Electronic devices including structures for heat dissipation

Abstract

An electronic device according to one embodiment may include a display, electronic components, and a heat diffusion member that partially overlaps with the electronic components when viewed from above the display. The heat diffusion member may include: a first plate facing the electronic components; a second plate substantially facing the first plate; a separation structure arranged to have a first flow path and a second flow path; and a wicking structure for moving fluid. The wicking structure may include a first wicking portion located in the first and second flow paths, and a second wicking portion located on a portion of the first wicking portion corresponding to the second flow path.

Description

Technical Field

[0001] The various embodiments described later relate to electronic devices that include structures for heat dissipation. Background Technology

[0002] Electronic devices can include a variety of electronic components. Electronic devices can be miniaturized for wearable or portable use by a user. Heat can be generated within the miniaturized electronic device when the electronic components perform operations in response to a user's request. Electronic devices may require structures for heat dissipation. For example, an electronic device may include a vapor chamber or heat pipe for dissipating heat.

[0003] The above information may be provided as related technology to aid in understanding this disclosure. No argument or decision is made regarding whether anything described above can be used as prior art in connection with this disclosure. Summary of the Invention

[0004] According to an embodiment, an electronic device may include a display, electronic components, and a heat dissipation member, the heat dissipation member being configured to at least partially overlap with the electronic components when viewed from above the display. The heat dissipation member may include: a first plate facing the electronic components; a second plate substantially facing the first plate; and a separation structure disposed in an internal space between the first and second plates, such that a first flow path and a second flow path are formed along a first side surface of the separation structure and a second side surface opposite to the first side surface, respectively. The heat dissipation member may include a wicking structure for moving fluid along at least one of the first and second flow paths. The wicking structure may include a first wicking portion located in the first or second flow path and a second wicking portion located above a portion of the first wicking portion corresponding to the second flow path.

[0005] According to an embodiment, an electronic device may include electronic components and a heat dissipation member at least partially disposed on the electronic components. The heat dissipation member may include: a first region facing the electronic components; a second region spaced apart from the first region; and a third region connecting the first and second regions, and including a first flow path for a gaseous fluid and a second flow path for a liquid fluid. The heat dissipation member may include a frame and a wick structure, the frame including a separation structure in the third region separating the first and second flow paths, and the wick structure for allowing fluid to move within the frame. The wick structure may include: a first wick portion including a first portion disposed in the first region, a second portion disposed in the second region, and a third portion disposed in the third region and connecting the first and second portions; and a second wick portion disposed in the second flow path and inserted between the third portion and the frame. Attached Figure Description

[0006] Figure 1 This is a block diagram of an electronic device in a network environment according to an implementation method.

[0007] Figure 2a This is a diagram illustrating an electronic device according to an embodiment.

[0008] Figure 2b This is an exploded perspective view of an electronic device according to an embodiment.

[0009] Figure 3a A portion of an exemplary electronic device is shown.

[0010] Figure 3b This is an exploded perspective view of a heat dissipation component of an exemplary electronic device.

[0011] Figure 4a and Figure 4b It is along Figure 3a A cross-sectional view of the heat dissipation component of an exemplary electronic device cut along line A-A'.

[0012] Figure 4c It is along Figure 3a A cross-sectional view of the heat dissipation component of an exemplary electronic device cut along line A-A'.

[0013] Figure 4d yes Figure 4c Top view of the first liquid-absorbing core portion of the heat dissipation component.

[0014] Figure 4e It is along Figure 3a A cross-sectional view of the heat dissipation component of an exemplary electronic device cut along line A-A'.

[0015] Figure 4f yes Figure 4d Top view of the first liquid-absorbing core portion of the heat dissipation component.

[0016] Figure 5a This is an exploded perspective view of a heat dissipation component of an exemplary electronic device.

[0017] Figure 5b It is along Figure 3a A cross-sectional view of the heat dissipation component of an exemplary electronic device cut along line A-A'.

[0018] Figure 5c yes Figure 5b Top view of the liquid-absorbing core structure of the heat dissipation component.

[0019] Figure 5d It is along Figure 3a A cross-sectional view of the heat dissipation component of an exemplary electronic device cut along line A-A'.

[0020] Figure 5e yes Figure 5d Top view of the liquid-absorbing core structure of the heat dissipation component.

[0021] Figure 6a , Figure 6b , Figure 6c and Figure 6d A portion of a heat dissipation component of an exemplary electronic device is shown.

[0022] Figure 7a , Figure 7b and Figure 7c A portion of a heat dissipation component of an exemplary electronic device is shown.

[0023] Figure 8a , Figure 8b , Figure 8c , Figure 8d and Figure 8e A portion of an exemplary electronic device is shown.

[0024] Figure 9a An example electronic device is shown in its unfolded state.

[0025] Figure 9b An example electronic device is shown in its folded state.

[0026] Figure 9c This is an exploded view of an exemplary electronic device.

[0027] Figure 9d and Figure 9e A portion of an exemplary electronic device is shown. Detailed Implementation

[0028] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0029] refer to Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some implementations, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0030] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the result data in non-volatile memory 134. According to another embodiment, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0031] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0032] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0033] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0034] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0035] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0036] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0037] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0038] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0039] Interface 177 may support one or more specific protocols used to enable direct (e.g., wired) or wireless connection between electronic device 101 and external electronic device (e.g., electronic device 102). Depending on the implementation, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0040] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] The tactile module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or motion) or electrical stimulation that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the tactile module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0042] Camera module 180 can capture still or moving images. Depending on the implementation, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0043] The power management module 188 manages the power supply to the electronic device 101. According to embodiments, the power management module 188 may be implemented as at least a portion of, for example, a power management integrated circuit (PMIC).

[0044] Battery 189 can power at least one component of electronic device 101. According to embodiments, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0045] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0046] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to the implementation, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane delay (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0047] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0048] According to various embodiments, antenna module 197 can form a millimeter-wave antenna module. According to one embodiment, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top or side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0049] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0050] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to the second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that will run on electronic device 101 can be run on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0051] Figure 2a This is a diagram illustrating an electronic device according to an embodiment.

[0052] refer to Figure 2a The electronic device 200 according to an embodiment may include a housing 210 forming the exterior of the electronic device 200. For example, the housing 210 may include a front surface 200A, a rear surface 200B, and a side surface 200C surrounding the space between the front surface 200A and the rear surface 200B. According to an embodiment, the housing 210 may also refer to a structure forming at least a portion of the front surface 200A, the rear surface 200B, and / or the side surface 200C.

[0053] The electronic device 200 according to an embodiment may include a substantially transparent front panel 202. According to an embodiment, the front panel 202 may form at least a portion of the front surface 200A. According to an embodiment, the front panel 202 may include, for example, a glass plate or a polymer plate including various coatings, but is not limited thereto.

[0054] The electronic device 200 according to an embodiment may include a substantially opaque back panel 211. According to an embodiment, the back panel 211 may form at least a portion of the back surface 200B. According to an embodiment, the back panel 211 may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.

[0055] The electronic device 200 according to an embodiment may include a side frame structure (or side member) 218. According to an embodiment, the side frame structure 218 may form at least a portion of the side surface 200C of the electronic device 200 by being coupled to the front panel 202 and / or the rear panel 211. For example, the side frame structure 218 may form the entire side surface 200C of the electronic device 200; or, for example, the side frame structure 218 may form the side surface 200C of the electronic device 200 together with the front panel 202 and / or the rear panel 211.

[0056] Unlike the illustrated embodiment, where the side surface 200C of the electronic device 200 is partially formed by the front plate 202 and / or the rear plate 211, the front plate 202 and / or the rear plate 211 may include regions that bend seamlessly from their peripheries toward the rear plate 211 and / or the front plate 202. These extended regions of the front plate 202 and / or the rear plate 211 may be located, for example, at both ends of the long side of the electronic device 200, but are not limited to the examples described above.

[0057] According to one embodiment, the side frame structure 218 may include metal and / or polymer. According to another embodiment, the back panel 211 and the side frame structure 218 may be integrally formed and may include the same material (e.g., a metallic material such as aluminum), but are not limited thereto. For example, the back panel 211 and the side frame structure 218 may be formed in a separate configuration and / or may include different materials.

[0058] According to an embodiment, the electronic device 200 may include at least one of the following: a display 201, audio modules 203, 204 and 207, a sensor module (not shown), camera modules 205, 212 and 213, a key input device 217, a light-emitting element (not shown), and / or a connector hole 208. According to an embodiment, the electronic device 200 may omit at least one of the components (e.g., the key input device 217 or the light-emitting element (not shown)), or may additionally include another component.

[0059] According to one embodiment, the display 201 can be visually exposed through a large portion of the front panel 202. For example, at least a portion of the display 201 can be seen through the front panel 202 forming the front surface 200A. According to another embodiment, the display 201 can be disposed on the rear surface of the front panel 202.

[0060] According to one embodiment, the shape of the display 201 can be formed to be substantially the same as the shape of the front panel 202 adjacent to the display 201. According to one embodiment, in order to expand the visually exposed area of ​​the display 201, the gap between the outer periphery of the display 201 and the outer periphery of the front panel 202 can be formed to be substantially the same.

[0061] According to one embodiment, the display 201 (or the front surface 200A of the electronic device 200) may include a screen display area 201A. According to another embodiment, the display 201 may provide visual information to a user through the screen display area 201A. In the illustrated embodiment, the screen display area 201A is shown to be spaced apart from the outer periphery of the front surface 200A, and when viewed from the front, the screen display area 201A is located inside the front surface 200A, but is not limited thereto. In another embodiment, when viewed from the front, at least a portion of the periphery of the screen display area 201A may substantially coincide with the periphery of the front surface 200A (or the front panel 202).

[0062] According to an embodiment, the screen display area 201A may include a sensing area 201B configured to acquire the user's biometric information. Here, "screen display area 201A includes sensing area 201B" can be understood as at least a portion of sensing area 201B overlapping with screen display area 201A. For example, sensing area 201B may represent an area that, similar to another area of ​​screen display area 201A, can display visual information on display 201 and additionally acquire the user's biometric information (e.g., fingerprint). According to an embodiment, sensing area 201B may be formed in key input device 217.

[0063] According to one embodiment, the display 201 may include an area where the first camera 205 is located. According to another embodiment, an opening may be formed in the area of ​​the display 201, and the first camera 205 (e.g., a punch-hole camera) may be at least partially disposed within the opening to face the front surface 200A. In this case, the screen display area 201A may surround at least a portion of the periphery of the opening. According to another embodiment, the first camera 205 (e.g., an under-display camera (UDC)) may be disposed below the display 201 to overlap with the area of ​​the display 201. In this case, the display 201 can provide visual information to the user through this area, and additionally, the first camera 205 can obtain an image through the area of ​​the display 201 corresponding to the direction facing the front surface 200A.

[0064] According to the implementation, the display 201 may be connected to or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digital converter for detecting a magnetic field type stylus.

[0065] According to an implementation, audio modules 203, 204 and 207 may include microphone holes 203 and 204 and speaker holes 207.

[0066] According to an embodiment, microphone holes 203 and 204 may include a first microphone hole 203 formed in a portion of the side surface 200C and a second microphone hole 204 formed in a portion of the rear surface 200B. A microphone (not shown) for obtaining external sound may be disposed inside microphone holes 203 and 204. The microphone may include multiple microphones to sense the direction of sound.

[0067] According to an embodiment, a second microphone hole 204 formed in a portion of the rear surface 200B may be disposed adjacent to camera modules 205, 212, and 213. For example, the second microphone hole 204 may acquire sound based on the operation of camera modules 205, 212, and 213. However, it is not limited thereto.

[0068] According to an embodiment, the speaker hole 207 may include an external speaker hole 207 and a call receiver hole (not shown). The external speaker hole 207 may be formed in a portion of the side surface 200C of the electronic device 200. According to an embodiment, the external speaker hole 207 may be implemented as a single hole together with the microphone hole 203. Although not shown, the call receiver hole (not shown) may be formed in another portion of the side surface 200C. For example, the call receiver hole may be formed on the opposite side of the external speaker hole 207 on the side surface 200C. For example, based on Figure 2aAs illustrated, an external speaker hole 207 may be formed on a side surface 200C corresponding to the lower part of the electronic device 200, and a call receiver hole may be formed on a side surface 200C corresponding to the upper part of the electronic device 200. However, it is not limited to this, and according to embodiments, the call receiver hole may be formed at a location other than the side surface 200C. For example, the call receiver hole may be formed by a separation space between the front panel 202 (or display 201) and the side bezel structure 218.

[0069] According to an embodiment, the electronic device 200 may include at least one speaker (not shown) configured to output sound to the outside of the housing through an external speaker hole 207 and / or a call receiver hole (not shown).

[0070] According to an embodiment, the sensor module (not shown) can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of the electronic device 200. For example, the sensor module may include at least one of a proximity sensor, HRM sensor, fingerprint sensor, gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0071] According to an embodiment, camera modules 205, 212 and 213 may include a first camera 205 configured to face the front surface 200A of the electronic device 200, a second camera 212 configured to face the rear surface 200B, and a flash 213.

[0072] According to the implementation, the second camera 212 may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera 212 is not necessarily limited to including multiple cameras, and may include a single camera.

[0073] According to an embodiment, the first camera 205 and the second camera 212 may include one or more lenses, image sensors and / or image signal processors.

[0074] According to one embodiment, the flash 213 may include, for example, a light-emitting diode or a xenon lamp. According to another embodiment, two or more lenses (an infrared camera and wide-angle and telephoto lenses) and an image sensor may be disposed on one surface of the electronic device 200.

[0075] According to one embodiment, the key input device 217 may be disposed on the side surface 200C of the electronic device 200. According to another embodiment, the electronic device 200 may not include part or all of the key input device 217, and the unincluded key input device 217 may be implemented on the display 201 in another form (such as soft keys).

[0076] According to one embodiment, a connector hole 208 may be formed on a side surface 200C of the electronic device 200 to accommodate a connector of an external device. A connection end of the connector electrically connected to the external device may be disposed in the connector hole 208. The electronic device 200 according to one embodiment may include an interface module for processing electrical signals transmitted and received through the connection end.

[0077] According to one embodiment, the electronic device 200 may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on the front surface 200A of the housing. The light-emitting element (not shown) may provide status information of the electronic device 200 in the form of light. According to one embodiment, the light-emitting element (not shown) may provide a light source associated with the operation of the first camera 205. For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0078] Figure 2b This is an exploded perspective view of an electronic device according to an embodiment.

[0079] In the following text, repeated descriptions of configurations with the same reference numerals as those described above will be omitted.

[0080] refer to Figure 2b The electronic device 200 according to the embodiment may include a frame structure 240, a first printed circuit board 250, a second printed circuit board 252, a cover plate 260, and a battery 270.

[0081] According to an embodiment, the frame structure 240 may include the exterior forming the electronic device 200 (e.g., Figure 2a The frame structure 240 comprises a side bezel structure 218 (side surface 200C) and a support portion 243 extending inwardly from the side bezel structure 218. According to an embodiment, the frame structure 240 may be disposed between the display 201 and the rear panel 211. According to an embodiment, the side bezel structure 218 of the frame structure 240 may surround the space between the rear panel 211 and the front panel 202 (and / or the display 201), and the support portion 243 of the frame structure 240 may extend from the side bezel structure 218 within this space.

[0082] According to embodiments, the frame structure 240 can support or accommodate other components included in the electronic device 200. For example, a display 201 can be disposed on a surface of the frame structure 240 facing one direction (e.g., the +z direction), and the display 201 can be supported by a support portion 243 of the frame structure 240. For example, a first printed circuit board 250, a second printed circuit board 252, a battery 270, and a second camera 212 can be disposed on another surface of the frame structure 240 facing the opposite direction (e.g., the -Z direction). The first printed circuit board 250, the second printed circuit board 252, the battery 270, and the second camera 212 can be respectively disposed in recesses defined by the side frame structure 218 and / or the support portion 243 of the frame structure 240.

[0083] According to the embodiments, the first printed circuit board 250, the second printed circuit board 252, and the battery 270 can be respectively connected to the frame structure 240. For example, the first printed circuit board 250 and the second printed circuit board 252 can be fixedly disposed in the frame structure 240 by means of connecting members such as screws. For example, the battery 270 can be fixedly disposed on the frame structure 240 by means of adhesive members (e.g., double-sided tape). However, it is not limited to the above examples.

[0084] According to one embodiment, the cover plate 260 may be disposed between the first printed circuit board 250 and the rear plate 211. According to another embodiment, the cover plate 260 may be disposed on the first printed circuit board 250. For example, the cover plate 260 may be disposed on the surface of the first printed circuit board 250 facing the -z direction.

[0085] According to one embodiment, the cover plate 260 may at least partially overlap with the first printed circuit board 250 based on the z-axis. According to another embodiment, the cover plate 260 may cover at least a portion of the first printed circuit board 250. Therefore, the cover plate 260 may protect the first printed circuit board 250 from physical impact or prevent connectors attached to the first printed circuit board 250 from disengaging.

[0086] According to an embodiment, the cover plate 260 can be fixedly disposed on the first printed circuit board 250 by means of a connecting member (e.g., screws), or it can be connected to the frame structure 240 together with the first printed circuit board 250 by means of a connecting member.

[0087] According to an embodiment, the display 201 may be disposed between the frame structure 240 and the front panel 202. For example, the front panel 202 may be disposed on one side of the display 201 (e.g., in the +z direction), and the frame structure 240 may be disposed on the other side (e.g., in the -z direction).

[0088] According to an embodiment, the front panel 202 can be coupled to the display 201. For example, the front panel 202 and the display 201 can be adhered to each other by means of an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) inserted therebetween.

[0089] According to an embodiment, the front panel 202 can be coupled to the frame structure 240. For example, the front panel 202 may include an outer portion that extends outside the display 201 when viewed in the z-axis direction, and can be attached to the frame structure 240 by an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front panel 202 and the frame structure 240 (e.g., the side bezel structure 218). However, it is not limited to the above example.

[0090] According to embodiments, the processor, memory, and / or interface may be mounted on the first printed circuit board 250 and / or the second printed circuit board 252. The processor may include, for example, one or more of a central processing unit, application processor, graphics processing unit, image signal processor, sensor hub processor, or communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface can electrically or physically connect the electronic device 200 to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector. According to embodiments, the first printed circuit board 250 and the second printed circuit board 252 may be operatively connected or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0091] According to an embodiment, battery 270 can supply power to at least one component of electronic device 200. For example, battery 270 may include a rechargeable secondary battery or a fuel cell. At least a portion of battery 270 may be disposed on a plane substantially the same as the first printed circuit board 250 and / or the second printed circuit board 252.

[0092] The electronic device 200 according to an embodiment may include an antenna module (not shown). According to an embodiment, the antenna module may be disposed between a rear panel 211 and a battery 270. The antenna module may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly send and receive power with an external device.

[0093] According to an embodiment, the first camera 205 (e.g., a front-facing camera) may be disposed in at least a portion (e.g., the support portion 243) of the frame structure 240, such that the lens can pass through the front panel 202 (e.g., Figure 1A portion of the front surface 200A (e.g., camera area 237) receives external light.

[0094] According to one embodiment, a second camera 212 (e.g., a rear camera) may be disposed between the frame structure 240 and the rear panel 211. According to another embodiment, the second camera 212 may be electrically connected to the first printed circuit board 250 via a connecting member (e.g., a connector). According to yet another embodiment, the second camera 212 may be configured such that its lens receives external light through the camera area 284 of the rear panel 211 of the electronics 200.

[0095] According to an embodiment, camera region 284 may be formed on the surface of rear plate 211 (e.g., Figure 1 The camera region 284 is located on the rear surface 200B of the second camera 212. According to one embodiment, the camera region 284 may be formed to be at least partially transparent, allowing external light to enter the lens of the second camera 212. According to one embodiment, at least a portion of the camera region 284 may protrude from the surface of the rear plate 211 by a predetermined height. However, this is not a limitation, and in another embodiment, the camera region 284 may be formed to be substantially the same plane as the surface of the rear plate 211.

[0096] According to an embodiment, the housing of the electronic device 200 (e.g., Figure 2a The housing 210 can refer to a configuration or structure that forms at least a portion of the exterior of the electronic device 200. In this respect, at least a portion of the front panel 202, frame structure 240, and / or rear panel 211 forming the exterior of the electronic device 200 can be referred to as the housing 210 of the electronic device 200.

[0097] Figure 3a A portion of an exemplary electronic device is shown. Figure 3b This is an exploded perspective view of a heat dissipation component of an exemplary electronic device.

[0098] refer to Figure 3a and Figure 3b The electronic device 101 may include electronic components 305 and heat dissipation components 300.

[0099] According to an embodiment, the heat dissipation member 300 may be at least partially disposed on the electronic component 305. In this document, when an element is referred to as being "on" another element, it should be understood that it may be directly on the other element, or there may be an intermediate element between them. For example, in this document, "B is disposed on A" may mean "B is disposed above A". For example, in this document, "B is disposed on A" may mean "B faces A and is spaced apart from A". For example, "heat dissipation member 300 is disposed on electronic component 305" may mean "heat dissipation member 300 contacts electronic component 305". For example, "heat dissipation member 300 is disposed on electronic component 305" may mean "heat dissipation member 300 faces electronic component 305 and is spaced apart from electronic component 305".

[0100] For example, when the heat dissipation member 300 is viewed from above (e.g., when viewed from the +z direction), the heat dissipation member 300 may at least partially overlap with the electronic component 305. For example, the heat dissipation member 300 may be positioned above the electronic component 305 based on the +z direction. For example, although not shown, the heat dissipation member 300 may be positioned below the electronic component 305 based on the +z direction. For example, the heat dissipation member 300 may receive at least a portion of the heat emitted from the electronic component 305 by being at least partially facing the electronic component 305.

[0101] For example, electronic component 305 can be mounted on the printed circuit board of electronic device 101 (e.g., Figure 2b The electronic component 305 is disposed on a first printed circuit board 250 or a second printed circuit board 252. The surface of the printed circuit board on which the electronic component 305 is disposed may face the heat dissipation member 300. For example, the electronic component 305 may emit heat to its surroundings by being configured to perform calculations during operation of the electronic device 101. The heat dissipation member 300 may dissipate the heat emitted from the electronic component 305 by being at least partially disposed on the electronic component 305. For example, the electronic component 305 may be referred to as the processor of the electronic device 101 (e.g., Figure 1 Processor 120), but not limited to this.

[0102] For example, electronic device 101 may include housing 210. Electronic component 305 and heat dissipation member 300 may be disposed within housing 210. Housing 210 may include frame structure 240 for supporting and securing heat dissipation member 300 within housing 210. For example, at least a portion of frame structure 240 may provide placement space for accommodating heat dissipation member 300. For example, at least a portion of frame structure 240 may be disposed between electronic component 305 and heat dissipation member 300. At least a portion of frame structure 240 may transfer at least a portion of the heat emitted from electronic component 305 to heat dissipation member 300. For example, at least a portion of frame structure 240 (e.g., Figure 2b The support portion 243 can be configured such that, through the support heat dissipation member 300, heat is dissipated from the electronic component 305 toward the display of the electronic device 101 (e.g., Figure 2a The heat emitted by the display 201 is dissipated through the heat dissipation member 300. The structure for heat dissipation through the heat dissipation member 300 will be described later.

[0103] According to an embodiment, the heat dissipation component 300 may include a first region 300a facing the electronic component 305, a second region 300b spaced apart from the first region 300a, and a third region 300c connecting the first region 300a and the second region 300b. The third region 300c may include a first flow path 301 for a gaseous fluid and a second flow path 302 for a liquid fluid.

[0104] For example, the heat sink 300 may include a fluid (not shown) disposed within the heat sink 300 to dissipate heat transferred to the heat sink 300. The fluid may evaporate due to heat transferred from the electronic component 305 to the heat sink 300. The fluid may be liquefied when heat is emitted from the heat sink 300. The fluid may be, for example, water, but is not limited thereto.

[0105] For example, the first region 300a may be a region that receives heat from the electronic component 305. For example, when viewed from above (e.g., when viewed from the +z direction), the first region 300a may be a region that overlaps with the electronic component 305. The first region 300a may be a region disposed on the electronic component 305. For example, the first region 300a may be a region that receives at least a portion of the heat emitted from the electronic component 305 through a component (e.g., frame structure 240) between the electronic component 305 and the first region 300a. For example, the fluid in the first region 300a may evaporate from a liquid state to a gaseous state by the heat transferred from the electronic component 305. The fluid in the first region 300a may absorb heat by being evaporated. The first region 300a may be referred to as the evaporation portion of the heat dissipation member 300 in terms of the area where the fluid evaporates, but is not limited thereto.

[0106] For example, the second region 300b may be a region with a lower temperature than the first region 300a. For example, the fluid in the second region 300b may be liquefied from a gaseous state to a liquid state. The fluid in the second region 300b may emit heat from the second region 300b by being liquefied. In terms of the region where the fluid is liquefied, the second region 300b may be referred to as the condensation portion of the heat dissipation member 300, but is not limited thereto.

[0107] For example, the third region 300c can be configured to move a gaseous fluid from the first region 300a to the third region 300c via a first flow path 301. The third region 300c can be configured to move a liquid fluid from the second region 300b to the first region 300a via a second flow path 302.

[0108] For example, a third region 300c can extend from a first region 300a to a second region 300b. For example, a third region 300c can be positioned between the first region 300a and the second region 300b. For example, a third region 300c can provide a fluid movement path between the first region 300a and the second region 300b. For example, a first flow path 301 can be a path for moving fluid evaporating in the first region 300a to the third region 300b. Gas-like fluid evaporating in the first region 300a can move to the third region 300b via the first flow path 301. For example, a second flow path 302 can be a path for moving fluid liquefied in the third region 300b to the first region 300a. Liquid fluid liquefied in the third region 300b can move to the first region 300a via the second flow path 302. The heat dissipation component 300 can be referred to as a loop heat pipe because it has a structure in which fluid in the heat dissipation component 300 moves from a first region 300a to a second region 300b or from a second region 300b to a first region 300a through a phase change, but is not limited thereto. The heat dissipation component 300 can dissipate heat transferred from the electronic component 305 to the heat dissipation component 300 by being configured to circulate fluid within the heat dissipation component 300. For fluid circulation, the heat dissipation component 300 may require a structure for separating a first flow path 301 for the fluid in a gaseous state and a second flow path 302 for the fluid in a liquid state.

[0109] According to an embodiment, the first flow path 301 can be configured to diffuse fluid substantially evaporated by heat generated from the electronic component 305 from a first region 300a of the heat dissipation member 300 to a second region 300b opposite to the first region 300a. The second flow path 302 can be configured to diffuse fluid substantially liquefied in the second region 300b from the second region 300b to the first region 300a.

[0110] According to an embodiment, the heat dissipation component 300 may include a first plate 310, a second plate 320 connected to the first plate 310, and a frame 330. The frame 330 includes a separation structure 335 in a third region 300c, which separates the first flow path 301 and the second flow path 302.

[0111] For example, frame 330 may form the exterior of heat dissipation member 300. Frame 330 may include, but is not limited to, a metal with relatively high thermal conductivity. For example, first plate 310 may be a plate supported by housing 210 (or frame structure 240). For example, first plate 310 may be a plate that receives heat from electronic component 305. For example, second plate 320 may be disposed on first plate 310. Second plate 320 may be fastened to first plate 310. For example, second plate 320 may seal the internal space of heat dissipation member 300 together with first plate 310. For example, second plate 320 may form regions 300a, 300b, and 300c of heat dissipation member 300 together with first plate 310.

[0112] For example, the separation structure 335 may space the first flow path 301 and the second flow path 302 in the third region 300c. For example, the separation structure 335 may separate a gaseous fluid moving through the first flow path 301 from a liquid fluid moving through the second flow path 302 within the frame 330. For example, the separation structure 335 may extend in a direction from the first region 300a toward the second region 300b (e.g., the -y direction) and / or in a direction from the second region 300b toward the first region 300a (e.g., the +y direction). For example, the separation structure 335 may be disposed between the first plate 310 and the second plate 320.

[0113] According to the embodiment, the separation structure 335 may protrude at least partially from the first plate 310, or it may protrude from the second plate 320. For example, when the separation structure 335 protrudes from the first plate 310 toward the second plate 320, the separation structure 335 may support the second plate 320. The separation structure 335 can reduce damage to the third region 300c due to external impact by supporting the second plate 320. For example, when the separation structure 335 protrudes from the second plate 320 toward the first plate 310, the separation structure 335 may support the first plate 310. The separation structure 335 can reduce damage to the third region 300c due to external impact by supporting the first plate 310. For example, a portion of the separation structure 335 (e.g., Figure 6c The first protrusion 610 can protrude from the first plate 310 toward the second plate 320, and the remainder of the separation structure 335 (e.g., Figure 6c The second protrusion 620 can protrude from the second plate 320 toward the first plate 310. This part of the separation structure 335 and the remaining part of the separation structure 335 can contact each other, or can be connected through elements therebetween (e.g., Figure 6c The adhesive components 650 are connected to each other. The formation of the separation structure 335 will be discussed later. Figure 6aAs described below. By including the separation structure 335, the heat dissipation member 300 can reduce damage to the third region 300c due to external impacts by separating the first flow path 301 for the gaseous fluid from the second flow path 302 for the liquid fluid and enhancing the rigidity of the third region 300c.

[0114] According to an embodiment, the separation structure 335 can be disposed in the internal space between the first plate 310 and the second plate 320, such that the first flow path 301 and the second flow path 302 are formed along the first side surface 330a and the second side surface 330b opposite to the first side surface 330a, respectively, of the separation structure 335. For example, the first flow path 301 can be at least partially formed by the first side surface 330a of the separation structure 335. Fluid in the first flow path 301 can contact the first side surface 330a of the separation structure 335. For example, the second flow path 302 can be at least partially formed by the second side surface 330b opposite to the first side surface 330a of the separation structure 335. Fluid in the second flow path 302 can contact the second side surface 330b.

[0115] According to an embodiment, the heat dissipation member 300 may include a wick structure 340 for moving fluid within the frame 330. The wick structure 340 may include a first wick portion 350 attached to a first plate 310 of the frame 330 and a second wick portion 360 disposed in a second flow path 302 and at least partially inserted between the first wick portion 350 and the second plate 320 of the frame 330.

[0116] For example, the wick structure 340 may include a porous structure for absorbing liquid fluid in the heat dissipation member 300. For example, the wick structure 340 may be disposed between the first plate 310 and the second plate 320. For example, the first wick portion 350 may be in contact with the first plate 310. The first wick portion 350 may receive at least a portion of the heat emitted from the electronic component 305 through the first plate 310. For example, in the first region 300a, the liquid fluid included in the first wick portion 350 may evaporate due to heat transferred from the electronic component 305 to the first region 300a. The gaseous fluid may move to the second region 300b through the first flow path 301 of the third region 300c. For example, the gaseous fluid in the second region 300b may liquefy due to heat dissipation from the second region 300b. At least a portion of the liquefied fluid may be absorbed into the first wick portion 350.

[0117] For example, a second absorbent core portion 360 may be at least partially disposed in a second flow path 302 for a liquid fluid. A portion of the first absorbent core portion 350 and at least a portion of the second absorbent core portion 360 may be disposed in the second flow path 302. For example, the second absorbent core portion 360 may be at least partially disposed in the second flow path 302 between the first absorbent core portion 350 and the second plate 320. The second absorbent core portion 360 may be attached to the second plate 320. For example, the second absorbent core portion 360 may be attached to the first absorbent core portion 350. The second absorbent core portion 360, together with the first absorbent core portion 350, can move the liquid fluid in the second flow path 302. The absorbent core structure 340 can provide a path for moving the liquid fluid from the second region 300b to the first region 300a by including the second absorbent core portion 360 disposed in the second flow path 302.

[0118] According to an embodiment, the first liquid-absorbing core portion 350 may include a first portion 351 disposed in a first region 300a, a second portion 352 disposed in a second region 300b, and a third portion 353 connecting the first portion 351 and the second portion 352 in a third region 300c. To support the second plate 320, the third portion 353 may include a first support region 353a disposed in the first flow path 301 and a second support region 353b disposed in the second flow path 302.

[0119] For example, a first portion 351 may be attached to a first plate 310 in a first region 300a. The first portion 351 may be disposed on top of an electronic component 305. For example, the first portion 351 may receive heat from the electronic component 305 via the first plate 310. A liquid fluid contained in the first portion 351 may evaporate in the first region 300a due to heat. For example, a second portion 352 may be spaced apart from the first portion 351. The second portion 352 may absorb fluid liquefied by heat dissipation in a second region 300b.

[0120] For example, the third portion 353 can extend from the first portion 351 to the second portion 352. For example, the third portion 353 can move liquid fluid from the second region 300b to the first region 300a. For example, the first support region 353a can be attached to the first plate 310 in the first flow path 301. The first support region 353a can move liquid fluid included in the first support region 353a toward the first region 300a. For example, the second support region 353b can be separated from the first support region 353a by being attached to the first plate 310 in the second flow path 302. The second support region 353b can move liquid fluid included in the second support region 353b toward the first region 300a. For example, the second support region 353b can contact the second absorbent core portion 360. The second support region 353b can be the portion of the third portion 353 in the third region 300c that is attached to the second absorbent core portion 360. The first liquid-absorbing core portion 350 can improve the heat dissipation performance of the heat dissipation component 300 by including a first support region 353a disposed in the first flow path 301 and a second support region 353b disposed in the second flow path 302.

[0121] According to an embodiment, the first absorbent core portion 350 may include a slit 350a for passing through the separation structure 335. For example, the slit 350a may be penetrated by the separation structure 335 in the third region 300c. For example, the slit 350a may fasten the first absorbent core portion 350 to the frame 330 by engaging with the separation structure 335. For example, the slit 350a may have a shape corresponding to the shape of the separation structure 335. For example, the slit 350a may be disposed between the first support region 353a and the second support region 353b of the third portion 353. The slit 350a may separate the first support region 353a and the second support region 353b. By including the slit 350a, the first absorbent core portion 350 can provide space for the separation structure 335 and can be fastened to the frame 330.

[0122] According to an embodiment, the frame 330 may include a plurality of posts 370 projecting from the second plate 320 toward the first plate 310. For example, the plurality of posts 370 may extend from the second plate 320 toward the first plate 310 within the frame 330. For example, the plurality of posts 370 may be attached to the first absorbent core portion 350 by extending from the second plate 320 toward the first absorbent core portion 350. For example, the pressure in the heat dissipation member 300 may be lower than the pressure outside the heat dissipation member 300. Because the pressure in the heat dissipation member 300 is lower than the pressure outside the heat dissipation member 300, the frame 330 of the heat dissipation member 300 may be at least partially dented due to external impact. The second plate 320 may reduce damage to the frame 330 due to external impact by including a plurality of posts 370 supported by the first absorbent core portion 350 and / or the first plate 310.

[0123] According to the above embodiments, the heat dissipation member 300 of the electronic device 101 can reduce the damage to other electronic components in the electronic device 101 caused by heat emitted from the electronic component 305 by being configured to dissipate heat emitted from the electronic component 305. By including a separation structure 335 for separating a first flow path 301 for moving a gaseous fluid and a second flow path 302 for moving a liquid fluid, the heat dissipation member 300 can improve its heat dissipation performance and reduce damage to the frame 330 of the heat dissipation member 300 due to external impacts. The heat dissipation member 300 can move liquid fluid from a second region 300b to a first region 300a by means of a wicking structure 340 disposed in the frame 330. The wicking structure 340 can improve the performance of the heat dissipation member 300 by including a second wicking portion 360 at least partially disposed in the second flow path 302.

[0124] Figure 4a and Figure 4b It is along Figure 3a A cross-sectional view of the heat dissipation component of an exemplary electronic device cut along line A-A'.

[0125] refer to Figure 4a and Figure 4b Electronic device 101 may include electronic components (e.g., Figure 3a The electronic component 305 and a heat dissipation member 300 at least partially disposed on the electronic component 305. The heat dissipation member 300 may include a first region facing the electronic component 305 (e.g., Figure 3a The first region 300a), and the second region separated from the first region 300a (e.g., Figure 3aThe heat dissipation member 300 may include a second region 300b and a third region 300c, the third region 300c connecting the first region 300a and the second region 300b and including a first flow path 301 for a gaseous fluid and a second flow path 302 for a liquid fluid. The heat dissipation member 300 may include: a first plate 310; a second plate 320 coupled to the first plate 310; a frame 330 including a separation structure 335 in the third region 300c separating the first flow path 301 and the second flow path 302; and a wicking structure 340 for moving fluid within the frame 330. The wicking structure 340 may include a first wicking portion 350 attached to the first plate 310 and a second wicking portion 360 disposed in the second flow path 302 and at least partially inserted between the first wicking portion 350 and the second plate 320. According to an embodiment, the frame 330 may include a plurality of posts 370 projecting from the second plate 320 toward the first plate 310.

[0126] According to an embodiment, the first absorbent core portion 350 may include a first portion disposed in the first region 300a (e.g., Figure 3b The first part 351), and the second part set in the second region 300b (e.g., Figure 3b The second part 352), and the third part 353 disposed in the third region 300c and connecting the first part 351 and the second part 352. In order to support the second plate 320, the third part 353 may include a first support region 353a disposed in the first flow path 301 and a second support region 353b disposed in the second flow path 302.

[0127] In the following text, the part with the same as will be omitted. Figure 3a and Figure 3b The accompanying figures are described repeatedly with the same reference numerals.

[0128] According to an embodiment, the second absorbent core portion 360 can fill the second flow path 302 together with the first absorbent core portion 350. For example, the second absorbent core portion 360 can occupy the space between the first absorbent core portion 350 and the second plate 320 in the second flow path 302. For example, the second flow path 302 can be filled by the second support region 353b of the first absorbent core portion 350 and the second absorbent core portion 360 attached to the second support region 353b. For example, the second absorbent core portion 360 can be surrounded in the second flow path 302 by the third support region 353b of the first absorbent core portion 350 and the second plate 320. For example, the second absorbent core portion 350 can be attached to the separation structure 335. For example, the second absorbent core portion 360 can be covered in the second flow path 302 by the second plate 320. The liquid-absorbing core structure 340 can move liquid fluid in the heat dissipation member 300 from the second region 300b to the first region 300a through the second flow path 302 via the second liquid-absorbing core portion 360, which includes the second flow path 302 filled together with the first liquid-absorbing core portion 350.

[0129] According to an embodiment, the first plate 310 may include a first sidewall 311 disposed along the periphery of the first plate 310. The second plate 320 may include a second sidewall 321 disposed along the periphery of the second plate 320 and facing the first sidewall 311. The second sidewall 321 may be connected to the first sidewall 311. For example, the second sidewall 321 may be attached to the first sidewall 311. For example, the second sidewall 321 may be welded to the first sidewall 311. For example, the second sidewall 321 may seal the space between the first plate 310 and the second plate 320 together with the first sidewall 311. The second sidewall 321 can reduce fluid leakage in the heat dissipation member 300 by sealing the interior of the heat dissipation member 300 together with the first sidewall 311. The second plate 320 may be connected to the first plate 310 by connecting the second sidewall 321 to the first sidewall 311.

[0130] According to an embodiment, the frame 330 may include a first post 410 that contacts a first support region 353a by protruding from the second plate 320 toward the first plate 310 in a first flow path 301. For example, the first post 410 may extend from the second plate 320 to the first support region 353a. For example, the first post 410 may be attached to the first support region 353a. The first support region 353a may be at least partially disposed between the first post 410 and the second plate 320. For example, the first post 410 may contact a gaseous fluid in the first flow path 301. The first post 410 may support the second plate 320 on which the first post 410 is formed. The first post 410 may be supported by the first plate 310. The second plate 320 may reduce damage to the first flow path 301 due to external impacts by including the first post 410 supported by the first absorbent core portion 350 and / or the first plate 310.

[0131] refer to Figure 4b The frame 330 may include a second post 420 that contacts a second support region 353b by protruding from the second plate 320 toward the first plate 310 in the second flow path 302. The second absorbent core portion 360 may include a plurality of through holes 430 for the second post 420 to pass through in the second flow path 302. For example, the plurality of posts 370 may include a first post 410 disposed in the first flow path 301 and a second post 420 disposed in the second flow path 302. The first post 410 and the second post 420 may be attached to the first absorbent core portion 350 by protruding from the second plate 320 toward the first plate 310. For example, the second post 420 may extend from the second plate 320 to the second support region 353b. For example, the second post 420 may be attached to the second support region 353b. The second support region 353b may support the second plate 320 via the second post 420. For example, the second post 420 may contact a liquid fluid in the second flow path 302. The frame 330 can reduce damage to the second flow path 302 due to external impacts by a second column 420 supported by a second support region 353b of the first absorbent core portion 350 and / or the first plate 310.

[0132] For example, multiple through holes 430 of the second suction core portion 360 can be penetrated by the second post 420 in the second flow path 302. The multiple through holes 430 can each have a shape corresponding to the shape of the multiple posts 420. For example, the multiple through holes 430 can be connected to the second post 420. The multiple through holes 430 can secure the second suction core portion 360 to the second plate 320 by connecting to the second post 420. By including the multiple through holes 430, the second suction core portion 360 can provide space for the second post 420 in the second flow path 302 and connect the second suction core portion 360 to the second plate 320.

[0133] The second absorbent core portion 360 has been described as including a plurality of through holes 430, but is not limited thereto. The second absorbent core portion 360 may include, instead of a plurality of through holes 430, multiple recesses for receiving each second post 420, or may include a plurality of through holes 430 and multiple recesses for respectively allowing and / or receiving second posts 420 of various shapes to pass through and / or receive second posts 420 of various shapes. By including multiple recesses, the second absorbent core portion 360 can provide space for the second posts 420 and reduce damage to the second flow path 302 due to external impacts.

[0134] According to the above embodiments, the heat dissipation member 300 of the electronic device 101 can improve its performance by including a second absorbent core portion 360 that fills the second flow path 302 together with the first absorbent core portion 350. By including a first post 410 protruding from the second plate 320 toward the first plate 310 in the first flow path 301, the heat dissipation member 300 can reduce damage to the first flow path 301 due to external impacts. By including a second post 420 protruding from the second plate 320 toward the first plate 310 in the second flow path 302, the heat dissipation member 300 can reduce damage to the second flow path 302 due to external impacts.

[0135] Figure 4c It is along Figure 3a A cross-sectional view of the heat dissipation component of an exemplary electronic device cut along line A-A'. Figure 4d yes Figure 4c Top view of the first liquid-absorbing core portion of the heat dissipation component.

[0136] refer to Figure 4c and Figure 4d The frame 330 may include a first post 410 that contacts a first support region 353a of the first absorbent core portion 350 by protruding from the second plate 320 toward the first plate 310 in the first flow path 301. The first support region 353a may include a plurality of holes 440.

[0137] For example, multiple holes 440 may extend in a direction from the first portion 351 toward the second portion 352 (e.g., the -y direction) and / or in a direction from the second portion 352 toward the first portion 351 (e.g., the +y direction). For example, multiple holes 440 may extend along a slit 350a of the first suction core portion 350 through which the separation structure 335 passes. For example, the second support plate 320 may face the first support plate 310 through multiple holes 440 in the first flow path 301. For example, multiple holes 440 may be formed in the remaining portion of the first support region 353a that is not attached to the first post 410.

[0138] The first support region 353a of the first suction core portion 350 has been described as including a plurality of holes 440, but is not limited thereto. The first suction core portion 350 may include a plurality of recesses for providing additional space to the first flow path 301 instead of a plurality of holes 440, or may include a structure in which a plurality of holes 440 and a plurality of recesses are formed. The first suction core portion 350 may provide additional space for gaseous fluid in the first flow path 301 by including a plurality of holes 440 and / or a plurality of recesses.

[0139] According to the above embodiment, the liquid-absorbing core structure 340 in the heat dissipation component 300 can provide additional space for gaseous fluid in the first flow path 301 by including a first liquid-absorbing core portion 350 having a plurality of holes 440 formed in the first flow path 301. The remaining portion of the first liquid-absorbing core portion 350, excluding the portion having the plurality of holes 440, can be attached to the first post 410 in the first flow path 301 to reduce damage to the frame 330 due to external impact.

[0140] Figure 4e It is along Figure 3a A cross-sectional view of the heat dissipation component of an exemplary electronic device cut along line A-A'. Figure 4f yes Figure 4d Top view of the first liquid-absorbing core portion of the heat dissipation component.

[0141] refer to Figure 4e and Figure 4f The frame 330 may include a first post 410 protruding from the second plate 320 toward the first plate 310 in the first flow path 301. The first post 410 may contact the first plate 310.

[0142] For example, with Figures 4a to 4d The first support region 353a of the first absorbent core portion 350 can be omitted. For example, the third portion 353 of the first absorbent core portion 350 can be disposed in the second flow path 302 of the first flow path 301 and the second flow path 302. For example, the first post 410 can extend from the second plate 320 to the first plate 310. The first post 410 can be attached to the first plate 310. For example, the first post 410 can support the second plate 320 through the first plate 310.

[0143] For example, liquid fluid in the heat dissipation component 300 can move through the third portion 353 and the second absorbent core portion 360 in the second flow path 302 of the first flow path 301 and the second flow path 302. Liquid fluid in the first absorbent core portion 350 can move from the second portion 352 to the first portion 351 in the second flow path 302 via the third portion 353. Gaseous fluid in the heat dissipation component 300 can move through the first flow path 301 in the first flow path 301 and the second flow path 302.

[0144] The above description and Figures 4a to 4f The structures of the first flow path 301 and the second flow path 302 shown are exemplary and not limited thereto. The first flow path 301 and the second flow path 302 of the electronic device 101 may include various structures and combinations thereof based on the frame 330 and the absorbent core structure 340 forming the first flow path 301 and the second flow path 302. For example, in one embodiment, the first flow path 301 may include a structure in which a plurality of holes 440 are formed in the first absorbent core portion 350, such as... Figure 4c As shown, the second flow path 302 may include a structure in which a plurality of through holes 430 for the second column 420 are formed in the second suction core portion 360, as shown. Figure 4b As shown. For example, in an embodiment, the first flow path 301 may include a structure in which the first absorbent core portion 350 is not provided and the first column 410 extends to the first plate 310, as shown. Figure 4e As shown, the second flow path 302 may include a structure in which a plurality of through holes 430 for the second column 420 are formed in the second suction core portion 460, as shown. Figure 4b As shown. However, it is not limited to this, and the shapes of the first flow path 301 and the second flow path 302 may include Figures 4a to 4f The combination of structures shown in the example.

[0145] According to the above embodiment, the first liquid-absorbing core portion 350 in the heat dissipation member 300 can improve the performance of the heat dissipation member 300 by being disposed in the second flow path 302 of the first flow path 301 and the second flow path 302 in the third region 300c. Since the heat dissipation member 300 includes a first post 410 attached to the first plate 310 by extending from the second plate 320 to the first plate 310, the heat dissipation member 300 can reduce damage to the frame 330 due to external impacts.

[0146] Figure 5a This is an exploded perspective view of a heat dissipation component of an exemplary electronic device.

[0147] refer to Figure 5a Electronic devices (e.g.) Figure 1The electronic device 101 may include electronic components (e.g., Figure 3a The electronic component 305 and a heat dissipation member 300 at least partially disposed on the electronic component 305. The heat dissipation member 300 may include a first region facing the electronic component 305 (e.g., Figure 3a The first region 300a), and the second region separated from the first region 300a (e.g., Figure 3a The second region 300b) and the third region (e.g., Figure 3a The third region 300c), the third region connects the first region 300a and the second region 300b and includes a first flow path for the fluid in a gaseous state (e.g., Figure 3a The first flow path 301) and the second flow path for the fluid in the liquid state (e.g., Figure 3a The second flow path 302). The heat dissipation component 300 may include: a first plate 310; a second plate 320 connected to the first plate 310; a frame 330 including a separation structure 335 in a third region 300c that separates the first flow path 301 and the second flow path 302; and a wick structure 340 for moving fluid within the frame 330. The wick structure 340 may include a first wick portion 350 attached to the first plate 310 and a second wick portion 360 disposed in the second flow path 302 and at least partially inserted between the first wick portion 350 and the second plate 320.

[0148] According to an embodiment, the separation structure 335 can have curvature by being at least partially bent. For example, at least a portion of regions 300a, 300b, and 300c of the heat dissipation member 300 can be bent. The separation structure 335 in the heat dissipation member 300 can be bent along at least a portion of the bent heat dissipation member 300.

[0149] For example, the separation structure 335 may include at least one first curved portion 510 having curvature. The first flow path 301 and / or the second flow path 302 in the third region 300c of the heat dissipation member 300 may have a shape that bends through at least one first curved portion 510. For example, the second absorbent core portion 360, at least partially disposed in the second flow path 302, may include at least one second curved portion 520 that bends to correspond to at least one first curved portion 510 of the separation structure 335. The third portion 353 (or the second support region 353b) of the first absorbent core portion 350 attached to the second absorbent core portion 360 may be at least partially bent to correspond to at least one first curved portion 510 and / or at least one second curved portion 520. However, it is not limited thereto. The heat dissipation member 300 may require a frame 330, which is connected to the housing of the electronic device 101 (e.g., Figure 2a The structure in the housing 210 has at least a partially curved shape. The separation structure 335 and / or the liquid-absorbing core structure 340 in the frame 330 can be configured by bending at least partially along the at least partially curved frame 330, such that the heat dissipation member 300 is disposed in the electronic device 101.

[0150] According to the above embodiments, the heat dissipation member 300 of the electronic device 101 can be configured by including a separation structure 335 having at least a first bending portion 510 along a frame 330 that is at least partially bent and / or a second liquid-absorbing core portion 360 having at least a second bending portion 520, such that the heat dissipation member 300 is disposed in the electronic device 101.

[0151] Figure 5b It is along Figure 3a A cross-sectional view of the heat dissipation component of an exemplary electronic device cut along line A-A'. Figure 5c yes Figure 5b Top view of the liquid-absorbing core structure of the heat dissipation component. Figure 5d It is along Figure 3a A cross-sectional view of the heat dissipation component of an exemplary electronic device cut along line A-A'. Figure 5e yes Figure 5d Top view of the liquid-absorbing core structure of the heat dissipation component.

[0152] refer to Figure 5b , Figure 5c , Figure 5d and Figure 5e Electronic device 101 may include electronic components (e.g., Figure 3a The electronic component 305 and a heat dissipation member 300 at least partially disposed on the electronic component 305. The heat dissipation member 300 may include a first region facing the electronic component 305 (e.g., Figure 3aThe first region 300a), and the second region separated from the first region 300a (e.g., Figure 3a The heat dissipation member 300 may include a second region 300b and a third region 300c, the third region 300c connecting the first region 300a and the second region 300b and including a first flow path 301 for a gaseous fluid and a second flow path 302 for a liquid fluid. The heat dissipation member 300 may include: a first plate 310; a second plate 320 coupled to the first plate 310; a frame 330 including a separation structure 335 in the third region 300c separating the first flow path 301 and the second flow path 302; and a wicking structure 340 for moving fluid within the frame 330. The wicking structure 340 may include a first wicking portion 350 attached to the first plate 310 and a second wicking portion 360 disposed in the second flow path 302 and at least partially inserted between the first wicking portion 350 and the second plate 320. According to an embodiment, the frame 330 may include a plurality of posts 370 projecting from the second plate 320 toward the first plate 310.

[0153] According to the implementation method, with Figures 3a to 5a The absorbent core structure 340 can be the first absorbent core portion therein (e.g., Figure 3b The first absorbent core portion 350) and the second absorbent core portion (e.g., Figure 3b The second absorbent core portion 360 is integrally formed into the structure. For example, in the absorbent core structure 340, the first absorbent core structure 340 may be a portion with a relatively small thickness relative to the first column 410 disposed in the first flow path 301. For example, in the absorbent core structure 340, the second absorbent core portion 350 may be a portion with a relatively large thickness for filling the second flow path 302.

[0154] According to an embodiment, the wick structure 340 may include a stepped portion 340a formed along the separation structure 335. For example, the stepped portion 340a may be formed by the thickness difference between the first wick portion 350 and the second wick portion 360. For example, the height of the stepped portion 340a may correspond to the height of each first post 410 disposed in the first flow path 301. The wick structure 340 may be configured to simplify the manufacturing process of the wick structure 340 and facilitate fluid movement within the heat dissipation member 300 by including an integrally formed structure comprising the stepped portion 340a.

[0155] refer to Figure 5b and Figure 5c The wick structure 340 may include a slit 350a for the separation structure 335 to pass through. A stepped portion 340a of the wick structure 340 may be formed along the slit 350a.

[0156] refer to Figure 5d and Figure 5e ,and Figures 5a to 5c Unlike other wicking structures, the slit 350a can be omitted in the wicking structure 340. The wicking structure 340 may include a separation portion 340b serving as a separation structure 335. For example, the separation portion 340b may be welded to the first plate 310 and the second plate 320. For example, the separation portion 340b may be part of the wicking structure 340, in which the untreated substrate material of the wicking structure 340 is disposed. For example, in the case that the wicking structure 340 is a mesh wicking structure, the separation portion 340b may be a portion in which the mesh structure is not formed. The wicking structure 340 can separate the first flow path 301 and the second flow path 302 by including the separation portion 340b serving as a separation structure 335.

[0157] According to the above embodiments, the liquid wick structure 340 of the heat dissipation component 300 can be configured to simplify the manufacturing process of the liquid wick structure 340 and enable fluid movement within the heat dissipation component 300 by including a stepped portion 340a and an integrally formed structure. The liquid wick structure 340 can separate the first flow path 301 and the second flow path 302 by including a separation portion 340b.

[0158] Figure 6a , Figure 6b , Figure 6c and Figure 6d A portion of a heat dissipation component of an exemplary electronic device is shown.

[0159] refer to Figure 6a , Figure 6b , Figure 6c and Figure 6d Electronic device 101 may include electronic components (e.g., Figure 3a The electronic component 305 and a heat dissipation member 300 at least partially disposed on the electronic component 305. The heat dissipation member 300 may include a first region facing the electronic component 305 (e.g., Figure 3a The first region 300a), and the second region separated from the first region 300a (e.g., Figure 3aThe heat dissipation member 300 may include a second region 300b and a third region 300c, the third region 300c connecting the first region 300a and the second region 300b and including a first flow path 301 for a gaseous fluid and a second flow path 302 for a liquid fluid. The heat dissipation member 300 may include: a first plate 310; a second plate 320 coupled to the first plate 310; a frame 330 including a separation structure 335 in the third region 300c separating the first flow path 301 and the second flow path 302; and a wicking structure 340 for moving fluid within the frame 330. The wicking structure 340 may include a first wicking portion 350 attached to the first plate 310 and a second wicking portion 360 disposed in the second flow path 302 and at least partially inserted between the first wicking portion 350 and the second plate 320.

[0160] refer to Figure 6a The separation structure 335 can contact the second plate 320 by extending from the first plate 310 toward the second plate 320 in the third region 300c. For example, the separation structure 335 can be formed in the first plate 310. The separation structure 335 can space the first flow path 301 and the second flow path 302 by protruding from the first plate 310 toward the second plate 320. For example, the separation structure 335 can reduce the second plate 320 from denting toward the first plate 310 due to external impact by supporting the second plate 320.

[0161] refer to Figure 6b The separation structure 335 can contact the first plate 310 by extending from the second plate 320 toward the first plate 310 in the third region 300c. For example, the separation structure 335 can be formed in the second plate 320. The separation structure 335 can space the first flow path 301 and the second flow path 302 by protruding from the second plate 320 toward the first plate 310. For example, the separation structure 335 can reduce the first plate 310 from denting toward the second plate 320 due to external impact by supporting the first plate 310.

[0162] refer to Figure 6cThe separation structure 335 may include a first protrusion 610 extending from the first plate 310 toward the second plate 320 in the third region 300c, a second protrusion 620 extending from the second plate 320 toward the first plate 310 in the third region 300c and facing the first protrusion 610, and an adhesive member 650 connecting the first protrusion 610 and the second protrusion 620. For example, the first protrusion 610 may be disposed in the first plate 310 at a position corresponding to the second protrusion 620. For example, when viewed from above (e.g., when viewed in the +z direction), the first protrusion 610 may overlap with the second protrusion 620. For example, the first protrusion 610 may be coupled to the second protrusion 620.

[0163] For example, the adhesive member 650 can be inserted between the first protrusion 610 and the second protrusion 620. The adhesive member 650 can attach the first protrusion 610 to the second protrusion 620. For example, the adhesive member 650 can fill the gap between the first protrusion 610 and the second protrusion 620. The adhesive member 650 can separate the first flow path 301 and the second flow path 302 by being positioned in the gap. For example, the adhesive member 650 may include, but is not limited to, solder for connecting the first protrusion 610 and the second protrusion 620.

[0164] The adhesive member 650 has been described as being disposed between the first protrusion 610 and the second protrusion 620 of the separation structure 335, but is not limited thereto. For example, when referenced together... Figure 6a At that time, the adhesive member 650 can attach the separation structure 335 to the second plate 320 by being disposed between the separation structure 335 extending from the first plate 310 toward the second plate 320 and the second plate 320. For example, when referenced together Figure 6b At the same time, the adhesive member 650 can attach the separation structure 335 to the first plate 310 by being disposed between the separation structure 335 extending from the second plate 320 toward the first plate 310 and the first plate 310.

[0165] See Figure 6d The separation structure 335 may include a first support portion 335a protruding from the second plate 320 toward the first absorbent core portion 350 and a second support portion 335b connected to the first support portion 335a and at least partially filling the first absorbent core portion 350. For example, with Figures 6a to 6cThe differences shown may omit the slit 350a of the first absorbent core portion 350 for the separation structure 335 to pass through. At least a portion of the first absorbent core portion 350 may be filled with the material forming the separation structure 335. For example, the first support portion 335a may be a portion that contacts a gaseous fluid moving through the first flow path 301. For example, the first support portion 335a may be a portion that contacts a second absorbent core portion 360 disposed in the second flow path 302. For example, the second support portion 335b may be a portion disposed in the first absorbent core portion 350 through a porous structure. For example, the second support portion 335b may be a portion of the first absorbent core portion 350 disposed between the first plate 310 and the first support portion 335a. For example, the second support portion 335b may separate the first flow path 301 and the second flow path 302 by extending from the first support portion 335a through the first absorbent core portion 350 to the first plate 310. For example, when the first support portion 335a is attached to the first plate 310, the separation structure 335 can be fastened to the second plate 320.

[0166] Refer again Figure 6a , Figure 6b , Figure 6c and Figure 6d The frame 330 may include at least one recess 630 formed in the separation structure 335.

[0167] For example, if the separation structure 335 of the frame 330 is formed by an etching process, the separation structure 335 may not include at least one recess 630. For example, if the separation structure 335 of the frame 330 is formed by machining, the separation structure 335 may include at least one recess 630 by being formed into at least a portion of the first plate 310 and / or at least a portion of the second plate 320 via a pressing process.

[0168] For example, when referring to Figure 6a When the separation structure 335 protrudes from the first plate 310 toward the second plate 320, the first plate 310 may include a first recess 631, which is disposed at a position corresponding to the separation structure 335 and recessed toward the second plate 320. For example, when referring to... Figure 6b At this time, the separation structure 335 can protrude from the second plate 320 toward the first plate 310. The second plate 320 may include a second recess 632, which is disposed at a position corresponding to the separation structure 335 and recessed toward the first plate 310.

[0169] For example, when referring to Figure 6cThe separation structure 335 may include a first protrusion 610 protruding from the first plate 310 toward the second plate 320 and a second protrusion 620 protruding from the second plate 320 toward the first plate 310 and facing the first protrusion 610. At least one recess 630 may include a first recess 631 formed in the first protrusion 610 and recessed toward the second plate 320 and a second recess 632 formed in the second protrusion 620 and recessed toward the first plate 310.

[0170] According to an embodiment, the wicking structure 340 may include at least one of a mesh wicking structure and a sintered wicking structure. For example, the first wicking portion 350 and the second wicking portion 360 may be mesh wicking structures. For example, the first wicking portion 350 and the second wicking portion 360 may be sintered wicking structures. For example, one of the first wicking portion 350 and the second wicking portion 360 may be a mesh wicking structure, and the other may be a sintered wicking structure. However, it is not limited thereto. The wicking structure 340 can improve the performance of the heat dissipation member 300 by including at least one of a mesh wicking structure and a sintered wicking structure.

[0171] According to the above embodiments, by including a separation structure 335 in the heat dissipation member 300 to separate the first flow path 301 and the second flow path 302, the heat dissipation member 300 of the electronic device 101 can improve the performance of the heat dissipation member 300 and reduce damage to the third region 300c in which the separation structure 335 is provided due to external impact.

[0172] Figure 7a , Figure 7b and Figure 7c A portion of a heat dissipation component of an exemplary electronic device is shown.

[0173] refer to Figure 7a , Figure 7b and Figure 7c Electronic device 101 may include electronic components (e.g., Figure 3a The electronic component 305 and a heat dissipation member 300 at least partially disposed on the electronic component 305. The heat dissipation member 300 may include a first region facing the electronic component 305 (e.g., Figure 3a The first region 300a), and the second region separated from the first region 300a (e.g., Figure 3aThe heat dissipation member 300 may include a second region 300b and a third region 300c, the third region 300c connecting the first region 300a and the second region 300b and including a first flow path 301 for a gaseous fluid and a second flow path 302 for a liquid fluid. The heat dissipation member 300 may include: a first plate 310; a second plate 320 coupled to the first plate 310; a frame 330 including a separation structure 335 in the third region 300c separating the first flow path 301 and the second flow path 302; and a wicking structure 340 for moving fluid within the frame 330. The wicking structure 340 may include a first wicking portion 350 attached to the first plate 310 and a second wicking portion 360 disposed in the second flow path 302 and at least partially inserted between the first wicking portion 350 and the second plate 320.

[0174] According to an embodiment, frame 330 may include another separation structure 710 spaced apart from separation structure 335. First flow path 301 and / or second flow path 302 may be divided into multiple flow paths by separation structure 335 and another separation structure 710. First absorbent core portion 350 may include a slit 350a for passage of separation structure 335 and another slit 720 for passage of another separation structure 710.

[0175] For example, when referring to Figure 7a In this case, the first flow path 301 may include a first set of flow paths 301a and 301b separated from each other by another separation structure 710 different from the separation structure 335. For example, when referring to Figure 7b At the same time, a second flow path 302 for moving the liquid fluid can be provided between the first set of flow paths 301a and 301b for moving the gaseous fluid by means of a separation structure 335 and another separation structure 710.

[0176] For example, when referring to Figure 7c In this case, the second flow path 302b may include a second set of flow paths 302a and 302b separated from each other by the separation structure 335 and another separation structure 710. A first flow path 301 for moving a gaseous fluid may be disposed between the second set of flow paths 302a and 302b for moving a liquid fluid via the separation structure 335 and another separation structure 710. However, it is not limited thereto.

[0177] The frame 330 may include multiple separation structures, including a separation structure 335 that separates the first flow path 301 and the second flow path 302. By including multiple separation structures, the frame 330 can reduce damage to the third region 300c of the heat dissipation component 300, which is provided with multiple separation structures, due to external impacts.

[0178] Figure 8a , Figure 8b , Figure 8c , Figure 8d and Figure 8e A portion of an exemplary electronic device is shown.

[0179] refer to Figure 8a , Figure 8b , Figure 8c , Figure 8d and Figure 8e The electronic device 101 may include an electronic component 305 and a heat dissipation member 300 at least partially disposed on the electronic component 305. The heat dissipation member 300 may include a first flow path 301 for a gaseous fluid and a second flow path 302 for a liquid fluid. The heat dissipation member 300 may include a first plate (e.g., Figure 3b The first plate 310), and the second plate connected to the first plate 310 (e.g., Figure 3b The second plate 320), a frame 330 including a separation structure 335 separating the first flow path 301 and the second flow path 302, and a wick structure 340 for moving fluid within the frame 330. The wick structure 340 may include a first wick portion attached to the first plate 310 (e.g., Figure 3b The first absorbent core portion 350) and the second absorbent core portion 360 disposed in the second flow path 302 and at least partially inserted between the first absorbent core portion 350 and the second plate 320.

[0180] According to the implementation method, when viewing the display from above (e.g., Figure 2a When the display 201 is viewed from above (e.g., when viewed in the +z direction), the heat sink 300 may at least partially overlap with the electronic component 305. For example, when the display 201 is viewed from above, a portion of the heat sink 300 may overlap with the electronic component 305, and the remaining portion of the heat sink 300 may overlap with the battery 270 in the electronic device 101. The wicking structure 340 in the heat sink 300 may be configured to diffuse fluid evaporated by heat generated from the electronic component 305 into a first flow path 301. The wicking structure 340 may be configured to move fluid liquefied in the first flow path 301 to a region adjacent to the electronic component 305 via a second flow path 302 (e.g., ...). Figure 3a The first region 300a). The wick structure 340 (or the second wick portion 360 of the wick structure 340) can fill the second flow path 302.

[0181] refer to Figure 8a and Figure 8bThe separation structure 335 can separate the first flow path 301 and the second flow path 302. The gaseous fluid evaporated by the electronic component 305 in the first flow path 301 can diffuse into the first flow path 301. In the first flow path 301, when viewing the display 201 from above (e.g., when viewed in the +z direction), the fluid adjacent to the first peripheral portion 360a of the second absorbent core portion 360, which is spaced apart from the electronic component 305, can be liquefied. When viewing the display 201 from above, the liquefied fluid in the liquid state can move through the absorbent core structure 340 filling the second flow path 302 to the second peripheral portion 360b, which is opposite to the first peripheral portion 360a of the second absorbent core portion 360 and adjacent to the electronic component 305. The liquid fluid that has moved to the second peripheral portion 360b can diffuse back into the first flow path 301 by evaporation by the electronic component 305.

[0182] refer to Figure 8c , Figure 8d and Figure 8e The heat dissipation component 300 may include separation structures 335 and 710 that separate the first flow path 301 and the second flow path 302. The wicking structure 340 may be configured to diffuse fluid evaporated from the electronic component 305 into the first flow path 301. The wicking structure 340 may be configured to allow fluid liquefied in the first flow path 301 to move through the second flow path 302 to a region adjacent to the electronic component 305.

[0183] For example, when referring to Figure 8c At this time, separation structure 335 and another separation structure 710 can separate the first flow path 301 and the second flow path 302. In the first flow path 301, when the display 201 is viewed from above (e.g., when viewed in the +z direction), the fluid adjacent to the first peripheral portion 360a and the second peripheral portion 360b of the second absorbent core portion 360, which are spaced apart from the electronic component 305, can be liquefied. When the display 201 is viewed from above, the liquefied fluid in the liquid state can move through the absorbent core structure 340 filling the second flow path 302 to the third peripheral portion 360c, which is spaced apart from the first peripheral portion 360a and the second peripheral portion 360b of the second absorbent core portion 360 and adjacent to the electronic component 305. The liquid fluid that has moved to the third peripheral portion 360c can diffuse into the first flow path 301 by being evaporated by the electronic component 305.

[0184] For example, when referring to Figure 8dAt this time, separation structure 335 and another separation structure 710 can separate the first flow path 301 from the second set of flow paths 302a and 302b, respectively. In the first flow path 301, when the display 201 is viewed from above (e.g., when viewed in the +z direction), the fluid adjacent to the first peripheral portion 360a of the second absorbent core portion 360, which is spaced apart from the electronic component 305, can be liquefied. When the display 201 is viewed from above, the liquefied fluid in the liquid state can move through the absorbent core structure 340 filling the second set of flow paths 302a and 302b to the second peripheral portion 360b and the third peripheral portion 360c, which are spaced apart from the first peripheral portion 360a of the second absorbent core portion 360 and adjacent to the electronic component 305. The liquid fluid that has moved to the second peripheral portion 360b and the third peripheral portion 360c can diffuse into the first flow path 301 by being evaporated by the electronic component 305.

[0185] For example, when referring to Figure 8e The second absorbent core portion 360 may include a first portion 361 and a second portion 362 spaced apart from each other. Separation structure 335 and another separation structure 710 can separate the first flow path 301 and the second set of flow paths 302a and 302b, respectively. In the first flow path 301, when viewing the display 201 from above (e.g., when viewed in the +z direction), fluid adjacent to the first peripheral portion 360a of the first portion 361 and the second peripheral portion 360b of the second portion 362, which are spaced apart from the electronic component 305, can be liquefied. When viewing the display 201 from above, the liquefied fluid in a liquid state can move through the absorbent core structure 340 filling the second set of flow paths 302a and 302b to the third peripheral portion 360c and the fourth peripheral portion 360d, which are spaced apart from the first peripheral portions 360a and 360b of the second absorbent core portion 360 and adjacent to the electronic component 305. The liquid fluid that moves to the third peripheral portion 360c and the fourth peripheral portion 360d can diffuse into the first flow path 301 by being evaporated by the electronic component 305.

[0186] According to the above embodiments, by including a liquid-absorbing core structure 340 disposed in the heat dissipation member 300 in various forms, the heat dissipation member 300 of the electronic device 101 can reduce the damage to the electronic device 101 caused by heat generated from the electronic component 305.

[0187] Figure 9a An example electronic device is shown in its unfolded state. Figure 9b An example electronic device is shown in its folded state. Figure 9c This is an exploded view of an exemplary electronic device. Figure 9d and Figure 9eA portion of an exemplary electronic device is shown.

[0188] refer to Figure 9a , Figure 9b and Figure 9c Electronic device 101 (e.g., Figure 1 The electronic device 101 may include a housing 210 comprising a first housing 910 and a second housing 920, and a flexible display 930 (e.g., Figure 1 Display module 160 or Figure 2a The display 201), at least one camera 940 (e.g., Figure 1 The camera module 180, the hinge structure 950, and / or at least one electronic component 960.

[0189] The first housing 910 and the second housing 920 may form at least a portion of the outer surface of the electronic device 101 that can be gripped by a user. When the user uses the electronic device 101, at least a portion of the outer surface of the electronic device 101 defined by the first housing 910 and the second housing 920 may come into contact with a part of the user's body. According to an embodiment, the first housing 910 may include a first surface 911, a second surface 912 facing and spaced apart from the first surface 911, and a third side surface 913 surrounding at least a portion of the first surface 911 and the second surface 912. The third side surface 913 may connect the periphery of the first surface 911 and the periphery of the second surface 912. The first surface 911, the second surface 912, and the third side surface 913 may define an internal space of the first housing 910. According to an embodiment, the first housing 910 may provide the space formed by the first surface 911, the second surface 912, and the third side surface 913 as a space for mounting components of the electronic device 101.

[0190] According to an embodiment, the second housing 920 may include a third surface 921, a fourth surface 922 facing and spaced apart from the third surface 921, and a fourth side surface 923 surrounding at least a portion of the third surface 921 and the fourth surface 922. The fourth side surface 923 may connect the periphery of the third surface 921 and the periphery of the fourth surface 922. The third surface 921, the fourth surface 922, and the fourth side surface 923 may define an internal space of the second housing 920. According to an embodiment, the second housing 920 may provide a space formed by the third surface 921, the fourth surface 922, and the fourth side surface 923 surrounding at least a portion of the third surface 921 and the fourth surface 922 as a space for mounting components of the electronic device 101. According to an embodiment, the second housing 920 may be coupled to the first housing 910 to be rotatable relative to the first housing 910.

[0191] According to an embodiment, each of the first housing 910 and the second housing 920 may respectively include a first protective member 914 and a second protective member 924. The first protective member 914 and the second protective member 924 may be disposed along the periphery of the flexible display 930 on a first surface 911 and a third surface 921. According to an embodiment, the first protective member 914 and the second protective member 924 can prevent the introduction of foreign matter (e.g., dust or moisture) through the gap between the flexible display 930 and the first housing 910 and the second housing 920. For example, the first protective member 914 may surround the periphery of a first display area 931 of the flexible display 930, and the second protective member 924 may surround the periphery of a second display area 932 of the flexible display 930. The first protective member 914 may be formed by attaching to a third side surface 913 of the first housing 910, or may be integrally formed with the third side surface 913. The second protective member 924 may be formed by attaching to a fourth side surface 923 of the second housing 920, or may be integrally formed with the fourth side surface 923.

[0192] According to an embodiment, the third side surface 913 and the fourth side surface 923 may include conductive materials, non-conductive materials, or combinations thereof. For example, the fourth side surface 923 may include at least one conductive member 925 and at least one non-conductive member 926. The at least one conductive member 925 may include a plurality of conductive members spaced apart from each other. The at least one non-conductive member 926 may be disposed between the plurality of conductive members. The plurality of conductive members may be disconnected from each other by the at least one non-conductive member 926 disposed between the plurality of conductive members. According to an embodiment, the plurality of conductive members and the plurality of non-conductive members may together form an antenna radiator. The electronic device 101 may communicate with an external electronic device through the antenna radiator formed by the plurality of conductive members and the plurality of non-conductive members.

[0193] The flexible display 930 can be configured to display visual information. According to an embodiment, the flexible display 930 can be disposed across a hinge structure 950 on a first surface 911 of a first housing 910 and a third surface 921 of a second housing 920. For example, the flexible display 930 may include a first display area 931 disposed on the first surface 911 of the first housing, a second display area 932 disposed on the third surface 921 of the second housing, and a third display area 933 disposed between the first display area 931 and the second display area 932. The first display area 931, the second display area 932, and the third display area 933 may form the front surface of the flexible display 930. According to an embodiment, the flexible display 930 may also include a sub-display panel 935 disposed on a fourth surface 922 of the second housing 920. According to an embodiment, the flexible display 930 may include a window exposed to the outside of the electronic device 101. The window may be protected by a substantially transparent material to protect the surface of the flexible display 930 and transmit the visual information provided by the flexible display 930 to the outside of the electronic device 101. For example, a window may include glass (e.g., ultra-thin glass (UTG)) and / or polymers (e.g., polyimide (PI)), but is not limited thereto.

[0194] At least one camera 940 may be configured to acquire an image based on receiving light from an object outside the electronic device 101. According to an embodiment, at least one camera 940 may include a third camera 941 (e.g., Figure 2a The device 101 includes a rear camera 212, a fourth camera 942, and a fifth camera 943. A third camera 941 may be disposed within the first housing 910. For example, the third camera 941 may be disposed inside the first housing 910, and at least a portion thereof may be visible through the second surface 912 of the first housing 910. The third camera 941 may be supported by a bracket (not shown) within the first housing 910. When viewed from above, the first housing 910 may include at least one opening 941a overlapping the third camera 941. The third camera 941 may acquire images based on receiving light from the outside of the electronic device 101 through at least one opening 941a.

[0195] According to one embodiment, the fourth camera 942 may be disposed within the second housing 920. For example, the fourth camera 942 may be disposed inside the second housing 920 and visible through the sub-display panel 935. When viewed from above, the second housing 920 may include at least one opening 942a overlapping the fourth camera 942. The fourth camera 942 may acquire images based on receiving light from the outside of the electronic device 101 through at least one opening 942a.

[0196] According to an embodiment, the fifth camera 943 may be disposed within the first housing 910. For example, the fifth camera 943 may be disposed inside the first housing 910, and at least a portion thereof may be visible through the first surface 911 of the first housing 910. As another example, the fifth camera 943 may be disposed inside the first housing 910, and at least a portion thereof may be visible through the first display area 931 of the flexible display 930. When viewed from above, the first display area 931 of the flexible display 930 may include at least one opening overlapping with the fifth camera 943. The fifth camera 943 may acquire an image based on receiving light from the outside of the flexible display 930 through at least one opening.

[0197] According to the implementation, the fourth camera 942 and the fifth camera 943 may be disposed below the flexible display 930 (e.g., in a direction toward the interior of the first housing 910 or the interior of the second housing 920). For example, the fourth camera 942 and the fifth camera 943 may be under-display cameras (UDC). When the fourth camera 942 and the fifth camera 943 are under-display cameras, the area of ​​the flexible display 930 corresponding to the position of each of the fourth camera 942 and the fifth camera 943 may not be a passive area. A passive area of ​​the flexible display 930 may refer to an area of ​​the flexible display 930 that does not include pixels or does not emit light to the outside of the electronic device 101. As another example, the fourth camera 942 and the fifth camera 943 may be punch-hole cameras. When the fourth camera 942 and the fifth camera 943 are punch-hole cameras, the area of ​​the flexible display 930 corresponding to the position of each of the fourth camera 942 and the fifth camera 943 may be a passive area.

[0198] According to an embodiment, the hinge structure 950 can rotatably connect the first housing 910 and the second housing 920. The hinge structure 950 can be disposed between the first housing 910 and the second housing 920 of the electronic device 101, allowing the electronic device 101 to be bent, folded, or folded. For example, the hinge structure 950 can be disposed between a portion of a third side surface 913 and a portion of a fourth side surface 923 facing each other. The hinge structure 950 can change the electronic device 101 to an unfolded state where the first surface 911 of the first housing 910 and the third surface 921 of the second housing 920 face the same direction, or a folded state where the first surface 911 and the third surface 921 face each other. When the electronic device 101 is in the folded state, the first housing 910 and the second housing 920 can be stacked or overlapped by facing each other.

[0199] According to the embodiment, when the electronic device 101 is in a folded state, the directions facing the first surface 911 and the third surface 921 can be different from each other. For example, when the electronic device 101 is in a folded state, the directions facing the first surface 911 and the third surface 921 can be opposite to each other. As another example, when the electronic device 101 is in a folded state, the directions facing the first surface 911 and the third surface 921 can be tilted relative to each other. When the direction facing the first surface 911 is tilted relative to the direction facing the third surface 921, the first housing 910 can be tilted relative to the second housing 920.

[0200] According to an embodiment, the electronic device 101 can be folded relative to a folding axis f. The folding axis f can represent, but is not limited to, an imaginary line extending through the hinge cover 951 in a direction parallel to the longitudinal direction of the electronic device 101. For example, the folding axis f can be an imaginary line extending in a direction perpendicular to the longitudinal direction of the electronic device 101. When the folding axis f extends in a direction perpendicular to the longitudinal direction of the electronic device 101, the hinge structure 950 can connect the first housing 910 and the second housing 920 by extending in a direction parallel to the folding axis f. The first housing 910 and the second housing 920 can be rotatable via the hinge structure 950 extending in a direction perpendicular to the longitudinal direction of the electronic device 101.

[0201] According to one embodiment, the hinge structure 950 may include a hinge cover 951, a first hinge plate 952, a second hinge plate 953, and a hinge module 954. The hinge cover 951 may surround the internal components of the hinge structure 950 and form the outer surface of the hinge structure 950. According to one embodiment, when the electronic device 101 is in a folded state, at least a portion of the hinge cover 951 surrounding the hinge structure 950 may be exposed to the outside of the electronic device 101 through the space between the first housing 910 and the second housing 920. According to one embodiment, when the electronic device 101 is in an unfolded state, the hinge cover 951 may be covered by the first housing 910 and the second housing 920 and may not be exposed to the outside of the electronic device 101.

[0202] According to an embodiment, the first hinge plate 952 and the second hinge plate 953 can be rotatably connected to the first housing 910 and the second housing 920 by being connected to them respectively. For example, the first hinge plate 952 can be connected to the first front bracket 915 of the first housing 910, and the second hinge plate 953 can be connected to the second front bracket 927 of the second housing 920. When the first hinge plate 952 and the second hinge plate 953 are connected to the first front bracket 915 and the second front bracket 927 respectively, the first housing 910 and the second housing 920 can rotate according to the rotation of the first hinge plate 952 and the second hinge plate 953.

[0203] The hinge module 954 is rotatable of the first hinge plate 952 and the second hinge plate 953. For example, the hinge module 954 can rotate the first hinge plate 952 and the second hinge plate 953 about the folding axis f by including gears that mesh with each other to be rotatable. According to an embodiment, multiple hinge modules 954 may be present. For example, multiple hinge modules 954 may be spaced apart from each other and respectively disposed at both ends of the first hinge plate 952 and the second hinge plate 953.

[0204] According to an embodiment, the first housing 910 may include a first front support 915 and a rear support 916, and the second housing 920 may include a second front support 927. The first front support 915 and the rear support 916 may be disposed inside the first housing 910 and may support components of the electronic device 101. The second front support 927 may be disposed inside the second housing 920 and may support components of the electronic device 101. For example, a flexible display 930 may be disposed on the surface of the first front support 915 and the surface of the second front support 927. The rear support 916 may be disposed on the other surface of the first front support 915 opposite to the surface of the first front support 915.

[0205] According to an embodiment, a portion of the first front support 915 may be surrounded by the third side surface 913, and a portion of the second front support 927 may be surrounded by the fourth side surface 923. For example, the first front support 915 may be integrally formed with the third side surface 913, and the second front support 927 may be integrally formed with the fourth side surface 923. Alternatively, the first front support 915 may be formed separately from the third side surface 913, and the second front support 927 may be formed separately from the fourth side surface 923.

[0206] At least one electronic component 960 can perform various functions to be provided to the user. According to an embodiment, at least one electronic component 960 may include a first printed circuit board 250, a second printed circuit board 252, a flexible printed circuit board 253, and a battery 270 (e.g., Figure 1 Battery 189) and / or antenna 248 (e.g., Figure 1 Antenna module 197). The first printed circuit board 250 and the second printed circuit board 252 can each form an electrical connection between components in the electronic device 101. For example, components used to realize the overall function of the electronic device 101 (e.g., Figure 1 The processor 120 may be disposed on the first printed circuit board 250, and electronic components for implementing some functions of the first printed circuit board 250 may be disposed on the second printed circuit board 252. For example, components for operating the sub-display panel 935 disposed on the fourth surface 922 may be disposed on the second printed circuit board 252.

[0207] According to one embodiment, a first printed circuit board 250 may be disposed in a first housing 910. For example, the first printed circuit board 250 may be disposed on the surface of a first front support 915. According to another embodiment, a second printed circuit board 252 may be disposed in a second housing 920. For example, the second printed circuit board 252 may be spaced apart from the first printed circuit board 250 and disposed on the surface of a second front support 927. A flexible printed circuit board 253 may connect the first printed circuit board 250 and the second printed circuit board 252. For example, the flexible printed circuit board 253 may extend from the first printed circuit board 250 to the second printed circuit board 252.

[0208] Battery 270 is a device for supplying power to at least one component of electronic device 101, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of battery 270 may be disposed on a plane substantially the same as the first printed circuit board 250 or the second printed circuit board 252.

[0209] Antenna 248 can be configured to receive power or signals from outside the electronic device 101. In one embodiment, antenna 248 may be disposed between the rear bracket 916 and the battery 270. Antenna 248 may include, for example, a near-field communication (NFC) antenna, an antenna module, and / or a magnetically secure transmission (MST) antenna. Antenna 248 can, for example, perform short-range communication with external devices or wirelessly transmit and receive power required for charging.

[0210] refer to Figure 9d and Figure 9e The electronic device 101 may include a first housing 910, a second housing 920, a hinge structure 950, an electronic component 305, and a heat dissipation member 300 at least partially disposed on the electronic component 305. The heat dissipation member 300 may include a first flow path 301 for a gaseous fluid and a second flow path 302 for a liquid fluid. The heat dissipation member 300 may include a first plate (e.g., Figure 3bThe first plate 310), and the second plate connected to the first plate 310 (e.g., Figure 3b The second plate 320), a frame 330 including a separation structure 335 separating the first flow path 301 and the second flow path 302, and a wick structure 340 for moving fluid within the frame 330. The wick structure 340 may include a first wick portion attached to the first plate 310 (e.g., Figure 3b The first absorbent core portion 350) and the second absorbent core portion 360 disposed in the second flow path 302 and at least partially inserted between the first absorbent core portion 350 and the second plate 320.

[0211] According to one embodiment, the first housing 910 may accommodate the heat dissipation member 300. The second housing 920 may be rotatably connected to the first housing 910. A hinge structure (e.g., Figure 9b The hinge structure 950 can connect the first housing 910 and the second housing 920.

[0212] For example, electronic component 305 may be disposed within the first housing 910. When viewed from above, the flexible display (e.g., Figure 9a When a flexible display 930 is used, a heat dissipation component 300 may be disposed in the first housing 910 to at least partially overlap with the electronic component 305.

[0213] For example, the separation structure 335 in the heat dissipation component 300 can separate the first flow path 301 and the second flow path 302. The gaseous fluid evaporated by the electronic component 305 in the first flow path 301 can diffuse into the first flow path 301. In the first flow path 301, when the flexible display 930 is viewed from above (e.g., when viewed in the +z direction), the fluid adjacent to the first peripheral portion 360a of the second absorbent core portion 360, which is spaced apart from the electronic component 305, can be liquefied. When the flexible display 930 is viewed from above, the liquefied fluid in the liquid state can move through the absorbent core structure 340 filling the second flow path 302 to the second peripheral portion 360b, which is opposite to the first peripheral portion 360a of the second absorbent core portion 360 and adjacent to the electronic component 305. The liquid fluid that has moved to the second peripheral portion 360b can diffuse into the first flow path 301 by being evaporated by the electronic component 305. The heat dissipation component 300 can reduce the damage to the electronic components housed in the first housing 910 due to heat by dissipating the heat generated from the electronic components 305.

[0214] According to one embodiment, the electronic device 101 may include a heat transfer member 980 extending across a hinge structure 950 from a first housing 910 toward a second housing 920. A heat dissipation member 300 may be configured such that a first flow path 301 is closer to the heat transfer member 980 than a second flow path 302.

[0215] For example, when the flexible display 930 is viewed from above (e.g., when viewed in the +z direction), the heat transfer member 980 may at least partially overlap with the electronic component 305. For example, the heat transfer member 980 may be attached to the region of the first flow path 301 in the first flow path 301 and the second flow path 302 where the heat dissipation member 300 is provided (e.g., Figure 3a The heat dissipation member 300 may be located between the electronic component 305 and the heat transfer member 980, in the first region 300a). According to an embodiment, the heat dissipation member 300 may be located between the electronic component 305 and the heat transfer member 980. The region of the heat dissipation member 300 where the heat transfer member 980 is located may be a region located on the electronic component 305. For example, the heat transfer member 980 may extend from the region of the heat dissipation member 300 where the first flow path 301 is provided across the hinge structure 950 to the second housing 920. Heat transferred from the electronic component 305 to the heat transfer member 980 via the first flow path 301 can be dissipated from the first housing 910 to the second housing 920 via the heat transfer member 980. By providing a heat transfer path for transferring heat from the electronic component 305 to the heat dissipation member 300 from the first housing 910 to the second housing 920, the heat transfer member 980 can reduce damage to the electronic device 101 due to heat generated from the electronic component 305, and the heat transferred from the electronic component 305 to the heat dissipation member 300 can be dissipated via the second housing 920.

[0216] According to the above embodiments, the electronic device 101 can reduce damage to the electronic device 101 due to heat by including a heat transfer member 980, which is configured to transfer heat generated by the electronic components 305 in the first housing 910 to a second housing 920 rotatably connected to the first housing 910.

[0217] According to the above embodiments, an electronic device (e.g., Figure 1 The electronic device 101 may include electronic components (e.g., Figure 3a Electronic component 305) and heat dissipation components (e.g., at least partially disposed on the electronic component) Figure 3a The heat dissipation component 300 may include a first region facing the electronic components (e.g., Figure 3a The first region 300a), and the second region separated from the first region (e.g., Figure 3a The second region 300b), and the third region (e.g., Figure 3aThe third region 300c), the third region connects the first region and the second region and includes a first flow path for the fluid in a gaseous state (e.g., Figure 3a The first flow path 301) and the second flow path for the fluid in the liquid state (e.g., Figure 3a The second flow path 302). The heat dissipation component may include a first plate (e.g., Figure 3b The first plate 310), and the second plate connected to the first plate (e.g., Figure 3b The second board 320) and the frame (e.g., Figure 3b The framework 330 includes a separation structure (e.g., in the third region) that separates the first and second flow paths. Figure 3a The separation structure 335). The heat dissipation component may include a wick structure for moving fluid within the frame (e.g., Figure 3b The absorbent core structure 340 may include a first absorbent core portion attached to the first plate (e.g., ...). Figure 3b The first absorbent core portion 350) and the second absorbent core portion (e.g., disposed in the second flow path and at least partially inserted between the first absorbent core portion and the second plate) Figure 3b (The second absorbent core portion 360). According to the above embodiment, the heat dissipation member 300 can reduce damage to the electronic device due to heat by dissipating the heat emitted from the electronic component 305. The heat dissipation member 300 can improve its performance by including a separation structure that separates the first flow path and the second flow path. The absorbent core structure can improve the performance of the heat dissipation member by including a second absorbent core portion that is at least partially disposed in the second flow path. The above embodiment can have various effects including the effects described above.

[0218] According to an embodiment, the first suction core portion may include a slit for the separation structure to pass through (e.g., Figure 3b (slit 350a). According to the above embodiment, the first suction core portion can provide space for the separation structure by including the slit. The above embodiment can have various effects including the effects described above.

[0219] According to an embodiment, the frame may further include a first column (e.g., [missing information]) that protrudes from the second plate toward the first plate and contacts the first plate in the first flow path. Figure 4a (First column 410). According to the above embodiment, the frame can reduce damage to the first flow path due to external impacts by including the first column. The above embodiment can have various effects including the effects described above.

[0220] According to an embodiment, the second absorbent core portion can fill the second flow path together with the first absorbent core portion. According to the above embodiment, the performance of the heat dissipation component can be improved by the second absorbent core portion filling the second flow path together with the first absorbent core portion. The above embodiment can have various effects including those described above.

[0221] According to an embodiment, the first absorbent core portion may include a first portion disposed in the first region (e.g., Figure 3b The first part 351), set in the second part of the second area (e.g., Figure 3b The second part 352) and the third part set in the third region (e.g., Figure 3b The third part 353), which connects the first part and the second part, includes a first support region disposed in the first flow path (e.g., Figure 3b The first support region 353a) and the second support region (e.g., provided in the second flow path to support the second plate) Figure 3b (Second support region 353b). According to the above embodiment, the performance of the heat dissipation component can be improved by including a first support region and a second support region. The above embodiment can have various effects including the effects described above.

[0222] According to an embodiment, the frame may further include a first column that protrudes from the second plate toward the first plate in the first flow path and contacts the first support region. According to the above embodiment, the frame can reduce damage to the first flow path due to external impacts by including the first column contacting the first support region. The above embodiment can have various effects including those described above.

[0223] According to an embodiment, the frame may further include a second column (e.g., [missing information]) that protrudes from the second plate toward the first plate and contacts the second support area in the second flow path. Figure 4b The second column 420). The second suction core portion may include multiple through holes in the second flow path for the second column to pass through (e.g., Figure 4b (Multiple through holes 430). According to the above embodiment, the frame can reduce damage to the second flow path due to external impact by including a second column. The above embodiment can have various effects including the effects described above.

[0224] According to an embodiment, the third region can be configured to move gaseous fluid from the first region to the third region via a first flow path, and to move liquid fluid from the second region to the first region via a second flow path. According to the above embodiment, the third region can improve the performance of the heat dissipation component by being configured to circulate fluid within the heat dissipation component. The above embodiments can have various effects, including those described above.

[0225] According to an embodiment, the separation structure can have curvature by being at least partially bent. According to the above embodiment, the separation structure can be configured such that the heat diffusion member is disposed in the electronic device by being at least partially bent. The above embodiment can have various effects including those described above.

[0226] According to one embodiment, the separation structure can contact the second plate by extending from the first plate toward the second plate in the third region. According to the above embodiment, by including the separation structure, the heat dissipation member can improve its performance and reduce damage to the third region due to external impacts. The above embodiment can have various effects including those described above.

[0227] According to one embodiment, the separation structure can contact the first plate by extending from the second plate toward the first plate in the third region. According to the above embodiment, by including the separation structure, the heat dissipation member can improve its performance and reduce damage to the third region due to external impacts. The above embodiment can have various effects including those described above.

[0228] According to an embodiment, the separation structure may include a first protrusion extending from the first plate toward the second plate in the third region (e.g., Figure 6c The first protrusion 610), and the second protrusion facing the first protrusion by extending from the second plate toward the first plate in the third region (e.g., Figure 6c The second protrusion 620), and the adhesive member connecting the first protrusion and the second protrusion (e.g., Figure 6c (Adhesive member 650). According to the above embodiment, by including a separation structure, the heat dissipation member can improve its performance and reduce damage to the third region due to external impact. The above embodiment can have various effects including the effects described above.

[0229] According to one embodiment, the separation structure may include a first support portion (e.g., protruding from the second plate toward the first absorbent core portion) Figure 6d The first support portion 335a) and the second support portion (e.g., connected to the first support portion and at least partially filling the first absorbent core portion) Figure 6d (Second support portion 335b). According to the above embodiment, by including a separation structure, the heat dissipation component can improve its performance and reduce damage to the third region due to external impacts. The above embodiment can have various effects including the effects described above.

[0230] According to an embodiment, the frame may further include at least one recess formed in the separation structure (e.g., Figure 6a(at least one recess 630). According to the above embodiment, by including a separation structure with at least one recess, the heat dissipation member can improve its performance and reduce damage to the third region due to external impact. The above embodiment can have various effects including the effects described above.

[0231] According to embodiments, the wicking structure may include at least one of a mesh wicking core and a sintered wicking core. According to the above embodiments, the wicking structure can improve the performance of the heat dissipation component by including at least one of a mesh wicking core and a sintered wicking core. The above embodiments can have various effects including those described above.

[0232] According to an embodiment, an electronic device may include electronic components and a heat dissipation member at least partially disposed on the electronic components. The heat dissipation member may include: a first region facing the electronic components; a second region spaced apart from the first region; and a third region connecting the first and second regions, and including a first flow path and a second flow path, the first flow path for a gaseous fluid and the second flow path for a liquid fluid. The heat dissipation member may include a frame and a wick structure, the frame including a separation structure in the third region separating the first and second flow paths, and the wick structure for allowing fluid to move within the frame. The wick structure may include a first wick portion and a second wick portion, the first wick portion including a first portion disposed in the first region, a second portion disposed in the second region, and a third portion disposed in the third region and connecting the first and second portions, the second wick portion being disposed in the second flow path and at least partially inserted between the third portion and the frame. According to the above embodiment, the heat dissipation member 300 can reduce damage to the electronic device due to heat by dissipating heat emitted from the electronic components 305. The heat dissipation component 300 can improve its performance by including a separation structure that separates the first flow path and the second flow path. The liquid-absorbing core structure can improve its performance by including a second liquid-absorbing core portion that is at least partially disposed in the second flow path. The above embodiments can have various effects, including those described above.

[0233] According to an embodiment, the second absorbent core portion can fill the second flow path together with the first absorbent core portion. According to the above embodiment, the performance of the heat dissipation component can be improved by the second absorbent core portion filling the second flow path together with the first absorbent core portion. The above embodiment can have various effects including those described above.

[0234] According to an embodiment, the third part may include a first support region disposed in a first flow path and a second support region disposed in a second flow path. The frame may further include: a first plate, with a first absorbent core portion attached to the first plate; a second plate, with a second absorbent core portion attached to the second plate and connected to the first plate; and a first column, which protrudes from the second plate toward the first plate in the first flow path and contacts the first support region. According to the above embodiment, the frame can reduce damage to the first flow path due to external impacts by including the first column contacting the first support region. The above embodiment can have various effects including the effects described above.

[0235] According to an embodiment, the frame may further include a second post that protrudes from the second plate toward the first plate in the second flow path and contacts the second support region. The second absorbent core portion may include a plurality of through holes in the second flow path for the second post to pass through. According to the above embodiment, the frame can reduce damage to the second flow path due to external impacts by including the second post. The above embodiment can have various effects including those described above.

[0236] According to one embodiment, the third region can be configured to move gaseous fluid from the first region to the third region via a first flow path, and to move liquid fluid from the second region to the first region via a second flow path. According to the above embodiment, the third region can improve the performance of the heat dissipation component by being configured to circulate fluid within the heat dissipation component. The above embodiments can have various effects including those described above.

[0237] According to an embodiment, an electronic device (e.g., Figure 1 The electronic device 101 may include a display (e.g., Figure 2a The monitor 201 or Figure 9a Flexible display 930), electronic components (e.g., Figure 3a Electronic components 305) and heat dissipation components (e.g., Figure 3a A heat dissipation component 300 is configured to at least partially overlap with electronic components when viewed from above the display. The heat dissipation component may include a first plate facing the electronic components (e.g., Figure 3b The first board 310), and the second board which is basically oriented towards the first board (e.g., Figure 3b The second plate 320) and the separation structure (e.g., Figure 3a The separation structure 335 is disposed in the internal space between the first plate and the second plate, such that the first flow path (e.g., Figure 3a First flow path 301) and second flow path (e.g., Figure 3a The second flow path 302) is respectively along its first side surface (e.g., Figure 3a The first side surface 330a) and the second side surface opposite to the first side surface (e.g., Figure 3a The second side surface 330b is formed. The heat dissipation component may include a wick structure (e.g., for moving fluid along at least one of a first flow path and a second flow path) for moving fluid. Figure 3b The wick structure 340 may include a first wick portion located in the first flow path and the second flow path (e.g., wick structure 340). Figure 3b The first absorbent core portion 350) and the second absorbent core portion (e.g., located above the portion of the first absorbent core portion corresponding to the second flow path) above the portion of the first absorbent core portion. Figure 3b The second absorbent core part 360).

[0238] According to an embodiment, the first flow path can be configured to allow fluid that has been substantially evaporated by heat generated from electronic components to flow from a first region of the heat dissipation member (e.g., Figure 3a The first region 300a diffuses through the first flow path to the second region opposite to the first region (e.g., Figure 3a (Second region 300b). The second flow path can be configured to diffuse the fluid, which is substantially liquefied in the second region, from the second region to the first region through the second flow path.

[0239] According to one embodiment, the first absorbent core portion can be attached to the first plate. The second absorbent core portion can be attached to the first absorbent core portion.

[0240] According to an embodiment, the separation structure may include a protrusion extending from one of the first plate and the second plate (e.g., Figure 6c The first protrusion 610 or the second protrusion 620).

[0241] According to an embodiment, the protrusion may be formed to contact another of the first plate and the second plate.

[0242] According to the embodiment, the protrusion can be welded to the first liquid-absorbing core portion.

[0243] According to an embodiment, the first absorbent core portion may include a slit corresponding to the separation structure (e.g., Figure 3b (350a) slit.

[0244] According to an embodiment, the heat dissipation component may further include a first column (e.g., Figure 4a The first column 410 protrudes from the second plate toward the first plate within the first flow path and contacts the first absorbent core portion.

[0245] According to an embodiment, the first absorbent core portion may include a plurality of holes corresponding to at least a portion of the space between the first post (e.g., Figure 4cMultiple holes 440).

[0246] According to one embodiment, the second plate may include a plurality of recesses formed along the separation structure within the second flow path. The second absorbent core portion may be configured to fill the recesses.

[0247] According to an embodiment, the absorbent core structure may include a separation portion in which no pores are formed (e.g., Figure 5d The separation portion 340b) is at least a part of the separation structure.

[0248] According to an embodiment, the electronic device 101 may include a first housing that accommodates a heat dissipation component (e.g., Figure 9a The first housing 910), the second housing rotatably connected to the first housing, and the hinge structure connecting the first housing and the second housing (e.g., Figure 9b The hinge structure 950), and the heat transfer member extending from the first housing across the hinge structure to the second housing (e.g., Figure 9d (Heat transfer component 980). The heat dissipation component can be configured such that the first flow path is positioned closer to the heat transfer component than the second flow path.

[0249] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0250] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions for the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “in conjunction with another element (e.g., a second element)” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0251] When used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0252] The various embodiments described herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media can be provided in the form of non-transitory storage media. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between cases where data is stored semi-permanently in the storage medium and cases where data is temporarily stored in the storage medium.

[0253] According to various embodiments, methods according to this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0254] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

Claims

1. An electronic device (101), comprising: Display (201); Electronic components (305); as well as A heat dissipation component (300) is configured to at least partially overlap with the electronic component (305) when viewed from above the display (201); The heat dissipation component (300) includes: The first plate (310) facing the electronic component (305); The second plate (320) is basically facing the first plate (310); A separation structure (335) is disposed in the internal space between the first plate (310) and the second plate (320), such that a first flow path (301) and a second flow path (302) are formed along a first side surface (330a) and a second side surface (330b) opposite to the first side surface (330a), respectively; and A wick structure (340) for moving fluid along at least one of the first flow path (301) or the second flow path (302); and The liquid-absorbing core structure (340) includes: The first absorbent core portion (350) is located in the first flow path (301) and the second flow path (302); and The second absorbent core portion (360) is located above the portion of the first absorbent core portion (350) corresponding to the second flow path (302).

2. The electronic device (101) according to claim 1. in, The first flow path (301) is configured to diffuse the fluid, substantially evaporated by heat generated from the electronic component (305), from a first region (300a) of the heat dissipation member (300) through the first flow path (301) to a second region (300b) opposite to the first region (300a), and The second flow path (302) is configured to allow the fluid, which is substantially liquefied in the second region (300b), to diffuse from the second region (300b) through the second flow path (302) to the first region (300a).

3. The electronic device (101) according to claim 1 or 2. in, The first absorbent core portion (350) is attached to the first plate (310), and The second absorbent core portion (360) is attached to the first absorbent core portion (350).

4. The electronic device (101) according to any one of claims 1 to 3. in, The separation structure (335) includes a protrusion (610, 620) protruding from one of the first plate (310) or the second plate (320).

5. The electronic device (101) according to claim 4. in, The protrusions (610, 620) are formed to contact another of the first plate (310) and the second plate (320).

6. The electronic device (101) according to claim 4. in, The protrusions (610, 620) are welded to the first liquid-absorbing core portion (350).

7. The electronic device (101) according to any one of claims 1 to 6. in, The first absorbent core portion (350) includes a slit corresponding to the separation structure (335).

8. The electronic device (101) according to any one of claims 1 to 7. in, The heat dissipation component (300) further includes a first column (410) that protrudes from the second plate (320) toward the first plate (310) and contacts the first absorbent core portion (350) within the first flow path (301).

9. The electronic device (101) according to claim 8. in, The first absorbent core portion (350) includes a plurality of holes (440) that correspond to at least a portion of the space between the first posts (410).

10. The electronic device (101) according to any one of claims 1 to 9. in, The second plate (320) includes a plurality of recesses formed within the second flow path (302) along the separation structure (335), and The second absorbent core portion (360) is configured to fill the depression.

11. The electronic device (101) according to any one of claims 1 to 10. in, The liquid-absorbing core structure (340) includes a separation portion (340b) as at least part of the separation structure (335), in which no pores are formed.

12. The electronic device (101) according to any one of claims 1 to 11, comprising: A first housing (910) houses the heat dissipation component (300). The second housing (920) is rotatably connected to the first housing (910); A hinge structure (950) connects the first housing (910) and the second housing (920). as well as A heat transfer member (980) extends from the first housing (910) across the hinge structure (950) to the second housing (920). The heat dissipation component (300) is configured such that the first flow path (301) is positioned closer to the heat transfer component (980) than the second flow path (302).

13. The electronic device (101) according to any one of claims 1 to 12. in, The second absorbent core portion (360) is configured to fill the second flow path (302) together with the first absorbent core portion (350).

14. The electronic device (101) according to any one of claims 1 to 13. in, The heat dissipation component (300) further includes a second column (420) that protrudes from the second plate (320) toward the first plate (310) in the second flow path (302) and contacts the first absorbent core portion (350). The second liquid-absorbing core portion (360) includes a plurality of through holes (430) in the second flow path (302), the plurality of through holes (430) being used to allow the second column (420) to pass through.

15. The electronic device (101) according to any one of claims 1 to 14. in, The heat dissipation component (300) is at least partially bent, and The separation structure (335) has curvature by bending at least partially along the heat dissipation member (300).

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