Environment-friendly semiconductor part laser cleaning equipment and method

Abstract

The application relates to an environment-friendly semiconductor part laser cleaning equipment and method and relates to the technical field of semiconductor part cleaning. The equipment comprises a laser cleaning machine and a machining platform, a transmission gear set is rotatably arranged in the machining platform, first rotating seats and second rotating seats are fixed on the two sides of the transmission gear set, adjusting and limiting assemblies are arranged on the side walls of the first rotating seats and the second rotating seats, a blowing seat is slidably arranged on the surface of the machining platform, and a blowing and cleaning assembly is arranged in the blowing seat. According to the different sizes of the parts to be cleaned, the first rotating seats, the second rotating seats, the transmission gear set and the adjusting and limiting assemblies are used for adaptively adjusting the distances between the sucking discs, the sucking discs are uniformly attached to and stably adsorb the edges of the parts, the warping deformation and the cleaning blind area of the thin parts are avoided from the root, the blowing seat and the blowing and cleaning assembly are used for blowing and cleaning the surfaces of the parts in the cleaning process, and the particles are prevented from being retained on the surfaces of the parts.

Description

Technical Field

[0001] This invention relates to the field of semiconductor component cleaning technology, specifically to an environmentally friendly laser cleaning device and method for semiconductor components. Background Technology

[0002] Laser cleaning equipment for semiconductor components is a core cleanroom tool adapted to the development of advanced semiconductor manufacturing processes. In chip manufacturing, during wafer fabrication, the surfaces of components inside the equipment cavity become contaminated with plating, requiring periodic disassembly and cleaning. The precision and safety of the cleaning equipment are key constraints on production capacity and yield. Currently, the semiconductor industry still primarily uses wet cleaning methods, but this method relies on chemical solutions, which can easily lead to cross-contamination of components, generate large amounts of environmentally friendly waste liquid with high processing costs, and is difficult to adapt to the fine cleaning requirements of advanced processes. Therefore, laser cleaning equipment for semiconductor components has become a key solution to address these industry pain points. This equipment relies on… The precision and non-contact nature of laser technology breaks through the technical bottlenecks of traditional cleaning, adapting to the cleaning needs of semiconductor parts from mature to advanced processes. It eliminates the need for chemical agents, avoiding pollution and waste liquid treatment costs from the source. It has outstanding advantages of low energy consumption, low cost, and safety and environmental protection, and meets international laser safety standards. First, the vision system scans the surface of the part to accurately locate the contaminants. Then, based on the part substrate and the type of contamination, it intelligently matches parameters such as laser power and spot size. Finally, it uses a pulsed laser beam to act on the contaminated area, causing the contaminants to vaporize or peel off instantly, completing precise cleaning without damage or pollution.

[0003] However, existing laser cleaning equipment for parts typically places the parts directly on a support platform for surface cleaning. During laser cleaning, the instantaneous energy of the pulsed laser creates localized forces on the part surface. Thin parts, due to their weak resistance to deformation, are prone to uneven deformation at the edges, causing the laser spot to fail to uniformly cover the entire part surface, thus creating cleaning blind spots. Contaminants in these blind spots are difficult to effectively remove, affecting the uniformity of cleaning. At the same time, the nano-sized particles removed by the laser tend to remain suspended around the cleaning area. Due to intermolecular forces such as electrostatic forces on the part surface, these suspended nano-particles may re-adsorb onto the part surface, causing secondary contamination and resulting in substandard part cleanliness.

[0004] To address the aforementioned issues, innovative design based on existing methods is urgently needed. Summary of the Invention

[0005] The purpose of this invention is to provide an environmentally friendly laser cleaning device and method for semiconductor parts, in order to solve the problems mentioned in the background art, such as the easy deformation of thin parts leading to cleaning blind spots and the potential secondary pollution caused by suspended nanoparticles. The technical solution of this invention addresses the problem that the existing technical solutions are too simplistic and provides a solution that is significantly different from the existing technology.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an environmentally friendly laser cleaning equipment and method for semiconductor parts, comprising a laser cleaning machine and a processing platform, wherein a transmission gear set is rotatably installed inside the processing platform, and a first rotating seat and a second rotating seat are respectively fixed on both sides of the transmission gear set, and adjustment and limiting components are provided on the side walls of the first rotating seat and the second rotating seat; an air blowing seat is slidably installed on the surface of the processing platform, and an air blowing cleaning component is provided inside the air blowing seat; The adjusting and limiting assembly includes a rotating groove formed on the surface of the first rotating seat and a movable seat slidably installed in the processing platform. A movable rod is fixed to the bottom end of the movable seat, and a movable block is fixed to the end of the movable rod. Multiple suction cups are provided on the surface of the movable seat. It also includes a first fixed seat fixed in the processing platform. A limiting groove is formed on the surface of the first fixed seat. It also includes three traction connecting rods rotatably installed on the side wall of the second rotating seat. An adjusting block is rotatably installed at the end of the traction connecting rod. It also includes a second fixed seat fixed in the processing platform. A guide groove is formed on the surface of the second fixed seat.

[0007] Preferably, the surface of the processing platform is provided with multiple moving grooves, the bottoms of the multiple suction cups are located in the moving grooves, and the moving grooves are designed to be inclined.

[0008] Preferably, the moving rod is located in the limiting groove, the moving block is located in the rotating groove, and the rotating groove is designed with an arc.

[0009] Preferably, the traction connecting rod has an arc design, and the adjusting block is slidably installed in the guide groove.

[0010] Preferably, the air-blowing cleaning assembly includes a drive shaft rotatably mounted inside the air-blowing seat, an adjusting seat slidably mounted on the surface of the drive shaft, a guide block fixed at the end of the drive shaft, a rotating block rotatably mounted on the side wall of the guide block, a transmission block disposed inside the guide block, and a limiting shaft rotatably mounted inside the air-blowing seat. An air-blowing port is fixed on the surface of the limiting shaft, a swing seat is fixed on the side wall of the air-blowing port, and a transmission seat is rotatably mounted on the side wall of the swing seat.

[0011] Preferably, the end of the adjusting block is located inside the air blowing seat, and the adjusting block is rotatably connected to the adjusting seat.

[0012] Preferably, the end of the drive shaft is connected to a drive motor, the guide block has an arc design, and the transmission seat is connected to the transmission block.

[0013] Preferably, the rotating block is designed in an L-shape, and an adjustment seat and a transmission seat are slidably connected to both ends of the rotating block, respectively.

[0014] Preferably, the method includes the following steps: S1: Place the part to be cleaned on the processing platform, push the moving seat to make the suction cups adhere to the bottom of the part, and use the inclined moving groove to ensure that the suction cups are evenly distributed; S2: The transmission gear set drives the adjustment block to move, which in turn pushes the adjustment seat to move along the drive shaft. The L-shaped rotating block drives the transmission seat to move, thereby adjusting the swing amplitude of the swing seat and adapting the airflow range to the size of the parts. S3: Start the drive motor to drive the drive shaft to rotate, and use the air blowing cleaning component to make the air blowing nozzle swing back and forth, so that the airflow evenly covers the entire area of ​​the parts, and cleans up the fallen particles in time to avoid retention.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention, through the setting of a first rotating seat, a second rotating seat, a transmission gear set, and an adjustment limiting component, adaptively adjusts the suction cup spacing according to the different sizes of the parts to be cleaned, so that the suction cups evenly adhere to and firmly adsorb the edges of the parts, offsetting the instantaneous impact force during laser cleaning, fundamentally preventing thin parts from warping and deformation and cleaning blind spots. At the same time, by adjusting the position of the adjusting block, the swing amplitude of the air blowing cleaning component is controlled, optimizing the blowing range, improving the blowing efficiency of detached nano-sized particles, reducing the risk of secondary particle adhesion, and ensuring that the cleanliness of the parts meets the standards after cleaning.

[0016] 2. In this invention, by setting up an air-blowing seat and an air-blowing cleaning component, after adjusting the position of the adjusting seat according to the part to be cleaned, the drive motor drives the drive shaft to rotate, thereby driving the air-blowing nozzle to reciprocate and swing, so that the airflow can evenly cover the entire surface of the part, and blow clean the surface of the part during cleaning, avoiding particles from remaining on the surface of the part, improving the targeting and effectiveness of the blowing and cleaning, and reducing the possibility of secondary particle adhesion. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the processing platform of the present invention; Figure 3 This is a schematic diagram of the processing platform and moving trough of the present invention; Figure 4 This is a cross-sectional view of the processing platform of the present invention; Figure 5 This is a schematic diagram showing the disassembled structure of the first fixed seat, the movable seat, and the first rotating seat of the present invention; Figure 6 This is a schematic diagram showing the split structure of the first fixed seat, the movable seat, and the first rotating seat from another perspective of the present invention; Figure 7 This is a schematic diagram showing the disassembled structure of the second fixed seat and the second rotating seat of the present invention; Figure 8This is a cross-sectional view of the air-blowing seat of the present invention; Figure 9 This is a schematic diagram of the air-blowing cleaning component of the present invention; Figure 10 This is a schematic diagram of the air-blowing cleaning component from another perspective of the present invention.

[0018] In the diagram: 1. Laser cleaning machine; 101. Processing platform; 102. Moving groove; 2. Moving seat; 201. Moving block; 202. Suction cup; 203. Moving rod; 3. First fixed seat; 301. Limiting groove; 302. First rotating seat; 303. Rotating groove; 304. Transmission gear set; 4. Second fixed seat; 401. Guide groove; 5. Second rotating seat; 501. Pulling rod; 502. Adjusting block; 6. Air blowing seat; 7. Drive shaft; 701. Guide block; 702. Rotating block; 703. Transmission seat; 704. Transmission block; 8. Adjusting seat; 9. Swing seat; 901. Limiting shaft; 902. Air blowing port. Detailed Implementation

[0019] To further illustrate the technical means and effects adopted by the present invention in order to achieve the intended purpose, the following detailed description is provided in conjunction with the accompanying drawings and preferred embodiments, based on the specific implementation methods, structures, features and effects of the present invention.

[0020] Please see Figures 1-10 This invention provides a technical solution: an environmentally friendly laser cleaning equipment and method for semiconductor parts, including a laser cleaning machine 1 and a processing platform 101. The laser is used as the core cleaning source, eliminating the need for strong acids, strong alkalis, or other chemical agents. This avoids pollution problems such as chemical waste discharge and agent residue in traditional wet cleaning methods, ensuring the safety of operators. A transmission gear set 304 is rotatably installed inside the processing platform 101. A first rotating seat 302 and a second rotating seat 5 are fixed on both sides of the transmission gear set 304, respectively. Adjustment and limiting components are provided on the side walls of the first rotating seat 302 and the second rotating seat 5. The drive suction cup 202 is evenly attached to the edge of the part, firmly adsorbing it to offset the laser impact force and prevent warping of thin parts. An air blowing seat 6 is slidably installed on the surface of the processing platform 101. An air blowing cleaning component is provided inside the air blowing seat 6, and its position and blowing range are precisely adjusted with the adjustment block 502. The adjusting and limiting assembly includes a rotating groove 303 formed on the surface of the first rotating seat 302, and a movable seat 2 slidably installed in the processing platform 101. A movable rod 203 is fixed at the bottom of the movable seat 2, and a movable block 201 is fixed at the end of the movable rod 203. Multiple suction cups 202 are provided on the surface of the movable seat 2. It also includes a first fixed seat 3 fixed in the processing platform 101. A limiting groove 301 is formed on the surface of the first fixed seat 3. It also includes three pulling rods 501 rotatably installed on the side wall of the second rotating seat 5. An adjusting block 502 is rotatably installed at the end of the pulling rod 501. It also includes a second fixed seat 4 fixed in the processing platform 101. A guide groove 401 is formed on the surface of the second fixed seat 4.

[0021] As one embodiment of the present invention, the surface of the processing platform 101 is provided with a plurality of moving grooves 102, the bottom of a plurality of suction cups 202 is located in the moving grooves 102, the moving grooves 102 are inclined, and the plurality of moving grooves 102 provide moving guides for the suction cups 202, so that the suction cups 202 automatically adjust the spacing when they move with the moving seat 2.

[0022] In one embodiment of the present invention, the moving rod 203 is located in the limiting groove 301 and can only move linearly along the limiting groove 301 to avoid the moving rod 203 from shaking or deviating. The moving block 201 is located in the rotating groove 303, which is designed with an arc. The moving block 201 is placed in the rotating groove 303 with an arc design. When it moves linearly with the moving rod 203, it squeezes the groove wall of the rotating groove 303, converting the linear translation of the moving seat 2 into the rotational motion of the first rotating seat 302.

[0023] As one embodiment of the present invention, the traction link 501 is designed with an arc to avoid motion interference and jamming. The adjustment block 502 is slidably installed in the guide groove 401. The adjustment block 502 slides linearly along the guide groove 401. The position of the adjustment seat 8 is adjusted in conjunction with parts of different diameters to change the blowing range of the air cleaning component and achieve adaptive matching for parts of multiple sizes.

[0024] In one embodiment of the present invention, the air blowing cleaning assembly includes a drive shaft 7 rotatably mounted inside the air blowing seat 6, an adjusting seat 8 slidably mounted on the surface of the drive shaft 7, a guide block 701 fixed at the end of the drive shaft 7, a rotating block 702 rotatably mounted on the side wall of the guide block 701, a transmission block 704 disposed inside the guide block 701, and a limiting shaft 901 rotatably mounted inside the air blowing seat 6, an air blowing port 902 fixed on the surface of the limiting shaft 901, a swing seat 9 fixed on the side wall of the air blowing port 902, and a transmission seat 703 rotatably mounted on the side wall of the swing seat 9.

[0025] In one embodiment of the present invention, the end of the adjusting block 502 is located inside the air blowing seat 6. The adjusting block 502 is rotatably connected to the adjusting seat 8. When the adjusting block 502 slides linearly with the pulling rod 501, it pushes the adjusting seat 8 to slide along the drive shaft 7.

[0026] In one embodiment of the present invention, a drive motor is connected to the end of the drive shaft 7 to provide stable rotational power for the entire air blowing cleaning assembly. The guide block 701 has an arc design, and the transmission seat 703 is connected to the transmission block 704. When the rotating block 702 drives the transmission block 704 to change position within the guide block 701, the connection between the transmission seat 703 and the transmission block 704 can ensure that the position adjustment is synchronously transmitted to the transmission block 704, thereby accurately changing the swing amplitude of the drive shaft 7.

[0027] As one embodiment of the present invention, the rotating block 702 is designed in an L-shape. The two ends of the rotating block 702 are slidably connected to the adjusting seat 8 and the transmission seat 703, respectively. The L-shaped rotating block 702 can change the position of the transmission seat 703 and the transmission block 704 in the guide block 701 by using the linear movement of the adjusting seat 8, thereby adjusting the swing amplitude of the swing seat 9, the limiting shaft 901 and the air outlet 902.

[0028] As one embodiment of the present invention, the method includes the following steps: S1: Place the part to be cleaned on the processing platform 101, push the moving seat 2 to make the suction cup 202 fit the bottom of the part, and use the inclined moving groove 102 to ensure that the suction cup 202 is evenly distributed; S2: The transmission gear set 304 drives the adjustment block 502 to move, pushes the adjustment seat 8 to translate along the drive shaft 7, drives the transmission seat 703 to move through the L-shaped rotating block 702, and adjusts the swing amplitude of the swing seat 9 so that the airflow range can be adapted to the size of the parts. S3: Start the drive motor to drive the drive shaft 7 to rotate, and the air blowing cleaning component makes the air blowing nozzle 902 swing back and forth, so that the airflow evenly covers the entire area of ​​the part and cleans up the fallen particles in time to avoid retention.

[0029] Working principle: When using this environmentally friendly semiconductor component laser cleaning equipment and method, the component to be cleaned is first placed on the processing platform 101 of the laser cleaning machine 1. Then, the moving seat 2 is pushed so that the moving seat 2 moves the suction cup 202 close to and adheres to the bottom of the component. Since the bottom end of the suction cup 202 is embedded in the moving groove 102 opened on the surface of the processing platform 101, and the moving groove 102 is designed to be inclined, the suction cup 202 automatically adjusts its position under the limiting and guiding action of the moving groove 102 as it moves with the moving seat 2, ensuring that multiple suction cups 202 are always evenly distributed at the bottom of the component, thus improving the adsorption stability of the component. The movable rod 203 fixed at the bottom of the movable seat 2 moves synchronously along the limiting groove 301 opened on the surface of the first fixed seat 3, following the movable seat 2. Since the movable block 201 fixed at the end of the movable rod 203 is located in the rotating groove 303 opened on the surface of the first rotating seat 302, and the rotating groove 303 is designed with an arc, when the movable block 201 slides with the movable rod 203, its side wall presses against the inner wall of the rotating groove 303, driving the first rotating seat 302 to rotate around its own axis. The side wall of the first rotating seat 302 is fixed with a transmission gear set 304 connected to the second rotating seat 5. Under the meshing transmission action of the transmission gear set 304, the first rotating seat 302 and the second rotating seat 5 rotate synchronously in opposite directions. When the second rotating seat 5 rotates, the adjusting block 502 moves synchronously along the guide groove 401 opened on the surface of the second fixed seat 4 through the pulling rod 501, completing the linkage adjustment of the adjusting limiting component and the air blowing cleaning component. When the position adjustment of the limiting component is completed, the end of the adjusting block 502 is located at the air blowing seat 6, and the adjusting block 502 is rotatably connected to the adjusting seat 8. While the adjusting block 502 moves along the guide groove 401, it drives the adjusting seat 8 to move along the drive shaft 7. Since the rotating block 702 is L-shaped, and the two ends of the rotating block 702 are slidably connected to the adjusting seat 8 and the transmission seat 703 respectively, when the adjusting seat 8 moves, it drives the rotating block 702 to rotate around the fixed fulcrum of the side wall of the guide block 701, pushing the transmission seat 703 to change the relative position with the guide block 701, thereby changing the swing amplitude of the subsequent swing seat 9, ensuring that the air blowing range matches the size of the part, and avoiding the occurrence of blind spots in the blowing. The cleaning process begins without the need for strong acids or other chemical agents, avoiding waste liquid discharge and chemical loss. The drive motor is then started, causing the drive shaft 7 to rotate at a constant speed. The continuous rotation of the drive shaft 7 stably transmits power to the guide block 701. Since the transmission block 704 inside the guide block 701 is connected to the transmission seat 703, the transmission seat 703 is displaced under the drive of the transmission block 704. This displacement, via the swing seat 9, pulls the limiting shaft 901 and the air nozzle 902 to swing back and forth regularly around a fixed fulcrum. This allows the airflow from the air nozzle 902 to evenly cover the entire surface of the part, cleaning the surface of the part and preventing particles from remaining on the surface. The entire process leaves no chemical residue, avoids the risk of chemical corrosion, eliminates waste liquid treatment costs, reduces consumable costs, and is safe and environmentally friendly.

[0030] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. An environmentally friendly laser cleaning device for semiconductor components, comprising a laser cleaning machine (1) and a processing platform (101), characterized in that: A transmission gear set (304) is rotatably installed inside the processing platform (101). A first rotating seat (302) and a second rotating seat (5) are fixed on both sides of the transmission gear set (304). Adjustment and limiting components are provided on the side walls of the first rotating seat (302) and the second rotating seat (5). An air blowing seat (6) is slidably installed on the surface of the processing platform (101). An air blowing cleaning component is provided inside the air blowing seat (6). The adjustment and limiting assembly includes a rotating groove (303) formed on the surface of the first rotating seat (302) and a movable seat (2) slidably installed in the processing platform (101). A movable rod (203) is fixed at the bottom of the movable seat (2) and a movable block (201) is fixed at the end of the movable rod (203). A plurality of suction cups (202) are provided on the surface of the movable seat (2). It also includes a first fixed seat (3) fixed in the processing platform (101). A limiting groove (301) is formed on the surface of the first fixed seat (3). It also includes three pulling rods (501) rotatably installed on the side wall of the second rotating seat (5). An adjustment block (502) is rotatably installed at the end of the pulling rod (501). It also includes a second fixed seat (4) fixed in the processing platform (101). A guide groove (401) is formed on the surface of the second fixed seat (4).

2. The environmentally friendly laser cleaning equipment for semiconductor components according to claim 1, characterized in that: The processing platform (101) has multiple moving grooves (102) on its surface. The bottom of the suction cup (202) is located in the moving groove (102), and the moving groove (102) is designed to be inclined.

3. The environmentally friendly laser cleaning equipment for semiconductor components according to claim 1, characterized in that: The moving rod (203) is located in the limiting groove (301), and the moving block (201) is located in the rotating groove (303), which is designed with an arc.

4. The environmentally friendly laser cleaning equipment for semiconductor components according to claim 1, characterized in that: The traction link (501) is designed with an arc, and the adjusting block (502) is slidably installed in the guide groove (401).

5. The environmentally friendly laser cleaning equipment for semiconductor components according to claim 1, characterized in that: The air-blowing cleaning assembly includes a drive shaft (7) rotatably mounted inside the air-blowing seat (6), an adjustment seat (8) slidably mounted on the surface of the drive shaft (7), a guide block (701) fixed at the end of the drive shaft (7), a rotating block (702) rotatably mounted on the side wall of the guide block (701), a transmission block (704) provided inside the guide block (701), and a limiting shaft (901) rotatably mounted inside the air-blowing seat (6), an air-blowing port (902) fixed on the surface of the limiting shaft (901), a swing seat (9) fixed on the side wall of the air-blowing port (902), and a transmission seat (703) rotatably mounted on the side wall of the swing seat (9).

6. The environmentally friendly laser cleaning equipment for semiconductor components according to claim 5, characterized in that: The end of the adjusting block (502) is located inside the air blowing seat (6), and the adjusting block (502) is rotatably connected to the adjusting seat (8).

7. The environmentally friendly laser cleaning equipment for semiconductor components according to claim 5, characterized in that: The drive shaft (7) is connected to a drive motor at its end. The guide block (701) has an arc design. The transmission seat (703) is connected to the transmission block (704).

8. The environmentally friendly laser cleaning equipment for semiconductor components according to claim 5, characterized in that: The rotating block (702) is designed in an L-shape, and the two ends of the rotating block (702) are slidably connected to the adjusting seat (8) and the transmission seat (703).

9. A method of using an environmentally friendly laser cleaning equipment for semiconductor components, applicable to the environmentally friendly laser cleaning equipment for semiconductor components as described in any one of claims 1-8, characterized in that: The method includes the following steps: S1: Place the part to be cleaned on the processing platform (101), push the moving seat (2) to make the suction cup (202) fit against the bottom of the part, and use the inclined moving groove (102) to ensure that the suction cup (202) is evenly distributed; S2: The transmission gear set (304) drives the adjustment block (502) to move, pushes the adjustment seat (8) to translate along the drive shaft (7), drives the transmission seat (703) to displacement through the L-shaped rotating block (702), and adjusts the swing amplitude of the swing seat (9) so that the airflow range is adapted to the size of the parts; S3: Start the drive motor to drive the drive shaft (7) to rotate, and make the air nozzle (902) swing back and forth through the air blowing cleaning component. The airflow evenly covers the entire area of ​​the part, and cleans up the fallen particles in time to avoid retention.

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