Quartz purification method and quartz purification system
By using a stepwise immersion method with a single acid solution and ultrasonic oscillation treatment, the problem of residual impurities caused by mixed acids and hydrofluoric acid was solved, achieving the acquisition of high-purity quartz and improving safety, while reducing operational risks and environmental impact.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- FULL CHAIN MATERIALS INTL CO LTD
- Filing Date
- 2024-11-29
- Publication Date
- 2026-05-29
AI Technical Summary
In existing quartz purification methods, the mutual interference of mixed acids and the toxicity and corrosiveness of hydrofluoric acid lead to residual impurities, making it difficult to achieve high purity and posing safety risks.
A stepwise immersion method using a single acid solution is employed, employing hydrochloric acid, nitric acid, phosphoric acid, hydrogen peroxide, and sulfuric acid solutions to leach the quartz, combined with ultrasonic vibration and drying treatment to avoid adverse reactions and improve purity.
Without using hydrofluoric acid, the purity of quartz is increased to four nines, reducing safety risks, minimizing environmental pollution, extending equipment life, and lowering costs.
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Figure CN122102142A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to a quartz purification method and a quartz purification system. Background Technology
[0002] In the field of quartz purification, mixed acids are commonly used to treat quartz ore. However, the various acids in a mixed acid solution can easily interfere with each other, making it impossible to completely remove certain impurities and thus affecting the final purity of the quartz. Furthermore, the mixed acid may react with impurities during the reaction to form byproducts that are difficult to remove. These byproducts tend to remain on the surface or inside the quartz, leading to a decrease in purity and failing to achieve the desired purification effect.
[0003] On the other hand, hydrofluoric acid is also commonly used to treat quartz ore in the field of quartz purification. However, although hydrofluoric acid is effective in removing some impurities, its lack of oxidizing properties makes it less effective at removing certain types of impurities, which may leave these impurities in the quartz, preventing the achievement of higher purity standards. Furthermore, hydrofluoric acid is highly toxic; its volatile and corrosive gases pose a significant threat to operators and the environment, increasing the risks and safety management difficulties of the operation process. Its strong etching effect can also damage the surface structure of quartz, further affecting its purity and material stability. Therefore, how to provide a method for obtaining high-purity quartz without using hydrofluoric acid is a topic of active research in the field. Summary of the Invention
[0004] According to one or more embodiments of this disclosure, a quartz purification method includes: a quartz pulverization step; a pulverization grinding step; a preliminary cleaning and magnetic separation step for the ground quartz; an acid leaching step for the magnetically separated quartz, which includes placing the magnetically separated quartz in five solutions in any order, wherein the five solutions are hydrochloric acid solution, nitric acid solution, phosphoric acid solution, hydrogen peroxide solution and sulfuric acid solution; a shaking step for the acid-leached quartz; and a drying step for the shaken quartz.
[0005] In one or more embodiments disclosed herein, in the acid leaching step, the first solution and the last solution in which the quartz is placed are each selected from the group consisting of hydrochloric acid solution, nitric acid solution and sulfuric acid solution, and the first solution and the last solution are different.
[0006] In one or more embodiments disclosed herein, in the acid leaching step, the magnetically separated quartz is placed sequentially in hydrochloric acid solution, nitric acid solution, phosphoric acid solution, hydrogen peroxide solution and sulfuric acid solution.
[0007] In one or more embodiments disclosed herein, the molar concentration of each of the five solutions is 4M to 6M.
[0008] In one or more embodiments disclosed herein, the temperature of each of the five solutions is between 70°C and 100°C.
[0009] In one or more embodiments of this disclosure, the ground quartz is placed in each of the five solutions for 30 to 60 minutes.
[0010] In one or more embodiments of this disclosure, the quartz purification method further includes placing the acid-soaked quartz in pure water for a washing step before performing the shaking step.
[0011] According to one or more embodiments of this disclosure, a quartz purification system includes a crushing device, a grinding device, a preliminary cleaning and magnetic separation device, five acid leaching devices, a drying device, and a conveying device. The five acid leaching devices include a hydrochloric acid solution tank, a nitric acid solution tank, a phosphoric acid solution tank, a hydrogen peroxide solution tank, and a sulfuric acid solution tank. The conveying device sequentially passes through the crushing device, the grinding device, the preliminary cleaning and magnetic separation device, each of the five acid leaching devices, a shaking device, and the drying device.
[0012] In one or more embodiments disclosed herein, the conveying device sequentially passes through a hydrochloric acid solution tank, a nitric acid solution tank, a phosphoric acid solution tank, a hydrogen peroxide solution tank, and a sulfuric acid solution tank.
[0013] In one or more embodiments disclosed herein, the oscillation device is an ultrasonic oscillator of 250 watts to 350 watts.
[0014] According to the embodiments described above, the quartz purification method disclosed herein can increase the purity of quartz to four nines (99.9 ... Attached Figure Description
[0015] To make the above and other objects, features, advantages and embodiments disclosed herein more apparent and understandable, the accompanying drawings are described below:
[0016] Figure 1 This is a schematic flowchart of a quartz purification method according to some embodiments of this disclosure;
[0017] Figure 2 This is a schematic diagram of the configuration of a quartz purification system according to some embodiments of this disclosure.
[0018] Figure label:
[0019] S10~S60: Steps
[0020] 100: Quartz Purification System
[0021] 110: Crushing device
[0022] 120: Grinding device
[0023] 130: Acid leaching apparatus
[0024] 130a: Hydrochloric acid solution tank
[0025] 130b: Nitric acid solution tank
[0026] 130c: Phosphoric acid solution tank
[0027] 130d: Hydrogen peroxide solution tank
[0028] 130e: Sulfuric acid solution tank
[0029] 140: Oscillating device
[0030] 150: Drying device
[0031] 160: Conveying device
[0032] 170: Preliminary cleaning and magnetic separation device Detailed Implementation
[0033] The following describes several embodiments of this disclosure with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. That is, in some embodiments of this disclosure, these practical details are not essential and therefore should not be used to limit this disclosure. Furthermore, for the sake of simplicity in the drawings, some known and conventional structures and components will be shown in a simple schematic manner. In addition, for the reader's convenience, the dimensions of the components in the drawings are not drawn to scale.
[0034] It should be understood that although the terms "first," "second," and "third," etc., may be used herein to describe various components, parts, regions, layers, and / or portions, these components, parts, regions, and / or portions should not be limited by these terms. These terms are used only to distinguish one component, part, region, layer, or portion from another component, part, region, layer, or portion. Therefore, "first component," "part," "region," "layer," or "part" as used below may also be referred to as a second component, part, region, layer, or portion without departing from the teachings of this document.
[0035] This disclosure provides a quartz purification method that can improve the purity of quartz to Four Nines Purity without the use of hydrofluoric acid (HF). This achieves high-purity quartz while reducing operator safety risks, minimizing environmental pollution, extending equipment lifespan, and lowering purification costs. Furthermore, this disclosure provides a quartz purification system to implement the disclosed quartz purification method.
[0036] Please see Figure 1 This is a flowchart of a quartz purification method according to some embodiments of the present disclosure. The quartz purification method includes steps S10 to S60. In step S10, the quartz is crushed. In step S20, the crushed quartz is ground. In step S30, the ground quartz is preliminarily cleaned and magnetically separated. In step S40, the magnetically separated quartz is acid-leached, including placing the magnetically separated quartz in five solutions in any order, wherein the five solutions are hydrochloric acid solution, nitric acid solution, phosphoric acid solution, hydrogen peroxide solution, and sulfuric acid solution. In step S50, the acid-leached quartz is shaken. In step S60, the shaken quartz is dried. In the following description, the above steps will be described in sequence. First, in step S10, the quartz is crushed. In some embodiments, single-step crushing can be performed, directly crushing large pieces of quartz ore to a suitable particle size for grinding (e.g., a particle size of 0.5 mm to 15 mm). Single-step crushing simplifies the processing flow and improves efficiency, and is suitable for cases where the raw quartz ore is brittle. In other embodiments, multi-step crushing can also be performed, progressively crushing large pieces of quartz ore to a suitable particle size for grinding. For example, multi-step crushing may include a coarse crushing step, an intermediate crushing step, and a fine crushing step, where the coarse crushing step can crush the quartz to a particle size of 10 mm to 15 mm, the intermediate crushing step can crush the quartz to a particle size of 5 mm to 9 mm, and the fine crushing step can crush the quartz to a particle size of 0.5 mm to 3 mm. Multi-step crushing can effectively reduce equipment wear and energy waste caused by processing too much material at a time or by a large particle size range. In addition, multi-step operation can help to precisely control the particle size distribution, reduce the risk of over-crushing, thereby improving the quality of the final quartz and production efficiency.
[0037] Next, in step S20, the pulverized quartz undergoes a grinding step. Specifically, grinding after pulverizing the quartz further refines the particles and improves particle size uniformity, thereby enhancing mixability and the reaction rate of the quartz in the subsequent acid leaching step. During grinding, the surface area of the particles increases, which helps remove impurities from the quartz in the subsequent acid leaching step. In some embodiments, the ground quartz can be passed through a 100-mesh to 200-mesh sieve (e.g., 120-mesh, 140-mesh, 160-mesh, and 180-mesh). This results in fine and uniform particles and an increased surface area, improving magnetic separation efficiency in the subsequent magnetic separation step and promoting contact between the quartz and acid in the subsequent acid leaching step, thereby increasing the purity of the quartz.
[0038] Subsequently, in step S30, the ground quartz undergoes preliminary cleaning and magnetic separation. Specifically, the quartz is first cleaned with pure water, and then an external strong magnetic field is used to adsorb iron-based substances from the quartz. In some embodiments, a magnetic separator can be used for the magnetic separation step, and the strength of the magnetic field can be from 0.1 texela to 1.5 texela (e.g., 0.2 texela, 0.4 texela, 0.6 texela, 0.8 texela, 1.0 texela, 1.2 texela, 1.4 texela). The specific strength depends on the content and nature of the iron impurities in the quartz ore; generally, a higher iron content requires a higher magnetic field strength. In some embodiments, the preliminary cleaning and magnetic separation steps can be performed at room temperature to increase the magnetization of the magnetic substances (impurities). Overall, after completing the preliminary cleaning and magnetic separation steps, the content of iron-based substances (iron impurities) in the quartz can be significantly reduced.
[0039] Subsequently, in step S40, the magnetically separated quartz undergoes an acid leaching step. The acid leaching step primarily utilizes the chemical properties of acid to remove impurities and impurities from the quartz material. During acid leaching, the magnetically separated quartz is immersed in an acid solution (i.e., an aqueous solution containing acid). The impurities and impurities react with the acid in the solution to form soluble compounds, thereby being removed. Furthermore, the acid leaching step also helps improve the surface smoothness of the quartz and modify the particle morphology, further enhancing the quality of the purified quartz.
[0040] In this disclosure, by immersing magnetically separated quartz in a single acid solution, the purity of quartz can be increased to four nines (99.99%) without using highly toxic hydrofluoric acid. Specifically, this disclosure uses five acid solutions—hydrochloric acid, nitric acid, phosphoric acid, hydrogen peroxide, and sulfuric acid—for the acid leaching step of the magnetically separated quartz. The magnetically separated quartz is placed in these five acid solutions in any order, ensuring that the quartz is exposed to only one acid solution at a time. For example, the quartz can be placed in the following order: hydrochloric acid, nitric acid, phosphoric acid, hydrogen peroxide, and sulfuric acid. As another example, the quartz can be placed in the following order: sulfuric acid, nitric acid, phosphoric acid, hydrogen peroxide, and hydrochloric acid. Compared to directly immersing the quartz in a mixed acid solution for the acid leaching step, this disclosure offers several advantages by immersing the quartz in only one acid solution at a time, as listed below.
[0041] [Control Reactivity]
[0042] Soaking in a single acid allows for more precise control of reactivity. Specifically, since each acid has a different dissolution rate for different impurities in quartz, selecting the appropriate single acid not only removes specific impurities and adjusts the reaction rate as needed, but also avoids uneven reactions and optimizes soaking time and concentration, thereby achieving better cleaning or impurity removal results.
[0043] [Avoid adverse reactions]
[0044] Soaking in a single acid can avoid adverse reactions. Specifically, chemical reactions between different acids can lead to precipitation, gas release, or other side reactions, resulting in the formation of undesirable products and affecting the pickling effect. By using only a single acid at a time, the probability of these potential adverse reactions can be reduced.
[0045] [Increase purity]
[0046] Soaking in a single acid can improve the final purity of the quartz. Specifically, each acid has a specific solubility for different types of impurities, and using a single acid allows for targeted removal of the desired impurities, thus reducing the risk of secondary contamination, which is especially important in applications requiring high purity. Furthermore, mixed acids can affect the crystal structure of quartz, leading to changes in the material's physical and chemical properties, while a single acid does not affect the chemical structure of quartz.
[0047] [Simplified Process]
[0048] Single-acid immersion simplifies the process. Specifically, using mixed acids requires precise calculation of the proportions of each acid to avoid uneven mixing or over-reaction, while using a single acid only requires controlling its concentration and dosage. This makes immersion conditions easier to standardize and adjust, further reducing process variables and the complexity of parameter settings. Furthermore, single-acid systems are simpler to manage and monitor, eliminating the need for compatibility with multi-acid systems and contributing to improved overall process reliability and production efficiency.
[0049] [Improve security]
[0050] Soaking in a single acid can improve operational safety. Specifically, mixed acids may release toxic gases or trigger thermal reactions during operation, increasing the danger of the experiment. Using a single acid can reduce this risk, making the experiment safer.
[0051] [Improve repeatability]
[0052] Single-acid immersion improves process repeatability. Specifically, in mixed-acid systems, interactions between different acids can cause fluctuations in multiple variables, such as reaction rate, temperature, and acidity, affecting the results of each batch. A single acid, with its stable and highly controllable chemical properties, eliminates these variables, allowing for precise control of acid concentration, temperature, and reaction time in each treatment, ensuring consistent and stable results across batches. Furthermore, in single-acid systems, experimental parameters and operating conditions are easier to standardize, which is crucial for quality control in industrial production. This helps reduce quality fluctuations caused by impurities or material inhomogeneities, ultimately improving the predictability and reproducibility of process results.
[0053] Overall, as mentioned above, immersing quartz in only one acid solution at a time allows for better control of reactivity, avoids adverse reactions, improves quartz purity, simplifies the process, enhances operational safety, and improves process repeatability. It should be noted that regardless of the order in which the quartz is immersed in these five acid solutions, a purity of four nines can be achieved. Hydrochloric acid solution primarily removes metal oxide impurities from quartz, such as iron, copper, nickel, aluminum, and chromium, and can also partially remove alkaline earth metals such as calcium and magnesium. Nitric acid solution primarily removes reduced metal impurities from quartz, such as copper, manganese, tin, and lead, and can also effectively remove organic matter and some non-metallic impurities. Phosphoric acid solution is effective in removing elements such as titanium, aluminum, calcium, and potassium. Phosphoric acid can form stable phosphate compounds with these metals, thereby reducing their content in quartz. Phosphoric acid also has a certain effect on removing alkali metals such as lithium and sodium. Hydrogen peroxide solution primarily removes reduced-state metallic impurities from quartz, such as manganese, chromium, lithium, and boron. Hydrogen peroxide oxidizes these metals to higher valence ions, which can then be removed in conjunction with other acids. It is also very effective at removing organic matter and carbon residues from the quartz surface. Sulfuric acid solution primarily removes impurities such as iron, aluminum, calcium, and magnesium from quartz. Sulfuric acid forms soluble sulfate compounds with these metals and can be used in combination with oxidizing agents to improve the removal efficiency of certain difficult-to-remove metallic impurities (e.g., aluminum and titanium). Sulfuric acid also has some ability to remove alkali metal impurities such as sodium and potassium.
[0054] In some embodiments, the order in which the quartz is immersed in the five acid solutions can be adjusted so that the acid solutions with relatively higher acidity are placed first and last to achieve better purification results. For example, the first and last solutions can each be selected from the group consisting of hydrochloric acid, nitric acid, and sulfuric acid solutions, and the first and last solutions are different acid solutions. In detail, placing the highly acidic solution first can remove most of the impurities in a short time, ensuring improved purity in subsequent processing. This is because the highly acidic solution can quickly dissociate and react with the metal to form easily soluble salts, thereby achieving a preliminary deep purification effect. Placing the highly acidic solution last can further remove residual trace metal impurities to ensure high purity of the quartz. This is because the highly acidic solution can attack residual and difficult-to-remove metals after the quartz has undergone multiple acid treatments, thereby further improving the purification effect. Overall, this operational sequence (soaking in strong acid → weak acid → strong acid) creates an effective purification loop, minimizing residual impurities and thus improving the purification efficiency and final purity of quartz. In some embodiments, the two acid solutions with relatively lower acidity (phosphoric acid solution and hydrogen peroxide solution) can be positioned in the third and fourth order, or in the second and third order. In a preferred embodiment, quartz can be placed sequentially in hydrochloric acid solution, nitric acid solution, phosphoric acid solution, hydrogen peroxide solution, and sulfuric acid solution. It should be understood that although not all arrangements of the five acid solutions are listed herein, any arrangement of the five acid solutions falls within the scope of this disclosure and can achieve a purity of four nines for quartz.
[0055] In some embodiments, the molar concentration of each of the five acid solutions (i.e., the molar concentration of each of the five acids in water) can be from 4M to 6M (e.g., 4.5M, 5M, 5.5M), and the quartz can be immersed in each of the five acid solutions for 30 minutes to 60 minutes (e.g., 35 minutes, 40 minutes, 45 minutes, 50 minutes, 55 minutes). Immersing the quartz in an acid of appropriate concentration for an appropriate time can improve the purification effect and the final quality of the quartz. Specifically, the concentration of the acid solution determines the efficiency of impurity removal from the quartz surface; too high a concentration may cause corrosion of the quartz surface and damage its structure, while too low a concentration may not be able to effectively remove deep impurities. In addition, the immersion time can be coordinated with the acid concentration; too short a time may not achieve the desired impurity removal effect, while too long a time may lead to unnecessary material loss.
[0056] In some embodiments, the temperatures of the five acid solutions can be, for example, between 70°C and 100°C (e.g., 75°C, 80°C, 85°C, 90°C, and 95°C). As the temperature increases within this range, the reaction rate accelerates, allowing the acids to react more quickly and effectively with impurities on the quartz surface, thereby improving removal efficiency. Conversely, as the temperature decreases within this range, impurities are removed more gently. Because the temperatures of the acid solutions are relatively low, excessive corrosion of the quartz surface structure, increased material loss, and alterations to the quartz's microstructure can be avoided, thus preventing negative impacts on its physical properties and subsequent application stability. In short, by adjusting the temperature of the acid solutions, impurity removal can be accelerated while avoiding unnecessary damage to the quartz itself, achieving optimal purification results.
[0057] In some embodiments, after immersing the quartz in each acid solution, the quartz can be placed in pure water for a rinsing step to prevent residual acid solution from the previous solution from interacting with subsequent acid solutions and causing fluctuations in multiple variables such as reaction rate, temperature, and acidity, or leading to the formation of unexpected products. For example, in embodiments where the quartz is sequentially immersed in hydrochloric acid solution, nitric acid solution, phosphoric acid solution, hydrogen peroxide solution, and sulfuric acid solution, the quartz can be rinsed with pure water after immersion in hydrochloric acid solution, followed by immersion in nitric acid solution, and then rinsed with pure water. This immersion and rinsing process is repeated until all acid immersion steps are completed. In some embodiments, the water temperature for the rinsing step can be 25°C to 35°C, and the rinsing time can be 15 minutes to 30 minutes. Next, in step S50, the acid-immersed quartz is subjected to an agitation step. In some embodiments, the acid-immersed and rinsed quartz can be placed in pure water and subjected to ultrasonic agitation. Ultrasonic oscillation generates high-frequency pressure changes in a liquid, producing microbubbles. The localized high pressure and high-speed microfluidic motion generated when these bubbles burst effectively break the bond between impurities and the quartz surface, causing them to completely desorb. This physical action compensates for the shortcomings of chemical cleaning, achieving a more thorough cleaning effect and improving the purity and quality of the quartz. In some embodiments, the ultrasonic oscillation power can be from 250 watts to 350 watts (e.g., 260 watts, 270 watts, 280 watts, 290 watts, 300 watts, 310 watts, 320 watts, 330 watts, 340 watts). An appropriate oscillation power can be selected based on the properties of the quartz material, the type of impurities, and the cleaning objective, thereby achieving optimal cleaning results and improved purity while protecting the material structure.
[0058] Subsequently, in step S60, the agitated quartz undergoes a drying process to obtain high-purity quartz (purity of four nines). In some embodiments, the drying temperature can be between 80°C and 120°C, and the drying time can be between 2 and 6 hours. An appropriate drying temperature can effectively remove residual moisture and volatile substances from the quartz surface and pores, preventing them from re-adhering or agglomerating into new impurities during the drying process. If the drying temperature is too low, incomplete moisture evaporation may lead to surface contamination or crystallization defects; if the drying temperature is too high, it may cause thermal stress deformation of the quartz or generate microcracks, affecting the physical properties and purity of the material. Therefore, based on the characteristics of the quartz and the purification target, an appropriate drying temperature can be selected within the above temperature range to balance moisture removal and material stability, ensuring the high purity and structural integrity of the product. On the other hand, the drying time can be coordinated with the drying temperature.
[0059] Please see Figure 2 This is a schematic diagram of the configuration of a quartz purification system 100 according to some embodiments of the present disclosure. The quartz purification system 100 disclosed herein includes a pulverizing device 110, a grinding device 120, a preliminary cleaning and magnetic separation device 170, five acid leaching devices 130, a shaking device 140, a drying device 150, and a conveying device 160. The conveying device 160 sequentially passes through the pulverizing device 110, the grinding device 120, the preliminary cleaning and magnetic separation device 170, each of the five acid leaching devices 130, the shaking device 140, and the drying device 150, and is configured to sequentially convey quartz into each of these devices. Furthermore, the five acid leaching devices include a hydrochloric acid solution tank 130a, a nitric acid solution tank 130b, a phosphoric acid solution tank 130c, a hydrogen peroxide solution tank 130d, and a sulfuric acid solution tank 130e. In some embodiments, the crushing device 110, the grinding device 120, the preliminary cleaning and magnetic separation device 170, the five acid leaching devices 130, the vibration device 140, the drying device 150, and the conveying device 160 may be arranged adjacent to each other.
[0060] In some embodiments, the quartz purification method described above can be achieved through... Figure 2The quartz purification system 100 is used to achieve this. Specifically, the quartz undergoes a pulverizing step in the pulverizing device 110, a grinding step in the grinding device 120, a preliminary cleaning and magnetic separation step in the preliminary cleaning and magnetic separation device 170, an acid leaching step in the acid leaching device 130, a shaking step in the shaking device 140, and a drying step in the drying device 150. In some embodiments, the conveying device 160 can be an adjustable conveying pipeline, and the configuration path of the conveying pipeline can be adjusted according to the requirements of the acid leaching sequence. For example, the conveying device 160 can sequentially pass through a hydrochloric acid solution tank 130a, a nitric acid solution tank 130b, a phosphoric acid solution tank 130c, a hydrogen peroxide solution tank 130d, and a sulfuric acid solution tank 130e. In some implementations, the oscillating device may be an ultrasonic oscillator of 250 watts to 350 watts (e.g., 260 watts, 270 watts, 280 watts, 290 watts, 300 watts, 310 watts, 320 watts, 330 watts, 340 watts).
[0061] In the following description, several embodiments will be provided to demonstrate the effectiveness of this disclosure. It should be understood that this disclosure should not be interpreted as limiting by the embodiments described below.
[0062] In this experiment, steps S10 to S60 described above were used to purify quartz. Specifically, in the pulverization step, a single-step pulverization process was used to pulverize the quartz to a particle size of 0.5 mm to 15 mm; in the preliminary washing and magnetic separation step, a magnetic separator was used to perform magnetic separation of the quartz at room temperature. In the grinding step, the ground quartz could pass through a 100-200 mesh sieve; in the acid leaching step, the molar concentration of each of the five acid solutions was 5 M, the temperature of each acid solution was 90 °C, and the quartz was placed in each of the five acid solutions for 45 minutes; in the washing step (a total of 5 washes), the temperature of the pure water was room temperature, and the total washing time was 100 minutes (each wash lasting 20 minutes); in the shaking step, the quartz was ultrasonically shaken using a power of 300 watts; in the drying step, the drying temperature was 100 °C, and the drying time was 120 minutes. The results of the quartz purification are recorded in Table 1.
[0063] Table 1
[0064]
[0065]
[0066] [Note 1]
[0067] Purity is calculated as follows: 1 - [(total impurities) / 1000000] × 100%.
[0068] [Note 2]
[0069] Acid leaching sequence:
[0070] Example 1: Hydrochloric acid → Nitric acid → Phosphoric acid → Hydrogen peroxide → Sulfuric acid
[0071] Example 2: Sulfuric acid → Nitric acid → Phosphoric acid → Hydrogen peroxide → Hydrochloric acid
[0072] Example 3: Phosphoric acid → Hydrochloric acid → Nitric acid → Hydrogen peroxide → Sulfuric acid
[0073] Example 4: Hydrogen peroxide → Nitric acid → Hydrochloric acid → Phosphoric acid → Sulfuric acid
[0074] It should be understood that the impurity content in Table 1 was obtained by inductively coupled plasma mass spectrometry (ICP-MS), and the results of Examples 1-3 were obtained by repeating the same experiment three times (each result was identical). As shown in Table 1, the quartz purification method disclosed herein can indeed achieve a purity of four nines that is difficult to achieve, and does not use highly toxic hydrofluoric acid. Therefore, this disclosure can obtain high-purity quartz while reducing operator safety risks, reducing environmental pollution, extending equipment life, and reducing purification costs.
[0075] Although the present disclosure has been described above with reference to embodiments, it is not intended to limit the present disclosure. Anyone skilled in the art may make various modifications and alterations without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the appended claims.
Claims
1. A method for purifying quartz, characterized in that, include: The quartz is crushed. The pulverized quartz is then subjected to a grinding step; The ground quartz undergoes preliminary cleaning and magnetic separation. The quartz after magnetic separation is subjected to an acid leaching step, which includes placing the quartz after magnetic separation in five solutions in any order, wherein the five solutions are hydrochloric acid solution, nitric acid solution, phosphoric acid solution, hydrogen peroxide solution and sulfuric acid solution. The acid-leached quartz was subjected to an agitation step. as well as The quartz was then dried after being shaken.
2. The quartz purification method as described in claim 1, characterized in that, In the acid leaching step, the first and last solutions of the quartz placed in the five solutions are each selected from the group consisting of the hydrochloric acid solution, the nitric acid solution, and the sulfuric acid solution, and the first and last solutions are different.
3. The quartz purification method as described in claim 1, characterized in that, In this acid leaching step, the magnetically separated quartz is placed sequentially in the hydrochloric acid solution, the nitric acid solution, the phosphoric acid solution, the hydrogen peroxide solution, and the sulfuric acid solution.
4. The quartz purification method as described in claim 1, characterized in that, The five solutions each have a molar concentration ranging from 4M to 6M.
5. The quartz purification method as described in claim 1, characterized in that, The temperatures of the five solutions range from 70°C to 100°C.
6. The quartz purification method according to claim 1, characterized in that, The ground quartz was placed in each of the five solutions for 30 to 60 minutes.
7. The quartz purification method according to claim 1, characterized in that, Furthermore, before performing the oscillation step, the acid-soaked quartz is placed in pure water for a cleaning step.
8. A quartz purification system, characterized in that, include: Crushing device; Grinding equipment; Preliminary cleaning and magnetic separation equipment; Five acid leaching devices, including a hydrochloric acid solution tank, a nitric acid solution tank, a phosphoric acid solution tank, a hydrogen peroxide solution tank, and a sulfuric acid solution tank; Oscillating device; Drying equipment; as well as The conveying device sequentially passes through the crushing device, the grinding device, the preliminary cleaning and magnetic separation device, each of the five acid leaching devices, the vibration device, and the drying device.
9. The quartz purification system as described in claim 8, characterized in that, The conveying device passes sequentially through the hydrochloric acid solution tank, the nitric acid solution tank, the phosphoric acid solution tank, the hydrogen peroxide solution tank, and the sulfuric acid solution tank.
10. The quartz purification system as described in claim 8, characterized in that, The oscillating device is a 250-watt to 350-watt ultrasonic oscillator.