 83, and the inner cavity 32 is used to accommodate the wafer 82 and form an immersion tank 5 with the wafer 82. Then, the spraying mechanism 6 sprays the adhesive remover into the immersion tank 5 to achieve the purpose of immersing and removing adhesive only from the wafer 82, isolating the adhesive remover from the carrier film 83, avoiding wrinkles or failure of the carrier film 83 from the root, ensuring that the carrier film 83 is not damaged, and ensuring the integrity of the carrier film 83.

[0039] In the wafer immersion method provided in this embodiment, the annular body 31 can move up and down with the lifting mechanism 4, thereby allowing the annular body 31 and the framed wafer 8 to be separably coupled. On this basis, the inner diameter of the annular body 31 is approximately the same as the diameter of the wafer 82. When the annular body 31 and the framed wafer 8 are coupled, the annular body 31 covers the area between the edge of the wafer and the edge of the carrier film, so that the solution fills the inner cavity 32 of the annular body 31, forming a solution pool, which isolates the solution from contact with the carrier film 83, and the wafer is immersed in the solution pool.

[0040] Specifically, in the initial state, the cover plate mechanism 3 at the lifting mechanism 4 is located above the carrier plate 21. During use, the lifting mechanism 4 moves the cover plate mechanism 3 downward, so that the cover plate mechanism 3 cooperates with the framed wafer 8 to form the immersion tank 5. The spraying mechanism 6 sprays the adhesive remover into the immersion tank 5 to perform immersion and adhesive removal treatment on the wafer. The adhesive remover only contacts the upper surface of the wafer and the annular body, and does not contact the carrier film 83. At the same time as spraying, the rotating mechanism 22 drives the carrier plate 21 to rotate, so that the adhesive remover evenly covers the wafer surface under the action of centrifugal force, ensuring that the adhesive removal is sufficient. After the immersion and adhesive removal is completed, the spraying mechanism 6 stops spraying and discharges the waste adhesive that has accumulated in the central area of ​​the wafer surface. The lifting mechanism 4 moves the cover plate mechanism 3 upward to reset, waiting for the next operation.

[0041] Optionally, the spraying mechanism 6 may be equipped with a suction device with a suction nozzle, which is used to adsorb and discharge the waste adhesive liquid accumulated in the central area of ​​the wafer surface.

[0042] In one specific embodiment, the carrier mechanism 2 further includes multiple sets of clamping mechanisms, all of which are arranged around the carrier disk 21 for clamping the annular body 31. The clamping mechanisms press against the annular body 31, thereby causing the annular body 31 to abut against the carrier membrane 83, avoiding gaps between the annular body 31 and the carrier membrane 83, preventing the liquid medicine from leaking out from between the annular body 31 and the carrier membrane 83 and contacting the carrier membrane 83, and further eliminating the risk of the liquid medicine corroding the carrier membrane 83.

[0043] In one specific embodiment, the clamping mechanism includes a clamping member 7 and a driving mechanism connected to the clamping member 7. The driving mechanism drives the clamping member 7 to move away from or towards the support plate 21. When the annular body 31 is located on the support plate 21, the clamping member is used to clamp the annular body 31 to the support plate 21. In this embodiment, the driving mechanism can be a motor, which is connected to the clamping member 7 through a transmission component and drives the clamping member 7 to move radially. The clamping member 7 can be an arc-shaped gripper. When the clamping member 7 is close to the support plate 21, the clamping member 7 clamps the annular body. When the clamping member 7 is away from the support plate 21, the clamping member 7 releases the annular body.

[0044] Specifically, the clamping member 7 uses an elastic element to provide clamping force. When the clamping member 7 approaches the annular body under the drive mechanism, the arc-shaped clamping member 7 is lifted by the annular body 31, and the elastic element is stretched, so that the clamping member 7 is stably clamped at the annular body 31. When the clamping member 7 moves away from the annular body 31 under the drive mechanism, the clamping member 7 is disengaged from the annular body 31, and the elastic element returns to its free state.

[0045] In one specific embodiment, the lifting mechanism 4 includes: a first driving member 41, fixed to the cavity wall 11; a first transmission part, connected to the first driving member 41, for converting the output power of the first driving member 41 into linear power; a second transmission part, including two intersecting transmission members 44 rotatably connected at the intersection, and the rotatable connection of the two transmission members 44 is connected to the first transmission part, for amplifying the motion stroke of the first transmission part to the required multiple; one end of each of the two transmission members 44 is rotatably connected to the cavity wall 11; and a gripping part 45, rotatably connected to the other end of the two transmission members 44; the gripping part 45 is used to grip or remove the annular body.

[0046] In this embodiment, the first driving member 41 can be, but is not limited to, a motor. The first transmission unit drives the cross connection of the two transmission members 44 to move up and down in a straight line. When the first transmission unit drives the cross connection to move down, the cross angle between the two transmission members 44 decreases, the gripping part 45 descends, the annular body moves toward the bearing plate 21, and presses against the bearing film 83. When the first transmission unit drives the cross connection to move up, the cross angle between the two transmission members 44 increases, and the gripping part 45 moves up and resets. By setting the cross transmission members 44, the lifting and lowering are multiplied, so that the gripping part 45 can achieve a large lifting and lowering displacement with a small stroke of the first transmission unit, thereby reducing the driving energy consumption.

[0047] In one specific embodiment, the lifting mechanism 4 further includes a guide member 46, which is disposed on the top of the vertical cavity wall 11; the first transmission part includes a lead screw 42 and a nut pair connected by transmission, and a converter 43 connected to the nut pair; the lead screw 42 is connected by transmission to the first driving member 41, and the converter 43 passes through the guide member 46 and is connected to the rotational connection of the two transmission members 44; in this embodiment, the guide member 46 can be, but is not limited to, a rod, used to constrain the lateral displacement of the converter 43 during the lifting process, and ensure that the gripping part 45 moves stably in the vertical direction; the first driving member 41 drives the lead screw 42 to rotate, and the nut pair moves axially along the lead screw 42; the transmission member 44 can be a rod, and the rotational connection of the two transmission members 44 is connected to the converter 43; when the nut pair moves axially along the lead screw 42, it drives the cross connection of the two transmission members 44 to move synchronously through the converter 43.

[0048] In one specific embodiment, the gripping part 45 includes an adsorption plate 451 and a gripper assembly 452 disposed on the adsorption plate 451; the adsorption plate 451 is connected to the transmission member 44, and the adsorption plate 451 is provided with a suction cup 453 for adsorbing the annular body 31; the gripper assembly 452 includes: a fixed base 4521 connected to the adsorption plate; a second driving member 4522 disposed on the fixed base 4521; and a claw part 4523 rotatably connected to the fixed base 4521; the second driving member 4522 is drivenly connected to the claw part 4523 and is adapted to drive the claw part 4523 to rotate around the position connected to the fixed base 4521 so that the claw part 4523 opens or closes.

[0049] In this embodiment, the suction cup 453 is connected to an external negative pressure device for adsorption and fixation to the end face of the annular body; the gripper assembly 452 is used to grasp the outer edge of the annular body; the second drive member 4522 at the gripper assembly 452 can be, but is not limited to, a motor, and the second drive member 4522 is connected to the claw part 4523 via a connecting rod assembly 4524, so that the claw part 4523 rotates around the connection position with the fixed seat 4521 to switch between the folded and open angle positions; when the claw part 4523 is folded, it plays a role in preventing the annular body 31 from falling off; when the claw part 4523 is open, it facilitates the picking and putting-away operation of the annular body.

[0050] Specifically, when installing the annular body onto the gripping part 45: first, the second driving member 4522 drives the claw part 4523 to open, so as to facilitate the installation of the annular body 31; the suction cup 453 is connected to negative pressure, so that it adsorbs and fixes the annular body, and then the claw part 4523 retracts; the lifting mechanism 4 drives the annular body to move down, and when the annular body moves down to a certain distance from the carrier plate 21, specifically, but not limited to, 250mm, the second driving member 4522 drives the claw part 4523 to open in advance, to prevent the claw part 4523 from opening again after the annular body has moved down to the position and interfering with the carrier plate 21; the lifting mechanism 4 continues to drive the annular body to descend until the annular body is aligned with the pressure ring 81, the suction cup 453 releases negative pressure, and the annular body is accurately placed in the target position, and then the gripping part 45 moves up and resets.

[0051] In one specific embodiment, the adsorption plate 451 has a ring structure; at least two sets of gripper assemblies 452 are provided, and all gripper assemblies 452 are evenly spaced around the adsorption plate 451; in this embodiment, all gripper assemblies 452 are evenly distributed on the outer periphery of the adsorption plate 451 to ensure stable clamping of the ring body from multiple directions, prevent the ring body from tipping over, and apply the clamping force evenly to the ring body to ensure that the ring body is subjected to uniform force; multiple suction cups 453 are also provided, and all suction cups 453 are evenly distributed on the lower surface of the adsorption plate 451.

[0052] In one specific embodiment, the rotating mechanism 22 includes a base 221, a rotating shaft 222 rotatably connected to the base 221, and a third driving member 223 that is drively connected to the rotating shaft 222. The base 221 is fixed to the cavity wall 11, the bearing plate 21 is fixed to the rotating shaft 222, and the third driving member 223 is adapted to drive the rotating shaft 222 to rotate around the axis. In this embodiment, the third driving member 223 can be, but is not limited to, a motor. When the spraying mechanism 6 sprays liquid into the soaking tank 5, the third driving member 223 simultaneously drives the rotating shaft 222 to rotate. The rotating shaft 222 drives the bearing plate 21 to rotate at a low speed, so that the desmearing solution sprayed into the soaking tank 5 flows slowly in the tank, so that the solution is evenly distributed on the wafer surface, improving the desmearing effect, and avoiding the process quality being affected by excessively high local solution concentration. After the soaking and desmearing are completed, the spraying mechanism 6 stops spraying liquid, and the third driving member 223 gradually reduces the speed of the rotating shaft 222 to zero, ensuring that the bearing plate 21 stops stably.

[0053] Optionally, the wafer immersion desmearing device also includes an outer cover 9, which covers the outer area of ​​the rotating mechanism 22 and serves to prevent dust and provide safety protection.

[0054] In one specific embodiment, the bearing surface of the bearing disk 21 is provided with air suction holes, and the rotating shaft 222 is provided with air suction channels 2221, which are connected to the air suction holes. In this embodiment, there are multiple air suction holes, which are evenly distributed on the surface of the bearing disk 21. The air suction channels 2221 are connected to an external negative pressure device, and negative pressure is formed on the surface of the bearing disk 21 through the air suction holes, so that the bearing film 83 and the bearing disk 21 are tightly attached. Multiple air suction channels 2221 are provided to improve the adsorption force and prevent the bearing film 83 from shifting or lifting during rotation.

[0055] In a second aspect, this application provides a wafer cleaning method in a wafer debonding process, employing a wafer cleaning apparatus as described in any of the above claims, with reference to... Figure 7 The wafer cleaning method includes: placing the framed wafer 8 on the carrier tray 21; controlling the cover plate mechanism 3 to descend and be placed on the framed wafer 8, with the pressure ring 81 on the framed wafer 8 located in the groove 311, and the wafer on the framed wafer 8 being accommodated in the inner cavity 32 to form an immersion tank 5 with the annular body 31; controlling the spraying mechanism 6 to spray the adhesive remover into the immersion tank 5, thereby executing and completing the immersion adhesive remover cleaning process.

[0056] In one specific embodiment, the soaking and desmearing cleaning process includes: during the spraying of the desmearing solution, controlling the carrier plate 21 to drive the cover plate mechanism 3 and the framed wafer 8 to rotate at a first rotation speed; after the framed wafer 8 has been soaked in the soaking tank 5 for a preset time, controlling the carrier plate 21 to rotate at a second rotation speed, increasing the spraying pressure of the spraying mechanism 6 to a preset value, and spraying the solution back and forth at a uniform speed above the wafer; stopping the spraying of the desmearing solution, controlling the carrier plate 21 to slow down until it stops; controlling the spraying mechanism 6 to discharge the waste liquid containing the adhesive film from the soaking tank 5, thus completing the soaking and desmearing cleaning process.

[0057] In this embodiment, the first rotational speed is a low-speed rotation, and the second rotational speed is greater than the first rotational speed. The specific process of the wafer immersion and resist removal process is as follows: the wafer is first introduced into the chamber 12, and then the framed wafer 8 is placed on the carrier plate 21 by a robot arm. The suction hole on the carrier plate 21 fixes the carrier film 83 under negative pressure. The lifting mechanism 4 drives the annular body to descend until the annular body is opposite to the pressure ring 81, the annular body contacts the carrier film 83, and an immersion tank 5 is formed between the annular body and the side of the wafer away from the carrier film 83. The clamping mechanism presses and fixes the annular body to the carrier film 83 to prevent gaps between the annular body and the carrier film 83. The carrier plate 21 rotates at the first rotational speed under the action of the third driving member 223, and the spraying mechanism 6 sprays liquid into the immersion tank 5. The adhesive remover solution is sprayed to evenly cover the wafer surface under centrifugal force, ensuring thorough removal. After the framed wafer 8 is immersed in the soaking tank 5 for a preset time (the preset time is determined according to process requirements), the spraying pressure of the spraying mechanism 6 is increased, and the carrier plate 21 rotates at a second speed. At the same time, the spraying mechanism 6 moves radially and reciprocally at a uniform speed above the wafer to ensure that the adhesive solution evenly washes the wafer surface and effectively removes residual adhesive. After the adhesive layer separates from the wafer, the spraying mechanism 6 stops supplying liquid, and the third drive component 223 gradually reduces the speed until the carrier plate 21 comes to a stop. Then, the suction nozzle at the spraying mechanism 6 sucks up and recovers the waste adhesive solution gathered in the center of the soaking tank 5. The lifting mechanism 4 drives the annular body to move upward and reset, and the robot arm takes away the wafer that has been de-adheded, completing the soaking adhesive removal cleaning process.

[0058] Optionally, after the suction nozzle draws and recovers the waste adhesive liquid in the soaking tank 5, the soaking tank 5 can also be cleaned with fluid. Specifically, it can be a two-fluid system, which refers to mixing compressed gas (such as nitrogen or clean compressed air) with cleaning liquid in the nozzle. The compressed gas atomizes the cleaning liquid into tiny particles, forming a high-speed, fine droplet gas-liquid mixture that is sprayed out, thereby achieving efficient cleaning of the surface of the soaking tank 5.

[0059] The above description of the embodiments is intended to enable those skilled in the art to understand and apply this application. It will be apparent to those skilled in the art that various modifications can be easily made to these embodiments, and the general principles described herein can be applied to other embodiments without creative effort. Therefore, this application is not limited to the embodiments described herein, and any improvements and modifications made by those skilled in the art based on the disclosure of this application without departing from the scope and spirit of this application are within the scope of this application.

Claims

1. A wafer cleaning apparatus, characterized by comprising: The application relates to a process cavity, a bearing mechanism, a cover plate mechanism, a lifting mechanism and a liquid spraying mechanism. The process cavity comprises a cavity wall and a cavity surrounded by the cavity wall. The bearing mechanism comprises a bearing disc arranged in the cavity and a rotating mechanism connected with the bearing disc and used for driving the bearing disc to rotate. The bearing disc has a bearing surface used for bearing a wafer or a wafer with a frame. The wafer with a frame comprises a compression ring, a wafer and a bearing film arranged in sequence. The wafer with a frame is placed with the bearing film in contact with the bearing surface. The cover plate mechanism is arranged above the bearing disc and comprises an annular body and an inner cavity surrounded by the annular body.

2. The wafer cleaning apparatus of claim 1, wherein The annular body is provided with a groove with an opening facing the bearing disc.

3. The wafer cleaning apparatus of claim 2, wherein The lifting mechanism is connected with the cover plate mechanism and used for driving the cover plate mechanism to move up and down so that the cover plate mechanism is pressed against the bearing disc.

4. The wafer cleaning apparatus of claim 1, wherein The liquid spraying mechanism is arranged in the cavity and connected with a glue removing liquid supply device and used for discharging waste liquid. When the wafer with a frame is placed on the bearing disc, the lifting mechanism drives the cover plate mechanism to move towards the bearing disc until the wafer with a frame is contacted. The groove accommodates the compression ring and makes the annular body and the wafer in the inner cavity form an immersion groove. The liquid spraying mechanism is used for spraying the glue removing liquid into the immersion groove. A plurality of clamping mechanisms are arranged in the bearing mechanism and surround the bearing disc and are used for clamping the annular body. A clamping piece and a driving mechanism connected with the clamping piece are arranged in the clamping mechanism.

5. The wafer cleaning apparatus of claim 4, wherein The driving mechanism drives the clamping piece to move away from or close to the bearing disc. When the annular body is arranged on the bearing disc, the clamping piece is configured to clamp the annular body and the bearing disc.

6. The wafer cleaning apparatus of claim 4, wherein The lifting mechanism comprises a first driving piece fixed to the cavity wall, a first transmission part connected with the first driving piece and used for converting the output power of the first driving piece into linear power, a second transmission part comprising two transmission pieces cross-connected and rotatably connected at the cross connection and connected with the first transmission part and used for amplifying the movement stroke of the first transmission part to a required multiple, one end of each of the two transmission pieces being rotatably connected with the cavity wall and a grabbing part rotatably connected with the other end of each of the two transmission pieces and used for grabbing or unloading the annular body. A guide piece is arranged in the lifting mechanism and is arranged vertically to the top of the cavity wall. A screw and a nut pair and an adapter connected with the nut pair are arranged in the first transmission part. The screw is in transmission connection with the first driving piece. The adapter is arranged on the guide piece and is connected with the cross connection of the two transmission pieces. An adsorption plate and a jaw assembly arranged on the adsorption plate are arranged in the grabbing part. The adsorption plate is connected with the transmission pieces. The adsorption plate is provided with a suction cup used for adsorbing the annular body. The jaw assembly comprises a fixed seat connected with the adsorption plate, a jaw connected with the fixed seat and used for clamping the annular body and a driving mechanism connected with the jaw and used for driving the jaw to move away from or close to the adsorption plate. The driving mechanism comprises a first driving piece fixed to the fixed seat, a second driving piece rotatably connected with the first driving piece and used for driving the jaw to move away from or close to the adsorption plate and a third driving piece rotatably connected with the second driving piece and used for driving the jaw to move away from or close to the adsorption plate. A second driving member is disposed on the fixed base; and The claw is rotatably connected to the fixed base; the second driving member is drivenly connected to the claw and is adapted to drive the claw to rotate about the position connected to the fixed base so that the claw opens or closes.

7. The wafer cleaning apparatus of claim 6, wherein in, The adsorption plate has a ring structure; and The gripper assembly has at least two sets, and each gripper assembly is evenly spaced around the adsorption plate.

8. The wafer cleaning apparatus of claim 1, wherein in, The rotating mechanism includes a base, a rotating shaft rotatably connected to the base, and a third driving component that is drively connected to the rotating shaft; The base is fixed to the cavity wall, the bearing plate is fixed to the rotating shaft, and the third driving member is adapted to drive the rotating shaft to rotate around the axis.

9. The wafer cleaning apparatus of claim 8, wherein It also includes an air intake hole disposed on the bearing surface of the bearing plate and an air intake channel disposed in the rotating shaft, wherein the air intake channel is in communication with the air intake hole.

10. A method for cleaning a wafer in a wafer debonding process, the method comprising: providing a wafer having a die attached thereto; providing a cleaning solution; and immersing the wafer in the cleaning solution. The wafer cleaning apparatus according to any one of claims 1 to 9, wherein the wafer cleaning method comprises: Place the framed wafer onto the carrier tray; The control cover mechanism descends and is placed on the framed wafer, with the pressure ring on the framed wafer located in a groove. The wafer on the framed wafer is accommodated in the inner cavity to form an immersion tank with the annular body; and The spraying mechanism is controlled to spray adhesive remover into the soaking tank, thereby executing and completing the soaking and adhesive removal cleaning process.

11. The wafer cleaning method of claim 10, wherein in, The process of performing and completing the soaking and degumming cleaning includes: During the spraying of the adhesive remover, the carrier plate is controlled to drive the cover plate mechanism and the framed wafer to rotate at a first speed. After the framed wafer has been immersed in the immersion tank for a preset time, the carrier plate is controlled to rotate at a second rotation speed, the spraying pressure of the spraying mechanism is increased to a preset value, and the liquid is sprayed back and forth at a uniform speed above the wafer. Stop spraying the adhesive remover, and control the bearing plate to slow down its movement until it stops; and The spraying mechanism is controlled to discharge the waste liquid containing the adhesive film from the soaking tank, thus completing the soaking and degumming cleaning process.

Images